A chip mounting mechanism, a chip mounting device and a chip mounting process for LED

Abstract

The present invention provides a patch mechanism, a patch device and a patch process for LEDs, the core of which lies in an innovative chip picking and mounting design. The mechanism realizes the rotation and extension of the straw by driving a combined motor through a first outer rotor motor distributed in parallel in a shell, and combines the controllable negative pressure generated by an electromagnet and a rubber membrane to accurately locate and quickly pick up the LED chip. The combination of a rotary and a linear telescopic motor is adopted, which can quickly pick up, patch and adjust the angle. The patch device further integrates a longitudinal and transverse slide rail system, as well as an intelligent plate movement and positioning mechanism, to achieve accurate placement of the chip on the PCB board. This process flow incorporates key steps such as solder paste printing, PCB board identification and positioning, chip fine adjustment and visual inspection, which significantly improves the patch efficiency and accuracy. Through the above-mentioned improvements, the present invention successfully shortens the chip picking time, breaks through the patch speed limit of the prior art, and provides a revolutionary solution for the LED packaging industry.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic manufacturing, and relates to a patch mechanism, a patch device and a patch process for LEDs. Background Art

[0002] In the field of lighting technology and electronic manufacturing, the development and innovation of LED chip technology has always been an important force driving the progress of the industry. Since the end of the last century, with the rise of surface mount technology (SMT), LED chip technology has gradually become an indispensable part of electronic assembly, especially in modern lighting applications that pursue lightness, high brightness and energy efficiency.

[0003] Most of the early LED placement machines were improved based on traditional SMT equipment, and were mainly designed for larger chip components. With the continuous reduction in the size of LED chips and the increasing requirements for placement accuracy, LED placement machines have undergone a transformation from single-arm to multi-arm, from low speed to high speed, and from single function to multi-function. For example, the CM602 placement machine launched by Panasonic of Japan is equipped with four arm mounting heads, which significantly improves production efficiency through multi-task parallel processing. These technological advances are not only reflected in the optimization of mechanical structure, but also involve the integration of precision optical systems, advanced motion control algorithms and intelligent software management systems, enabling placement machines to complete the placement of LED chips more accurately and efficiently.

[0004] However, in the workflow of existing LED SMT machines, the chip picking step is still a key link that restricts the overall efficiency improvement. This process involves the multi-axis linkage of the SMT mechanism, that is, the robot arm is controlled by a precise servo drive system to move accurately to the position of the feeder, and the LED chip is sucked by a vacuum nozzle or other picking device, and then returned and the chip is accurately placed on the PCB pad. Although a high degree of automation and precise control have been achieved technically, due to the inherent limitations of physical movement, each picking operation is accompanied by non-productive mechanical travel time, which accumulates in continuous operations and constitutes a significant time consumption in the entire SMT cycle.

[0005] Specifically, the time loss in the chip picking step mainly comes from the following aspects: the acceleration, deceleration and stopping process of the robot arm, the positioning and chip identification of the feeder, and the path planning of returning and positioning to the next placement point after picking. These factors jointly determine the number of placements that the placement machine can complete per unit time, which directly affects the throughput and production efficiency of the production line. Summary of the invention

[0006] The purpose of the present invention is to provide a chip mounting mechanism, a chip mounting device and a chip mounting process for LEDs, so as to change the traditional chip picking method, fundamentally shorten the chip picking time and break through the bottleneck of the current chip mounting speed.

[0007] In order to solve the above technical problems, the present invention provides a patch mechanism, including a shell, a patch opening is opened at the lower end of the shell, a plurality of first outer rotor motors distributed in parallel are installed in the shell, a plurality of combination motors are installed outwardly on the outer periphery of the rotor of each first outer rotor motor, a negative pressure cylinder is arranged outwardly at the free end of each combination motor, the combination motor drives the negative pressure cylinder to rotate and retract, a straw is arranged at the free end of each negative pressure cylinder, an electromagnet is installed at the bottom of each negative pressure cylinder, a rubber membrane is arranged near the corresponding straw position in each negative pressure cylinder, and an iron sheet matched with the corresponding electromagnet is arranged in the middle of each rubber membrane;

[0008] A plurality of second outer rotor motors are installed in the housing and are distributed side by side and correspond one to one with the first outer rotor motors. The outer periphery of the rotor of each second outer rotor motor is provided with an annular material supply groove for driving the material belt to move. A side of the housing away from the first outer rotor motor is connected with a plurality of feed ports corresponding one to one with the annular material supply grooves. A side of the housing away from the first outer rotor motor is connected with a plurality of discharge ports corresponding one to one with the annular material supply grooves.

