Semiconductor device vacuum welding automation equipment

Abstract

The invention discloses semiconductor device vacuum welding automation equipment, relates to the technical field of semiconductor device processing, and comprises a vacuum welding furnace, an upper cover, a preheating zone, a high-temperature reflow zone, a vacuum zone and a cooling zone, wherein the upper cover is rotatably connected to the top edge of the vacuum welding furnace; a plurality of fixed frames are arranged on the lower surface of the upper cover, and floating blocks are arranged inside the fixed frames corresponding to the positions of the cooling zones, and vents are arranged inside the floating blocks; the invention can adjust the distance between the vents and the semiconductor pins, and can also prevent wind from directly blowing on the semiconductors, thereby preventing defects in the semiconductors caused by too fast cooling speed or uneven cooling, and can realize the opening and closing of the backstop baffle, ensuring that cold air can be continuously and evenly transported to the inside of the vacuum welding furnace, and can change the air volume passing through the reserved slots, thereby preventing changes in the semiconductor pins caused by too much air volume.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor device processing, in particular to semiconductor device vacuum welding automation equipment. Background Art

[0002] Vacuum reflow soldering is an advanced electronic component surface mounting technology, which is widely used in the manufacture of semiconductor packaging, high-density interconnection boards and other high-performance electronic products. Vacuum reflow soldering is carried out in a vacuum environment, which can effectively eliminate bubbles and oxygen in the solder paste, thereby improving soldering quality and production efficiency.

[0003] The existing vacuum reflow soldering has certain drawbacks. The cooling zone of the semiconductor device reflow soldering is to allow the soldering area to cool quickly and solidify the solder to form a reliable solder joint. However, if the cooling speed is inconsistent during the cooling process, a temperature gradient may be generated between the PCB board and the semiconductor device, which may cause uneven stress between the devices, thereby affecting the performance and life of the device. If the cooling speed is too fast, or the cold air cannot be continuously and evenly delivered to the inside of the vacuum soldering furnace, it may cause solder joint quality problems, such as dark solder joints and rough solder joint surfaces. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor device vacuum welding automation equipment to solve the problems raised in the above background technology.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] Semiconductor device vacuum welding automation equipment, including a vacuum welding furnace, an upper cover, a preheating zone, a high-temperature reflow zone, a vacuum zone and a cooling zone, wherein the upper cover is rotatably connected to the top edge of the vacuum welding furnace, and the preheating zone, the high-temperature reflow zone, the vacuum zone and the cooling zone are arranged inside the vacuum welding furnace; a plurality of fixed frames are arranged on the lower surface of the upper cover, and a floating block is arranged inside the fixed frame corresponding to the position of the cooling zone, and a vent is arranged inside the floating block, and the vent is aligned with the surface of the cooling zone; a cooling wind direction adjustment structure is arranged on the lower surface of the fixed frame and the floating block, and the cooling wind direction adjustment structure includes four connecting rods, and the connecting rods are arranged at four corners of the fixed frame, and the bottom ends of the four connecting rods are connected to a first swing plate and a second swing plate, and a fixed shaft is arranged at the intersection of the first swing plate and the second swing plate, and the first swing plate and the second swing plate are rotatably connected, and connecting racks are arranged at both ends of the fixed shaft, and lifting grooves are opened on both sides of the bottom end of the floating block, and the connecting rack is located inside the lifting groove, and a driving structure is arranged inside both sides of the floating block, and the driving structure is meshed with the top of the connecting rack.

[0007] As a preferred technical solution of the present invention, the driving structure includes two groups of first gears and tooth grooves, the two groups of first gears are respectively arranged inside the two sides of the floating block, and the tooth grooves are opened on the inner wall of the fixed frame, the first gears are meshed with the tooth grooves and the connecting racks, the relative movement directions of the tooth grooves and the connecting racks are opposite, and a guide groove is opened on the mating surfaces of the fixed frame and the floating block.

[0008] As a preferred technical solution of the present invention, the connecting rod includes two connecting columns and an intermediate column, the two ends of the intermediate column are respectively rotatably connected to the two connecting columns, the top connecting column is fixed to the fixed frame, and the bottom connecting column is fixed to the first swing plate and the second swing plate.

