A polishing device

Abstract

The present application relates to the field of semiconductor polishing technology, and in particular to a polishing device, including a device body, the device body including: a polishing disc; a laying mechanism, the laying mechanism is used to lay a polishing pad on the polishing disc, the laying mechanism includes: a carrier, the carrier has a bearing surface, the bearing surface is used to bear the polishing pad, the bearing surface has at least one connecting part, the connecting part is used to detachably connect the polishing pad so that the polishing pad can be attached to the bearing surface; the bearing surface can be pressed and matched with the polishing disc so that the polishing pad and the polishing disc form a force section. The technical problem of how to improve the pasting quality of the polishing pad is solved, and the technical effect of effectively improving the pasting quality of the polishing pad is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor polishing, and in particular to a polishing device. Background Art

[0002] In the field of semiconductor manufacturing, silicon wafers are the basic materials of integrated circuits, and their surface quality is crucial to device performance. CMP (chemical mechanical polishing) technology, as the key process for the final polishing of silicon wafers, can effectively remove microscopic unevenness and residual impurities on the surface of silicon wafers, and improve the flatness and smoothness of the surface of silicon wafers. With the continuous development of semiconductor technology, the requirements for CMP equipment and processes are also increasing. CMP (chemical mechanical polishing) technology, as the key process for the final polishing of silicon wafers, has a vital impact on the surface quality of silicon wafers. However, in CMP equipment, the problem of high particle size has always been a technical challenge. These small particles mainly come from abrasives used in the polishing process, wear of polishing pads, dust inside the equipment, and impurities in chemical solutions. Regarding particle size contamination in polishing equipment, it will also affect the adhesion of polishing pads on polishing discs. When particles exist during the pasting process of polishing pads, the pasting quality of polishing pads will be affected.

[0003] In the prior art, the polishing pad is pasted by manual pressing. In order to improve the pasting quality of the polishing pad, high operating experience is required for the operator. Otherwise, particles will be present between the polishing pad and the polishing disk, which will lead to the bulging of the polishing pad during the polishing process, that is, bubbles will be generated between the polishing pad and the polishing disk, thereby affecting the polishing quality of the wafer.

[0004] Therefore, the technical problem of the prior art is: how to improve the sticking quality of the polishing pad. Summary of the invention

[0005] The present application provides a polishing device, which solves the technical problem of how to improve the sticking quality of the polishing pad, thereby achieving the technical effect of effectively improving the sticking quality of the polishing pad.

[0006] The present application provides a polishing device, which adopts the following technical solution:

[0007] A polishing device, comprising:

[0008] An equipment body, the equipment body is used for polishing silicon wafers, and the equipment body has a processing chamber;

[0009] A filtering mechanism, the filtering mechanism is used to remove particulate matter inside the device body, and the filtering mechanism includes:

[0010] A clean room, the clean room is connected to the processing room, and the clean room and the processing room are at least partially connected;

[0011] A first filter assembly, the first filter assembly is connected between the clean room and the processing room, and the first filter assembly can supply and filter air along a first direction, wherein the first direction is a direction from the processing room to the clean room; and

[0012] The second filter component is connected between the clean room and the processing room, and the second filter component can supply air and filter along a second direction, wherein the second direction refers to the direction from the clean room to the processing room; so that a circulating airflow is formed between the processing room and the clean room.

[0013] Preferably, the first filter component is a first FFU, the second filter component is a second FFU, and the filtration efficiency level of the second FFU is greater than that of the first FFU.

[0014] Preferably, the device body further comprises:

[0015] Polishing discs;

[0016] A laying mechanism, the laying mechanism is used to lay the polishing pad on the polishing disc, the laying mechanism comprises:

[0017] A carrier, wherein the carrier has a bearing surface, the bearing surface is used to bear a polishing pad, the bearing surface has at least one connecting portion, the connecting portion is used to detachably connect the polishing pad, so that the polishing pad can be attached to the bearing surface; the bearing surface can be pressed and matched with the polishing disk, so that the polishing pad and the polishing disk form a force-bearing section; the carrier has a rotational freedom around and a movement freedom along a third direction, so that when the carrier is rotating, the force-bearing section can move along the third direction, and the third direction refers to the direction in which the polishing pad is laid;

[0018] Among them, a sticky layer is provided on the surface of the polishing disk, or a sticky layer is provided on a side of the polishing pad close to the polishing disk, and the sticky layer has a first state and a second state. The sticky layer is not sticky in the first state, and is sticky in the second state. After the polishing pad is laid on the polishing disk, the sticky layer is switched from the first state to the second state so that the polishing pad is adhered to the polishing disk.

[0019] Preferably, the carrier is a cone whose bottom surface is a load-bearing surface.

[0020] Preferably, the carrier is a cylinder, and the bearing surface is the arc side surface of the cylinder.

[0021] Preferably, the connection between the connecting portion and the polishing pad is by bonding, magnetic attraction, or snap connection.