[0009] A plurality of fill light detection cameras corresponding one-to-one to the first outer rotor motor are installed inwardly in each shell, and the fill light detection cameras are used to detect the deflection angle of the chip. A plurality of fill light positioning cameras corresponding one-to-one to the first outer rotor motor are installed near the patch port in the shell, and the fill light positioning cameras are used for positioning during patching.

[0010] The present invention is further configured such that each combined motor includes a rotating motor installed on the outside of the corresponding outer rotor motor, and a linear telescopic motor installed on the free end of the corresponding rotating motor, the mover of each rotating motor is provided with a telescopic hole inwardly, the mover of each linear telescopic motor is provided with a telescopic shaft slidably connected to the corresponding telescopic hole, and each telescopic shaft cannot rotate relative to the corresponding telescopic hole.

[0011] The present invention is further configured such that each straw is made of rubber material.

[0012] The present invention also provides a patch device, comprising a bracket, wherein a longitudinal slide rail is arranged at the upper end of the bracket, a longitudinal slider is slidably connected in the longitudinal slide rail, a longitudinal driving motor for driving the longitudinal slider to slide back and forth is installed at one end of the longitudinal slide rail, a transverse slide rail perpendicular to the longitudinal slide rail is connected to the upper end of the longitudinal slider, a transverse slide rail slidably connected to the transverse slide rail is arranged on the outer side of the housing of the patch mechanism, and a transverse driving motor for driving the transverse slider to slide back and forth is installed at one end of the transverse slide rail;

[0013] The upper end of the bracket is provided with a longitudinal or transverse plate moving channel, the plate moving channel is located below the patch mechanism, strip conveyors are provided on both sides of the upper part of the plate moving channel, and a conveying drive motor for driving the conveyor belt of the strip conveyor is installed on the outer side of the plate moving channel;

[0014] The bracket is provided with a positioning frame on one side of the plate moving channel, and an identification and positioning camera is installed on the positioning frame downward toward the plate moving channel. A mounting frame is provided at the upper end of the bracket, and a plurality of third outer rotor motors are installed in the mounting frame, which are distributed side by side and correspond to the second outer rotor motors one by one. A winding wheel for winding waste material tape is provided on the outer periphery of the rotor of each third outer rotor motor, and a mounting bracket is provided upward at the upper end of the bracket, and a horizontal mounting shaft for mounting a material tray is horizontally provided at the upper end of the mounting bracket.

[0015] The present invention is further configured such that a longitudinal threaded shaft is rotatably connected in the longitudinal slide rail, the longitudinal slider is provided with a longitudinal threaded hole threadedly connected to the longitudinal threaded shaft, the power output shaft of the longitudinal drive motor is connected to the longitudinal threaded shaft, a longitudinal limit shaft is arranged in the longitudinal slide rail, and the longitudinal slider is provided with a longitudinal limit hole slidably connected to the longitudinal limit shaft.

[0016] The present invention is further configured such that a transverse threaded shaft is rotatably connected in the transverse slide rail, the transverse slider is provided with a transverse threaded hole threadedly connected to the transverse threaded shaft, the power output shaft of the transverse drive motor is connected to the transverse threaded shaft, a transverse limit shaft is arranged in the transverse slide rail, and the transverse slider is provided with a transverse limit hole slidably connected to the transverse limit shaft.

[0017] The present invention is further configured such that a plurality of strip conveyors are arranged on both sides of the upper part of the plate moving channel, each strip conveyor comprises a conveyor belt, two transmission shafts respectively arranged in the corresponding conveyor belts and rotatably connected to the side walls of the plate moving channel, a transmission pulley is arranged at one end of each transmission shaft, and each two adjacent transmission pulleys on the same side are driven by belts, the conveying drive motor is a double-head drive motor, and the power output shafts at both ends of the conveying drive motor are arranged with drive pulleys, and each drive pulley is driven by a belt to the drive pulley on the corresponding side.

