power module

Abstract

This disclosure provides a power module, belonging to the field of electronic technology. The power module includes a heat dissipation assembly, at least one power unit, and a fixing component. The heat dissipation assembly includes a heat dissipation housing and a cooling device. The upper surface of the heat dissipation housing has multiple mounting slots, and the heat dissipation housing also has cooling channels arranged around each mounting slot. A second liquid outlet of the cooling device communicates with a first liquid inlet of the cooling channel, and the second liquid inlet of the cooling device communicates with the first liquid outlet of the cooling channel. The power unit includes multiple semiconductor switching devices and a connecting assembly. The multiple semiconductor switching devices are electrically connected through the connecting assembly, and each semiconductor switching device is located in a different mounting slot. The fixing component is connected to the heat dissipation housing to confine the multiple semiconductor switching devices within the mounting slots. Using this disclosure improves the heat dissipation effect of the power module, thereby improving the stability of the power module during operation.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of electronic technology, in particular to a power module. BACKGROUND

[0002] A power module is a module combined and packaged by a plurality of semiconductor switching devices, which can be applied as a rectifier or an inverter in various electrical appliances.

[0003] Generally, the power module includes a housing, a plurality of semiconductor switching devices located in the housing, and a heat sink connected with one surface of the housing for heat conduction through the surface to achieve heat dissipation of the power module.

[0004] However, the heat dissipation effect of the power module is limited, which reduces the stability of the power module during operation. SUMMARY

[0005] The power module provided by the embodiments of the present disclosure can improve the heat dissipation effect of the power module, thereby improving the stability of the power module during operation, and the technical scheme is as follows:

[0006] The power module provided by the embodiments of the present disclosure can improve the heat dissipation effect of the power module, thereby improving the stability of the power module during operation, and the technical scheme is as follows:

[0007] The heat dissipation assembly includes a heat dissipation housing and a cooling device, the upper surface of the heat dissipation housing has a plurality of mounting grooves, the heat dissipation housing also has a cooling channel, the cooling channel is arranged around each mounting groove, the second liquid outlet of the cooling device is in communication with the first liquid inlet of the cooling channel, the second liquid inlet of the cooling device is in communication with the first liquid outlet of the cooling channel, and the cooling device is used to refrigerate the liquid flowing into the second liquid inlet and discharge the refrigerated liquid through the second liquid outlet.

[0008] The power unit includes a plurality of semiconductor switching devices and a connection assembly, the plurality of semiconductor switching devices are electrically connected through the connection assembly, and each semiconductor switching device is located in a different mounting groove.

[0009] The fixing member is connected with the heat dissipation housing to limit the plurality of semiconductor switching devices in the mounting grooves.

[0010] In a possible implementation, the plurality of semiconductor switching devices included in the power unit are located in a plurality of adjacent mounting grooves.

[0011] In a possible implementation, the heat dissipation housing has a rectangular structure, and the plurality of mounting grooves are arranged in multiple rows and multiple columns.

[0012] In a possible implementation, the plurality of mounting slots are arranged in N rows and M columns, the power unit includes a number of semiconductor switching devices which is a multiple of N, and the semiconductor switching devices included in the power unit are located in the same column of mounting slots or in adjacent columns of mounting slots, where N is a positive integer.

[0013] In a possible implementation, the heat dissipation shell includes an upper plate, a side plate, and a bottom plate, two ends of the side plate are connected to edges of the upper plate and the bottom plate respectively, the cooling channel is formed between the upper plate, the side plate, and the bottom plate, the upper plate has a plurality of mounting protrusions, the protruding direction of the mounting protrusions is toward the bottom plate, and the position of each mounting slot corresponds to the position of a mounting protrusion.

[0014] In a possible implementation, the side plate is in a rectangular ring shape, the first liquid inlet and the first liquid outlet are located on opposite sides of the side plate, the first liquid inlet is located close to the bottom plate, and the first liquid outlet is located close to the upper plate.

[0015] In a possible implementation, the first length of the semiconductor switching device is greater than the second length of the semiconductor switching device, the first length of the semiconductor switching device is the length of the semiconductor switching device in a direction perpendicular to the upper surface of the heat dissipation shell, and the second length of the semiconductor switching device is the maximum value of the length between any two edge points of the orthogonal projection of the semiconductor switching device on the upper surface of the heat dissipation shell.

[0016] In a possible implementation, the semiconductor switching device has a control end, an input end, and an output end.

[0017] The connection assembly includes a first connection piece, a second connection piece, and a third connection piece, the first connection piece is electrically connected to the control end of each semiconductor switching device included in the power unit, the second connection piece is electrically connected to the input end of each semiconductor switching device included in the power unit, and the third connection piece is electrically connected to the output end of each semiconductor switching device included in the power unit.

[0018] In a possible implementation, the fixing member includes a plurality of mounting plates, the mounting plates are connected to the upper surface of the heat dissipation shell, and the mounting plates shield part of the slot opening of the mounting slot to limit the semiconductor switching device in the mounting slot.

