Method for processing copper particle embedded circuit board

Abstract

The application relates to a processing method of copper particle embedding of a circuit board, which comprises the following steps: obtaining position data of required copper particles in a target circuit board according to a circuit layout diagram, and obtaining shape feature data of the copper particles corresponding to each position; forming a copper particle combination according to the position data and the shape feature data, the copper particle combination comprising a plurality of to-be-embedded copper particles, and two adjacent to-be-embedded copper particles being connected through a copper bridge; arranging the copper particle combination on a substrate, and arranging each to-be-embedded copper particle in the copper particle combination in a corresponding copper groove in the substrate; and pressing each to-be-embedded copper particle. In the application, the copper bridge is arranged to connect the plurality of to-be-embedded copper particles into a whole, so that the plurality of to-be-embedded copper particles in the copper particle combination can be simultaneously embedded in the corresponding copper grooves, and therefore, the processing method of the copper particle embedding of the circuit board can not only ensure that the copper particles are reliably embedded in the substrate, but also effectively shorten the embedding operation time and improve the embedding efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board, in particular to a processing method of circuit board embedded copper particles. BACKGROUND

[0002] With the increase of component assembly density and integration on the printed circuit board, the printed circuit board has higher and higher requirements for heat dissipation, especially the printed circuit board used in electric vehicles works under high power, which requires more effective heat dissipation requirements. In the printed circuit board technology, embedded copper particles are one of the methods applied to heat dissipation management, which realizes metal conduction heat dissipation by combining copper particles with electroplated through holes.

[0003] However, the current embedded copper particle method has the problems of long embedding operation time and low embedding efficiency. SUMMARY

[0004] Therefore, it is necessary to provide a processing method of circuit board embedded copper particles which can effectively shorten the embedding operation time and improve the embedding efficiency.

[0005] The technical scheme is as follows:

[0006] A processing method of circuit board embedded copper particles, comprising the following steps:

[0007] According to the circuit layout diagram, the position data of the required embedded copper particles in the target circuit board is obtained, and the shape feature data of each position corresponding to the copper particles is obtained;

[0008] According to the position data and the shape feature data, a copper particle combination is formed, the copper particle combination includes a plurality of to-be-embedded copper particles, and two adjacent to-be-embedded copper particles are connected by a copper bridge;

[0009] The copper particle combination is arranged on the substrate, and each to-be-embedded copper particle in the copper particle combination is arranged in the corresponding copper groove of the substrate;

[0010] Each to-be-embedded copper particle is pressed.

[0011] In the processing method of the circuit board embedded with copper particles, the copper bridge is arranged to connect the plurality of copper particles to be embedded into one, which also enables the plurality of copper particles to be embedded to be simultaneously moved to the substrate. Since the copper particle assembly is formed into an integrated structure according to the position data and the shape data, the plurality of copper particles to be embedded can maintain a specific relative relationship during the synchronous movement, which enables the plurality of copper particles to be embedded to be simultaneously moved to the substrate and positioned in the corresponding copper slot. Compared with the operation of embedding the copper particles by the copper particle embedding machine, the processing method can save the time for moving the copper particles to be embedded and the time for positioning the copper particles to be embedded, thereby effectively shortening the embedding operation time and improving the embedding operation efficiency. Since each copper particle to be embedded is arranged in the corresponding copper slot one by one and then subjected to the pressing operation, each copper particle to be embedded after the pressing operation can be reliably fixed to the substrate, so that the fixed copper particle can perform heat transfer with the substrate to achieve the corresponding heat dissipation effect. Therefore, the processing method of the circuit board embedded with copper particles can not only ensure that the copper particles are reliably embedded in the substrate, but also effectively shorten the embedding operation time and improve the embedding efficiency.

[0012] The technical solutions are further described below.

[0013] In one embodiment, the step of obtaining position data of copper particles to be embedded in the target circuit board according to the circuit layout diagram and obtaining shape feature data of the copper particles corresponding to each position comprises:

[0014] determining a coordinate origin, a first direction axis and a second direction axis to form a coordinate system according to the circuit layout diagram, wherein the first direction axis and the second direction axis are arranged at an angle;

[0015] determining the coordinates of each copper particle in the coordinate system.

[0016] In one embodiment, the shape feature data comprises shape data and size data.

