An automatic chip placement machine with self-calibration function

Abstract

The invention discloses an automatic chip mounter with a self-calibration function, and relates to the technical field of chip calibration. The automatic chip mounter comprises a chip mounter body, a component positioning mechanism, a component dispensing mechanism and a dispensing drying mechanism. The chip mounter body is connected to the component positioning mechanism, the chip mounter body is connected to the component dispensing mechanism, and the chip mounter body is connected to the dispensing drying mechanism; the component dispensing mechanism comprises a glue storage tank and a heating device, the glue storage tank is connected to the heating device, the heating device comprises an electric thermal resistance wire, a stirring shaft rod and a stirring fan blade, the electric thermal resistance wire is wound in the glue storage tank wall, the stirring shaft rod and the stirring fan blade are placed in the glue storage tank, one end of the stirring shaft rod passes through the glue storage tank, and the other end of the stirring shaft rod is rotatably connected to the inside of the glue storage tank through a support plate, a plurality of stirring fan blades are provided, and the plurality of stirring fan blades are grouped in pairs, and the stirring fan blades and the stirring shaft rod are tightly connected.

Description

Technical Field

[0001] The invention relates to the technical field of patch calibration, in particular to an automatic patch machine with a self-calibration function. Background Art

[0002] With the continuous development of electronic products, the requirements for the placement accuracy of components are getting higher and higher. After a long period of operation, traditional placement machines often have some problems due to various factors, which affects the product qualification rate.

[0003] At present, the placement of conventional components is mostly done manually or by machine. The efficiency of manual placement is low and the scrap rate is high. Some components need to be glued first. Manual glue dispensing may not be able to control the amount of glue, resulting in glue overflow or insufficient glue, which will affect subsequent welding or other operations. The machine's glue dispensing can accurately control the amount of glue used, but the gap between the component and the PCB board is not calibrated to maintain a fixed distance. At the same time, the machine's glue dispensing directly injects glue into the gap. The glue has low fluidity and cannot make the glue in the gap uniform, which may cause the component and the PCB board to be not parallel, affecting subsequent welding and use. Summary of the invention

[0004] The purpose of the present invention is to provide an automatic placement machine with a self-calibration function to solve the problems raised in the prior art.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] The automatic placement machine includes a placement machine body, a component positioning mechanism, a component dispensing mechanism and a dispensing drying mechanism, wherein the placement machine body is connected to the component positioning mechanism, the placement machine body is connected to the component dispensing mechanism, and the placement machine body is connected to the dispensing drying mechanism;

[0007] The component dispensing mechanism includes a glue storage tank and a heating device, which are connected to the glue storage tank. The heating device includes an electric thermal resistance wire, a stirring shaft and a stirring fan blade. The electric thermal resistance wire is wound in the wall of the glue storage tank. The stirring shaft and the stirring fan blade are placed in the glue storage tank. One end of the stirring shaft passes through the glue storage tank, and the other end of the stirring shaft is rotatably connected to the inside of the glue storage tank through a support plate. A plurality of stirring fan blades are provided, and the plurality of stirring fan blades are grouped in pairs. The stirring fan blades and the stirring shaft are tightly connected.

[0008] In the placement machine, the placement machine is used to connect components and PCB boards, the placement machine body is used to provide a place for placement, the component positioning mechanism is used to fix components and PCB boards and move components to facilitate subsequent dispensing, the component dispensing mechanism is used to dispense glue between components and PCB boards to fix the two, facilitate subsequent welding and use, and reduce the circuit board from being unusable due to component displacement, and the dispensing drying mechanism is used to quickly dry the glue between the component and the PCB board after dispensing is completed, thereby improving work efficiency and facilitating faster execution of the next step.

[0009] Furthermore, the main body of the placement machine includes a shell and an operating table, the shell and the operating table are connected, an operating chamber is arranged in the shell, the operating table is placed in the operating chamber, the operating table is tightly connected to the wall of the operating chamber, the shell is connected to the component positioning mechanism, the operating chamber is connected to the component positioning mechanism, the operating table is connected to the component positioning mechanism, the operating table is connected to the component dispensing mechanism, the operating table is connected to the dispensing drying mechanism, the main body of the placement machine also includes a component conveying device, the component conveying device is connected to the shell, the component conveying device is placed in the operating chamber, the component conveying device includes a component conveyor belt, an active roller and a driving motor, two active rollers are provided, the two active rollers are drivingly connected to the component conveyor belt, the two active rollers are tightly connected to the bottom wall of the operating chamber through a bracket, the active roller is rotationally connected to the bracket, one side of an active roller is tightly connected to the output end of the driving motor, and the fixed end of the driving motor is tightly connected to the bracket; ... It includes a PCB board conveying device, which is connected to a shell, connected to a component conveying device, and located in the same plane. The PCB board conveying device is connected to an active roller, and is placed in an operating chamber. The PCB board conveying device includes a PCB board conveying belt, a driven roller, and a transmission rod. Two driven rollers are provided, and the two driven rollers are drivingly connected to the PCB board conveying belt. The driven roller is fastened to the bottom wall of the operating chamber through a fixed frame, and the driven roller is rotationally connected to the fixed frame. The PCB board conveying device and the component conveying belt are placed in parallel, one end of the transmission rod is fastened to the active roller, and one end of the transmission rod away from the active roller is fastened to the driven roller. The transmission rod is perpendicular to the PCB board conveying belt and the component conveying belt, and an operating table passes through the middle of the PCB board conveying belt and the component conveying belt and is fastened to the inner wall of the operating chamber.