[0019] In a possible implementation, the semiconductor switching device is at least one of an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and a diode.

[0020] The technical solutions provided by the embodiments of the present disclosure have at least the following beneficial effects:

[0021] The embodiments of the present disclosure provide a power module, in which a cooling channel is arranged around each mounting groove, so that the liquid in the cooling channel can dissipate heat from at least all sides of the semiconductor switching device, thereby improving the heat dissipation effect of the power module and further improving the stability of the power module during operation.

[0022] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 is a structural schematic diagram of a power module shown by an embodiment of the present disclosure;

[0025] Figure 2 is a structural schematic diagram of a power module shown by an embodiment of the present disclosure;

[0026] Figure 3 is an exploded schematic diagram of a power module shown by an embodiment of the present disclosure;

[0027] Figure 4 is a structural schematic diagram of a power module shown by an embodiment of the present disclosure;

[0028] Figure 5 is a structural schematic diagram of a power module shown by an embodiment of the present disclosure;

[0029] Figure 6 is a structural schematic diagram of a heat dissipation shell shown by an embodiment of the present disclosure;

[0030] Figure 7 is a structural schematic diagram of a heat dissipation shell shown by an embodiment of the present disclosure;

[0031] Figure 8 is a structural schematic diagram of a heat dissipation shell according to an embodiment of the present disclosure;

[0032] Figure 9 is a structural schematic diagram of a heat dissipation shell according to an embodiment of the present disclosure;

[0033] Figure 10 is a structural schematic diagram of a power module according to an embodiment of the present disclosure.

[0034] Legend

[0035] 1, heat dissipation assembly;

[0036] 11, heat dissipation shell; 12, cooling device;

[0037] 111, mounting groove; 112, cooling channel; 113, upper plate; 114, side plate; 115, bottom plate; 116, mounting protrusion; 121, second liquid outlet; 122, second liquid inlet;

[0038] 1121, first liquid inlet; 1122, first liquid outlet;

[0039] a, upper surface of the heat dissipation shell;

[0040] 2, power unit;

[0041] 21, semiconductor switching device; 22, connecting assembly;

[0042] 211, clamping groove; 221, first connecting piece; 222, second connecting piece; 223, third connecting piece;

[0043] 3, fixing piece;

[0044] 31, mounting plate; 32, screw;

[0045] 311, clamping protrusion. DETAILED DESCRIPTION

[0046] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the element or object preceding “comprising” or “including” encompasses the element or object listed following “comprising” or “including” and its equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0047] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0048] This disclosure provides a power module, see [link to relevant documentation] Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The power module includes a heat dissipation assembly 1, at least one power unit 2, and a fixing member 3. The heat dissipation assembly 1 includes a heat dissipation housing 11 and a cooling device 12. The upper surface a of the heat dissipation housing 11 has multiple mounting slots 111, and the heat dissipation housing also has cooling channels 112 arranged around each mounting slot 111. The second liquid outlet 121 of the cooling device 12 communicates with the first liquid inlet 1121 of the cooling channel 112, and the second liquid inlet 122 of the cooling device 12 communicates with the first liquid outlet 1122 of the cooling channel 112. The cooling device 12 is used to cool the liquid flowing into the second liquid inlet 122 and discharge the cooled liquid through the second liquid outlet 121. The power unit 2 includes multiple semiconductor switching devices 21 and a connecting assembly 22. The multiple semiconductor switching devices 21 are electrically connected through the connecting assembly 22, and each semiconductor switching device 21 is located in a different mounting slot 111. The fixing member 3 is connected to the heat dissipation housing 11 to confine the multiple semiconductor switching devices 21 within the mounting slots 111.

[0049] The heat dissipation assembly 1 includes a heat dissipation housing 11 and a cooling device 12. The upper surface a of the heat dissipation housing 11 has multiple mounting slots 111, see [link to documentation]. Figure 3The plurality of mounting slots 111 are used to accommodate semiconductor switching devices 21 in the power unit 2 to be introduced later, and each mounting slot 111 is used to accommodate one semiconductor switching device 21.

[0050] The shape and size of the mounting slot 111 can be adapted to the shape and size of the semiconductor switching device 21 to be accommodated, so as to improve the stability of the semiconductor switching device 21 in the mounting slot 111.

[0051] Referring to Figure 6 and Figure 7 The heat dissipation shell 11 also has a cooling channel 112, which is arranged around each mounting slot 111, that is, the cooling channel 112 has a plurality of annular portions (or "h" type channels), see Figure 7 Each annular portion can be arranged around one mounting slot 111, so that the liquid flowing in the cooling channel 112 can cool all the side walls of each mounting slot 111, thereby cooling all the side walls of the semiconductor switching device 21 in each mounting slot 111, improving the cooling effect of each semiconductor switching device 21, thereby improving the cooling effect of the power module, and further improving the stability of the power module during operation.

