Method and related device for deleting PCM area in wafer image

Abstract

The present application provides a method and related device for deleting a PCM area in a wafer map, the method comprising: obtaining an arrangement of the PCM area and the chip in the wafer map; obtaining target image information of the central chip of the wafer map when the PCM area is arranged around the chip; obtaining multiple target lines passing through the central chip; performing the following operations for each of the multiple target lines: determining a standard chip according to the central chip and the current target line, the image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target line and is closest to the central chip; determining the distance between the central chip and the standard chip as the standard distance; determining the PCM area corresponding to the current target line according to the current target line, the target image information and the standard distance; deleting the PCM area corresponding to the current target line. The efficiency of deleting the PCM area in the wafer map can be improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a method and related device for deleting a PCM area in a wafer map. Background Art

[0002] With the development of integrated circuit technology, the chip size is getting smaller and smaller, and the number of chips on wafers of various sizes is increasing. Therefore, there are higher requirements for the test environment and efficiency, which has led to an increase in the process control monitoring (PCM) area produced in the process. This requires manual deletion of the PCM areas in the wafer map in the software in order to achieve the output wafer map consistent with the actual wafer layout. Due to the large number of PCMs, deletion errors may occur when manually deleting, and the efficiency of manually deleting PCM areas is also low. Summary of the invention

[0003] The embodiments of the present application provide a method and related apparatus for deleting a PCM area in a wafer image, so as to improve the efficiency of deleting the PCM area in the wafer image and reduce the operation difficulty of the tester.

[0004] In a first aspect, an embodiment of the present application provides a method for deleting a PCM area in a wafer map, comprising:

[0005] Obtaining the arrangement of PCM areas and chips in the wafer image;

[0006] When the arrangement mode is that the PCM area is arranged around the chip, obtaining target image information of the central chip of the wafer image;

[0007] Acquire a plurality of target straight lines passing through the center chip;

[0008] For each of the plurality of target lines, the following operations are performed:

[0009] A standard chip is determined according to the center chip and the current target straight line, the image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target straight line and is closest to the center chip; the distance between the center chip and the standard chip is determined to be the standard distance; a PCM area corresponding to the current target straight line is determined according to the current target straight line, the target image information and the standard distance; and the PCM area corresponding to the current target straight line is deleted.

[0010] In a second aspect, an embodiment of the present application provides a device for deleting a PCM area in a wafer map, comprising:

[0011] A first acquisition unit is used to acquire the arrangement of the PCM area and the chips in the wafer image;

[0012] A second acquisition unit is used to acquire target image information of a central chip of the wafer image when the arrangement mode is that the PCM area is arranged around the chip;

[0013] A third acquisition unit, used for acquiring a plurality of target straight lines passing through the center chip;

[0014] An execution unit is used to perform the following operations for each of the multiple target lines: determine a standard chip based on the center chip and the current target line, the image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target line and is closest to the center chip; determine the distance between the center chip and the standard chip as the standard distance; determine a PCM area corresponding to the current target line based on the current target line, the target image information and the standard distance; and delete the PCM area corresponding to the current target line.

[0015] In a third aspect, an embodiment of the present application provides an electronic device, comprising a processor, a memory, a communication interface, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor, and the program includes instructions for executing the steps in the first aspect of the embodiment of the present application.

[0016] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having a computer program or instructions stored thereon, wherein the computer program or instructions are executed by a processor to implement the steps in the first aspect of the embodiment of the present application.

[0017] It can be seen that in this embodiment, the electronic device first obtains the arrangement of the PCM area and the chip in the wafer image, and then obtains the target image information of the central chip of the wafer image when the arrangement is that the PCM area is arranged around the chip, and then obtains multiple target straight lines passing through the central chip, and finally performs the following operations for each of the multiple target straight lines: determines a standard chip according to the central chip and the current target straight line, the image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target straight line and is closest to the central chip; determines that the distance between the central chip and the standard chip is the standard distance; determines the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance; deletes the PCM area corresponding to the current target straight line.