[0022] Preferably, when the polishing pad is laid, an angle space is formed between the polishing disc and the polishing pad; the polishing device further comprises a dust removal mechanism, the dust removal mechanism removes dust in the angle space, and the dust removal mechanism comprises:

[0023] A nozzle, wherein the nozzle is arranged on one side of the polishing disc, and the nozzle is used to form a dust removal airflow, wherein the dust removal airflow forms an airflow channel, and the airflow channel is located on one side of the force-bearing section and is parallel or substantially parallel to the force-bearing section; the nozzle has the freedom of movement along a third direction so that the dust removal airflow can move along the third direction.

[0024] Preferably, the distance between the airflow channel and the stress-bearing section is L, wherein 5cm≤L≤20cm.

[0025] Preferably, it further comprises a driving mechanism, wherein the driving mechanism is used to drive the carrier to move and rotate along the third direction; and the driving mechanism is used to drive the nozzle to move along the third direction.

[0026] Preferably, the carrier has a plurality of airbags, each of which is long and straight and arranged on a bearing surface of the carrier. The airbags are parallel or substantially parallel to the axial direction of the carrier.

[0027] Preferably, the interior of the carrier is hollow, and a plurality of mounting channels are provided on the carrier's bearing surface, the mounting channels are connected to the interior of the carrier, and the airbag is movably connected to the mounting channels along the radial direction of the cross section of the carrier, so that the airbag can move along the radial direction of the cross section of the carrier;

[0028] A balancing block is arranged inside the carrier, and the balancing block is arranged to be smooth so that when the carrier rolls, the balancing block is at the lowest point of the carrier or has a tendency to move toward the lowest point. The balancing block acts on the airbag so that the airbag convexly acts on the force-bearing section.

[0029] Preferably, a plurality of limit plates are provided on the installation channel, a movable plate is provided between the limit plates, the airbag is connected to the movable plate, and the airbag is located on the side of the movable plate away from the axial direction of the carrier so that the movable plate and the airbag can move between the limit plates.

[0030] Preferably, the length of the balancing block is equal to or substantially equal to the length of the carrier, and a sliding surface is provided on the bottom surface of the balancing block, the shape of the sliding surface matches the inner wall of the carrier, so that when the carrier rolls, the balancing block is at the lowest point of the carrier or has a tendency to move toward the lowest point.

[0031] Preferably, a plurality of guide members are arranged on the inner wall of the carrier, the guide members are arranged in a wedge shape, the guide members are arranged between two adjacent mounting channels, the guide members have a guide surface, the guide surface is arranged obliquely along a fourth direction, and an acute angle exists between the fourth direction and the cross-sectional tangent direction of the carrier;

[0032] The bottom of the balancing block is provided with a telescopic member and a reset member, the telescopic member is movably connected to the bottom of the balancing block through the reset member, and the reset member is used to reset the telescopic member so that the telescopic member can extend or retract relative to the balancing block;

[0033] When the carrier is rotating, the telescopic part of the balancing weight passes from the previous airbag through the guide surface to the next airbag and acts on the next airbag, so that the next airbag convexly acts on the force-bearing section.

[0034] Preferably, the angle is between 15° and 30°.

[0035] Preferably, the extension length of the telescopic member is greater than the maximum thickness of the guide member in the radial direction of the carrier.

[0036] Preferably, the interior of the carrier is hollow, and a plurality of mounting channels are provided on the bearing surface of the carrier, the mounting channels are connected to the interior of the carrier, the airbag is clamped in the mounting channels, and the airbag comprises:

[0037] a first airbag, the first airbag being located inside the carrier;

[0038] a second airbag, the second airbag being located in the installation channel and being in communication with the first airbag;

[0039] A balancing block is arranged inside the carrier, and the balancing block is set to be smooth so that when the carrier rolls, the balancing block is at the lowest point of the carrier or has a tendency to move toward the lowest point. The balancing block acts on the first airbag so that the second airbag convexly acts on the force-bearing section.

[0040] Preferably, the length of the balancing block is equal to or substantially equal to the length of the carrier, and a sliding surface is provided on the bottom surface of the balancing block, the shape of the sliding surface matches the inner wall of the carrier, so that when the carrier rolls, the balancing block is at the lowest point of the carrier or has a tendency to move toward the lowest point.

[0041] Preferably, a plurality of guide members are arranged on the inner wall of the carrier, the guide members are arranged in a wedge shape, the guide members are arranged between two adjacent mounting channels, the guide members have a guide surface, the guide surface is arranged obliquely along a fourth direction, and an acute angle exists between the fourth direction and the cross-sectional tangent direction of the carrier;

[0042] The bottom of the balancing block is provided with a telescopic member and a reset member, the telescopic member is movably connected to the bottom of the balancing block through the reset member, and the reset member is used to reset the telescopic member so that the telescopic member can extend or retract relative to the balancing block;

[0043] When the carrier rotates, the telescopic part of the balancing block passes from the previous first airbag through the guide surface to the next first airbag and acts on the next first airbag, so that the second airbag convex corresponding to the next first airbag acts on the force-bearing section.

[0044] Preferably, the angle is between 15° and 30°.

[0045] Preferably, the extension length of the telescopic member is greater than the maximum thickness of the guide member in the radial direction of the carrier.