[0052] The two ends of the cooling channel 112 are respectively a first liquid inlet 1121 and a first liquid outlet 1122, and the first liquid inlet 1121 and the first liquid outlet 1122 are located on the heat dissipation shell 11.

[0053] The cooling device 12 has a second liquid inlet 122 and a second liquid outlet 121, and the second liquid outlet 121 of the cooling device 12 is in communication with the first liquid inlet 1121 of the cooling channel 112, and the second liquid inlet 122 of the cooling device 12 is in communication with the first liquid outlet 1122 of the cooling channel 112.

[0054] The cooling device 12 is used to cool the liquid flowing into the second liquid inlet 122, and discharge the cooled liquid through the second liquid outlet 121.

[0055] In implementation, after the liquid is cooled in the cooling device 12, the cooled liquid flows into the cooling channel 112 through the second liquid outlet 121 and the first liquid inlet 1121 in turn, and cools the mounting slot 111 and the semiconductor switching device 21 in the mounting slot 111 during the flowing process in the cooling channel 112. In this process, the liquid absorbs heat, and the heated liquid flows into the cooling device 12 again through the first liquid outlet 1122 and the second liquid inlet 122, and is cooled again. The above cooling cycle is repeated, so as to realize the cooling of the power module.

[0056] The structure of the cooling device 12 can be any reasonable arrangement. For example, the cooling device 12 can include a water pump and a heat exchange device. The inlet of the water pump is the second inlet 122 of the cooling device 12. That is, the inlet of the water pump is in communication with the first outlet 1122 of the cooling channel 112. The outlet of the water pump is in communication with the inlet of the heat exchange device. The outlet of the heat exchange device is the second outlet 121 of the cooling device 12. That is, the outlet of the heat exchange device is in communication with the first inlet 1121 of the cooling channel 112.

[0057] In implementation, when the water pump is working, the liquid in the cooling channel 112 can be pumped out, sequentially flow through the first outlet 1122 and the second inlet 122, flow into the water pump, and then be discharged from the outlet of the water pump to the inlet of the heat exchange device, flow into the heat exchange device through the inlet of the heat exchange device, and be cooled in the heat exchange device to obtain cooled liquid. The cooled liquid sequentially flows through the second outlet 121 and the first inlet 1121, and flows into the cooling channel 112 to cool the power module again.

[0058] The heat exchange device can be any reasonable device. For example, the heat exchange device can be a device for exchanging heat between liquid and ambient air, a device for exchanging heat between liquid and other liquid, or a device for exchanging heat between liquid and other phase-changeable material, etc. The embodiments of the present disclosure do not limit the heat exchange device.

[0059] Referring to Figure 4 , the power unit 2 can include a plurality of semiconductor switching devices 21 and a connection assembly 22.

[0060] The plurality of semiconductor switching devices 21 are electrically connected by the connection assembly 22. In this way, the plurality of semiconductor switching devices 21 electrically connected by the connection assembly 22 can realize corresponding functions, such as the functions of a rectifier or an inverter. The specific connection mode of electrically connecting the plurality of semiconductor switching devices 21 can be set according to actual needs, and the embodiments of the present disclosure do not limit the specific connection mode.

[0061] Referring to Figure 3 , each semiconductor switching device 21 is located in a different mounting groove 111. In this way, the cooling channel 112 arranged around the mounting groove 111 can cool all sides of each semiconductor switching device 21, greatly increasing the cooling area of the cooled liquid for the semiconductor switching device 21, i.e., increasing the area of the cooling surface of the power module, thereby improving the cooling effect of the power module and further improving the stability of the power module when working.

[0062] In a possible implementation, the plurality of semiconductor switching devices 21 included in the power unit 2 can be located in a plurality of adjacent mounting grooves 111. For example, referring to Figure 3 and Figure 4 Each power unit 2 includes six semiconductor switching devices 21, and the six semiconductor switching devices 21 included in the power unit 2 are located in six adjacent mounting grooves 111.

[0063] In this way, in the first aspect, the plurality of semiconductor switching devices 21 located in the plurality of adjacent mounting grooves 111 are arranged adjacent to each other, which facilitates the electrical connection of the plurality of semiconductor switching devices 21 by the connecting assembly 22, facilitates installation, and improves production efficiency.

[0064] In the second aspect, the plurality of semiconductor switching devices 21 included in the power unit 2 are relatively close to each other, and when the plurality of semiconductor switching devices 21 are electrically connected by the connecting assembly 22, the connecting material of the connecting assembly 22 can be saved, thereby saving resources.

[0065] In the third aspect, the plurality of semiconductor switching devices 21 included in the power unit 2 are arranged adjacent to each other, so that the arrangement is more compact, thereby improving the power density of the power module, and when the power module is applied to other devices, the power density of the other devices is also improved, thereby improving the market competitiveness, for example, the power module can be applied to any device in the technical fields of household appliances, transportation, power engineering, renewable energy, smart grid, and new energy vehicles, etc., and the like, and the embodiments of the present disclosure are not limited thereto.