[0018] In this way, the electronic device can automatically locate and delete the PCM area in the wafer image based on the arrangement of the PCM area and the chip in the wafer image, which can improve the accuracy of locating the PCM area, while improving the efficiency of deleting the PCM area and reducing labor costs and the difficulty of operation for testers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0021] Figure 2 It is a flowchart of a method for deleting a PCM area in a wafer map provided by an embodiment of the present application;

[0022] Figure 3 It is a schematic diagram of a wafer diagram provided in an embodiment of the present application;

[0023] Figure 4 is another wafer diagram schematic diagram provided in an embodiment of the present application;

[0024] Figure 5 It is a block diagram of functional units of a device for deleting a PCM area in a wafer image provided by an embodiment of the present application;

[0025] Figure 6 It is a block diagram of the functional units of another device for deleting a PCM area in a wafer image provided by an embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0028] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0029] Currently, it is necessary to manually delete the PCM areas in the wafer map in software one by one to ensure that the output wafer map is consistent with the actual wafer layout. Due to the large number of PCMs, manual deletion may result in deletion errors, and the efficiency of manual deletion of PCM areas is also low.

[0030] In response to the above problems, an embodiment of the present application provides a method and a related device for deleting a PCM area in a wafer map. The embodiment of the present application is described in detail below in conjunction with the accompanying drawings.

[0031] See also Figure 1 , Figure 1 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. The electronic device 110 can be used to locate the PCM area in the wafer map, and delete the PCM area in the wafer map based on the positioning. The electronic device 110 includes a processor 120, a memory 130, a communication interface 140, and one or more programs 131, wherein the one or more programs 131 are stored in the above-mentioned memory 130 and are configured to be executed by the above-mentioned processor 120, and the one or more programs 131 include instructions for executing any step in the following method embodiment. In a specific implementation, the processor 120 is used to execute any step performed by the electronic device in the following method embodiment, and when performing data transmission such as sending, the communication interface 140 can be selectively called to complete the corresponding operation.

[0032] See also Figure 2 , Figure 2 The present invention provides a method for deleting a PCM region in a wafer map according to an embodiment of the present invention. The method for deleting a PCM region in a wafer map includes the following steps.

[0033] S210, obtaining the arrangement of PCM regions and chips in the wafer image.

[0034] The arrangement of the PCM area and the chip in the wafer image may include arranging the PCM area around the chip or arranging the PCM area and the chip in an interlaced manner. Figure 3 As shown, Figure 3 The example in FIG. 1 is a wafer image corresponding to the arrangement of the PCM area around the chip. In the wafer image, the black squares represent the PCM area and the white squares represent the chip, that is, the PCM area is arranged around the chip. Figure 4 As shown, Figure 4 The example in the figure shows the wafer diagram corresponding to the arrangement of PCM area and chip interlaced arrangement. In the wafer diagram, a dotted box corresponds to a group, each group includes a PCM area and 8 chips, and then the chips are arranged in the wafer diagram in turn in the unit of the group.

[0035] S220, when the arrangement manner is that the PCM area is arranged around the chip, obtaining target image information of the central chip of the wafer image.

[0036] Among them, before obtaining the target image information, it is necessary to first determine the center chip in the wafer image, and the method for determining the center chip includes: obtaining the image center of the wafer image; determining the chip corresponding to the target image information closest to the image center as the center chip. When obtaining the target image information, you can first obtain the point cloud image of the wafer, then extract the point cloud depth information to obtain the depth image, and then obtain a binary image based on the depth image. There are multiple minimum bounding rectangles in the binary image, and each minimum bounding rectangle corresponds to a chip. That is, the minimum bounding rectangle closest to the center of the image is the target image information, and the chip corresponding to the minimum bounding rectangle is the center chip.

[0037] S230, acquiring a plurality of target straight lines passing through the central chip.

[0038] When acquiring multiple target straight lines, a reference straight line can be acquired first, and then the straight line is rotated at a certain rotation angle until it is rotated back to the reference straight line, thereby obtaining multiple target straight lines. The reference straight line can be a horizontal straight line or a vertical straight line passing through the center chip. In particular, the user can also delete a PCM area in the wafer map, and then determine the straight line passing through the deleted PCM area and the center chip at the same time as the reference straight line.

[0039] After obtaining multiple straight lines, the following operations may be performed for each of the multiple target straight lines. When performing the following operations for each straight line, the following operations may be performed once for each target straight line obtained, or after obtaining multiple target straight lines, the following operations may be performed for each target straight line in sequence.

[0040] S241, determining a standard chip according to the central chip and the current target straight line.

[0041] The image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target straight line and is closest to the center chip. In other words, the standard chip is the smallest bounding rectangle closest to the smallest bounding rectangle corresponding to the center chip on the target straight line. There is a standard chip in the positive direction of the target straight line, and there is also a standard chip in the negative direction of the target straight line.

