Display module and display device

Abstract

This application discloses a display module and a display device. The display module includes a first support region, a second support region, and a bending region. The second support region is located on the side of the first support region away from the bending region. The display module includes: a display part, a bending part, and a bonding part, with the display part and the bonding part stacked and spaced apart. The bending part connects the display part and the bonding part. The bonding part is located in the first support region, the display part is located in the first support region and the second support region, and the bending part is located in the bending region. An adhesive layer is located in the first support region and the second support region. A rigid filler is filled in the adhesive layer located in the first support region. A support layer is disposed on one side of the adhesive layer and is at least partially located in the second support region. This design enhances the support performance of the adhesive layer in the first support region.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and a display device. Background Technology

[0002] As people's requirements for display screens become higher and higher, ultra-narrow bezel displays are becoming increasingly popular among consumers. Terminal displays are increasingly demanding high screen-to-body ratios, which requires reducing the bezels of both the display screen and the terminal itself.

[0003] Bending technology is one of the key technologies for reducing bezel size, but the bending of the bezel area in current displays does not achieve the desired effect. Summary of the Invention

[0004] This application provides a display module and a display device, which can improve the support performance of the display module.

[0005] This application provides a display module, the display module including a first support area, a second support area, and a bending area, the second support area being located on the side of the first support area away from the bending area, the display module further including: a display part, a bending part, and a bonding part, the display part and the bonding part being stacked and spaced apart, the bending part connecting the display part and the bonding part; wherein, the bonding part is located in the first support area, the display part is located in the first support area and the second support area, and the bending part is located in the bending area; an adhesive layer is located in the first support area and the second support area, and is located between the bonding part and the display part; a rigid filler is filled in the adhesive layer located in the first support area; a support layer is disposed on one side of the adhesive layer, and is at least partially located in the second support area.

[0006] In one embodiment, the orthographic projection of the support layer on the non-display surface of the display portion completely coincides with the orthographic projection of the adhesive layer located in the second support area on the non-display surface of the display portion.

[0007] Preferably, the material of the support layer includes a thermally conductive material.

[0008] Preferably, the material of the support layer includes copper foil.

[0009] In one embodiment, the number of the rigid fillers is multiple.

[0010] Preferably, the plurality of the rigid fillers are uniformly distributed in the adhesive layer.

[0011] Preferably, the rigid filler has a spherical shape.

[0012] In one embodiment, the rigid filler is a solid structure.

[0013] Preferably, the material of the rigid filler includes organic materials.

[0014] In one embodiment, the rigid filler includes a rigid shell and a refrigerant located within the rigid shell.

[0015] Preferably, the refrigerant includes at least one of a halogenated hydrocarbon, alcohol, or diethyl ether.

[0016] Preferably, the material of the rigid shell includes a metallic material;

[0017] Preferably, the display module further includes a heat insulation layer located on the side of the adhesive layer opposite to the support layer, and at least in the first support area.

[0018] In one embodiment, the adhesive layer is made of a superelastic material.

[0019] Preferably, the adhesive layer is made of at least one of silicone gel, aerogel, and foam adhesive.

[0020] In one embodiment, the display module further includes: a first support film and a second support film, wherein the first support film is located between the display portion and the adhesive layer, and the second support film is located between the bonding portion and the adhesive layer.

[0021] Preferably, the orthographic projection of the support layer on the non-display surface of the display portion completely coincides with the orthographic projection of the adhesive layer located in the second support area on the non-display surface of the display portion.

[0022] Preferably, the orthographic projection of the second support film onto the adhesive layer does not overlap with the orthographic projection of the support layer onto the adhesive layer.

[0023] Preferably, the orthographic projection of the support layer on the non-display surface of the display portion covers the orthographic projection of the adhesive layer in the second support area on the non-display surface of the display portion, and the orthographic projection of the second support film on the non-display surface of the display portion covers the orthographic projection of the adhesive layer in the first support area on the non-display surface of the display portion.

[0024] In one embodiment, the thickness of the support layer is less than the thickness of the second support film.

[0025] In one embodiment, the display module further includes a driver chip located on the side of the bonding portion opposite to the display portion.

[0026] Preferably, the orthographic projection of the driving chip on the non-display surface of the display unit is at least partially located in the first support area.

[0027] This application also provides a display device, including a display module as described in any of the above embodiments.

