A manufacturing device and its manufacturing process for circuit board production

Abstract

The present invention discloses a manufacturing device for the production of a circuit board, including a device body and a multi-layer circuit board body processed by the device body. The multi-layer circuit board body includes base materials distributed at intervals up and down. An iron heating sheet is provided between every two adjacent base materials, and the heating sheet is bonded to the base material through an insulating layer; the device body includes a frame assembly, the frame assembly includes a top plate and a bottom plate arranged up and down, and a plurality of connecting columns are connected between the top plate and the bottom plate; a bearing assembly, the bearing assembly includes connecting plates distributed in an annular array, and the upper and lower ends of the connecting plates are respectively fixedly connected to the top plate and the bottom plate. A plurality of bearing plates are fixedly connected to the connecting plates in the vertical direction, and positioning grooves are formed at the upper ends of the bearing plates. The present invention adopts a method of electromagnetic heating of the insulating layer by cooperating the heating sheet with the heating coil to heat the insulating layer comprehensively, and there is no problem of uneven heating caused by spacing.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a manufacturing device and a manufacturing process for circuit board production. Background Art

[0002] In the field of circuit boards, a multi-layer circuit board is a special circuit board structure that includes multiple circuit layers separated by insulating layers (usually a mixture of thin fiberglass and resin). Due to its higher integration and better electromagnetic compatibility, multi-layer circuit boards are widely used in fields such as computers, communication devices, and consumer electronics.

[0003] When a multi-layer circuit board is subjected to lamination processing, the circuit sub-boards are stacked in the designed hierarchical order, and insulating layers are arranged between adjacent circuit sub-boards. Generally, two hot plates arranged vertically from above and below are used to heat and laminate the multi-layer circuit board sub-boards. Heat is conducted through the circuit sub-boards to melt each insulating layer. Since the distances of each insulating layer from the heat source are different, there is a temperature difference in each insulating layer, and uneven heating affects the lamination quality, which is more important for the production of multi-layer circuit boards with high lamination quality requirements. Summary of the Invention

[0004] The present invention aims to provide a manufacturing device and a manufacturing process for circuit board production to solve the problem of uneven heating caused by heating and lamination from above and below in the prior art.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A manufacturing device for circuit board production includes a device body and a multi-layer circuit board body processed by the device body. The multi-layer circuit board body includes substrates spaced up and down. An iron heating sheet is provided between every two adjacent substrates, and the heating sheet is bonded to the substrate through an insulating layer;

[0007] The device body includes

[0008] A frame assembly, the frame assembly includes a top plate and a bottom plate arranged up and down, and a plurality of connecting columns are connected between the top plate and the bottom plate;

[0009] A carrying assembly, the carrying assembly includes connecting plates distributed in a circular array, and the upper and lower ends of the connecting plates are respectively fixedly connected to the top plate and the bottom plate. A plurality of carrying plates are fixedly connected to the connecting plates in the vertical direction, and positioning grooves are formed at the upper ends of the carrying plates;

[0010] Pressing assembly, the pressing assembly includes a threaded rod rotatably connected to the top plate and the bottom plate, a first rotating motor for driving the threaded rod is fixedly installed at the upper end of the top plate, and a plurality of pressing gears are threadedly connected to the threaded rod in the vertical direction, and the pressing gears are correspondingly arranged above each carrier plate;

[0011] Limiting assembly, used to limit a plurality of pressing gears;

[0012] Heating coil, coaxially arranged outside the threaded rod, and the heating coil is connected to the mains through an electromagnetic heater.

[0013] The limiting assembly includes a clamping structure, the clamping structure includes a rotating plate rotatably connected to the threaded rod, electric telescopic rods are symmetrically and fixedly installed on the rotating plate, the telescopic ends of the electric telescopic rods are fixedly connected with arc-shaped toothed plates, and the arc-shaped toothed plates can mesh with each pressing gear.

[0014] Preferably: The clamping structure further includes a guide rail fixedly connected to the rotating plate, and the arc-shaped toothed plate is slidably connected to the guide rail.