[0009] As a preferred technical solution of the present invention, the surfaces of the first swing plate and the second swing plate are both provided with reserved grooves, and the reserved grooves of the first swing plate and the second swing plate are arranged in an eight-shaped shape, and the edges of the first swing plate and the second swing plate are both provided with edge plates, and the edge plates are arranged tilted upward.

[0010] As a preferred technical solution of the present invention, a check structure is provided inside the floating block and inside and on both sides of the vent, the check structure includes two groups of check baffles and arc-shaped racks, the check baffles and the arc-shaped racks are welded to each other, and the two check baffles are rotatably connected, a torsion spring is provided at the intersection of the two check baffles, and the two check baffles are opened and closed at the same time, a placement cavity is provided on both sides of the floating block, an intermediate rod is provided inside the placement cavity, a floating plate is rotatably installed in the middle of the two intermediate rods, a lifting plate is provided on the side wall connected to the rack and located below one end of the floating plate, a first connecting shaft and a second gear are provided on the other end of the floating plate and located on the side wall of the vent, the first connecting shaft and the second gear rotate synchronously, the other end of the floating plate contacts the upper end of the second gear, and the second gear meshes with the arc-shaped rack.

[0011] As a preferred technical solution of the present invention, a connecting sleeve, a floating rod and a telescopic spring are provided at both ends of the intermediate rod and inside the floating block. The connecting sleeve is rotatably connected to the intermediate rod, the telescopic spring sleeve is arranged on the outside of the floating rod, and the connecting sleeve moves in the horizontal direction, and the two groups of first connecting axes approach or move away from each other.

[0012] As a preferred technical solution of the present invention, an opening and closing structure is provided inside the first swing plate and the second swing plate, and the opening and closing structure includes a rotating plate and a second connecting shaft, and the rotating plate and the second connecting shaft are arranged inside the reserved grooves of the first swing plate and the second swing plate, and the second connecting shaft is synchronously rotatably connected with the rotating plate, and rotating disks are provided at the ends of the first swing plate and the second swing plate, and the positions of the rotating disks and the second connecting shaft correspond, and the second connecting shaft and the rotating disk are screwed together, and two connecting strips are provided between each rotating disk, and the two connecting strips of the same group are arranged in a parallelogram structure, and a matching disk is provided at the end of the fixed shaft, and the matching disk contacts one of the rotating disks.

[0013] As a preferred technical solution of the present invention, the rotation angle of the matching disk and the rotating plate is less than 90°, and the plane of the rotating plate is flush with the plane of the reserved groove.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] A cooling wind direction adjustment structure is provided, and the positions of the first swing plate and the second swing plate can be adjusted by connecting the rack, so that the wind direction of the first swing plate and the second swing plate can be changed, and the distance between the vent and the semiconductor pin can be adjusted, and the wind can be prevented from blowing directly on the semiconductor, thereby preventing the semiconductor from being defective due to too fast cooling speed or uneven cooling;

[0016] A check structure is provided, and the check baffle can be opened when the upper cover is closed, and it is ensured that the check baffle is always open. After the upper cover is opened, the check baffle can be rotated and closed, and the check baffle can be opened and closed to ensure that the cold air can be continuously and evenly delivered to the inside of the vacuum welding furnace;

[0017] The cooling air direction adjustment structure and the non-return structure cooperate to ensure that the backstop baffle is closed when the upper cover is opened, and the backstop baffle is opened when the upper cover is closed, which is more intelligent;

[0018] An opening and closing structure is provided, and the position of the reserved slot can be manually adjusted in advance as needed so that the gap between the reserved slot and the rotating plate can be adjusted, and the air volume passing through the reserved slot can be changed to avoid changes in the semiconductor pins caused by excessive air volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0020] Figure 1 It is the main structure diagram of the present invention;

[0021] Figure 2 This is a schematic diagram of opening the upper cover of the present invention;

[0022] Figure 3 It is a schematic diagram of the fixed frame and floating block of the present invention;

[0023] Figure 4 It is a schematic diagram of the cooling wind direction adjustment structure of the present invention;

[0024] Figure 5 It is a schematic diagram of the rotation state of the first swing plate and the second swing plate of the present invention;

[0025] Figure 6 It is a schematic diagram of the first gear and the connecting rack of the present invention;

[0026] Figure 7 It is a schematic diagram of the non-return structure of the present invention;

[0027] Figure 8 It is a schematic diagram of the meshing of the second gear and the arc-shaped rack of the present invention;

[0028] Fig. 9 It is a schematic diagram of the opening and closing structure of the present invention;

[0029] Fig.10 It is a schematic diagram of the state of the matching disk of the present invention.