[0028] Unlike existing technologies, the beneficial effects of this application are as follows: the adhesive layer in the first support area of ​​the adhesive layer of this application is filled with a hard filler, which can enhance the support performance of the adhesive layer in the first support area. Moreover, through this structure, the adhesive layer can have both bonding and support effects. At the same time, since the adhesive layer in the second support area does not have a hard filler, its overall support is weak. This application improves the support performance of the display part in the second support area by setting a support layer. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0030] Figure 1 This is a schematic diagram of one embodiment of the display module of this application;

[0031] Figure 2 This is a schematic diagram of another embodiment of the display module of this application;

[0032] Figure 3 yes Figure 2 A schematic diagram of one embodiment of a medium-hard filler;

[0033] Figure 4 This is a schematic diagram of one embodiment of the display device of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0035] It should be noted that the terms "first" and "second" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0036] Please see Figure 1 The first aspect of this application provides a display module 10, which includes a first support region Z1, a second support region Z2, and a bending region BA. The second support region Z2 is located on the side of the first support region Z1 away from the bending region BA. The display module 10 also includes a display part 310, a bending part 320, and a bonding part 330. The display part 310 and the bonding part 330 are stacked and spaced apart. The bending part 320 connects the display part 310 and the bonding part 330. The second support region Z2 is located on the side of the first support region Z1 away from the bending part 320, the bonding part 330 is located in the first support region Z1, the display part 310 is located in the first support region Z1 and the second support region Z2, and the bending part 320 is located in the bending region BA. The display module 10 also includes an adhesive layer 110, a rigid filler 120, and a support layer 130. The adhesive layer 110 is located in the first support region Z1 and the second support region Z2, and is located between the bonding portion 330 and the display portion 310; the rigid filler 120 is filled in the adhesive layer 110 located in the first support region Z1; the support layer 130 is disposed on one side of the adhesive layer 110 and is at least partially located in the second support region Z2.

[0037] Specifically, in the bending process of the display module 10, the bonding portion 330 is bent to the non-display surface A side of the display portion 310, and the bonding portion 330 and the display portion 310 are bonded and fixed by the adhesive layer 110. For example, the bonding portion 330 can be bonded to the non-display surface A of the display portion 310 by the adhesive layer 110 through a pressing process.

[0038] The display module 10 includes a first support area Z1 and a second support area Z2. The number of the first support area Z1 and the second support area Z2 is not limited; there can be one or more. For example, when the display module 10 has two opposing bending areas BA, a first support area Z1 can be arranged adjacent to each bending area BA. An adhesive layer 110 is disposed in the entire first support area Z1 and the second support area Z2. The adhesive layer 110 in the first support area Z1 is filled with a rigid filler 120, and the number of rigid fillers 120 is not specifically limited. Because the adhesive layer 110 itself has low hardness and does not have good support performance, its support performance is greatly improved after the adhesive layer 110 is filled with hard filler 120. That is to say, after the adhesive layer 110 in the first support region Z1 is filled with hard filler 120, the overall support performance of the film layer in the first support region Z1 is better than that in the second support region Z2. Therefore, the positional stability of the bonding part 330 after bending is guaranteed, thereby ensuring a good bending shape of the bending part 320 and improving the bending effect of the bending region BA. In addition, the hard filler 120 is filled in the adhesive layer 110. The adhesive layer 110 is a soft material with a certain degree of fluidity, which can ensure the uniformity of the distribution of the hard filler 120. The display module 10 also includes a support layer 130, which has good support performance. The support layer 130 can be provided only in the second support region Z2 or further provided in the first support region Z1.

[0039] This application differs from the prior art by filling the adhesive layer 110 in the first support region Z1 with a hard filler 120, which greatly improves the support performance of the adhesive layer 110 in the first support region Z1, thereby enabling the adhesive layer 110 in the first support region Z1 to withstand greater pressure without deformation. The adhesive layer 110 in this application has the dual effect of bonding and support. At the same time, since the adhesive layer 110 in the second support region Z2 does not have a hard filler 120, its overall support is relatively weak. This application improves the support performance of the display part 310 in the second support region Z2 by setting a support layer 130.

