A circuit board intelligent test management system for energy storage power supply

Abstract

The present invention discloses a circuit board intelligent test management system for energy storage power supply, which relates to the field of circuit board intelligent detection technology, and realizes the simultaneous detection of the circuit board surface and internal structure. The present invention selects a state data set of a circuit board as a sample state data set, and the state data sets of the remaining circuit boards as test state data sets in sequence, and then takes the sample state data set as the data analysis center, establishes a standard temperature change interval, a standard voltage change interval and a standard regional dynamic range image model, establishes corresponding spatial nodes according to the number of types of power supply interaction environments, inputs each standard temperature change interval, standard voltage change interval and standard regional dynamic range image model into the corresponding spatial node to obtain a circuit board analysis network, collects real-time state data of the target test circuit board, and inputs the real-time state data into the circuit board analysis network, and then determines whether the corresponding target test circuit board has an abnormality.

Description

Technical Field

[0001] The invention relates to the technical field of intelligent detection of circuit boards, in particular to an intelligent test management system for circuit boards used for energy storage power supplies. Background Art

[0002] View Technology

[0003] As one of the indispensable components of energy storage devices, circuit boards connect various electronic components and electrical equipment through the circuits designed on the circuit boards to realize signal transmission, signal processing, energy scheduling and other operations of energy storage devices. With the rapid development of electrical equipment, the number and types of circuit boards in various electrical equipment are increasing. The quality of circuit boards directly affects the function and quality of energy storage devices. Therefore, it is particularly important to perform various tests on circuit boards before using them.

[0004] The existing circuit board testing technology has the following defects:

[0005] Automated optical inspection technology: Uses cameras and image processing algorithms to perform high-resolution scans of circuit boards to detect surface defects and poor soldering, but this method mainly detects surface problems and cannot identify defects inside the circuit board such as open circuits or short circuits.

[0006] Boundary scan test technology: Boundary scan technology is used to test digital circuits by inserting special test circuits to detect signal transmission and logic functions. However, this method has poor flexibility and has limited testing effects on circuit boards with complex circuits.

[0007] Therefore, how to improve the detection accuracy while taking into account the detection of the circuit board surface and internal structure is a difficulty in the prior art. For this purpose, a circuit board intelligent test management system for energy storage power supply is provided. Summary of the invention

[0008] In order to solve the above technical problems, the object of the present invention is to provide a circuit board intelligent test management system for energy storage power supply.

[0009] In order to achieve the above object, the present invention provides the following technical solutions:

[0010] A circuit board intelligent test management system for an energy storage power supply, comprising a cloud computing platform, wherein the cloud computing platform is communicatively connected with a test data acquisition module, a monitoring and analysis network module, and a circuit board status monitoring module;

[0011] The test data acquisition module is used to divide a plurality of state test areas of the same size in a plurality of circuit boards of the same type, and to set a common data acquisition unit at the edge of adjacent state test areas, and then to collect the state data of each state test area of ​​each circuit board under the same power supply interaction environment through the common data acquisition unit, and to integrate the state data of each state test area into a state data set;

[0012] The monitoring and analysis network module is used to sequentially select a state data set of a circuit board as a sample state data set, and the state data sets of the remaining circuit boards as test state data sets, and then use the sample state data set as the data analysis center to obtain the corresponding standard temperature change interval, standard voltage change interval and standard area dynamic range image model, establish corresponding space nodes according to the number of types of power supply interaction environments, and input each standard temperature change interval, standard voltage change interval and standard area dynamic range image model into the corresponding space node to obtain a circuit board analysis network;

[0013] The circuit board status monitoring module is used to collect real-time status data of the target test circuit board, and input the real-time status data into the circuit board analysis network, so as to determine whether the corresponding target test circuit board has an abnormality, and repair the target test circuit board according to the determination result.