[0015] Preferably: The limiting assembly further includes a rotating structure, the rotating structure includes a passive gear in a ring shape and connected to the rotating plate, the passive gear meshes with an active gear, and a second rotating motor for driving the active gear is fixed outside the threaded rod.

[0016] Preferably: The equipment body further includes a lifting assembly, the lifting assembly includes a lifting ring slidably sleeved on each connecting column, an expansion bag is hermetically and fixedly connected between the lifting ring and the top plate, one of the connecting columns is a threaded rod and is rotatably connected to the top plate and the bottom plate, a third rotating motor for driving the threaded rod is fixedly installed at the upper end of the top plate, a vacuum pump is fixedly installed at the upper end of the top plate, an intake end of the vacuum pump is communicated with a vacuum tube, and the vacuum tube is communicated with the expansion bag.

[0017] Preferably: A sealing gasket is fixedly connected to the lower end of the lifting ring by gluing.

[0018] A manufacturing process of a manufacturing device for circuit board production includes the following steps:

[0019] S1. Stack according to one heating sheet for every two base materials, with insulating layers on both the upper and lower sides of the heating sheet;

[0020] S2. Place the multi-layer circuit board bodies of the same type in step S1 into the positioning grooves on each carrier plate on the same plane, and place the multi-layer circuit board bodies of different types into the positioning grooves on each carrier plate on different planes;

[0021] S3. According to the thickness of different types of multi-layer circuit board bodies, the height of the corresponding pressing gear relative to the carrier plate is set, that is, the pressing gear is rotated relative to the threaded rod to adjust its height to the carrier plate, and the position of the arc-shaped toothed plate relative to the pressing gear is adjusted by the rotating structure based on the position of the teeth of the pressing gear, and then the arc-shaped toothed plate is meshed with the pressing gear through the locking structure to limit the pressing gear;

[0022] S4. The lifting ring and the telescopic bag are pressed against the bottom plate through the lifting assembly to form an airtight space;

[0023] S5. First, the heating coil is powered on to conduct heat to the insulating layer through the heating sheet; second, the vacuum pump sucks out the air in the airtight space through the vacuum tube to form a negative pressure space in the airtight space; third, the rotating motor drives the threaded rod to drive the pressing gears to descend, and press the different types of multi-layer circuit board bodies synchronously;

[0024] S6. After the pressing is completed, the heating coil is powered off, the vacuum pump is stopped, the lifting ring is reset and the telescopic bag is contracted through the lifting assembly, and the pressed multi-layer circuit board body is taken out;

[0025] S7, repeating the above S1-S6, that is, repeating the pressing operation of the multi-layer circuit board body.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The heating sheet and the heating coil are used to electromagnetically heat the insulation layer, so that the insulation layer is fully heated, and there is no problem of uneven heating due to spacing;

[0028] 2. Different types of multilayer circuit board bodies can be placed in the positioning grooves on different planes, and the pressing distance of the pressing gear relative to the carrier plate can be adjusted. Different types of multilayer circuit board bodies can be heated and pressed in batches at one time, with high pressing efficiency;

[0029] 3. An airtight space is formed between the telescopic bag, the lifting ring, the top plate and the bottom plate through the lifting assembly. The vacuum pump forms a negative pressure space in the airtight space through the vacuum tube, thereby improving the fluidity of the insulating layer and further improving the pressing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the circuit board of the present invention;

[0031] Figure 2 This is a schematic structural diagram of a three-dimensional cross-section from a first-view perspective of a manufacturing device for producing a circuit board proposed by the present invention;

[0032] Figure 3 for Figure 2 The enlarged structural diagram at A in the middle;

[0033] Figure 4 A top - down structural sectional view of a manufacturing device for the production of a circuit board proposed by the present invention;

[0034] Figure 5 A schematic structural diagram of a manufacturing device for the production of a circuit board proposed by the present invention from a second - perspective three - dimensional view;

[0035] Figure 6 A schematic structural diagram of a manufacturing device for the production of a circuit board proposed by the present invention from a third - perspective three - dimensional view.

