A package structure and an electric energy converter

Abstract

The application discloses a packaging structure and an electric energy converter. The packaging structure comprises a printed circuit board, and the printed circuit board comprises a heat generating unit. Heat generating devices in a first part are densely arranged to form a middle region, and heat generating devices in a second part are distributed around the middle region to form a surrounding region. The distance between any heat generating device in the second part and any heat generating device in the first part is greater than or equal to the distance between any two heat generating devices in the first part. The heat generating devices in the second part and the outer edge of the middle region have a plurality of air ducts for air flow. The packaging structure further comprises a fan, and the central axis of the fan is aligned with the center of the middle region along a first direction. The air of the fan blows towards the middle region and is divided along the outer edge of the middle region to the outer walls of the remaining heat generating devices. The first direction is perpendicular to the plane where the middle region is located, so that the heat of the heat generating devices and the printed circuit board can be taken away, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a packaging structure and a power converter. Background Technology

[0002] With the miniaturization, high density, and high speed of electronic products, the integration of printed circuit boards (PCBs) is becoming increasingly sophisticated. Numerous heat-generating components can be arranged on a single PCB. In order to ensure the long-term stable operation of the product, it is necessary to improve the product's heat dissipation performance.

[0003] In related technologies, heat-generating components are densely packed on a PCB board, with a fan blowing air directly onto them. When the air blows onto the heat-generating components, the dense packing prevents the formation of an airflow channel to dissipate heat from both the components and the PCB board, resulting in low heat dissipation efficiency. Summary of the Invention

[0004] This application provides a packaging structure and a power converter that can dissipate heat from heat-generating devices and printed circuit boards, thereby improving heat dissipation efficiency.

[0005] The first aspect of this application provides a packaging structure including a printed circuit board, the printed circuit board including a heating unit; heating devices in a first part are densely arranged to form an intermediate region, and heating devices in a second part are distributed around the intermediate region to form a surrounding region; the distance between any heating device in the second part and any heating device in the first part is greater than or equal to the distance between any two heating devices in the first part; the heating devices in the second part and the outer edge of the intermediate region have multiple air ducts for airflow; the packaging structure also includes a fan, the central axis of the fan is aligned with the center of the intermediate region along a first direction; the air from the fan blows towards the intermediate region and is diverted along the outer edge of the intermediate region to the outer wall of the remaining heating devices; the first direction is perpendicular to the plane where the intermediate region is located.

[0006] In this way, by constructing a central area on the printed circuit board and adjusting the position of the remaining heat-generating devices to form a surrounding area, multiple air ducts are formed between the central area and the outer edge of the central area for airflow. Therefore, when the fan blows air towards the central area, it will be diverted along the outer edge of the central area to the outer wall of the remaining heat-generating devices, thereby removing the heat from the heat-generating devices and the printed circuit board and improving heat dissipation efficiency.

[0007] In some embodiments, when the intermediate region includes multiple heating devices, the size of the fan's outlet surface is larger than the area of ​​the closed region formed by the multiple heating devices.

[0008] In this way, the air blown by the fan can completely cover the middle area, allowing the air to be diverted to the other heat-generating components, thus better dissipating heat from the heat-generating components and printed circuit boards.

[0009] In some embodiments, there are at least two heating devices in the surrounding area with a distance greater than or equal to a preset value to form at least one air outlet; the air outlet allows air to flow from the inside of the heating unit to the outside of the heating unit; other adjacent heating devices in the surrounding area are closely arranged.

[0010] In this way, by setting up air outlets, heat exchange can occur between the inside and outside of the heating unit, and hot air can be discharged, thus improving heat dissipation efficiency.

[0011] In some embodiments, the width of the air duct is negatively correlated with the number of heating devices along the air duct path; if the surrounding area has corners, the width of the air duct between the corners of the surrounding area and the middle area is smaller than the width of the air duct between the remaining positions of the surrounding area and the middle area.

[0012] In this way, the wind speed is slower at the corners and faster at other locations. The wind energy flows over the surface of each heat-generating device, carrying away the heat from the device and improving heat dissipation efficiency.

[0013] In some embodiments, the heating element at the corner of the surrounding area is also used to form an air outlet.

