A packaging structure

Abstract

The present invention discloses a packaging structure comprising: a frame, a chip to be packaged, and a plastic encapsulation layer. The frame comprises a main body and at least one pin, the chip to be packaged being disposed on the surface of the main body; the plastic encapsulation layer is disposed on the surface of the frame where the chip to be packaged is disposed; a first cavity is defined between the plastic encapsulation layer and the frame, the chip to be packaged being disposed in the first cavity; and the plastic encapsulation layer fills the gap between the main body and the pin. This invention prevents the plastic encapsulation layer from catching fire or melting during a short-circuit test, thereby improving the safety of the packaging structure.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to a packaging structure. Background Art

[0002] Plastic packages for semiconductor devices primarily include double flat no-lead packages (DFPs) and quad flat no-lead packages (QFNs). Plastic packages can be categorized by material, including plastic, metal, and ceramic. Compared to metal and ceramic packages, plastic packages offer smaller size, lower cost, and improved process automation, making them the mainstream packaging format in the market.

[0003] Figure 1 It is a top view of the packaging structure. Figure 2 It is a cross-sectional view of a package structure, such as Figure 1 and Figure 2 As shown, a copper-based island 20 in the center of the frame structure supports a chip 23. The portion of the back of the copper-based island 20 not covered by the plastic encapsulation material 24 serves as a heat dissipation channel. The chip 23 is connected to the pin 101 via a copper wire 22, and the chip 23 and the copper wire 22 are encapsulated by the plastic encapsulation material 24. The plastic encapsulation material 24 is flammable. During a short-circuit test of the chip 23, a large current instantaneously flows through the chip 23. The high current generated by the short-circuit of the chip 23 can cause the plastic encapsulation material 24 in contact with the chip 23 to rapidly melt and expand, causing explosions and fires. Summary of the Invention

[0004] The present invention provides a packaging structure to avoid ignition and melting of a plastic packaging layer during a short-circuit test, thereby improving the safety of the packaging structure.

[0005] According to one aspect of the present invention, an embodiment of the present invention provides a packaging structure, including:

[0006] Frame, chip to be packaged and plastic layer;

[0007] The frame includes a main body and at least one pin, and the chip to be packaged is arranged on the surface of the main body;

[0008] The plastic encapsulation layer is arranged on the surface of the frame where the chip to be packaged is arranged. There is a first cavity between the plastic encapsulation layer and the frame, and the chip to be packaged is arranged in the first cavity; and the plastic encapsulation layer fills the gap between the main body and the pins.

[0009] Optionally, at least one pin includes a preset pin, the preset pin is provided with a connector adjacent to a surface of the chip to be packaged, the connector includes an insulating thermal deformation portion and a conductive portion, the insulating thermal deformation portion and the conductive portion are fixedly connected, and one end of the insulating thermal deformation portion is fixedly connected to the preset pin;

[0010] The chip pins of the chip to be packaged are electrically connected to the conductive part through connecting wires; when the temperature is lower than the preset temperature, part of the conductive part contacts the preset pin; when the temperature is higher than or equal to the preset temperature, the volume of the insulating thermal deformation part increases due to the heat, causing the conductive part to separate from the preset pin.

[0011] Optionally, the insulating thermal deformation portion and the conductive portion are located on the same plane, and the conductive portion is provided on a side of the insulating thermal deformation portion adjacent to the chip to be packaged;

[0012] Alternatively, the conductive portion is located on a surface of the insulating thermal deformation portion away from the preset pin, and the conductive portion extends from the surface of the insulating thermal deformation portion away from the preset pin to the surface of the preset pin.

[0013] Optionally, the insulating thermal deformation portion is fixedly connected to the preset pin via a fixing bolt, wherein the fixing bolt penetrates the insulating thermal deformation portion and extends into the preset pin; or, the preset pin has a first protrusion on a surface adjacent to the insulating thermal deformation portion, and the first protrusion is inserted into the insulating thermal deformation portion;

[0014] The conductive part and the insulating thermal deformation part are fixedly connected by an adhesive layer, or the conductive part and the insulating thermal deformation part are fixedly connected by a fixing bolt, or the surface of the conductive part adjacent to the insulating thermal deformation part has a second protrusion, and the second protrusion is inserted into the insulating thermal deformation part.