[0030] In the figure: 1. vacuum welding furnace; 2. upper cover; 3. preheating zone; 4. high temperature reflow zone; 5. vacuum zone; 6. cooling zone; 7. fixed frame; 8. floating block; 9. cooling wind direction adjustment structure; 10. vent; 11. non-return structure; 12. opening and closing structure; 91. first swing plate; 92. second swing plate; 93. reserved slot; 94. lifting slot; 95. connecting rack; 96. fixed shaft; 97. connecting rod; 98. edge plate; 99. guide slot; 910, first gear; 911, tooth groove; 111, intermediate rod; 112, floating plate; 113, second gear; 114, first connecting shaft; 115, connecting sleeve; 116, floating rod; 117, lifting plate; 118, telescopic spring; 1110, backstop baffle; 1111, arc-shaped rack; 1112, torsion spring; 121, rotating plate; 122, rotating disk; 123, second connecting shaft; 124, connecting strip; 125, matching disk. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Embodiment 1:

[0033] See also Figure 1-Figure 6As shown, semiconductor device vacuum welding automation equipment includes a vacuum welding furnace 1, an upper cover 2, a preheating zone 3, a high-temperature reflow zone 4, a vacuum zone 5 and a cooling zone 6. The upper cover 2 is rotatably connected to the top edge of the vacuum welding furnace 1. The preheating zone 3, the high-temperature reflow zone 4, the vacuum zone 5 and the cooling zone 6 are arranged inside the vacuum welding furnace 1. During this period, the semiconductor is moved along the conveyor belt, so that the solder paste solder at the semiconductor pin is heated and melted, and then the solder paste can adhere to the pin, so that the pin and the mainboard can be welded together after the solder paste solder is dried. During this period, the semiconductor device and the mainboard pass through the high-temperature reflow zone 4, the vacuum zone 5, the cooling zone 6 and the fixing frame 7, so that the semiconductor device is heated, welded and Cooling and solidification; a plurality of fixed frames 7 are arranged on the lower surface of the upper cover 2, and a floating block 8 is arranged inside the fixed frame 7 corresponding to the position of the cooling zone 6, and a vent 10 is arranged inside the floating block 8, and the vent 10 is aligned with the surface of the cooling zone 6, and a cooling wind direction adjustment structure 9 is arranged on the lower surface of the fixed frame 7 and the floating block 8, and the cooling wind direction adjustment structure 9 includes four connecting rods 97, and the connecting rods 97 are arranged at the four corners of the fixed frame 7, and the bottom ends of the four connecting rods 97 are connected to the first swing plate 91 and the second swing plate 92, and a fixed shaft 96 is arranged at the intersection of the first swing plate 91 and the second swing plate 92, and the first swing plate 91 and the second swing plate 92 are rotatably connected, and the first swing plate 91 and the second swing plate 92 are connected. As the upper cover 2 descends, the support bars on the lower surfaces of the first swing plate 91 and the second swing plate 92 will contact the conveyor belt, so that the intersection of the first swing plate 91 and the second swing plate 92 will rotate around the fixed shaft 96, so that the connecting rack 95 moves upward relative to the floating block 8, so that the first swing plate 91 and the second swing plate 92 are in an inclined state, so that the wind blown out when cooling the semiconductor can be guided by the first swing plate 91 and the second swing plate 92, and the cold wind can be blown to different positions, and connecting racks 95 are provided at both ends of the fixed shaft 96, and lifting grooves 94 are provided on both sides of the bottom end of the floating block 8, and the connecting racks 95 are located inside the lifting grooves 94. A driving structure is provided inside both sides, and the driving structure is meshed with the top end of the connecting rack 95. When the support bar contacts the surface of the vacuum welding furnace 1 or the edge of the conveyor, the connecting rack 95 is upward relative to the floating block 8, and the first gear 910 at the top end of the connecting rack 95 is meshed with the tooth groove 911. The meshing of the first gear 910 and the connecting rack 95 can avoid the change of the angular position of the first swing plate 91 and the second swing plate 92. At the same time, the first gear 910 is meshed with the tooth groove 911, so that the floating block 8 will also rise and fall relative to the fixed frame 7, so that the height of the vent 10 inside the floating block 8 can be adjusted at this time to avoid the vent 10 being too close to the semiconductor pin.