[0014] This allows for the arrangement of more heat-generating components and also helps to dissipate the heat from the heat-generating components and the printed circuit board.

[0015] In some embodiments, at least a portion of the heating element is located at the edge of the printed circuit board; the interior of the heating unit also has a plurality of mounting holes for fixing the printed circuit board; the mounting holes are distributed between the central region and the surrounding region and / or inside the central region.

[0016] In this way, while forming air ducts in the printed circuit board, the requirements for mounting holes can be met, the layout of the printed circuit board can be better arranged, and the area of ​​the printed circuit board can be saved.

[0017] In some embodiments, the printed circuit board includes multiple heating units arranged adjacent to each other; the packaging structure includes multiple fans, which correspond to the multiple heating units, and the air from each fan blows towards the middle area of ​​the corresponding heating unit; when the number of fans is less than the number of heating units, for multiple adjacent heating units, heating units without fans are distributed between two heating units with fans, and the middle areas of the heating units on both sides and the middle area of ​​the heating unit in the middle have a direct airflow channel, so that the air from the fans on both sides reaches the middle area of ​​the heating unit in the middle directly without passing through any heating device.

[0018] In this way, the air from the fans on both sides can reach the middle area of ​​the heating unit directly without being blocked by any heating device, ensuring the continuity of the direct airflow, making the airflow smoother and improving the heat dissipation efficiency.

[0019] In some embodiments, in a heating unit without a fan, air flows from the inside of the heating unit to the outside of the heating unit along a first direction.

[0020] In this way, no air outlet is needed in the heating unit without a fan, so that the two rows of heating units arranged along the second direction can be densely packed, thereby saving the area of ​​the printed circuit board.

[0021] In some embodiments, the width of the heating unit along the second direction is smaller than the width along the third direction; the plane containing the second direction and the third direction is the plane containing the middle region; on both sides of the surrounding region along the second direction, multiple heating devices are closely arranged along the third direction to form two long edges extending along the third direction; on both sides of the surrounding region along the third direction, multiple heating devices are loosely arranged along the second direction to form two short edges extending along the second direction; the spacing between two heating devices in the long edge is smaller than the spacing between two heating devices in the short edge to reduce air leakage outward along the second direction and allow air leakage outward along the third direction.

[0022] In this way, the heating elements along the long edges of the printed circuit board are closely arranged, which can confine the lateral airflow within the area of ​​the heating elements and prevent air leakage.

[0023] In some embodiments, the cross-sectional shape of the heating device is at least one or more of the following: circle, ellipse, and arc.

[0024] In this way, there are no dead zones for airflow to the heating elements, and the air can flow smoothly through each heating element, thereby removing heat from the heating elements and improving heat dissipation efficiency.

[0025] A second aspect of this application also provides a power converter comprising the packaging structure as described in any one of the first aspects; the power converter is at least used to convert DC power into AC power, or AC power into DC power.

[0026] Thus, since the power converter includes the aforementioned packaging structure, it has at least the same advantages as the aforementioned packaging structure. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a packaging structure.

[0028] Figure 2 This is a schematic diagram of a packaging structure provided in an embodiment of this application. Figure 1.

[0029] Figure 3 This is a schematic diagram of a packaging structure provided in an embodiment of this application. Figure 2 .

[0030] Figure 4 This is a schematic diagram of a packaging structure provided in an embodiment of this application. Figure 3 .

[0031] Figure 5 This is a schematic diagram of a packaging structure provided in an embodiment of this application. Figure 4 .

[0032] Figure 6 This is a schematic diagram of a packaging structure provided in an embodiment of this application. Figure 5 .

[0033] Figure 7 This is a schematic diagram of the structure of a power converter provided in an embodiment of this application. Detailed Implementation

[0034] The following detailed description, with appropriate reference to the accompanying drawings, discloses a specific embodiment of the packaging structure and power converter of this application. However, unnecessary detailed descriptions may be omitted. For example, detailed descriptions of well-known matters and repetitive descriptions of practically identical structures may be omitted. This is to avoid unnecessarily lengthy descriptions and to facilitate understanding by those skilled in the art. Furthermore, the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand this application and are not intended to limit the subject matter of the claims.

