Heating table of vacuum heating device and vacuum heating device

Abstract

The present application relates to a heating platform of a vacuum heating device and a vacuum heating device. The heating platform includes a support mechanism, a heating head, and a heat buffer assembly; the heating head and the support mechanism are arranged opposite to each other; the heat buffer assembly includes a first partition, a second partition, a third partition, a plurality of first clamping parts, and a plurality of second clamping parts. The first partition, the second partition, and the third partition are arranged in sequence along the direction from the support mechanism to the heating head. The first partition and the third partition are connected to the support mechanism, and the second partition is connected to the heating head. The first clamping part and the second clamping part are respectively arranged between the first partition and the second partition and between the third partition and the second partition to clamp the second partition between the first partition and the third partition. The first clamping part is in line contact or point contact with the first partition and the second partition, and the second clamping part is in line contact or point contact with the third partition and the second partition.

Description

Technical Field

[0001] The present application relates to the technical field of heating devices, and in particular to a heating platform and a vacuum heating device. Background Art

[0002] Heating materials or processing substrates within a vacuum chamber is a common experimental method used in disciplines such as semiconductors, physics, and materials science. Some experiments require sample heating temperatures exceeding 1000°C, which also causes the many support structures to reach very high temperatures. At high temperatures, these support structures will release gases, affecting the vacuum level and contaminating the growing sample. Currently, water cooling is generally used to reduce the temperature of the support structures, but this reduces the maximum heating temperature. Summary of the Invention

[0003] Based on this, it is necessary to provide a heating table and a vacuum heating device for the above technical problems.

[0004] A heating platform of a vacuum heating device, comprising:

[0005] Support mechanism;

[0006] a heating head, the heating head being arranged opposite to the supporting mechanism; and

[0007] A heat buffer assembly, the heat buffer assembly includes a first partition, a second partition, a third partition, a plurality of first clamping parts and a plurality of second clamping parts, the first partition, the second partition and the third partition are arranged in sequence along the direction from the support mechanism to the heating head, the first partition and the third partition are connected to the support mechanism, the second partition is connected to the heating head, the first clamping part and the second clamping part are respectively arranged between the first partition and the second partition and between the third partition and the second partition to clamp the second partition between the first partition and the third partition, wherein the first clamping part is in line contact or point contact with the first partition and the second partition, and the second clamping part is in line contact or point contact with the third partition and the second partition.

[0008] In one embodiment, the heating platform further comprises a plurality of first support rods along the circumference of the support mechanism, wherein the first support rods comprise a first mounting section connected to the support mechanism and a first connecting section opposite to the first mounting section;

[0009] The first partition is provided with a plurality of first mounting holes along the circumference of the support mechanism, the second partition is provided with a plurality of second mounting holes along the circumference of the support mechanism, and the third partition is provided with a plurality of third mounting holes along the circumference of the support mechanism. The first mounting hole, the second mounting hole and the third mounting hole are all used for the corresponding first connecting section to pass through; wherein, a first annular gap is formed between the hole wall of the second mounting hole and the corresponding first connecting section.

[0010] In one embodiment, the diameter of the first mounting section is larger than the diameter of the first connecting section, so that the first support rod forms a first stepped surface facing the first partition, the first partition has a first surface facing the support mechanism, and the first surface abuts against the first stepped surface; and / or,

[0011] The heating platform further includes a plurality of first threaded members. The first locking members are located on a side of the third partition facing away from the second partition and are threadedly connected to the corresponding first connecting sections.

[0012] In one embodiment, the heating platform further includes a plurality of second support rods along the circumference of the support mechanism, the second support rods including a second mounting section connected to the heating head and a second connecting section opposite to the second mounting section;

[0013] The second partition plate is provided with a plurality of fourth mounting holes along the circumference of the support mechanism, and the third partition plate is provided with a plurality of fifth mounting holes along the circumference of the support mechanism. The fourth mounting holes and the fifth mounting holes are both used for the corresponding second connecting section to pass through; wherein, a second annular gap is formed between the hole wall of the fifth mounting hole and the corresponding second connecting section.