[0034] See also Figure 4-Figure 6As shown, the driving structure includes two groups of first gears 910 and tooth grooves 911. The two groups of first gears 910 are respectively arranged inside the two sides of the floating block 8, and the tooth grooves 911 are opened at the inner wall of the fixed frame 7. The first gear 910 is meshed with the tooth grooves 911 and the connecting rack 95. The relative movement directions of the tooth grooves 911 and the connecting rack 95 are opposite. A guide groove 99 is opened on the fitting surface of the fixed frame 7 and the floating block 8, so that when the first gear 910 rotates, the connecting rack 95 moves in a vertical upward direction, and the floating block 8 also moves vertically upward along the inside of the fixed frame 7, so that the floating block 8 can be lifted faster, so that the vent 10 inside the floating block 8 is away from the inside of the semiconductor device.

[0035] See also Figure 4-Figure 6 As shown, the connecting rod 97 includes two connecting columns and an intermediate column. The two ends of the intermediate column are rotatably connected to the two connecting columns respectively. The connecting column at the top end is fixed to the fixed frame 7, and the connecting column at the bottom end is fixed to the first swing plate 91 and the second swing plate 92. When the positions of the first swing plate 91 and the second swing plate 92 change, the first swing plate 91 and the second swing plate 92 can be connected through the connecting column and the intermediate column, and the connecting rod 97 can change when the first swing plate 91 and the second swing plate 92 rotate.

[0036] See also Figure 4-Figure 6 As shown, reserved grooves 93 are provided on the surfaces of the first swing plate 91 and the second swing plate 92, and the reserved grooves 93 of the first swing plate 91 and the reserved grooves 93 of the second swing plate 92 are arranged in an eight-shaped shape. Edge plates 98 are provided on the edges of the first swing plate 91 and the second swing plate 92, and the edge plates 98 are arranged tilted upward. The reserved grooves 93 in the eight-shaped shape can be used to make the airflow flow to different positions, thereby achieving a better cooling effect.

[0037] It should be noted that the semiconductor to be soldered is placed inside the vacuum soldering furnace 1, so that the vacuum soldering furnace 1 heats and melts the solder paste between the semiconductor pins and the mainboard, so that the semiconductor pins and the mainboard can be pasted together, and the semiconductor in the vacuum soldering furnace 1 passes through the preheating zone 3, the high-temperature reflow zone 4, the vacuum zone 5, and the cooling zone 6. In the cooling zone 6, the cooling wind direction adjustment structure 9 can be used to process the wind direction. Specifically, when the extended floating block 8 descends with the upper cover 2, the support columns at the bottom ends of the first swing plate 91 and the second swing plate 92 are used to adjust the first swing plate 91 and the second swing plate 92. The two swing plates 92 abut against each other, so that the first swing plate 91 and the second swing plate 92 rotate around the fixed axis 96, so that the connecting rack 95 moves upward, and the teeth at the top of the connecting rack 95 engage with the first gear 910, so that the first gear 910 rotates. At the same time, the first gear 910 engages with the tooth groove 911, so that the first gear 910 drives the floating block 8 to move upward at the same time, so that the floating block 8 can be received in the fixed frame 7, which can prevent the vent 10 inside the floating block 8 from being closer to the semiconductor, thereby making the semiconductor pin more secure.

