Liquid cooling head and liquid cooling heat sink having the same

Abstract

The application discloses a liquid cooling head and a liquid cooling radiator with the liquid cooling head. The liquid cooling head comprises a liquid cooling head body provided with a flow guide chamber on a bottom surface, an inlet and outlet box combined on a top surface of the liquid cooling head body, and a heat conduction sheet combined on the bottom surface of the liquid cooling head body. The liquid cooling head is used for forming the liquid cooling radiator with the liquid cooling head, a liquid cooling radiator and two liquid pipes. When the liquid cooling head operates, the liquid cooling radiator outputs liquid through a liquid pipe. The liquid enters a flow distribution groove in the liquid cooling head body through the inlet and outlet box and an inlet hole of the liquid cooling head body. The flow distribution groove is perpendicular to a plurality of cross flow grooves on the heat conduction sheet and the length direction of the fins, so that the liquid evenly flows into the cross flow grooves for heat exchange, and then flows to both sides of the flow guide chamber from both ends of the cross flow grooves, and then flows out of the liquid cooling head through an outlet hole of the liquid cooling head body and the inlet and outlet box, and then flows to the liquid cooling radiator through another liquid pipe for heat dissipation.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of cooling and heat dissipation of chip processors, and in particular to a liquid cooling head for cooling and removing heat from a chip processor by liquid, and a liquid cooling heat sink with the liquid cooling head. BACKGROUND

[0002] There are two types of heat sinks for computer processors today, air-cooled heat sinks and liquid-cooled heat sinks. A liquid cooling head of a liquid-cooled heat sink is attached to the surface of a processor, and the heat generated by the processor during operation is removed by the flow of cold liquid through the liquid cooling head, so that the heated liquid flows to the radiator, and the heated liquid is cooled and becomes cold liquid by the radiator, and then returns to the liquid cooling head, thereby achieving higher cooling and heat dissipation efficiency than traditional air-cooled heat sinks.

[0003] A conventional liquid-cooled heat sink, such as shown in Patent No. I802996B or Patent Publication No. US20230014449A1, has a liquid cooling head, a liquid cooling radiator, and a cold liquid inlet pipe and a hot liquid outlet pipe connected between the liquid cooling head and the liquid cooling radiator. A liquid pump is provided in the liquid cooling head, which is used to circulate the liquid between the liquid cooling head and the liquid cooling radiator. When the cold liquid enters the liquid cooling head, it can cool the chip processor and become hot liquid, and the hot liquid flows to the liquid cooling radiator to be cooled and become cold liquid, thereby achieving the functions of cooling and heat dissipation.

[0004] However, the internal structure of the liquid cooling head of the above-mentioned liquid-cooled heat sink causes the flow direction of the cold liquid after entering to be easily disordered, resulting in the mixing of hot liquid and cold liquid, and easy occurrence of uneven cooling. The plurality of through holes on the VC vapor chamber easily block the flow of cold liquid, making it difficult for the cold liquid to flow smoothly into the lower heat exchange space, which affects the cooling effect. In addition, the liquid pump is installed in the liquid cooling head, so that when the liquid pump fails or operates abnormally, the entire liquid cooling head needs to be removed from the motherboard for maintenance, causing inconvenience in disassembly and maintenance. Moreover, the installation of the liquid pump in the liquid cooling head results in a large volume of the liquid cooling head, which is not conducive to installation on a motherboard with limited space. SUMMARY

[0005] The main purpose of the present application is to provide a liquid cooling head and a liquid cooling heat sink with the liquid cooling head, which is designed by the internal structure of the liquid cooling head to make the liquid flowing into the liquid cooling head flow uniformly, directionally and quantitatively through the internal heat exchange structure, so that the liquid flowing through the structure will not be disordered by hot and cold liquids, and there will be no structure to block the flow.

[0006] The second object of the present application is to provide a liquid cooling head and a liquid cooling radiator with the liquid cooling head, which are designed by installing a liquid pump in the liquid cooling head without a liquid pump and in the liquid cooling radiator, so that the volume of the liquid cooling head is reduced, and the liquid cooling head is favorably installed on a mainboard with a small space, and if the liquid pump fails, the liquid cooling head does not need to be removed.