[0014] In one embodiment, the second connecting section has a connecting section end away from the second mounting section, and the diameter of a portion of the second connecting section adjacent to the connecting end is larger than the diameter of the connecting end, so that the second connecting section forms a second stepped surface facing the second partition plate, and the second partition plate has a second surface facing the heating head, and the second surface abuts against the second stepped surface; and / or,

[0015] The heating platform further includes a plurality of second threaded members, each of which is located between the first baffle and the second baffle and is threadedly connected to the corresponding second connecting segments.

[0016] In one embodiment, the first partition plate is provided with a plurality of first accommodating holes along the circumference of the support mechanism, and the second partition plate is provided with a plurality of second accommodating holes along the circumference of the support mechanism;

[0017] The first clamping portion is a spherical structure, and the first clamping portion is inserted into the corresponding first accommodating hole and the corresponding second accommodating hole in a line contact manner; or,

[0018] The first clamping portion is a double pyramid structure, and the second clamping portion is inserted into the corresponding second accommodating hole in a point contact manner.

[0019] In one embodiment, the third partition plate is provided with a plurality of third accommodating holes along the circumference of the support mechanism; the second partition plate is provided with a plurality of fourth accommodating holes along the circumference of the support mechanism;

[0020] The second clamping portion is a spherical structure, and the second clamping portion is inserted into the corresponding third accommodating hole and the corresponding fourth accommodating hole in a line contact manner; or,

[0021] The second clamping portion is a double pyramid structure, and the second clamping portion is inserted into the corresponding third accommodating hole and the corresponding fourth accommodating hole in a point contact manner.

[0022] In one embodiment, the orthographic projections of the first clamping portion and the second clamping portion on the second partition plate are staggered along the circumference of the second partition plate.

[0023] In one embodiment, the first clamping portion and the second clamping portion are made of insulating material.

[0024] A vacuum heating device comprising: a vacuum chamber, a displacement stage, and a heating stage as described above;

[0025] The translation stage is movably disposed in the vacuum chamber;

[0026] The heating stage is located in the vacuum chamber, and the supporting mechanism of the heating stage is connected to the displacement stage.

[0027] The above-mentioned heating table is additionally provided with a heat buffer component between the support mechanism and the heating head. The heat buffer component can clamp the second partition between the first partition and the third partition through the cooperation of the first clamping part and the second clamping part, so that the support mechanism can stably support the heating head; in addition, by making the first clamping part in line contact or point contact with the first partition and the second partition, and the second clamping part in line contact or point contact with the third partition and the second partition, the contact mode between the support mechanism and the heating head is adjusted from surface contact to line contact or point contact, reducing the contact area between the support mechanism and the heating head, and greatly reducing the rate at which the heating head transfers heat to the support mechanism. Under the same heating power, the temperature of the sample can be made higher and the temperature of the support mechanism lower, which can greatly reduce the rate at which the support mechanism releases gas, greatly reducing the contamination effect on the growing sample. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic structural diagram of a heating platform of a vacuum heating device provided in one embodiment of the present application.

[0029] Figure 2 This is a schematic structural diagram of a vacuum heating device provided in one embodiment of the present application.

[0030] Figure 3 for Figure 2 A partially exploded schematic diagram of the vacuum heating device provided.

[0031] Figure 4 for Figure 1 A partial enlarged schematic diagram of the heating stage at point A is provided.

[0032] Figure 5 This is a schematic structural diagram of the first clamping portion provided in another embodiment of the present application.

[0033] Figure 6 for Figure 3 A partial enlarged schematic diagram of the vacuum heating device at point B is provided.