[0036] In the figure: 1. Multilayer circuit board body; 11. Substrate; 12. Heating sheet; 13. Insulating layer; 2. Equipment body; 21. Frame assembly; 211. Top plate; 212. Bottom plate; 213. Connecting column; 22. Carrying assembly; 221. Connecting plate; 222. Carrying plate; 223. Positioning groove; 23. Pressing assembly; 231. Threaded rod; 232. Rotating motor 1; 233. Pressing gear; 24. Limiting assembly; 241. Clamping structure; 2411. Rotating plate; 2412. Guide rail; 2413. Arc - shaped toothed plate; 2414. Electric telescopic rod; 242. Rotating structure; 2421. Passive gear; 2422. Active gear; 2423. Rotating motor 2; 25. Lifting assembly; 251. Expansion bladder; 252. Lifting ring; 253. Sealing gasket; 254. Vacuum pump; 255. Vacuum tube; 256. Rotating motor 3; 26. Heating coil. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0038] Defects of the prior art: Since the multilayer circuit boards in the prior art are usually arranged with intervals between the substrate and the insulating layer, and the method of pressing with hot plates on both the upper and lower sides is adopted, it causes different amounts of heat received due to different intervals, resulting in uneven heating and poor pressing quality. Although some prior art uses heating wires with a circular - around design to surround the outside of the multilayer circuit board, this method still has different distances from the inside and outside of each insulating layer to the heat source, cannot solve the problem of uneven heating, and will also cause heat loss, which does not conform to the concept of environmental protection and energy conservation design.

[0039] Accordingly, the present invention designs the following technical solutions based on the basic principle of electromagnetic heating: Embodiment

[0040] Refer to Figure 1, A manufacturing device for the production of a circuit board, including a device body 2 and a multi-layer circuit board body 1 processed by the device body 2. The multi-layer circuit board body 1 includes base materials 11 distributed at intervals up and down. Between every two adjacent base materials 11, there is an iron heating sheet 12. The heating sheet 12 is bonded to the base material 11 through an insulating layer 13.

[0041] In this embodiment, the structure of the multi-layer circuit board in the prior art is improved, that is, a heating sheet 12 is arranged between every two adjacent base materials 11, and an insulating layer 13 is arranged between the base material 11 and the heating sheet 12. The iron heating sheet 12 is the premise of the electromagnetic heating design of the present invention. It should be noted that the present invention is applicable to scenarios with high requirements for multi-layer circuit board lamination.

[0042] Refer to Figures 2 to 6 , The device body 2 includes a frame assembly 21, a bearing assembly 22, a pressing assembly 23, a limiting assembly 24, a lifting assembly 25, and a heating coil 26. Through the mutual cooperation of the above components, this embodiment can synchronously perform heating and pressing operations on different types of multi-layer circuit board bodies 1.

[0043] Specifically, the frame assembly 21 includes a top plate 211 and a bottom plate 212 arranged up and down. Between the top plate 211 and the bottom plate 212, there are a plurality of connecting columns 213 connected. According to the setting of the lifting assembly 25, the other connecting columns 213 are fixedly connected to the top plate 211 and the bottom plate 212.

[0044] Specifically, the bearing assembly 22 includes connecting plates 221 distributed in a circular array. The upper and lower ends of the connecting plates 221 are respectively fixedly connected to the top plate 211 and the bottom plate 212. In the vertical direction, the connecting plates 221 are fixedly connected with a plurality of bearing plates 222. At the upper end of each bearing plate 222, there is a positioning groove 223, and the positioning groove 223 matches the size of the corresponding type of multi-layer circuit board body 1.

[0045] Specifically, the pressing assembly 23 includes a threaded rod 231 rotatably connected to the top plate 211 and the bottom plate 212. At the upper end of the top plate 211, there is a rotary motor 1 232 for driving the threaded rod 231. In the vertical direction, the threaded rod 231 is threadedly connected with a plurality of pressing gears 233, and the pressing gears 233 are arranged one by one above each bearing plate 222. Under the limiting condition, the rotary motor 1 232 drives the threaded rod 231 to rotate to drive each pressing gear 233 to vertically descend to press each type of multi-layer circuit board body 1. It should be noted that in the top view perspective, the top view projection of the pressing gear 233 covers the multi-layer circuit board body 1 placed in the positioning groove 223, so that each multi-layer circuit board body 1 is evenly stressed.