[0007] To achieve the above object, the present application provides a liquid cooling head, which is used to contact a chip processor, cool the chip processor by flowing liquid, and take away the heat of the chip processor. The preferred technical scheme comprises:

[0008] A liquid cooling head body, which is a corrosion-resistant plastic seat body, has a flow guide chamber recessed to a top surface thereof at a bottom surface, and has a flow distribution groove recessed to the top surface in a middle of a top wall of the flow guide chamber, the flow distribution groove extending to two opposite sides of the flow guide chamber; the top wall of the flow distribution groove is provided with a first liquid inlet hole, which is communicated to the top surface; the top wall of the flow guide chamber is provided with a first liquid outlet hole at each of two sides opposite to the flow distribution groove, and the first liquid outlet hole is communicated to the top surface.

[0009] An inlet and outlet liquid box, which is combined with the top surface of the liquid cooling head body, has a second liquid inlet hole and a second liquid outlet hole; an inlet end of the second liquid inlet hole is communicated to any side surface of the inlet and outlet liquid box, and an outlet end of the second liquid inlet hole is communicated to the first liquid inlet hole; an outlet end of the second liquid outlet hole is communicated to any side surface of the inlet and outlet liquid box, and an inlet end of the second liquid outlet hole is communicated to the first liquid outlet hole.

[0010] A heat conduction sheet, which is a heat conduction metal sheet, is combined with the bottom surface of the liquid cooling head body, covers and seals the flow guide chamber; the top surface of the heat conduction sheet has a plurality of parallel flow grooves, the flow grooves extend to two opposite sides of the heat conduction sheet, and two ends of the flow grooves are communicated to the first liquid outlet holes above the two ends; the length direction of the flow grooves is perpendicular to the length direction of the flow distribution groove, so that the liquid entering the flow distribution groove flows into the flow grooves for heat exchange, and then flows out of the two ends of the flow grooves to the first liquid outlet holes; and

[0011] A liquid separation sheet, which has a first through hole corresponding to the shape of the flow distribution groove in the middle, and has two second through holes corresponding to the shape of the first liquid outlet holes at two sides, the first through hole and the second through hole are strip-shaped holes, and the liquid separation sheet covers the flow grooves of the heat conduction sheet.

[0012] In order to achieve the above object, the application provides a liquid cooling radiator with a liquid cooling head, which preferably comprises a liquid cooling radiator, two liquid pipes and the liquid cooling head; the liquid cooling radiator comprises a first liquid box, a second liquid box, a group of connecting pipes between the first liquid box and the second liquid box, and a liquid pump arranged in the first liquid box, and the first liquid box is provided with an inlet pipe joint and an outlet pipe joint; one end of the two liquid pipes is connected with the inlet end of the second inlet hole of the liquid cooling head and the outlet end of the second outlet hole, and the other end of the two liquid pipes is connected with the inlet pipe joint and the outlet pipe joint.

[0013] The liquid cooling head and the liquid cooling radiator with the liquid cooling head can make the liquid flow uniformly, directionally and quantitatively through the cross-flow grooves, the liquid flow is not disordered when flowing, and the liquid can flow in and out without obstruction. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a front perspective view of the liquid cooling radiator with the liquid cooling head.

[0015] Figure 2 It is a front perspective view of the liquid cooling head.

[0016] Figure 3 It is a rear perspective view of the liquid cooling head.

[0017] Figure 4 It is an exploded view of the liquid cooling head from the top.

[0018] Figure 5 It is an exploded view of the liquid cooling head from the bottom.

[0019] Figure 6 It is an exploded view of the liquid cooling head from the top.

[0020] Figure 7 It is a longitudinal front section view of the liquid cooling head.

[0021] Figure 8 It is a longitudinal side section view of the liquid cooling head.

[0022] Figure 9 It is a top view of the liquid cooling head body.

[0023] Figure 10 It is a cross section view of the liquid cooling head body.

[0024] Figure 11 Figure 1 is a schematic exploded view of a liquid cooling radiator with a liquid cooling head according to the present application.

[0025] Figure 12 Figure 2 is a schematic perspective view of a liquid cooling radiator with a liquid cooling head according to the present application.