[0014] Furthermore, a plurality of state test areas of the same size are divided in a plurality of circuit boards of the same type, and a number s is set for each state test area. 1，1 、s 1，2 、s 1，3 ,……,s n，m , where n and m are natural numbers greater than 0, s n，m Indicates the mth state test area of ​​the nth circuit board;

[0015] For each state test area in any circuit board, a common data acquisition unit is set at a common edge position of the state test areas at adjacent positions, and the data acquisition unit is provided with a wireless communication device, a temperature sensor, a laser signal sensor and a voltage sensor;

[0016] A plurality of power supply interaction environments are set, wherein the power supply interaction environment is composed of two groups of currents with fixed voltage value ranges and opposite current directions that are interactively transformed in cycles.

[0017] Furthermore, the process of collecting the status data of the status test area includes:

[0018] Place each circuit board in the same power interaction environment, and set a number of data upload cycles according to the current interaction change direction cycle of each power interaction environment;

[0019] Each public data acquisition unit continuously collects data from its adjacent state test area through a temperature sensor and a voltage sensor, and continuously sends a laser signal to the state test area through a laser signal sensor;

[0020] Then, each public data acquisition unit continuously collects the temperature value, voltage value and laser signal spectrum of its adjacent state test area. Whenever a data upload cycle starts, each public data acquisition unit generates a temperature change curve and a voltage change curve based on the temperature value and voltage value collected since the last data upload cycle.

[0021] After the public data acquisition unit marks the acquisition time, state test area number and voltage value range on the temperature change curve, voltage change curve and laser signal spectrum, it uploads each data to the test data acquisition module, integrates the data with the same state test area number and voltage value range, and obtains the state data set of the corresponding state test area.

[0022] Furthermore, the process of establishing the standard temperature variation range and the standard voltage variation range includes:

[0023] A two-dimensional coordinate system is established and an associated distance threshold is set, and each temperature change curve and voltage change curve are divided into a plurality of temperature change segments and voltage change segments according to a current direction exchange cycle in a power supply interaction environment;

[0024] Obtaining the absolute value of the calculus data between each test voltage change segment and test temperature change segment and the corresponding test voltage change segment and test temperature change segment, and recording it as the correlation distance between the corresponding test change segment and the sample change segment;

[0025] Determine the size relationship between each change segment and the sample change segment, record the test change segment as the associated change segment of the corresponding sample change segment according to the determination result, and integrate all the associated change segments to obtain the associated change data interval of the corresponding sample change curve;

[0026] Overlap and map the associated change data intervals of different circuit boards in the same power interaction environment and the same state test area on the same two-dimensional coordinate system, set a number of time nodes according to the time length corresponding to each associated change data interval, and set a feature frame with a length of twice the associated distance threshold and a width equal to the length between any two adjacent time nodes according to the associated distance threshold;

[0027] Through the feature framework, traverse from the bottom to the top of the overlapped associated change data interval between each time node, and then select the position of the associated change data interval with the largest number of overlaps selected by the feature framework as the standard change segment interval;

[0028] The standard change segment intervals between the various time nodes are sequentially connected in chronological order, thereby obtaining a standard temperature change interval and a standard voltage change interval.

[0029] Furthermore, the process of establishing the standard area dynamic range image model includes:

[0030] According to the cycle time of the current direction change in each power interaction environment, each laser signal spectrum is divided into a number of laser signal spectrum segments, and a local area dynamic image model is generated according to each laser signal spectrum segment. The local area dynamic image model corresponding to the same state test area is overlapped and mapped, so as to obtain a regional dynamic image model of the corresponding state test area under the corresponding power interaction environment;

[0031] Establish a three-dimensional coordinate system, map the regional dynamic image models corresponding to the same state test area number and voltage value range in the three-dimensional coordinate system, set a three-dimensional feature frame, and divide each regional dynamic image model into a number of model areas with a volume only half the size of the three-dimensional feature frame;

[0032] The model area between each time node is traversed by the three-dimensional feature frame. According to the traversal result of the three-dimensional feature frame, the part with the largest number of overlapping regional dynamic graphic models is selected as the standard model area range. The standard model area ranges are spliced ​​according to the positions of the corresponding model areas in the regional dynamic image model to obtain the standard regional dynamic range image model.

