Friction damping vibration reduction material with double-layer hollow structure, preparation method and application thereof
By preparing friction damping and vibration-absorbing materials with double-layer hollow structures, the scattering of mechanical waves in the intermediate hollow layer and the energy-consuming interface friction are solved, and the composite material has been effectively achieved.
Patent Information
- Application Number
- CN202411179750.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2044-08-27
AI Technical Summary
Existing composite materials have shortcomings in vibration damping performance, making it difficult to effectively reduce damage to high-end precision instruments under vibration and impact loads.
The friction damping and vibration-absorbing material with a double-layer hollow structure increases the interface friction energy consumption of the composite material through mechanical wave scattering and diffraction of the intermediate hollow layer, as well as the interface friction energy consumption between the intermediate hollow sphere and the outer hollow sphere.
It improves the vibration damping performance of composite materials, ensures lightweight and high-strength characteristics, and enhances the damping and vibration damping performance, and is suitable for vibration control of high-end precision instruments.
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Figure CN118931111B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of composite material vibration reduction, and in particular to a friction damping vibration reduction material with a double-layer hollow structure, a preparation method and application thereof. Background Art
[0002] As technology advances, modern engineering systems increasingly rely on efficient vibration control to ensure their performance, reliability, and longevity. For example, the aerospace industry requires materials that can effectively reduce the vibrations generated by aircraft during high-speed flight, thereby improving flight safety and passenger comfort. In the automotive industry, vibration-damping materials can significantly reduce the noise and vibration generated by vehicles at high speeds, enhancing the driving experience and ride comfort.
[0003] Due to their lightweight and high-strength properties, composite materials are increasingly being used in aerospace, maritime, and transportation. In aerospace, aircraft structures must withstand the vibration and impact loads associated with high-speed flight and complex aerodynamic environments. Composite materials, with their high strength, low density, and excellent vibration control properties, are ideal for reducing structural weight, improving aircraft performance, and enhancing passenger comfort. In the maritime sector, composite materials, due to their lightweight and corrosion-resistant properties, can reduce ship weight and protect hulls from corrosion in the hot and humid ocean environment. In transportation, composite materials can effectively reduce the impact of engine and road vibration on vehicle passengers, enhancing driving comfort and safety.
[0004] To improve the damping performance of composite materials, micro-nano-sized fillers such as carbon nanotubes and graphene can be added to the composite materials to increase the contact area between the resin and the nanofillers, thereby increasing the interface friction effect of the mechanical waves during vibration.
[0005] The double-layer hollow structure consists of a central hollow region layer and an outer layer surrounding the central hollow region, forming a double-layer hollow structure with a gap between the two layers. Due to its unique double-layer hollow structure, compared to solid and single-layer hollow spheres of the same size, when the vibration mechanical wave passes through the outer layer and enters the central hollow region, it first scatters and diffracts the mechanical wave in the central hollow region, dissipating energy. The mechanical wave then causes frictional energy dissipation at the interface between the central hollow sphere and the outer hollow sphere. The mechanical wave further scatters multiple times between the layers, causing frictional energy dissipation at the interface between the outer hollow sphere and the composite material.
[0006] Based on the above description, the double-layer hollow structure can effectively increase the interfacial friction energy dissipation of composite materials, improve the friction damping performance of composite materials, and enhance the vibration reduction performance of composite materials. It can provide a practical and effective solution for the vibration reduction control of high-end precision instruments, maintaining the original lightweight and high-strength characteristics of the structure while increasing its damping and vibration reduction performance. Summary of the Invention
[0007] The present invention provides a friction damping and vibration reduction material with a double-layer hollow structure, a preparation method and an application thereof, in order to solve the problems raised in the above background technology.