[0042] S242: Determine that the distance between the central chip and the standard chip is a standard distance.

[0043] Among them, since the wafers in the wafer map are arranged based on the mask plate rules, the distance between all chips is the same, so the standard distance can indicate the spacing between all wafers corresponding to the target straight line in the wafer map.

[0044] S243: Determine a PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance.

[0045] S244, deleting the PCM area corresponding to the current target straight line.

[0046] After the PCM area corresponding to each target straight line is determined, the PCM area is directly deleted, so that all PCM areas in the wafer image can be automatically deleted.

[0047] It can be seen that in this embodiment, based on the arrangement of the PCM area and the chip in the wafer image, the PCM area in the wafer image is automatically located and deleted, which can improve the accuracy of positioning the PCM area, while improving the efficiency of deleting the PCM area, reducing labor costs and the difficulty of operation for testers.

[0048] In a possible embodiment, the method of determining the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance includes: step a: starting from the standard chip, moving the standard distance on the current target straight line to reach the target position; step b: determining whether the image information corresponding to the target position is the same as the target image information; step c: if they are the same as the target image information, determining that the chip corresponding to the target position is the standard chip; repeating steps a to c until the image information corresponding to the target position is different from the target image information; starting from the current standard chip, moving a preset distance on the current target straight line to reach a reference position; when the image information corresponding to the reference position is the same as the preset image information, determining that the reference position is the PCM area corresponding to the current target straight line; when the image information corresponding to the reference position is different from the preset image information, determining that the PCM area corresponding to the current target straight line is empty.

[0049] Among them, on a target straight line, the standard chip can be used as the starting point, and a standard distance can be moved in the positive direction or negative direction of the target straight line respectively, and then the target position can be reached. If the standard chip is not an edge chip of the chip array, the target position corresponds to a chip. That is, if it is determined that the image information corresponding to the target position is the same as the target image information, the next chip to the standard chip is determined. At this time, the next chip is used as the standard chip, and then the current standard chip is used as the starting point, and then a standard distance is moved to reach the next chip. Until the current standard chip is the edge chip of the chip array, after moving a standard distance from the edge chip as the starting point, the image information obtained is no longer consistent with the target image information. At this time, since the PCM area is arranged on the periphery of the chip array, the distance between the PCM area and the chip array can be obtained again, and then the edge chip, that is, the current standard chip, is used as the starting point, and a preset distance is moved to reach the reference position. If the image information corresponding to the reference position is the same as the preset image information corresponding to the PCM area, it is determined that the reference position is the position of the PCM area. If the image information corresponding to the reference position is different from the preset image information, it is considered that there is no PCM area on the target straight line.

[0050] In a specific implementation, when obtaining the preset distance, the position corresponding to the PCM area manually deleted by the user can be obtained first, and then the distance between the manually deleted PCM area and the edge chip on the straight line where the PCM area is located is determined, and the distance is determined as the initial distance. Then, the angle value between the current target straight line and the straight line where the PCM area is located is obtained, and the preset distance corresponding to the current target straight line is determined according to the angle value and the initial distance. In particular, when the angle value is n×90°, the preset distance can be the same as the initial distance.

[0051] It should be noted that when moving the standard distance with the standard chip as the starting point, you can first move in the positive direction or negative direction of the current target line. When you move to the edge chip in the positive direction or negative direction of the current target line and locate the PCM area, then use the first standard chip as the starting point to move in the other direction of the current target line until the PCM area in the positive and negative directions of the current target line is located.

[0052] It can be seen that in this embodiment, the edge chips of the chip array are determined based on the standard chips and standard distances, and then whether there is a PCM area on the current target straight line is determined based on the preset distance and the preset image, and the PCM area is located and deleted, which can improve the accuracy of locating the PCM area and improve the efficiency of deleting the PCM area.

[0053] In a possible embodiment, the obtaining of multiple target straight lines passing through the center chip includes: obtaining a horizontal straight line and a vertical straight line passing through the center chip to obtain two target straight lines; respectively determining the number of the standard chips included in the two target straight lines; determining the chip arrangement of the wafer diagram according to the number of the standard chips included in the two target straight lines; determining a rotation angle according to the chip arrangement; and rotating the reference straight line according to the rotation angle to obtain multiple target straight lines.

