A tube mouth positioning device for sapphire transistor grinding

Abstract

The invention discloses a nozzle positioning device for grinding a sapphire transistor, which specifically relates to the technical field of crystal processing, and comprises a sapphire transistor, an external clamping structure, wherein the external clamping structure is coaxially clamped on the outer peripheral surface of the sapphire transistor, the external clamping structure comprises at least two groups of external positioning clamping units, and an internal clamping structure, wherein the internal clamping structure is coaxially clamped on the inner peripheral surface of the sapphire transistor, the internal clamping structure comprises at least two groups of internal positioning clamping units, and the sapphire transistor is clamped on both sides in a multi-stage manner by the internal and external positioning clamping units, so that the clamping is more precise and the sapphire transistor is prevented from being affected by the outside world and causing large vibrations. At the same time, the linearity and wall thickness uniformity of the sapphire transistor are reversely tested by the internal and external positioning clamping units, so that the concentricity of the sapphire transistor after multiple clamping is also guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal processing, and more specifically to a nozzle positioning device for grinding sapphire transistors. Background Art

[0002] Because sapphire crystals have the characteristics of high hardness, wear resistance, high temperature resistance, acid and alkali corrosion resistance, and excellent optical properties, they are widely used in various optical detection instruments and various visual instrument window interfaces.

[0003] A Chinese patent with authorization announcement number CN103659556B discloses a polishing method for a sapphire tube, including using a vertical CNC milling machine, calling an automatic tool setting instrument, measuring and calculating the position of the center of the sapphire tube, setting this point as the tool zero point and fixing the sapphire tube on a special polishing fixture, and then fixing the special polishing fixture on the vertical CNC milling machine to polish the sapphire tube. The premise of precise polishing after calculating the position of the center of the sapphire tube is: to ensure that the sapphire tube after the fixed position does not change position during the polishing process, and secondly, the clamping position of the special fixture will also affect the polishing accuracy. If the polishing knife vibrates during the polishing process and transmits the vibration to the sapphire tube, the clamping position of the special fixture is too far from the polishing position, the clamping positioning of the tube mouth is poor, the sapphire tube vibrates greatly, and the polishing accuracy is low. Finally, the bending and uneven wall thickness of the sapphire tube will cause measurement errors, affect the polishing accuracy, and reduce the polishing efficiency.

[0004] Therefore, a nozzle positioning device for sapphire transistor grinding is proposed to solve the above problems. Summary of the invention

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a tube mouth positioning device for grinding sapphire transistors, which clamps the sapphire transistor on both sides in a multi-stage manner through internal and external positioning clamping units, so that the clamping is more precise. At the same time, the linearity and wall thickness uniformity of the sapphire transistor are reversely tested through the internal and external positioning clamping units, and the concentricity of the sapphire transistor after multiple clamping is also guaranteed to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a nozzle positioning device for sapphire transistor grinding, comprising: a sapphire transistor;

[0007] An external clamping structure, the external clamping structure is coaxially clamped on the outer peripheral surface of the sapphire transistor, and the external clamping structure includes no less than two groups of external positioning clamping units;

[0008] An inner clamping structure, the inner clamping structure is coaxially clamped on the inner circumference of the sapphire transistor, and the inner clamping structure includes no less than two groups of inner positioning clamping units;

[0009] The anti-positioning structure includes a positioning rod 1, a linkage structure and a positioning rod 2. The positioning rod 1 is radially inserted into the outer positioning clamping unit by the grinding end of the sapphire transistor and passes out from the outer positioning clamping unit. The linkage structure is pressurized and sleeved on one end of the positioning rod 1 that passes through the outer positioning clamping unit. The positioning rod 2 is coaxially inserted into the inner positioning clamping unit by the grinding end of the sapphire transistor and passes out from the inner positioning clamping unit. The linkage structure presses on the insertion end of the positioning rod 2.

[0010] Preferably, at least two groups of the external positioning clamping units have a bottom plate connected as an integral whole at their bottom ends, the bottom plate fits on a plane and has two groups of hexagonal countersunk bolts threadedly connected at both ends for fixation, the external positioning clamping unit comprises an arc-shaped clamping arm and an extension arm integrally connected to the arc-shaped clamping arm, the number of the arc-shaped clamping arms is two groups and they are symmetrical about the horizontal center plane of the sapphire transistor, one group of extension arms located above the horizontal center plane of the sapphire transistor has two positioning holes, the positioning rod passes through the positioning hole and connects multiple groups of external positioning clamping units in series.