[0066] In the embodiments of the present disclosure, the semiconductor switching device 21 can be at least one of an IGBT, a MOSFET, and a diode. The plurality of semiconductor switching devices 21 included in the power unit 2 can be any of the above, and of course, can also be any other reasonable semiconductor switching device. The type of each semiconductor switching device 21 in each power unit 2 can be set according to actual needs, and the embodiments of the present disclosure are not limited thereto.

[0067] Referring to Figure 1 The fixing member 3 is connected with the heat dissipation shell 11 to limit the plurality of semiconductor switching devices 21 in the mounting groove 111, thereby improving the connection stability between the semiconductor switching device 21 and the heat dissipation shell 11, and further improving the stability during the operation of the power module.

[0068] In the embodiments of the present disclosure, the heat dissipation shell 11 can be any reasonable structure, and the following describes several possible structures thereof:

[0069] In a possible implementation, referring to Figure 3The heat dissipation shell 11 can have a rectangular structure, and the plurality of mounting grooves 111 are arranged in multiple rows and multiple columns.

[0070] In this way, the plurality of mounting grooves 111 are arranged in multiple rows and multiple columns, and form a regular arrangement, thereby improving the compactness between the plurality of semiconductor switching devices 21, thereby improving the power density. Meanwhile, the heat dissipation shell 11 is also provided as a rectangular structure, and the shape thereof is adapted to the overall shape of the plurality of mounting grooves 111 arranged in multiple rows and multiple columns, thereby further improving the power density of the power module.

[0071] In a possible implementation, referring to Figure 3 The plurality of mounting grooves 111 can be arranged in N rows, the number of the plurality of semiconductor switching devices 21 included in the power unit 2 is a multiple of N, and the plurality of semiconductor switching devices 21 included in the power unit 2 are located in the same column of mounting grooves 111 or in adjacent multiple columns of mounting grooves 111, where N is a positive integer.

[0072] When N is 1, the plurality of semiconductor switching devices 21 included in the power unit 2 can occupy an entire column of mounting grooves 111, so that the plurality of semiconductor switching devices 21 included in the power unit 2 are arranged in the column direction and are compact in position, thereby improving the convenience of electrical connection between the connecting assembly 22 and the plurality of semiconductor switching devices 21, and improving the power density of the power unit 2.

[0073] When N is a positive integer greater than 1, the plurality of semiconductor switching devices 21 included in the power unit 2 can occupy adjacent multiple columns of mounting grooves 111, so that the plurality of semiconductor switching devices 21 included in the power unit 2 are arranged in a certain regularity and are compact in position, and the convenience of electrical connection between the connecting assembly 22 and the plurality of semiconductor switching devices 21 can also be improved, and the power density of the power unit 2 is improved.

[0074] In the embodiments of the present disclosure, the shape of the heat dissipation shell 11 can also be other arbitrary reasonable shapes, for example, can be circular, oval, or square, etc., and can be set according to the installation space of the power unit in the device, and the embodiments of the present disclosure are not limited thereto.

[0075] Similarly, the arrangement mode of the plurality of mounting grooves 111 can also be other reasonable arrangements, and different settings can be made according to the needs and actual structures, and the embodiments of the present disclosure are not limited thereto.

[0076] In a possible implementation, referring to Figure 6 and Figure 7The heat dissipation shell 11 can include an upper plate 113, a side plate 114, and a bottom plate 115, two ends of the side plate 114 are connected with edges of the upper plate 113 and the bottom plate 115 respectively, and a cooling channel 112 is formed between the upper plate 113, the side plate 114, and the bottom plate 115.

[0077] The side plate 114 can have a ring structure, and shapes of openings at two ends of the ring structure can be adapted to shapes of the upper plate 113 and the bottom plate 115 respectively, so that the two ends of the ring structure are connected with edges of the upper plate 113 and the bottom plate 115 respectively, and a space formed between the upper plate 113, the side plate 114, and the bottom plate 115 is the cooling channel 112 and can be used for circulation of the liquid after refrigeration.

[0078] The upper plate 113 has a plurality of mounting protrusions 116, and protruding directions of the mounting protrusions 116 are toward the bottom plate 115, and positions of each mounting groove 111 correspond to positions of one mounting protrusion 116 respectively.

[0079] That is, the upper plate 113 has a plurality of mounting protrusions 116 toward the cooling channel 112, positions of the plurality of mounting protrusions 116 correspond to positions of the plurality of mounting grooves 111 one by one, and distances between adjacent mounting protrusions 116 are certain, so that the space between the adjacent mounting protrusions 116 is also part of the cooling channel 112, so that the cooling channel 112 can be arranged around each mounting protrusion 116, that is, around each mounting groove 111 arranged on the mounting protrusion 116, so as to realize cooling for all sides of each semiconductor switching device 21 located in the mounting groove 111.

[0080] For the mounting groove 111 and the mounting protrusion 116 corresponding in position, a thickness between an inner wall of the mounting groove 111 and a surface of the mounting protrusion 116 can be the same as a thickness of other positions of the upper plate 113 except the mounting protrusion 116.

