Radiator for high-end computer processor and method for manufacturing the same

Abstract

The present invention provides a radiator for a high-end computer processor and a manufacturing method thereof, comprising an upper limit frame, a lower limit frame, a stepless fan assembly, a temperature detector, a dual heat-conducting pipe body assembly and a heat dissipation body, wherein the heat dissipation body comprises a heat-conducting base and a plurality of heat-dissipating fins integrally connected to the upper surface of the heat-conducting base, a heat-conducting protrusion is integrally connected to the lower surface of the heat-conducting base to form a vertical upward heat-conducting heat dissipation, a mounting hole is opened on the lower limit frame, the heat-conducting protrusion is sleeved into the mounting hole, the heat-dissipating body is provided with a dual heat-conducting pipe body assembly, and a temperature detector is provided on one side of the heat-conducting base; the present invention designs the heat-dissipating body into an independent single body structure, so as to carry out batch production and radiator combinations of different sizes, can conduct heat in horizontal and vertical directions, accelerate the heat dissipation and cooling speed, protect the service life of the CPU, reduce the production and manufacturing cost, and is more convenient to use.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and in particular to a radiator for a high-end computer processor and a manufacturing method thereof. Background Art

[0002] A radiator is a device that dissipates heat from heat-prone electronic components in electrical appliances. It is mostly made of aluminum alloy, brass or bronze in the form of plates, sheets or multiple sheets. For example, a computer's CPU central processing unit requires a fairly large radiator, as do the power tubes in televisions and the power amplifier tubes in amplifiers. Generally, a layer of thermal conductive silicone grease is applied to the contact surface of the electronic components during use to allow the heat generated by the components to be more effectively transferred to the radiator, and then dissipated into the surrounding air through the radiator to achieve a heat dissipation effect.

[0003] The existing radiator is basically composed of a cooling fan and a heat sink. The bottom of the heat sink is a flat structure, and a plurality of heat sink fins are vertically arranged on the upper surface, and the heat sink fins are parallel to each other, so as to achieve the basic heat dissipation purpose. However, since the size of the heat sink is fixed, heat sink structures of various sizes must be customized according to different purposes. When more sizes are used, not only will the production cost increase, but it will also be inconvenient to use.

[0004] For high-performance computer processors, for example, carrying multiple high-computing CPUs means high power consumption and high heat generated per unit time. The single heat sink fins used in traditional radiators cannot meet the high-heat and rapid heat dissipation requirements of high-computing CPUs. Unsatisfactory heat dissipation can easily affect the service life of high-performance computers. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a heat sink for high-end computer processors and a manufacturing method thereof, so as to solve the problem that the existing heat sink must be customized with heat sink structures of various sizes according to different purposes of use, which increases the production and manufacturing costs and is inconvenient to use, and the single heat sink fin cannot meet the high-heat and rapid heat dissipation requirements of a high-computing CPU, affecting its service life.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] A radiator for a high-end computer processor comprises an upper limit frame, a lower limit frame, a stepless fan assembly, a temperature detector, a dual heat-conducting pipe body assembly and a heat dissipation body, wherein the heat-conducting body comprises a heat-conducting base and a plurality of heat-dissipating fins integrally connected to the upper surface of the heat-conducting base, a heat-conducting protrusion is integrally connected to the lower surface of the heat-conducting base to form a vertical upward heat-conducting heat dissipation, a mounting hole is provided on the lower limit frame, the heat-conducting protrusion is sleeved into the mounting hole, the heat-dissipating body is provided with a dual heat-conducting pipe body assembly, one end of the dual heat-conducting pipe body assembly is arranged between the heat-dissipating fins, and the other end is inserted and arranged at the bottom of the heat-conducting protrusion, and the bottom surface is exposed to the outside and flush with the lower surface of the heat-conducting protrusion, a temperature detector is provided on one side of the heat-conducting base, wherein the heat-conducting protrusion is flush with the lower surface of the lower limit frame;

[0008] The four corners of the lower limit frame are provided with support components, the heat conductive base is fixed between the upper limit frame and the lower limit frame through the support components, the stepless fan component is installed on the top of the support component, and the temperature detector and the stepless fan component are both connected with a serial port for electrical plug-in.