[0011] Preferably, fasteners are provided on the surfaces of the two groups of symmetrically arranged arc-shaped clamping arms, and each group of external positioning clamping units includes two symmetrically arranged arc-shaped clamping arms, and the two arc-shaped clamping arms are symmetrically arranged with respect to the horizontal center plane of the sapphire transistor. The fasteners are used to lock the two groups of symmetrical arc-shaped clamping arms and position the fasteners on the surfaces of the arc-shaped clamping arms, and a group of arc-shaped clamping arms located below the horizontal center plane of the sapphire transistor is connected to the base plate through an extension arm.

[0012] Preferably, a group of short tube sleeves are provided at one of the positioning holes formed through the extension arm. The short tube sleeves are welded to the surface of the extension arm and communicate with the first positioning hole. The inner diameter of the short tube sleeves is consistent with the aperture size of the first positioning hole.

[0013] Preferably, the inner positioning clamping unit includes a center plate, a telescopic part, a special-shaped connecting rod and an arc-shaped claw; the telescopic parts and the special-shaped connecting rods are in multiple groups and correspond to each other, and the multiple groups of special-shaped connecting rods are axially symmetrically arranged about the vertical center line of the center plate. The center plate is connected to the special-shaped connecting rod as a whole through the telescopic part, and the arc-shaped claw is pressed onto the end of the special-shaped connecting rod away from the center plate.

[0014] Preferably, a plurality of test holes are passed through the surface of the special-shaped connecting rod, and an arc-shaped clamping groove matched with the arc-shaped clamping claw is provided on the inner circumference of the arc-shaped clamping claw.

[0015] Preferably, a plurality of second positioning holes are passed through the surface of the center plate, and the aperture size of the second positioning holes is consistent with the rod size of the second positioning rod.

[0016] Preferably, the linkage structure includes a concentric plate, a bent tube, a long tube sleeve and a limit rod that are integrally connected. The long tube sleeve at one end of the bent tube is sleeved on the surface of the positioning rod and fits tightly with the surface of the positioning rod. The concentric plate at the other end of the bent tube is concentric and coaxial with the external clamping structure. The limit rod is vertically inserted into the surface of the concentric plate, and the side of the limit rod inserted into the concentric plate faces the sapphire transistor.

[0017] Preferably, a limiting hole is provided at the rod head of the second positioning rod, the diameter of the limiting hole is smaller than the rod body size of the second positioning rod, and multiple groups of the second positioning rods and multiple limiting rods are arranged in a one-to-one correspondence.

[0018] Technical effects and advantages of the present invention:

[0019] 1. The device intermittently clamps the outer peripheral surface of the sapphire transistor through at least two groups of external positioning clamping units, and penetrates and connects all the external positioning clamping units in series through the positioning rod along the positioning hole on the surface of the extension arm. Whether the multiple external positioning clamping units clamped at different positions of the sapphire transistor are concentric and coaxial is determined by whether they are connected in series, and then the accuracy of the outer peripheral surface of the sapphire transistor is reversely tested;

[0020] 2. The device is provided with no less than two groups of external positioning clamping units which are intermittently clamped on the outer peripheral surface of the sapphire transistor. The external positioning clamping units are evenly distributed on the surface of the sapphire transistor in a multi-stage clamping manner to achieve the clamping function. The evenly distributed external positioning clamping units ensure the accurate position of the sapphire transistor, ensure the overall stability of the sapphire transistor, reduce the vibration caused by the external polishing knife or the internal polishing knife rotating feed polishing, and improve the grinding accuracy of the sapphire transistor;

[0021] 3. This device connects a plurality of groups of special-shaped connecting rods in one direction in series with a positioning rod, and judges whether the multiple inner peripheral surfaces of the sapphire transistor at different positions are concentric and coaxial by whether they are connected in series, and then reversely tests the accuracy of the inner peripheral surface of the sapphire transistor;