[0081] The thicknesses of the upper plate 113, the side plate 114, and the bottom plate 115 can also be equal. Of course, they can also be unequal and can be set according to actual needs.

[0082] In a possible implementation, a gap (not shown in the figure) is formed between the mounting protrusion 116 and the bottom plate 115, so that the space between the mounting protrusion 116 and the bottom plate 115 also becomes part of the cooling channel 112, and in the circulation process of the liquid after refrigeration in the cooling channel 112, the bottom surface of the semiconductor switching device 21 close to the groove bottom of the mounting groove 111 can be cooled at the same time of cooling for all sides of the semiconductor switching device 21, further increasing the area of the cooling surface, thereby improving the cooling effect of the power module and the stability of the power module during operation.

[0083] In another possible implementation, referring to Figure 6 The mounting protrusions 116 are connected to the bottom plate 115, so that the mounting protrusions 116 play a supporting role between the upper plate 113 and the bottom plate 115, improve the strength of the heat dissipation shell 11, and thus improve the stability of the power module.

[0084] In a possible implementation, referring to Figure 8 When the plurality of mounting grooves 111 are arranged in multiple rows and multiple columns, the plurality of mounting protrusions 116 are also arranged in multiple rows and multiple columns, and the column direction is the arrangement direction of the first liquid inlet 1121 and the first liquid outlet 1122. The heat dissipation shell 11 can further have a plurality of first partitions, each of which is connected to the bottom plate 115 and the side plate 114 on multiple sides, and a first channel is formed between the first partition and the upper plate 113. It can be understood that the first channel is part of the cooling channel 112.

[0085] A first partition is arranged between every two columns of mounting protrusions 116.

[0086] For example, referring to Figure 8 The plurality of mounting grooves 111 and the plurality of mounting protrusions 116 are arranged in four columns and multiple rows, and the four columns of mounting protrusions 116 are sequentially the first column of mounting protrusions 116, the second column of mounting protrusions 116, the third column of mounting protrusions 116, and the fourth column of mounting protrusions 116 in the direction from the first liquid inlet 1121 to the first liquid outlet 1122. A first partition A is arranged between the first column of mounting protrusions 116 and the second column of mounting protrusions 116, a first partition B is arranged between the second column of mounting protrusions 116 and the third column of mounting protrusions 116, and a first partition C is arranged between the third column of mounting protrusions 116 and the fourth column of mounting protrusions 116.

[0087] When the refrigerated liquid flows into the cooling channel 112 through the first liquid inlet 1121, it will first flow around the first column of mounting protrusions 116. Since the first partition plate is connected to the bottom plate 115, the refrigerated liquid will first accumulate in the part of the cooling channel 112 between the side plate 114 and the first partition plate A after flowing into the cooling channel 112, until the liquid level rises to the first channel corresponding to the first partition plate A, and then flows into the part of the cooling channel 112 between the first partition plate A, the side plate 114, and the first partition plate B from the first channel corresponding to the first partition plate A. Then the liquid accumulates in this part of the cooling channel 112 and flows around the second column of mounting protrusions 116, until the liquid level rises to the first channel corresponding to the first partition plate B, and then flows into the part of the cooling channel 112 between the first partition plate B, the side plate 114, and the first partition plate C from the first channel corresponding to the first partition plate B. Then the liquid accumulates again and flows around the third column of mounting protrusions 116, until the liquid level rises to the first channel corresponding to the first partition plate C, and then flows into the part of the cooling channel 112 between the first partition plate C and the side plate 114 from the first channel corresponding to the first partition plate C. Then the liquid flows around the fourth column of mounting protrusions 116, until the liquid level rises to the first liquid outlet 1122, and then flows out from the first liquid outlet 1122.

[0088] In this way, by arranging multiple first partition plates, the refrigerated liquid can be in sufficient contact with the surface of each mounting protrusion 116, thereby cooling each semiconductor switching device 21 located in the mounting groove 111, improving the heat dissipation effect of the power module, and thereby improving the stability of the power module during operation.

[0089] In a possible implementation, referring to Figure 9 The heat dissipation shell 11 can further include multiple second partition plates. Each second partition plate is connected to the bottom plate 115 and the side plate 114 on multiple sides, respectively. The second partition plate and the upper plate 113 form a second channel. It can be understood that the second channel is part of the cooling channel 112. The first liquid inlet 1121 is located corresponding to the first row of mounting protrusions 116. When the number of columns of mounting grooves 111 is odd, the first liquid outlet 1122 is located corresponding to the last row of mounting protrusions 116. When the number of columns of mounting grooves 111 is even, the first liquid outlet 1122 is located corresponding to the first row of mounting protrusions 116.

[0090] A second partition plate is arranged between every two rows of mounting protrusions 116. Each second partition plate is connected to multiple first partition plates, thereby forming a grid-shaped structure in cross section.