[0008] A method for preparing a friction damping and vibration reduction material with a double-layer hollow structure, the preparation method specifically comprising the following steps:
[0009] S1. Preparation of solid double-layer silica spheres:
[0010] Anhydrous ethanol, ammonia water and deionized water were mixed and stirred in a glass beaker for 15 minutes to obtain an alkaline ethanol / water mixed solution, and then tetrabutyl silicate, resorcinol and formaldehyde were quickly added to the above solution in sequence, and the mixture was sealed and stirred for a period of time to obtain a microsphere solution with silicon dioxide as the core and carbide as the shell. Then, tetrabutyl silicate was added to the solution a second time, and the mixture was stirred for a period of time. The solution was then added to a reactor to react for a period of time, and finally, the mixture was repeatedly washed with ethanol solution and deionized water and dried to obtain solid double-layer silica spheres.
[0011] S2. Preparation of double-layer hollow carbon spheres:
[0012] The solid double-layer silica spheres obtained in step S1 are carbonized in an inert gas to obtain carbonized solid double-layer silica spheres, and then SiO2 is etched with hydrofluoric acid to obtain a double-layer hollow carbon sphere solution, and finally washed with deionized water and dried to obtain double-layer hollow carbon spheres;
[0013] S3. Preparation of a composite material having a double-layer hollow sphere structure:
[0014] The double-layer hollow carbon spheres prepared in step S2 are reacted with a silane coupling agent solution, and then vacuum filtered and dried. The double-layer hollow carbon spheres are then dispersed in an organic solution. Finally, the double-layer hollow carbon sphere organic solution is mixed and stirred with a composite material resin, and allowed to stand and dry to obtain a friction damping and vibration reduction material with a double-layer hollow structure.
[0015] Furthermore, in step S1, the volume ratio of formaldehyde, tetrabutyl silicate, deionized water, ammonia water and anhydrous ethanol is 1:(3-7):(11-26):(3-8):(83-187), and the mass ratio of resorcinol to deionized water in step S1 is 1:(20-35).
[0016] Furthermore, in step S1, after adding tetrabutyl silicate, resorcinol and formaldehyde to the solution, the sealed stirring time is 6-10 hours, the second addition of tetrabutyl silicate in step S1 and the stirring time is continued for 24-30 hours, the solution in step S1 reacts in the reactor for 12-24 hours, and the reaction temperature is 180°C.
[0017] Furthermore, in step S2, the inert gas is nitrogen or argon, and the carbonization temperature is 500-700°C.
[0018] Furthermore, the step of etching SiO2 with hydrofluoric acid in step S2 is as follows:
[0019] The carbonized solid double-layer silica spheres were first statically etched for 6 h and then ultrasonically etched for 2 h.
[0020] Furthermore, the organic solution for dispersing the double-layer hollow carbon spheres in step S3 is ethanol or acetone solution.
[0021] Furthermore, the composite material resin in step S3 is a pure resin composite material or a fiber-reinforced resin-based composite material.
[0022] A friction damping and vibration reduction material with a double-layer hollow structure is prepared by the above-mentioned method for preparing the friction damping and vibration reduction material with a double-layer hollow structure.
[0023] The friction damping vibration reduction material with a double-layer hollow structure prepared by the above preparation method is used in industrial vibration reduction materials.
[0024] The advantages and beneficial effects of the present invention are:
[0025] The present invention synthesizes SiO2@CP@SiO2@CP in a solution, then carbonizes it to obtain SiO2@C@SiO2@C, and finally etches it with hydrofluoric acid to obtain C@C. The C@C is then composited with a resin material, causing mechanical wave scattering and diffraction energy dissipation in the middle hollow layer. The mechanical wave then causes interfacial friction energy dissipation between the middle hollow spheres and the outer hollow spheres. The mechanical wave further scatters multiple times between the layers, causing friction energy dissipation at the interface between the outer hollow spheres and the composite material, increasing the composite material's interfacial friction energy dissipation effect and improving the composite material's vibration reduction performance. This provides a practical and effective solution for vibration reduction control in high-end precision instruments, maintaining the original lightweight and high-strength characteristics of the structure while increasing its damping and vibration reduction performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0027] Figure 1 This is a microscopic morphology of the double-layer hollow carbon sphere (C@C) of the present invention.