[0010] In the SMT machine body, the shell provides a working place, and other operations are completed in the operating chamber. The operating table is placed in the operating chamber to provide support for the work of other mechanisms. The operating table passes through the middle of the PCB board conveyor belt and the component conveyor belt, and is tightly connected to the wall of the operating chamber. The PCB board conveying device and the component conveying device are in the same plane. The component conveyor belt and the active roller in the component conveying device are rotatably connected, and the active roller and the bracket are rotatably connected. The active roller is driven by a driving motor. At the same time, the PCB board conveyor belt and the driven roller are rotatably connected, and the driven roller and the fixed frame are rotatably connected. The active roller and the driven roller are tightly connected through a transmission rod. After the device is started, the components and PCB boards are placed on the component conveyor belt and the PCB board conveyor belt respectively, and the driving motor is started to drive the active roller to rotate, and the active roller and a driven roller are tightly connected through a transmission rod, so the driven roller is also driven to rotate, and the component conveyor belt and the PCB board conveyor belt run at the same speed.

[0011] Furthermore, the component positioning mechanism includes a driving hydraulic cylinder, a first driving block, a second driving block, a connecting rod and a locking block. A rectangular sliding groove is provided on the operating table. The rectangular sliding groove is placed between the PCB board conveyor belt and the component conveyor belt. The driving hydraulic cylinder is connected to the operating table. The driving hydraulic cylinder is placed in the rectangular sliding groove. The fixed end of the driving hydraulic cylinder is tightly connected to the wall of the rectangular sliding groove close to one end of the component conveyor belt. The output end of the driving hydraulic cylinder is tightly connected to the first driving block. The first driving block and the second driving block have the same shape. The first driving block and the second driving block are both Inverted "L" shape, the first drive block is connected to the operating table, the bottom of the first drive block is slidably connected to the rectangular sliding groove, the distance from the operating table to the first drive block is consistent with the distance from the operating table to the upper surface of the PCB board conveyor belt, the bottom of the second drive block is slidably connected to the upper surface of the operating table, the distance from the operating table to the second drive block is consistent with the distance from the operating table to the upper surface of the component conveyor belt, the first drive block and the second drive block are fastened connected by a connecting rod, the bottom of the locking block is fastened to the operating table, the locking block is provided with a protruding end, and the protruding end of the locking block is provided with a slot.

[0012] In the component positioning mechanism, the mechanism is used to fix components and PCB boards and move components. The driving hydraulic cylinder is placed in a rectangular sliding groove, and its output end is tightly connected to the first driving block, which is used to drive the first driving block to move forward and backward, and the first driving block and the second driving block are tightly connected by a connecting rod. The second driving block is slidably connected to the surface of the operating table. When the first driving block moves under the action of the driving hydraulic cylinder, the second driving block will also move in the same direction. The distance from the operating table to the first driving block and the second driving block is exactly the distance from the upper part of the PCB board conveyor belt and the upper part of the component conveyor belt to the surface of the operating table. Therefore, after the driving hydraulic cylinder is driven, the first driving block and the second driving block are respectively clamped on the PCB board conveyor belt and the component conveyor belt to intercept the PCB board and components on the conveyor belt. The clamping block is used to fix the height between the component and the PCB board in the later stage, which is convenient for later dispensing.

[0013] Furthermore, the component positioning mechanism also includes a moving device, which is placed on the inner wall of the operating chamber. The moving device includes a rotating motor, a rotating rod and a driven block. The fixed end of the rotating motor is tightly connected to the inner wall of the operating chamber, the output end of the rotating motor is tightly connected to the rotating rod, and the end of the rotating rod away from the rotating motor is rotatably connected to the inner wall of the operating chamber. The rotating rod is provided with a thread, and the driven block is provided with a circular through hole. The circular through hole of the driven block is provided with a thread, and the rotating rod and the driven block are threadedly connected. The direction of the rotating rod is perpendicular to the direction of the PCB board conveyor belt and the component conveyor belt. The driven block is located on one side of the intersection of the transmission direction of the transmission belt and the driving block. The component positioning mechanism also includes a suction device, which is connected to the moving device, and the suction device is connected to the driven block. The suction device includes a vacuum pump, a suction pipe, a suction nozzle and a telescopic rod. The vacuum pump is placed on the driven block, and the vacuum pump is connected to the suction pipe. The end of the suction pipe away from the vacuum pump is connected to the suction nozzle, and the suction nozzle is tightly connected to the bottom of the driven block through the telescopic rod. The telescopic rod is provided with a transverse rod, and the width of the transverse rod is consistent with the width of the card slot.

[0014] The component positioning mechanism also includes a moving device, which is used to move the suction device. The fixed end of the rotating motor is tightly connected to the wall of the operating chamber, and the output end is connected to a rotating rod. The rotating rod is provided with a thread and is threadedly connected to a driven block. After the rotating motor is started, the rotating rod is driven to rotate, and the driven block threadedly connected to the rotating rod moves along the rotating rod. The suction device is placed on the driven block, and the telescopic rod is tightly connected to the bottom of the driven block and the suction nozzle. The vacuum pump is tightly connected to the top of the driven block, and the vacuum pump and the suction nozzle are connected through a suction pipe. After the device is started, the rotating motor drives the rotating rod to rotate, so that the driven block moves. The farthest distance it moves to is above the component conveyor belt. At this time, the component is directly below the suction nozzle. The telescopic rod is extended, and the vacuum pump is started. , so that the suction nozzle sucks the component, then the telescopic rod retracts, the rotating motor reverses, and the driven block moves toward the rotating motor. The nearest point is the PCB board conveyor belt. At this time, the PCB board is blocked here because of the first driving block. At this time, the position of the component that needs to be placed on the PCB board is directly below the component sucked by the suction nozzle. Then the telescopic rod is extended again, and the suction nozzle and the component move downward together. A transverse rod is fastened to the telescopic rod, and the width of the transverse rod is consistent with the width of the card slot. During the descent of the telescopic rod, the transverse rod will contact and engage with the card slot, and then the telescopic rod can no longer descend, and the suction nozzle and the component stop moving. At this time, there is a gap between the component and the PCB board. This operation is used to calibrate the size of the gap to facilitate later dispensing.

