Wafer disc loading device

Abstract

The application provides a wafer disc feeding device, and relates to the technical field of wafer disc detection devices.The wafer disc feeding device comprises a rack, a feeding track, a discharging track, a gripper and a workbench.The rack is used for supporting the feeding track, the discharging track and the gripper.The feeding track and the discharging track are arranged in parallel.The workbench is located between the feeding track and the discharging track in the height direction.The workbench reciprocates between the end of the feeding track and the wafer disc detection device.The gripper is located above the feeding track.Through the arrangement of the feeding track and the discharging track, the feeding and discharging can be simultaneously performed during the wafer disc detection process, so that the wafer discs can be always waited on the feeding track during the detection process, thereby improving the detection efficiency of the wafer discs and improving the work efficiency of the components.

Description

Technical Field

[0001] This invention relates to the field of wafer disk inspection equipment technology, and more particularly to a wafer disk loading device. Background Technology

[0002] During the wafer disk inspection process, the wafer disk is received by a receiving plate on top. In the existing technology, in order to facilitate the loading and unloading of wafer disks, a sliding track is usually set under the receiving plate to extend the receiving plate, and then an AGV trolley is used to load the receiving plate. However, during the loading process, since the receiving plate can only monitor one wafer disk, the loading and unloading process can only be carried out on a single wafer disk, resulting in low work efficiency. Summary of the Invention

[0003] The purpose of this application is to solve the technical problem of low efficiency in wafer disk inspection in the prior art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A wafer disk loading device is used for loading and unloading wafer disks for a wafer disk inspection device. It includes a frame, a loading track, an unloading track, a gripper, and a worktable. The frame supports the loading track, unloading track, and gripper. The loading track and unloading track are arranged parallel to each other. The worktable is located between the loading track and the unloading track in the height direction. The worktable reciprocates between the end of the loading track and the wafer disk inspection device. The gripper is located above the loading track and is used to grip the wafer disk, allowing it to move between the loading track, unloading track, and worktable.

[0006] Preferably, the frame includes a receiving base and a protective cover. The receiving base is used to receive the loading track and the unloading track. The protective cover is located above the loading track and is used to cover the outer periphery of the gripper. A baffle is provided above the receiving base. The baffle is located on both sides of the loading track and the unloading track in the width direction. The length of the baffle is the same as the length of the loading track. A safety light curtain is provided on the side of the baffle that faces away from the wafer disk inspection device.

[0007] Preferably, the feeding track includes a telescopic part and two sets of conveying structures, wherein the two sets of conveying structures are located on both sides of the width direction of the wafer disk, the telescopic part is fixed on the baffle, and the distance between the two sets of conveying structures is adjusted by the extension and retraction of the telescopic part.

[0008] Preferably, the telescopic part includes a U-shaped frame and telescopic rods, wherein the U-shaped frame opens upward, and the two side walls of the U-shaped frame are fixed to the two side baffles by bolts. A support plate parallel to the baffles is provided in the middle of the U-shaped frame. Two telescopic rods are provided, located on both sides of the support plate respectively. One end of the telescopic rod is fixed to the support plate, and the other end is fixed to the conveying structure.

[0009] Preferably, the conveying structure includes a fixed plate extending horizontally, with drive wheels at both ends along its length. A conveyor belt is fitted around the outer periphery of the two drive wheels. One drive wheel is a driving wheel controlled by a motor, which is located on the side of the fixed plate away from the drive wheel. The other drive wheel is a driven wheel. The conveying of the wafer disk is achieved by the displacement of the conveyor belt on the drive wheel. The drive wheels are located on opposite sides of the two fixed plates. The end of the telescopic rod away from the support plate is fixedly mounted on the fixed plate.

[0010] Preferably, the unloading track is located below the loading track, and the length of the unloading track is greater than that of the loading track; a stop is provided at the end of the unloading track away from the wafer disk detection device.

[0011] Preferably, the gripper includes a driving part, a sliding part, and a gripping part, wherein the driving part is fixed on the frame, the driving part is used to drive the sliding part to move in the vertical direction, and the sliding part and the gripping part are fixedly arranged and slide synchronously.

[0012] Preferably, the sliding part includes a slider and a sliding plate that slide in a vertical direction, the sliding plate slides in a vertical direction, and the gripping part is fixed on the sliding plate.