[0028] Figure 2 This is a diagram of the damping performance of the double-layer hollow carbon sphere (C@C) filled with IN2 epoxy flow-guiding resin and pure IN2 epoxy flow-guiding resin. DETAILED DESCRIPTION
[0029] The following embodiments are further described in conjunction with the accompanying drawings and examples. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention.
[0030] like Figure 1-2 As shown, the present invention provides a friction damping and vibration reduction material with a double-layer hollow structure, and the specific preparation steps are shown in the following Example 1;
[0031] Example 1
[0032] S1. Preparation of SiO2@CP@SiO2@CP:
[0033] 70 mL of anhydrous ethanol, 3 mL of ammonia water, and 10 mL of deionized water were sealed and stirred in a glass beaker for 15 minutes to obtain an alkaline ethanol / water mixed solution. 2.8 mL of tetrabutyl silicate, 0.4 g of resorcinol, and 0.56 mL of formaldehyde were then added to the above solution in sequence. The mixture was sealed and stirred for another 6 hours to obtain a SiO2@CP solution with a silicon dioxide core and a carbide shell.
[0034] Then, 1.5 mL of tetrabutyl silicate was added to the solution for a second time and stirring was continued for 24 h. Subsequently, the solution was added to the reactor and reacted at 180 °C for 12 h. Finally, it was repeatedly washed with anhydrous ethanol solution and deionized water for 5 times and dried to obtain SiO2@CP@SiO2@CP.
[0035] S2. Preparation of C@C:
[0036] The SiO2@CP@SiO2@CP obtained in step S1 was placed in a tube furnace and carbonized in nitrogen for 3 h at a carbonization temperature of 700°C to obtain SiO2@C@SiO2@C;
[0037] Then, SiO2@C@SiO2@C was placed in 60 mL of a 40 wt% hydrofluoric acid solution and allowed to stand for etching for 6 h. It was then ultrasonically etched for 2 h in an ultrasonic machine with a power of 180 W.
[0038] Finally, the microspheres were washed three times with deionized water to obtain C@C with a size of about 500 nm. Figure 1 As shown;
[0039] S3. Preparation of a composite material having a double-layer hollow sphere structure:
[0040] Prepare 60 mL of a 7.5 wt% silane solution, add the C@C prepared in step S2 to the 7.5 wt% silane solution, use KH-560 silane coupling agent, stir at room temperature for 5 h, and then wash with deionized water three times to obtain silanized C@C;
[0041] The silanized C@C was dispersed in 30 mL of acetone and stirred for 15 min to disperse uniformly, thereby obtaining a C@C acetone solution with a concentration of 15 wt%.
[0042] Next, 26 mL of the acetone solution containing C@C was taken and added with 100 g of epoxy resin. The mixture was stirred for 15 minutes and then dried under vacuum at 90°C for 12 hours to completely evaporate the acetone. Finally, 30 g of curing agent was added to form a composite resin material with the epoxy resin. The mixture was stirred for another 15 minutes to ensure that the epoxy resin and curing agent were evenly mixed. The curing agent model was AT30. The composite resin material formed was IN2 epoxy flow-guiding resin.
[0043] The IN2 epoxy flow-infusion resin in this embodiment is a pure resin composite material. Fiber materials such as carbon fiber, glass fiber, and aramid fiber can be added to the pure resin composite material to form a fiber-reinforced resin-based composite material. The C@C in this application can also be added to form a friction damping and vibration reduction material.
[0044] Finally, IN2 epoxy flow-infusion resin mixed with C@C was poured into the mold and cured in a drying oven at 60°C. The amount of C@C added was 3wt%, and a friction damping and vibration reduction material with a double-layer hollow structure was finally obtained.
[0045] In the present invention, the epoxy resin and curing agent used are both commercially available low-viscosity slow-curing epoxy resins.
[0046] Figure 2 The damping coefficient of pure epoxy resin is 0.9, and the damping coefficient of epoxy resin composite material with double-layer hollow carbon spheres (C@C) is 0.96.