[0033] Furthermore, the establishment process of the circuit board analysis network includes:

[0034] Several network nodes are established according to the number of types of each power interaction environment, and the voltage value range corresponding to each power interaction environment is marked on each network node respectively. Then, the standard regional dynamic range image model, standard temperature change interval and standard voltage change interval of the corresponding power exchange environment are stored in the corresponding network node, and each network node is connected in sequence according to the size of the voltage value range to obtain a circuit board monitoring and analysis network.

[0035] Further, the circuit board status monitoring module collects various real-time status data of the target test circuit board according to the process of the test data collection module collecting various status data of the circuit board;

[0036] The real-time voltage value range corresponding to the power interaction environment of the target test circuit board is input into the circuit board monitoring and analysis network, and then the corresponding network node is retrieved, and a real-time regional image model is generated according to the real-time laser signal spectrum of the target test circuit board;

[0037] Determine whether the real-time temperature value, real-time voltage value and real-time regional image model of the target test circuit board at each time point are within the corresponding standard regional dynamic range image model, standard temperature change interval and standard voltage change interval;

[0038] According to the judgment results, the status test areas will be labeled "suspected abnormality", "operation abnormality" and "area damage" respectively, and a maintenance decision will be generated according to the number of the status test area with "operation abnormality" or "area damage", and the corresponding status test area will be repaired according to the maintenance decision.

[0039] Furthermore, if after all the status test areas with "operational abnormality" or "area damage" are repaired, the real-time temperature value and real-time voltage value of the status test area marked with "suspected abnormality" are still not within the corresponding standard temperature change range and standard voltage change range, then the "suspected abnormality" mark is changed to "operational abnormality" until all the status test areas of the target test circuit board have no marks.

[0040] Compared with the prior art, the present invention has the following beneficial effects:

[0041] The present invention uses a sample state data set as a data analysis center, establishes standard temperature change intervals, standard voltage change intervals and standard regional dynamic range image models, establishes corresponding space nodes according to the number of types of power supply interaction environments, inputs each standard temperature change interval, standard voltage change interval and standard regional dynamic range image model into the corresponding space node to obtain a circuit board analysis network, collects real-time state data of a target test circuit board, and inputs the real-time state data into the circuit board analysis network, thereby determining whether the corresponding target test circuit board has an abnormality, thereby achieving the goal of improving the detection accuracy of the circuit board while taking into account the detection of the circuit board surface and internal structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention.

[0043] Figure 1 It is a schematic diagram of the present invention. DETAILED DESCRIPTION

[0044] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0045] like Figure 1 As shown, a circuit board intelligent test management system for energy storage power supply includes a cloud computing platform, and the cloud computing platform is communicatively connected with a test data acquisition module, a monitoring and analysis network module, and a circuit board status monitoring module;

[0046] The test data acquisition module is used to divide a plurality of state test areas of the same size in a plurality of circuit boards of the same type, and to set a common data acquisition unit at the edge of adjacent state test areas, and then to collect the state data of each state test area of ​​each circuit board under the same power supply interaction environment through the common data acquisition unit, and to integrate the state data of each state test area into a state data set;

[0047] The monitoring and analysis network module is used to sequentially select a state data set of a circuit board as a sample state data set, and the state data sets of the remaining circuit boards as test state data sets, and then use the sample state data set as the data analysis center to obtain the corresponding standard temperature change interval, standard voltage change interval, and standard area dynamic range image model, establish corresponding space nodes according to the number of types of power supply interaction environments, input each standard temperature change interval, standard voltage change interval, and standard area dynamic range image model into the corresponding space node, and then obtain the circuit board analysis network;

[0048] The circuit board status monitoring module is used to collect real-time status data of the target test circuit board, and input the real-time status data into the circuit board analysis network, so as to determine whether the corresponding target test circuit board has an abnormality, and repair the target test circuit board according to the judgment result.