[0009] Preferably, the dual heat-conducting pipe body assembly includes a hollow heat-conducting pipe body, a plurality of left blind grooves and right blind grooves are provided on the bottom surface of the heat-conducting protrusion, the left blind grooves and the right blind grooves are bidirectionally arranged and staggered, a wide flat heat-conducting pipe is provided at one end of the hollow heat-conducting pipe body, a circular heat-conducting pipe is provided at one end of the hollow heat-conducting pipe body, the wide flat heat-conducting pipes are respectively arranged in the left blind groove and the right blind groove, and the circular heat-conducting pipes are respectively extended and inserted between the heat-dissipating fins to form heat conduction and heat dissipation on both sides in the horizontal direction, wherein the hollow heat-conducting pipe body is made of pure copper, and its outer surface is gold-plated.

[0010] Preferably, the temperature detector is connected to an external main control via the serial port;

[0011] When the temperature detector detects that the temperature of the heat-conducting base is greater than the first warning temperature threshold, the temperature detector sends a signal to the external main control, and the external main control controls the stepless fan assembly to adjust to the first gear of the heat dissipation load;

[0012] When the temperature detector detects that the temperature of the heat-conducting base is greater than the second warning temperature threshold, the temperature is sent to the external main control, and the stepless fan assembly is controlled by the external main control to adjust to the second gear of heat dissipation load;

[0013] When the temperature detector detects that the temperature of the heat-conducting base is greater than the third warning temperature threshold, it is sent to the external main control, and the external main control controls the stepless fan assembly to adjust to the third gear of heat dissipation load and reach a warning reminder.

[0014] Preferably, the upper limit positioning frame is provided with a through hole for being inserted into the upper part of the heat dissipating fin, so that the lower surface of the upper limit positioning frame is pressed against the upper end surface of the supporting assembly for limiting, wherein the through hole is smaller than the size of the thermal conductive base, and the thermal conductive protrusion is smaller than the size of the thermal conductive base.

[0015] Preferably, movable elastic locking devices are installed at the four corners of the lower limit frame, arc-shaped inner grooves are opened at the four corners of the heat-conducting base, and the arc-shaped inner grooves are used to cooperate with the mounting hole sleeve, and the lower limit frame is made of oxygen-free copper.

[0016] Preferably, the stepless fan assembly includes a mounting frame, a mounting groove corresponding to the heat dissipation body is opened on the mounting frame, a support frame is fixedly connected to the inner wall of the mounting groove, a stepless motor is installed on the support frame, and fan blades are installed on the output end of the stepless motor, wherein the stepless motor is a stepless motor with multi-speed stepless speed regulation.

[0017] Preferably, the support assembly includes a support column arranged corresponding to the arc-shaped inner groove, the bottom end of the support column is fixedly connected to the lower limit frame, the top end of the support column passes through the arc-shaped inner groove, the upper limit frame and the mounting frame in sequence and is threadedly connected with a nut, the outer surface of the support column is sleeved with a support sleeve, and the support sleeve is located between the upper limit frame and the mounting frame.

[0018] Preferably, an anti-deformation sheet is provided between the support sleeve and the mounting frame, and the anti-deformation sheet is used to separate two adjacent heat dissipation fins.

[0019] Preferably, the anti-deformation plate includes a fixing plate, and a plurality of plug-in rods are fixedly connected to the lower surface of the fixing plate on one side close to the heat dissipation fins, and the plug-in rods are located between two heat dissipation fins. A plurality of circular holes are opened on the fixing plate, and the circular holes are sleeved on the outer surface of the support column. The plug-in rods and the fixing plate are bent integrally, and the lower surface of the fixing plate contacts the upper surface of the heat dissipation fins, and the bottom end of the plug-in rod is a conical structure.