[0013] Preferably, the gripping part includes a fixing part and a gripping plate. The fixing part is fixed to the sliding plate. There are two gripping plates, which are located at both ends of the fixing part along its length and slide along the length of the fixing part. The gripping plates extend downward and a transverse clamping plate is provided at the bottom of the gripping plates.

[0014] The wafer disk loading device described above, through the setting of loading and unloading tracks, enables simultaneous loading and unloading during the wafer disk inspection process, ensuring that there are always wafer disks waiting on the loading track during the inspection process, thereby improving the wafer disk inspection efficiency and the working efficiency between various components. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a wafer disk loading device according to one embodiment of the present invention;

[0016] Figure 2 This is a schematic diagram of the internal structure of a wafer disk loading device according to an embodiment of the present invention;

[0017] Figure 3 This is a schematic diagram of the feeding track structure of a wafer disk feeding device according to one embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of the structure of the worktable surface inside a wafer disk loading device according to an embodiment of the present invention.

[0019] Legend:

[0020] 1. Frame; 11. Base; 111. Baffle; 112. Safety light curtain; 12. Protective cover; 121. Observation window; 2. Feeding track; 21. Telescopic part; 211. U-shaped frame; 2111. Support plate; 212. Telescopic rod; 22. Conveying structure; 221. Fixing plate; 222. Drive wheel; 223. Conveyor belt; 224. Distance sensor; 3. Unloading track; 31. Stop; 4. Gripper; 41. Drive unit ; 42. Sliding part; 421. Slider; 422. Sliding plate; 43. Gripping part; 431. Fixing part; 432. Gripping plate; 4321. Clamping plate; 5. Worktable; 51. Sliding track; 511. First track; 512. Second track; 5121. Track plate; 5122. First slider; 513. Positioning plate; 514. Cylinder; 52. Receiving part; 521. Second slider; 200. Wafer disk inspection device. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to specific embodiments.

[0022] A wafer disk loading device is placed on one side of a wafer disk inspection device 200 and is used to load wafer disks onto the wafer disk inspection device. (See also...) Figure 1The wafer disk loading device includes a frame 1, a loading track 2, an unloading track 3, a gripper 4, a worktable 5, and an AGV trolley (not shown in the figure). The loading track 2 and the unloading track 3 are arranged in parallel, with the loading track 2 located above the unloading track 3. The size of the loading track 2 is smaller than that of the unloading track 3. The loading track 2 and the unloading track 3 are coplanar, pointing towards one end of the wafer disk inspection device. The worktable 5 is located above the loading track 2 and slides between the end of the loading track 2 and the wafer disk inspection device. The gripper 4 is located above the loading track 2 and is used to move the wafer disk between the loading track 2, the worktable 5, and the unloading track 3. The frame 1 supports the loading track 2, the unloading track 3, and the gripper 4. The AGV trolley is used to replenish the loading track 2 and remove empty disks from the unloading track 3.

[0023] Please see Figure 1 and Figure 2 The frame 1 includes a receiving base 11 and a protective cover 12. The receiving base 11 is used to receive the loading track 2 and the unloading track 3. The protective cover 12 is located above the loading track 2 and is used to cover the outer periphery of the gripper 4. In one embodiment, the receiving base 11 is rectangular. A baffle 111 is provided above the receiving base 11. The baffle 111 is located on both sides of the loading track 2 and the unloading track 3 in the width direction. In one embodiment, the length of the baffle 111 is the same as the length of the loading track 2. A safety light curtain 112 is provided on the side of the baffle 111 facing away from the wafer disk inspection device. The safety light curtain 112 is vertically arranged and located on the side of the baffle 111.

[0024] The protective cover 12 is located above the baffle 111. The protective cover 12 is a rectangular shell with an opening at the bottom. The protective cover 12 is located on the side of the receiving base 11 pointing towards the wafer disk inspection device. In one embodiment, the sidewalls of the protective cover 12 in the vertical direction are respectively provided with observation windows 121. The observation windows 121 are used to facilitate the staff to monitor the internal working status.

[0025] The feeding track 2 is fixed on the baffle 111, and the length of the feeding track 2 is greater than the sum of the lengths of the two wafer disks. In one embodiment, the feeding track 2 includes a telescopic part 21 and two sets of conveying structures 22, wherein the two sets of conveying structures 22 are located on both sides of the width direction of the wafer disk, and the telescopic part 21 is fixed on the baffle 111. The distance between the two sets of conveying structures 22 is adjusted by the extension and retraction of the telescopic part 21.