[0038] See also Figure 3 , Figure 7 and Figure 8As shown, a check structure 11 is provided inside the floating block 8 and inside and on both sides of the vent 10. The check structure 11 includes two sets of check baffles 1110 and arc-shaped racks 1111. The check baffles 1110 and the arc-shaped racks 1111 are welded to each other, and the two check baffles 1110 are rotatably connected. A torsion spring 1112 is provided at the intersection of the two check baffles 1110. The two check baffles 1110 are opened and closed at the same time. A placement cavity is provided on both sides of the floating block 8. An intermediate rod 111 is provided inside, and a floating plate 112 is rotatably installed between the two intermediate rods 111. When there is airflow inside the vent 10, the two backstop baffles 1110 will rotate along the intersection, so that the backstop baffles 1110 can be opened or closed. The backstop baffles 1110 can be opened under the action of airflow, and the backstop baffles 1110 can be closed under the action of the torsion spring 1112 when there is no airflow. The side wall of the rack 95 is connected and is located at one end of the floating plate 112. A lifting plate 117 is provided at the bottom, and a first connecting shaft 114 and a second gear 113 are provided at the other end of the floating plate 112 and at the side wall of the vent 10. The first connecting shaft 114 and the second gear 113 rotate synchronously, and the other end of the floating plate 112 contacts the upper end of the second gear 113, and the second gear 113 is meshed with the arc-shaped rack 1111. When the connecting sleeve 115 moves upward, the lifting plate 117 moves in the vertical direction, so that the lifting plate 117 moves the floating plate 112 so that the floating plate 112 The plate 112 rotates around the middle rod 111, and the other end of the floating plate 112 can move the second gear 113, so that the second gear 113 is pushed to the middle, and the second gear 113 contacts the arc-shaped rack 1111 of the backstop baffle 1110, so that the backstop baffle 1110 can be kept in a state, thereby ventilating the vent 10 in advance. After the backstop baffle 1110 is opened, the upper cover 2 is lowered to make the floating plate 112 rise and fall, so that the deployed backstop baffle 1110 can be fixed.

[0039] See also Figure 7 and Figure 8As shown, a connecting sleeve 115, a floating rod 116 and a telescopic spring 118 are provided at both ends of the middle rod 111 and inside the floating block 8. The connecting sleeve 115 is rotatably connected to the middle rod 111, and the telescopic spring 118 is sleeved on the outside of the floating rod 116. The connecting sleeve 115 moves in the horizontal direction, and the two groups of first connecting shafts 114 approach or move away from each other. When the floating plate 112 drives the second gear 113 to move, the first connecting shaft 114 will move along the internal groove of the floating block 8. At this time, the two ends of the first connecting shaft 114 move with the connecting sleeve 115, so that the two groups of connecting sleeves 115 and the second gear 113 are moved toward the middle. At this time, the second gear 113 can be meshed with the arc-shaped rack 1111, so that the position of the arc-shaped rack 1111 can be maintained, thereby ensuring that wind can pass through the inside of the vent 10 normally.

[0040] It should be noted that when there is airflow inside the vent 10, the two backstop baffles 1110 will rotate along the intersection, so that the backstop baffles 1110 can be opened or closed. The backstop baffles 1110 can be opened under the action of airflow, and the backstop baffles 1110 can be closed under the action of the torsion spring 1112 when there is no airflow. When the connecting sleeve 115 moves upward, the lifting plate 117 moves in the vertical direction, so that the lifting plate 117 moves the floating plate 112 so that the floating plate 112 rotates around the middle rod 111, and the other end of the floating plate 112 can move the second gear 113 , so that the second gear 113 is pushed to the middle, and the second gear 113 contacts the arc-shaped rack 1111 of the backstop baffle 1110, so that the backstop baffle 1110 can be kept in a state, so that the ventilation in the vent 10 is ventilated in advance. After the backstop baffle 1110 is opened, the upper cover 2 is lowered to make the floating plate 112 rise and fall, so that the deployed backstop baffle 1110 can be fixed, and when the upper cover 2 is raised, the floating block 8 will drop under its own weight, so that the connecting rack 95 will drop, so that the backstop baffle 1110 is reset under the action of the torsion spring 1112 to prevent the airflow from continuing to blow.