[0020] In addition, in order to solve the above technical problems, the present invention also provides a method for manufacturing a heat sink for a high-end computer processor, the manufacturing method comprising the following steps:

[0021] S1. Get a lower limit frame and place it on a flat plate, insert one end of the double heat-conducting pipe assembly into the two sides of the bottom of the heat-conducting protrusion respectively, and extend the other end of the double heat-conducting pipe assembly into the heat-dissipating fins respectively, so that the double heat-conducting pipe assembly forms a bidirectional arrangement and is firmly set on the heat-dissipating body;

[0022] S2, apply thermal conductive silicone to the heat-conducting protrusion on the heat-dissipating body and one end surface of the double heat-conducting pipe assembly inserted on both sides of the bottom of the heat-conducting protrusion and place them in the mounting hole on the lower limit frame, at this time, the lower surface of the lower limit frame and the lower surface of the heat-dissipating body are flat surfaces, wherein a temperature detector is preliminarily provided on one side of the heat-conducting base;

[0023] S3, sleeve the upper limit frame on the support assembly, assemble and set the stepless fan assembly, and fasten the upper limit frame and the lower limit frame by screws to form a stable connection;

[0024] S4. The serial ports of the temperature detector and the stepless fan assembly are electrically connected to the external main control, wherein the temperature detector is used to detect the temperature of the heat-conducting base so that the external main control can control the stepless fan assembly to perform stepless speed change for heat dissipation.

[0025] Compared with the prior art, the present invention has at least the following beneficial effects:

[0026] In the above scheme, by designing the heat dissipation body into an independent single structure, mass production can be carried out. In addition to the use of a single structure, multiple heat dissipation bodies can be combined with the upper limit frame, the lower limit frame, the stepless fan assembly and the support assembly to form radiator structures of different sizes, which not only reduces the production cost but also makes it more convenient to use.

[0027] In the above scheme, an anti-deformation sheet is provided, and after installation, the plug-in rod on the anti-deformation sheet is inserted between two adjacent heat sinks, and the heat sinks are supported by the plug-in rod, thereby increasing the compression and deformation resistance, preventing the heat sinks from being deformed by foreign objects and vibrations, and the heat sinks can be made thinner, reducing material costs. At the same time, the plug-in rod can block the gap at the top of the two heat sinks, allowing more air to flow from the bottom, taking away the high temperature at the bottom and then discharging it from the stepless fan assembly, thereby extending the flow path and improving the heat dissipation efficiency.

[0028] In the above scheme, the stepless fan assembly is sleeved on the top of the support column and the nut is locked. The lower limit frame, the heat dissipation body, the upper limit frame, the support sleeve, the anti-deformation sheet and the stepless fan assembly are fastened together through the cooperation of the nut and the support column. Not only is the assembly convenient, but also due to the support of the support sleeve, the stepless fan assembly can be attached to the surface of the heat dissipation fins without squeezing the heat dissipation fins, so that more air can flow through the gaps between adjacent heat dissipation fins to better take away the heat.

[0029] In the above scheme, the heat of the CPU is dissipated vertically upward from the heat-conducting base and the heat-dissipating fins through the lower surface where the heat-conducting protrusions are located, and the heat of the CPU is conducted horizontally to both sides through the wide flat heat-conducting pipe and then dissipated in the heat-dissipating fins. It can conduct heat horizontally and vertically, accelerate the heat dissipation and cooling speed, and protect the service life of the CUP. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0031] Figure 2 It is a schematic diagram of the three-dimensional bottom-up structure of the present invention;

[0032] Figure 3 It is a schematic diagram of the decomposition structure of the present invention;

[0033] Figure 4 for Figure 3 A schematic diagram of the enlarged structure at A in the middle;

[0034] Figure 5 It is a side view structural schematic diagram of the present invention;

[0035] Figure 6 It is a three-dimensional structural schematic diagram of the heat dissipation body and the double heat-conducting pipe assembly in the present invention;

[0036] Figure 7 is a schematic cross-sectional structure diagram of a dual heat-conducting pipe assembly in the present invention;

[0037] Figure 8 It is a schematic diagram of the cross-sectional structure of the present invention;

[0038] Fig. 9 It is a schematic diagram of a three-dimensional structure of a combination of the present invention;

[0039] Fig.10 It is a schematic diagram of the combined two-dimensional structure of the present invention;

[0040] Figure markings: 1. upper limit frame; 2. lower limit frame; 3. stepless fan assembly; 4. dual heat-conducting pipe body assembly; 5. heat dissipation body; 6. heat-conducting base; 7. heat-conducting fins; 8. heat-conducting protrusions; 9. mounting holes; 10. support assembly; 11. left blind groove; 12. right blind groove; 13. wide flat heat-conducting pipe; 14. circular heat-conducting pipe; 15. through hole; 16. elastic locking device; 17. arc-shaped inner groove; 18. mounting frame; 19. mounting groove; 20. support frame; 21. stepless motor; 22. fan blades; 23. support column; 24. nut; 25. support sleeve; 26. anti-deformation sheet; 27. fixing sheet; 28. plug-in rod; 29. ​​round hole. DETAILED DESCRIPTION

[0041] The following is a detailed description of a high-end computer processor heat sink and a manufacturing method thereof provided by the present invention in conjunction with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternative methods to implement some known technologies; and the accompanying drawings are only for a more specific description of the embodiments, and are not intended to specifically limit the present invention.