[0046] Specifically, the limiting component 24 for limiting multiple pressing gears 233 includes an engaging structure 241. The engaging structure 241 includes a rotating plate 2411 rotatably connected to the threaded rod 231. Electric telescopic rods 2414 are symmetrically and fixedly installed on the rotating plate 2411. The telescopic ends of the electric telescopic rods 2414 are fixedly connected to arc-shaped toothed plates 2413, and the arc-shaped toothed plates 2413 can mesh with the respective pressing gears 233. By the telescoping of the electric telescopic rods 2414, the arc-shaped toothed plates 2413 are separated from or meshed with the pressing gears 233 to release or limit the pressing gears 233. Additionally provided to improve the sliding stability of the arc-shaped toothed plates 2413 is a guide rail 2412 fixedly connected to the rotating plate 2411, and the arc-shaped toothed plates 2413 are slidably connected to the guide rail 2412.

[0047] Since the heights of the pressing gears 233 vary due to different types of multi-layer circuit board bodies 1, a rotating structure 242 is additionally provided. The rotating structure 242 includes a passive gear 2421 that is annular and connected to the rotating plate 2411. The passive gear 2421 meshes with an active gear 2422, and a second rotating motor 2423 for driving the active gear 2422 is fixed to the outside of the threaded rod 231. After manually adjusting the position of the pressing gear 233 relative to the threaded rod 231, the tooth positions of the pressing gear 233 and the arc-shaped toothed plate 2413 may not correspond. Therefore, the second rotating motor 2423 in the rotating structure 242 can be used to drive the active gear 2422, and the torque is transmitted to the rotating plate 2411 by meshing with the passive gear 2421 to adjust the orientation of the teeth of the arc-shaped toothed plate 2413 relative to the teeth of the pressing gear 233 to just be able to mesh. Of course, within a certain pressing distance error range, the larger the number of teeth or the smaller the tooth groove width, the better, that is, the higher the precision.

[0048] Specifically, the lifting component 25 includes a lifting ring 252 slidably sleeved on each connecting column 213. An expansion bladder 251 is hermetically and fixedly connected between the lifting ring 252 and the top plate 211. One of the connecting columns 213 is a threaded rod and is rotatably connected to the top plate 211 and the bottom plate 212. A third rotating motor 256 for driving the threaded rod is fixedly installed at the upper end of the top plate 211. By driving the connecting column 213 that is a threaded rod by the third rotating motor 256, the lifting ring 252 is driven to descend. A vacuum pump 254 is fixedly installed at the upper end of the top plate 211. The suction end of the vacuum pump 254 is communicated with a vacuum tube 255, and the vacuum tube 255 is communicated with the expansion bladder 251. The vacuum pump 254 sucks away the air in the airtight space through the vacuum tube 255 to form a negative pressure space to enhance the flow of the insulating layer material of the insulating layer 13 and improve the pressing quality. Additionally provided to form an airtight space is a sealing gasket 253 fixedly connected by gluing to the lower end of the lifting ring 252, and the airtightness of the airtight space is made better by the setting of the sealing gasket 253.

[0049] Specifically, a coaxial heating coil 26 is provided on the outside of the threaded rod 231 and is connected to the mains via an electromagnetic heater. The electromagnetic heater is used to convert current so that the heating plate 12 generates eddy currents. The eddy currents cause the carriers of the heating plate 12 to move irregularly at high speed, and the carriers collide and rub against each other to generate heat energy.