[0022] 4. This device tests whether the positioning rod 1 of the serial external positioning clamping unit and the positioning rod 2 of the serial internal positioning clamping unit can be plugged into the linkage structure to determine whether the positioning rod 1, the positioning rod 2 and the linkage structure are concentric and coaxial, and reversely tests the uniformity of the wall thickness of the sapphire transistor, laying the foundation for improving the processing accuracy of the sapphire transistor. At the same time, the sapphire transistor is clamped more accurately by using a multi-stage joint clamping method for the inside and outside of the sapphire transistor;

[0023] 5. This device ensures the position of the sapphire transistor after multiple clamping by using a fixed-position bottom plate and a fixed-position external clamping structure, and confirms the accuracy of the position by using an anti-positioning structure, thereby ensuring the concentricity of the sapphire transistor after multiple clamping, reducing the difficulty of grinding the sapphire transistor and improving the grinding efficiency of the sapphire transistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the pipe orifice positioning device of the present invention.

[0025] Figure 2 It is a three-dimensional schematic diagram of the partial structure of the pipe opening positioning device of the present invention.

[0026] Figure 3 It is a planar exploded view of the overall structure of the pipe orifice positioning device of the present invention.

[0027] Figure 4 It is a partial structural stereoscopic cross-sectional view of the pipe orifice positioning device of the present invention.

[0028] Figure 5 It is a three-dimensional schematic diagram of the overall structure of the inner clamping structure of the present invention.

[0029] Figure 6 It is a schematic diagram of the assembly structure of the outer clamping structure and the anti-positioning structure of the present invention.

[0030] Figure 7 It is a schematic diagram of the assembly structure of the inner clamping structure and the positioning rod of the present invention.

[0031] Figure 8 For the present invention Figure 7 A-section structure enlarged view.

[0032] Fig. 9 It is a partial structural schematic diagram of the pipe orifice positioning device of the present invention.

[0033] Figure numerals: 1. Base plate; 2. Hexagon countersunk bolt; 3. External clamping structure; 31. Arc-shaped clamping arm; 32. Extension arm; 33. Positioning hole one; 4. Fastener; 5. Short tube sleeve; 6. Positioning rod one; 7. Internal clamping structure; 71. Center plate; 72. Telescopic member; 73. Special-shaped connecting rod; 74. Positioning hole two; 75. Arc-shaped claw; 76. Arc-shaped slot; 8. Linkage structure; 81. Concentric plate; 82. Bend pipe; 83. Long tube sleeve; 84. Limit rod; 9. Positioning rod two; 91. Limit hole; 10. Sapphire transistor. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Embodiment 1

[0036] Refer to the instruction manual Figure 1-Figure 9 As shown, a nozzle positioning device for grinding a sapphire transistor comprises: a sapphire transistor 10, an outer clamping structure 3, an inner clamping structure 7 and an anti-positioning structure, wherein the outer clamping structure 3 is coaxially clamped on the outer peripheral surface of the sapphire transistor 10, and the outer clamping structure 3 comprises at least two groups of outer positioning clamping units; the inner clamping structure 7 is coaxially clamped on the inner peripheral surface of the sapphire transistor 10, and the inner clamping structure 7 comprises at least two groups of inner positioning clamping units, and the anti-positioning structure comprises a positioning rod 1 6, a linkage structure 8 and a positioning rod 2 9, wherein the positioning rod 1 6 radially penetrates into the outer positioning clamping unit from the grinding end of the sapphire transistor 10 and passes out from the outer positioning clamping unit, the linkage structure 8 is pressurized and sleeved on one end of the positioning rod 1 6 passing through the outer positioning clamping unit, the positioning rod 1 6 is sleeved on multiple groups of outer positioning clamping units at the same time, and multiple groups of outer positioning clamping units are connected in series through the positioning rod 1 6, and the positioning rod 2 9 is connected by the sapphire The grinding end of the sapphire transistor 10 is coaxially inserted into the inner positioning clamping unit in the opposite direction and passes out from the inside of the inner positioning clamping unit. The linkage structure 8 is pressed on the insertion end of the positioning rod 29. The positioning rod 29 is simultaneously connected to multiple groups of inner positioning clamping units. The multiple groups of inner positioning clamping units are connected in series through the positioning rod 29. It should be noted that the length of the positioning rod 16 is greater than the tube length of the sapphire transistor 10, the length of the positioning rod 29 is less than the tube length of the sapphire transistor 10, the positioning rod 16 and the positioning rod 29 shall not hinder the rotational feed of the outer circle polishing knife or the inner circle polishing knife, and the positioning rod 16 must pass through multiple groups of outer positioning clamping units and be connected to the linkage structure 8. The outer clamping structure 3 is close to the length of the sapphire transistor 10 to ensure that the outer clamping structure 3 stabilizes the entire sapphire transistor 10 as much as possible, to ensure the overall stability of the sapphire transistor 10, to reduce the vibration of the sapphire transistor 10 caused by the rotational feed of the outer circle polishing knife or the inner circle polishing knife.