[0046] In summary, the present application includes at least one of the following beneficial technical effects:

[0047] The polishing equipment of the present invention is provided with a polishing pad arrangement mechanism, which can first arrange the polishing pad on a carrier, and then transfer the polishing pad to the polishing disk through the carrier. The carrier presses against the polishing disk to improve the contact effect between the polishing disk and the polishing pad. At the same time, the dust and particulate matter are cleaned by the dust removal mechanism, thereby further improving the arrangement and adhesion quality of the polishing pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is a schematic diagram of the main body of the polishing equipment described in this application;

[0049] Figure 2 is a schematic diagram of a processing chamber of the polishing equipment described in the present application;

[0050] Figure 3 is a schematic diagram of the filtering mechanism of the polishing device described in the present application;

[0051] Figure 4 is a schematic diagram of the circulating airflow of the polishing equipment described in the present application;

[0052] Figure 5 It is a schematic diagram of the layout mechanism of the polishing equipment described in this application;

[0053] Figure 6 is a schematic diagram of the connection between the polishing disc and the polishing pad in the polishing device described in the present application;

[0054] Figure 7-Figure 9 It is a schematic diagram of a first carrier for arranging the mechanism in the polishing device described in the present application;

[0055] Figure 10-12 It is a schematic diagram of a second carrier of the arrangement mechanism of the polishing device described in the present application;

[0056] Figure 13-Figure 15 is a schematic diagram of a dust removal mechanism of the polishing equipment described in the present application;

[0057] Fig.16 It is a schematic diagram of the airbag structure of the carrier of the arrangement mechanism in the polishing device described in the present application;

[0058] Fig.17 It is a schematic diagram of the airbag protrusion of the carrier of the arrangement mechanism in the polishing device described in the present application;

[0059] Fig.18 It is a schematic diagram of the balance block of the arrangement mechanism in the polishing equipment described in the present application;

[0060] Figure 19-21 This is a schematic diagram of the first type of airbag structure of the arrangement mechanism in the polishing device described in the present application;

[0061] Figure 22-Figure 24 It is a schematic diagram of the second airbag structure of the arrangement mechanism in the polishing equipment described in this application.

[0062] Description of reference numerals: 110, polishing disc; 120, adhesive layer; 130, polishing pad; 140, force-bearing section; 150, angle space; 210, equipment body; 211, processing chamber; 220, filtering mechanism; 221, purification chamber; 222, first filtering assembly; 223, second filtering assembly; 300, frame; 400, laying mechanism; 410, carrier; 411, bearing surface; 412, connecting portion; 420, installation channel; 4 21. Limiting plate; 422. Movable plate; 430. Airbag; 431. First airbag; 432. Second airbag; 440. Balance block; 441. Sliding surface; 442. Telescopic member; 443. Resetting member; 450. Guide member; 451. Guide surface; 500. Dust removal mechanism; 510. Nozzle; 511. Airflow channel; 512. Dust removal airflow; 600. Driving mechanism; 610. First driving assembly; 620. Second driving assembly. DETAILED DESCRIPTION

[0063] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0064] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0065] The embodiment of the present application provides a polishing device, which solves the technical problem of how to effectively remove particle contamination in the CMP device space, thereby achieving the technical effect of effectively removing particle contamination in the CMP device space.

[0066] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0067] In wafer polishing, a key link in precision manufacturing, it is particularly important to control the particle content in the polishing system. This is because the surface quality of the wafer, as a core component of the semiconductor industry, is directly related to the performance, reliability and yield of the subsequent integrated circuit. The polishing process aims to achieve the ultimate smoothness and flawlessness of the wafer surface, and any tiny particles may become a hidden danger that undermines this goal. These particles may not only scratch the wafer surface and introduce defects during the high-speed polishing process, but may also pollute the entire production environment and affect the overall process quality. In order to ensure that the wafer surface reaches nanometer-level flatness and finish and meet the requirements of modern semiconductor industry for high precision and high reliability, strict control of the particle content in the polishing liquid, environment and tools has become an indispensable step. This measure aims to reduce the risk of wafer surface damage, improve product yield and reliability, and also help improve production efficiency and reduce the additional costs caused by wafer scrapping.

[0068] Particle control during wafer polishing is a critical task in semiconductor manufacturing, which is directly related to product quality, cost and market competitiveness. Ensuring the cleanliness of the polishing system through advanced monitoring and purification technology is the cornerstone of achieving high-quality wafer production and promoting the sustainable development of the semiconductor industry.

[0069] like Figure 1-Figure 4 As shown, the present application provides a polishing device for polishing a wafer, and the polishing device includes a device body 210 and a filtering mechanism 220. The device body 210 is used to polish the wafer; the filtering mechanism 220 is used to control the particle content in the polishing system.