[0026] Brief Description of the Drawings

[0027] 100: liquid cooling head

[0028] 10: liquid cooling head body

[0029] 11: flow guide chamber

[0030] 12: flow distribution groove

[0031] 13: first liquid inlet hole

[0032] 14: first liquid outlet hole

[0033] 15: shoulder portion

[0034] 16: positioning protrusion

[0035] 161: screw hole

[0036] 17: leakproof structure

[0037] 171: first groove

[0038] 172: second groove

[0039] 173: leakproof ring

[0040] 18: leakproof structure

[0041] 181: third groove

[0042] 182: fourth groove

[0043] 183: leakproof ring

[0044] 20: liquid inlet and outlet box

[0045] 21: second liquid inlet hole

[0046] 22: second liquid outlet hole

[0047] 23: liquid outlet chamber

[0048] 24: liquid inlet and outlet box body

[0049] 25: outer shell

[0050] 26: pipe joint

[0051] 261: O-ring

[0052] 27: positioning hole

[0053] 28: screw

[0054] 29: latch

[0055] 30: heat-conducting sheet

[0056] 31: cross-flow groove

[0057] 32: fin

[0058] 33: screw

[0059] 40: liquid-separation sheet

[0060] 41: first through hole

[0061] 42: second through hole

[0062] 50: fixing bracket

[0063] 200: liquid-cooling heat-dissipation row

[0064] 201: first liquid box

[0065] 202: second liquid box

[0066] 203: row pipe

[0067] 204: liquid pump

[0068] 205: liquid inlet pipe joint

[0069] 206: liquid outlet pipe joint

[0070] 300: liquid pipe

[0071] 400: chip processor DETAILED DESCRIPTION

[0072] The technical features, structure, and other effects, purposes, and functions of the present application are described in detail below with reference to the embodiments shown in the drawings:

[0073] Referring to Figure 1 , Figure 2 and Figure 3 , the present application is a liquid cooling head 100, which is arranged on a chip processor 400 to cool the chip processor 400 by liquid and to take away the heat of the chip processor 400. Referring to Figure 4 and Figure 5 , the preferred embodiment of the liquid cooling head 100 includes a liquid cooling head body 10, a liquid inlet and outlet box 20, a heat-conducting sheet 30, and can be additionally provided with a liquid-separation sheet 40 and two fixing brackets 50, wherein:

[0074] The liquid cooling head body 10 is a member for fixing and heat exchanging, preferably a rectangular corrosion-resistant plastic seat body, the bottom surface of which is provided with a rectangular flow guide chamber 11 recessed towards the top surface thereof, the top wall of the flow guide chamber 11 is provided with a sub-flow groove 12 recessed towards the top surface of the liquid cooling head body 10, the sub-flow groove 12 is implemented as a long strip-shaped groove extending to the two opposite sides of the flow guide chamber 11; the top wall of the sub-flow groove 12 is provided with a first liquid inlet hole 13, which communicates to the top surface of the liquid cooling head body 10; the top wall of the flow guide chamber 11 is provided with a first liquid outlet hole 14 at each of the two sides opposite to the sub-flow groove 12, the first liquid outlet hole 14 is preferably a strip-shaped hole, and the first liquid outlet hole 14 respectively communicates to the top surface of the liquid cooling head body 10. The liquid cooling head body 10 is further provided with a shoulder portion 15 around the same, the shoulder portion 15 is respectively provided with a fixing bracket 50 on the two opposite sides thereof, and the fixing bracket 50 is used for fixing on a circuit board (mainboard) through a fixing element known in the art.

[0075] The liquid inlet and outlet box 20 is combined with the liquid cooling head body 10, and is used for making the liquid flow into and out of the liquid cooling head body 10. Specifically, the liquid inlet and outlet box 20 is combined with the top surface of the liquid cooling head body 10, and is provided with a second liquid inlet hole 21 and a second liquid outlet hole 22. An inlet end of the second liquid inlet hole 21 communicates to any side surface of the liquid inlet and outlet box 20, and an outlet end of the second liquid inlet hole 21 is located at the bottom surface of the liquid inlet and outlet box 20, and is used for communicating to the inlet end of the first liquid inlet hole 13 of the liquid cooling head body 10. An outlet end of the second liquid outlet hole 22 communicates to any side surface of the liquid inlet and outlet box 20, and an inlet end of the second liquid outlet hole 22 is located at the bottom surface or other position of the liquid inlet and outlet box 20, and is used for communicating to the outlet end of the first liquid outlet hole 14 of the liquid cooling head body 10. Wherein, the bottom surface of the liquid inlet and outlet box 20 is provided with a liquid outlet cavity 23 recessed towards the top surface thereof, and the bottom surface of the liquid outlet cavity 23 covers the two first liquid outlet holes 14, so that the liquid of the two first liquid outlet holes 14 can flow into the liquid outlet cavity 23, and then flow into the second liquid outlet hole 22, and the inlet end of the second liquid outlet hole 22 is located at the inner wall of the liquid outlet cavity 23.