[0037] The polishing and grinding of sapphire transistors 10 in the prior art mainly adopts two polishing processes: the polishing process of the tube mouth grinding utilizes an outer circle polishing knife or an inner circle polishing knife to rotate and then grind the end face of the sapphire transistor 10, and uses a positioning device to fix the position of the sapphire transistor 10, but the positioning device is often difficult to achieve the positioning result. First, in view of the accuracy problem of the sapphire transistor 10 itself, the existing equipment is often positioned by clamping on the outer peripheral surface of the sapphire transistor 10, but whether the center of the clamping surface of the positioning device is coaxial with the port center of the sapphire transistor 10, and the linearity and wall thickness uniformity of the sapphire transistor 10 will also affect the grinding accuracy. Second, when the inside and outside of the sapphire transistor 10 are ground, the concentricity of the inner and outer tube mouths of the sapphire transistor 10 after multiple clamping is difficult to ensure, making it difficult to ensure the grinding effect. The present device is provided with no less than two groups of external positioning clamping units clamped on the outer peripheral surface of the sapphire transistor 10, and no less than two groups of The structure of the outer positioning clamping unit is consistent. Whether the positioning rod 16 can connect multiple groups of outer positioning clamping units in series can be used to check whether the outer peripheral clamping surfaces at different positions of the sapphire transistor 10 are concentric and coaxial; the device is provided with no less than two groups of inner positioning clamping units clamped on the inner peripheral surface of the sapphire transistor 10. The structure of no less than two groups of inner positioning clamping units is consistent. Whether the positioning rod 29 can connect multiple groups of inner positioning clamping units in series can be used to check whether the inner peripheral clamping surfaces at different positions of the sapphire transistor 10 are concentric and coaxial. The linear performance of the sapphire transistor 10 is judged by whether the multiple clamping surfaces of the inner and outer peripheral surfaces of the sapphire transistor 10 are coaxial and concentric. A linkage structure 8 is provided to be pressurized and sleeved on the end of the positioning rod 16. The uniformity of the wall thickness of the sapphire transistor 10 is judged by whether the linkage structure 8 can be pressed on the end of the positioning rod 29. The nozzle positioning device can be used as a detection member for the uniformity of the inner peripheral surface, outer peripheral surface and wall thickness of the sapphire transistor 10;

[0038] Secondly, since multiple groups of serially connected external positioning clamping units and multiple groups of serially connected internal positioning clamping units clamp the inner and outer circumferences of the sapphire transistor 10 together, the clamping is more stable and the positioning is more accurate.

[0039] Furthermore, at least two groups of the external positioning clamping units have bottom ends that are connected as one body and are provided with a bottom plate 1 that is fitted to a plane and has two groups of hexagonal countersunk bolts 2 threadedly connected at both ends for fixing. The bottom plate 1 and the external positioning clamping units that are integrally connected thereto are fixed to the plane by the hexagonal countersunk bolts 2, that is, the position of the sapphire transistor 10 clamped by multiple groups of series-connected external positioning clamping units is determined. The external positioning clamping units include arc-shaped clamping arms 31 and extension arms 32 that are integrally connected to the arc-shaped clamping arms 31. The number of the arc-shaped clamping arms 31 is two groups and they are symmetrical about the horizontal center plane of the sapphire transistor 10. A group of extension arms 32 disposed above the horizontal center plane of the sapphire transistor 10 is provided with two positioning holes 33. The positioning rod 6 passes through the positioning hole 33 and is connected in series with multiple groups of external positioning clamping units, and at least two groups of external positioning clamping units are intermittently clamped on the outer peripheral surface of the sapphire transistor 10, and the bottom end of each group of external positioning clamping units is provided with an integrally connected bottom plate 1, and the bottom plate 1 is fixed to the plane by a hexagonal countersunk bolt 2, that is, the positions of at least two groups of external positioning clamping units are determined, and the external positioning clamping units are evenly distributed on the surface of the sapphire transistor 10 in a multi-stage clamping manner to achieve the clamping function, and the evenly distributed external positioning clamping units ensure the accurate position of the sapphire transistor 10 and the overall stability of the sapphire transistor 10, reduce the impact of the external circle polishing knife or the internal circle polishing knife rotating feed polishing vibration, and improve the grinding accuracy.