[0042] It should be noted that the references to "one embodiment", "embodiment", "exemplary embodiments", "some embodiments" and the like in the specification indicate that the embodiments described may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it should be within the knowledge of a person skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments (whether or not explicitly described).

[0043] In general, a term can be understood, at least in part, from its use in context. For example, depending, at least in part, on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending, at least in part, on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0044] It will be understood that the meaning of “on,” “over,” and “above” in this disclosure should be interpreted in the broadest manner, so that “on” means not only “directly on” something, but also includes the meaning of being “on” something with intervening features or layers therebetween, and “on” or “over” means not only “on” or “above” something, but also includes the meaning of being “on” or “above” something with no intervening features or layers therebetween.

[0045] Additionally, spatially relative terms such as "under," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive convenience to describe the relationship of one element or feature to another element or features, as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially relative descriptors used herein may be similarly interpreted accordingly.

[0046] Embodiment 1:

[0047] like Figure 1-8As shown, an embodiment of the present invention provides a heat sink for a high-end computer processor, comprising an upper limit frame, a lower limit frame, a stepless fan assembly, a temperature detector, a dual heat-conducting pipe assembly and a heat dissipation body, wherein the heat dissipation body comprises a heat-conducting base and a plurality of heat-dissipating fins integrally connected to the upper surface of the heat-conducting base, a heat-conducting protrusion is integrally connected to the lower surface of the heat-conducting base to form a vertical upward heat-conducting heat dissipation, a mounting hole is opened on the lower limit frame, the heat-conducting protrusion is sleeved into the mounting hole, the heat-dissipating body is provided with a dual heat-conducting pipe assembly, and the One end of the dual heat-conducting pipe body assembly is arranged between the heat dissipation fins, and the other end is inserted and arranged at the bottom of the heat-conducting protrusion, and the bottom surface is exposed and flush with the lower surface of the heat-conducting protrusion. A temperature detector is provided on one side of the heat-conducting base, wherein the heat-conducting protrusion is flush with the lower surface of the lower limit frame; support assemblies are provided at the four corners of the lower limit frame, and the heat-conducting base is fixed between the upper limit frame and the lower limit frame through the support assemblies, and the stepless fan assembly is installed at the top of the support assembly, and the temperature detector and the stepless fan assembly are both connected with a serial port for electrical plug-in.

[0048] In this embodiment, in addition to the cooperation between the heat dissipation body, the dual heat-conducting pipe body assembly and the stepless fan assembly to achieve the purpose of efficient heat dissipation, a temperature detector is also used to detect the heat conduction temperature of the heat dissipation body, which can better protect the radiator.

[0049] Among them, Figure 2 , Figure 6 and Figure 7 As shown, the dual heat-conducting pipe body assembly includes a hollow heat-conducting pipe body, a plurality of left blind grooves and right blind grooves are provided on the bottom surface of the heat-conducting protrusion, and the left blind groove and the right blind groove are bidirectionally arranged and staggered. A wide flat heat-conducting pipe is provided at one end of the hollow heat-conducting pipe body, and a circular heat-conducting pipe is provided at one end of the hollow heat-conducting pipe body. The wide flat heat-conducting pipes are respectively arranged in the left blind groove and the right blind groove, and the circular heat-conducting pipes are respectively extended and inserted between the heat-dissipating fins to form heat conduction and heat dissipation on both sides in the horizontal direction. The hollow heat-conducting pipe body is made of pure copper, and its outer surface is gold-plated. The gold-plated hollow heat-conducting pipe body has stronger thermal conductivity.