[0050] The advantages of this embodiment are:

[0051] 1. The heating sheet 12 and the heating coil 26 are used to electromagnetically heat the insulating layer 13, so that the insulating layer 13 is fully heated, and there is no problem of uneven heating due to the spacing;

[0052] 2. Different types of multilayer circuit board bodies 1 can be placed in the positioning grooves 223 on different planes, and the pressing distance of the pressing gear 233 relative to the carrier plate 222 can be adjusted, so that different types of multilayer circuit board bodies 1 can be heated and pressed in batches at one time, with high pressing efficiency;

[0053] 3. An airtight space is formed between the telescopic bag 251, the lifting ring 252, the top plate 211 and the bottom plate 212 through the lifting assembly 25. The vacuum pump 254 forms a negative pressure space in the airtight space through the vacuum tube 255, thereby improving the fluidity of the insulating layer 13 and further improving the pressing quality. Example

[0054] A manufacturing process for a circuit board manufacturing device comprises the following steps:

[0055] S1. According to each of the two substrates 11, there is a heating sheet 12, and the heating sheet 12 has an insulating layer 13 stacked on both sides;

[0056] S2. The multilayer circuit board body 1 of the same type in S1 is placed in the positioning grooves 223 on each carrier plate 222 on the same plane, and the multilayer circuit board body 1 of different types is placed in the positioning grooves 223 on each carrier plate 222 on different planes;

[0057] S3. According to the thickness of different types of multilayer circuit board bodies 1, the height of the corresponding pressing gear 233 relative to the carrier plate 222 is set, that is, the pressing gear 233 is rotated relative to the threaded rod 231 to adjust its height to the carrier plate 222, and the position of the arc-shaped toothed plate 2413 relative to the pressing gear 233 is adjusted by the rotating structure 242 based on the position of the gear teeth of the pressing gear 233, and then the arc-shaped toothed plate 2413 is meshed with the pressing gear 233 by the engaging structure 241 to limit the pressing gear 233;

[0058] S4. The lifting ring 252 and the telescopic capsule 251 are pressed against the bottom plate 212 through the lifting assembly 25 to form an airtight space;

[0059] S5. First, energize the heating coil 26 to conduct heat to the insulating layer 13 through the heating sheet 12; second, the vacuum pump 254 sucks out the air in the airtight space through the vacuum tube 255 to form a negative pressure space in the airtight space; third, the first rotating motor 232 drives the threaded rod 231 to drive each pressing gear 233 to descend, and simultaneously press different types of multilayer circuit board bodies 1.

[0060] S6. After the pressing is completed, cut off the power supply of the heating coil 26, and at the same time stop the vacuum pump 254. Through the lifting assembly 25, the lifting ring 252 is reset and the expansion and contraction bladder 251 contracts, and the pressed multilayer circuit board body 1 is taken out.

[0061] S7. Repeat the above S1 - S6, that is, repeat the pressing operation of the multilayer circuit board body 1.

[0062] The above is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent replacements or changes, and should be covered by the protection scope of the present invention.

Claims

1. A manufacturing device for the production of a circuit board, comprising a device body (2) and a multi-layer circuit board body (1) processed by the device body (2). The multi-layer circuit board body (1) includes base materials (11) distributed at intervals up and down. An iron heating sheet (12) is provided between every two adjacent base materials (11). The heating sheet (12) is bonded to the base material (11) through an insulating layer (13). It is characterized in that: The device body (2) includes a frame assembly (21). The frame assembly (21) includes a top plate (211) and a bottom plate (212) arranged up and down. A plurality of connecting columns (213) are connected between the top plate (211) and the bottom plate (212). a carrying assembly (22). The carrying assembly (22) includes connecting plates (221) distributed in a circular array. The upper and lower ends of the connecting plates (221) are respectively fixedly connected to the top plate (211) and the bottom plate (212). A plurality of carrying plates (222) are fixedly connected to the connecting plates (221) in the vertical direction. A positioning groove (223) is formed at the upper end of each carrying plate (222). a pressing assembly (23). The pressing assembly (23) includes a threaded rod (231) rotatably connected to the top plate (211) and the bottom plate (212). A first rotating motor (232) for driving the threaded rod (231) is fixedly installed at the upper end of the top plate (211). A plurality of pressing gears (233) are threadedly connected to the threaded rod (231) in the vertical direction, and the pressing gears (233) are arranged above each carrying plate (222) in one-to-one correspondence. a limiting assembly (24) for limiting the plurality of pressing gears (233). a heating coil (26). The heating coil (26) is coaxial with the outside of the threaded rod (231). The heating coil (26) is connected to the mains through an electromagnetic heater.