[0035] The "range" disclosed in this application is defined by a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, which define the boundaries of a particular range. Ranges defined in this way can include or exclude endpoints and can be arbitrarily combined; that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60-120 and 80-110 are listed for a specific parameter, it is expected that ranges of 60-110 and 80-120 are also included. Furthermore, if minimum range values ​​of 1 and 2 are listed, and if maximum range values ​​of 3, 4, and 5 are listed, then the following ranges are all expected: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5. In this application, unless otherwise stated, the numerical range "ab" represents a shortened representation of any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0-5" indicates that all real numbers between "0-5" have been listed in this article; "0-5" is simply a shortened representation of these numerical combinations. Furthermore, when a parameter is stated as an integer ≥2, it is equivalent to disclosing that the parameter is, for example, an integer such as 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0036] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions.

[0037] Unless otherwise specified, all technical features and optional technical features of this application may be combined to form new technical solutions.

[0038] Unless otherwise specified, the terms used in this application have the common meanings as commonly understood by those skilled in the art.

[0039] Unless otherwise specified, the values ​​of the parameters mentioned in this application can be determined using various testing methods commonly used in the art, for example, according to the testing methods given in this application.

[0040] It should be noted that the terms "first, second, third" used in the embodiments of this disclosure are merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of this disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0041] Before introducing the embodiments of this disclosure, we first define three directions that may be used in the plane to describe the three-dimensional structure in the following embodiments. Taking the Cartesian coordinate system as an example, the three directions may include a first direction, a second direction, and a third direction.

[0042] In related technologies, heat-generating components on a PCB board are closely arranged, and a fan blows air directly onto these components; specifically, the heat-generating components can be capacitors. Please see [link to relevant documentation]. Figure 1 It provides a schematic diagram of a packaging structure. For example... Figure 1 As shown, the package structure includes 10, a PCB board 11, and a baffle fan 12. Figure 1 (Not shown in the image), the PCB board 11 includes a plurality of capacitors 111 arranged in a dense array, and a plurality of mounting holes 112 located at the edge of the PCB board 11, the mounting holes 112 being used to fix the PCB board 11. For example, as shown... Figure 1 As shown, multiple capacitors 111 are arranged in an array along the second direction and the third direction, respectively, and multiple mounting holes 112 are located on one edge along the second direction.

[0043] Here, Figure 1 The number and specific arrangement of the capacitors 111 and mounting holes 112 are only examples. The multiple capacitors 111 may not be arranged in an array along the second and third directions. The number of capacitors 111 can also be increased or decreased according to actual needs, but the multiple capacitors 111 are densely packed. The mounting holes 112 can be set on the edges on both sides along the second direction. The number of mounting holes 112 can also be increased or decreased according to actual needs, but the multiple mounting holes 112 are located on the edge of the PCB board 11.

[0044] It should be noted that the first direction is perpendicular to the plane where the PCB board 11 is located, while the second and third directions are located on the plane where the PCB board 11 is located, and the second and third directions intersect each other (e.g., are perpendicular).

[0045] When the turbulence fan 12 of the power compartment blows air directly onto the capacitor 111 along the first direction, the capacitors 111 are arranged too closely to form an airflow channel to dissipate heat from the capacitors 111 and the copper foil on the PCB board 11. As a result, some of the heat from the capacitors 111 cannot be carried away, resulting in low heat dissipation efficiency. Consequently, the heat from the capacitors 111 becomes too high, affecting the performance of the PCB board 11.

[0046] Based on this, this application provides a packaging structure including a printed circuit board (PCB) with heating elements. Heating elements in a first portion are densely packed to form a central region, while heating elements in a second portion are distributed around the central region to form a surrounding region. The distance between any heating element in the second portion and any heating element in the first portion is greater than or equal to the distance between any two heating elements in the first portion. Multiple air ducts for airflow are provided between the heating elements in the second portion and the outer edge of the central region. The packaging structure also includes a fan, whose central axis is aligned with the center of the central region along a first direction. Airflow from the fan is directed towards the central region and diverted along the outer edge of the central region to the outer walls of the remaining heating elements. The first direction is perpendicular to the plane containing the central region. Thus, by constructing a central region on the PCB and adjusting the positions of the remaining heating elements to form a surrounding region, multiple air ducts for airflow are formed between the central region and the outer edge of the central region. Therefore, when airflow from the fan is directed towards the central region, it is diverted along the outer edge of the central region to the outer walls of the remaining heating elements, thereby removing heat from the heating elements and the PCB and improving heat dissipation efficiency.