[0015] Optionally, the connecting member is located in the first cavity; or, a second cavity is provided between the plastic packaging layer and the frame, and the connecting member is located in the second cavity.

[0016] Optionally, the plastic packaging layer includes side walls surrounding the chip to be packaged and the connector, and a top cover arranged on a side of the chip to be packaged and the connector away from the frame, and the top cover and the side walls are integrally connected.

[0017] Optionally, the main body and the chip to be packaged, as well as the pins and the chip to be packaged, are electrically connected via connecting wires; at least a portion of the connecting wires is located within the plastic packaging layer.

[0018] Optionally, the packaging structure further includes:

[0019] a first shielding member;

[0020] The first shielding member is located in the first cavity and is arranged on the surface of the main body; the first shielding member is arranged on at least one side of the chip to be packaged, and the first shielding member is away from the surface of the chip to be packaged and contacts the plastic packaging layer.

[0021] Optionally, the first shielding member includes at least one baffle, which is arranged on the surface of the main body, and each baffle is arranged on one side of the chip to be packaged;

[0022] Alternatively, the first shielding member includes a shielding shell, the shielding shell includes a first surface, a second surface and a third surface, the two edges of the second surface are respectively connected to the first surface and the third surface, the second surface is arranged on the side of the chip to be packaged away from the frame, and the first surface and the third surface are vertically arranged on the frame surface.

[0023] Optionally, the packaging structure further includes:

[0024] a second shielding member;

[0025] The second shielding member is located in the second cavity and is arranged on the surface of the preset pin; the second shielding member is arranged on at least one side of the connector, and the surface of the second shielding member is away from the connector and contacts the plastic packaging layer.

[0026] In an embodiment of the present invention, the frame includes a main body and at least one pin, the chip to be packaged is located on the surface of the main body, the plastic sealing layer is arranged on the surface of the frame where the chip to be packaged is arranged, and fills the gap between the main body and the pin, and a first cavity is provided between the plastic sealing layer and the frame. The chip to be packaged is arranged in the first cavity so that the plastic sealing layer and the chip to be packaged do not contact each other. When the chip to be packaged passes through a large current and generates heat, the air in the first cavity expands and squeezes the plastic sealing layer, causing the plastic sealing layer to explode, thereby preventing the plastic sealing layer from catching fire and melting during a short-circuit test, thereby improving the safety of the packaging structure.

[0027] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a top view of a packaging structure;

[0030] Figure 2 It is a cross-sectional view of a packaging structure;

[0031] Figure 3 is a schematic cross-sectional view of a packaging structure provided by an embodiment of the present invention along a cross section;

[0032] Figure 4 is a schematic cross-sectional view of a packaging structure provided by an embodiment of the present invention along another cross-sectional plane;

[0033] Figure 5 is a schematic cross-sectional view of another packaging structure provided by an embodiment of the present invention along a cross section;

[0034] Figure 6 is a cross-sectional schematic diagram of another packaging structure provided by an embodiment of the present invention along another cross-sectional plane;

[0035] Figure 7 is a cross-sectional view of another packaging structure provided by an embodiment of the present invention;

[0036] Figure 8 1 is a schematic structural diagram of a connector provided by an embodiment of the present invention at room temperature;

[0037] Figure 9 1 is a schematic structural diagram of a connector provided by an embodiment of the present invention under a high temperature state;

[0038] Figure 10 This is a schematic structural diagram of a connector provided by an embodiment of the present invention;

[0039] Figure 11 Schematic diagram of a connection between an insulating thermal deformation portion and a conductive portion provided by an embodiment of the present invention;

[0040] Figure 12 is a schematic diagram of another connection between an insulating thermal deformation portion and a conductive portion provided by an embodiment of the present invention;

[0041] Figure 13 is a cross-sectional schematic diagram of another packaging structure provided by an embodiment of the present invention;

[0042] Figure 14 is a cross-sectional schematic diagram of another packaging structure provided by an embodiment of the present invention;

[0043] Figure 15 This is a schematic diagram of the frame after etching;

[0044] Figure 16 This is a schematic diagram of the frame after plastic sealing;

[0045] Figure 17 It is a schematic diagram of attaching the chip to be packaged on the frame and soldering the connecting wires;

[0046] Figure 18 It is a schematic diagram of the plastic-sealed top cover;

[0047] Figure 19 This is a schematic diagram after the first shielding member is attached. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0049] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the numbers used in this manner are interchangeable where appropriate so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, any variations of the terms "including" and "having" are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to these processes, methods, products, or apparatus.