[0018] The present invention is further configured such that a traction plate is upwardly arranged at the upper end of the bracket between the patch mechanism, the third outer rotor motor and the horizontal mounting shaft, the traction plate is provided with a belt feed port corresponding one-to-one to the feed port, the traction plate is provided with a belt outlet port corresponding one-to-one to the outlet, a belt feed traction tube is connected between each belt feed port and the corresponding feed port, and a belt outlet traction tube is connected between each belt outlet and the corresponding outlet.

[0019] The present invention is further configured such that each belt inlet traction pipe and each belt outlet traction pipe are PVC reinforced hoses.

[0020] The present invention also provides a chip mounting process for LEDs of a chip mounting device, comprising the following steps:

[0021] S1, solder paste printing, the steel mesh or template evenly applies solder paste on the pads of the PCB board;

[0022] S2, PCB board identification and positioning, transfer the PCB board to the plate moving channel, drive the strip conveyor to convey it forward, and identify the marking points on the PCB board after passing through the identification and positioning camera, and set the picking position, angle, height and other parameters in the patch software according to the LED size and PCB board layout;

[0023] S3, chip picking, the second outer rotor motor and the third outer rotor motor rotate simultaneously, driving the material belt to rotate into the shell, and after it is directly facing the suction tube, the combined motor drives the suction tube to extend and contact the LED in the material belt, and the electromagnet is energized to attract the iron sheet, so that the iron sheet drives the rubber membrane to generate negative pressure in the negative pressure cylinder, so that the suction tube sucks up the LED;

[0024] S4, deflection detection, the first outer rotor motor drives the combined motor to drive the straw to rotate, so that the LED faces the fill light detection camera, the fill light detection camera identifies the angle of the LED, and then compares it with the angle of the corresponding position on the PCB board in the system. If the angles match, no processing is required. If there is an angle deflection, the combined motor drives the straw to drive the LED to rotate to match the angle;

[0025] S5, patch, the first outer rotor motor drives the combined motor to drive the straw to rotate, so that the LED rotates downward, and with the cooperation of the fill light positioning camera, the combined motor drives the straw downward to gently place the LED on the pad pre-coated with solder paste, and then the electromagnet is powered off to make the negative pressure in the negative pressure cylinder lose, so that the LED can be attached to the PCB board. During the process, the patch mechanism is driven by the longitudinal drive motor and the transverse drive motor to quickly move the patch relative to the PCB board;

[0026] S6, reflow soldering, send the mounted PCB board into the reflow soldering furnace for preheating, heat preservation, reflow soldering and cooling;

[0027] S7, visual inspection, use AOI equipment to automatically scan the PCB board to check for defects such as solder leaks, bridging, offset, etc.

[0028] S8, Functional test, perform electrical test on the soldered PCB board to ensure that all LEDs light up normally without short circuit or open circuit.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] First, the present invention integrates chip picking inside the shell of the patch mechanism, and picks up chips one by one through the cooperation of the first outer rotor motor and the second outer rotor motor inside. It is not necessary to move the patch mechanism back and forth to the position of the feeder, and the step of moving the material is directly eliminated, which fundamentally shortens the chip picking time and breaks through the bottleneck of the current patch speed.

[0031] Secondly, the present invention integrates the X-axis movement and the Y-axis movement into one, and cancels the step of moving the material. When the patch mechanism is performing patching, the patch mechanism only has a small range of displacement, so the X-axis movement and the Y-axis movement do not need to use a drag chain, and the mobile mechanism has a high degree of integration, a simpler structure, and a smaller footprint;

[0032] Third, the present invention uses an inlet traction tube and an outlet traction tube to cover the material tape. When the patch mechanism moves, it will only cause the inlet traction tube and the outlet traction tube to deform, and will not pull the material tape. The movement of the patch mechanism will not cause the take-up wheel and the material tray to rotate, thereby ensuring the accuracy of picking up the chip and allowing the waste material tape to be stably wound on the take-up wheel. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 ;

[0034] Figure 2 The overall structure of the present invention is shown in FIG. Figure 2 ;

[0035] Figure 3 It is used to show the connection between the longitudinal slider and the transverse slide rail;

[0036] Figure 4 Used to demonstrate the connection of patch mechanism, take-up wheel and horizontal mounting shaft;

[0037] Figure 5 A schematic diagram for showing the overall structure of the patch mechanism;

[0038] Figure 6 Schematic diagram for showing the internal structure of the patch mechanism;

[0039] Figure 7 A schematic diagram used to show the overall structure of the combined motor.