[0047] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0048] In one embodiment of this application, please refer to Figure 2 It shows a schematic diagram of a packaging structure provided in an embodiment of this application. Figure 1 .like Figure 2 As shown, the packaging structure 20 includes a printed circuit board 21, and the printed circuit board 21 includes a heating unit.

[0049] The heating elements in the first part are densely packed to form a central region 211, and the heating elements in the second part are distributed around the central region 211 to form a surrounding region 212; the distance between any heating element in the second part and any heating element in the first part is greater than or equal to the distance between any two heating elements in the first part.

[0050] The second part has multiple air ducts between the heating element and the outer edge of the middle region 211 for airflow.

[0051] The packaging structure 20 also includes a fan 22 (not shown in the figure), the central axis of the fan 22 is aligned with the center of the intermediate region 211 along a first direction; the air blown by the fan 22 is directed toward the intermediate region 211 and diverted along the outer edge of the intermediate region 211 to the outer wall of the remaining heat-generating devices; the first direction is perpendicular to the plane in which the intermediate region 211 is located.

[0052] It should be noted that the first direction is perpendicular to the plane containing the intermediate region 211, that is, the first direction is perpendicular to the surface of the printed circuit board 21. On the surface of the printed circuit board 21, two intersecting (e.g., perpendicular) directions are defined, namely the second direction and the third direction.

[0053] It should also be noted that, such as Figure 2 As shown, the printed circuit board 21 includes multiple heating devices, denoted by 'a'. Specifically, 'a-1' represents the heating devices in the first part, and 'a-2' represents the heating devices in the second part. The area formed by the multiple heating devices a-1 is the intermediate region 211. The area formed by all the heating devices in the heating unit, excluding heating devices a-1, outside the intermediate region 211 and within the heating unit is the surrounding region 212. 'b' represents the heating unit. For example, the printed circuit board 21 includes only one heating unit. In this heating unit, the intermediate region 211 includes four heating devices a-1, and the surrounding region 212 includes twelve heating devices a-2.

[0054] Here, the heating device a-1 in the first part and the heating device a-2 in the second part can be the same heating device or different heating devices; there is no specific limitation in this regard. For example, as... Figure 2 As shown, heating device a-1 and heating device a-2 are the same.

[0055] Furthermore, such as Figure 2 As shown, arrows indicate the air ducts through which airflow passes. The central region 211 connects the various air ducts, allowing the air from the fan 22 to be diverted along the outer edge of the central region 211 to the outer walls of the remaining heating elements after being blown into it. Furthermore, the distance between any heating element in the second part and any heating element in the first part is greater than or equal to the distance between any two heating elements in the first part. In other words, the heating elements in the central region 211 are closely arranged, while the heating elements in the surrounding region 212 are loosely arranged compared to those in the central region 211.

[0056] It should also be noted that fan 22 can be a turbulence fan, but this is not specifically limited. A turbulence fan is a technology that uses resistance and disturbance to improve the efficiency of gas conveying and save energy. Its main principle is to change the gas flow field characteristics, so that the gas maintains a high speed during the conveying process and recovers as much energy as possible after the gas is sent out by the fan. The working principle of a turbulence fan is that various forms of disturbance structures such as baffles, honeycomb packing, or spiral bodies are installed inside the fan, which can prevent gas flow, change the flow field characteristics, and thus improve working efficiency.

[0057] The central axis of the fan 22 is aligned with the center of the intermediate region 211 along a first direction. That is, the fan 22 blows air directly onto the intermediate region 211 along the first direction, and the airflow from the fan 22 is specifically directed towards the center of the intermediate region 211 (e.g., ...). Figure 2 (The center of the rhombus in the middle region 211), at this time there is no wind in the center of the middle region 211.