[0050] An embodiment of the present invention provides a packaging structure. Figure 3 is a schematic cross-sectional view of a packaging structure provided by an embodiment of the present invention along a cross section. Figure 4 is a schematic cross-sectional view of a packaging structure provided by an embodiment of the present invention along another cross-sectional plane. Figure 5 is a schematic cross-sectional view of another packaging structure provided by an embodiment of the present invention along a cross section. Figure 6 FIG. 1 is a cross-sectional diagram of another packaging structure provided by an embodiment of the present invention along another cross-sectional plane. Figure 3-Figure 6 The packaging structure includes: a frame 1, a chip to be packaged 2 and a plastic packaging layer 3; wherein the frame 1 includes a main body 10 and at least one pin 101, and the chip to be packaged 2 is arranged on the surface of the main body 10; the plastic packaging layer 3 is arranged on the surface of the frame 1 where the chip to be packaged 2 is arranged, and a first cavity 4 is provided between the plastic packaging layer 3 and the frame 1, and the chip to be packaged 2 is arranged in the first cavity 4; and the plastic packaging layer 3 fills the gap between the main body 10 and the pin 101.

[0051] in, Figure 3 and Figure 4 These are cross-sectional views of the same package structure along different cross-sections. Figure 5 and Figure 6These are cross-sectional views of the same packaging structure along different cross-sections. The main body 10 and the pins 101 are respectively connected to the chip 2 to be packaged via connecting wires 6. Part of the connecting wires 6 are embedded in the plastic layer 3, or the connecting wires 6 are entirely located within the first cavity 4. The first cavity 4 can be formed by providing a first shielding member 7 on the surface of the frame 1. Specifically, the first shielding member 7 can be provided before providing the plastic layer 3. When the plastic layer 3 is formed, the first cavity 4 is formed under the shielding effect of the first shielding member 7. In addition, the plastic layer 3 can also be formed in stages. For example, the side walls of the plastic layer 3 are first formed, and then a top cover is covered on the side walls. The plastic layer 3 is formed after the side walls and the top cover are connected.

[0052] The main body 10 can serve as a pin 101 for the packaged chip 2. The packaged chip 2 is electrically connected to external devices via at least one pin 101 and the main body 10. The main body 10 also supports and dissipates heat for the packaged chip 2. The plastic encapsulation layer 3 protects the packaged chip 2. Filling the gap between the main body 10 and the pin 101 with the plastic encapsulation layer 3 provides both sealing and insulation, preventing electrical connection between the main body 10 and the pin 101.

[0053] The first cavity 4 accommodates the chip 2 to be packaged, preventing it from contacting the plastic layer 3. Air is contained within the first cavity 4. When a large current flows through the chip 2 to be packaged and generates heat, the air within the first cavity 4 expands and squeezes the plastic layer 3, causing it to rupture and prevent fire. Alternatively, the first cavity 4 can be filled with other heat-expanding gases.

[0054] In an embodiment of the present invention, the frame 1 includes a main body 10 and at least one pin 101. The chip 2 to be packaged is located on the surface of the main body 10. The plastic sealing layer 3 is arranged on the surface of the frame 1 where the chip 2 to be packaged is arranged, and fills the gap between the main body 10 and the pin 101. There is a first cavity 4 between the plastic sealing layer 3 and the frame 1. The chip 2 to be packaged is arranged in the first cavity 4 so that the plastic sealing layer 3 does not contact the chip 2 to be packaged. When the chip 2 to be packaged is heated by a large current, the air in the first cavity 4 expands and squeezes the plastic sealing layer 3, causing the plastic sealing layer 3 to explode, thereby preventing the plastic sealing layer 3 from catching fire and melting during a short-circuit test, thereby improving the safety of the packaging structure.