[0040] Among them, 1. bracket; 2. longitudinal slide rail; 3. longitudinal slider; 4. longitudinal drive motor; 5. longitudinal threaded shaft; 6. longitudinal threaded hole; 7. longitudinal limit shaft; 8. longitudinal limit hole; 9. transverse slide rail; 10. transverse slider; 11. transverse drive motor; 12. transverse threaded shaft; 13. transverse threaded hole; 14. transverse limit shaft; 15. transverse limit hole; 16. shell; 17. patch port; 18. first outer rotor motor; 19. rotary motor; 20. linear telescopic motor; 21. telescopic hole; 22. telescopic shaft; 23. negative pressure cylinder; 24. straw; 25. electromagnet; 26. rubber membrane; 2 7. Iron sheet; 28. Second outer rotor motor; 29. ​​Annular feed trough; 30. Feed inlet; 31. Discharge outlet; 32. Fill light detection camera; 33. Fill light positioning camera; 34. Plate moving channel; 35. Conveying drive motor; 36. Conveyor belt; 37. Transmission shaft; 38. Transmission pulley; 39. Belt; 40. Positioning frame; 41. Identification and positioning camera; 42. Mounting frame; 43. Third outer rotor motor; 44. Take-up wheel; 45. Mounting bracket; 46. Horizontal mounting shaft; 47. Traction plate; 48. Belt inlet; 49. Belt outlet; 50. Belt inlet traction tube; 51. Belt outlet traction tube. DETAILED DESCRIPTION

[0041] The following is a further detailed description of a patch mechanism, a patch device and a patch process for LEDs proposed in the present invention in combination with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. The same or similar reference numerals in the accompanying drawings represent the same or similar components.

[0042] Example 1, reference Figure 1-7A patch device comprises a bracket 1, a longitudinal slide rail 2 is arranged at the upper end of the bracket 1, a longitudinal slider 3 is slidably connected in the longitudinal slide rail 2, a longitudinal driving motor 4 for driving the longitudinal slider 3 to slide back and forth is installed at one end of the longitudinal slide rail 2, a longitudinal threaded shaft 5 is rotatably connected in the longitudinal slide rail 2, the longitudinal slider 3 is provided with a longitudinal threaded hole 6 threadedly connected to the longitudinal threaded shaft 5, a power output shaft of the longitudinal driving motor 4 is connected to the longitudinal threaded shaft 5, two longitudinal limit shafts 7 are arranged in the longitudinal slide rail 2, the longitudinal slider 3 is provided with two longitudinal limit holes 8 slidably connected to the longitudinal limit shaft 7, and the longitudinal slider 3 is driven to move longitudinally by the longitudinal driving motor 4.

[0043] The upper end of the longitudinal slider 3 is connected to a transverse slide rail 9 which is perpendicular to the longitudinal slide rail 2. A transverse slider 10 is slidably connected to the transverse slide rail 9. A transverse drive motor 11 for driving the transverse slider 10 to slide back and forth is installed at one end of the transverse slide rail 9. A transverse threaded shaft 12 is rotatably connected in the transverse slide rail 9. The transverse slider 10 is provided with a transverse threaded hole 13 which is threadedly connected to the transverse threaded shaft 12. The power output shaft of the transverse drive motor 11 is connected to the transverse threaded shaft 12. Two transverse limit shafts 14 are arranged in the transverse slide rail 9. The transverse slider 10 is provided with two transverse limit holes 15 which are slidably connected to the transverse limit shaft 14. The transverse drive motor 11 drives the transverse slider 10 to move laterally.

[0044] A patch mechanism is provided on one side of the transverse slider 10, and the patch mechanism includes a shell 16, and a patch opening 17 is opened at the lower end of the shell 16. Five first outer rotor motors 18 distributed in parallel are installed in the shell 16. The outer periphery of the rotor of each first outer rotor motor 18 is equipped with multiple combination motors outwardly, and each combination motor includes a rotating motor 19 installed on the outer side of the corresponding outer rotor motor, and a linear telescopic motor 20 installed on the free end of the corresponding rotating motor 19. The stator of the rotating motor 19 is a circumferentially distributed vertical coil, and the outside of the rotor of the rotating motor 19 is a circumferentially distributed vertical coil. To the magnetic strip, the stator of the linear telescopic motor 20 has a vertically distributed circular coil inside, and the mover of the linear telescopic motor 20 has a vertically distributed circular magnet outside, so as to realize the rotation driven by the rotary motor 19 and the telescopic drive of the linear telescopic motor 20. Each mover of the rotary motor 19 is provided with a telescopic hole 21 with a square cross-section inwardly, and each mover of the linear telescopic motor 20 is provided with a telescopic shaft 22 with a square cross-section and slidably connected to the corresponding telescopic hole 21. Each telescopic shaft 22 cannot rotate relative to the corresponding telescopic hole 21, and the mover of the rotary motor 19 drives the linear telescopic motor 20 to rotate.