[0040] Furthermore, fasteners 4 are provided on the surfaces of the two groups of symmetrically arranged arc-shaped clamping arms 31, and the number of the fasteners 4 is four times that of the external clamping structure 3. Each group of external positioning clamping units includes two symmetrically arranged arc-shaped clamping arms 31, and the two arc-shaped clamping arms 31 are symmetrically arranged about the horizontal center plane of the sapphire transistor 10. The fasteners 4 are used to lock the two groups of symmetrical arc-shaped clamping arms 31 and position the fasteners 4 on the surfaces of the arc-shaped clamping arms 31. A group of arc-shaped clamping arms 31 located below the horizontal center plane of the sapphire transistor 10 is connected to the base plate 1 through an extension arm 32. The fasteners 4 include two groups of arc-shaped connecting plates tightly attached to the surfaces of the arc-shaped clamping arms 31 and matching nuts and studs for fixing the arc-shaped connecting plates to the arc-shaped clamping arms 31. First, the external positioning The positioning clamping unit is close to the port of the sapphire transistor 10 but does not cover the port of the sapphire transistor 10, two groups of symmetrically arranged arc-shaped clamping arms 31 clamp the sapphire transistor 10 up and down, and are locked and connected as a whole by fasteners 4, and then the remaining multiple groups of external positioning clamping units are clamped on the surface of the sapphire transistor 10 in the same way. It is noted that the directions of the multiple base plates 1 connected as a whole with the multiple arc-shaped clamping arms 31 are consistent. After the external clamping structure 3 is installed on the surface of the sapphire transistor 10, multiple groups of special-shaped connecting rods 73 located in one direction are connected in series through positioning rods 6. Whether the multiple inner peripheral surfaces of the sapphire transistor 10 located at different positions are concentric and coaxial is judged by whether they are connected in series, and then the qualification of the inner peripheral surface accuracy of the sapphire transistor 10 is reversely tested;

[0041] After completing the peripheral surface accuracy test of the sapphire transistor 10, the base plate 1 and the external clamping structure 3 are fixed in position using hexagonal countersunk bolts 2, and the sapphire transistor 10 is clamped in multiple stages using an external positioning clamping unit. The multi-stage clamping method of the external clamping structure 3 ensures the overall synchronization of the sapphire transistor 10, which not only achieves precise positioning, but also prevents part of the sapphire transistor 10 from being excessively vibrated by external influences, thereby reducing the vibration impact caused by the rotation of the outer circle polishing knife or the inner circle polishing knife.

[0042] Furthermore, a group of short tube sleeves 5 are provided at the positioning hole 33 formed by penetrating the extension arm 32. The short tube sleeves 5 are welded to the surface of the extension arm 32 and communicated with the positioning hole 33. The inner diameter of the short tube sleeve 5 is consistent with the aperture size of the positioning hole 33. The positioning rod 6 is radially penetrated by the grinding end of the sapphire transistor 10 and is connected in series with multiple groups of external positioning clamping units and penetrates out at the same time. The rod head of the positioning rod 6 is abutted against the first group of external positioning clamping units that pass through. The rod body size of the positioning rod 6 is consistent with the aperture size of the positioning hole 33 and the inner tube size of the short tube sleeve 5. The short tube sleeve 5 is provided to prevent the positioning rod 6 from being unable to maintain a horizontal state under the action of gravity, limit the running trajectory of the positioning rod 6 under the squeezing of the short tube sleeve 5, reduce the difficulty of the positioning rod 6 passing through, and improve the end running accuracy of the positioning rod 6.