[0055] Figure 7 is a cross-sectional view of another packaging structure provided by an embodiment of the present invention. Figure 8 1 is a schematic structural diagram of a connector provided by an embodiment of the present invention at room temperature; Figure 9 Schematic diagram of the structure of the connector provided by the embodiment of the present invention under high temperature conditions. Figure 7-Figure 9Optionally, on the basis of the above embodiment, at least one pin 101 includes a preset pin 11, and a connector 5 is provided on the surface of the preset pin 11 adjacent to the chip 2 to be packaged, and the connector 5 includes an insulating thermal deformation part 50 and a conductive part 51, and the insulating thermal deformation part 50 and the conductive part 51 are fixedly connected, and one end of the insulating thermal deformation part 50 is fixedly connected to the preset pin 11; the pin of the chip 2 to be packaged is electrically connected to the conductive part 51 through a connecting wire 6; when the temperature is lower than the preset temperature, a partial area of ​​the conductive part 51 contacts the preset pin 11; when the temperature is greater than or equal to the preset temperature, the volume of the insulating thermal deformation part 50 increases due to heat, so that the conductive part 51 is separated from the preset pin 11.

[0056] The preset pin 11 can be a pin connected to the source, drain, or gate of the chip to be packaged 2, preferably a pin connected to the gate of the chip to be packaged 2. The insulating thermal deformation portion 50 can be made of a thermosensitive non-conductive material. The insulating thermal deformation portion 50 will increase in volume as the temperature rises. When the temperature is lower than the preset temperature, the insulating thermal deformation portion 50 is smaller in size, and part of the conductive portion 51 is in contact with the preset pin 11. The chip to be packaged 2 is in operation. As the heat generated by the chip to be packaged 2 increases, the temperature rises. When the temperature exceeds the preset temperature, the insulating thermal deformation portion 50 increases in volume to a certain extent, driving the conductive portion 51 to move, causing the conductive portion 51 to separate from the preset pin 11, and the chip to be packaged 2 stops working and no longer generates heat.

[0057] In an embodiment of the present invention, by providing an insulating thermal deformation portion 50, the conductive portion 51 is separated from the preset pin 11 at high temperature, so that the chip 2 to be packaged stops working and stops generating heat, further avoiding the plastic sealing layer 3 from catching fire and melting, and further improving the safety of the packaging structure.

[0058] Figure 10 is a structural diagram of a connector provided by an embodiment of the present invention; see Figure 7-10 Optionally, based on the above embodiment, the insulating thermal deformation portion 50 and the conductive portion 51 are located on the same plane, and the conductive portion 51 is provided on a side of the insulating thermal deformation portion 50 adjacent to the chip 2 to be packaged ( Figure 7-Figure 9 ); or, the conductive portion 51 is located on the surface of the insulating thermal deformation portion 50 away from the preset pin 11, and the conductive portion 51 extends from the surface of the insulating thermal deformation portion 50 away from the preset pin 11 to the surface of the preset pin 11 ( Figure 10 ).

[0059] Specifically, Figure 7-Figure 9It is shown that the insulating thermal deformation part 50 and the conductive part 51 are located on the same plane, and the insulating thermal deformation part 50 and the conductive part 51 are arranged side by side on the surface of the preset pin 11. At high temperature, the size of the insulating thermal deformation part 50 increases in a direction parallel to the surface of the preset pin 11, pushing the conductive part 51 to move, so that the conductive part 51 is separated from the preset pin 11.

[0060] Figure 10 It is shown that the conductive part 51 is located on the surface of the insulating thermal deformation part 50 away from the preset pin 11. At high temperature, the size of the insulating thermal deformation part 50 in the direction perpendicular to the surface of the preset pin 11 increases, so that the height of the conductive part 51 is increased, and the conductive part 51 is separated from the preset pin 11.

[0061] In an embodiment of the present invention, by arranging the insulating thermal deformation portion 50 and the conductive portion 51 to be located on the same plane, or by arranging the conductive portion 51 to be located on the surface of the insulating thermal deformation portion 50 away from the preset pin 11, the conductive portion 51 is separated from the preset pin 11 at a high temperature, thereby avoiding the subsequent chip 2 to be packaged from continuing to generate heat and causing the packaging layer 3 to catch fire and melt.

[0062] Figure 11 Schematic diagram of a connection between an insulating thermal deformation portion and a conductive portion provided by an embodiment of the present invention; Figure 12 This is a schematic diagram of another embodiment of the present invention providing a connection between an insulating thermal deformation portion and a conductive portion, see Figures 9-12 Optionally, based on the above embodiment, the insulating thermal deformation portion 50 is fixedly connected to the preset pin 11 through a fixing bolt 52, wherein the fixing bolt 52 penetrates the insulating thermal deformation portion 50 and extends into the preset pin 11 ( Figure 9-10 ); or, the preset pin 11 is adjacent to the surface of the insulating thermal deformation portion 50 having a first protrusion 53, the first protrusion 53 is inserted into the insulating thermal deformation portion 50 ( Figure 11 ).