[0017] In one embodiment, the step of forming a copper particle assembly according to the position data and the shape feature data, the copper particle assembly comprising a plurality of copper particles to be embedded, and the two adjacent copper particles to be embedded are connected by a copper bridge comprises:

[0018] obtaining the copper particle assembly by etching a copper plate.

[0019] In one embodiment, the method further comprises, after the step of forming a copper particle combination according to the position data and the shape feature data, the copper particle combination comprising a plurality of copper particles to be embedded, and two adjacent copper particles to be embedded being connected by a copper bridge, and before the step of arranging the copper particle combination on a substrate, and embedding each of the copper particles to be embedded in the copper particle combination in a corresponding copper slot of the substrate, the method further comprises the steps of:

[0020] forming the copper slots on the substrate according to the position data and the shape feature data, the copper slots corresponding to the copper particles one by one.

[0021] In one embodiment, the number of the copper particles to be embedded in the copper particle combination is less than or equal to the number of the copper particles of the target circuit board.

[0022] In one embodiment, the step of pressing each of the copper particles to be embedded comprises:

[0023] pressing the plurality of copper particles to be embedded according to a predetermined order.

[0024] In one embodiment, the step of pressing the plurality of copper particles to be embedded according to a predetermined order comprises:

[0025] establishing a predetermined route of a punch head of a press machine according to the predetermined order, so that the punch head presses the plurality of copper particles to be embedded according to the predetermined order.

[0026] In one embodiment, the method further comprises, after the step of pressing each of the copper particles to be embedded, the steps of:

[0027] removing each of the copper bridges in the copper particle combination.

[0028] In one embodiment, the step of removing each of the copper bridges in the copper particle combination comprises:

[0029] drilling a drill point between each of the copper bridges and the corresponding copper particles to be embedded. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 Flow chart of a processing method of embedding copper particles in a circuit board in one embodiment.

[0031] Figure 2 Flow chart of a processing method of embedding copper particles in a circuit board in another embodiment. DETAILED DESCRIPTION

[0032] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described herein and by one of ordinary skill in the art without departing from the spirit and scope of the present application, and it is therefore intended that all such variations be considered as falling within the scope of the present application. It should be understood that the use of the terms "include", "comprise" or "contain" herein should not be understood as limiting the present application to the features or steps described herein, but rather the use of these terms is intended to cover the presence of the features or steps described herein as well as the presence of other features or steps not described herein.

[0033] In the description of the present application, it should be understood that, if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0034] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0035] In the present application, unless otherwise specifically defined and limited, if the terms "mount", "connect", "connect", "fix" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship of two elements, unless otherwise specifically limited. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] In the present application, unless specifically defined and limited otherwise, if there is a description of a first feature "on" or "under" a second feature, etc., it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0037] It should be noted that if an element is referred to as "fixed to" or "provided on" another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0038] In some related technologies, copper particles are embedded on the substrate by a copper particle embedding machine. Specifically, a plurality of to-be-embedded copper particles are placed one by one in order, and then the substrate is placed horizontally in the copper particle embedding machine, and then the copper particle embedding machine is positioned to a copper slot of the substrate by a sensor, and then the copper particle embedding machine drives a suction head to suck a to-be-embedded copper particle matched with the copper slot, and the to-be-embedded copper particle is pressed into the copper slot to complete the embedding of one copper particle. However, since the copper particle embedding machine can only position one copper slot at a time when embedding the copper particles, the single embedding process of the copper particle embedding machine can only complete the embedding of one copper particle, which makes the copper particle embedding machine need to repeatedly position the copper slot, transport the to-be-embedded copper particles, and press the to-be-embedded copper particles when embedding the copper on the entire substrate. The whole process is relatively slow, resulting in long embedding operation time and low embedding efficiency. Therefore, how to effectively shorten the embedding operation time and improve the embedding efficiency has become the key to improving the production efficiency of the circuit board.

[0039] Based on this, referring to Figure 1 An embodiment of the present application provides a processing method for embedding copper particles in a circuit board, which comprises the following steps:

[0040] S1: Obtain position data of copper particles to be embedded in a target circuit board according to a circuit layout diagram, and obtain shape feature data of each position corresponding to the copper particles.