[0058] In summary, please refer to Figure 1 In related technologies, the PCB board 11 includes a plurality of capacitors 111 arranged in a dense array. When the turbulence fan 12 blows air directly onto the capacitors 111 along the first direction, it is impossible to form an air duct to dissipate heat from the capacitors 111 and the copper foil on the PCB board 11, resulting in low heat dissipation efficiency.

[0059] In contrast, please see Figure 2 By improving the layout of the printed circuit board 21, a central region 211 is constructed, which includes densely packed heat-generating devices. The positions of the remaining heat-generating devices are adjusted to form a surrounding region 212, which forms multiple air ducts between the central region 211 and the outer edge of the central region 211 for airflow. Therefore, when the air from the fan 22 blows towards the central region 211, it will be diverted along the outer edge of the central region 211 to the outer wall of the remaining heat-generating devices, thereby removing the heat from the heat-generating devices and the printed circuit board and improving heat dissipation efficiency.

[0060] In some embodiments, when the intermediate region 211 includes multiple heating devices, the air outlet surface size of the fan 22 is larger than the area of ​​the closed region formed by the multiple heating devices.

[0061] In other words, the outlet surface size of the fan 22 is related to the area of ​​the closed region formed by multiple heating elements. When each heating element has the same cross-sectional area, the outlet surface size of the fan 22 can be considered to be related to the number of heating elements. For example, as... Figure 2 As shown, the central region 211 includes four heating elements; Figure 2 Based on the printed circuit board 21 shown, see Figure 3 The central area 211 includes six heating elements. Figure 3 The area of ​​the closed region formed by the six heating elements is greater than Figure 2 The area of ​​the closed region formed by the four heating elements, therefore Figure 3 The required air outlet size of fan 22 needs to be larger than Figure 2 The required air outlet size of fan 22.

[0062] In this way, when the air outlet size of the fan 22 is larger than the area of ​​the closed region formed by multiple heat-generating devices, the air blown by the fan 22 can completely cover the middle region 211, allowing the air to be diverted to the remaining heat-generating devices, thus better dissipating heat from the heat-generating devices and the printed circuit board 21.

[0063] In some embodiments, there are at least two heating devices in the surrounding area 212 with a distance greater than or equal to a preset value to form at least one air outlet; the air outlet allows air to flow from the inside of the heating unit to the outside of the heating unit; other adjacent heating devices in the surrounding area 212 are closely arranged.

[0064] It should be noted that there is no limit to the specific value of the preset value. It can be set according to actual needs so that the heating unit can dissipate heat through the air outlet.

[0065] For example, such as Figure 2 As shown, the printed circuit board 21 includes two air outlets, the positions of which are schematically indicated by dashed ellipses; Figure 2 Based on the printed circuit board 21 shown, see Figure 4 ,turn out to be Figure 2 A heating element is also installed at one of the air outlets. The printed circuit board 21 includes only one air outlet (represented by a dashed ellipse), so that the number of air outlets can be selected according to actual needs.

[0066] In this way, by setting up air outlets, heat exchange can occur between the inside and outside of the heating unit, and hot air can be discharged, thus improving heat dissipation efficiency.

[0067] In some embodiments, such as Figure 2 As shown, the width of the air duct is negatively correlated with the number of heat-generating devices along the air duct path;

[0068] If the surrounding area 212 has corners, the width of the air duct between the corners of the surrounding area 212 and the middle area 211 is less than the width of the air duct between the remaining positions of the surrounding area 212 and the middle area 211.

[0069] For example, see Figure 2 The surrounding area 212 has corners, each corner containing three heating elements, while the remaining areas of the surrounding area 212 contain two heating elements. Because there are more heating elements at the corners and fewer at the other locations, the width of the air duct between the corners of the surrounding area 212 and the central area 211 needs to be smaller than the width of the air duct between the remaining areas of the surrounding area 212 and the central area 211. This ensures that the airflow is slower at the corners and faster at the other locations, allowing the airflow to pass over the surface of each heating element, carrying away its heat and improving heat dissipation efficiency.