[0015] Furthermore, the component dispensing mechanism also includes an injection device, which is connected to an operating table. The injection device includes an injection needle and an injection tube. The injection device is connected to a glue storage tank. One end of the injection tube is connected to the glue storage tank, and the other end of the injection tube is connected to the injection needle. The injection needle, the glue storage tank and the operating table are tightly connected, and the output end of the injection needle faces the PCB board conveyor belt.

[0016] In the component dispensing mechanism, the mechanism is used to perform dispensing operation on the gap between the component and the PCB board, so that the component and the PCB board are fixed, and the glue is injected into the gap between the component and the PCB board through the injection needle. Then the fluidity of the glue itself is not strong, and the injection needle can only inject the glue from one corner. If the glue is injected directly, the extension range of the glue is not large, which may cause uneven injection of the glue, making the component and the PCB board not parallel, affecting subsequent use. It can only be around the injection needle, and the glue storage tank is wrapped with electric heat resistance wire. By heating by power, the glue in the glue storage tank is heated up and the fluidity is improved. The stirring fan blade is used to stir the glue in the glue storage tank. This allows it to heat up evenly. After the heating is completed, the power is turned off, the heating wire stops heating, and the stirring fan blades continue to stir to ensure that the temperature in the glue storage tank is uniform. After the power is turned off, the glue in the glue storage tank is pumped out to the injection tube through the glue pump, and then from the injection tube to the injection needle, and then injected into the gap by the injection needle. The temperature of the glue injected at the beginning is the highest, so the fluidity is also the highest. After injection, it will flow toward the edge of the component, and then the temperature of the injected glue will gradually decrease. The last thing injected is the glue at room temperature. At this time, the fluidity of the glue is the lowest. This injection method can make the glue evenly placed in the gap, making the component and the PCB board parallel, which is convenient for subsequent welding operations and use.

[0017] Furthermore, the glue dispensing and drying mechanism includes a lamp rack and an infrared radiation lamp tube. The lamp rack is provided with two groups, and the two groups of lamp racks are tightly connected to the operating table. The two groups of lamp racks are symmetrically placed about the PCB board conveyor belt. There are several infrared radiation lamp tubes, which are tightly connected to the lamp racks and face the PCB board conveyor belt.

[0018] In the glue dispensing and drying mechanism, the mechanism is used to dry the glue in the gap between the component and the PCB board to make it solidify. After the glue is injected, the vacuum pump stops driving, the suction nozzle stops sucking the component, the telescopic rod retracts, and then the rotary motor starts, so that the suction device returns to the component conveyor belt, ready to suck the next component, and drives the hydraulic cylinder to retreat, so that the first drive block and the second drive block are away from the PCB board conveyor belt and the component conveyor belt. The PCB board moves with the PCB board conveyor belt. Lamp racks are installed on both sides of the PCB board conveyor belt, and infrared radiation lamps are tightly connected to the lamp racks. When the PCB board moves with the PCB board conveyor belt, it will pass through the glue dispensing and drying mechanism, and the infrared radiation lamps will light-cure the glue in the gap between the component and the PCB board.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: after the present invention is started, the driving motor drives the component conveyor belt and the PCB board conveyor belt to run, the driving hydraulic cylinder is started, the first driving block and the second driving block are respectively on the corresponding conveyor belts to intercept the PCB board and the components, the rotating motor is started, so that the suction nozzle moves to the top of the component, the telescopic rod is extended, the suction nozzle sucks the component through the vacuum pump, the telescopic rod is retracted, the rotating motor is reversed, the suction nozzle and the sucked component are placed above the component to be placed on the PCB board, the telescopic rod is extended, the suction nozzle and the component move downward, and during the descent process the transverse rod and the card slot are engaged, the telescopic rod can no longer descend, the suction nozzle and the component stop moving, and a gap is left between the component and the PCB board for dispensing glue. During this process, the electric heating resistance wire is energized and heated, so that the glue liquid in the glue storage tank is heated up and the fluidity is improved. The stirring fan blade is used to stir the glue liquid in the glue storage tank so that it can be heated up evenly. After the heating is completed, the power is cut off and the electricity is turned on. The thermal resistance wire stops heating, and the stirring fan blades continue stirring to ensure that the temperature in the glue storage tank is uniform. After power is off, the glue in the glue storage tank is pumped out to the injection tube through the glue pump, and then from the injection tube to the injection needle, and injected into the gap by the injection needle. The temperature of the glue injected at the beginning is the highest, so the fluidity is also the highest. After injection, it will flow toward the edge of the component, and then the temperature of the injected glue will gradually decrease. The glue injected at the end is at room temperature, and the fluidity of the glue is the lowest at this time. This injection method can make the glue evenly placed in the gap, so that the component and the PCB board are parallel. Then the suction nozzle stops sucking, the telescopic rod retracts, the rotating motor starts, the suction device returns to the component conveyor belt, and prepares to suck the next component, drives the hydraulic cylinder to retreat, and the first drive block and the second drive block are away from the PCB board conveyor belt and the component conveyor belt. The PCB board moves with the PCB board conveyor belt, and the glue is light-cured through the glue dispensing and drying mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 A top view of the present invention;

[0022] Figure 3 is a side view of the present invention;

[0023] Figure 4 for Figure 2 BB cross-sectional view;

[0024] Figure 5 for Figure 4 Enlarged view of part A;

[0025] Figure 6 This is a schematic diagram of the nozzle working;

[0026] Figure 7It is a schematic diagram of the glue dispensing and drying mechanism of the present invention.