[0043] Embodiment 2

[0044] Refer to the instruction manual Figure 3-Figure 6 As shown, the inner positioning clamping unit includes a center plate 71, a telescopic member 72, a special-shaped connecting rod 73 and an arc-shaped claw 75; the number of the telescopic member 72 and the special-shaped connecting rod 73 are both multiple groups and corresponding, the telescopic member 72 includes a round rod passing between the center plate 71 and the special-shaped connecting rod 73, and a small spring is wound around the surface of the round rod, the small spring and the center plate 71, the small spring and the special-shaped connecting rod 73 are all fixedly connected, and the multiple groups of special-shaped connecting rods 73 are axially symmetrical about the vertical center line of the center plate 71, the center plate 71 is connected to the special-shaped connecting rod 73 as a whole through the telescopic member 72, and the arc-shaped claw 75 is pressed on the end of the special-shaped connecting rod 73 away from the center plate 71, and when the inner clamping structure 7 is clamped on the inner circumference of the sapphire transistor 10, the small spring is in a compressed state.

[0045] Furthermore, the surface of the special-shaped connecting rod 73 is penetrated with a plurality of test holes, the test holes are consistent with the rod body size of the positioning rod 6, and the inner circumference of the arc-shaped claw 75 is provided with an arc-shaped groove 76 adapted to the arc-shaped claw 75. The purpose of setting the telescopic member 72 is to expand the application range of the nozzle positioning structure for sapphire transistors 10 with different inner diameters, and secondly to reduce the vibration caused by the rotation feed of the outer circle polishing knife or the inner circle polishing knife to ensure the nozzle grinding accuracy of the sapphire transistor 10. Finally, in order to facilitate the installation of the inner clamping structure 7 in the sapphire transistor 10, the cross-sectional area of ​​the inner clamping structure 7 is smaller than the inner circumferential area of ​​the sapphire transistor 10 through the contraction of the telescopic member 72.

[0046] First, retract the inner positioning clamping unit and clamp it close to the port of the sapphire transistor 10 without covering the port of the sapphire transistor 10. When the inner clamping structure 7 clamps the inner circumference of the sapphire transistor 10, the arc-shaped claw 75 abuts against the sapphire transistor 10, and the special-shaped connecting rod 73 is engaged inside the arc-shaped claw 75. The telescopic part 72 is in a retracted state. The inner clamping structure 7 is installed by loosening and contracting. The special-shaped connecting rods 73 of multiple inner positioning clamping units are installed in the same direction, and the installation of multiple inner positioning clamping units is completed.

[0047] Due to the uncertainty of the expansion and contraction of the small spring, even if the sapphire transistor 10 itself meets the precision requirements, it is difficult to ensure that the centers of the multiple internal positioning clamping units for positioning the inner circumference of the sapphire transistor 10 are in a straight line. First, the positioning rod 6 is passed through the multiple internal positioning clamping units, and the penetration parts of the multiple internal positioning clamping units are in the same part of the multiple special-shaped connecting rods 73, and the multiple special-shaped connecting rods 73 are parallel. The length of the special-shaped connecting rod 73 is not retractable, and the penetration part of the special-shaped connecting rod 73 is at a fixed distance from the inner circumference of the internal positioning clamping unit. The same test hole on the surface of the multiple parallel special-shaped connecting rods 73 should be in a straight line. If the series connection of multiple internal positioning clamping units can be achieved through the positioning rod 6, it means that the multiple inner circumferences of the sapphire transistor 10 at different positions are concentric and coaxial, and the inner circumference of the sapphire transistor 10 has qualified precision.

[0048] Embodiment 3

[0049] Refer to the instruction manual Figure 6-Figure 9 As shown, the surface of the center plate 71 is penetrated by a plurality of positioning holes 74, and the plurality of positioning holes 74 are circumferentially opened at equal intervals on the surface of the center plate 71. The aperture size of the positioning holes 74 is consistent with the rod body size of the positioning rod 9. The structures of the positioning rod 9 and the positioning rod 1 are similar. After completing the inner circumferential surface accuracy test of the sapphire transistor 10, the plurality of positioning rods 9 are passed through the plurality of internal positioning clamping units and passed out to realize the series connection of the plurality of internal positioning clamping units. The positioning rod 29 is pressed into the linkage structure 8 to lock the outer clamping structure 3 and the inner clamping structure 7, so that the position of the sapphire transistor 10 is doubly clamped and fixed, and the position of the sapphire transistor 10 is accurately determined.

