A method for making a 2000 mesh grinding wheel for silicon carbide substrate thinning

Abstract

The application provides a preparation method of a 2000-mesh thinning grinding wheel for silicon carbide substrate thinning, and comprises the following steps: S1, preparing a binder by a sol-gel method; S2, stirring; S3, gelling; S4, water-quenching sand grinding after debinding and sintering; S5, slurry matching; S6, spray granulation; S7, cold pressing forming; and S8, debinding, sintering, assembling, finishing and debugging. The application points of the application are as follows: 1, the binder is prepared by the sol-gel method, so that the uniformity of the binder is ensured; 2, the slurry is mixed in a spray drying manner, and then is subjected to cold pressing forming, so that the uniformity of the material accumulation in the micron level is ensured, and the macroscopic consistency of the diamond thinning grinding wheel is ensured; and therefore, the consistency of the machining effect of the whole grinding wheel in the machining process is ensured, and the grinding wheel will not be scratched or burned due to local unevenness.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of grinding wheels, more particularly, to a preparation method of a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates. BACKGROUND

[0002] A thinning grinding wheel is a tool specifically designed for dressing and grinding grinding wheels, which is usually a grinding tool used to dress and grind the outer diameter and side surface of the grinding wheel to restore its geometric shape and surface state. The main uses of the thinning grinding wheel include: dressing the grinding wheel: the grinding wheel will lose its geometric accuracy and balance due to wear or deformation during use; the thinning grinding wheel can dress the grinding wheel to restore it to the desired shape and size; balancing the grinding wheel: before the grinding wheel is installed and used on the machine tool, it needs to ensure that it will not vibrate or be unbalanced during rotation; the thinning grinding wheel can be used to balance the grinding wheel to ensure its stability and safety during high-speed rotation; changing the outer diameter and thickness of the grinding wheel: in some special cases, the outer diameter of the grinding wheel needs to be adjusted or its thickness needs to be reduced to meet specific processing requirements; the thinning grinding wheel can achieve this adjustment; the thinning grinding wheel is usually made of diamond or alumina and has high grinding efficiency and precision, which can effectively dress and grind various types of grinding wheels.

[0003] In the semiconductor industry, silicon carbide substrates are widely used as the basis for manufacturing high-power electronic and optoelectronic devices, which have excellent thermal conductivity, high-temperature resistance and chemical stability, and are suitable for high-performance applications. Thinning grinding wheels are used to precisely grind and dress silicon wafers and silicon carbide substrates. These grinding wheels can effectively dress, smooth and accurately process silicon wafers or silicon carbide substrates. In semiconductor manufacturing, silicon carbide substrates need to have very high flatness and surface quality to ensure the accuracy and reliability of subsequent process steps such as deposition, etching and lithography. Thinning grinding wheels play a key role in these processes by precisely grinding to ensure the smoothness of the surface of the silicon carbide substrate and the accuracy of its geometric dimensions. Thinning grinding wheels are closely related to silicon carbide substrates in semiconductor manufacturing and are one of the key processing tools to ensure the manufacturing process of high-performance electronic devices.

[0004] Existing thinning grinding wheels are essential tools for thinning silicon carbide substrates, but in actual application, they may face some inconveniences, mainly including:

[0005] Long grinding time: due to the high hardness and wear resistance of silicon carbide substrates, the grinding process may take a long time to achieve the desired thinning thickness, which increases the processing cycle and cost;

[0006] Grinding precision challenge: Silicon carbide substrates require high-precision grinding to ensure flatness and surface quality after thinning. The wear of the grinding wheel and thermal effects during processing can affect the final processing precision and stability.

[0007] Surface quality control during grinding: During the thinning of silicon carbide substrates, the surface quality generated during grinding needs to be strictly controlled to avoid scratches, cracks, or uneven surfaces.