[0027] In the figure: 1. SMT machine body; 11. Shell; 111. Operating chamber; 12. Operating table; 121. Rectangular sliding slot; 13. Component conveying device; 131. Component conveyor belt; 132. Active roller; 133. Driving motor; 14. PCB board conveying device; 141. PCB board conveyor belt; 142. Driven roller; 143. Transmission rod; 2. Component positioning mechanism; 21. Driving hydraulic cylinder; 22. First driving block; 23. Second driving block; 24. Connecting rod; 25. Engaging block; 251. Card slot; 26, moving device; 261, rotating motor; 262, rotating rod; 263, driven block; 27, suction device; 271, vacuum pump; 272, suction pipe; 273, suction nozzle; 274, telescopic rod; 3, component dispensing mechanism; 31, glue storage tank; 32, heating device; 321, electric heating wire; 322, stirring shaft; 323, stirring fan blade; 33, injection device; 331, injection needle; 332, injection tube; 4, dispensing and drying mechanism; 41, lamp holder; 42, infrared radiation lamp tube. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Example: Figure 1-Figure 7 As shown, the present invention provides a technical solution for an automatic chip mounter with a self-calibration function, the automatic chip mounter comprises a chip mounter body 1, a component positioning mechanism 2, a component dispensing mechanism 3 and a dispensing drying mechanism 4, the chip mounter body 1 is connected to the component positioning mechanism 2, the chip mounter body 1 is connected to the component dispensing mechanism 3, and the chip mounter body 1 is connected to the dispensing drying mechanism 4;

[0030] The component dispensing mechanism 3 includes a glue storage tank 31 and a heating device 32, which are connected to each other. The heating device 32 includes an electric thermal resistance wire 321, a stirring shaft 322 and a stirring blade 323. The electric thermal resistance wire 321 is wound around the wall of the glue storage tank 31, and the stirring shaft 322 and the stirring blade 323 are placed in the glue storage tank 31. One end of the stirring shaft 322 passes through the glue storage tank 31, and the other end of the stirring shaft 322 is rotatably connected to the inside of the glue storage tank 31 through a support plate. A plurality of stirring blades 323 are provided, and the plurality of stirring blades 323 are grouped in pairs, and the stirring blades 323 and the stirring shaft 322 are tightly connected.

[0031] In the placement machine, the placement machine is used to connect components and PCB boards. The placement machine body 1 is used to provide a place for placement. The component positioning mechanism 2 is used to fix components and PCB boards and move components to facilitate subsequent glue dispensing. The component glue dispensing mechanism 3 is used to dispense glue between components and PCB boards to fix the two, which is convenient for subsequent welding and use, reducing the circuit board from being unusable due to component displacement. The glue dispensing drying mechanism 4 is used to quickly dry the glue between the component and the PCB board after the glue dispensing is completed, thereby improving work efficiency and facilitating faster execution of the next step.

[0032] The mounter body 1 includes a shell 11 and an operating table 12, the shell 11 and the operating table 12 are connected, an operating cavity 111 is arranged in the shell 11, the operating table 12 is placed in the operating cavity 111, the operating table 12 and the wall of the operating cavity 111 are tightly connected, the shell 11 is connected to the component positioning mechanism 2, the operating cavity 111 is connected to the component positioning mechanism 2, the operating table 12 is connected to the component positioning mechanism 2, the operating table 12 is connected to the component dispensing mechanism 3, the operating table 12 is connected to the dispensing drying mechanism 4, and the mounter body 1 also includes a component conveying device 13, the component conveying device 13 The component conveying device 13 is connected to the housing 11, and is placed in the operating chamber 111. The component conveying device 13 includes a component conveying belt 131, an active roller 132 and a driving motor 133. Two active rollers 132 are provided. The two active rollers 132 are transmission-connected to the component conveying belt 131. The two active rollers 132 are fastened to the bottom wall of the operating chamber 111 through a bracket. The active rollers 132 are rotationally connected to the bracket. One side of the active roller 132 is fastened to the output end of the driving motor 133, and the fixed end of the driving motor 133 is fastened to the bracket. The mounter body 1 also includes P PCB board conveying device 14, PCB board conveying device 14 is connected to housing 11, PCB board conveying device 14 is connected to component conveying device 13, PCB board conveying device 14 and component conveying device 13 are in the same plane, PCB board conveying device 14 is connected to active roller 132, PCB board conveying device 14 is placed in operating chamber 111, PCB board conveying device 14 comprises PCB board conveying belt 141, driven roller 142 and transmission rod 143, driven roller 142 is provided with two, two driven rollers 142 and PCB board conveying belt 141 are drivingly connected The driven roller 142 is fastened to the bottom wall of the operating chamber 111 through a fixed frame, the driven roller 142 is rotatably connected to the fixed frame, the PCB board conveying device 14 and the component conveyor belt 131 are placed in parallel, one end of the transmission rod 143 is fastened to the active roller 132, the end of the transmission rod 143 away from the active roller 132 is fastened to the driven roller 142, the transmission rod 143 is perpendicular to the PCB board conveyor belt 141 and the component conveyor belt 131, and the operating table 12 passes through the middle of the PCB board conveyor belt 141 and the component conveyor belt 131 and is fastened to the inner wall of the operating chamber 111.