[0070] like Figure 1 , 2 As shown, the device body 210 is used to polish the wafer. The device body 210 is the core component of the polishing equipment, which is mainly used to polish the wafer. It integrates a precise mechanical structure, a control system and a power device. By rotating, pressurizing and supplying a polishing liquid, the wafer surface is efficiently and evenly polished to eliminate minor defects and unevenness on the surface and achieve a highly smooth and flat surface quality. The design, manufacture and commissioning of the device body 210 need to follow strict standards and processes to ensure that its performance is stable and reliable and can meet the high-precision requirements of semiconductor manufacturing. Among them, the device body 210 has a processing chamber 211, and the wafer is located in the processing chamber 211 to complete polishing. In other words, the processing chamber 211 is also an important part of the polishing system. The filtering mechanism 220 of the present application is used to control the content of particulate matter in the processing chamber 211 to minimize the impact of particulate matter on the wafer.

[0071] like Figure 3 , 4As shown, the filter mechanism 220 is used to control the content of particles in the polishing system. The filter mechanism 220 is a key part of the polishing equipment for controlling the content of particles in the polishing system. During the polishing process, the friction between the polishing liquid and the wafer surface will generate a large number of tiny particles. If these particles are not removed in time, they will scratch and contaminate the wafer surface, affecting the quality and performance of the product.

[0072] Further, such as Figure 3 , 4 As shown, the filtering mechanism 220 includes a purification chamber 221, a first filter component 222 and a second filter component 223. The purification chamber 221 is used to provide an airflow circulation space for the first filter component 222 and the second filter component 223. The first filter component 222 and the second filter component 223 are used to filter the gas in the processing chamber 211 to reduce the particulate matter content in the processing chamber 211.

[0073] like Figure 3 , 4 As shown, the clean room 221 is disposed on the top of the processing room 211. Specifically, the clean room 221 is at least partially connected to the processing room 211, so that the airflow of the processing room 211 can enter the clean room 221, so that the clean room 221 provides an airflow circulation space for the first filter assembly 222 and the second filter assembly 223. The clean room 221 is connected to the processing room 211 at least at two locations, so that the air in the processing room 211 can enter the clean room 221 and then return to the processing room 211.

[0074] like Figure 3 , 4 As shown, the first filter assembly 222 and the second filter assembly 223 are used to filter the air in the processing chamber 211 to reduce the content of particulate matter in the processing chamber 211. The first filter assembly 222 is connected between the clean room 221 and the processing chamber 211. The first filter assembly 222 can send air in a first direction to form an airflow and filter the airflow. The first direction is the direction from the processing chamber 211 to the clean room 221; the second filter assembly 223 is connected between the clean room 221 and the processing chamber 211. The second filter assembly 223 can send air in a second direction to form an airflow and filter the airflow. The second direction is the direction from the clean room 221 to the processing chamber 211; in this way, the air in the processing chamber 211 is filtered by the first filter assembly 222 and enters the clean room 221. The air in the clean room 221 is then filtered by the second filter assembly 223 and returns to the processing chamber 211 to form a circulating airflow; after double filtering by the first filter assembly 222 and the second filter assembly 223, the content of particulate matter in the air of the processing chamber 211 is greatly reduced.

[0075] In one embodiment, Figure 3 , 4As shown, the first filter assembly 222 is the first FFU, and the second filter assembly 223 is the second FFU, wherein the filtration level of the second FFU is greater than the filtration level of the first FFU. The first FFU is installed between the clean room 221 and the processing room 211, and its main function is to preliminarily filter the airflow flowing from the processing room 211 to the clean room 221. This step effectively removes larger or medium-sized particles in the air, laying the foundation for subsequent deep filtration. The first FFU supplies air along the first direction (processing room 211 to clean room 221), and the formed airflow is purified when passing through the filter medium inside it. The second FFU is also located between the clean room 221 and the processing room 211, so that the air that has been further processed (such as temperature, humidity adjustment or other purification steps) by the clean room 221 is filtered again and sent back to the processing room 211. Since the filtration level of the second FFU is higher than that of the first FFU, it can capture and remove finer particles, thereby providing higher quality air to the processing room 211. Contrary to the first FFU, the second FFU supplies air in the second direction (from the clean room 221 to the processing room 211 ), ensuring that the double-filtered clean air can re-enter the processing room 211 , forming a closed-loop circulating airflow system.

[0076] Further, such as Figure 5 As shown, the equipment body 210 also includes a polishing disk 110 and a laying mechanism 400. The polishing disk 110 is used to carry the wafer, that is, the wafer is placed on the polishing disk 110 for polishing. It is worth noting that a polishing pad 130 needs to be laid on the polishing disk 110; the laying mechanism 400 is used to lay the polishing pad 130 on the polishing disk 110 so that relative movement occurs between the wafer and the polishing pad 130 to complete polishing.

[0077] like Figure 6 As shown, the polishing disc 110 is a core component of the polishing equipment. After the polishing pad 130 is arranged on the polishing disc 110, it is used to support the polishing pad 130 and polish the wafer.