[0041] Since the arrangement of the copper particles for heat dissipation is determined according to the power consumption and heat dissipation requirement of the circuit board, the size, shape and mounting position of the heat sink and other factors, the layout of the copper particles in different target circuit boards can be different, and the shape and size of the corresponding copper particles can also be different. Therefore, through this step, the arrangement position of each copper particle of the target circuit board and the shape characteristics of the copper particles at each position can be determined intuitively and clearly, so as to facilitate the subsequent embedding operation of the copper particles according to the position data and shape characteristic data.

[0042] S2: Form a copper particle combination according to the position data and shape characteristic data, the copper particle combination comprising a plurality of to-be-embedded copper particles, and two adjacent to-be-embedded copper particles are connected by a copper bridge.

[0043] On the one hand, since the copper bridge is connected between two adjacent to-be-embedded copper particles, the plurality of to-be-embedded copper particles generated can be connected into an integrated structure under the action of the copper bridge, which makes the remaining to-be-embedded copper particles move synchronously under the action of the copper bridge when one of the to-be-embedded copper particles is moved. On the other hand, since the copper particle combination is formed according to the position data and shape characteristic data, the to-be-embedded copper particles in the copper particle combination can correspond one-to-one to the corresponding copper particles in the target circuit board, and the positional relationship of the to-be-embedded copper particles in the copper particle combination can also be consistent with the positional relationship between the corresponding copper particles in the target circuit board under the connecting action of the copper bridge, which makes the plurality of to-be-embedded copper particles move synchronously while maintaining the relative positional relationship when the copper particle combination is moved. Since the plurality of to-be-embedded copper particles formed by the processing method can be connected into an integrated structure under the action of the copper bridge, the plurality of to-be-embedded copper particles formed by the processing method can realize the movement of the positions in the same to-be-embedded copper particle carrying operation, which makes the processing method effectively reduce the number of times of carrying the copper particles, shorten the operation time, and improve the work efficiency compared with the scheme of independently arranging the to-be-embedded copper particles and moving only one to-be-embedded copper particle at a time by the copper particle embedding machine.

[0044] S3: Arrange the copper particle combination on the substrate, and arrange each to-be-embedded copper particle in the copper particle combination in the corresponding copper slot in the substrate.

[0045] Since the copper bridge can connect the plurality of to-be-embedded copper particles into an integrated structure, and the positions of the to-be-embedded copper particles in the copper particle combination can correspond one-to-one to the positions of the corresponding copper particles in the target circuit board, when the copper slots for embedding the copper particles are formed on the substrate, each to-be-embedded copper particle in the copper particle combination can be moved into the corresponding copper slot in the substrate by simultaneously moving the plurality of to-be-embedded copper particles, so as to realize the simultaneous positioning of the plurality of to-be-embedded copper particles. Therefore, compared with the design of positioning only one copper slot and embedding only one copper particle at a time by the copper particle embedding machine, the processing method can realize the simultaneous positioning and embedding of the plurality of to-be-embedded copper particles by the arrangement of the copper bridge, thereby reducing the number of times of positioning during embedding, shortening the positioning operation time and improving the work efficiency.

[0046] S4: Pressing each copper particle to be embedded.

[0047] In this way, each copper particle to be embedded can be stably fixed on the substrate, so that the copper particles embedded in the substrate can reliably achieve their heat dissipation function, ensuring the heat dissipation efficiency of the circuit board.

[0048] In the above-mentioned processing method for embedding copper particles in a circuit board, the copper bridge is arranged to enable multiple copper particles to be embedded to be connected as a whole, which enables multiple copper particles to be embedded in the copper particle combination to be simultaneously moved to the substrate. Moreover, since the copper particle combination is an integrated structure formed according to the position data and the shape data, the multiple copper particles to be embedded can maintain a specific relative relationship during the synchronous movement of the multiple copper particles to be embedded. This enables the multiple copper particles to be embedded not only to be simultaneously moved to the substrate, but also to be simultaneously positioned in the corresponding copper grooves. This enables the processing method to not only save the time for transporting the copper particles to be embedded, but also save the time for positioning the copper particles to be embedded, thereby effectively shortening the embedding operation time and improving the embedding operation efficiency. Moreover, since the copper particles to be embedded in the copper particle combination are placed one by one in the corresponding copper grooves, and each copper particle to be embedded is subjected to a pressing operation, each copper particle to be embedded after the pressing operation can be reliably fixed to the substrate, so that the fixed copper particles can perform heat transfer with the substrate to achieve the corresponding heat dissipation effect. Therefore, the processing method for embedding copper particles in a circuit board not only enables the copper particles to be reliably embedded in the substrate, but also effectively shortens the embedding operation time and improves the embedding efficiency, thereby effectively reducing labor costs and improving the production efficiency of the circuit board.