[0045] A negative pressure cylinder 23 is provided at one end of each telescopic shaft 22 away from the corresponding rotating motor 19. The combined motor drives the negative pressure cylinder 23 to rotate and retract. A straw 24 is provided at the free end of each negative pressure cylinder 23. The straw 24 is used to absorb the chip. Each straw 24 is made of rubber. An electromagnet 25 is installed at the bottom of each negative pressure cylinder 23. A layer of rubber membrane 26 is provided near the corresponding straw 24 in each negative pressure cylinder 23. An iron sheet 27 that cooperates with the corresponding electromagnet 25 is provided in the middle of each rubber membrane 26. When the electromagnet 25 is energized, it generates magnetic attraction to the iron sheet 27. The iron sheet 27 moves inward and drives the rubber membrane 26 to expand inward, so that negative pressure is generated in the negative pressure cylinder 23 and the straw 24, and the chip is sucked by twisting.

[0046] Five second outer rotor motors 28 are installed in the shell 16, which are distributed side by side and correspond one to one with the first outer rotor motor 18. The outer circumference of the rotor of each second outer rotor motor 28 is provided with a circle of annular supply grooves 29 for driving the material belt to move. The side of the shell 16 away from the first outer rotor motor 18 is connected with a plurality of feed ports 30 corresponding one to one with the annular supply grooves 29. The side of the shell 16 away from the first outer rotor motor 18 is connected with a plurality of discharge ports 31 corresponding one to one with the annular supply grooves 29. After the material belt enters the shell 16 from the feed port 30, it bypasses the annular supply groove 29 and passes through the discharge port 31. The rotation of the second outer rotor motor 28 can drive the material belt to move, making it convenient for the suction tube 24 to absorb the chip.

[0047] Five fill light detection cameras 32 corresponding to the first outer rotor motor 18 are installed inwardly in each shell 16. The fill light detection camera 32 is used to detect the deflection angle of the chip. If the deflection angle is incorrect, the rotating motor 19 drives the straw 24 to drive the chip to rotate. Five fill light positioning cameras 33 corresponding to the first outer rotor motor 18 are installed in the shell 16 near the patch port 17. The fill light positioning camera 33 is used for positioning during patching.

[0048] A longitudinal or transverse plate moving channel 34 is provided at the upper end of the bracket 1. The plate moving channel 34 is located below the patch mechanism. A plurality of strip conveyors are provided on both sides of the upper part of the plate moving channel 34. A conveying drive motor 35 for driving the conveyor belt 36 of the strip conveyor is installed on the inner side of a section of the plate moving channel 34. The conveying drive motor 35 is a double-headed drive motor. Each strip conveyor includes a conveyor belt 36, two transmission shafts 37 respectively arranged in the corresponding conveyor belts 36 and rotatably connected to the side wall of the plate moving channel 34. A transmission pulley 38 is provided at one end of each transmission shaft 37. Each pulley is provided with two circles of belt 39 grooves. Each adjacent two transmission pulleys 38 on the same side are driven by a belt 39 to achieve synchronous movement of the adjacent two belts 39. The power output shafts at both ends of the conveying drive motor 35 are provided with a driving pulley. Each driving pulley is driven by a belt 39 with the transmission pulley 38 on the corresponding side, and the strip conveyors on both sides are driven to move by a conveying drive motor 35.