[0078] like Figure 7-Figure 12As shown, the arrangement mechanism 400 is used to arrange the polishing pad 130 on the polishing disk 110. The arrangement mechanism 400 includes a carrier 410, and the carrier 410 has a bearing surface 411, and the bearing surface 411 is set as a convex arc surface, and the bearing surface 411 is used to carry the polishing pad 130. The polishing pad 130 is first arranged on the bearing surface 411 of the carrier 410, and then the polishing pad 130 is transferred to the polishing disk 110 through the carrier 410 to complete the arrangement of the polishing pad 130; wherein, the bearing surface 411 has at least one connecting portion 412, and the connecting portion 412 is detachably connected to the polishing pad 130, so that the polishing pad 130 can be at least partially fixed on the bearing surface 411; in this way, during the transfer process of the polishing pad 130 from the carrier 410 to the polishing disk 110. The carrier 410 (bearing surface 411) presses the polishing pad 130 against the polishing disk 110 to form a force-bearing section 140. The force-bearing section 140 refers to the area formed by the contact between the polishing pad 130 and the polishing disk 110. Since the bearing surface 411 is set as an arc surface, the polishing pad 130 is in linear contact with the polishing pad 130 under the pressure of the carrier 410; the carrier 410 has the degree of freedom of rotation around and the degree of freedom of movement along the third direction, so that when the carrier 410 rotates, the force-bearing section 140 can move along the third direction. The third direction refers to the direction in which the polishing pad 130 is laid.

[0079] Among them, Figure 6 As shown, the surface of the polishing disc 110 is provided with a sticky layer 120, and the sticky layer 120 is used to bond the polishing disc 110 and the polishing pad 130. The sticky layer 120 has a first state and a second state. The sticky layer 120 is not sticky in the first state; the sticky layer 120 is sticky in the second state; thus, before the polishing pad 130 is arranged on the polishing disc 110, the sticky layer 120 is not sticky, and it is necessary to activate the sticky layer 120 to switch the sticky layer 120 from the first state to the second state, so that the polishing pad 130 is bonded to the polishing disc 110 to complete the arrangement and bonding of the polishing pad 130.

[0080] Alternatively, a sticky layer 120 is provided on one surface of the polishing pad 130 close to the polishing disk 110, and the sticky layer 120 is used to bond the polishing disk 110 and the polishing pad 130. The sticky layer 120 has a first state and a second state. The sticky layer 120 is not sticky in the first state; the sticky layer 120 is sticky in the second state; in this way, before the polishing pad 130 is arranged on the polishing disk 110, the sticky layer 120 is not sticky, and it is necessary to activate the sticky layer 120 to switch the sticky layer 120 from the first state to the second state, so that the polishing pad 130 is bonded to the polishing disk 110 to complete the arrangement and bonding of the polishing pad 130.

[0081] Specifically, Figure 7-Figure 9As shown, a bearing surface 411 of the carrier 410 is in the form of an outwardly convex arc. After the connection portion 412 connects the polishing pad 130 to the bearing surface 411, the carrier 410 presses the polishing pad 130 against the polishing plate 110 with the bearing surface 411 facing the polishing pad 130. Since the bearing surface 411 is set as an arc surface, the polishing pad 130 is also set on the bearing surface 411 to form an arc surface, so that the polishing pad 130 and the polishing plate 110 are in line contact, that is, a force section 140 is formed between the polishing plate 110 and the bearing surface 411. In this force section 140, The polishing pad 130 in 40 is subjected to pressure between the bearing surface 411 (carrier 410) and the polishing disk 110, so that the polishing pad 130 is pressed against the polishing disk 110; further, the carrier 410 can rotate so that the force-bearing section 140 can move along the third direction. In other words, as the carrier 410 rotates, the force-bearing section 140 formed between the polishing pad 130 and the polishing disk 110 moves along the third direction, that is, the pressed part of the polishing pad 130 moves along the third direction, so that the polishing pad 130 is gradually arranged on the polishing disk 110 in the third direction.

[0082] Further, such as Figure 7-Figure 9 As shown, the connection method of the connection part 412 can be: the connection part 412 is connected to one end of the polishing pad 130, and the end of the polishing pad 130 away from the connection part 412 first contacts the polishing plate 110, and when the carrier 410 is driven to rotate, the force-bearing section 140 moves along the third direction, so that the polishing pad 130 can be gradually arranged along the third direction. The connection part 412 can be detachably connected to the polishing pad 130 in the form of bonding, magnetic attraction or buckle, and after the polishing pad 130 is completely arranged on the polishing plate 110, the connection of the connection part 412 can be cancelled.

[0083] In one embodiment, Figure 7-Figure 9 As shown, the carrier 410 is a cone with an arc-shaped bottom surface, and the bearing surface 411 is the arc-shaped surface. The bearing surface 411 is substantially the same size as the polishing pad 130. The carrier 410 is connected to the polishing pad 130 via a connecting portion 412. One end of the polishing pad 130 is pressed against the polishing disk 110 by the pressure of the carrier 410, and the other end of the polishing pad 130 is connected to the carrier 410 via the connecting portion 412, so that the polishing pad 130 can be fitted and fixed on the bearing surface 411. In this way, when the carrier 410 is driven to rotate, the force-bearing section 140 formed between the polishing pad 130 and the polishing disk 110 moves along the third direction, so that the polishing pad 130 is gradually arranged along the third direction while being pressed at the position of the force-bearing section 140.