[0050] In this embodiment, the left blind groove and the right blind groove are used to install the wide flat shape heat pipe. The wide flat shape is conducive to increasing the contact surface with the CPU, improving the heat conduction efficiency, and accelerating the purpose of heat dissipation and cooling. Moreover, the two-way staggered setting avoids the concentrated conduction of single heat, effectively forms the heat conduction on both sides in the horizontal direction and relieves high heat. On the other hand, the lower surface of the heat-conducting protrusion is also in contact with the CPU, and the heat generated by the high-computation CPU can also be conducted away from the heat-conducting base and the heat dissipation fins in the vertical direction, so that the entire radiator can be heat-conducted and cooled in the horizontal and vertical directions, which solves the shortcomings of traditional single heat dissipation and greatly improves the effectiveness of efficient heat dissipation.

[0051] Wherein, the temperature detector is connected to an external main control via the serial port;

[0052] When the temperature detector detects that the temperature of the heat-conducting base is greater than the first warning temperature threshold, the temperature detector sends a signal to the external main control, and the external main control controls the stepless fan assembly to adjust to the first gear of the heat dissipation load;

[0053] When the temperature detector detects that the temperature of the heat-conducting base is greater than the second warning temperature threshold, the temperature is sent to the external main control, and the stepless fan assembly is controlled by the external main control to adjust to the second gear of heat dissipation load;

[0054] When the temperature detector detects that the temperature of the heat-conducting base is greater than the third warning temperature threshold, it is sent to the external main control, and the external main control controls the stepless fan assembly to adjust to the third gear of heat dissipation load and reach a warning reminder.

[0055] For example, idle or light load temperature below 50°C: the normal temperature of most CPUs in idle state or light load, no additional cooling measures are needed, the stepless fan assembly can maintain low speed or silent mode, and it may not be necessary to turn on all radiators;

[0056] Medium load temperature between 50°C - 70°C: The CPU will usually be in this temperature range when processing daily tasks or medium loads. This is the temperature range of most high-performance CPUs when running office software, web browsing or simple multitasking. At this time, the operation control is set to the first gear of the cooling load, and the stepless fan assembly begins to accelerate. Usually no additional intervention is required. The radiator automatically adjusts to maintain a stable temperature;

[0057] High load temperature between 70°C - 80°C: This is the typical temperature when running demanding applications, such as gaming, 3D rendering, large software compilation or video editing. When the temperature rises above 70°C, it is recommended to start improving the cooling efficiency. At this time, the operation control is switched to the second gear of the cooling load. The stepless fan assembly should gradually increase the speed to prevent further temperature rise and accelerate the heat dissipation.

[0058] Overheating critical point temperature is between 80°C - 85°C: When the temperature reaches or exceeds 80°C, it means that the CPU is under high load and may be close to its safe operating limit. Although running in this range for a short period of time will not usually damage the hardware immediately, maintaining this temperature for a long time may affect the life and stability. At this time, the operation is controlled to the third gear of heat dissipation load, and the fan should be fully accelerated to the maximum speed. If the temperature cannot drop quickly, an early warning reminder or manual shutdown operation will be performed.

[0059] The upper limit frame is provided with a through hole for inserting into the upper part of the heat dissipation fin, so that the lower surface of the upper limit frame abuts against the upper end surface of the support assembly for positioning, wherein the through hole is smaller than the size of the heat-conducting base, and the heat-conducting protrusion is smaller than the size of the heat-conducting base. The upper limit frame can be arranged in this way to press the surface of the heat-conducting base, and multiple heat dissipation bodies can be fixed by cooperating with the lower limit frame and the support assembly.

[0060] Among them, Figure 3 , Figure 6 As shown, the four corners of the lower limit frame are equipped with movable elastic locking devices, the four corners of the heat-conducting base are provided with arc-shaped inner grooves, and the arc-shaped inner grooves are used to cooperate with the mounting hole sleeves, and the lower limit frame is made of oxygen-free copper. The elastic locking device can be abutted against the mounting surface that needs heat dissipation, so that the heat dissipation body is in contact with the heat-generating components, so that the lower limit frame has excellent thermal conductivity and will not affect the thermal conductivity effect.