[0041] See also Figure 3 , Fig. 9 Fig.10As shown, the first swing plate 91 and the second swing plate 92 are provided with an opening and closing structure 12 inside, and the opening and closing structure 12 includes a rotating plate 121 and a second connecting shaft 123, and the rotating plate 121 and the second connecting shaft 123 are provided inside the reserved groove 93 of the first swing plate 91 and the second swing plate 92, and the second connecting shaft 123 is synchronously rotated and connected with the rotating plate 121, and the airflow blown out from the vent 10 can pass through the inside of the reserved groove 93, and the position of the rotating plate 121 and the second connecting shaft 123 can be rotated as needed, so that the wind direction of the rotating plate 121 can be adjusted, and the ends of the first swing plate 91 and the second swing plate 92 are provided with a rotating disk 122, and the position of the rotating disk 122 corresponds to the second connecting shaft 123, and the second connecting shaft 123 is connected to the rotating plate 121. 3 and the rotating disk 122 are screwed together, two connecting strips 124 are arranged between each rotating disk 122, and the two connecting strips 124 of the same group are arranged in a parallelogram structure. A matching disk 125 is arranged at the end of the fixed shaft 96, and the matching disk 125 is in contact with one of the rotating disks 122. The matching disk 125 can be manually adjusted as needed to make the matching disk 125 rotate, so that the matching disk 125 can drive one of the rotating disks 122 to rotate, and the two connecting strips 124 on the rotating disk 122 swing, so that the rotating disks 122 of the same group rotate synchronously. At this time, the position of the rotating plate 121 inside the reserved groove 93 changes, so that the gap between the reserved groove 93 and the rotating plate 121 is adjusted as needed to control the size of the air volume.

[0042] See also Figure 3 , Fig. 9 Fig.10 As shown, the rotation angle of the matching disk 125 and the rotating plate 121 is less than 90°, and the plane of the rotating plate 121 is flush with the plane of the reserved slot 93. When the position of the rotating plate 121 inside the reserved slot 93 changes, the ventilation gap inside the reserved slot 93 will change, so that the wind gap at the reserved slot 93 can be adjusted as needed.

[0043] When the present invention is in use, the air flow blown out from the vent 10 can pass through the inside of the reserved slot 93, and the position of the rotating plate 121 and the second connecting shaft 123 can be rotated as needed, so that the wind direction of the rotating plate 121 can be adjusted, and the matching disk 125 can be manually adjusted as needed to make the matching disk 125 rotate, so that the matching disk 125 can drive the two connecting strips 124 to swing, so that the rotating disks 122 of the same group rotate synchronously, and when the position of the rotating plate 121 inside the reserved slot 93 changes, the ventilation gap inside the reserved slot 93 will change, so that the wind gap at the reserved slot 93 can be adjusted as needed.