[0026] Specifically, in one embodiment, the telescopic part 21 includes a U-shaped frame 211 and telescopic rods 212. The U-shaped frame 211 has an upward opening, and its two side walls are fixed to the two side baffles 111 by bolts. A support plate 2111 parallel to the baffles 111 is provided in the middle of the U-shaped frame 211. Two telescopic rods 212 are provided, located on both sides of the support plate 2111. One end of each telescopic rod 212 is fixed to the support plate 2111, and the other end is fixed to the conveying structure 22. In one embodiment, the telescopic rods 212 are electric telescopic rods 212; the two electric telescopic rods 212 are used to push the two side conveying structures 22. In one embodiment, in order for the two side conveying structures 22 to move stably, at least three telescopic parts 21 are provided, wherein the distance between the telescopic part 21 closest to the wafer disk detection device and the end of the loading track 2 is greater than the length of the wafer disk.

[0027] Each of the two conveying structures 22 includes a fixed plate 221 extending horizontally. Drive wheels 222 are respectively located at both ends of the fixed plate 221 along its length. A conveyor belt 223 is fitted around the outer periphery of each drive wheel 222. One drive wheel 222 is a driving wheel, controlled by a motor located on the side of the fixed plate 221 opposite to the drive wheel 222. The other drive wheel 222 is a driven wheel. The conveying of the wafer disk is achieved by the displacement of the conveyor belt 223 on the drive wheel 222. The drive wheels 222 are located on opposite sides of the two fixed plates 221. The end of the telescopic rod 212 opposite to the support plate 2111 is fixedly mounted on the fixed plate 221.

[0028] In one embodiment, a distance sensor 224 is also provided on the side of the fixing plate 221 pointing towards the wafer disk detection device, and the distance sensor 224 is used to detect the position of the wafer disk.

[0029] The unloading track 3 is located below the loading track 2. The length of the unloading track 3 is greater than that of the loading track 2. In one embodiment, the length of the unloading track 3 is greater than the sum of the lengths of the three wafer disks. The structure of the unloading track 3 is similar to that of the loading track 2, except that the unloading track 3 does not include the telescopic part 21. The two fixing plates 221 of the unloading track 3 are fixedly mounted on the baffle 111 and extend away from the wafer disk detection device. A stop block 31 is provided at the end of the unloading track 3 away from the wafer disk detection device. The stop block 31 blocks the wafer disks sliding on the unloading track 3 to prevent the wafer disks from sliding outward and falling off the unloading track 3, thus preventing damage to the wafer disks.

[0030] The gripper 4 is located above the loading track 2 and is used to grip the wafer disk. In one embodiment, the gripper 4 includes a driving part 41, a sliding part 42, and a gripping part 43. The driving part 41 is fixed to the protective cover 12 and is used to drive the sliding part 42 to move in the vertical direction. The sliding part 42 and the gripping part 43 are fixedly arranged and slide synchronously. In one embodiment, the driving part 41 is a lead screw drive, and the sliding part 42 includes a slider 421 that slides in the vertical direction and a sliding plate 42. 2. The sliding plate 422 slides vertically, and the gripping part 43 is fixed on the sliding plate 422. In one embodiment, the gripping part 43 includes a fixing part 431 and a gripping plate 432. The fixing part 431 is fixed on the sliding plate 422. Two gripping plates 432 are provided, located at both ends of the fixing part 431 along its length and sliding along the length of the fixing part 431. The gripping plates 432 extend downward, and a transverse locking plate 4321 is provided at the bottom of the gripping plate 432. In one embodiment, the gripping plate 432 is controlled pneumatically.