[0061] The stepless fan assembly includes a mounting frame, a mounting slot corresponding to the heat dissipation body is provided on the mounting frame, a support frame is fixedly connected to the inner wall of the mounting slot, a stepless motor is installed on the support frame, and a fan blade is installed at the output end of the stepless motor, wherein the stepless motor is a stepless motor with multi-gear stepless speed regulation. The stepless motor drives the fan blades to rotate and drive the air to flow, and at this time, the air flows through the gaps between adjacent heat dissipation fins to better take away the heat.

[0062] The support assembly includes a support column arranged corresponding to the arc-shaped inner groove, the bottom end of the support column is fixedly connected to the lower limit frame, the top end of the support column sequentially passes through the arc-shaped inner groove, the upper limit frame and the mounting frame and is threadedly connected with a nut, and the outer surface of the support column is sleeved with a support sleeve, and the support sleeve is located between the upper limit frame and the mounting frame. The lower limit frame, the heat dissipation body, the upper limit frame, the support sleeve and the stepless fan assembly are fastened together by the cooperation of the nut and the support column, which is not only convenient for assembly, but also due to the support of the support sleeve, the stepless fan assembly can be attached to the surface of the heat dissipation fins without squeezing the heat dissipation fins.

[0063] Among them, Figure 3 , Figure 4 and Fig. 9As shown, in the present embodiment, in order to avoid the problem that the heat dissipation fins 7 are easily deformed due to their low anti-deformation ability when hit by external objects, strong natural wind force or vibration, an anti-deformation sheet is arranged between the support sleeve and the mounting frame, and the anti-deformation sheet is used to separate two adjacent heat dissipation fins, and the anti-deformation sheet includes a fixing sheet, and a plurality of plug-in rods are fixedly connected to the lower surface of the fixing sheet on the side close to the heat dissipation fins, and the plug-in rods are located between two heat dissipation fins, and a plurality of circular holes are opened on the fixing sheet, and the circular holes are sleeved on the outer surface of the support column, and the plug-in rod and the fixing sheet are bent integrally, and the lower surface of the fixing sheet is in contact with the upper surface of the heat dissipation fin, and the bottom end of the plug-in rod is a conical structure. The heat sink fins are supported by the plug-in rods, which increases the pressure resistance and deformation resistance, prevents the heat sink fins from deformation caused by foreign objects and vibration, and allows the heat sink fins to be made thinner, reducing material costs. At the same time, the plug-in rods can block the gaps at the tops of the two heat sink fins, allowing more air to flow from the bottom, taking away the high temperature at the bottom and discharging it from the stepless fan assembly, thereby extending the flow path and improving heat dissipation efficiency.

[0064] Embodiment 2:

[0065] like Fig. 9 As shown, on the basis of Example 1, if there is a heat dissipation demand for 2 CPUs, mass production can be carried out by designing the heat dissipation body into an independent single structure. When multiple heat dissipation bodies are combined with the upper limit frame, the lower limit frame, the stepless fan assembly and the support assembly, they can be combined into radiator structures of different sizes to meet different heat dissipation needs. Its functional use refers to Example 1.

[0066] Embodiment three:

[0067] like Fig.10 As shown, on the basis of Example 1, if there is a heat dissipation demand for 3 CPUs, mass production can be carried out by designing the heat dissipation body into an independent single structure. When multiple heat dissipation bodies are coordinated with the upper limit frame, the lower limit frame, the stepless fan assembly and the support assembly, they can be combined into radiator structures of different sizes to meet different heat dissipation needs. Its functional use refers to Example 1.