[0040] In one embodiment, see Figure 1The orthographic projection of the support layer 130 on the non-display surface A of the display unit 310 completely coincides with the orthographic projection of the adhesive layer 110 located in the second support region Z2 on the non-display surface A of the display unit 310. That is to say, the support layer 130 is only provided in the second support region Z2 and is not provided in the first support region Z1. Therefore, the overall thickness of the film layer in the first support region Z1 is smaller than the overall thickness of the film layer in the second support region Z2. Reducing the thickness of the film layer in the first support region Z1 allows for a reduction in the bending radius of the bending portion 320, thereby reducing the display bezel of the display module 10. Furthermore, the support layer 130 fully supports the adhesive layer 110 in the second support region Z2, which improves the support effect and also protects the adhesive layer 110.

[0041] Of course, in some other embodiments, the orthographic projection of the support layer 130 on the non-display surface A of the display unit 310 is located within the orthographic projection of the adhesive layer 110 in the second support region Z2, and may not completely overlap.

[0042] In one embodiment, the material of the support layer 130 includes a thermally conductive material. The support layer 130 can be made of a thermally conductive material, which can improve the heat dissipation capacity of the support layer 130.

[0043] In one embodiment, the material of the support layer 130 includes copper foil. Of course, the material of the support layer 130 can also be other types of thermally conductive materials, and this application does not impose any limitations.

[0044] In one embodiment, see Figure 1 The number of rigid fillers 120 is multiple. Multiple rigid fillers 120 are filled into the adhesive layer 110 to achieve full mixing of the rigid fillers 120 and the adhesive layer 110, which can improve the bonding and support effect.

[0045] In one embodiment, see Figure 1 Multiple rigid fillers 120 are evenly distributed in the adhesive layer 110. The evenly distributed rigid fillers 120 can make the support effect of the adhesive layer 110 in the first support area Z1 more uniform.

[0046] Of course, in some other embodiments, a plurality of rigid fillers 120 may also be randomly filled into the adhesive layer 110 of the first support region Z1.

[0047] In one embodiment, see Figure 1 The rigid filler 120 has a spherical shape. When the spherical rigid filler 120 is filled into the adhesive layer 110, it is less likely to generate air bubbles or other problems, resulting in a better filling effect.

[0048] Of course, in some other embodiments, the hard filler 120 can also be other shapes, which can be regular shapes or irregular shapes; the shapes of multiple hard fillers 120 can be the same or different; the sizes of multiple hard fillers 120 can be the same or different, and this application does not impose specific limitations.

[0049] In one embodiment, see Figure 1 The rigid filler 120 is a solid structure. Solid materials are easy to process, low in cost, and provide better support.

[0050] In one embodiment, the rigid filler 120 is made of an organic material. The rigid filler 120 may be made of acrylic material. Of course, other organic materials may also be used, which can improve the adhesion between the filler and the adhesive layer 110.

[0051] In some other embodiments, the material of the rigid filler 120 includes inorganic or metallic materials, as long as they can meet the support effect of this application.

[0052] In one embodiment, see Figure 2 and Figure 3 The rigid filler 120 includes a rigid housing 121 and a refrigerant 122 located within the rigid housing 121.

[0053] Specifically, the refrigerant 122 is used to absorb external heat and temporarily store the heat inside the rigid shell 121. That is, the heat is absorbed when passing through the rigid filler 120, reducing heat transfer. As a result, the adhesive layer 110 of the first support area Z1 plays a certain role in blocking heat. At the same time, the heat can be released at room temperature and can be recycled. It can be understood that the rigid filler 120 has a heat dissipation function for the bonding part 330 and the display part 310 located on both sides.

[0054] In one embodiment, the refrigerant 122 includes at least one of a halogenated hydrocarbon, alcohol, or diethyl ether. The above materials absorb heat at high temperatures, causing the liquid to evaporate and form a gas. Upon reaching room temperature, the gas releases heat and liquefies back into a liquid, allowing for recycling.

[0055] In one embodiment, the rigid housing 121 is made of a metallic material. Metallic materials have good thermal conductivity and hardness; for example, they may be iron, copper, or chromium.

[0056] In one embodiment, see Figure 2 The display module 10 also includes a heat insulation layer 140, which is located on the side of the adhesive layer 110 away from the support layer 130 and is at least partially located in the first support area Z1.

[0057] Specifically, the heat insulation layer 140 serves as a heat insulation layer, preventing heat transfer between the bonding portion 330 and the display portion 310. The heat insulation layer 140 is provided at least on the side of the adhesive layer 110 away from the support layer 130 in the first support region Z1, further enhancing the heat transfer barrier effect together with the rigid filler 120. The heat insulation layer 140 may be provided only in the first support region Z1, or it may extend further to the second support region Z2.