[0034] The reference numerals in the accompanying drawings are described as follows:

[0035] 10. Vacuum heating device; 100. Heating table; 110. Support mechanism; 120. Heating head; 121. Mounting shell; 122. Heating body; 1221. Heating filament; 123. Sample holder base; 123a. Opening; 124. Sample holder; 130. Heat buffer assembly; 131. First partition; 131a. First accommodating hole; 132. Second partition; 132a. Fourth accommodating hole; 133. Third partition; 134. First clamping portion; 135. Second clamping portion; 140. First support rod; 141. First mounting section; 142. First connecting section; 150. Second support rod; 151. Second mounting section; 152. Second connecting section; 1521. Connecting end; 160. First threaded member; 170. Second threaded member; 200. Translation stage; 210. Voltage connector; 220. Current connector. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0038] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0039] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0042] like Figure 1 As shown, an embodiment of the present application provides a heating platform 100 of a vacuum heating device 10, the heating platform 100 includes a support mechanism 110, a heating head 120 and a heat buffer assembly 130; the heating head 120 is arranged opposite to the support mechanism 110; the heat buffer assembly 130 includes a first baffle 131, a second baffle 132, a third baffle 133, a plurality of first clamping portions 134 and a plurality of second clamping portions 135, the first baffle 131, the second baffle 132 and the third baffle 133 are arranged in sequence along the direction from the support mechanism 110 to the heating head 120, and the first baffle 131, the second baffle 132 and the third baffle 133 are arranged in sequence along the direction from the support mechanism 110 to the heating head 120, and the first baffle 131, the second baffle 132 and the third baffle 133 are arranged in sequence. 31. The third partition 133 is connected to the supporting mechanism 110, the second partition 132 is connected to the heating head 120, and the first clamping portion 134 and the second clamping portion 135 are respectively arranged between the first partition 131 and the second partition 132 and between the third partition 133 and the second partition 132 to clamp the second partition 132 between the first partition 131 and the third partition 133, wherein the first clamping portion 134 is in line contact or point contact with the first partition 131 and the second partition 132, and the second clamping portion 135 is in line contact or point contact with the third partition 133 and the second partition 132.

[0043] The heating stage 100 can be applied to a vacuum heating device 10 such as a high temperature electron beam heating device. Figure 2 and Figure 3 As shown, the support mechanism 110 of the heating platform 100 is connected to the translation stage 200 of the high-temperature electron beam heating device, and the heating head 120 is used to receive and heat the sample. The structure of the heating platform 100 is described below using the high-temperature electron beam heating device as an example.

[0044] The heating table 100 is provided with a heat buffer assembly 130 between the support mechanism 110 and the heating head 120. The heat buffer assembly 130 can clamp the second partition 132 between the first partition 131 and the third partition 133 through the cooperation of the first clamping portion 134 and the second clamping portion 135, so that the support mechanism 110 can stably support the heating head 120. In addition, by making the first clamping portion 134 in line contact or point contact with the first partition 131 and the second partition 132, the second clamping portion 135 in line contact with the third partition 133 and the third partition 133, The second partition 132 is in line contact or point contact, so that the contact mode between the support mechanism 110 and the heating head 120 is adjusted from surface contact to line contact or point contact, reducing the contact area between the support mechanism 110 and the heating head 120, which can greatly reduce the rate at which the heating head 120 transfers heat to the support mechanism 110. Under the same heating power, the temperature of the sample can be made higher and the temperature of the support mechanism 110 can be made lower, which can greatly reduce the rate at which the support mechanism 110 releases gas, thereby greatly reducing the pollution impact on the growing sample.

[0045] In some embodiments, as Figure 1 and Figure 4 As shown, the heating platform 100 further includes a plurality of first support rods 140 along the circumference of the support mechanism 110. The first support rods 140 include a first mounting section 141 connected to the support mechanism 110 and a first connecting section 142 opposite the first mounting section 141. The first partition 131 is provided with a plurality of first mounting holes along the circumference of the support mechanism 110, the second partition 132 is provided with a plurality of second mounting holes along the circumference of the support mechanism 110, and the third partition 133 is provided with a plurality of third mounting holes along the circumference of the support mechanism 110. The first mounting holes, the second mounting holes, and the third mounting holes are all used to allow the corresponding first connecting sections 142 to pass through. A first annular gap is formed between the hole wall of the second mounting hole and the corresponding first connecting section 142. By sequentially passing the first support rods 140 through the first partition 131, the second partition 132, and the third partition 133, the connection between the support mechanism 110 and the first partition 131 and the third partition 133 is achieved. This connection method can make the structure of the heating platform 100 compact. It should be noted that the first annular gap between the hole wall of the second mounting hole and the corresponding first connecting section 142 is used for heat insulation.