[0049] Further, the working principle of the present invention is described below by way of examples:

[0050] The test data acquisition module divides a number of state test areas of the same size in multiple circuit boards of the same type, and sets a number s for each state test area 1，1 、s 1，2 、s 1，3 ,……,s n，m , where n and m are natural numbers greater than 0, s n，m Indicates the mth state test area of ​​the nth circuit board;

[0051] For each state test area in any circuit board, a common data acquisition unit is set at a common edge position of the state test areas at adjacent positions, and the data acquisition unit is provided with a wireless communication device, a temperature sensor, a laser signal sensor and a voltage sensor;

[0052] It should be noted that for edge locations associated with only one state test area, no common data acquisition unit is provided;

[0053] A plurality of power interaction environments are set, wherein the power interaction environments are composed of two groups of currents with fixed voltage value ranges and opposite current directions that are periodically interactively transformed, and the voltage value ranges of different power interaction environments are different, but the extreme values ​​of the voltage value ranges of each power interaction environment are continuous.

[0054] Further, each circuit board is placed in the same power interaction environment, and a number of data upload cycles are set according to the current interaction change direction cycle of each power interaction environment;

[0055] Then, each public data acquisition unit continuously collects the status test area adjacent to it through the temperature sensor and the voltage sensor, and continuously sends a laser signal to the status test area through the laser signal sensor. It should be noted that the laser signal frequency emitted by the laser signal sensor of each public data acquisition unit is the same;

[0056] For each state test area at the edge position of the circuit board, a public data acquisition unit is set at each of the four edge positions. Therefore, when each laser signal sensor in a state test area sends a laser signal, when the circuit board corresponding to the state test area is not damaged, the laser signal spectrum collected by the public data acquisition units at two opposite sides remains unchanged;

[0057] Then, each public data acquisition unit continuously collects the temperature value, voltage value and laser signal spectrum of its adjacent state test area. Whenever a data upload cycle starts, each public data acquisition unit generates a temperature change curve and a voltage change curve based on the temperature value and voltage value collected since the last data upload cycle.

[0058] The public data acquisition unit marks the acquisition time, state test area number and voltage value range on the temperature change curve, voltage change curve and laser signal spectrum, and then uploads the data to the test data acquisition module;

[0059] The test data acquisition module integrates the data with the same state test area number and voltage value range, and then obtains the state data set of the corresponding state test area.

[0060] Further, the test data collection module sends the status data sets of all status test areas to the monitoring and analysis network module;

[0061] The monitoring and analysis network module sequentially marks a state data set of a circuit board as a sample state data set, and marks the state data sets of other circuit boards as test state data sets;

[0062] For the temperature change curve and voltage change curve in the status data set of each circuit board, the monitoring and analysis network module establishes a two-dimensional coordinate system, retrieves the voltage change curve and temperature change curve with the same second digit of the subscript number and the same acquisition time and voltage value range from each test status set, and maps them in the two-dimensional coordinate system respectively, and records the voltage change curve and temperature change curve in the sample status data set as the sample voltage change curve and the sample temperature change curve, and records the voltage change curve and the temperature change curve in the test status data set as the test voltage change curve and the test temperature change curve;

[0063] An associated distance threshold is set, and each temperature change curve and voltage change curve are divided into a number of temperature change segments and voltage change segments according to the current direction exchange cycle in the power interaction environment. It should be noted that the points between adjacent temperature change segments and voltage change segments represent the moment when the current direction of the power interaction environment changes;

[0064] Then, the absolute value of the calculus data between each test voltage change segment and test temperature change segment and the corresponding test voltage change segment and test temperature change segment is calculated, and recorded as the correlation distance between the corresponding test change segment and the sample change segment;

[0065] If the correlation distance between the change segment and the sample change segment is greater than or equal to the correlation distance threshold, the corresponding test change segment is eliminated;

[0066] If the association distance between the change segment and the sample change segment is less than the association distance threshold, the corresponding test change segment is retained, and the test change segment is recorded as the associated change segment of the corresponding sample change segment;

[0067] Repeat the above process of obtaining the associated change segments, and then obtain the state data sets corresponding to each circuit board under different power interaction environments as the sample state data sets, the associated change segments of each sample change curve, and integrate all the associated change segments to obtain the associated change data interval of the corresponding sample change curve;