[0084] In another embodiment, Figure 10-12As shown, the carrier 410 is a cylinder, and the bearing surface 411 is the arc-shaped side surface of the cylinder. When the cross-sectional radius of the cylinder is large, the polishing pad 130 is connected to the polishing disc 110 through the connecting portion 412, and there is no overlapping portion of the polishing pad 130; when the cross-sectional radius of the cylinder is small, the polishing pad 130 is connected to the polishing pad 130 through the connecting portion 412, and there is an overlapping portion of the polishing pad 130, that is, the polishing pad 130 is wound on the side surface of the cylinder; but it is worth noting that in both cases, the carrier 410 can be connected to the polishing disc 110 through the connecting portion 412. The connecting portion 412 is connected to the polishing pad 130, and one end of the polishing pad 130 is pressed against the polishing disk 110 by the pressure of the carrier 410, and the other end of the polishing pad 130 is connected to the carrier 410 through the connecting portion 412, so that the polishing pad 130 can be fitted and fixed on the bearing surface 411. In this way, when the carrier 410 is driven to rotate, the force-bearing section 140 formed between the polishing pad 130 and the polishing disk 110 moves along the third direction, so that the polishing pad 130 is gradually arranged along the third direction while being pressed at the position of the force-bearing section 140.

[0085] As a preferred example, Figure 5 As shown, a frame 300 is provided on both sides of the polishing disk 110, and a driving mechanism 600 is provided on the frame 300. The driving mechanism 600 includes a first driving component 610 and a second driving component 620. The first driving component 610 is used to drive the carrier 410 to rotate and roll. The first driving component 610 is arranged along the third direction. In one embodiment, the first driving component 610 is a linear motor, and the carrier 410 is connected to the first driving component 610 through a bearing, so that the carrier 410 can rotate and roll while being driven by the linear motor, that is, when the carrier 410 is driven to rotate, the force-bearing section 140 formed between the polishing pad 130 and the polishing disk 110 moves along the third direction, so that the polishing pad 130 is gradually arranged along the third direction while being pressed at the position of the force-bearing section 140.

[0086] The polishing device also includes a dust removal mechanism 500, such as Figure 13-Figure 15 As shown, the dust removal mechanism 500 is used to remove dust from the polishing disc 110 to reduce the possibility of bubbles forming between the polishing disc 110 and the polishing pad 130. It is understandable that if there is dust between the polishing pad 130 and the polishing disc 110, after the polishing pad 130 is laid, due to the change in temperature, bubbles will be formed in the area where the dust is located, and the increase in bubbles will cause the polishing pad 130 to bulge, thereby affecting the polishing quality. Therefore, before or while the polishing pad 130 is laid, the area between the polishing disc 110 and the polishing pad 130 needs to be dusted.

[0087] It is understandable that if Figure 13-Figure 15As shown, when the bearing surface 411 of the carrier 410 presses the polishing pad 130 against the polishing disk 110 and forms a force-bearing section 140, an angle space 150 is formed between the polishing disk 110 and the polishing pad 130. The angle space 150 refers to the position where the polishing pad 130 and the polishing disk 110 are to be in contact. Therefore, it is necessary to perform dust removal treatment on the angle space 150, and the dust removal mechanism 500 is used to perform dust removal treatment on the angle space 150.

[0088] Specifically, Fig.15 As shown, the dust removal mechanism 500 includes a nozzle 510, which is arranged on one side of the polishing disk 110, the nozzle 510 is directed toward the polishing disk 110 and the direction of the nozzle 510 is parallel or substantially parallel to the force-bearing section 140, the nozzle 510 is used to form a dust removal airflow 512 in front of the force-bearing section 140 (or the angle space 150) in the third direction. Specifically, an airflow channel 511 is formed on the polishing disk 110, and the dust removal airflow 512 is formed in the airflow channel 511, the airflow channel 511 (dust removal airflow 512) is located on one side of the force-bearing section 140 (angle space 150), and the nozzle 510 has the freedom of movement along the third direction, so that the airflow channel 511 (dust removal airflow 512) can also move along the third direction.

[0089] It is worth noting that if Fig.15 As shown, there is a certain positional relationship between the position of the airflow channel 511 (dust removal airflow 512) and the force-bearing section 140 (angle space 150), and both the nozzle 510 and the force-bearing section 140 are movable. By driving the nozzle 510 and the carrier 410, it is satisfied that: the airflow channel 511 (dust removal airflow 512) is located at a distance L of 5cm to 20cm (including 5cm and 20cm) from the force-bearing section 140 in the third direction, that is, a spacing distance is formed at one end between the airflow channel 511 (dust removal airflow 512) and the force-bearing section 140, so that the dust removal airflow 512 will not directly act on the angle space 150, thereby avoiding blowing the dust in the angle space 150 into the angle space 150; at the distance L in the third direction of the force-bearing section 140, The dust removal airflow 512 formed at the position removes dust from the polishing disk 110 and the angle space 150. On the one hand, the dust removal airflow 512 can directly blow away the dust located at the spacing L along the third direction of the force-bearing section 140; on the other hand, since the air pressure is relatively small at the position where the air flow velocity is large, by using the Bernoulli principle, the air flow velocity in the angle space 150 is small and the air pressure is large. In this way, the dust located in the angle space 150 can be brought out by the air pressure difference and blown away by the dust removal airflow 512; it should be noted that at this time, the viscosity of the polishing pad 130 and the polishing disk 110 has not yet been activated, and the dust can be removed by the dust removal airflow 512. After the polishing pad 130 is laid out, the viscosity layer 120 is activated, so that the polishing pad 130 and the polishing disk 110 can be bonded, and there is no dust between the two.