[0091] The plurality of first partitions include at least one third partition and at least one fourth partition, the third partition and the fourth partition are arranged alternately, the third partition is connected with the upper plate 113, and the position of the first channel corresponding to the third partition corresponds to the position of the last row of mounting protrusions 116, that is, the third partition blocks between the adjacent two mounting protrusions 116 in the other rows except the last row of mounting protrusions 116; the fourth partition is connected with the upper plate 113, and the position of the first channel corresponding to the fourth partition corresponds to the position of the first row of mounting protrusions 116, that is, the fourth partition blocks between the adjacent two mounting protrusions 116 in the other rows except the first row of mounting protrusions 116.

[0092] For example, referring to Figure 9 , the plurality of mounting grooves 111 and the plurality of mounting protrusions 116 are arranged in four columns and three rows, the three rows of mounting protrusions 116 are sequentially the first row of mounting protrusions 116, the second row of mounting protrusions 116 and the third row of mounting protrusions 116 in a column direction, the position of the first liquid inlet 1121 corresponds to the position of the first row of mounting protrusions 116, and the position of the first liquid outlet 1122 corresponds to the position of the third row of mounting protrusions 116. A second partition A is arranged between the first row of mounting protrusions 116 and the second row of mounting protrusions 116, a second partition B is arranged between the second row of mounting protrusions 116 and the third row of mounting protrusions 116, a third partition A is arranged between the first column of mounting protrusions 116 and the second column of mounting protrusions 116, a fourth partition is arranged between the second column of mounting protrusions 116 and the third column of mounting protrusions 116, and a third partition B is arranged between the third column of mounting protrusions 116 and the fourth column of mounting protrusions 116.

[0093] When the refrigerated liquid flows into the cooling channel 112 through the first liquid inlet 1121, it will first flow around the mounting protrusions 116 in the first row and the first column, and accumulate in the part of the cooling channel 112 between the side plate 114, the third partition plate A, and the second partition plate A. When the liquid level rises to the second channel corresponding to the second partition plate A, it will flow into the part of the cooling channel 112 formed between the side plate 114, the second partition plate A, the second partition plate B, and the third partition plate A, and accumulate and flow around the mounting protrusions 116 in the second row and the first column. When the liquid level rises to the second channel corresponding to the second partition plate B, it will flow into the part of the cooling channel 112 formed between the side plate 114, the second partition plate B, and the third partition plate A, and accumulate and flow around the mounting protrusions 116 in the third row and the first column. When the liquid level rises to the first channel corresponding to the third partition plate A, it will flow into the part of the cooling channel 112 formed between the side plate 114, the third partition plate A, the fourth partition plate, and the second partition plate B, and accumulate and flow around the mounting protrusions 116 in the third row and the second column. In this way, the refrigerated liquid will subsequently flow to the mounting protrusions 116 in the second row and the second column, the mounting protrusions 116 in the first row and the second column, the mounting protrusions 116 in the first row and the third column, the mounting protrusions 116 in the second row and the third column, the mounting protrusions 116 in the third row and the third column, the mounting protrusions 116 in the third row and the fourth column, the mounting protrusions 116 in the second row and the fourth column, and the mounting protrusions 116 in the first row and the fourth column, and then flow out through the first liquid outlet 1122 corresponding to the position of the mounting protrusions 116 in the first row.

[0094] In this way, effective cooling of each mounting protrusion 116 is ensured, thereby improving the heat dissipation effect of the power module and further improving the stability of the power module during operation.

[0095] In one possible implementation, referring to Figure 7 , the side plate 114 is in a rectangular ring shape, and the first liquid inlet 1121 and the first liquid outlet 1122 are located on opposite sides of the side plate 114. The first liquid inlet 1121 is located near the bottom plate 115 of the side plate 114, and the first liquid outlet 1122 is located near the upper plate 113 of the side plate 114.

[0096] In this way, the first liquid inlet 1121 and the first liquid outlet 1122 form a low-in and high-out inlet and outlet, so that the refrigerated liquid can fully contact the surface of the mounting protrusions 116 during flow in the cooling channel 112, thereby cooling all sides of the semiconductor switching device 21 arranged in the mounting groove 111.

[0097] In another possible implementation, the first liquid outlet 1122 can be located on the upper plate 113 (not shown in the figure), the first liquid inlet 1121 can be located on the side plate 114, and even the first liquid inlet 1121 can be located at a position of the side plate 114 close to the bottom plate 115.

[0098] The above are only several possible structures of the heat dissipation shell 11, and the heat dissipation shell 11 can also have any other reasonable structure, and the embodiments of the present disclosure do not limit the heat dissipation shell 11.

[0099] The power unit 2 in the embodiments of the present disclosure can also have multiple possibilities, and the following describes several possible structures of the power unit 2.

[0100] In a possible implementation, the first length of the semiconductor switching device 21 is greater than the second length of the semiconductor switching device 21.