[0008] The advantage of the present invention is that the pore distribution is very orderly, and after granulation and dry pressing, the problem of uneven distribution of pore-forming agents in large particles is microscopically controlled. Because the sol-gel method solves the problem of uneven distribution of diamonds, the final grinding wheel has high consistency, and the grinding will not cause instantaneous high-temperature burns to the product. At the same time, the surface quality is high, the wear of the grinding wheel is small, effectively helping customers reduce costs and improve yield. SUMMARY

[0009] The present invention aims to solve the technical problems raised in the background art, and provides the following technical solution: A preparation method for a 2000-mesh thinning grinding wheel for silicon carbide substrate thinning, comprising the following steps:

[0010] S1: Gel sol method for preparing binder: The viscosity and fluidity can be controlled;

[0011] S2: Stirring: Precisely weighed diamond powder and grinding aid are added to the gel sol for stirring;

[0012] S3: Gel: After sufficient stirring, the mixture forms a gel state with certain viscosity and fluidity;

[0013] S4: Defatting, sintering, and water quenching of the grinding wheel: The mixture is subjected to defatting treatment to remove organic substances, then sintering and water quenching treatment are performed to obtain certain hardness and structural stability;

[0014] S5: Slurry preparation: The defatted and sintered mixture is prepared with dispersant, thickening agent, and pore-forming agent. The dispersant is used to ensure uniform distribution of diamond powder, the thickening agent is used to control the viscosity of the mixture, and the pore-forming agent is used to form the pore structure in the grinding wheel, affecting its grinding performance and heat dissipation effect;

[0015] S6: Spray granulation: The prepared slurry is sprayed and granulated into composite agglomerates, which helps to control the particle size distribution and uniformity of the grinding wheel;

[0016] S7: Cold pressing: The mixture after spray granulation is placed in a mold for cold pressing. In this process, the porosity, pore size and distribution, and final geometry of the grinding wheel can be controlled;

[0017] S8: Defatting, sintering, assembling, finishing and debugging: After cold pressing, the grinding wheel needs to be defatted, sintered and assembled and finished, which can further improve the hardness and wear resistance of the grinding wheel, ensure its stability and performance during use, and finally, the grinding wheel after debugging and finishing is assembled into a cup-shaped diamond thinning grinding wheel.

[0018] In a specific embodiment, the defatting, sintering, assembling, finishing and debugging includes the following steps:

[0019] S1: Defatting treatment:

[0020] Defatting treatment: is the process of decomposing organic matter under certain temperature conditions in an air atmosphere, mainly including the process of removing free water, combined water, carbon and oxygen to generate carbon dioxide, the main purpose is to place in the subsequent sintering process, the rapid release of water vapor and carbon dioxide changes the structure;

[0021] S2: Sintering:

[0022] Sintering: sintering of ceramic grinding wheels, not metal grinding wheels, the definition here should be that under high temperature conditions, the binder melts and the diamond and other materials are high-temperature wetted, and the process of cooling and solidification;

[0023] S3: Assembly: Assembly includes dispensing, assembling and processes;

[0024] S4: Finishing and debugging: finishing includes end face grinding, internal circle grinding and external circle grinding debugging, including dynamic balance debugging.

[0025] In a specific embodiment, the gel sol method for preparing the binder includes the following steps:

[0026] S1: Sol preparation: First, a sol needs to be prepared, which is usually composed of colloidal particles suspended in a solvent, and the sol includes silica, alumina, etc.;

[0027] S2: Gel formation: The particles in the sol gradually aggregate to form a gel, this process can be achieved by controlling the concentration of particles in the sol, the pH value of the solution, the temperature, etc. In the process of forming the gel, there is a certain time window to adjust and process the morphology and structure of the gel;

[0028] S3: Gel molding: After the gel is formed, it needs to be molded, which is usually through a mold or other molding process to solidify the gel into a block or granular structure with the required shape and size;

[0029] S4: Drying: The molded gel usually needs to be dried to remove the solvent and moisture therein, so that the binder has good mechanical strength and stability, the drying process can be completed by natural drying or heating drying;

[0030] S5: sintering: further sintering treatment can be carried out to improve its density and heat resistance, and the sintering process can make the gel form a more solid and stable structure.

[0031] In a specific embodiment, the proportion of the binding agent is between 20% and 30%, the proportion of the diamond powder is between 30% and 50%, and the diamond powder is a synthetic diamond powder.

[0032] In a specific embodiment, the proportion of the grinding aid is between 5% and 20%, and the grinding aid is one of hard particles such as alumina and silicon carbide.

[0033] In a specific embodiment, the proportion of the dispersant is between 1% and 5%, and the dispersant can be one of organic compounds and surfactants.