[0033] In the SMT machine body 1, the shell 11 provides a working place, and other operations are completed in the operating chamber 111. The operating table 12 is placed in the operating chamber 111 to provide support for the work of other mechanisms. The operating table 12 passes through the middle of the PCB board conveyor belt 141 and the component conveyor belt 131, and is tightly connected to the wall of the operating chamber 111. The PCB board conveyor 14 and the component conveyor 13 are in the same plane. The component conveyor belt 131 in the component conveyor 13 is rotatably connected to the active roller 132, and the active roller 132 is rotatably connected to the bracket. The active roller 132 is driven by the drive motor 133, and the active roller 132 is driven by the drive motor 133. At the same time, the PCB board conveyor belt 141 and the driven roller 142 are rotationally connected, the driven roller 142 and the fixed frame are rotationally connected, the active roller 132 and the driven roller 142 are fastened together by the transmission rod 143. After the device is started, the components and PCB boards are placed on the component conveyor belt 131 and the PCB board conveyor belt 141 respectively, the driving motor 133 is started, and the active roller 132 is driven to rotate, and the active roller 132 and a driven roller 142 are fastened together by the transmission rod 143, so the driven roller 142 is also driven to rotate, and the component conveyor belt 131 and the PCB board conveyor belt 141 run at the same speed.

[0034] The component positioning mechanism 2 includes a driving hydraulic cylinder 21, a first driving block 22, a second driving block 23, a connecting rod 24 and a locking block 25. A rectangular sliding groove 121 is provided on the operating table 12. The rectangular sliding groove 121 is placed between the PCB board conveyor belt 141 and the component conveyor belt 131. The driving hydraulic cylinder 21 is connected to the operating table 12. The driving hydraulic cylinder 21 is placed in the rectangular sliding groove 121. The fixed end of the driving hydraulic cylinder 21 is tightly connected to the wall of the rectangular sliding groove 121 close to one end of the component conveyor belt 131. The output end of the driving hydraulic cylinder 21 is tightly connected to the first driving block 22. The first driving block 22 and the second driving block 23 have the same shape. The first driving block 22 and the second driving block 23 are both It is in an inverted "L" shape, the first driving block 22 is connected to the operating table 12, the bottom of the first driving block 22 is slidably connected to the rectangular sliding groove 121, the distance from the operating table 12 to the first driving block 22 is consistent with the distance from the operating table 12 to the upper surface of the PCB board conveyor belt 141, the bottom of the second driving block 23 is slidably connected to the upper surface of the operating table 12, the distance from the operating table 12 to the second driving block 23 is consistent with the distance from the operating table 12 to the upper surface of the component conveyor belt 131, the first driving block 22 and the second driving block 23 are fastened together by a connecting rod 24, the bottom of the engaging block 25 is fastened together with the operating table 12, the engaging block 25 is provided with a protruding end, and the protruding end of the engaging block 25 is provided with a card slot 251.

[0035] In the component positioning mechanism 2, the mechanism is used to fix the components and the PCB board and move the components. The driving hydraulic cylinder 21 is placed in the rectangular sliding groove 121, and its output end is tightly connected to the first driving block 22, which is used to drive the first driving block 22 to move forward and backward. The first driving block 22 and the second driving block 23 are tightly connected by a connecting rod 24. The second driving block 23 is slidably connected to the surface of the operating table 12. When the first driving block 22 moves under the action of the driving hydraulic cylinder 21, the second driving block 23 will also move in the same direction. , and the distance from the operating table 12 to the first driving block 22 and the second driving block 23 is just the distance from the upper part of the PCB board conveyor belt 141 and the upper part of the component conveyor belt 131 to the surface of the operating table 12. Therefore, after the driving hydraulic cylinder 21 is driven, the first driving block 22 and the second driving block 23 are respectively clamped onto the PCB board conveyor belt 141 and the component conveyor belt 131 to intercept the PCB boards and components on the conveyor belts. The clamping block 25 is used to fix the height between the components and the PCB board in the later stage, which is convenient for the later dispensing of glue.

[0036] The component positioning mechanism 2 also includes a moving device 26, which is placed on the inner wall of the operating chamber 111. The moving device 26 includes a rotating motor 261, a rotating rod 262 and a driven block 263. The fixed end of the rotating motor 261 is tightly connected to the inner wall of the operating chamber 111, the output end of the rotating motor 261 is tightly connected to the rotating rod 262, and the end of the rotating rod 262 away from the rotating motor 261 is rotatably connected to the inner wall of the operating chamber 111. The rotating rod 262 is provided with a thread, and the driven block 263 is provided with a circular through hole. The circular through hole of the driven block 263 is provided with a thread, and the rotating rod 262 and the driven block 263 are threadedly connected. The direction of the rotating rod 262 is in the same direction as the PCB board conveyor belt 141 and the component conveyor belt 131. Vertically, the driven block 263 is located on one side of the intersection of the transmission direction of the transmission belt and the driving block. The component positioning mechanism 2 also includes a suction device 27, which is connected to the moving device 26, and the suction device 27 is connected to the driven block 263. The suction device 27 includes a vacuum pump 271, a suction pipe 272, a suction nozzle 273 and a telescopic rod 274. The vacuum pump 271 is placed on the driven block 263, and the vacuum pump 271 is connected to the suction pipe 272. The end of the suction pipe 272 away from the vacuum pump 271 is connected to the suction nozzle 273, and the suction nozzle 273 is fastened to the bottom of the driven block 263 by the telescopic rod 274. The telescopic rod 274 is provided with a transverse rod, and the width of the transverse rod is consistent with the width of the card slot 251.