[0101] The first length of the semiconductor switching device 21 is the length of the semiconductor switching device 21 in a direction perpendicular to the upper surface a of the heat dissipation shell 11. When the slot depth direction of the mounting groove 111 is perpendicular to the upper surface a of the heat dissipation shell 11, the first length of the semiconductor switching device 21 is the length of the semiconductor switching device 21 in the slot depth direction of the mounting groove 111.

[0102] The second length of the semiconductor switching device 21 is the maximum value of the length between any two edge points of the orthographic projection of the semiconductor switching device 21 on the upper surface a of the heat dissipation shell 11. That is, the orthographic projection of the semiconductor switching device 21 on the upper surface a of the heat dissipation shell 11 is obtained, and the orthographic projection is a two-dimensional graph, which has multiple edge points, and any two edge points have a certain length, and the maximum value of the lengths is the second length of the semiconductor switching device 21.

[0103] In the embodiments of the present disclosure, the first length of the semiconductor switching device 21 is greater than the second length, which can make the longest part of the semiconductor switching device 21 be arranged vertically to the upper surface a of the heat dissipation shell 11, and the part with relatively short length be arranged relatively horizontally to the upper surface a of the heat dissipation shell 11, so that the occupied area of the power unit 2 in the horizontal plane can be reduced, the space in the vertical direction with larger space can be fully utilized, and the space utilization of the power module in the equipment is improved.

[0104] In a possible implementation, the semiconductor switching device 21 has a control end, an input end and an output end.

[0105] The connecting assembly 22 comprises a first connecting piece 221, a second connecting piece 222 and a third connecting piece 223. The first connecting piece 221 is electrically connected to the control end of each of the plurality of semiconductor switching devices 21 comprised by the power unit 2. The second connecting piece 222 is electrically connected to the input end of each of the plurality of semiconductor switching devices 21 comprised by the power unit 2. The third connecting piece 223 is electrically connected to the output end of each of the plurality of semiconductor switching devices 21 comprised by the power unit 2.

[0106] When the semiconductor switching device 21 is located in the mounting groove 111, the control end, the input end and the output end of the semiconductor switching device 21 can be located at the slot opening of the mounting groove 111 and exposed outside through the slot opening, so as to improve the convenience of electrical connection between the connecting assembly 22 and the plurality of semiconductor switching devices 21.

[0107] The first connecting piece 221, the second connecting piece 222 and the third connecting piece 223 can be copper bars, and can also be other components suitable for electrical connection, and the embodiments of the present disclosure do not limit the same.

[0108] The first connecting piece 221, the second connecting piece 222 and the third connecting piece 223 can be respectively provided with corresponding terminals for electrical connection with other components in the device.

[0109] In a possible implementation manner, referring to Figure 3 and Figure 10 The fixing member 3 comprises a plurality of mounting plates 31. The mounting plates 31 are connected to the upper surface a of the heat dissipation shell 11 and shield at least part of the slot opening of the mounting groove 111 to limit the semiconductor switching device 21 in the mounting groove 111.

[0110] The mounting plate 31 can be arranged close to the surface of the heat dissipation shell 11 and can be attached to the upper surface a of the heat dissipation shell 11. The mounting plate 31 shields part of the slot opening of the mounting groove 111, thereby limiting the semiconductor switching device 21 in the mounting groove 111 and preventing the semiconductor switching device 21 from being separated from the mounting groove 111, so as to improve the connection stability of the semiconductor switching device 21.

[0111] In a possible implementation manner, referring to Figure 3 and Figure 10 When the plurality of mounting grooves 111 are arranged in multiple rows and multiple columns, one mounting plate 31 is arranged between every two columns of mounting grooves 111. The mounting plate 31 can shield part of the slot opening of each of the two columns of mounting grooves 111, thereby limiting the plurality of semiconductor switching devices 21 in the plurality of mounting grooves 111.

[0112] In this way, the plurality of semiconductor switching devices 21 can be limited by one mounting plate 31, which is simple in structure and convenient to install.

[0113] In a possible implementation, referring to Figure 3 and Figure 10 The fixing member 3 can further include screws 32, the upper surface a of the heat dissipation shell 11 has threaded holes, the mounting plate 31 has through holes, the position of each through hole corresponds to the position of a threaded hole respectively, and the screws 32 pass through the through holes and are screwed with the threaded holes, so as to realize the fixed connection between the mounting plate 31 and the heat dissipation shell 11.

[0114] Of course, the mounting plate 31 and the upper surface a of the heat dissipation shell 11 can also be connected by other connection modes, for example, can be connected by clamping connection or welding connection, etc., which can be set according to the needs and the actual structure, and the embodiments of the present disclosure are not limited thereto.

[0115] In a possible implementation, referring to Figure 3 and Figure 10 The semiconductor switching device 21 protrudes from the upper surface a of the heat dissipation shell 11, the side surface of the protruding part of the semiconductor switching device 21 protruding from the upper surface a of the heat dissipation shell 11 has a clamping groove 211, and the side surface of the mounting plate 31 has a clamping protrusion 311, and the clamping protrusion 311 is located in the clamping groove 211.