[0049] In one embodiment, in combination with Figure 1 and Figure 2 It is shown that step S1 includes:

[0050] S11: Determine the coordinate origin, the first direction axis and the second direction axis to form a coordinate system according to the circuit layout diagram, wherein the first direction axis and the second direction axis are arranged at an included angle.

[0051] S12: Determine the coordinates of each copper particle in the coordinate system.

[0052] In this way, the coordinates of each copper particle in the target circuit board can be conveniently determined by using the coordinate system formed by the coordinate origin, the first direction axis and the second direction axis, so as to obtain the position data of the target circuit board, and then the copper particle combination can be formed according to the position data, thereby ensuring that multiple copper particles to be embedded in the copper particle combination can be simultaneously positioned in the corresponding copper grooves in the substrate, so as to shorten the embedding operation time and improve the embedding efficiency of the processing method for embedding copper particles in a circuit board.

[0053] Optionally, the angle between the first direction axis and the second direction axis can be set as required, for example, 45°, 60° or 90°, etc. Preferably, the first direction axis and the second direction axis are perpendicular.

[0054] Optionally, the coordinate origin can be the edge position of the circuit board; or it can also be the position of a certain point in the circuit board, such as the center position of a certain copper particle in the circuit board.

[0055] Illustratively, the coordinates of the copper particle can be the position of the center of the copper particle in the coordinate system, so that subsequent copper particle combinations can be conveniently formed according to the position data and shape feature data. For example, when the copper particle is a cylinder, the position of the axis of the copper particle is the coordinate of the copper particle in the coordinate system.

[0056] Further, in an embodiment, the shape feature data includes shape data and size data.

[0057] Since the structures, power consumption and heat dissipation requirements of different positions in the circuit board are different, the shapes and sizes of the copper particles arranged at different positions can be different. For example, at a position with high heat dissipation requirement, the copper particle is in a cylindrical shape and has a diameter of 10.2 mm, while at another position with lower heat dissipation requirement, the cross section of the copper particle is in a square structure and has a side length of 8 mm. Therefore, by step S1, the shape and size of the copper particle at each position in the target circuit board can be accurately obtained, so that subsequent copper particle combinations can be formed according to the position data, shape data and size data, and it is ensured that the formed copper particle combinations can meet the requirements of the target circuit board, thereby ensuring that the processing method can reliably shorten the embedding operation time and improve the embedding efficiency.

[0058] Further, in an embodiment, the shape feature data includes shape data and size data. Figure 1 and Figure 2 As shown in FIGS. 1, 2 and 3, step S2 includes: obtaining the copper particle combination by etching the copper plate.

[0059] Since the etching process does not limit the position, shape and size of etching, when the copper particle combination is formed by the etching process, not only the position of the to-be-embedded copper particle formed by etching can be determined according to the position data, but also the shape and size of the to-be-embedded copper particle formed by etching can be determined according to the shape feature data, so as to ensure that the positions, shapes and sizes of the plurality of to-be-embedded copper particles in the copper particle combination can be consistent with the positions, shapes and sizes of the corresponding copper particles in the target circuit board, so that the plurality of to-be-embedded copper particles in the copper particle combination can be simultaneously embedded into the corresponding copper grooves, thereby effectively shortening the embedding operation time and improving the embedding efficiency.

[0060] Further, since the copper particles to be embedded are formed by etching, the size of the copper particles to be embedded is not limited, for example, when the copper particles are cylindrical, the diameter of the copper particles can be large, such as 15 mm, or the diameter can also be small, such as 3 mm. Therefore, compared with the scheme of embedding copper particles by using a copper particle embedding machine, the processing method can effectively expand the size range of the product copper particles. Specifically, since the suction head of the copper particle embedding machine can only suck copper particles of a specific size range (for example, limited by the suction force of the suction head, the suction head can only suck copper particles with a diameter of 8.2 mm, 10.2 mm or 12.2 mm), when the copper particles are embedded by using the copper particle embedding machine, the diameter of the embedded copper particles is limited to a specific diameter range. For copper particles that exceed the size range, the embedding operation cannot be effectively completed, so the size of the product copper particles is limited.