[0070] In some embodiments, Figure 2 Based on the printed circuit board 21 shown, see Figure 5 The heating elements at the corners of the surrounding area 212 are also used to form air outlets.

[0071] like Figure 2 As shown, the printed circuit board 21 has two air outlets; as Figure 4 As shown, the printed circuit board 21 is provided with an air outlet; furthermore, Figure 2 Heating elements are installed at both air outlets, or... Figure 4 The remaining air outlet is also equipped with a heating element. Therefore, there is no need to set up an additional air outlet in the printed circuit board 21. The air duct at the corner of the surrounding area 212 can be used as the air outlet. In this way, more heating elements can be arranged, and the heat of the heating elements and the printed circuit board can be removed.

[0072] In some embodiments, such as Figure 2 As shown, at least some of the heat-generating devices are located at the edge of the printed circuit board 21;

[0073] The heating unit also has multiple mounting holes 213 inside, which are used to fix the printed circuit board 21; the mounting holes 213 are distributed between the middle region 211 and the surrounding region 212 and / or inside the middle region 211.

[0074] For example, such as Figure 2 As shown, mounting holes 213 are distributed between the central region 211 and the surrounding region 212; in addition, mounting holes 213 can also be distributed inside the central region 211, specifically at the center of the central region 211.

[0075] It should be noted that, due to safety regulations, the area around mounting hole 213 needs to be kept at a certain distance from heat-generating devices; these safety regulations are various rules, regulations and standards established to ensure personal safety and the safe operation of equipment.

[0076] In summary, please refer to Figure 1 In related technologies, mounting holes 112 are located at the edge of the PCB board 11, and capacitors 111 are centrally located. In contrast, as... Figure 2 As shown, the mounting holes originally located at the edge of the PCB board are moved to the area where the heat-generating devices are distributed, and some of the heat-generating devices that were originally concentrated are moved to the edge of the PCB board. Each heat-generating device forms a certain airflow channel around each mounting hole 213. In this way, while forming airflow channels in the printed circuit board 21, the requirements for mounting hole settings can be met, and the layout of the printed circuit board 21 can be better, saving the area of ​​the printed circuit board 21.

[0077] In some embodiments, Figure 2 Based on the printed circuit board 21 shown, see Figure 6The printed circuit board 21 includes multiple heating units arranged adjacent to each other; the package structure 20 includes multiple fans 22 (not shown in the figure), and the multiple fans 22 correspond to the multiple heating units. The air from each fan 22 blows towards the middle area 211 in the corresponding heating unit.

[0078] When the number of fans 22 is less than the number of heating units, for multiple adjacent heating units, the heating units without fans 22 are distributed between two heating units with fans 22, and the middle area 211 of the heating units on both sides and the middle area 211 of the heating unit in the middle have a direct air duct, so that the air from the fans 22 on both sides can directly reach the middle area 211 of the heating unit in the middle without passing through any heating device.

[0079] For example, such as Figure 6 As shown, the printed circuit board 21 includes three heating units, denoted by b-1, b-2, and b-3. Heating unit b-2 represents a heating unit without a fan 22, while heating units b-1 and b-3 represent heating units with fans 22. Heating unit b-2 shares the fans 22 of heating units b-1 and b-3. Additionally, dashed arrows indicate direct airflow.

[0080] It should be noted that, see Figure 6 Along the third direction, heating units b-1, b-2 and b-3 are arranged adjacent to each other in a straight line, but no specific limitation is made on this.

[0081] It should also be noted that heating unit b-2 shares a portion of the heating elements in the surrounding area 212 with heating units b-1 and b-3, respectively. Specifically, along the third direction, heating unit b-2 shares four heating elements with heating unit b-1 near its edge, and heating unit b-2 shares four heating elements with heating unit b-3 near its edge. However, multiple heating units can also be set independently, meaning each heating unit has... Figure 2 The structures shown do not share heating elements when arranged adjacently, and no specific limitations are made in this regard.

[0082] In this way, the air from the fans 22 on both sides can reach the middle area 211 of the middle heating unit directly without passing through any heating device, ensuring the continuity of the direct airflow, making the airflow smoother and improving the heat dissipation efficiency.