[0090] As a preferred example, Fig.15 As shown, a frame 300 is provided on both sides of the polishing disc 110, and the nozzle 510 is movably connected to the frame 300 through the second drive component 620 so that the nozzle 510 can move along the third direction. The first drive component 610 is arranged along the third direction. In one embodiment, the second drive component 620 is a linear motor; under the cooperative drive of the first drive component 610 and the second drive component 620, the force-bearing section 140 and the dust removal airflow 512 can maintain a distance L and move forward synchronously along the third direction.

[0091] Furthermore, a force-bearing section 140 is formed between the polishing pad 130 of the carrier 410 and the polishing disk 110. The polishing pad 130 located on the force-bearing section 140 is subjected to the pressure of the carrier 410 on the polishing disk 110. In order to improve the contact tightness between the polishing pad 130 on the force-bearing section 140 and the polishing disk 110, further optimization of the carrier 410 is proposed.

[0092] like Fig.16 , 17 As shown, since the carrier 410 moves in the third direction through the first driving assembly 610, the connection between the first driving assembly 610 and the carrier 410 limits the position of the carrier 410 in the direction perpendicular to the polishing disk 110. Therefore, the present application arranges an airbag 430 on the carrier 410, and adjusts the size or position of the airbag 430 to achieve pressure adjustment on the polishing disk 110; specifically, the airbag 430 is arranged in a long straight shape and has a plurality of airbags 430, and the airbag 430 is arranged on the bearing surface 411 of the carrier 410, The arrangement direction of the airbag 430 is parallel or substantially parallel to the axial direction of the carrier 410. Thus, when a force-bearing section 140 is formed between the polishing pad 130 and the polishing disk 110, the airbag 430 is located at the position of the force-bearing section 140. By adjusting the state such as the pressure of the airbag 430, the pressure degree of the polishing pad 130 on the force-bearing section 140 can be adjusted. In other words, by squeezing the polishing pad 130 located on the force-bearing section 140 by the airbag 430, the contact between the polishing pad 130 and the polishing disk 110 is made closer.

[0093] In one embodiment, Figure 18-Figure 21As shown, the airbag 430 disposed on the carrier 410 is movable. When the carrier 410 rotates, the airbag 430 on the carrier 410 can protrude and act on the polishing pad 130 located on the force-bearing section 140, so that the force between the polishing pad 130 and the polishing disk 110 is greater and the contact is closer. Specifically, the carrier 410 is set to be hollow, and a plurality of mounting channels 420 are set on the bearing surface 411 of the carrier 410. The outside and the inside of the carrier 410 are connected through the mounting channels 420. An airbag 430 is set on the mounting channel 420. The airbag 430 is movably connected to the mounting channel 420 along the cross-sectional radius direction of the carrier 410, so that the airbag 430 can move in the cross-sectional radius direction of the carrier 410; in order to enable the airbag 430 to move on the cross-sectional radius of the carrier 410, a movable balancing block 440 is set inside the carrier 410, so that the balancing block 440 can slide inside the carrier 410. During the rotation or rolling process of the carrier 410, the balancing block 440 always remains at the lowest point inside the carrier 410, or has a tendency to move toward the lowest point, so that the balancing block 440 acts on the airbag 430 to make the airbag 430 bulge on the force-bearing section 140, so that the bulge of the airbag 430 acts on the polishing pad 130 located on the force-bearing section 140.

[0094] In order to improve the flexibility and accuracy of the movement of the balancing weight 440 inside the carrier 410, as shown in FIG. Fig.18 As shown, the inner wall of the carrier 410 is a smooth arc surface, and correspondingly, the bottom surface of the balancing block 440 is provided with a sliding surface 441, and the sliding surface 441 is used to slide with the inner wall of the carrier 410, wherein the sliding surface 441 is consistent with the inner wall of the carrier 410, so that when the carrier 410 rotates or rolls, the balancing block 440 always remains at the lowest point inside the carrier 410, or has a tendency to move toward the lowest point; for example, the inner wall of the carrier 410 is an arc surface and the cross-section of the balancing block 440 is a semicircle; wherein the length of the balancing block 440 is equal to or substantially equal to the length of the carrier 410, or the length of the balancing block 440 is equal to or substantially equal to the length of the airbag 430, so that the balancing block 440 can act on the entire airbag 430 so that the airbag 430 can effectively bulge.