[0054] Among them, when determining multiple target lines, two target lines can be first determined based on the horizontal and vertical directions of the center chip, and then the PCM areas corresponding to the two target lines are judged, and then the arrangement of the chip array in the wafer diagram is obtained based on the number of standard chips included in the two target lines. The rotation angle is determined based on the arrangement, and then the reference line is rotated to obtain more target lines. It should be noted that the reference line can be the above-mentioned horizontal line or vertical line, or it can be a line corresponding to a PCM area manually deleted by the user.

[0055] Since the edge chips of the chip array need to be obtained when locating the PCM area corresponding to the target straight line, the number of standard chips included in the horizontal straight line is the number of rows of the chip array, and the number of standard chips included in the vertical straight line is the number of columns of the chip array. The rotation angle can be determined based on the number of rows and columns of the chip array, and the rotation angle can be calculated according to the following formula:

[0056] K=180÷(N+M-2)

[0057] Among them, K is the rotation angle, N is the number of rows of the chip array in the wafer image, and M is the number of columns of the chip array in the wafer image.

[0058] It can be seen that in this embodiment, the rotation angle is determined based on the chip arrangement, so that the peripheral area of ​​the chip array can be judged in detail, the comprehensiveness of the PCM area traversal can be improved, and computing resources can be saved.

[0059] In a possible embodiment, after rotating the horizontal straight line or the vertical straight line according to the rotation angle to obtain multiple target straight lines, the method further includes: acquiring the number of PCM areas corresponding to the L target straight lines; determining the arrangement density of the PCM areas according to the number of the PCM areas; and adjusting the rotation angle according to the arrangement density;

[0060] The Lth target straight line is rotated according to the adjusted rotation angle to obtain multiple target straight lines.

[0061] Among them, the PCM area on each target straight line can be located and deleted each time a target straight line is obtained. Therefore, after the PCM areas on multiple (L) target straight lines are located, the arrangement density of the PCM area can be determined. That is, if the PCM areas on J target straight lines among the L straight lines are determined to be empty, the arrangement density of the PCM area is relatively small, and the rotation angle can be increased accordingly. When determining the rotation angle to be adjusted, the target angle value can be determined based on the arrangement density and the angle value of any two adjacent target straight lines among the L target straight lines. The target angle value is the adjusted rotation angle. Then, the Lth target straight line is used as the reference straight line, and the Lth target straight line is rotated multiple times at the adjusted rotation angle until the rotated target straight line overlaps with the acquired target straight line or the rotated target straight line falls between the acquired target straight lines, and the rotation ends.

[0062] It can be seen that in this embodiment, adjusting the rotation angle based on the arrangement density of the PCM area can save computing resources and improve the efficiency of positioning the PCM area.

[0063] In a possible embodiment, when the arrangement is an interlaced arrangement of the PCM area and the chip, the method further includes: obtaining a basic arrangement array of the PCM area and the chip; dividing the wafer map into a plurality of groups according to the basic arrangement array, each group corresponding to a chip and a PCM area in the basic arrangement array; obtaining group coordinates of each group; obtaining deletion information for a target group, the deletion information being used to delete the PCM area in the target group, the target group being a group among the plurality of groups; determining the coordinates of the PCM area in each group according to the deletion information and the group coordinates of each group; and deleting the PCM area in the wafer map according to the coordinates of the PCM area in each group.

[0064] Among them, since the chips and PCM areas in the wafer map are arranged based on the mask pattern, when the PCM areas and chips are arranged interspersed, the coordinates of the PCM areas in a group can be obtained, and then the coordinates of the PCM areas in each group can be determined based on the coordinate relationship between each group. When dividing the groups, a group includes at least one PCM area and multiple chips, for example Figure 4 As shown in FIG, a small group includes 1 PCM region and 8 chips.

[0065] In a possible embodiment, determining the coordinates of the PCM area in each group based on the deletion information and the group coordinates of each group includes: determining the target coordinates of the PCM area in the target group based on the deletion information; acquiring the group coordinates of the target group; determining a coordinate correspondence relationship based on the group coordinates of the target group and the target coordinates; and determining the PCM area in each group based on the group coordinates of each group and the coordinate correspondence relationship.