[0063] The conductive part 51 and the insulating thermal deformation part 50 are fixedly connected by the adhesive layer 55 ( Figure 11 ), or, the conductive portion 51 and the insulating thermal deformation portion 50 are fixedly connected by a fixing bolt 52 ( Figure 10 ), or, the conductive portion 51 has a second protrusion 54 on the surface adjacent to the insulating thermal deformation portion 50, and the second protrusion 54 is inserted into the insulating thermal deformation portion 50 ( Figure 12 ).

[0064] This arrangement ensures that the insulating thermal deformation portion 50 and the preset pin 11, as well as the insulating thermal deformation portion 50 and the conductive portion 51 are firmly connected to avoid falling off.

[0065] Figure 13 is a cross-sectional schematic diagram of another packaging structure provided by an embodiment of the present invention, Figure 14This is a cross-sectional schematic diagram of another packaging structure provided by an embodiment of the present invention, see Figure 7 and Figure 13-14 Optionally, based on the above embodiment, the connecting member 5 is located in the first cavity 4 ( Figure 7 ); or, there is a second cavity 8 between the plastic layer 3 and the frame 1, and the connecting member 5 is located in the second cavity 8 ( Figure 13 and Figure 14 ).

[0066] In an embodiment of the present invention, the connector 5 is arranged in the first cavity 4, or the connector 5 is arranged in the second cavity 8, so that there is a gap between the connector 5 and the plastic packaging layer 3, so that the insulating thermal deformation part 50 has deformation space at high temperature and the conductive part 5 has movement space, ensuring that the conductive part 51 can be separated from the preset pin 11 at high temperature, avoiding the subsequent chip 2 to be packaged to continue to generate heat and cause the packaging layer 3 to catch fire and melt.

[0067] See also Figure 7 Optionally, based on the above embodiment, the plastic encapsulation layer 3 includes a side wall 30 surrounding the chip 2 to be packaged and the connector 5, and a top cover 31 arranged on the side of the chip 2 to be packaged and the connector 5 away from the frame 1, and the top cover 31 and the side wall 30 are integrally connected.

[0068] The plastic encapsulation layer 3 also includes a portion disposed between the pins 101 and the main body 10. After the sidewalls 30 and the top cover 31 are integrally connected, the space between the top cover 31, the sidewalls 30, and the frame 1 forms a first cavity 4. When manufacturing the package structure, the chip 2 to be packaged can be placed on the frame 1, followed by forming the sidewalls 30 and the plastic encapsulation layer between the pins 101 and the main body 10. Finally, the top cover 31 is installed to complete the entire plastic encapsulation layer 3.

[0069] In the embodiment of the present invention, the chip to be packaged 2 and the connector 5 can be arranged in the first cavity 4. The space of the first cavity 4 is larger, the distance between the plastic encapsulation layer 3 and the structure to be packaged 2 is farther, the plastic encapsulation layer 3 is less likely to catch fire and melt, and the connector 5 and the chip to be packaged 2 are in the same cavity and have the same temperature. When the temperature rises, the connector 5 can disconnect the connection between the chip to be packaged 2 and the preset pin 11 more quickly, so that the chip to be packaged 2 stops working faster, further avoiding the subsequent chip to be packaged 2 continuing to generate heat and causing the packaging layer 3 to catch fire and melt.

[0070] See also Figure 3 and Figure 5 Optionally, based on the above embodiment, the main body 10 and the chip to be packaged 2, as well as the preset pins 11 and the chip to be packaged 2 are electrically connected through connecting wires 6; at least part of the connecting wires 6 is located in the plastic packaging layer 3.