[0037] The component positioning mechanism 2 also includes a moving device 26, which is used to move the suction device 27. The fixed end of the rotating motor 261 is tightly connected to the wall of the operating chamber 111, and the output end is connected to a rotating rod 262. The rotating rod 262 is provided with a thread and is threadedly connected to a driven block 263. After the rotating motor 261 is started, the rotating rod 262 is driven to rotate, and the driven block 263 threadedly connected to the rotating rod 262 moves along the rotating rod 262. The suction device 27 is placed on the driven block 263, and the telescopic rod 274 is tightly connected to the bottom of the driven block 263 and the suction nozzle 273. The vacuum pump 271 is tightly connected to the top of the driven block 263. The vacuum pump 271 and the suction nozzle 273 are connected through the suction pipe 272. After the device is started, the rotating motor 261 drives the rotating rod 262 to rotate, so that the driven block 263 moves. The farthest distance it moves to is above the component conveyor belt 131. At this time, the suction nozzle 273 is directly below. The telescopic rod 274 extends out, and the vacuum pump 271 is started, so that the suction nozzle 273 sucks the component, and then the telescopic rod 274 retracts, and the rotary motor 261 reverses, so that the driven block 263 moves toward the rotary motor 261, and the nearest point is the PCB board conveyor belt 141. At this time, the PCB board is blocked here because of the first driving block 22. At this time, the position of the component that needs to be placed on the PCB board is just below the component sucked by the suction nozzle 273. Then the telescopic rod 274 extends out again, and moves downward with the suction nozzle 273 and the component, and a transverse rod is fastened to the telescopic rod 274, and the width of the transverse rod is consistent with the width of the card slot 251. During the descent of the telescopic rod 274, the transverse rod will contact and engage with the card slot 251, and then the telescopic rod 274 can no longer descend, and the suction nozzle 273 and the component stop moving. At this time, there is a gap between the component and the PCB board. The size of the gap is calibrated through such operation to facilitate later dispensing.

[0038] The component dispensing mechanism 3 also includes an injection device 33, which is connected to the operating table 12. The injection device 33 includes an injection needle 331 and an injection tube 332. The injection device 33 is connected to the glue storage tank 31. One end of the injection tube 332 is connected to the glue storage tank 31, and the other end of the injection tube 332 is connected to the injection needle 331. The injection needle 331, the glue storage tank 31 and the operating table 12 are tightly connected, and the output end of the injection needle 331 faces the PCB board conveyor belt 141.

[0039] In the component dispensing mechanism 3, the mechanism is used to perform dispensing operation on the gap between the component and the PCB board, so that the component and the PCB board are fixed, and the glue is injected into the gap between the component and the PCB board through the injection needle 331. Then the fluidity of the glue itself is not strong, and the injection needle 331 can only inject the glue from one corner. If the glue is directly injected, the extension range of the glue is not large, which may cause uneven injection of the glue, so that the component and the PCB board are not parallel, affecting subsequent use. It can only be around the injection needle 331, and the electric heating resistance wire 321 is wound inside the glue storage tank 31. By heating by powering on, the glue in the glue storage tank 31 is heated to improve the fluidity. The stirring blade 323 is used to stir the glue in the glue storage tank 31. This allows it to heat up evenly. After the heating is completed, the power is turned off, the thermal resistor 321 stops heating, and the stirring fan blades 323 continue stirring to ensure that the temperature in the glue storage tank 31 is uniform. After the power is turned off, the glue in the glue storage tank 31 is pumped out to the injection tube 332 through the glue pump, and then from the injection tube 332 to the injection needle 331, and injected into the gap by the injection needle 331. The temperature of the glue injected at the beginning is the highest, so the fluidity is also the highest. After injection, it will flow toward the edge of the component, and then the temperature of the injected glue will gradually decrease. The glue injected at last is at room temperature. At this time, the fluidity of the glue is the lowest. This injection method can make the glue evenly placed in the gap, so that the component and the PCB board are parallel, which is convenient for subsequent welding operations and use.

[0040] The glue dispensing and drying mechanism 4 includes a lamp rack 41 and an infrared radiation lamp tube 42. The lamp rack 41 is provided with two groups. The two groups of lamp racks 41 are tightly connected to the operating table 12. The two groups of lamp racks 41 are symmetrically placed about the PCB board conveyor belt 141. There are several infrared radiation lamp tubes 42. The infrared radiation lamp tubes 42 and the lamp rack 41 are tightly connected. The infrared radiation lamp tubes 42 face the PCB board conveyor belt 141.

[0041] In the glue dispensing and drying mechanism 4, the mechanism is used to dry the glue in the gap between the component and the PCB board to make it solidify. After the glue is injected, the vacuum pump 271 stops driving, the suction nozzle 273 stops sucking the component, and the telescopic rod 274 retracts. Then the rotating motor 261 starts, so that the suction device 27 returns to the component conveyor belt 131, ready to suck the next component, and drives the hydraulic cylinder 21 to retreat, so that the first driving block 22 and the second driving block 23 are away from the PCB board conveyor belt 141 and the component conveyor belt 131. The PCB board moves with the PCB board conveyor belt 141. Two lamp racks 41 are installed on the PCB board conveyor belt 141. Infrared radiation lamp tubes 42 are fastened to the lamp racks 41. When the PCB board moves with the PCB board conveyor belt 141, it will pass through the glue dispensing and drying mechanism 4, and the infrared radiation lamp tubes 42 will light-cure the glue in the gap between the component and the PCB board.