[0031] The worktable 5 includes a sliding rail 51 and a receiving portion 52, wherein the receiving portion 52 is used to receive the wafer disk, and the sliding rail 51 is used to drive the receiving portion 52 to slide between the wafer disk inspection device and the loading rail 2. In one embodiment, the receiving portion 52 is square in shape. Please refer to [reference needed]. Figure 2 The sliding track 51 includes a first track 511 and a second track 512. A positioning plate 513 is provided below the first track 511. The first track 511 is fixed on the wafer disk detection device by the positioning plate 513. The first track 511 extends along the length direction of the positioning plate 513. A track plate 5121 is provided below the second track 512. A first slider 5122421 is provided below the track plate 5121 and slides along the length direction of the second track 512. In one embodiment, a cylinder 514 is provided on the positioning plate 513. The cylinder 514 is fixed on the positioning plate 513. The piston rod of the cylinder 514 points to the track plate 5121 and is fixed to the end of the track plate 5121 away from the positioning plate 513. A second slider 521421 is provided below the receiving part 52. The second slider 521421 is slidably disposed on the second track 512. A driving device for driving the second slider 521421 to slide is provided on the track plate 5121. In one embodiment, the driving device is a stepper motor. In other embodiments, the driving device may be a pneumatic device or other driving device.

[0032] The AGV is used to feed materials onto the loading track 2 and unload materials onto the unloading track 3.

[0033] The wafer disk loading device described above in this application, through the setting of loading track 2 and unloading track 3, enables simultaneous loading and unloading during the wafer disk inspection process, ensuring that there are always wafer disks waiting on loading track 2 during the inspection process, thereby improving the wafer disk inspection efficiency and the working efficiency between various components.

Claims

1. A wafer disk loading device for loading and unloading wafer disks from a wafer disk inspection device, characterized in that: The device includes a frame, a loading track, an unloading track, a gripper, and a worktable. The frame supports the loading track, the unloading track, and the gripper. The loading track and the unloading track are arranged parallel to each other. The worktable is located between the loading track and the unloading track in the height direction. The worktable reciprocates between the end of the loading track and the wafer disk inspection device. The gripper is located above the loading track and is used to grip the wafer disk, allowing it to move between the loading track, the unloading track, and the worktable. The frame includes a receiving base and a protective cover. The receiving base is used to receive the loading track and the unloading track. The protective cover is located above the loading track and is used to cover the outer periphery of the gripper. A baffle is provided above the receiving base. The baffle is located on both sides of the loading track and the unloading track in the width direction. The length of the baffle is the same as the length of the loading track. A safety light curtain is provided on the side of the baffle that faces away from the wafer disk inspection device. The feeding track includes a telescopic part and two sets of conveying structures. The two sets of conveying structures are located on both sides of the width direction of the wafer disk. The telescopic part is fixed on the baffle, and the distance between the two sets of conveying structures is adjusted by the extension and retraction of the telescopic part. The telescopic part includes a U-shaped frame and telescopic rods. The U-shaped frame has an upward opening, and the two side walls of the U-shaped frame are fixed to the two side baffles by bolts. A support plate parallel to the baffles is provided in the middle of the U-shaped frame. Two telescopic rods are provided, located on both sides of the support plate. One end of the telescopic rod is fixed to the support plate, and the other end is fixed to the conveying structure. The conveying structure includes a fixed plate extending horizontally. Drive wheels are located at both ends of the fixed plate along its length, and a conveyor belt is fitted around the outer circumference of each drive wheel. One drive wheel is a driving wheel controlled by a motor, which is located on the side of the fixed plate away from the drive wheel. The other drive wheel is a driven wheel. The conveying of the wafer disk is achieved by the displacement of the conveyor belt on the drive wheel. The drive wheels are located on opposite sides of the two fixed plates. The end of the telescopic rod away from the support plate is fixedly mounted on the fixed plate.

2. The wafer disk loading device according to claim 1, characterized in that: The unloading track is located below the loading track, and the length of the unloading track is greater than that of the loading track; a stop is provided at the end of the unloading track away from the wafer disk detection device.

3. The wafer disk loading device according to claim 2, characterized in that: The gripper includes a driving part, a sliding part, and a gripping part. The driving part is fixed on the frame and is used to drive the sliding part to move in the vertical direction. The sliding part and the gripping part are fixedly arranged and slide synchronously.

4. A wafer disk loading device according to claim 3, characterized in that: The sliding part includes a slider and a sliding plate that slide in a vertical direction. The sliding plate slides in a vertical direction, and the gripping part is fixed on the sliding plate.

5. A wafer disk loading device according to claim 4, characterized in that: The gripping part includes a fixing part and gripping plates. The fixing part is fixed to the sliding plate. There are two gripping plates, which are located at both ends of the fixing part along the length direction and slide along the length direction of the fixing part. The gripping plates extend downward and a transverse clamping plate is provided at the bottom of the gripping plates.

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