[0046] The number of first, second, and third mounting holes is the same, and they correspond one-to-one, so that each first mounting hole is aligned with the corresponding second and third mounting holes along the direction from the support mechanism 110 to the heating head 120. The number of first, second, and third mounting holes can be 2, 3, 4, 5, or more, without specific limitation, as long as the support mechanism 110 can stably support the heating head 120. The first, second, and third mounting holes can be evenly distributed along the circumference of the support mechanism 110 to ensure stable support of the heating head 120 by the support mechanism 110.

[0047] Furthermore, if Figure 4 As shown, in some embodiments, the diameter of the first mounting section 141 is larger than the diameter of the first connecting section 142, so that the first support rod 140 forms a first stepped surface facing the first partition 131, and the first partition 131 has a first surface facing the support mechanism 110, the first surface abutting the first stepped surface. Furthermore, the heating platform 100 further includes a plurality of first threaded members 160, each located on a side of the third partition 133 facing away from the second partition 132 and threadedly connected to a corresponding first connecting section 142. The cooperation between the first stepped surface and the first threaded members 160 allows the first and third partitions 131, 133 to be mounted on the first support rod 140, preventing them from moving along the support mechanism 110 toward the heating head 120 and preventing the first clamping portion 134 and the second clamping portion 135 from falling off, thereby ensuring the stability of the support mechanism 110 supporting the heating head 120.

[0048] The first threaded member 160 may be a nut, and the end of the first connecting section 142 is provided with a thread matching the nut.

[0049] In some embodiments, as Figure 1 and Figure 4As shown, the heating platform 100 also includes a plurality of second support rods 150 along the circumference of the support mechanism 110. The second support rods 150 include a second mounting section 151 connected to the heating head 120 and a second connecting section 152 opposite the second mounting section 151. The second partition 132 is provided with a plurality of fourth mounting holes along the circumference of the support mechanism 110, and the third partition 133 is provided with a plurality of fifth mounting holes along the circumference of the support mechanism 110. Both the fourth and fifth mounting holes are configured to allow the passage of corresponding second connecting sections 152. A second annular gap is formed between the wall of the fifth mounting hole and the corresponding second connecting section 152. By sequentially passing the second support rods 150 through the third and second partitions 133, 132, the connection between the heating head 120 and the second partition 132 is achieved. This connection method makes the heating platform 100 compact. It should be noted that the second annular gap between the wall of the fifth mounting hole and the corresponding second connecting section 152 serves for thermal insulation.

[0050] The fourth mounting holes and the fifth mounting holes are provided in the same number and correspond one-to-one, such that each fourth mounting hole is aligned with the corresponding fifth mounting hole along the direction from the support mechanism 110 to the heating head 120. The number of fourth mounting holes and fifth mounting holes can be 2, 3, 4, 5, or more, without specific limitation, as long as the support mechanism 110 can stably support the heating head 120. The fourth mounting holes and the fifth mounting holes can be evenly distributed along the circumference of the support mechanism 110 to ensure stable support of the heating head 120 by the support mechanism 110.