[0066] Among them, when determining the group coordinates of each group, the position of the lower left corner in the wafer image can be determined as the coordinate origin of the wafer coordinate system, and the coordinates of the chip corresponding to the center of the group can be determined as the group coordinates of the group. Then, the center of the group can also be determined as the coordinate origin of the group coordinate system corresponding to the group. When the deletion information is obtained, after deleting the PCM area in the target group, the coordinates of the PCM area in the wafer coordinate system can be obtained, and the corresponding coordinates of the PCM area in the group coordinate system can be determined based on the group coordinates of the target group and the target coordinates. The corresponding coordinates indicate the coordinate correspondence between the group coordinates and the target coordinates. Then, each group can be positioned based on the group coordinates in turn, and then the coordinates of the PCM area in each group in the group coordinate system can be determined based on each group's own group coordinate system and corresponding coordinates, and the coordinates of the PCM area in the wafer coordinate system can be obtained based on the coordinates of each PCM area in the group coordinate system, so as to locate and delete each PCM area.

[0067] It can be seen that in this embodiment, the PCM area in each group is located based on the coordinate correspondence, so that the PCM area in the wafer image is automatically deleted, thereby improving the efficiency and accuracy of deleting the PCM area.

[0068] For the above embodiments, please refer to Figure 5 , Figure 5 1 is a block diagram of the functional units of a device for deleting a PCM area in a wafer map provided by an embodiment of the present application. Figure 5As shown, the device 30 for deleting the PCM area in the wafer image includes a first acquisition unit 301, which is used to obtain the arrangement of the PCM area and the chip in the wafer image; a second acquisition unit 302, which is used to obtain the target image information of the center chip of the wafer image when the arrangement is that the PCM area is arranged around the chip; a third acquisition unit 303, which is used to obtain multiple target straight lines passing through the center chip; an execution unit 304, which is used to perform the following operations for each of the multiple target straight lines: determine a standard chip according to the center chip and the current target straight line, the image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target straight line and is closest to the center chip; determine the distance between the center chip and the standard chip as the standard distance; determine the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance; delete the PCM area corresponding to the current target straight line.

[0069] In a possible embodiment, in terms of determining the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance, the execution unit 304 is specifically used for: step a: starting from the standard chip, moving the standard distance on the current target straight line to reach the target position; step b: determining whether the image information corresponding to the target position is the same as the target image information; step c: if they are the same as the target image information, determining that the chip corresponding to the target position is the standard chip; repeating steps a-c until the image information corresponding to the target position is different from the target image information; starting from the current standard chip, moving a preset distance on the current target straight line to reach a reference position; when the image information corresponding to the reference position is the same as the preset image information, determining that the reference position is the PCM area corresponding to the current target straight line; when the image information corresponding to the reference position is different from the preset image information, determining that the PCM area corresponding to the current target straight line is empty.

[0070] In a possible embodiment, in terms of acquiring multiple target straight lines passing through the center chip, the third acquisition unit 303 is specifically used to: acquire a horizontal straight line and a vertical straight line passing through the center chip to obtain two target straight lines; respectively determine the number of the standard chips included in the two target straight lines; determine the chip arrangement of the wafer diagram according to the number of the standard chips included in the two target straight lines; determine a rotation angle according to the chip arrangement; and rotate the reference straight line according to the rotation angle to obtain multiple target straight lines.

[0071] In a possible embodiment, the chip arrangement is used to indicate the number of rows and columns of the chip array in the wafer image. In terms of determining the rotation angle based on the chip arrangement, the third acquisition unit 303 is specifically used to: calculate the rotation angle according to the following formula: K=180÷(N+M-2), wherein K is the rotation angle, N is the number of rows of the chip array in the wafer image, and M is the number of columns of the chip array in the wafer image.

[0072] In a possible embodiment, after rotating the horizontal line or the vertical line according to the rotation angle to obtain multiple target lines, the third acquisition unit 303 is further used to: obtain the number of PCM areas corresponding to L target lines; determine the arrangement density of the PCM areas according to the number of PCM areas; adjust the rotation angle according to the arrangement density; rotate the Lth target line according to the adjusted rotation angle to obtain multiple target lines.

[0073] In a possible embodiment, when the arrangement method is an interlaced arrangement of the PCM area and the chip, the device 30 for deleting the PCM area in the wafer map is also used to: obtain a basic arrangement array of the PCM area and the chip; divide the wafer map into multiple groups according to the basic arrangement array, each group corresponds to a chip and PCM area in a basic arrangement array; obtain group coordinates of each group; obtain deletion information for a target group, the deletion information is used to delete the PCM area in the target group, the target group is a group among the multiple groups; determine the coordinates of the PCM area in each group according to the deletion information and the group coordinates of each group; delete the PCM area in the wafer map according to the coordinates of the PCM area in each group.