[0050] Furthermore, the linkage structure 8 includes a concentric plate 81, a curved tube 82, a long tube sleeve 83 and a limiting rod 84 which are integrally connected. The long tube sleeve 83 at one end of the curved tube 82 is sleeved on the surface of the positioning rod 6 and fits tightly with the surface of the positioning rod 6. The concentric plate 81 at the other end of the curved tube 82 is concentric and coaxial with the external clamping structure 3. The limiting rod 84 is vertically inserted into the surface of the concentric plate 81. One side of the limiting rod 84 inserted into the concentric plate 81 faces the sapphire transistor 10. Multiple groups of limiting rods 84 are equidistantly spaced and circumferentially perpendicular to the surface of the concentric plate 81, and correspond to multiple groups of positioning rods 9. The rod head of the positioning rod 9 is against the internal positioning clamping unit.

[0051] Furthermore, a limiting hole 91 is provided at the rod head of the positioning rod 2 9, and the aperture of the limiting hole 91 is smaller than the rod body size of the positioning rod 2 9. Multiple groups of the positioning rods 2 9 are arranged in a one-to-one correspondence with multiple limiting rods 84. The linkage structure 8 includes a concentric plate 81, a curved tube 82 and a long tube sleeve 83 which are integrally connected. The long tube sleeve 83 is sleeved on the surface of the positioning rod 1 6 and fixed on the surface of the positioning rod 1 6. The long tube sleeve 83 locates the position of the concentric plate 81 through the curved tube 82. At the same time, since the positioning rod 1 6 is positioned in the outer clamping structure 3, the concentric plate 8 1 is arranged concentrically and coaxially with the outer clamping structure 3, that is, the concentric plate 81 is concentrically and coaxially with the sapphire transistor 10, and the positioning rod 9 that connects the multiple groups of internal positioning clamping units in series is also concentrically and coaxially with the sapphire transistor 10. At this time, if the limiting hole 91 at the end of the positioning rod 9 is just plugged into the limiting rod 84, it means that the wall thickness of the sapphire transistor 10 is uniform and the processing accuracy of the sapphire transistor 10 is high. At the same time, the multi-stage common clamping method for the inside and outside of the sapphire transistor 10 is adopted, the clamping is more accurate, and at the same time, the sapphire transistor 10 is prevented from vibrating due to external influences.

[0052] To ensure the consistency of the concentricity of the sapphire transistor 10 after multiple clamping of the sapphire transistor 10, it is only necessary to remove the linkage structure 8 from the surface of the outer clamping structure 3 and the inner clamping structure 7, disassemble the outer clamping structure 3, and at the same time ensure that the positions of the arc-shaped clamping arm 31 and the extension arm 32 fixed to the base plate 1 remain unchanged. That is, when it is determined that the sapphire transistor 10 meets the precision requirements, the position of the sapphire transistor 10 after multiple clamping is ensured by the fixed position of the base plate 1 and the fixed position of the outer clamping structure 3, so as to achieve the precise position of the sapphire transistor 10 and ensure the concentricity of the sapphire transistor 10 after multiple clamping.

[0053] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0054] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0055] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A nozzle positioning device for sapphire transistor grinding, characterized in that: include: Sapphire transistor (10); An external clamping structure (3), the external clamping structure (3) being coaxially clamped on the outer peripheral surface of the sapphire transistor (10), the external clamping structure (3) comprising no less than two groups of external positioning clamping units; An inner clamping structure (7), the inner clamping structure (7) being coaxially clamped on the inner peripheral surface of the sapphire transistor (10), the inner clamping structure (7) comprising no less than two groups of inner positioning clamping units; A reverse positioning structure, the reverse positioning structure comprising a positioning rod 1 (6), a linkage structure (8) and a positioning rod 2 (9), the positioning rod 1 (6) radially penetrates into an outer positioning clamping unit from the grinding end of the sapphire transistor (10) and passes out from the outer positioning clamping unit, the linkage structure (8) is pressurized and sleeved on one end of the positioning rod 1 (6) passing through the outer positioning clamping unit, the positioning rod 2 (9) coaxially penetrates into the inner positioning clamping unit from the grinding end of the sapphire transistor (10) and passes out from the inner positioning clamping unit, and the linkage structure (8) presses on the penetration end of the positioning rod 2 (9); The linkage structure (8) comprises a concentric plate (81), a curved tube (82), a long tube sleeve (83) and a limiting rod (84) which are connected in an integral manner; the long tube sleeve (83) located at one end of the curved tube (82) is sleeved on the surface of the positioning rod (6) and is tightly fitted with the surface of the positioning rod (6); the concentric plate (81) located at the other end of the curved tube (82) is coaxial with the outer clamping structure (3); the limiting rod (84) is vertically inserted into the surface of the concentric plate (81); and the side of the limiting rod (84) inserted into the concentric plate (81) faces the sapphire transistor (10); Wherein, the plurality of groups of positioning rods (9) and the plurality of limiting rods (84) are arranged in a one-to-one correspondence.