[0051] Furthermore, if Figure 4 As shown, in some embodiments, the second connecting section 152 has a connecting end 1521 distal from the second mounting section 151, and the diameter of the portion of the second connecting section 152 adjacent to the connecting end 1521 is larger than the diameter of the connecting end 1521, so that the second connecting section 152 forms a second stepped surface facing the second partition 132, and the second partition 132 has a second surface facing the heating head 120, the second surface abutting the second stepped surface. Alternatively, the heating platform 100 further includes a plurality of second threaded members 170, each located between the first partition 131 and the second partition 132 and threadedly connected to a corresponding second connecting section 152. The engagement of the second stepped surface and the second threaded members 170 allows the second partition 132 to be mounted on the second support rod 150, thereby preventing the second partition 132 from shifting along the support mechanism 110 toward the heating head 120 and preventing the first clamping portion 134 from falling off from the second clamping portion 135, thereby ensuring the stability of the support mechanism 110 supporting the heating head 120.

[0052] The second threaded member 170 may be a nut, and the connecting end 1521 of the second connecting section 152 is provided with a thread matching the nut.

[0053] In some embodiments, as Figure 4 As shown, the first partition plate 131 is provided with a plurality of first receiving holes 131a along the circumference of the support mechanism 110, and the second partition plate 132 is provided with a plurality of second receiving holes along the circumference of the support mechanism 110; the first receiving holes 131a and the second receiving holes are used to accommodate corresponding first clamping portions 134. The first receiving holes 131a and the second receiving holes can limit the corresponding first clamping portions 134, preventing the first clamping portions 134 from moving between the first partition plate 131 and the second partition plate 132, thereby ensuring the stability of the support mechanism 110 supporting the heating head 120.

[0054] The number of the first accommodating holes 131a and the second accommodating holes is the same, and they correspond one to one, so that each first accommodating hole 131a is aligned with the corresponding second accommodating hole along the direction from the support mechanism 110 to the heating head 120, thereby accommodating the same first clamping portion 134. The number of the first accommodating holes 131a and the second accommodating holes can be set to 2, 3, 4, 5, or more, without specific limitation, as long as the support mechanism 110 can stably support the heating head 120. The first accommodating holes 131a and the second accommodating holes can be evenly distributed along the circumference of the support mechanism 110 to ensure the stability of the support mechanism 110 supporting the heating head 120.

[0055] like Figure 1 and Figure 4 As shown, in some embodiments, the first clamping portion 134 may be a spherical structure, and the first clamping portion 134 is inserted into the corresponding first receiving hole 131a and the corresponding second receiving hole in a linear contact manner. A circular edge is formed between the hole wall of the first receiving hole 131a and the surface of the first partition 131 facing the second partition 132, and the outer surface of the first clamping portion 134 contacts this edge, that is, the first clamping portion 134 and the first receiving hole 131a are in linear contact. Similarly, a circular edge is formed between the hole wall of the second receiving hole and the surface of the second partition 132 facing the first partition 131, and the outer surface of the first clamping portion 134 contacts this edge, that is, the first clamping portion 134 and the second receiving hole are in linear contact.

[0056] Of course, if Figure 5As shown, in some other embodiments, the first clamping portion 134 may also be a double pyramid structure, and the first clamping portion 134 is inserted into the corresponding first receiving hole 131a and the corresponding second receiving hole in a point contact manner. It should be noted that the double pyramid structure refers to a structure composed of two polygonal pyramids sharing a common bottom surface. There is a circular edge between the hole wall of the first receiving hole 131a and the surface of the first partition 131 facing the second partition 132, and one of the edges of the polygonal pyramid of the first clamping portion 134 contacts the edge, that is, the first clamping portion 134 and the first receiving hole 131a are in multi-point contact; similarly, there is a circular edge between the hole wall of the second receiving hole and the surface of the second partition 132 facing the first partition 131, and one of the edges of the polygonal pyramid of the first clamping portion 134 contacts the edge, that is, the first clamping portion 134 and the second receiving hole are in multi-point contact. It is understandable that the more edges the double pyramid structure has, the more points at which the first clamping portion 134 contacts the first receiving hole 131 a and the second receiving hole.

[0057] All the first clamping portions 134 may be spherical structures or bi-pyramid structures, or a portion of the first clamping portions 134 may be spherical structures and the remaining portion of the first clamping portions 134 may be bi-pyramid structures.