[0116] In this way, it is more convenient to position the position of the mounting plate 31 on the upper surface a of the heat dissipation shell 11 during installation, thereby improving the installation convenience and installation precision of the mounting plate 31.

[0117] The embodiments of the present disclosure provide at least the following beneficial effects:

[0118] The embodiments of the present disclosure provide a power module, in which the cooling channel 112 is arranged around each mounting groove 111, so that the liquid in the cooling channel 112 can cool and heat dissipate at least all side surfaces of the semiconductor switching device 21, thereby improving the heat dissipation effect of the power module, and further improving the stability of the power module during operation.

[0119] The above only describes optional embodiments of the present disclosure, and does not limit the present disclosure, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A power module, characterized by The power module comprises a heat dissipation assembly (1), at least one power unit (2) and a fixing member (3); The heat dissipation assembly (1) comprises a heat dissipation shell (11) and a cooling device (12), the upper surface (a) of the heat dissipation shell (11) is provided with a plurality of mounting grooves (111), the heat dissipation shell (11) comprises an upper plate (113), a side plate (114) and a bottom plate (115), the two ends of the side plate (114) are connected with the edges of the upper plate (113) and the bottom plate (115) respectively, the cooling channel (112) is formed between the upper plate (113), the side plate (114) and the bottom plate (115), the upper plate (113) is provided with a plurality of mounting protrusions (116), the protruding direction of the mounting protrusion (116) is toward the bottom plate (115), the position of each mounting groove (111) corresponds to the position of one mounting protrusion (116) respectively, the cooling channel (112) is arranged around each mounting groove (111), the side plate (114) is in a rectangular ring structure, the first liquid inlet (1121) of the cooling channel (112) and the first liquid outlet (1122) of the cooling channel (112) are located on the opposite sides of the side plate (114), the first liquid inlet (1121) is located close to the bottom plate (115) of the side plate (114), the first liquid outlet (1122) is located close to the upper plate (113) of the side plate (114), the second liquid outlet (121) of the cooling device (12) is communicated with the first liquid inlet (1121), the second liquid inlet (122) of the cooling device (12) is communicated with the first liquid outlet (1122), the cooling device (12) is used for refrigerating the liquid flowing into the second liquid inlet (122) and discharging the refrigerated liquid through the second liquid outlet (121); The power unit (2) comprises a plurality of semiconductor switching devices (21) and a connecting assembly (22), the plurality of semiconductor switching devices (21) are electrically connected through the connecting assembly (22), and each semiconductor switching device (21) is located in a different mounting groove (111); The fixing member (3) is connected with the heat dissipation shell (11) to limit the plurality of semiconductor switching devices (21) in the mounting grooves (111).

2. The power module of claim 1, wherein, The plurality of semiconductor switching devices (21) comprised by the power unit (2) are located in the adjacent mounting grooves (111).

3. The power module of claim 1, wherein, The heat dissipation shell (11) has a rectangular structure, and the plurality of mounting grooves (111) are arranged in multiple rows and multiple columns.

4. The power module of claim 3, wherein, The plurality of mounting grooves (111) are arranged in N rows and multiple columns, the number of the plurality of semiconductor switching devices (21) comprised by the power unit (2) is a multiple of N, and the plurality of semiconductor switching devices (21) comprised by the power unit (2) are located in the same column of mounting grooves (111) or the adjacent multiple columns of mounting grooves (111), wherein N is a positive integer.

5. The power module of claim 1, wherein, The first length of the semiconductor switching device (21) is greater than the second length of the semiconductor switching device (21), wherein the first length of the semiconductor switching device (21) is the length of the semiconductor switching device (21) in a direction perpendicular to the upper surface (a) of the heat dissipation shell (11), and the second length of the semiconductor switching device (21) is the maximum value of the length between any two edge points of the orthogonal projection of the semiconductor switching device (21) on the upper surface (a) of the heat dissipation shell (11).

6. The power module of claim 1, wherein, The semiconductor switching device (21) has a control end, an input end and an output end. The connecting assembly (22) comprises a first connecting piece (221), a second connecting piece (222) and a third connecting piece (223), the first connecting piece (221) is electrically connected with the control end of each of the plurality of semiconductor switching devices (21) included in the power unit (2), the second connecting piece (222) is electrically connected with the input end of each of the plurality of semiconductor switching devices (21) included in the power unit (2), and the third connecting piece (223) is electrically connected with the output end of each of the plurality of semiconductor switching devices (21) included in the power unit (2).

7. The power module of claim 1, wherein, The fixing piece (3) comprises a plurality of mounting plates (31), the mounting plates (31) are connected with the upper surface (a) of the heat dissipation shell (11), and the mounting plates (31) shield part of the slot of the mounting groove (111) to limit the semiconductor switching device (21) in the mounting groove (111).

8. The power module of claim 1, wherein, The semiconductor switching device (21) is at least one of an insulated gate bipolar transistor (IGBT), a metal oxide semiconductor field effect transistor (MOSFET) and a diode.

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