[0076] Referring to Figure 4 , Figure 5 and Figure 7 , the heat conduction sheet 30 is a heat conduction metal sheet, the bottom surface of which is used for contacting the chip processor 400, and the heat conduction sheet 30 is locked on the bottom surface of the liquid cooling head body 10 through a plurality of screws 33 at the edges thereof, and covers and seals the flow guide chamber 11. The top surface of the heat conduction sheet 30 is provided with a plurality of parallel cross-flow grooves 31 and fins 32 between the cross-flow grooves 31, when the heat conduction sheet 30 is combined with the bottom surface of the liquid cooling head body 10, the cross-flow grooves 31 and the fins 32 are located in the flow guide chamber 11 of the liquid cooling head body 10, and the length direction of the cross-flow grooves 31 is perpendicular to the length direction of the sub-flow groove 12 (as shown in Figure 9The cross flow grooves 31 extend to both sides of the heat conducting sheet 30, so that both ends of the cross flow grooves 31 are connected to the first liquid outlet holes 14 above the both ends (as shown in Figure 8 The first liquid outlet holes 14 are strip-shaped holes (as shown in Figure 9 and Figure 10 so that the liquid in each cross flow groove 31 can flow into the first liquid outlet holes 14 at the same speed. Therefore, when the cooled liquid flows into the flow distribution groove 12 through the first liquid inlet hole 13, the design of the strip-shaped flow distribution groove 12 can make the liquid flow into the middle of the cross flow grooves 31 and then flow to both ends of the cross flow grooves 31 to the first liquid outlet holes 14, so that the liquid can uniformly exchange heat with the heat conducting sheet 30 and the fins 32 during the flow in the cross flow grooves 31, thereby cooling the chip processor 400.

[0077] As shown in Figure 4 , Figure 5 and Figure 7 The present application can further comprise a liquid separation sheet 40, which is a rectangular sheet corresponding to the shape and size of the flow guiding chamber 11. The middle of the liquid separation sheet 40 is provided with a first through hole 41 corresponding to the shape of the flow distribution groove 12, and both sides of the liquid separation sheet 40 are provided with two second through holes 42 corresponding to the shape of the first liquid outlet holes 14. Both the first through hole 41 and the second through hole 42 are strip-shaped holes. During assembly, the liquid separation sheet 40 is covered on the cross flow grooves 31 of the heat conducting sheet 30, so that the liquid flowing into each cross flow groove 31 can flow out of both ends of the cross flow grooves 31, thereby avoiding the mixing of the heated liquid and the cold liquid during the flow.

[0078] As shown in Figure 6As shown, the preferred embodiment of the liquid inlet / outlet box 20 includes a liquid inlet / outlet box body 24, a cover 25, and two pipe joints 26. The liquid inlet / outlet box body 24 is a rectangular block, and the second liquid inlet hole 21 and the second liquid outlet hole 22 are formed in the liquid inlet / outlet box body 24. The bottom surface of the liquid inlet / outlet box body 24 is provided with the liquid outlet cavity 23. The cover 25 is a rectangular cover with a top plate and four side plates, and is sleeved on the liquid inlet / outlet box body 24 to cover the liquid inlet / outlet box body 24. The pipe joints 26 are connected to the inlet end of the second liquid inlet hole 21 and the outlet end of the second liquid outlet hole 22. The top surface of the liquid cooling head body 10 is provided with a plurality of positioning protrusions 16 and screw holes 161 formed in the positioning protrusions 16. The liquid inlet / outlet box 20 (the liquid inlet / outlet box body 24) is provided with a plurality of positioning holes 27 and screws 28 inserted into the positioning holes 27. During assembly, the positioning protrusions 16 of the liquid cooling head body 10 are inserted into the positioning holes 27 of the liquid inlet / outlet box 20 (the liquid inlet / outlet box body 24), and then the screws 28 are screwed into the screw holes 161 of the positioning protrusions 16 from top to bottom. Then, the cover 25 is sleeved on the liquid inlet / outlet box body 24, so that the surface of the liquid inlet / outlet box 20 is kept flat and beautiful, and dust is prevented from accumulating in the positioning holes 27. In addition, the liquid inlet / outlet box body 24 is provided with two latches 29, which are inserted into the second liquid inlet hole 21 and the second liquid outlet hole 22 to clamp the grooves of the pipe joints 26, so that the pipe joints 26 cannot be separated.