[0058] In some embodiments, as Figure 4 As shown, the third partition plate 133 is provided with a plurality of third receiving holes along the circumference of the support mechanism 110, and the second partition plate 132 is provided with a plurality of fourth receiving holes 132a along the circumference of the support mechanism 110; the third receiving holes and the fourth receiving holes 132a are used to accommodate corresponding second clamping portions 135. The third receiving holes and the fourth receiving holes 132a can limit the corresponding second clamping portions 135, preventing the second clamping portions 135 from moving between the third partition plate 133 and the second partition plate 132, thereby ensuring the stability of the support mechanism 110 supporting the heating head 120.

[0059] The number of the third and fourth accommodating holes 132a is the same, and they correspond one-to-one, so that each third accommodating hole is aligned with the corresponding fourth accommodating hole 132a along the direction from the support mechanism 110 to the heating head 120, thereby accommodating the same second clamping portion 135. The number of the third and fourth accommodating holes 132a can be 2, 3, 4, 5, or more, without specific limitation, as long as the support mechanism 110 can stably support the heating head 120. The third and fourth accommodating holes 132a can be evenly distributed along the circumference of the support mechanism 110 to ensure the stability of the support mechanism 110 supporting the heating head 120.

[0060] like Figure 1 and Figure 4As shown, in some embodiments, the second clamping portion 135 may be spherical and inserted into the corresponding third and fourth accommodating holes 132a in a line-contact manner. A circular edge is formed between the wall of the third accommodating hole and the surface of the third partition 133 facing the second partition 132, and the outer surface of the second clamping portion 135 contacts this edge, i.e., the second clamping portion 135 and the third accommodating hole are in line contact. Similarly, a circular edge is formed between the wall of the fourth accommodating hole 132a and the surface of the second partition 132 facing the third partition 133, and the outer surface of the second clamping portion 135 contacts this edge, i.e., the second clamping portion 135 and the fourth accommodating hole 132a are in line contact.

[0061] Of course, in other embodiments, the second clamping portion 135 may also be a bipyramid structure, with the second clamping portion 135 inserted into the corresponding fourth receiving hole 132a and the corresponding third receiving hole in a point-contact manner. A circular edge is formed between the wall of the third receiving hole and the surface of the third partition 133 facing the second partition 132, and one of the edges of the second clamping portion 135's polygonal pyramid contacts this edge, i.e., the second clamping portion 135 and the third receiving hole have multiple-point contact. Similarly, a circular edge is formed between the wall of the fourth receiving hole 132a and the surface of the second partition 132 facing the third partition 133, and one of the edges of the second clamping portion 135's polygonal pyramid contacts this edge, i.e., the second clamping portion 135 and the fourth receiving hole 132a have multiple-point contact. It will be understood that the more edges the bipyramid structure has, the more points of contact the second clamping portion 135 has with the third and fourth receiving holes 132a.

[0062] All the second clamping parts 135 may be spherical structures or bi-pyramid structures, or a portion of the second clamping parts 135 may be spherical structures and the remaining portion of the second clamping parts 135 may be bi-pyramid structures.

[0063] In some embodiments, the orthographic projections of the first clamping portion 134 and the second clamping portion 135 on the second partition plate 132 are staggered along the circumference of the second partition plate 132. In this way, the second partition plate 132 can be clamped at multiple locations, which can ensure the clamping force of the second partition plate 132 and further ensure the stability of the support mechanism 110 supporting the heating head 120.

[0064] It should be noted that the second accommodating hole and the fourth accommodating hole 132 a on the second partition plate 132 are also staggered along the circumferential direction of the second partition plate 132 .

[0065] In some embodiments, as Figure 6As shown, the heating head 120 includes a mounting shell 121, a heating body 122, a sample rack base 123 and a sample rack 124. The mounting shell 121 is connected to the second mounting section 151 of the second support rod 150. The heating body 122 is disposed in the mounting shell 121, and the sample rack base 123 is disposed in the mounting shell 121. The heating body 122 and the sample rack base 123 are disposed opposite to each other along the direction from the first partition 131 to the second partition 132. The sample rack 124 is disposed on the sample rack base 123 and exposed to the outside of the mounting shell 121 for carrying samples.