[0058] In one embodiment, the adhesive layer 110 is made of a superelastic material.

[0059] Specifically, the adhesive layer of the superelastic material has higher cushioning performance than conventional foam. Therefore, under the premise of the same cushioning performance, the adhesive layer of the superelastic material can be thinner than that of conventional foam. This can reduce the bending radius of the bending portion 320, thereby reducing the size of the frame. The adhesive layer 110 is made of at least one of silicone gel, aerogel, and foam adhesive.

[0060] In one embodiment, the adhesive layer 110 is made of at least one of silicone gel, aerogel, and foam adhesive.

[0061] Specifically, the material of the adhesive layer 110 can be any one of silicone gel, aerogel, or foam adhesive, or a combination of some of them.

[0062] In one embodiment, see Figure 1 The display module 10 also includes a first support film 211 and a second support film 212. The first support film 211 is located between the display portion 310 and the adhesive layer 110, and the second support film 212 is located between the bonding portion 330 and the adhesive layer 110. The first support film 211 and the second support film 212 mainly serve a supporting function. The first support film 211 is used to support the display portion 310, and the second support film 212 is used to support the bonding portion 330.

[0063] In one embodiment, see Figure 1 The orthographic projection of the support layer 130 on the non-display surface A of the display unit 310 completely coincides with the orthographic projection of the adhesive layer 110 located in the second support region Z2 on the non-display surface A of the display unit 310. This allows the support layer 130 to fully support the adhesive layer 110 in the second support region Z2, while also preventing the adhesive layer 110 from overflowing. Furthermore, since the support layer 130 is not located in the first support region Z1, the distance between the display unit 310 and the bonding portion 330 can be reduced, which is equivalent to reducing the bending radius of the bending portion 320, thereby reducing the display bezel. At the same time, the rigid filler 120 in the first support region Z1 and the support layer 130 in the second support region Z2 can provide support for the entire display unit 310.

[0064] In one embodiment, see Figure 1 The orthographic projection of the second support film 212 onto the adhesive layer 110 does not overlap with the orthographic projection of the support layer 130 onto the adhesive layer 110. In other words, the second support film 212 can be directly attached to the adhesive layer 110 of the first support area Z1 without the obstruction of the support layer 130. This is equivalent to the second support film 212 and the support layer 130 being disposed in the same layer on the surface of the adhesive layer 110 away from the first support film 211, which can reduce the distance between the bonding part 330 and the display part 310.

[0065] In one embodiment, see further. Figure 1 The orthographic projection of the support layer 130 on the non-display surface A of the display unit 310 covers the orthographic projection of the adhesive layer 110 in the second support region Z2 on the non-display surface A of the display unit 310. Similarly, the orthographic projection of the second support film 212 on the non-display surface A of the display unit 310 covers the orthographic projection of the adhesive layer 110 in the first support region Z1 on the non-display surface A of the display unit 310. It can be seen that the complete coverage of the adhesive layer 110 by the second support film 212 and the support layer 130 prevents the adhesive layer 110 from being exposed, thus protecting it.

[0066] In one embodiment, see Figure 1 The thickness of the support layer 130 is less than the thickness of the second support film 212.

[0067] Specifically, the support layer 130 is made of metal materials such as copper foil, which have high hardness, while the second support film 212 is made of organic polymer materials, which have low hardness. The support layer 130 can achieve high hardness even with a small thickness, thus having higher support performance. Reducing the thickness of the support layer 130 helps to save material costs and also reduces the overall thickness of the second support area Z2.

[0068] In one embodiment, see Figure 2 The display module 10 includes a driver chip 220, which is located on the side of the bonding portion 330 opposite to the display portion 310. The driver chip 220 is used to drive the pixels in the display portion 310. Of course, the driver chip 220 can also be located in other places, such as on the flip-chip film and electrically connected to the bonding portion.

[0069] In one embodiment, see Figure 2 The orthographic projection of the driver chip 220 onto the non-display surface A of the display unit 310 is at least partially located within the first support region Z1. That is, the orthographic projection of the driver chip 220 onto the non-display surface A of the display unit 310 is completely located within the first support region Z1, or the orthographic projection of the driver chip 220 onto the non-display surface A of the display unit 310 is only partially located within the first support region Z1. In either case, the first support region Z1 provides support for the driver chip 220.