[0079] To achieve the effect of preventing leakage, the combination surface between the liquid cooling head body 10 and the liquid inlet / outlet box 20 is provided with a leakage prevention structure 17. A first groove 171 is formed around the inlet end of the first liquid inlet hole 13 on the top surface of the liquid cooling head body 10, and a second groove 172 is formed around the two first liquid outlet holes 14. A leakage prevention ring 173 is arranged in the first groove 171 and the second groove 172. The leakage prevention structure 18 is arranged between the liquid cooling head body 10 and the heat conduction sheet 30 and the liquid separation sheet 40. A third groove 181 is formed around the flow distribution groove 12 on the bottom surface of the liquid cooling head body 10, and a fourth groove 182 is formed around the flow guide cavity 11. A leakage prevention ring 183 is arranged in the third groove 181 and the fourth groove 182. In addition, one or two O-rings 261 can be arranged around the insertion part of the pipe joint 26, so that the liquid cooling head 100 can achieve the effect of preventing leakage.

[0080] Referring to Figure 11 and Figure 12As shown, according to the above technical features, the liquid cooling head 100 is a liquid cooling head without a liquid pump. In order to apply the liquid cooling head 100 on the chip processor 400 for cooling and heat dissipation, the application further provides a liquid cooling radiator with a liquid cooling head, which comprises the above-mentioned liquid cooling head 100, a liquid cooling radiator 200 and two liquid pipes 300. The liquid cooling radiator 200 is a known structure, such as the liquid cooling radiator 200 shown in Chinese Patent No. I802996B or US Patent No. US20230014449A1, which comprises a first liquid box 201, a second liquid box 202, and a plurality of array pipes 203 connected between the first liquid box 201 and the second liquid box 202. However, the liquid pump of the above-mentioned patent is changed to the liquid cooling radiator 200, a liquid pump 204 is arranged in the first liquid box 201, and an inlet pipe joint 205 and an outlet pipe joint 206 are arranged in the first liquid box 201. One end of the two liquid pipes 300 is connected to the pipe joint 26 of the second inlet hole 21 of the liquid cooling head 100 and the pipe joint 26 of the second outlet hole 22, and the other end of the two liquid pipes 300 is connected to the inlet pipe joint 205 and the outlet pipe joint 206 of the liquid cooling radiator 200, so that the liquid cooled by the liquid cooling radiator 200 flows into the liquid cooling head 100, and the hot liquid of the liquid cooling head 100 can flow to the liquid cooling radiator 200 for heat dissipation. Therefore, in addition to the above-mentioned uniform heat exchange and heat dissipation and leakage prevention effects, the liquid cooling head 100 without a liquid pump can reduce the overall structure and volume of the liquid cooling head 100, facilitate installation in a small computer space, and also enable the liquid cooling radiator 200 to be disassembled without disassembling the liquid cooling head 100 when the liquid pump 204 fails.

[0081] In summary, the liquid cooling head and the liquid cooling radiator with the liquid cooling head of the application have practicality and creativity, the use of technical means is novel, the effects and design purposes are indeed consistent, and the application has made reasonable progress.