[0047] The friction damping and vibration reduction material with a double-layer hollow structure prepared by the above-mentioned preparation method has a double-layer hollow structure; the size is at the micro-nano level; the main component of the double-layer hollow structure is carbon; there is a gap between the inner layer and the outer layer of the double-layer hollow structure; the double-layer hollow structure is filled and dispersed in the resin to improve the damping and vibration reduction performance of the composite material.
[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A method for preparing a friction damping and vibration reduction material with a double-layer hollow structure, characterized in that: The preparation method specifically comprises the following steps: S1. Preparation of solid double-layer silica spheres: Anhydrous ethanol, ammonia water and deionized water were mixed and stirred in a glass beaker for 15 minutes to obtain an alkaline ethanol / water mixed solution, and then tetrabutyl silicate, resorcinol and formaldehyde were quickly added to the above solution in sequence, and the mixture was sealed and stirred for a period of time to obtain a microsphere solution with silicon dioxide as the core and carbide as the shell. Then, tetrabutyl silicate was added to the solution a second time, and the mixture was stirred for a period of time. The solution was then added to a reactor to react for a period of time, and finally, the mixture was repeatedly washed with ethanol solution and deionized water and dried to obtain solid double-layer silica spheres. S2. Preparation of double-layer hollow carbon spheres: The solid double-layer silica spheres obtained in step S1 are carbonized in an inert gas to obtain carbonized solid double-layer silica spheres, and then SiO2 is etched with hydrofluoric acid to obtain a double-layer hollow carbon sphere solution, and finally washed with deionized water and dried to obtain double-layer hollow carbon spheres; S3. Preparation of a composite material having a double-layer hollow sphere structure: The double-layer hollow carbon spheres prepared in step S2 are reacted with a silane coupling agent solution, and then vacuum filtered and dried. The double-layer hollow carbon spheres are then dispersed in an organic solution. Finally, the organic solution of the double-layer hollow carbon spheres is mixed and stirred with a composite material resin, and allowed to stand and dry to obtain a friction damping and vibration reduction material having a double-layer hollow structure. The composite material resin in step S3 is a pure resin composite material or a fiber-reinforced resin-based composite material.
2. The method for preparing the friction damping and vibration reduction material with a double-layer hollow structure according to claim 1, characterized in that: In step S1, the volume ratio of formaldehyde, tetrabutyl silicate, deionized water, ammonia water and anhydrous ethanol is 1:(3-7):(11-26):(3-8):(83-187), and the mass ratio of resorcinol to deionized water in step S1 is 1:(20-35).
3. The method for preparing the friction damping and vibration reduction material with a double-layer hollow structure according to claim 1, characterized in that: In step S1, after adding tetrabutyl silicate, resorcinol and formaldehyde to the solution, the stirring time is sealed for 6-10 hours. In step S1, tetrabutyl silicate is added for the second time and the stirring time is continued for 24-30 hours. In step S1, the solution is reacted in the reactor for 12-24 hours, and the reaction temperature is 180°C.
4. The method for preparing a friction damping and vibration reduction material having a double-layer hollow structure according to claim 1, characterized in that: In step S2, the inert gas is nitrogen or argon, and the carbonization temperature is 500-700°C.
5. The method for preparing the friction damping and vibration reduction material with a double-layer hollow structure according to claim 1, characterized in that: The step of etching SiO2 with hydrofluoric acid in step S2 is as follows: The carbonized solid double-layer silica spheres were first statically etched for 6 h and then ultrasonically etched for 2 h.
6. The method for preparing the friction damping and vibration reduction material with a double-layer hollow structure according to claim 1, characterized in that: The organic solution for dispersing the double-layer hollow carbon spheres in step S3 is ethanol or acetone solution.
7. A friction damping and vibration reduction material with a double-layer hollow structure, characterized in that: It is prepared according to the preparation method of the friction damping and vibration reduction material with a double-layer hollow structure according to any one of claims 1-6.
8. The friction damping and vibration reduction material prepared by the method for preparing a friction damping and vibration reduction material with a double-layer hollow structure according to any one of claims 1 to 6 or the friction damping and vibration reduction material according to claim 7, characterized in that: The friction damping vibration reduction material is used in industrial vibration reduction materials.
Citation Information
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