[0049] The bracket 1 is provided with a positioning frame 40 on one side of the plate moving channel 34, and an identification and positioning camera 41 is installed on the positioning frame 40 downwardly toward the plate moving channel 34. A mounting frame 42 is provided at the upper end of the bracket 1, and five third outer rotor motors 43 are installed in the mounting frame 42 and are distributed side by side and correspond to the second outer rotor motors 28 one by one. The outer periphery of the rotor of each third outer rotor motor 43 is provided with a reel 44 for winding up the waste tape, and the used tape is wound on the reel 44. If the tape needs to be cleaned, the tape is directly cut off and cleaned on the reel 44, and then the new tape is wound on it. A mounting bracket 45 is provided upwardly at the upper end of the bracket 1, and a horizontal mounting shaft 46 for mounting the material tray is horizontally provided at the upper end of the mounting bracket 45.

[0050] A traction plate 47 is arranged upwardly at the upper end of the bracket 1 between the patch mechanism and the third outer rotor motor 43 and the horizontal mounting shaft 46. The traction plate 47 is provided with a belt inlet 48 corresponding to the feed port 30 one by one, and the traction plate 47 is provided with a belt outlet 49 corresponding to the discharge port 31 one by one. A belt inlet traction tube 50 is connected between each belt inlet 48 and the corresponding feed port 30, and a belt outlet traction tube 51 is connected between each belt outlet 49 and the corresponding discharge port 31, wherein each belt inlet traction tube 50 and each belt outlet traction tube 51 are PVC reinforced hoses, so that when the patch mechanism is moving, the material belt will not be pulled in the belt inlet traction tube 50 or the belt outlet traction tube 51, and the movement of the patch mechanism will not cause the take-up wheel 44 and the material tray to rotate.

[0051] Embodiment 2, based on the SMD device of Embodiment 1, further provides a SMD process for LEDs of the SMD device, comprising the following steps:

[0052] S1, solder paste printing, the steel mesh or template evenly applies solder paste on the pads of the PCB board;

[0053] S2, PCB board identification and positioning, transfer the PCB board to the plate moving channel 34, and convey it forward through the strip conveyor drive. After passing through the identification and positioning camera 41, the marking points on the PCB board are identified, and the picking position, angle, height and other parameters are set in the patch software according to the LED size and PCB board layout;

[0054] S3, chip picking, the second outer rotor motor 28 and the third outer rotor motor 43 rotate simultaneously, driving the material belt to rotate into the housing 16, and after it is aligned with the suction tube 24, the combined motor drives the suction tube 24 to extend and contact the LED in the material belt, and the electromagnet 25 is energized to attract the iron sheet 27, so that the iron sheet 27 drives the rubber membrane 26 to generate negative pressure in the negative pressure cylinder 23, so that the suction tube 24 sucks up the LED;

[0055] S4, deflection detection, the first outer rotor motor 18 drives the combined motor to drive the straw 24 to rotate, so that the LED faces the fill light detection camera 32, the fill light detection camera 32 identifies the angle of the LED, and then compares it with the angle of the corresponding position on the PCB board in the system. If the angles match, no processing is required. If there is an angle deflection, the combined motor drives the straw 24 to drive the LED to rotate to match the angle;

[0056] S5, patch, the first outer rotor motor 18 drives the combined motor to drive the suction tube 24 to rotate, so that the LED rotates downward, and with the cooperation of the fill light positioning camera 33, the combined motor drives the suction tube 24 downward to gently place the LED on the pad pre-coated with solder paste, and then the electromagnet 25 is powered off, so that the negative pressure in the negative pressure cylinder 23 is lost, so that the LED can be attached to the PCB board. During the process, the patch mechanism is driven by the longitudinal drive motor 4 and the transverse drive motor 11 to quickly move the patch relative to the PCB board;

[0057] S6, reflow soldering, send the mounted PCB board into the reflow soldering furnace for preheating, heat preservation, reflow soldering and cooling;

[0058] S7, visual inspection, use AOI equipment to automatically scan the PCB board to check for defects such as solder leaks, bridging, offset, etc.

[0059] S8, Functional test, perform electrical test on the soldered PCB board to ensure that all LEDs light up normally without short circuit or open circuit.