Claims

1. A liquid cooling head for cooling a chip processor by a liquid, the liquid cooling head comprising: a liquid cooling head body, the liquid cooling head body being a corrosion-resistant plastic seat body, the liquid cooling head body having a flow guide cavity recessed from a top surface of the liquid cooling head body, the flow guide cavity having a flow distribution groove recessed from a top wall of the flow guide cavity, the flow distribution groove extending to opposite sides of the flow guide cavity, the flow distribution groove having a first liquid inlet hole in a top wall of the flow distribution groove, the first liquid inlet hole being communicated to the top surface, the flow guide cavity having a first liquid outlet hole in the top wall of the flow guide cavity, the first liquid outlet hole being communicated to the top surface; a liquid inlet and outlet box combined with the top surface of the liquid cooling head body, the liquid inlet and outlet box having a second liquid inlet hole and a second liquid outlet hole, the second liquid inlet hole having an inlet end communicated to a side surface of the liquid inlet and outlet box and an outlet end communicated to the first liquid inlet hole, the second liquid outlet hole having an outlet end communicated to a side surface of the liquid inlet and outlet box and an inlet end communicated to the first liquid outlet hole, the liquid inlet and outlet box having a liquid outlet cavity recessed from a top surface of the liquid inlet and outlet box, the inlet end of the second liquid outlet hole being located in an inner wall of the liquid outlet cavity, the liquid outlet cavity covering the two first liquid outlet holes, the two first liquid outlet holes being communicated to the liquid outlet cavity; a heat conduction sheet, the heat conduction sheet being a heat conduction metal sheet, the heat conduction sheet being combined with a bottom surface of the liquid cooling head body, the heat conduction sheet covering and sealing the flow guide cavity, the heat conduction sheet having a plurality of parallel cross flow grooves in a top surface of the heat conduction sheet, the cross flow grooves extending to opposite sides of the heat conduction sheet, the cross flow grooves having two ends communicated to the first liquid outlet holes above the two ends, the first liquid outlet holes being strip-shaped holes having a width greater than or equal to a total width of the cross flow grooves, the cross flow grooves being perpendicular to the flow distribution groove, such that liquid in the flow distribution groove flows into the cross flow grooves for heat exchange and then flows out of the cross flow grooves to the first liquid outlet holes; and a liquid separation sheet, the liquid separation sheet having a first through hole corresponding to a shape of the flow distribution groove, the liquid separation sheet having two second through holes corresponding to shapes of the first liquid outlet holes, the first through hole and the second through holes being strip-shaped holes, the liquid separation sheet covering the cross flow grooves of the heat conduction sheet.

2. The liquid cooling head of claim 1, wherein the liquid inlet and outlet box comprises a liquid inlet and outlet box body, a shell and two pipe joints, the liquid inlet and outlet box body being a rectangular block, the liquid inlet and outlet box body having the second liquid inlet hole and the second liquid outlet hole, the liquid inlet and outlet box body having the liquid outlet cavity in a bottom surface of the liquid inlet and outlet box body, the shell being a rectangular cover having a top plate and four side plates, the shell being sleeved on the liquid inlet and outlet box body, the pipe joints being combined with the second liquid inlet hole and the second liquid outlet hole.

3. The liquid cooling head of claim 2, wherein the liquid cooling head body has a plurality of positioning protrusions and screw holes in the positioning protrusions in the top surface of the liquid cooling head body, the liquid inlet and outlet box has a plurality of positioning holes and screws inserted into the positioning holes, the positioning protrusions of the liquid cooling head body are inserted into the positioning holes, and the screws are locked into the screw holes in the positioning protrusions. ​ ​ ​ ​ 4. The liquid cooling head of claim 1, wherein the top surface of the liquid cooling head body is concavely provided with a first groove surrounding the inlet end of the first liquid inlet hole and a second groove surrounding the two first liquid outlet holes, and the first groove and the second groove are respectively provided with a leakproof ring.

5. The liquid cooling head of claim 1, wherein the periphery of the flow distribution groove of the liquid cooling head body is provided with a third groove, and the periphery of the rectangular cavity of the flow guide chamber of the liquid cooling head body is provided with a fourth groove, and the third groove and the fourth groove are respectively provided with a leakproof ring.

6. The liquid cooling head of claim 1, wherein the periphery of the liquid cooling head body is provided with a shoulder portion, and the shoulder portions on the opposite sides are respectively provided with a fixing bracket.

7. A liquid cooling radiator with a liquid cooling head, comprising a liquid cooling radiator, two liquid pipes and the liquid cooling head of any one of claims 1-6; the liquid cooling radiator comprises a first liquid box, a second liquid box, a group of connecting pipes connected between the first liquid box and the second liquid box, and a liquid pump arranged in the first liquid box, and the first liquid box is provided with a liquid inlet connector and a liquid outlet connector; one end of the two liquid pipes is connected to the inlet end of the second liquid inlet hole and the outlet end of the second liquid outlet hole of the liquid cooling head, and the other end of the two liquid pipes is connected to the liquid inlet connector and the liquid outlet connector.

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