[0044] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor device vacuum welding automation equipment, comprising a vacuum welding furnace (1), an upper cover (2), a preheating zone (3), a high-temperature reflow zone (4), a vacuum zone (5) and a cooling zone (6), wherein the upper cover (2) is rotatably connected to the top edge of the vacuum welding furnace (1), and the preheating zone (3), the high-temperature reflow zone (4), the vacuum zone (5) and the cooling zone (6) are arranged inside the vacuum welding furnace (1); characterized in that: A plurality of fixed frames (7) are arranged on the lower surface of the upper cover (2); a floating block (8) is arranged inside the fixed frame (7) at a position corresponding to the cooling zone (6); a vent (10) is arranged inside the floating block (8); the vent (10) is aligned with the surface of the cooling zone (6); a cooling wind direction adjustment structure (9) is arranged on the lower surface of the fixed frame (7) and the floating block (8); the cooling wind direction adjustment structure (9) comprises four connecting rods (97); the connecting rods (97) are arranged at four corners of the fixed frame (7); the four connecting rods (97) are arranged at the four corners of the fixed frame (7); The bottom end of the floating block (8) is connected to a first swing plate (91) and a second swing plate (92), a fixed shaft (96) is arranged at the intersection of the first swing plate (91) and the second swing plate (92), the first swing plate (91) and the second swing plate (92) are rotatably connected, connecting racks (95) are arranged at both ends of the fixed shaft (96), lifting grooves (94) are arranged on both sides of the bottom end of the floating block (8), the connecting racks (95) are located inside the lifting grooves (94), and driving structures are arranged inside both sides of the floating block (8), and the driving structures are meshed with the top ends of the connecting racks (95); The driving structure comprises two groups of first gears (910) and tooth grooves (911), the two groups of first gears (910) are respectively arranged inside the two sides of the floating block (8), and the tooth grooves (911) are opened on the inner wall of the fixed frame (7), the first gears (910) are meshed with the tooth grooves (911) and the connecting rack (95), the relative movement directions of the tooth grooves (911) and the connecting rack (95) are opposite, and the contact surfaces of the fixed frame (7) and the floating block (8) are opened with guide grooves (99); The connecting rod (97) comprises two connecting columns and an intermediate column, the two ends of the intermediate column are rotatably connected to the two connecting columns respectively, the top connecting column is fixed to the fixed frame (7), and the bottom connecting column is fixed to the first swing plate (91) and the second swing plate (92); The surfaces of the first swing plate (91) and the second swing plate (92) are both provided with reserved grooves (93), and the reserved grooves (93) of the first swing plate (91) and the reserved grooves (93) of the second swing plate (92) are arranged in an eight-shaped shape, and the edges of the first swing plate (91) and the second swing plate (92) are both provided with edge plates (98), and the edge plates (98) are arranged obliquely upward; A non-return structure (11) is provided inside the floating block (8) and inside and on both sides of the vent (10). The non-return structure (11) includes two groups of non-return baffles (1110) and arc-shaped racks (1111). The non-return baffles (1110) and the arc-shaped racks (1111) are welded to each other, and the two non-return baffles (1110) are rotatably connected. A torsion spring (1112) is provided at the intersection of the two non-return baffles (1110). The two non-return baffles (1110) are opened and closed at the same time. A placement cavity is provided on both sides of the floating block (8), and a An intermediate rod (111), a floating plate (112) is rotatably mounted between the two intermediate rods (111), a lifting plate (117) is arranged at the side wall of the connecting rack (95) and below one end of the floating plate (112), a first connecting shaft (114) and a second gear (113) are arranged at the other end of the floating plate (112) and at the side wall of the vent (10), the first connecting shaft (114) and the second gear (113) rotate synchronously, the other end of the floating plate (112) contacts the upper end of the second gear (113), and the second gear (113) meshes with the arc-shaped rack (1111); A connecting sleeve (115), a floating rod (116) and a telescopic spring (118) are provided at both ends of the intermediate rod (111) and inside the floating block (8); the connecting sleeve (115) is rotatably connected to the intermediate rod (111); the telescopic spring (118) is sleeved outside the floating rod (116); the connecting sleeve (115) moves in a horizontal direction, and the two groups of first connecting shafts (114) move closer to or farther from each other.

2. The semiconductor device vacuum welding automation equipment according to claim 1, characterized in that: An opening and closing structure (12) is arranged inside the first swing plate (91) and the second swing plate (92), and the opening and closing structure (12) comprises a rotating plate (121) and a second connecting shaft (123), the rotating plate (121) and the second connecting shaft (123) are arranged inside the reserved groove (93) of the first swing plate (91) and the second swing plate (92), the second connecting shaft (123) is synchronously rotatably connected with the rotating plate (121), and the first swing plate (91) and the second swing plate (92) are opened and closed. ) are provided with a rotating disk (122) at the end thereof, the rotating disk (122) corresponds to the position of the second connecting shaft (123), and the second connecting shaft (123) and the rotating disk (122) are screwed together, two connecting bars (124) are provided between each rotating disk (122), and the two connecting bars (124) of the same group are arranged in a parallelogram structure, and a matching disk (125) is provided at the end of the fixed shaft (96), and the matching disk (125) is in contact with one of the rotating disks (122).

3. The semiconductor device vacuum welding automation equipment according to claim 2, characterized in that: The rotation angle of the matching disk (125) and the rotating plate (121) is less than 90 degrees, and the plane of the rotating plate (121) is flush with the plane of the reserved groove (93).

Images