[0071] Specifically, such as Figure 3 and Figure 5 As shown, when the heat generated by the chip 2 to be packaged in the first cavity 4 is too great, the air in the first cavity 4 will expand, causing the plastic layer 3 to burst. At this time, part of the connecting wire 6 in the plastic layer 3 will be disconnected, blocking the connection between the chip 2 to be packaged and the preset pin 11. The chip 2 to be packaged will stop working, thus preventing the subsequent chip 2 to be packaged from continuing to generate heat and causing fire and melting. Figure 13 and Figure 14 As shown, when at least part of the connecting line 6 is located in the plastic packaging layer 3 and the connector 5 is located at the preset pin 11, double protection of the plastic packaging layer 3 is achieved, further improving the safety of the packaging structure.

[0072] See also Figure 4-Figure 6 Optionally, based on the above embodiment, the packaging structure further includes: a first shielding member 7; the first shielding member 7 is located in the first cavity 4, and the first shielding member 7 is arranged on the surface of the main body 10; the first shielding member 7 is arranged on at least one side of the chip 2 to be packaged, and the first shielding member 7 is away from the surface of the chip 2 to be packaged and contacts the plastic layer 3.

[0073] Specifically, the first shielding member 7 is used to block the molding material during the process of forming the molding layer 3, so that the first cavity 4 is formed on one side of the first shielding member 7. By forming the molding layer 3 in the form of the first shielding member 7, the preparation process of the packaging structure is simplified.

[0074] Optionally, based on the above embodiment, refer to Figure 4 , the first shielding member 7 includes at least one baffle, the baffle is arranged on the surface of the main body 10, and each baffle is arranged on one side of the chip 2 to be packaged; or, referring to Figure 5 and Figure 6 The first shielding member 7 includes a shielding shell, which includes a first surface 71, a second surface 72 and a third surface 73. The two edges of the second surface 72 are respectively connected to the first surface 71 and the third surface 73. The second surface 72 is arranged on the side of the chip 2 to be packaged away from the frame 1, and the first surface 71 and the third surface 73 are vertically arranged on the surface of the frame 1.

[0075] The baffle and the shielding shell are both used to block the plastic packaging material, and the first cavity is formed under the shielding effect of the baffle and the shielding shell. The embodiment of the present invention simplifies the process of forming the first cavity by providing the baffle and the shielding shell.

[0076] See also Figure 13 and Figure 14Optionally, based on the above embodiment, the packaging structure further includes: a second shielding member 9; the second shielding member 9 is located in the second cavity 8, and the second shielding member is arranged on the surface of the preset pin 11; the second shielding member 9 is arranged on at least one side of the connector 5, and the second shielding member 9 is away from the surface of the connector 5 and contacts the plastic layer 3.

[0077] The second shielding member 9 is used to form the second cavity 8. The second shielding member 9 may be a baffle or a shielding shell. By providing the second shielding member 9, the second cavity 8 and the first cavity 4 can be formed in the same process, simplifying the process.

[0078] Figure 15-18 Shown Figure 7 The formation process of the package structure shown in Figure 15 This is a schematic diagram after the frame is etched. Figure 16 This is a schematic diagram of the frame after plastic sealing. Figure 17 It is a schematic diagram of attaching the chip to be packaged and welding the connecting wires on the frame. Figure 18 This is a schematic diagram of the plastic top cover, see Figure 15 , providing a frame 1, and forming a main body 10 and pins 101 on the frame 1 by an etching process. Figure 16 , the plastic layer 3 is plastic-sealed on the frame 1 to form the side wall 30, and the connector is fixed on the pin 101. Figure 17 , attach the chip 2 to be packaged to the main body 10, and solder the connecting wires to connect the chip 2 to the pins 101. Figure 18 , attach the plastic cover 31, then electroplate tin on the surface of the pin 101 away from the connector, and cut it into single pieces to form Figure 7 The package structure shown.

[0079] Figure 19 This is a schematic diagram after the first shielding member is attached; Figure 15 and Figure 19 Shown Figure 3 and Figure 4 The formation process of the package structure shown in Figure 15 , providing a frame 1, and forming a main body 10 and preset pins 11 on the frame 1 by etching process. Figure 19 , attach the chip 2 to be packaged to the main body 10, attach the first shielding member 7 to one side of the chip 2 to be packaged, and weld the connecting wires to connect the chip 2 to the preset pins 11. Figure 3 and Figure 4 , the plastic layer 3 is plastic-sealed on the frame 1. Due to the effect of the baffle, the plastic mold flow is affected to form a first cavity. Then, tin is electroplated on the surface of the preset pin 11 away from the chip 2 to be packaged, and it is cut into single pieces to form Figure 3 and Figure 4 The package structure shown.