[0034] In a specific embodiment, the proportion of the thickening agent is between 1% and 5%, and the thickening agent can be one of polymers and natural colloids.

[0035] In a specific embodiment, the proportion of the pore-forming agent is between 1% and 10%, and the pore-forming agent can be one of organic pore-forming agents and inorganic pore-forming agents.

[0036] In a specific embodiment, the proportion of the debinding agent is not more than 2%, and the debinding agent can be one of solvents and surfactants. Advantages

[0037] The present application adopts a sol-gel and cold-pressing forming composite method to prepare a thinning tooth. The binding agent is prepared by a gel sol method, but diamond powder, grinding aids, etc. are added during stirring. After gelation, the sand is debound, sintered, and water quenched, and then the slurry is matched, and grinding aids, dispersants, thickening agents, pore-forming agents, etc. are added. After spray granulation, a composite aggregate is formed. Finally, the porosity and pore size and distribution are controlled by cold pressing, and the cup-shaped diamond thinning grinding wheel is prepared by debinding, sintering, assembling, finishing, and debugging. The advantage of this process is that the pore distribution is very orderly, and the dry pressing after granulation microscopically controls the uneven distribution of the large particle pore-forming agent. Because the sol-gel method solves the problem of uneven distribution of diamond, the final grinding wheel has high consistency, and the grinding will not cause instantaneous high-temperature burn of the product. At the same time, the surface quality is high, the consumption of the grinding wheel is small, effectively helping customers to reduce costs and improve yield. DETAILED DESCRIPTION

[0038] The present application proposes a preparation method of a 2000-mesh thinning grinding wheel for silicon carbide substrate thinning, and the technical solutions in the present application will be clearly and completely described below in combination with the embodiments of the present application. Embodiment one

[0039] The application discloses a preparation method of a 2000-mesh thinning grinding wheel for silicon carbide substrate thinning.

[0040] S1: a binder is prepared by a sol-gel method, and the viscosity and fluidity of the binder can be controlled;

[0041] S2: stirring: diamond powder and grinding aids are accurately weighed in advance and added to the sol-gel for stirring;

[0042] S3: gel: after the mixture is fully stirred, a gel state with certain viscosity and fluidity is formed;

[0043] S4: defatting, sintering and water quenching of the sand mill: the mixture is subjected to defatting treatment to remove organic substances, and then is subjected to sintering and water quenching treatment, so that the mixture obtains certain hardness and structural stability;

[0044] S5: slurry matching: the defatted and sintered mixture is matched with a dispersant, a thickening agent and a pore-forming agent, the dispersant is used to ensure uniform distribution of the diamond powder, the thickening agent is used to control the viscosity of the mixture, and the pore-forming agent is used to form a pore structure in the grinding wheel, and affect the grinding performance and heat dissipation effect of the grinding wheel;

[0045] S6: spray granulation: the matched slurry is prepared into composite agglomerates by a spray granulation technology, which is helpful to control the particle size distribution and uniformity of the grinding wheel;

[0046] S7: cold pressing forming: the mixture after the spray granulation is placed into a mold for cold pressing forming, in the process, the porosity and pore size and distribution of the grinding wheel and the final geometric shape can be controlled;

[0047] S8: defatting, sintering, assembling, finishing, debugging: after the cold pressing forming, the grinding wheel needs to be subjected to defatting, sintering, assembling, finishing and debugging, so that the hardness and wear resistance of the grinding wheel can be further improved, and the stability and performance of the grinding wheel in use can be ensured, finally, the grinding wheel after the debugging and finishing is assembled into a cup-shaped diamond thinning grinding wheel.

[0048] The thinning grinding wheel has the advantages that the pore distribution is very orderly, the dry pressing after the granulation microscopically controls the uneven distribution of the large-particle pore-forming agent, the sol-gel method solves the problem of uneven distribution of the diamond, the consistency of the final grinding wheel is high, the grinding does not cause instant high-temperature burn of the product, the surface quality is high, the loss of the grinding wheel is small, the cost of the customer is effectively reduced, and the yield is improved. Example two

[0049] The 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to the present application adopts the following component proportioning: on the basis of the total mass of the thinning grinding wheel, the proportion of the binder is between 20% and 30%, the proportion of the diamond powder is between 30% and 50%, the proportion of the grinding aid is between 5% and 20%, the proportion of the dispersing agent is between 1% and 5%, the proportion of the thickening agent is between 1% and 5%, the proportion of the pore-forming agent is between 1% and 10%, and the proportion of the degreasing agent is not more than 2%, according to the mass percentage.