[0060] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0061] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A patch mechanism, comprising a housing (16), wherein a patch opening (17) is provided at the lower end of the housing (16), characterized in that: The housing (16) is provided with a plurality of first outer rotor motors (18) arranged in parallel, and a plurality of combined motors are installed outwardly on the outer periphery of the rotor of each first outer rotor motor (18), and each combined motor comprises a rotating motor (19) installed on the outer side of the corresponding outer rotor motor, and a linear telescopic motor (20) installed on the free end of the corresponding rotating motor (19), and a telescopic hole (21) is provided inwardly on the mover of each rotating motor (19), and a telescopic shaft (22) is provided on the mover of each linear telescopic motor (20) in sliding connection with the corresponding telescopic hole (21), and each The telescopic shafts (22) cannot rotate relative to the corresponding telescopic holes (21); a negative pressure cylinder (23) is disposed outwardly at the free end of each combined motor; the combined motor drives the negative pressure cylinder (23) to rotate and to telescope; a suction tube (24) is disposed at the free end of each negative pressure cylinder (23); an electromagnet (25) is installed at the bottom of each negative pressure cylinder (23); a rubber membrane (26) is disposed near the corresponding suction tube (24) in each negative pressure cylinder (23); and an iron sheet (27) matching the corresponding electromagnet (25) is disposed in the middle of each rubber membrane (26); A plurality of second outer rotor motors (28) are installed in the housing (16) and are arranged side by side and correspond one-to-one to the first outer rotor motors (18); an annular material supply groove (29) for driving the material belt to move is arranged on the outer periphery of the rotor of each second outer rotor motor (28); a plurality of feed ports (30) corresponding one-to-one to the annular material supply grooves (29) are connected to the side of the housing (16) away from the first outer rotor motor (18); and a plurality of discharge ports (31) corresponding one-to-one to the annular material supply grooves (29) are connected to the side of the housing (16) away from the first outer rotor motor (18); A plurality of fill light detection cameras (32) corresponding one-to-one to the first outer rotor motor (18) are installed inwardly in each shell (16), and the fill light detection cameras (32) are used to detect the deflection angle of the chip. A plurality of fill light positioning cameras (33) corresponding one-to-one to the first outer rotor motor (18) are installed in the shell (16) near the patch opening (17), and the fill light positioning cameras (33) are used for positioning during patching.

2. A patch mechanism according to claim 1, characterized in that: Each straw (24) is made of rubber.

3. A patch device, based on a patch mechanism according to any one of claims 1 to 2, comprising a bracket (1), characterized in that: The upper end of the bracket (1) is provided with a longitudinal slide rail (2), a longitudinal slider (3) is slidably connected inside the longitudinal slide rail (2), a longitudinal drive motor (4) for driving the longitudinal slider (3) to slide back and forth is installed at one end of the longitudinal slide rail (2), a transverse slide rail (9) perpendicular to the longitudinal slide rail (2) is connected to the upper end of the longitudinal slider (3), a transverse slider (10) slidably connected to the transverse slide rail (9) is provided on the outer side of the housing (16) of the patch mechanism, and a transverse drive motor (11) for driving the transverse slider (10) to slide back and forth is installed at one end of the transverse slide rail (9); The upper end of the support (1) is provided with a longitudinal or transverse plate moving channel (34), the plate moving channel (34) is located below the patch mechanism, strip conveyors are provided on both sides of the upper part of the plate moving channel (34), and a conveying drive motor (35) for driving the conveyor belt (36) of the strip conveyor is installed on the outer side of the plate moving channel (34); The bracket (1) is provided with a positioning frame (40) on one side of the plate moving channel (34), and an identification and positioning camera (41) is installed on the positioning frame (40) downwardly toward the plate moving channel (34). The upper end of the bracket (1) is provided with a mounting frame (42), and a plurality of third outer rotor motors (43) are installed in the mounting frame (42) and are distributed side by side and correspond one to one with the second outer rotor motor (28). The outer periphery of the rotor of each third outer rotor motor (43) is provided with a winding wheel (44) for winding up the waste material belt. The upper end of the bracket (1) is provided with a mounting bracket (45) upwardly, and the upper end of the mounting bracket (45) is horizontally provided with a horizontal mounting shaft (46) for mounting the material tray.

4. A patch device according to claim 3, characterized in that: A longitudinal threaded shaft (5) is rotatably connected inside the longitudinal slide rail (2), the longitudinal slider (3) is provided with a longitudinal threaded hole (6) threadedly connected to the longitudinal threaded shaft (5), the power output shaft of the longitudinal drive motor (4) is connected to the longitudinal threaded shaft (5), a longitudinal limiting shaft (7) is arranged inside the longitudinal slide rail (2), and the longitudinal slider (3) is provided with a longitudinal limiting hole (8) slidably connected to the longitudinal limiting shaft (7).