[0083] Heating units b-1 and b-3 obtain air through their respective fans 22, while heating unit b-2 obtains air from the fans 22 on both sides through a direct air duct. In addition, heating units b-1 and b-3 can dissipate heat through air outlets and / or air outlets formed by heating devices at the corners, while heating unit b-2 can dissipate heat through various means.

[0084] Specifically, in some embodiments, in a heating unit without a fan 22, air flows from the inside of the heating unit to the outside of the heating unit along a first direction.

[0085] like Figure 6 As shown, the heating units (i.e., heating units b-1 and b-3) with fans 22 on both sides have air outlets at their edges along the third direction. When the air from the fans 22 on both sides enters the heating unit (i.e., heating unit b-2) without fans 22 through the direct air duct, the hot air generated by the heat dissipation in the heating unit without fans 22 can float upward along the first direction for heat exchange. Thus, the heating unit without fans 22 does not need to be provided with an air outlet, so that the two rows of heating units arranged along the second direction can be densely packed, thereby saving the area of ​​the printed circuit board 21.

[0086] In some embodiments, in a heating unit without a fan 22, at least one air outlet is provided on both sides of the surrounding area 212 along the second direction, allowing air to escape from the inside to the outside of the heating unit. This further improves heat dissipation efficiency.

[0087] In some embodiments, such as Figure 6 As shown, the width of the heating unit along the second direction is smaller than the width along the third direction; the plane containing the second direction and the third direction is the plane containing the middle region 211;

[0088] On both sides of the surrounding area 212 along the second direction, multiple heating devices are closely arranged along the third direction to form two long edges extending along the third direction;

[0089] In the surrounding area 212, multiple heating elements are loosely arranged along the second direction on both sides of the third direction to form two short edges extending along the second direction.

[0090] The spacing between two heating elements in the long edge is smaller than the spacing between two heating elements in the short edge, so as to reduce the outward flow of air along the second direction and allow the outward flow of air along the third direction.

[0091] In other words, the two opposite edges of the printed circuit board 21 along the second direction are the long edges, and the two opposite edges of the printed circuit board 21 along the third direction are the short edges. In this way, the heating devices on the long edges of the printed circuit board 21 are closely arranged, which can confine the lateral airflow within the area of ​​the heating devices and prevent air leakage.

[0092] In some embodiments, the cross-sectional shape of the heating element is at least one or more of the following: circle, ellipse, and arc. This eliminates airflow dead zones, allowing air to flow smoothly through each heating element, thereby removing heat and improving heat dissipation efficiency.

[0093] For example, such as Figures 2 to 6 As shown, the cross-sectional shape of the heating device is circular.

[0094] In some embodiments, the heat-generating device is at least one or more of the following: capacitor, inductor, transistor, transformer;

[0095] In some embodiments, a plurality of heating units are arranged along a preset pattern; the preset pattern includes one or more of the following: straight line, rectangle, circle, S-shape, triangle.

[0096] In summary, this application provides a printed circuit board 21, where the heating device is specifically a capacitor, compared to... Figure 1 The printed circuit boards 11 and 21 shown can form airflow channels within the capacitor array, thereby improving the capacitor heat dissipation efficiency. Specific details are as follows:

[0097] (1) Move the mounting holes that were originally located at the edge of the PCB board to the capacitor area, and move some of the capacitors in the originally concentrated capacitor array to the edge of the PCB board.

[0098] (2) Adjust the position of other capacitors so that each capacitor forms a certain current flow gap (i.e. air duct) around each mounting hole; in addition, the area around the mounting hole itself needs to be a certain distance from the capacitor due to safety regulations.

[0099] (3) Construct several airflow center regions (i.e., the middle region) located in the capacitor array. Several capacitors are set in the airflow center region and face the fan. The airflow center region is positioned to connect each flow gap, so that the airflow from the fan can be diverted to other capacitors along each flow gap after it reaches the airflow center region, so as to dissipate heat for each capacitor and the copper foil of the PCB board.

[0100] (4) The capacitors in the edge area of ​​the PCB board (i.e. the two long edges extending along the third direction) are closely arranged to contain the lateral airflow within the capacitor area and prevent air leakage.