[0050] The first preferred embodiment of the present application is a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates, which adopts the following component proportioning: on the basis of the total mass of the thinning grinding wheel, the proportion of the binder is 20%, the proportion of the diamond powder is 30%, the proportion of the grinding aid is 5%, the proportion of the dispersing agent is 1%, the proportion of the thickening agent is 1%, the proportion of the pore-forming agent is 1%, and the proportion of the degreasing agent is not more than 2%, according to the mass percentage.

[0051] The second preferred embodiment of the present application is a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates, which adopts the following component proportioning: on the basis of the total mass of the thinning grinding wheel, the proportion of the binder is 21%, the proportion of the diamond powder is 31%, the proportion of the grinding aid is 6%, the proportion of the dispersing agent is 2%, the proportion of the thickening agent is 2%, the proportion of the pore-forming agent is 2%, and the proportion of the degreasing agent is not more than 2%, according to the mass percentage.

[0052] The third preferred embodiment of the present application is a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates, which adopts the following component proportioning: on the basis of the total mass of the thinning grinding wheel, the proportion of the binder is 22%, the proportion of the diamond powder is 32%, the proportion of the grinding aid is 7%, the proportion of the dispersing agent is 3%, the proportion of the thickening agent is 3%, the proportion of the pore-forming agent is 3%, and the proportion of the degreasing agent is not more than 2%, according to the mass percentage.

[0053] The fourth preferred embodiment of the present application is a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates, which adopts the following component proportioning: on the basis of the total mass of the thinning grinding wheel, the proportion of the binder is 24%, the proportion of the diamond powder is 34%, the proportion of the grinding aid is 9%, the proportion of the dispersing agent is 4%, the proportion of the thickening agent is 4%, the proportion of the pore-forming agent is between 1% and 10%, and the proportion of the degreasing agent is not more than 2%, according to the mass percentage.

[0054] The fifth preferred embodiment of the present application is a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates, which adopts the following component proportioning: on the basis of the total mass of the thinning grinding wheel, the proportion of the binder is 25%, the proportion of the diamond powder is 35%, the proportion of the grinding aid is 10%, the proportion of the dispersing agent is 5%, the proportion of the thickening agent is 5%, the proportion of the pore-forming agent is 5%, and the proportion of the degreasing agent is not more than 2%, according to the mass percentage.

[0055] In a sixth preferred embodiment of the present application, the 2000 mesh thinning grinding wheel for thinning silicon carbide substrates has the following component proportions: based on the total mass of the thinning grinding wheel, the proportion of binder is 26%, the proportion of diamond powder is 36%, the proportion of grinding aid is 11%, the proportion of dispersant is 5%, the proportion of thickening agent is 5%, the proportion of pore-forming agent is 6%, and the proportion of degreasing agent is not more than 2%.

[0056] In a seventh preferred embodiment of the present application, the 2000 mesh thinning grinding wheel for thinning silicon carbide substrates has the following component proportions: based on the total mass of the thinning grinding wheel, the proportion of binder is 27%, the proportion of diamond powder is 37%, the proportion of grinding aid is 12%, the proportion of dispersant is 5%, the proportion of thickening agent is 5%, the proportion of pore-forming agent is 7%, and the proportion of degreasing agent is not more than 2%. Example Three

[0057] In this embodiment, the diamond powder in Example Two is synthetic diamond powder.

[0058] Synthetic diamond powder is prepared by chemical vapor deposition or high temperature and high pressure technology. Diamond is one of the hardest materials in nature. Synthetic diamond powder has similar hardness and wear resistance, excellent chemical stability, and can maintain its performance in various extreme environments. Example Four

[0059] In this embodiment, the grinding aid in Example Two is one of hard particles such as alumina and silicon carbide.

[0060] Alumina: Alumina is a material with high hardness and good wear resistance, commonly used as a grinding aid. It is widely used in metal processing, wood polishing, ceramic manufacturing, etc., and can provide effective grinding effect.