5. A patch device according to claim 3, characterized in that: A transverse threaded shaft (12) is rotatably connected in the transverse slide rail (9), the transverse slider (10) is provided with a transverse threaded hole (13) threadedly connected to the transverse threaded shaft (12), the power output shaft of the transverse drive motor (11) is connected to the transverse threaded shaft (12), a transverse limiting shaft (14) is arranged in the transverse slide rail (9), and the transverse slider (10) is provided with a transverse limiting hole (15) slidably connected to the transverse limiting shaft (14).

6. A patch device according to claim 3, characterized in that: A plurality of strip conveyors are arranged on both sides of the upper part of the plate moving channel (34), each strip conveyor comprises a conveyor belt (36), two transmission shafts (37) respectively arranged in the corresponding conveyor belt (36) and rotatably connected to the side wall of the plate moving channel (34), one end of each transmission shaft (37) is provided with a transmission pulley (38), and each two adjacent transmission pulleys (38) on the same side are driven by a belt (39), the conveying drive motor (35) is a double-headed drive motor, and the power output shafts at both ends of the conveying drive motor (35) are provided with drive pulleys, and each drive pulley is driven by the drive pulley (38) on the corresponding side through a belt (39).

7. A patch device according to claim 3, characterized in that: A traction plate (47) is arranged upwardly at the upper end of the bracket (1) between the patch mechanism and the third outer rotor motor (43) and the horizontal mounting shaft (46); the traction plate (47) is provided with a belt feed port (48) corresponding one-to-one to the feed port (30); the traction plate (47) is provided with a belt discharge port (49) corresponding one-to-one to the discharge port (31); a belt feed traction tube (50) is connected between each belt feed port (48) and the corresponding feed port (30); and a belt discharge traction tube (51) is connected between each belt discharge port (49) and the corresponding discharge port (31).

8. A patch device according to claim 3, characterized in that: Each belt inlet traction pipe (50) and each belt outlet traction pipe (51) are PVC reinforced hoses.

9. A chip mounting process for LEDs using a chip mounting device according to any one of claims 3 to 8, characterized in that: The following steps are involved: S1, solder paste printing, the steel mesh or template evenly applies solder paste on the pads of the PCB board; S2, identifying and positioning the PCB board, transferring the PCB board to the board moving channel (34), driving the strip conveyor to convey the PCB board forward, identifying the marking points on the PCB board after passing through the identification and positioning camera (41), and setting the picking position, angle, height and other parameters in the patch software according to the LED size and PCB board layout; S3, chip picking, the second outer rotor motor (28) and the third outer rotor motor (43) rotate simultaneously, driving the material belt to rotate into the housing (16), and after being aligned with the suction tube (24), the combined motor drives the suction tube (24) to extend and contact the LED in the material belt, and the electromagnet (25) is energized to attract the iron sheet (27), so that the iron sheet (27) drives the rubber membrane (26) to generate negative pressure in the negative pressure cylinder (23), so that the suction tube (24) sucks up the LED; S4, deflection detection, the first outer rotor motor (18) drives the combined motor to drive the straw (24) to rotate, so that the LED faces the fill light detection camera (32), the fill light detection camera (32) identifies the angle of the LED, and then compares it with the angle of the corresponding position on the PCB board in the system, if the angles match, no processing is required, if there is an angle deflection, the combined motor drives the straw (24) to drive the LED to rotate to match the angle; S5, patch, the first outer rotor motor (18) drives the combined motor to drive the suction tube (24) to rotate, so that the LED rotates downward, and with the cooperation of the fill light positioning camera (33), the combined motor drives the suction tube (24) downward to gently place the LED on the pad pre-coated with solder paste, and then the electromagnet (25) is powered off, so that the negative pressure in the negative pressure cylinder (23) is lost, so that the LED can be attached to the PCB board. During the process, the patch mechanism is driven by the longitudinal drive motor (4) and the transverse drive motor (11) to quickly move the patch relative to the PCB board; S6, reflow soldering, send the mounted PCB board into the reflow soldering furnace for preheating, heat preservation, reflow soldering and cooling; S7, visual inspection, use AOI equipment to automatically scan the PCB board to check for defects such as solder leaks, bridging, offset, etc. S8, Functional test, perform electrical test on the soldered PCB board to ensure that all LEDs light up normally without short circuit or open circuit.

Images