[0074] In a possible embodiment, in terms of determining the coordinates of the PCM area in each group based on the deletion information and the group coordinates of each group, the device 30 for deleting the PCM area in the wafer map is also used to: determine the target coordinates of the PCM area in the target group based on the deletion information; obtain the group coordinates of the target group; determine the coordinate correspondence based on the group coordinates of the target group and the target coordinates; and determine the PCM area in each group based on the group coordinates of each group and the coordinate correspondence.

[0075] It can be understood that since the method embodiment and the device embodiment are different presentation forms of the same technical concept, the content of the method embodiment part in this application should be synchronously adapted to the device embodiment part and will not be repeated here.

[0076] In the case of integrated units, see Figure 6 , Figure 6 This is a block diagram of the functional units of another device for deleting a PCM area in a wafer image provided by an embodiment of the present application. Figure 6 In the embodiment, the device 30 for deleting the PCM area in the wafer map includes: a processing module 312 and a communication module 311. The processing module 312 is used to control and manage the actions of the device 30 for deleting the PCM area in the wafer map, for example, to execute the steps of the first acquisition unit 301, the second acquisition unit 302, the third acquisition unit 303 and the execution unit 304, and / or to execute other processes of the technology described herein. The communication module 311 is used for interaction between the device 30 for deleting the PCM area in the wafer map and other devices. Figure 6 As shown, the apparatus 30 for deleting a PCM region in a wafer map may further include a storage module 313, and the storage module 313 is used to store program codes and data of the apparatus 30 for deleting a PCM region in a wafer map.

[0077] Among them, the processing module 312 can be a processor or a controller, for example, a central processing unit (CPU), a general processor, a digital signal processor (DSP), an ASIC, an FPGA or other programmable logic device, a transistor logic device, a hardware component or any combination thereof. It can implement or execute various exemplary logic blocks, modules and circuits described in conjunction with the disclosure of this application. The processor can also be a combination that implements a computing function, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, and the like. The communication module 311 can be a transceiver, an RF circuit or a communication interface, and the like. The storage module 313 can be a memory.

[0078] Among them, all relevant contents of each scenario involved in the above method embodiment can be referred to the functional description of the corresponding functional module, and will not be repeated here. The above device 30 for deleting the PCM area in the wafer map can execute the above Figure 2 A method for deleting the PCM area in the wafer map is shown.

[0079] The above embodiments may be implemented in whole or in part by software, hardware, firmware or any other combination thereof. When implemented using software, the above embodiments may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from one website, computer, server or data center to another website, computer, server or data center by wired or wireless means. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media sets. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium may be a solid-state hard disk.

[0080] An embodiment of the present application also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, wherein the computer program enables a computer to execute part or all of the steps of any method described in the above method embodiments, and the above computer includes an electronic device.

[0081] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0082] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0083] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the above-mentioned units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0084] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0085] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0086] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a memory, including a number of instructions to enable a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the above-mentioned methods in each embodiment of the present application. The aforementioned memory includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or optical disk and other media that can store program codes.

[0087] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above embodiments may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable memory, which may include a flash drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0088] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for deleting a PCM area in a wafer map, characterized in that: include: Obtaining the arrangement of PCM areas and chips in the wafer image; When the arrangement mode is that the PCM area is arranged around the chip, obtaining target image information of the central chip of the wafer image; Acquire a plurality of target straight lines passing through the center chip; For each of the plurality of target lines, the following operations are performed: Determine a standard chip according to the center chip and the current target straight line, the image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target straight line and is closest to the center chip; Determine the distance between the center chip and the standard chip as the standard distance; determine the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance; delete the PCM area corresponding to the current target straight line; Wherein, determining the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance includes: Step a: starting from the standard chip, moving a standard distance on the current target straight line to reach the target position; Step b: determining whether the image information corresponding to the target position is the same as the target image information; Step c: If the information is the same as the target image information, determining that the chip corresponding to the target position is the standard chip; Repeat steps a to c until the image information corresponding to the target position is different from the target image information; Taking the current standard chip as the starting point, moving a preset distance on the current target straight line to reach the reference position; When the image information corresponding to the reference position is the same as the preset image information, determining that the reference position is a PCM area corresponding to the current target straight line; In a case where the image information corresponding to the reference position is different from the preset image information, it is determined that the PCM area corresponding to the current target straight line is empty.