[0061] Silicon carbide: Silicon carbide is also a very hard material, commonly used as an abrasive and grinding aid. It is harder than alumina and is commonly used for processing hard materials such as glass, ceramics and hard alloys. Example Five

[0062] In this embodiment, the dispersant in Example Two can be one of organic compounds and surfactants.

[0063] Organic compounds: These compounds can be a variety of organic molecules, with properties including adsorption to particles or dispersion of solid particles through dissolution. They can effectively surround particles in liquid and prevent their re-aggregation, thus maintaining a dispersed state.

[0064] Surfactant: Surfactants are a class of molecules, usually composed of a hydrophilic head group and a hydrophobic tail group, that can reduce surface tension and improve dispersion properties at interfaces. In dispersants, surfactants can form a stable coating layer on the surface of solid particles through their molecular structure, preventing particles from attracting and aggregating each other. Example Six

[0065] In this embodiment, the thickening agent in Example Two can be one of a polymer, a natural colloid;

[0066] Polymer: Polymers are a class of high molecular compounds with long chain structures that can form a three-dimensional network in a liquid or interact with long chain molecules in a solvent, thereby increasing the viscosity and consistency of the liquid;

[0067] Natural colloid: Natural colloid usually refers to high molecular substances extracted from plants or animals, which have good thickening properties, for example, sodium alginate, xylitol, etc. are commonly used natural colloid thickeners. Example Seven

[0068] In this embodiment, the pore-forming agent in Example Two can be one of an organic pore-forming agent, an inorganic pore-forming agent;

[0069] Organic pore-forming agent: Organic pore-forming agents are usually some organic substances that are easily soluble or volatile. They are added during material processing and then form pores through dissolution or volatilization, thereby improving the lightweight or water absorption properties of the material;

[0070] Inorganic pore-forming agent: Inorganic pore-forming agents are usually some inorganic particles or compounds that release gas or volatile molecules to form pores under high temperature or chemical reaction conditions. Example Eight

[0071] In this embodiment, the degreasing agent in Example Two can be one of a solvent, a surfactant;

[0072] Solvent-type degreaser: This type of degreaser mainly removes surface oil or dirt through its solubility. They can effectively dissolve and remove surface oil or dirt, and are commonly used ingredients in many cleaning processes;

[0073] Surfactant-type degreaser: This type of degreaser mainly removes surface oil or dirt through the action of surfactants. Surfactants can improve the properties of the oil-water interface, allowing oil or dirt to disperse in water and be easily rinsed off. Example Nine

[0074] In this embodiment: in preferred solutions one to two in embodiment two: the binder is prepared by the gel sol method, the synthetic diamond powder is used as the diamond powder, the alumina is used as the grinding aid, the organic compound is used as the dispersant, the polymer is used as the thickening agent, the organic pore-forming agent is used as the pore-forming agent, and the solvent type defatting agent is used as the defatting agent.

[0075] In preferred solutions three to five in embodiment two: the binder is prepared by the gel sol method, the synthetic diamond powder is used as the diamond powder, the silicon carbide is used as the grinding aid, the organic compound is used as the dispersant, the polymer is used as the thickening agent, the inorganic pore-forming agent is used as the pore-forming agent, and the surfactant type defatting agent is used as the defatting agent.

[0076] In preferred solutions six to seven in embodiment three: the binder is prepared by the gel sol method, the synthetic diamond powder is used as the diamond powder, the alumina is used as the grinding aid, the organic compound is used as the dispersant, the natural colloid is used as the thickening agent, the organic pore-forming agent is used as the pore-forming agent, and the solvent defatting agent is used as the defatting agent.

[0077] The present application adopts the sol-gel and cold-pressing forming composite method to prepare the thinning tooth, the binder is prepared by the gel sol method, but the diamond powder, grinding aid and the like are added in the stirring process, the gel is removed, the sand is sintered and water quenched, the slurry is matched, the grinding aid, dispersant, thickening agent and pore-forming agent are added, the composite agglomerate is made by spray granulation, and finally the porosity and pore size and distribution are controlled by cold pressing, and the cup-shaped diamond thinning grinding wheel is prepared by defatting, sintering, assembling, finishing and debugging; the advantage of this process is that the pore distribution is very orderly, the dry pressing after granulation microscopically controls the uneven distribution of the large particle pore-forming agent, because the sol-gel method solves the problem of uneven distribution of the diamond, the consistency of the final grinding wheel is high, the grinding will not cause instantaneous high temperature burn of the product, the surface quality is high, the consumption of the grinding wheel is small, the cost of the customer is effectively reduced, and the yield is improved.