[0068] Overlap and map the associated change data intervals of different circuit boards in the same power interaction environment and the same state test area on the same two-dimensional coordinate system, set a number of time nodes according to the corresponding time length of each associated change data interval, and set a feature frame with a length of twice the associated distance threshold and a width of the length between any two adjacent time nodes according to the associated distance threshold;

[0069] Through the feature framework, traverse from the bottom to the top of the overlapped associated change data interval between each time node, and then select the position where the feature framework selects the largest number of associated change data intervals for overlap, and record the position as the standard change segment interval of the state test area in the corresponding power interaction environment at the corresponding time node;

[0070] The standard change segment intervals between various time nodes are connected in chronological order, so as to obtain the standard temperature change interval and the standard voltage change interval of the state test area of ​​the corresponding type of line under the corresponding power supply interaction environment.

[0071] Furthermore, for the laser signal spectrum in the status data set of each circuit board, the monitoring and analysis network module divides each laser signal spectrum into several laser signal spectrum segments according to the cycle time of the current direction change in each power supply interaction environment;

[0072] Then, a corresponding local area dynamic image model is generated according to each laser signal spectrum fragment. Since each state test area is simultaneously monitored by four common data acquisition units for data acquisition, the local area dynamic image model corresponding to the same state test area is overlapped and mapped according to the acquisition time, state test area number and voltage value range of each laser signal spectrum, and then the regional dynamic image model of the corresponding state test area under the corresponding power supply interaction environment is obtained;

[0073] A three-dimensional coordinate system is established, and then the regional dynamic image models corresponding to the same state test area number and voltage value range are mapped in the three-dimensional coordinate system. A similar process is adopted to obtain the standard change segment interval between each time node, and a three-dimensional feature frame is set. In each regional dynamic image model, a number of model areas with a volume only half the size of the three-dimensional feature frame are divided;

[0074] Then, the model area between each time node is traversed through the three-dimensional feature frame. Since different circuit boards have different shapes in the same state test area, the model areas of different circuit boards at the same node at the same position are different.

[0075] According to the traversal results of the three-dimensional feature frame, the part with the largest number of overlapping regional dynamic graphic models is selected as the standard model area range;

[0076] The standard model area ranges are spliced ​​according to the positions of the corresponding model areas in the regional dynamic image model, thereby obtaining a standard regional dynamic range image model of the corresponding type of circuit board;

[0077] Several network nodes are established according to the number of types of each power interaction environment, and the voltage value range corresponding to each power interaction environment is marked on each network node respectively. Then, the standard regional dynamic range image model, standard temperature change interval and standard voltage change interval of the corresponding power exchange environment are stored in the corresponding network node, and each network node is connected in sequence according to the size of the voltage value range to obtain a circuit board monitoring and analysis network.

[0078] Further, the monitoring and analysis network module sends the circuit board monitoring and analysis network to the circuit board status monitoring module;

[0079] The circuit board status monitoring module collects various real-time status data of the target test circuit board according to the process of collecting various status data of the circuit board by the test data collection module;

[0080] The real-time voltage value range corresponding to the power interaction environment of the target test circuit board is input into the circuit board monitoring and analysis network, and then the corresponding network node is retrieved, and the corresponding real-time regional image model is generated according to the real-time laser signal spectrum of the target test circuit board;

[0081] Determine whether the real-time temperature value, real-time voltage value and real-time regional image model of the target test circuit board at each time point are within the corresponding standard regional dynamic range image model, standard temperature change interval and standard voltage change interval;

[0082] If it is judged that the real-time temperature value and the real-time voltage value of the state test area are not simultaneously within the corresponding standard temperature change interval and the standard voltage change interval at three consecutive time points, but the real-time regional image model is within the corresponding standard regional dynamic range image model, then further judge whether the real-time temperature value and the real-time voltage value of the state test area at the adjacent position of the state test area in the target test circuit board also have the same judgment result. If so, the state test area is marked as "suspected abnormal";

[0083] If the real-time temperature value and the real-time voltage value of the state test zone at the adjacent position of the state test zone are both within the corresponding standard temperature change interval and the standard voltage change interval, then no matter whether the real-time regional image model of the state test zone at the adjacent position is within the corresponding standard regional dynamic range image model, the state test zone is marked as "operation abnormal";