[0101] In another embodiment of this application, please refer to Figure 7This illustrates a schematic diagram of the structure of a power converter provided in an embodiment of this application. Figure 7 As shown, the power converter 30 includes the aforementioned packaging structure 20;

[0102] The power converter 30 is used at least to convert DC power into AC power, or AC power into DC power.

[0103] It should be noted that the power converter 30 may include an inverter, a converter, and a rectifier. The inverter can convert DC power into AC power; the rectifier can convert AC power into DC power; and the converter can convert fixed-frequency AC power into adjustable-frequency AC power, or it can convert DC power into AC power.

[0104] The power converter 30, since it includes the aforementioned package structure 20, has at least the same advantages as the package structure 20, which can remove heat from the heat-generating devices and printed circuit boards, thereby improving heat dissipation efficiency.

[0105] It should be noted that this application is not limited to the above-described embodiments. The above embodiments are merely examples, and any embodiments with the same structure and effect as the technical concept within the scope of this application are included in the technical scope of this application. Furthermore, various modifications that can be conceived by those skilled in the art to the embodiments, and other ways of constructing by combining some of the constituent elements of the embodiments, without departing from the spirit of this application, are also included in the scope of this application.

Claims

1. A packaging structure, characterized in that, The packaging structure includes a printed circuit board, the printed circuit board includes a heating unit, and the heating unit includes multiple heating devices. The heating elements in the first part are densely packed to form a central region, and the heating elements in the second part are distributed around the central region to form a surrounding region; the distance between any heating element in the second part and any heating element in the first part is greater than or equal to the distance between any two heating elements in the first part. The second part has multiple air ducts between the heating device and the outer edge of the intermediate region for airflow. The encapsulation structure also includes a fan, the central axis of which is aligned with the center of the intermediate region along a first direction; the air blown by the fan is directed toward the intermediate region and diverted along the outer edge of the intermediate region to the outer wall of the remaining heating devices; the first direction is perpendicular to the plane in which the intermediate region is located. There are at least two heating devices in the surrounding area with a distance greater than or equal to a preset value to form at least one air outlet; the air outlet allows air to flow from the inside of the heating unit to the outside of the heating unit; Other adjacent heating devices in the surrounding area are closely arranged.

2. The packaging structure according to claim 1, characterized in that, When the intermediate region includes multiple heating devices, the size of the fan's outlet surface is larger than the area of ​​the closed region formed by the multiple heating devices.

3. The packaging structure according to claim 1, characterized in that, The width of the air duct is negatively correlated with the number of heating devices passing through the air duct; If the surrounding area has corners, the width of the air duct between the corners of the surrounding area and the middle area is less than the width of the air duct between the remaining positions of the surrounding area and the middle area.

4. The packaging structure according to claim 1, characterized in that, The heating element at the corner of the surrounding area is also used to form an air outlet.

5. The packaging structure according to claim 1, characterized in that, At least a portion of the heating element is located at the edge of the printed circuit board; The heating unit also has multiple mounting holes inside, which are used to fix the printed circuit board; the mounting holes are distributed between the central region and the surrounding region and / or inside the central region.

6. The packaging structure according to claim 1, characterized in that, The printed circuit board includes a plurality of heating units arranged adjacent to each other; the packaging structure includes a plurality of fans, each fan corresponding to a plurality of heating units, with each fan blowing air towards the central area of ​​the corresponding heating unit. When the number of fans is less than the number of heating units, for a plurality of adjacent heating units, the heating units without fans are distributed between two heating units with fans, and the middle area of ​​the heating units on both sides and the middle area of ​​the heating unit in the middle have a direct air duct, so that the air from the fans on both sides does not pass through any of the heating devices and directly reaches the middle area of ​​the heating unit in the middle.

7. The packaging structure according to claim 6, characterized in that, In the heating unit without the fan, air flows from the inside to the outside of the heating unit along the first direction.

8. The packaging structure according to claim 1, characterized in that, The cross-sectional shape of the heating device is at least one or more of the following: circle, ellipse, and arc.

9. A power converter, characterized in that, The power converter includes the packaging structure as described in any one of claims 1 to 8; The power converter is used at least to convert DC power into AC power, or AC power into DC power.

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