[0068] In summary, in this embodiment, by designing the heat dissipation body into an independent single body structure, mass production can be carried out. In addition to the use of a single structure, multiple heat dissipation bodies can be combined with an upper limit frame, a lower limit frame, a stepless fan assembly and a support assembly to form radiator structures of different sizes, which not only reduces the production cost but also makes it more convenient to use. By providing an anti-deformation sheet, the plug-in rod on the anti-deformation sheet is inserted between two adjacent heat dissipation fins after installation, and the heat dissipation fins are supported by the plug-in rod, thereby increasing the compression and deformation resistance, preventing the heat dissipation fins from being deformed by foreign objects and vibration, and the heat dissipation fins can be made thinner, reducing material costs. At the same time, the plug-in rod can block the gap at the top of the two heat dissipation fins, allowing more air to flow through from the bottom, taking away the high temperature at the bottom and then discharging it from the stepless fan assembly, thereby extending the circulation The heat dissipation efficiency is improved by sleeveing ​​the stepless fan assembly on the top of the support column and tightening the nut; the lower limit frame, the heat dissipation body, the upper limit frame, the support sleeve, the anti-deformation sheet and the stepless fan assembly are fastened together through the cooperation of the nut and the support column, which is not only convenient for assembly, but also because of the support of the support sleeve, the stepless fan assembly can be attached to the surface of the heat dissipation fins without squeezing the heat dissipation fins, so that more air can flow through the gaps between adjacent heat dissipation fins, and heat can be better taken away; through the lower surface where the heat conductive protrusion is located, the CPU heat is vertically transferred upward from the heat conductive base and the heat dissipation fins to dissipate the heat; the wide flat-shaped heat conductive pipe is used to conduct the CPU heat from the horizontal direction to both sides, and then conducts the heat in the heat dissipation fins to dissipate the heat; it can conduct heat in the horizontal and vertical directions, accelerate the heat dissipation and cooling speed, and protect the service life of the CPU.

[0069] In addition, in order to solve the above technical problems, the present invention also provides a method for manufacturing a heat sink for a high-end computer processor, the manufacturing method comprising the following steps:

[0070] S1. Get a lower limit frame and place it on a flat plate, insert one end of the double heat-conducting pipe assembly into the two sides of the bottom of the heat-conducting protrusion respectively, and extend the other end of the double heat-conducting pipe assembly into the heat-dissipating fins respectively, so that the double heat-conducting pipe assembly forms a bidirectional arrangement and is firmly set on the heat-dissipating body;

[0071] S2, apply thermal conductive silicone to the heat-conducting protrusion on the heat-dissipating body and one end surface of the double heat-conducting pipe assembly inserted on both sides of the bottom of the heat-conducting protrusion and place them in the mounting hole on the lower limit frame, at this time, the lower surface of the lower limit frame and the lower surface of the heat-dissipating body are flat surfaces, wherein a temperature detector is preliminarily provided on one side of the heat-conducting base;

[0072] S3, sleeve the upper limit frame on the support assembly, assemble and set the stepless fan assembly, and fasten the upper limit frame and the lower limit frame by screws to form a stable connection;

[0073] S4. The serial ports of the temperature detector and the stepless fan assembly are electrically connected to the external main control, wherein the temperature detector is used to detect the temperature of the heat-conducting base so that the external main control can control the stepless fan assembly to perform stepless speed change for heat dissipation.

[0074] The present invention covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present invention. In order to make the public have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention, but those skilled in the art can fully understand the present invention without the description of these details. In addition, in order to avoid unnecessary confusion about the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0075] A person skilled in the art will appreciate that all or part of the steps in the above-mentioned embodiment method can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc.