[0066] Among them, such as Figure 6 As shown, the heating body 122 includes a heating filament 1221 that is wound reciprocatingly; the sample holder base 123 includes an opening 123a that is used to expose the back side of the sample holder 124. With this arrangement, when electron beam heating is performed, the heating filament 1221 is energized to emit electrons, which can evenly bombard the back side of the sample holder 124, thereby uniformly heating the sample on the sample holder 124. It should be noted that during electron beam heating, high voltage must be applied to the sample holder base 123 to ensure that the electrons bombard the back side of the sample holder 124 in a targeted manner. Of course, when the sample does not require a very high heating temperature, the heat generated by the heating filament 1221 can directly heat the sample without the need for electron bombardment. In this case, no high voltage needs to be applied to the sample holder base 123.

[0067] The second partition 132 is connected to the sample holder base 123 by metal, ensuring that the second partition 132 and the sample holder base 123 have the same electrical potential. Therefore, when electron beam heating is applied, high voltage is applied to the sample holder base 123, which is equivalent to applying high voltage to the second partition 132. Therefore, the second partition 132 must be insulated from the first and third partitions 131, 133 to electrically isolate the heating head 120 from the support mechanism 110. The first clamping portion 134 and the second clamping portion 135 are made of an insulating material, such as ceramic, which is both insulating and heat-resistant.

[0068] Another embodiment of the present application provides a vacuum heating device 10, such as Figure 2 and Figure 3 As shown, the vacuum heating device 10 includes: a vacuum chamber, a translation stage 200 and a heating stage 100 as described above; the translation stage 200 is movably arranged in the vacuum chamber; the heating stage 100 is located in the vacuum chamber, and the support mechanism 110 of the heating stage 100 is connected to the translation stage 200.

[0069] The vacuum heating device 10 is provided with a heat buffer assembly 130 between the support mechanism 110 of the heating table 100 and the heating head 120. The heat buffer assembly 130 can clamp the second partition 132 between the first partition 131 and the third partition 133 through the cooperation of the first clamping portion 134 and the second clamping portion 135, so that the support mechanism 110 can stably support the heating head 120. In addition, by making the first clamping portion 134 in line contact or point contact with the first partition 131 and the second partition 132, the second clamping portion 135 and the third partition 133 can be clamped. The plate 133 and the second partition plate 132 are in line contact or point contact, so that the contact mode between the support mechanism 110 and the heating head 120 is adjusted from surface contact to line contact or point contact, reducing the contact area between the support mechanism 110 and the heating head 120, which can greatly reduce the rate at which the heating head 120 transfers heat to the support mechanism 110. Under the same heating power, the temperature of the sample can be made higher and the temperature of the support mechanism 110 can be made lower, which can greatly reduce the rate at which the support mechanism 110 releases gas, thereby greatly reducing the pollution effect on the growing sample.

[0070] like Figure 2 As shown, the translation stage 200 is provided with a high voltage connector and a current connector 220 . The high voltage connector is used to pass high voltage to the sample holder base 123 , and the current connector 220 is used to pass current to the heating filament 1221 of the heating body 122 .

[0071] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heating table of a vacuum heating device, characterized in that: include: Support mechanism; a heating head, the heating head being arranged opposite to the supporting mechanism; as well as A heat buffer assembly, the heat buffer assembly includes a first partition, a second partition, a third partition, a plurality of first clamping parts and a plurality of second clamping parts, the first partition, the second partition and the third partition are arranged in sequence along the direction from the support mechanism to the heating head, the first partition and the third partition are connected to the support mechanism, the second partition is connected to the heating head, the first clamping part and the second clamping part are respectively arranged between the first partition and the second partition and between the third partition and the second partition to clamp the second partition between the first partition and the third partition, wherein the first clamping part is in line contact or point contact with the first partition and the second partition, and the second clamping part is in line contact or point contact with the third partition and the second partition.