2. The nozzle positioning device for sapphire transistor grinding according to claim 1, characterized in that: At least two groups of the external positioning clamping units have a bottom plate (1) connected as an integral body at their bottom ends, the bottom plate (1) is fitted to a plane and two groups of hexagonal countersunk bolts (2) are threadedly connected at both ends for fixing, the external positioning clamping unit comprises an arc-shaped clamping arm (31) and an extension arm (32) connected as an integral body to the arc-shaped clamping arm (31), the arc-shaped clamping arm (31) is provided in two groups and is symmetrical with respect to the horizontal center plane of the sapphire transistor (10), one group of the extension arms (32) arranged above the horizontal center plane of the sapphire transistor (10) is provided with two positioning holes (33), the positioning rod (6) passes through the positioning hole (33) and is connected in series with multiple groups of external positioning clamping units.

3. The nozzle positioning device for sapphire transistor grinding according to claim 2, characterized in that: Fasteners (4) are provided on the surfaces of the two groups of symmetrically arranged arc-shaped clamping arms (31), each group of external positioning clamping units comprises two symmetrically arranged arc-shaped clamping arms (31), the two arc-shaped clamping arms (31) are symmetrically arranged with respect to the horizontal center plane of the sapphire transistor (10), the fasteners (4) are used to lock the two groups of symmetrical arc-shaped clamping arms (31) and position the fasteners (4) on the surfaces of the arc-shaped clamping arms (31), and the group of arc-shaped clamping arms (31) located below the horizontal center plane of the sapphire transistor (10) is connected to the base plate (1) via an extension arm (32).

4. The nozzle positioning device for sapphire transistor grinding according to claim 3, characterized in that: A group of short tube sleeves (5) are provided at the positioning hole one (33) formed by penetrating the extension arm (32); the short tube sleeves (5) are welded to the surface of the extension arm (32) and are connected to the positioning hole one (33); the inner diameter of the short tube sleeves (5) is consistent with the aperture size of the positioning hole one (33).

5. The nozzle positioning device for sapphire transistor grinding according to claim 4, characterized in that: The inner positioning clamping unit comprises a central plate (71), a telescopic member (72), a special-shaped connecting rod (73) and an arc-shaped claw (75); the telescopic member (72) and the special-shaped connecting rod (73) are provided in multiple groups and in corresponding quantities; A plurality of groups of the special-shaped connecting rods (73) are arranged axially symmetrically about the vertical center line of the center plate (71); the center plate (71) is connected to the special-shaped connecting rods (73) as a whole via a telescopic member (72); and the arc-shaped claw (75) is pressed onto an end of the special-shaped connecting rod (73) away from the center plate (71).

6. The nozzle positioning device for sapphire transistor grinding according to claim 5, characterized in that: A plurality of test holes are formed through the surface of the special-shaped connecting rod (73), and an arc-shaped clamping groove (76) adapted to the arc-shaped clamping claw (75) is formed on the inner circumference of the arc-shaped clamping claw (75).

7. The nozzle positioning device for sapphire transistor grinding according to claim 6, characterized in that: A plurality of second positioning holes (74) are formed through the surface of the center plate (71), and the diameter of the second positioning holes (74) is consistent with the rod body size of the second positioning rod (9).

8. The nozzle positioning device for sapphire transistor grinding according to claim 7, characterized in that: A limiting hole (91) is provided at the rod head of the second positioning rod (9), and the diameter of the limiting hole (91) is smaller than the rod body size of the second positioning rod (9).

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