2. The method according to claim 1, characterized in that The step of acquiring a plurality of target straight lines passing through the center chip comprises: Acquire a horizontal straight line and a vertical straight line passing through the center chip to obtain two target straight lines; respectively determining the number of the standard chips included in the two target straight lines; Determining the chip arrangement of the wafer map according to the number of the standard chips included on the two target straight lines; Determine the rotation angle according to the chip arrangement; The reference straight line is rotated according to the rotation angle to obtain a plurality of target straight lines.

3. The method according to claim 2, characterized in that The chip arrangement is used to indicate the number of rows and columns of the chip array in the wafer map, and determining the rotation angle according to the chip arrangement includes: The rotation angle is calculated according to the following formula: K=180÷(N+M-2) Among them, K is the rotation angle, N is the number of rows of the chip array in the wafer image, and M is the number of columns of the chip array in the wafer image.

4. The method according to claim 2 or 3, characterized in that: After rotating the horizontal straight line or the vertical straight line according to the rotation angle to obtain a plurality of target straight lines, the method further includes: Get the number of PCM areas corresponding to L target lines; Determining the arrangement density of the PCM areas according to the number of the PCM areas; adjusting the rotation angle according to the arrangement density; The Lth target straight line is rotated according to the adjusted rotation angle to obtain multiple target straight lines.

5. The method according to claim 1, characterized in that In the case where the arrangement is that the PCM area and the chip are arranged in an interlaced manner, the method further includes: Obtaining a basic arrangement array of the PCM area and the chip; Dividing the wafer map into a plurality of groups according to the basic arrangement array, each group corresponding to a chip and PCM area in a basic arrangement array; Obtaining group coordinates of each group; Acquire deletion information for a target group, where the deletion information is used to delete a PCM area in the target group, where the target group is a group among the multiple groups; Determine the coordinates of the PCM area in each group according to the deletion information and the group coordinates of each group; The PCM regions in the wafer map are deleted according to the coordinates of the PCM regions in each group.

6. The method according to claim 5, characterized in that The determining the coordinates of the PCM area in each group according to the deletion information and the group coordinates of each group includes: Determine the target coordinates of the PCM area in the target group according to the deletion information; Obtaining the group coordinates of the target group; Determine a coordinate correspondence relationship according to the group coordinates of the target group and the target coordinates; The PCM area in each group is determined according to the group coordinates of each group and the coordinate correspondence.

7. A device for deleting a PCM area in a wafer map, characterized in that: include: A first acquisition unit is used to acquire the arrangement of the PCM area and the chip in the wafer image; A second acquisition unit is used to acquire target image information of a central chip of the wafer image when the arrangement mode is that the PCM area is arranged around the chip; A third acquisition unit, used for acquiring a plurality of target straight lines passing through the central chip; an execution unit, configured to perform the following operations for each of the plurality of target lines: determining a standard chip according to the center chip and the current target line, wherein the image information corresponding to the standard chip is the same as the target image information, and the standard chip passes through the current target line and is closest to the center chip; Determine the distance between the center chip and the standard chip as the standard distance; determine the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance; delete the PCM area corresponding to the current target straight line; Wherein, in determining the PCM area corresponding to the current target straight line according to the current target straight line, the target image information and the standard distance, the execution unit is further used for: Step a: starting from the standard chip, moving a standard distance on the current target straight line to reach the target position; Step b: determining whether the image information corresponding to the target position is the same as the target image information; Step c: If the information is the same as the target image information, determining that the chip corresponding to the target position is the standard chip; Repeat steps a to c until the image information corresponding to the target position is different from the target image information; Taking the current standard chip as the starting point, moving a preset distance on the current target straight line to reach the reference position; When the image information corresponding to the reference position is the same as the preset image information, determining that the reference position is a PCM area corresponding to the current target straight line; In a case where the image information corresponding to the reference position is different from the preset image information, it is determined that the PCM area corresponding to the current target straight line is empty.

8. An electronic device, characterized in that: The method comprises a processor, a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor, and the programs include instructions for executing the steps in the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program or instruction stored thereon, characterized in that: The computer program or instructions are executed by a processor to implement the steps of the method according to any one of claims 1 to 6.

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