[0042] Working principle of the present invention: After the present invention is started, the driving motor 133 drives the component conveyor belt 131 and the PCB board conveyor belt 141 to run, the driving hydraulic cylinder 21 is started, the first driving block 22 and the second driving block 23 are respectively on the corresponding conveyor belts to intercept the PCB board and the components, the rotating motor 261 is started, so that the suction nozzle 273 moves to the top of the component, the telescopic rod 274 extends, the suction nozzle 273 sucks the component through the vacuum pump 271, the telescopic rod 274 retracts, the rotating motor 261 is reversed, and the suction nozzle 273 and the sucked component are placed Above the component to be placed on the PCB board, the telescopic rod 274 is extended, and the suction nozzle 273 and the component move downward. During the descent, the transverse rod and the card slot 251 are engaged, and the telescopic rod 274 can no longer descend, and the suction nozzle 273 and the component stop moving. At this time, a gap is left between the component and the PCB board for dispensing glue. During this process, the electric heating resistor 321 is energized and heated, so that the glue liquid in the glue storage tank 31 is heated to improve fluidity. The stirring fan blade 323 is used to stir the glue liquid in the glue storage tank 31 so that it can be heated evenly. After the heating is completed, the power is turned off. The electric heating resistor 321 stops heating, and the stirring blade 323 continues stirring to ensure that the temperature in the glue storage tank 31 is uniform. After power is turned off, the glue in the glue storage tank 31 is pumped out to the injection tube 332 through the glue pump, and then from the injection tube 332 to the injection needle 331, and injected into the gap by the injection needle 331. The temperature of the glue injected at the beginning is the highest, so the fluidity is also the highest. After injection, it will flow toward the edge of the component, and then the temperature of the injected glue will gradually decrease. At the end of the injection, it is glue at room temperature, and the fluidity of the glue is the lowest. This injection method can make the glue liquid evenly placed in the gap, so that the component and the PCB board are parallel. Then the suction nozzle 273 stops sucking, the telescopic rod 274 retracts, the rotating motor 261 starts, and the suction device 27 returns to the component conveyor belt 131, ready to suck the next component, drive the hydraulic cylinder 21 back, the first drive block 22 and the second drive block 23 move away from the PCB board conveyor belt 141 and the component conveyor belt 131, and the PCB board moves with the PCB board conveyor belt 141, and the glue liquid is photocured through the glue dispensing and drying mechanism 4.

[0043] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An automatic placement machine with self-calibration function, characterized in that: The automatic chip mounter comprises a chip mounter body (1), a component positioning mechanism (2), a component glue dispensing mechanism (3) and a glue dispensing drying mechanism (4); the chip mounter body (1) is connected to the component positioning mechanism (2), the chip mounter body (1) is connected to the component glue dispensing mechanism (3), and the chip mounter body (1) is connected to the glue dispensing drying mechanism (4); The component dispensing mechanism (3) comprises a glue storage tank (31) and a heating device (32), wherein the glue storage tank (31) and the heating device (32) are connected, and the heating device (32) comprises an electric heat resistance wire (321), a stirring shaft (322) and a stirring blade (323), wherein the electric heat resistance wire (321) is wound around the outer wall of the glue storage tank (31), and the stirring shaft (322) and the stirring blade (323) are placed in the glue storage tank (31), and one end of the stirring shaft (322) passes through the glue storage tank (31), and the other end of the stirring shaft (322) is rotatably connected to the inside of the glue storage tank (31) via a support plate, and a plurality of the stirring blades (323) are provided, and the plurality of the stirring blades (323) are arranged in groups of two, and the stirring blades (323) and the stirring shaft (322) are tightly connected; The chip placement machine body (1) comprises a shell (11) and an operating table (12); the shell (11) and the operating table (12) are connected; an operating cavity (111) is provided in the shell (11); the operating table (12) is placed in the operating cavity (111); the operating table (12) and the wall surface of the operating cavity (111) are tightly connected; the shell (11) and the component positioning mechanism (2) are connected; the operating cavity (111) and the component positioning mechanism (2) are connected; the operating table (12) and the component dispensing mechanism (3) are connected; and the operating table (12) and the dispensing drying mechanism (4) are connected; The chip placement machine body (1) further comprises a component conveying device (13), the component conveying device (13) being connected to the housing (11), the component conveying device (13) being placed in the operating chamber (111), the component conveying device (13) comprising a component conveying belt (131), a driving roller (132) and a driving motor (133), two driving rollers (132) being provided, the two driving rollers (132) being drivingly connected to the component conveying belt (131), the two driving rollers (132) being fastened to the bottom wall of the operating chamber (111) via a bracket, the driving rollers (132) being rotationally connected to the bracket, one side of one driving roller (132) being fastened to the output end of the driving motor (133), and the fixed end of the driving motor (133) being fastened to the bracket; The SMT machine body (1) further comprises a PCB board conveying device (14), the PCB board conveying device (14) being connected to the housing (11), the PCB board conveying device (14) being connected to the component conveying device (13), the PCB board conveying device (14) and the component conveying device (13) being located in the same plane, the PCB board conveying device (14) being connected to the active roller (132), the PCB board conveying device (14) being disposed in the operating chamber (111), the PCB board conveying device (14) comprising a PCB board conveying belt (141), a driven roller (142) and a transmission rod (143), the driven roller (142) being provided with two, the two driven rollers (142) and the PCB board conveying belt (141) transmission connection, the driven roller (142) is fastened to the bottom wall of the operating chamber (111) through a fixed frame, the driven roller (142) is rotatably connected to the fixed frame, the PCB board conveying device (14) and the component conveyor belt (131) are placed in parallel, one end of the transmission rod (143) is fastened to the active roller (132), one end of the transmission rod (143) away from the active roller (132) is fastened to the driven roller (142), the transmission rod (143) and the PCB board conveyor belt (141) and the component conveyor belt (131) are perpendicular to each other, and the operating table (12) passes through the middle of the PCB board conveyor belt (141) and the component conveyor belt (131) and is fastened to the inner wall of the operating chamber (111); The component dispensing mechanism (3) further comprises an injection device (33), the injection device (33) being connected to an operating table (12), the injection device (33) comprising an injection needle (331) and an injection tube (332), the injection device (33) being connected to a glue storage tank (31), one end of the injection tube (332) being in communication with the glue storage tank (31), and the other end of the injection tube (332) being in communication with the injection needle (331), the injection needle (331), the glue storage tank (31) and the operating table (12) being tightly connected, and an output end of the injection needle (331) facing a PCB board conveyor belt (141).