[0061] In other embodiments, the copper particle combination can also be formed by laser cutting, punch stamping, etc.

[0062] In one embodiment, before step S3 and after step S2, the following steps are further included: Figure 1 and Figure 2 As shown in the figures, before step S3 and after step S2, the following steps are further included:

[0063] S31: Forming copper grooves corresponding to the copper particles on the substrate according to the position data and the shape feature data.

[0064] In this way, the position of the copper groove on the substrate for accommodating the heat dissipation copper particles can be effectively ensured to correspond to the position of the copper particles in the target circuit board, so that when the copper particle combination formed according to the position data and the shape feature data is placed on the substrate, the plurality of copper particles to be embedded in the copper particle combination can be simultaneously placed in the copper grooves matched therewith, so as to realize the simultaneous positioning of the plurality of copper particles to be embedded, thereby ensuring that the copper particles to be embedded can be reliably embedded in the corresponding copper grooves, so as to shorten the embedding operation time while ensuring the reliability of the circuit board. In addition, since the substrate may be deformed slightly in the pre-embedding process of the copper particles, the copper grooves formed according to the position data and the shape feature data can ensure that the position of the copper grooves corresponds to the position of the copper particles in the target circuit board, thereby ensuring that the copper particles to be embedded can be conveniently embedded in the corresponding copper grooves, thereby shortening the embedding operation time and improving the embedding efficiency.

[0065] Illustratively, in one embodiment, the copper grooves corresponding to the copper particles are formed on the substrate by a punch machine according to the position data and the shape feature data. In other embodiments, a drill machine or a milling machine can also be used to form the copper grooves.

[0066] In one embodiment, the number of copper particles to be embedded in the copper particle combination is less than or equal to the number of copper particles in the target circuit board.

[0067] Thus, when a large number of copper particles are arranged in the target circuit board, the copper particles can be embedded in the circuit board in a region-by-region manner, so that the copper particles can be quickly placed in the corresponding copper slots without causing the circuit board to be inconveniently placed in the corresponding copper slots due to the large number of copper particles to be embedded, and the reliability of the embedding operation is ensured.

[0068] In one embodiment, as shown in Figure 1 and Figure 2 Step S4 includes:

[0069] S41: Pressing the plurality of copper particles to be embedded in accordance with the predetermined order.

[0070] When the copper particles to be embedded are pressed, the substrate may be warped due to the pressing operation, which is not conducive to ensuring the flatness of the finished circuit board. Therefore, during the pressing of the copper particles to be embedded, the plurality of copper particles to be embedded are pressed in accordance with the predetermined order to avoid the substrate from being warped during the pressing process, thereby ensuring that each copper particle to be embedded is reliably pressed and ensuring the heat dissipation effect of the printed circuit board.

[0071] Optionally, in one embodiment, as shown in Figure 2 Step S41 includes: determining a predetermined route of a punch head of the press machine in accordance with the predetermined order, so that the punch head presses the plurality of copper particles to be embedded in accordance with the predetermined order.

[0072] In this way, when the punch head moves along the predetermined route, it can pass through each copper particle to be embedded in accordance with the predetermined order, so that the press machine can reliably press the copper particles to be embedded at each position on the substrate in accordance with the predetermined order, thereby ensuring the heat dissipation effect of the circuit board while avoiding other additional problems caused by the warping of the substrate.

[0073] Illustratively, when the copper particles are pressed, the moving direction of the punch head can be consistent with the relative direction of the opposite two sides of the substrate, so that the punch head can move from one side of the substrate to the opposite side, and can sequentially press each copper particle to be embedded on the moving path.

[0074] In one embodiment, as shown in Figure 1 and Figure 2 After step S4, the following steps are further included:

[0075] S5: Removing each copper bridge in the copper particle combination.

[0076] In this way, the plurality of copper particles to be embedded that are integrated into one can be dispersed into a plurality of independent copper blocks, so as to ensure the independence of the copper blocks embedded in the substrate, avoid heat transfer or current flow between the copper blocks, and effectively ensure the reliability of the circuit board.