[0070] In one embodiment, see Figure 2 and 3 Considering that the driver chip 220 generates heat when supplying power to the display unit 310, the heat will be transferred to the display unit 310 along the adhesive layer 110. The refrigerant 122 in the rigid housing 121 can absorb the heat and reduce the heat transfer to the display unit 310. The heat insulation layer 140 can also further block the heat from the driver chip 220.

[0071] Please see Figure 4 In a second aspect, this application provides a display device 20, which includes a display module 10 as described above.

[0072] Specifically, the display device 20 can be any electronic device such as a laptop, desktop computer, tablet computer, mobile phone, smartwatch, or virtual display terminal, without limitation. The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display module, characterized by The display module includes a first support area, a second support area, and a bending area. The second support area is located on the side of the first support area away from the bending area. The display module further includes: The unit comprises a display portion, a bending portion, and a bonding portion, wherein the display portion and the bonding portion are stacked and spaced apart, and the bending portion connects the display portion and the bonding portion; wherein the bonding portion is located in the first support area, the display portion is located in the first support area and the second support area, and the bending portion is located in the bending area; An adhesive layer is located in the first support area and the second support area, and is located between the bonding portion and the display portion; A rigid filler is incorporated into the adhesive layer located in the first support region; A support layer is disposed on one side of the adhesive layer and is at least partially located in the second support area.

2. The display module according to claim 1, characterized in that, The orthographic projection of the support layer on the non-display surface of the display unit completely coincides with the orthographic projection of the adhesive layer located in the second support area on the non-display surface of the display unit.

3. The display module according to claim 2, characterized in that, The material of the support layer includes a thermally conductive material.

4. The display module according to claim 2, characterized in that, The material of the support layer includes copper foil.

5. The display module according to claim 1, characterized in that, The number of the rigid fillers is multiple.

6. The display module according to claim 5, characterized in that, Multiple rigid fillers are uniformly distributed in the adhesive layer.

7. The display module according to claim 5, characterized in that, The rigid filler may be spherical in shape.

8. The display module according to claim 1, characterized in that, The rigid filler is a solid structure.

9. The display module according to claim 8, characterized in that, The material of the rigid filler includes organic materials.

10. The display module according to claim 1, characterized in that, The rigid filler includes a rigid shell and a refrigerant located within the rigid shell.

11. The display module according to claim 10, characterized in that, The refrigerant includes at least one of halogenated hydrocarbons, alcohols, or diethyl ethers.

12. The display module according to claim 10, characterized in that, The material of the rigid shell includes metallic materials.

13. The display module according to claim 10, characterized in that, The display module further includes a heat insulation layer located on the side of the adhesive layer away from the support layer, and at least partially located in the first support area.

14. The display module according to claim 1, characterized in that, The adhesive layer is made of a superelastic material.

15. The display module according to claim 14, characterized in that, The adhesive layer is made of at least one of silicone gel, aerogel, and foam adhesive.

16. The display module according to claim 1, characterized in that, Also includes: A first support film and a second support film, wherein the first support film is located between the display portion and the adhesive layer, and the second support film is located between the bonding portion and the adhesive layer.

17. The display module according to claim 16, characterized in that, The orthographic projection of the support layer on the non-display surface of the display unit completely coincides with the orthographic projection of the adhesive layer located in the second support area on the non-display surface of the display unit.

18. The display module according to claim 16, characterized in that, The orthographic projection of the second support film onto the adhesive layer does not overlap with the orthographic projection of the support layer onto the adhesive layer.

19. The display module according to claim 16, characterized in that, The orthographic projection of the support layer on the non-display surface of the display unit covers the orthographic projection of the adhesive layer in the second support area on the non-display surface of the display unit, and the orthographic projection of the second support film on the non-display surface of the display unit covers the orthographic projection of the adhesive layer in the first support area on the non-display surface of the display unit.

20. The display module according to claim 16, characterized in that, The thickness of the support layer is less than the thickness of the second support film.

21. The display module according to claim 1, characterized in that, Also includes: The driver chip is located on the side of the bonding portion opposite to the display portion.

22. The display module according to claim 21, characterized in that, The orthographic projection of the driver chip onto the non-display surface of the display unit is at least partially located in the first support area.

23. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 22.

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