2. The heating table according to claim 1, characterized in that The heating platform further includes a plurality of first support rods along the circumference of the support mechanism, wherein the first support rods include a first mounting section connected to the support mechanism and a first connecting section opposite to the first mounting section; The first partition is provided with a plurality of first mounting holes along the circumference of the support mechanism, the second partition is provided with a plurality of second mounting holes along the circumference of the support mechanism, and the third partition is provided with a plurality of third mounting holes along the circumference of the support mechanism. The first mounting hole, the second mounting hole and the third mounting hole are all used for the corresponding first connecting section to pass through; wherein, a first annular gap is formed between the hole wall of the second mounting hole and the corresponding first connecting section.

3. The heating table according to claim 2, characterized in that The diameter of the first mounting section is larger than the diameter of the first connecting section, so that the first support rod forms a first stepped surface facing the first partition plate, and the first partition plate has a first surface facing the support mechanism, and the first surface abuts against the first stepped surface; and / or, The heating platform further includes a plurality of first threaded members, which are located on a side of the third partition plate facing away from the second partition plate and are threadedly connected to the corresponding first connecting sections.

4. The heating table according to claim 1, characterized in that The heating platform further includes a plurality of second support rods along the circumference of the support mechanism, wherein the second support rods include a second mounting section connected to the heating head and a second connecting section opposite to the second mounting section; The second partition plate is provided with a plurality of fourth mounting holes along the circumference of the support mechanism, and the third partition plate is provided with a plurality of fifth mounting holes along the circumference of the support mechanism. The fourth mounting holes and the fifth mounting holes are both used for the corresponding second connecting section to pass through; wherein, a second annular gap is formed between the hole wall of the fifth mounting hole and the corresponding second connecting section.

5. The heating table according to claim 4, characterized in that The second connecting section has a connecting end away from the second mounting section, and a portion of the second connecting section adjacent to the connecting end has a larger diameter than the connecting end, so that the second connecting section forms a second stepped surface facing the second partition plate, and the second partition plate has a second surface facing the heating head, and the second surface abuts against the second stepped surface; and / or, The heating platform further includes a plurality of second threaded members, which are located between the first partition plate and the second partition plate and are threadedly connected to the corresponding second connecting sections.

6. The heating table according to any one of claims 1 to 5, characterized in that The first partition plate is provided with a plurality of first accommodating holes along the circumference of the support mechanism, and the second partition plate is provided with a plurality of second accommodating holes along the circumference of the support mechanism; The first clamping portion is a spherical structure, and the first clamping portion is inserted into the corresponding first accommodating hole and the corresponding second accommodating hole in a line contact manner; or, The first clamping portion is a double pyramid structure, and the second clamping portion is inserted into the corresponding second accommodating hole in a point contact manner.

7. The heating table according to any one of claims 1 to 5, characterized in that The third partition plate is provided with a plurality of third accommodating holes along the circumference of the support mechanism; the second partition plate is provided with a plurality of fourth accommodating holes along the circumference of the support mechanism; The second clamping portion is a spherical structure, and the second clamping portion is inserted into the corresponding third accommodating hole and the corresponding fourth accommodating hole in a line contact manner; or, The second clamping portion is a double pyramid structure, and the second clamping portion is inserted into the corresponding third accommodating hole and the corresponding fourth accommodating hole in a point contact manner.

8. The heating table according to any one of claims 1 to 5, characterized in that The orthographic projections of the first clamping portion and the second clamping portion on the second partition plate are staggered along the circumferential direction of the second partition plate.

9. The heating table according to any one of claims 1 to 5, characterized in that The first clamping portion and the second clamping portion are made of insulating material.

10. A vacuum heating device, characterized in that: include: A vacuum chamber, a translation stage, and a heating stage as claimed in any one of claims 1 to 9; The translation stage is movably disposed in the vacuum chamber; The heating stage is located in the vacuum chamber, and the supporting mechanism of the heating stage is connected to the displacement stage.

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