[0077] Optionally, in one embodiment, as shown in Figure 2As shown, the step S5 includes: the drill drills off the connecting point between each copper bridge and the corresponding copper particle to be embedded.

[0078] In this way, when the copper bridge is removed, the position and the travel distance of the drill bit can be accurately controlled, so as to avoid damaging the substrate or the copper particle by the drill, and effectively ensure the reliability of the circuit board.

[0079] In other embodiments, the copper bridge in the copper particle combination can also be removed by laser cutting.

[0080] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not contradict, they should be considered as the scope of the present application.

[0081] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A method for processing copper-inlay particles of a circuit board, characterized in that The method comprises the following steps: determining a coordinate origin, a first direction axis and a second direction axis according to a circuit layout to form a coordinate system, wherein the first direction axis and the second direction axis are arranged at an angle; determining the coordinates of the required copper particles in the target circuit board in the coordinate system; obtaining shape feature data of each copper particle, which comprises shape data and size data; forming a copper particle combination according to the position data and the shape feature data, the copper particle combination comprising a plurality of to-be-embedded copper particles, and two adjacent to-be-embedded copper particles being connected by a copper bridge; arranging the copper particle combination on a substrate, and embedding each to-be-embedded copper particle in the copper particle combination in a corresponding copper slot in the substrate; pressing each to-be-embedded copper particle.

2. The method for processing circuit board embedded copper particles according to claim 1, characterized in that: The step of arranging the first direction axis and the second direction axis at an angle comprises: The first direction axis and the second direction axis are arranged perpendicularly.

3. The method for processing circuit board embedded copper particles according to claim 1, characterized in that: The step of determining the coordinate origin, the first direction axis and the second direction axis according to the circuit layout to form the coordinate system, wherein the first direction axis and the second direction axis are arranged at an angle, and determining the coordinates of the required copper particles in the target circuit board in the coordinate system comprises: The coordinate origin is the position of an edge of the circuit board or a specific point in the circuit board, and the coordinates of the copper particles are the positions of the centers of the copper particles in the coordinate system, so that the copper particle combination can be conveniently formed according to the position data and the shape feature data.

4. The method for processing circuit board embedded copper particles according to claim 1, characterized in that: The step of forming the copper particle combination according to the position data and the shape feature data, the copper particle combination comprising a plurality of to-be-embedded copper particles, and two adjacent to-be-embedded copper particles being connected by a copper bridge comprises: The copper particle combination is obtained by etching a copper plate.

5. The method for processing circuit board embedded copper particles according to claim 1, characterized in that: After the step of arranging the copper particle combination on the substrate and embedding each to-be-embedded copper particle in the copper particle combination in a corresponding copper slot in the substrate, the step of forming the copper particle combination according to the position data and the shape feature data, the copper particle combination comprising a plurality of to-be-embedded copper particles, and two adjacent to-be-embedded copper particles being connected by a copper bridge, and the step of forming the copper slots corresponding to the copper particles on the substrate according to the position data and the shape feature data are further included. The number of to-be-embedded copper particles in the copper particle combination is less than or equal to the number of copper particles in the target circuit board.

6. The method for processing circuit board embedded copper particles according to claim 1, characterized in that: The step of pressing each to-be-embedded copper particle comprises:

7. The method for processing circuit board embedded copper particles according to claim 1, characterized in that: The plurality of to-be-embedded copper particles are pressed in a predetermined order. The step of pressing the plurality of to-be-embedded copper particles in the predetermined order comprises:

8. The method for processing circuit board embedded copper particles according to claim 7, characterized in that: A predetermined route of a punch head of a press machine is determined according to the predetermined order, so that the punch head presses the plurality of to-be-embedded copper particles in the predetermined order. After the step of pressing each to-be-embedded copper particle, the step of removing each copper bridge in the copper particle combination is further included.

9. The method for processing circuit board embedded copper particles according to claim 1, characterized in that: The step of removing each copper bridge in the copper particle combination comprises: A drill machine drills through the connection points between each copper bridge and the corresponding to-be-embedded copper particle.

10. The method for processing circuit board embedded copper particles according to claim 9, characterized in that: ​ ​

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