2. The automatic placement machine with self-calibration function according to claim 1, characterized in that: The component positioning mechanism (2) comprises a driving hydraulic cylinder (21), a first driving block (22), a second driving block (23), a connecting rod (24) and a locking block (25); a rectangular sliding groove (121) is provided on the operating table (12); the rectangular sliding groove (121) is placed between a PCB conveyor belt (141) and a component conveyor belt (131); the driving hydraulic cylinder (21) is connected to the operating table (12); the driving hydraulic cylinder (21) is placed in the rectangular sliding groove (121); a fixed end of the driving hydraulic cylinder (21) is tightly connected to a wall surface of the rectangular sliding groove (121) close to one end of the component conveyor belt (131); an output end of the driving hydraulic cylinder (21) is tightly connected to the first driving block (22); the first driving block (22) and the second driving block (23) have the same shape; the first driving block (22) and the second driving block (23) are tightly connected to each other. ) are both in an inverted "L" shape, the first driving block (22) is connected to the operating table (12), the bottom of the first driving block (22) is slidably connected to the rectangular sliding groove (121), the distance from the operating table (12) to the first driving block (22) is consistent with the distance from the operating table (12) to the upper surface of the PCB conveyor belt (141), the bottom of the second driving block (23) is slidably connected to the upper surface of the operating table (12), the distance from the operating table (12) to the second driving block (23) is consistent with the distance from the operating table (12) to the upper surface of the component conveyor belt (131), the first driving block (22) and the second driving block (23) are fastened to each other via a connecting rod (24), the bottom of the locking block (25) is fastened to the operating table (12), the locking block (25) is provided with a protruding end, and the locking block (25) is provided with a locking groove (251) on the protruding end.

3. The automatic chip mounter with self-calibration function according to claim 2, characterized in that: The component positioning mechanism (2) further comprises a moving device (26), the moving device (26) being disposed on the inner wall of the operating chamber (111), the moving device (26) comprising a rotating motor (261), a rotating rod (262) and a driven block (263), the fixed end of the rotating motor (261) being tightly connected to the inner wall of the operating chamber (111), the output end of the rotating motor (261) being tightly connected to the rotating rod (262), and the rotating rod (262) being away from one end of the rotating motor (261). The end is rotatably connected to the inner wall of the operating chamber (111), the rotating rod (262) is provided with a thread, the driven block (263) is provided with a circular through hole, the circular through hole of the driven block (263) is provided with a thread, the rotating rod (262) and the driven block (263) are threadedly connected, the direction of the rotating rod (262) is perpendicular to the direction of the PCB board conveyor belt (141) and the component conveyor belt (131), and the driven block (263) is located on the side of the intersection of the transmission direction of the transmission belt and the driving block.

4. The automatic chip mounter with self-calibration function according to claim 3, characterized in that: The component positioning mechanism (2) further comprises a suction device (27), wherein the suction device (27) is connected to the moving device (26), and the suction device (27) is connected to the driven block (263). The suction device (27) comprises a vacuum pump (271), a suction pipe (272), a suction nozzle (273) and a telescopic rod (274). The vacuum pump (271) is placed on the driven block (263), and the vacuum pump (271) is connected to the suction pipe (272). One end of the suction pipe (272) away from the vacuum pump (271) is connected to the suction nozzle (273). The suction nozzle (273) is fastened to the bottom of the driven block (263) via the telescopic rod (274). A transverse rod is provided on the telescopic rod (274), and the width of the transverse rod is consistent with the width of the card slot (251).

5. The automatic chip mounter with self-calibration function according to claim 1, characterized in that: The glue dispensing and drying mechanism (4) comprises a lamp rack (41) and an infrared radiation lamp tube (42); the lamp rack (41) is provided with two groups; the two groups of the lamp racks (41) are tightly connected to the operating table (12); the two groups of the lamp racks (41) are symmetrically placed with respect to the PCB board conveyor belt (141); a plurality of the infrared radiation lamp tubes (42) are provided; the infrared radiation lamp tubes (42) are tightly connected to the lamp rack (41); and the infrared radiation lamp tubes (42) face the PCB board conveyor belt (141).

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