[0076] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A heat sink for a high-end computer processor, characterized in that: The heat dissipation device comprises an upper limit frame, a lower limit frame, a stepless fan assembly, a temperature detector, a double heat-conducting pipe body assembly and a heat dissipation body, wherein the heat dissipation body comprises a heat-conducting base and a plurality of heat-dissipating fins integrally connected to the upper surface of the heat-conducting base, and a heat-conducting protrusion is integrally connected to the lower surface of the heat-conducting base to form a vertical upward heat dissipation, and the lower limit frame is provided with a mounting hole, and the heat-conducting protrusion is sleeved into the mounting hole, and the heat dissipation body is provided with a double heat-conducting pipe body assembly, one end of the double heat-conducting pipe body assembly is arranged between the heat-dissipating fins, and the other end is inserted and arranged at the bottom of the heat-conducting protrusion, and the bottom surface is exposed to the outside and is in contact with the lower surface of the heat-conducting protrusion. The surface is flush, and a temperature detector is provided on one side of the heat-conducting base, wherein the heat-conducting protrusion is flush with the lower surface of the lower limit frame; the four corners of the lower limit frame are provided with support components, and the heat-conducting base is fixed between the upper limit frame and the lower limit frame through the support components, and the stepless fan component is installed at the top of the support component, and the temperature detector and the stepless fan component are both connected with a serial port for electrical plug-in; the four corners of the lower limit frame are installed with movable elastic locking devices, and the four corners of the heat-conducting base are provided with arc-shaped inner grooves, and the arc-shaped inner grooves are used to cooperate with the mounting hole sleeve, and the lower limit frame The stepless fan assembly comprises a mounting frame, a mounting groove corresponding to the heat dissipation body is provided on the mounting frame, a support frame is fixedly connected to the inner wall of the mounting groove, a stepless motor is installed on the support frame, and a fan blade is installed at the output end of the stepless motor, wherein the stepless motor is a stepless motor with multi-gear stepless speed regulation; the support assembly comprises a support column arranged corresponding to the arc-shaped inner groove, the bottom end of the support column is fixedly connected to the lower limit frame, the top end of the support column passes through the arc-shaped inner groove, the upper limit frame and the mounting frame in sequence and is threadedly connected with a nut, and the outer surface of the support column is sleeved with a The heat dissipation device is a heat dissipation device, and a heat dissipation device is used to dissipate heat from the heat source, thereby ensuring that the heat dissipation device is in a state of being easily dissipated and easily broken. A method for manufacturing a heat sink for a high-end computer processor comprises the following steps: S1. Get a lower limit frame and place it on a flat plate, insert one end of the double heat-conducting pipe assembly into the two sides of the bottom of the heat-conducting protrusion respectively, and extend the other end of the double heat-conducting pipe assembly into the heat-dissipating fins respectively, so that the double heat-conducting pipe assembly forms a bidirectional arrangement and is firmly set on the heat-dissipating body; S2, apply thermal conductive silicone to the heat-conducting protrusion on the heat-dissipating body and one end surface of the double heat-conducting pipe assembly inserted on both sides of the bottom of the heat-conducting protrusion and place them in the mounting hole on the lower limit frame, at this time, the lower surface of the lower limit frame and the lower surface of the heat-dissipating body are flat surfaces, wherein a temperature detector is preliminarily provided on one side of the heat-conducting base; S3, sleeve the upper limit frame on the support assembly, assemble and set the stepless fan assembly, and fasten the upper limit frame and the lower limit frame by screws to form a stable connection; S4. The serial ports of the temperature detector and the stepless fan assembly are electrically connected to an external main control, wherein the temperature detector is used to detect the temperature of the heat-conducting base so that the external main control can control the stepless fan assembly to perform stepless speed change for heat dissipation.

2. The heat sink for high-end computer processor according to claim 1, characterized in that: The dual heat-conducting pipe body assembly includes a hollow heat-conducting pipe body, a plurality of left blind grooves and right blind grooves are provided on the bottom surface of the heat-conducting protrusion, the left blind grooves and the right blind grooves are bidirectionally arranged and staggered, a wide flat heat-conducting pipe is provided at one end of the hollow heat-conducting pipe body, a circular heat-conducting pipe is provided at one end of the hollow heat-conducting pipe body, the wide flat heat-conducting pipes are respectively arranged in the left blind groove and the right blind groove, and the circular heat-conducting pipes are respectively extended and inserted between the heat-dissipating fins to form heat conduction and heat dissipation on both sides in the horizontal direction, wherein the hollow heat-conducting pipe body is made of pure copper, and its outer surface is gold-plated.

3. The heat sink for high-end computer processor according to claim 1, characterized in that: The temperature detector is connected to the external main control via the serial port; when the temperature detector detects that the temperature of the heat-conducting base is greater than the first warning temperature threshold, it sends a signal to the external main control, and the external main control controls the stepless fan assembly to adjust to the first gear of the heat dissipation load; When the temperature detector detects that the temperature of the heat-conducting base is greater than the second warning temperature threshold, the temperature is sent to the external main control, and the stepless fan assembly is controlled by the external main control to adjust to the second gear of heat dissipation load; When the temperature detector detects that the temperature of the heat-conducting base is greater than the third warning temperature threshold, it is sent to the external main control, and the external main control controls the stepless fan assembly to adjust to the third gear of heat dissipation load and reach a warning reminder.

4. The heat sink for high-end computer processor according to claim 1, characterized in that: The upper limit frame is provided with a through hole for being inserted into the upper part of the heat dissipation fin, so that the lower surface of the upper limit frame is pressed against the upper end surface of the support assembly for limiting, wherein the through hole is smaller than the size of the thermal conductive base, and the thermal conductive protrusion is smaller than the size of the thermal conductive base.

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