[0084] If the real-time temperature value and real-time voltage value of the status test area are not within the corresponding standard temperature change range and standard voltage change range at three consecutive time points, and the real-time regional image model is not within the corresponding standard regional dynamic range image model, then the status test area is marked as "regional damage", otherwise no operation is performed;

[0085] The circuit board status monitoring module generates a maintenance decision based on the number of the status test area with "abnormal operation" or "area damage", and the staff repairs the corresponding status test area according to the maintenance decision;

[0086] If after all the status test areas with "abnormal operation" or "area damage" are repaired, the real-time temperature value and real-time voltage value of the status test area marked with "suspected abnormality" are still not within the corresponding standard temperature change range and standard voltage change range, then change the "suspected abnormality" mark to "abnormal operation" until all the status test areas of the target test circuit board have no marks.

[0087] The above embodiments are only used to illustrate the technical method of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A circuit board intelligent test management system for energy storage power supply, including a cloud computing platform, characterized in that: The cloud computing platform is communicatively connected with a test data acquisition module, a monitoring and analysis network module, and a circuit board status monitoring module; The test data acquisition module is used to divide a plurality of state test areas of the same size in a plurality of circuit boards of the same type, and to set a common data acquisition unit at the edge of adjacent state test areas, and then to collect the state data of each state test area of ​​each circuit board under the same power supply interaction environment through the common data acquisition unit, and to integrate the state data of each state test area into a state data set; Divide several status test areas of the same size in multiple circuit boards of the same type, and set a number s for each status test area 1，1 、s 1，2 、s 1，3 ,……,s n，m , where n and m are natural numbers greater than 0, s n，m Indicates the mth state test area of ​​the nth circuit board; For each state test area in any circuit board, a common data acquisition unit is set at a common edge position of the state test areas at adjacent positions, and the data acquisition unit is provided with a wireless communication device, a temperature sensor, a laser signal sensor and a voltage sensor; A plurality of power interaction environments are set, wherein the power interaction environments are composed of two groups of currents with fixed voltage value ranges and opposite current directions, which are interactively transformed in a periodic manner, and the voltage value ranges of different power interaction environments are different, but the extreme values ​​of the voltage value ranges of each power interaction environment are continuous; The monitoring and analysis network module is used to sequentially select a state data set of a circuit board as a sample state data set, and the state data sets of the remaining circuit boards as test state data sets, and then use the sample state data set as the data analysis center to obtain the corresponding standard temperature change interval, standard voltage change interval and standard area dynamic range image model, establish corresponding space nodes according to the number of types of power supply interaction environments, and input each standard temperature change interval, standard voltage change interval and standard area dynamic range image model into the corresponding space node to obtain a circuit board analysis network; The circuit board status monitoring module is used to collect real-time status data of the target test circuit board, and input the real-time status data into the circuit board analysis network, so as to determine whether the corresponding target test circuit board has an abnormality, and repair the target test circuit board according to the determination result.

2. The circuit board intelligent test management system for energy storage power supply according to claim 1, characterized in that: The process of collecting the status data of the status test area includes: Place each circuit board in the same power interaction environment, and set a number of data upload cycles according to the current interaction change direction cycle of each power interaction environment; Each public data acquisition unit continuously collects data from its adjacent state test area through a temperature sensor and a voltage sensor, and continuously sends a laser signal to the state test area through a laser signal sensor; Then, each public data acquisition unit continuously collects the temperature value, voltage value and laser signal spectrum of its adjacent state test area. Whenever a data upload cycle starts, each public data acquisition unit generates a temperature change curve and a voltage change curve based on the temperature value and voltage value collected since the last data upload cycle. After the public data acquisition unit marks the acquisition time, state test area number and voltage value range on the temperature change curve, voltage change curve and laser signal spectrum, it uploads each data to the test data acquisition module, integrates the data with the same state test area number and voltage value range, and obtains the state data set of the corresponding state test area.