Claims

1. A method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates, characterized in that: Includes the following steps: S1: Preparation of binders using the sol-gel method: controlling their viscosity and flowability; S2: Stirring: Add the pre-weighed diamond powder and grinding aid to the gel sol and stir. S3: Gel: After the mixture is thoroughly stirred, it forms a gel state with a certain viscosity and fluidity; S4: Degreasing, sintering, water quenching, and sand milling: The mixture is degreased to remove organic matter, and then sintered and water quenched to obtain a certain hardness and structural stability. S5: Slurry formulation: The degreased and sintered mixture is formulated with dispersant, thickener, and pore-forming agent. The dispersant is used to ensure uniform distribution of diamond powder, the thickener is used to control the viscosity of the mixture, and the pore-forming agent is used to form the pore structure in the grinding wheel, affecting its grinding performance and heat dissipation effect. S6: Spray granulation: The prepared slurry is made into composite agglomerates through spray granulation technology, which helps to control the particle size distribution and uniformity of the grinding wheel; S7: Cold pressing: The mixture after spray granulation is placed into a mold and cold pressed. During this process, the porosity and pore size and distribution of the grinding wheel, as well as the final geometry, are controlled. S8: Degreasing, sintering, assembly, and adjustment: After cold pressing, the grinding wheel needs to be degreased, sintered, and assembled to further improve its hardness and wear resistance, ensuring its stability and performance during use. Finally, the adjusted and dressed grinding wheel is assembled into a cup-shaped diamond thinning grinding wheel.

2. The method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to claim 1, characterized in that, The degreasing and sintering assembly and commissioning includes the following steps: S1: Degreasing treatment: The process of decomposing organic matter in air under certain temperature conditions, including the removal of free water and the reaction of water, carbon and oxygen to generate carbon dioxide. The purpose is to prevent the rapid release of water vapor and carbon dioxide during subsequent sintering process from altering the structure. S2: Sintering: This refers to the sintering of ceramic grinding wheels. Under high temperature conditions, the binder melts and the diamond is wetted at high temperature, and then the process is cooled and solidified. S3: Assembly: including dispensing and assembly processes; S4: Finishing: This includes end face grinding, internal grinding and external grinding adjustments, including dynamic balancing adjustments.

3. The method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to claim 1, characterized in that, The preparation of the binder using the gel-sol method includes the following steps: S1: Sol preparation: First, it is necessary to prepare a sol, which consists of colloidal particles suspended in a solvent. The sol includes silica and alumina. S2: Gel formation: Gradually aggregate particles in the sol to form a gel. This process is achieved by controlling the concentration of particles in the sol, the pH value of the solution, and the temperature conditions. During the gel formation process, there is a certain time window to adjust and process the morphology and structure of the gel. S3: Gel molding: After the gel is formed, it needs to be molded. The gel is solidified into a block or granular structure with the required shape and size by means of a mold or other molding process. S4: Drying: The gel after molding needs to be dried to remove the solvent and water, so that the binder has good mechanical strength and stability. The drying process is completed by natural drying or heat drying. S5: Sintering: Further sintering is carried out to improve its density and heat resistance. The sintering process will make the gel form a more robust and stable structure.

4. The method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to claim 1, characterized in that, The proportion of the binder is between 20% and 30%, and the proportion of diamond powder is between 30% and 50%, wherein the diamond powder is synthetic diamond powder.

5. A method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to claim 1, characterized in that, The proportion of the grinding aid is between 5% and 20%, and the grinding aid is one of alumina or silicon carbide hard particles.

6. A method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to claim 1, characterized in that, The proportion of the dispersant is between 1% and 5%, and the dispersant is one of the organic compounds or surfactants.

7. A method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to claim 1, characterized in that, The proportion of the thickener is between 1% and 5%, and the thickener is a polymer or a natural colloid.

8. A method for preparing a 2000-mesh thinning grinding wheel for thinning silicon carbide substrates according to claim 1, characterized in that, The proportion of the pore-forming agent is between 1% and 10%, and the pore-forming agent is one of organic pore-forming agents or inorganic pore-forming agents.