[0080] Figure 5 and Figure 6 The packaging structure formation process and Figure 3 and Figure 4 The formation process of the structure shown is similar and will not be repeated here.

[0081] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0082] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A packaging structure, characterized in that: include: Frame, chip to be packaged and plastic layer; The frame includes a main body and at least one pin, and the chip to be packaged is arranged on the surface of the main body; The plastic encapsulation layer is arranged on the surface of the frame on which the chip to be packaged is arranged, a first cavity is defined between the plastic encapsulation layer and the frame, and the chip to be packaged is arranged in the first cavity; and the plastic encapsulation layer fills the gap between the main body and the pins; The at least one pin includes a preset pin, wherein the preset pin is provided with a connector adjacent to a surface of the chip to be packaged, the connector including an insulating thermal deformation portion and a conductive portion, the insulating thermal deformation portion and the conductive portion are fixedly connected, and one end of the insulating thermal deformation portion is fixedly connected to the preset pin; The chip pins of the chip to be packaged are electrically connected to the conductive part through connecting wires; when the temperature is lower than a preset temperature, a partial area of ​​the conductive part contacts the preset pin; when the temperature is greater than or equal to the preset temperature, the volume of the insulating thermal deformation part increases due to heat, causing the conductive part to separate from the preset pin.

2. The packaging structure according to claim 1, wherein: The insulating thermal deformation portion and the conductive portion are located on the same plane, and the conductive portion is provided on a side of the insulating thermal deformation portion adjacent to the chip to be packaged; Alternatively, the conductive portion is located on a surface of the insulating thermal deformation portion away from the preset pin, and the conductive portion extends from the surface of the insulating thermal deformation portion away from the preset pin to the surface of the preset pin.

3. The packaging structure according to claim 1, wherein: The insulating thermal deformation portion is fixedly connected to the predetermined pin via a fixing bolt, wherein the fixing bolt penetrates the insulating thermal deformation portion and extends into the predetermined pin; or the predetermined pin has a first protrusion on a surface adjacent to the insulating thermal deformation portion, and the first protrusion is inserted into the insulating thermal deformation portion; The conductive part and the insulating thermal deformation part are fixedly connected by an adhesive layer, or the conductive part and the insulating thermal deformation part are fixedly connected by a fixing bolt, or the surface of the conductive part adjacent to the insulating thermal deformation part has a second protrusion, and the second protrusion is inserted into the insulating thermal deformation part.

4. The packaging structure according to claim 1, wherein: The connecting member is located in the first cavity; or, a second cavity is provided between the plastic packaging layer and the frame, and the connecting member is located in the second cavity.

5. The packaging structure according to claim 1, wherein: The plastic packaging layer includes a side wall surrounding the chip to be packaged and the connector, and a top cover arranged on a side of the chip to be packaged and the connector away from the frame, and the top cover and the side wall are integrally connected.

6. The packaging structure according to claim 1, wherein: The main body and the chip to be packaged, as well as the pins and the chip to be packaged, are electrically connected via connecting wires; at least a portion of the connecting wires is located within the plastic packaging layer.

7. The packaging structure according to claim 6, wherein: Also includes: a first shielding member; The first shielding member is located in the first cavity, and the first shielding member is provided on the surface of the main body; The first shielding member is disposed on at least one side of the chip to be packaged, and the first shielding member is away from the surface of the chip to be packaged and in contact with the plastic packaging layer.

8. The packaging structure according to claim 7, wherein: The first shielding member includes at least one baffle, which is arranged on the surface of the main body, and each baffle is arranged on one side of the chip to be packaged; Alternatively, the first shielding member includes a shielding shell, the shielding shell includes a first surface, a second surface and a third surface, the two edges of the second surface are respectively connected to the first surface and the third surface, the second surface is arranged on the side of the chip to be packaged away from the frame, and the first surface and the third surface are vertically arranged on the surface of the frame.

9. The packaging structure according to claim 4, wherein: Also includes: a second shielding member; The second shielding member is located in the second cavity, and the second shielding member is provided on the surface of the preset pin; The second shielding member is disposed on at least one side of the connecting member, and a surface of the second shielding member away from the connecting member is in contact with the plastic packaging layer.

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