2. The manufacturing equipment for producing the circuit board according to claim 1, characterized in that: The limiting assembly (24) includes a clamping structure (241). The clamping structure (241) includes a rotating plate (2411) rotatably connected to the threaded rod (231). Electric telescopic rods (2414) are symmetrically and fixedly installed on the rotating plate (2411). The telescopic ends of the electric telescopic rods (2414) are fixedly connected to an arc-shaped toothed plate (2413), and the arc-shaped toothed plate (2413) can be engaged with each pressing gear (233).

3. The manufacturing equipment for the production of the circuit board according to claim 2, characterized in that: The clamping structure (241) further includes a guide rail (2412) fixedly connected to the rotating plate (2411). The arc-shaped toothed plate (2413) is slidably connected to the guide rail (2412).

4. The manufacturing equipment for the production of the circuit board according to claim 3, characterized in that: The limiting assembly (24) further includes a rotating structure (242). The rotating structure (242) includes a passive gear (2421) that is annular and is connected to the rotating plate (2411). The passive gear (2421) is engaged with an active gear (2422). A second rotating motor (2423) for driving the active gear (2422) is fixed to the outside of the threaded rod (231).

5. The manufacturing equipment for producing the circuit board according to claim 4, characterized in that: The device body (2) further comprises a lifting assembly (25), the lifting assembly (25) comprising a lifting ring (252) slidably sleeved on each connecting column (213), a telescopic bag (251) being airtightly fixedly connected between the lifting ring (252) and the top plate (211), one of the connecting columns (213) being a threaded rod, and being rotatably connected to the top plate (211) and the bottom plate (212), a rotating motor (256) for driving the threaded rod being fixedly mounted on the upper end of the top plate (211), a vacuum pump (254) being fixedly mounted on the upper end of the top plate (211), a vacuum tube (255) being connected to the suction end of the vacuum pump (254), and the vacuum tube (255) being connected to the telescopic bag (251).

6. The manufacturing equipment for producing the circuit board according to claim 5, characterized in that: A sealing gasket (253) is glued and fixedly connected to the lower end of the lifting ring (252).

7. A manufacturing process of the manufacturing equipment for circuit board production according to claim 6, characterized in that: The following steps are involved: S1. There is a heating sheet (12) in every two substrates (11), and the heating sheet (12) has insulating layers (13) stacked on the upper and lower sides; S2. placing the same type of multilayer circuit board bodies (1) in S1 into the positioning grooves (223) on the respective carrier plates (222) on the same plane, and placing different types of multilayer circuit board bodies (1) into the positioning grooves (223) on the respective carrier plates (222) on different planes; S3. According to the thickness of different types of multilayer circuit board bodies (1), the height of the corresponding pressing gear (233) relative to the carrier plate (222) is set, that is, the pressing gear (233) is rotated relative to the threaded rod (231) to adjust its height to the carrier plate (222), and based on the position of the gear teeth of the pressing gear (233), the position of the arc-shaped toothed plate (2413) relative to the pressing gear (233) is adjusted by the rotating structure (242), and then the arc-shaped toothed plate (2413) is meshed with the pressing gear (233) by the locking structure (241), so as to limit the position of the pressing gear (233); S4. The lifting ring (252) and the telescopic bag (251) are pressed against the bottom plate (212) through the lifting assembly (25) to form an airtight space. S5. First, the heating coil (26) is energized to transfer heat to the insulating layer (13) through the heating plate (12); second, the vacuum pump (254) sucks out the air in the airtight space through the vacuum tube (255) to form a negative pressure space in the airtight space; third, the rotating motor (232) drives the threaded rod (231) to drive each pressing gear (233) to descend, and press the different types of multilayer circuit board bodies (1) synchronously; S6. After the pressing is completed, the heating coil (26) is powered off, and the vacuum pump (254) is stopped. The lifting ring (252) is reset and the telescopic bag (251) is contracted through the lifting assembly (25), and the pressed multilayer circuit board body (1) is taken out; S7, repeating the above S1-S6, i.e. repeating the pressing operation of the multilayer circuit board body (1).

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