3. The circuit board intelligent test management system for energy storage power supply according to claim 2, characterized in that: The process of establishing the standard temperature variation range and the standard voltage variation range includes: Establishing a two-dimensional coordinate system and setting an associated distance threshold, and dividing each temperature change curve and voltage change curve into a plurality of temperature change segments and voltage change segments; Obtaining the absolute value of the calculus data between each test voltage change segment and test temperature change segment and the corresponding test voltage change segment and test temperature change segment, and recording it as the correlation distance between the corresponding test change segment and the sample change segment; Determine the size relationship between each change segment and the sample change segment, record the test change segment as the associated change segment of the corresponding sample change segment according to the determination result, and integrate all the associated change segments to obtain the associated change data interval of the corresponding sample change curve; Overlap and map the associated change data intervals of the same power supply interaction environment and the same state test area on the same two-dimensional coordinate system, set a number of time nodes and a feature framework according to the time length corresponding to each associated change data interval; The overlapping associated change data intervals are traversed from the bottom to the top through the feature framework, and the position of the associated change data interval with the largest number of overlaps selected by the feature framework is selected as the standard change segment interval. The standard change segment intervals are connected in chronological order to obtain the standard temperature change interval and the standard voltage change interval.

4. The circuit board intelligent test management system for energy storage power supply according to claim 3, characterized in that: The process of establishing the standard area dynamic range image model includes: According to the cycle time of the current direction change in each power interaction environment, each laser signal spectrum is divided into a number of laser signal spectrum segments, and a local area dynamic image model is generated according to each laser signal spectrum segment. The local area dynamic image model corresponding to the same state test area is overlapped and mapped, so as to obtain a regional dynamic image model of the corresponding state test area under the corresponding power interaction environment; Establish a three-dimensional coordinate system, map the regional dynamic image models corresponding to the same state test area number and voltage value range in the three-dimensional coordinate system, set a three-dimensional feature frame, and divide each regional dynamic image model into a number of model areas with a volume only half the size of the three-dimensional feature frame; The model area between each time node is traversed by the three-dimensional feature frame. According to the traversal result of the three-dimensional feature frame, the part with the largest number of overlapping regional dynamic graphic models is selected as the standard model area range. The standard model area ranges are spliced ​​according to the positions of the corresponding model areas in the regional dynamic image model to obtain the standard regional dynamic range image model.

5. The circuit board intelligent test management system for energy storage power supply according to claim 4, characterized in that: The establishment process of the circuit board analysis network includes: Several network nodes are established according to the number of types of each power interaction environment, and the voltage value range corresponding to each power interaction environment is marked on each network node respectively. Then, the standard regional dynamic range image model, standard temperature change interval and standard voltage change interval of the corresponding power exchange environment are stored in the corresponding network node, and each network node is connected in sequence according to the size of the voltage value range to obtain a circuit board monitoring and analysis network.

6. The circuit board intelligent test management system for energy storage power supply according to claim 5, characterized in that: The circuit board status monitoring module collects various real-time status data of the target test circuit board according to the process of collecting various status data of the circuit board by the test data collection module; The real-time voltage value range corresponding to the power interaction environment of the target test circuit board is input into the circuit board monitoring and analysis network, and then the corresponding network node is retrieved, and a real-time regional image model is generated according to the real-time laser signal spectrum of the target test circuit board; Determine whether the real-time temperature value, real-time voltage value and real-time regional image model of the target test circuit board at each time point are within the corresponding standard regional dynamic range image model, standard temperature change interval and standard voltage change interval; According to the judgment results, the status test areas are labeled "suspected abnormality", "operation abnormality" and "regional damage" respectively, and a maintenance decision is generated according to the number of the status test area with "operation abnormality" or "regional damage", and the corresponding status test area is repaired through the maintenance decision.

7. The circuit board intelligent test management system for energy storage power supply according to claim 6, characterized in that: If after all the status test areas with "abnormal operation" or "area damage" are repaired, the real-time temperature value and real-time voltage value of the status test area marked with "suspected abnormality" are still not within the corresponding standard temperature change range and standard voltage change range, then change the "suspected abnormality" mark to "abnormal operation" until all the status test areas of the target test circuit board have no marks.

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