[0095] Further, such as Figure 19-21As shown, the airbag 430 is movably connected to the mounting channel 420, and is raised compared to the surface of the carrier 410 by the pressure of the balancing block 440. A plurality of limiting plates 421 are provided on each mounting channel 420, and a movable plate 422 is connected to the airbag 430, and the movable plate 422 is provided between the limiting plates 421, so that the movable plate 422 and the airbag 430 are limited to move between the limiting plates 421, wherein the airbag 430 is located on the side of the movable plate 422 away from the axial direction of the carrier 410, so that when the balancing block 440 acts on the movable plate 422, the airbag 430 is raised on the force-bearing section 140.

[0096] Furthermore, if Figure 19-21 As shown, a guide member 450 is provided on the inner wall of the carrier 410 for guiding the balancing block 440 so that the balancing block 440 can accurately and effectively act on the airbag 430 (or the movable plate 422). There are multiple groups of guide members 450. Specifically, the guide members 450 are located between every two adjacent installation channels 420. The bottom surface of the carrier 410 is provided with a telescopic member 442 and a reset member 443. The telescopic member 442 is connected to the bottom surface of the carrier 410 through the reset member 443, so that the telescopic member 442 can extend or retract relative to the balancing block 440. In one embodiment, the reset member 443 can be a spring. In this way, when the balancing block 440 moves inside the carrier 410, the guide member 450 is moved in the guide member 443. 50, the telescopic member 442 at the bottom of the balancing block 440 can accurately act on the movable plate 422 located in the installation channel 420 after passing through the guide member 450, that is, act on the airbag 430, so that the airbag 430 bulges on the force-bearing section 140; specifically, the guide member 450 is wedge-shaped, and has a guide surface 451 on the guide member 450, and the guide surface 451 is used for guiding and cooperating with the telescopic member 442 of the balancing block 440, and the guide surface 451 is inclined upward along the fourth direction. The fourth direction is set to have an acute angle with the cross-sectional tangent of the carrier 410, preferably between 15 and 30 degrees; in other words, when the carrier 410 rotates or rolls, the guide member 450 on the guide member 450 at the bottom is tilted from low to high along the third direction, and as the carrier 410 rotates, the telescopic member 442 set on the balance block 440 slides on the guide surface 451 and gradually retracts. When the telescopic member 442 jumps over the guide member 450, the telescopic member 442 is on the reset member 4 43 resets and pops out under the action of the balancing block 440, so that the balancing block 440 can act on the airbag 430 (mounting plate) of the next mounting channel 420; in this way, during the rotation of the carrier 410, the telescopic member 442 of the balancing block 440 passes through the guide surface 451 from the previous airbag 430 (movable plate 422) to the next airbag 430 (movable plate 422) and acts on the next airbag 430 (movable plate 422), so that the next airbag 430 convexly acts on the force-bearing section 140.

[0097] It is worth noting that the extension length of the telescopic member 442 should be greater than the maximum thickness of the guide member 450 so that the telescopic member 442 can contact and press against the airbag 430 (movable plate 422) after jumping over the guide member 450, wherein the maximum thickness refers to the thickness of the thickest position of the wedge-shaped guide member 450.

[0098] In another embodiment, Figure 22-Figure 24 As shown, the airbag 430 disposed on the carrier 410 can adjust the pressure. When the carrier 410 rotates, the airbag 430 on the carrier 410 can adjust the pressure so that the airbag 430 protrudes to act on the polishing pad 130 located on the force-bearing section 140, so that the polishing pad 130 and the polishing disk 110 are in closer contact.

[0099] Specifically, Figure 22-Figure 24 As shown, the carrier 410 is set to be hollow, and a plurality of mounting channels 420 are set on the bearing surface 411 of the carrier 410, the outside and the inside of the carrier 410 are connected through the mounting channels 420, and an airbag 430 is clamped on the mounting channels 420. The airbag 430 includes a first airbag 431 and a second airbag 432. The first airbag 431 is located inside the carrier 410, and the second airbag 432 is located in the mounting channels 420 of the carrier 410. The first airbag 431 and the second airbag 432 are connected; a movable balancing block 430 is set inside the carrier 410. 40, so that the balancing block 440 can slide inside the carrier 410, and during the rotation or rolling process of the carrier 410, the balancing block 440 always remains at the lowest point inside the carrier 410, or has a tendency to move toward the lowest point, so that the balancing block 440 acts on the first airbag 431, compressing the first airbag 431 and expanding the second airbag 432, so that the second airbag 432 overflows and bulges from the installation channel 420, that is, the second airbag 432 bulges on the force-bearing section 140, thereby acting on the polishing pad 130 located on the force-bearing section 140. It is worth noting that the connection between the first airbag 431 and the second airbag 432 is relatively thick, so that it is not easy to deform and can be firmly stuck in the installation channel 420.

[0100] In order to improve the flexibility and accuracy of the movement of the balancing weight 440 inside the carrier 410, as shown in FIG. Fig.18As shown, the inner wall of the carrier 410 is a smooth arc surface, and correspondingly, the bottom surface of the balancing block 440 is provided with a sliding surface 441, and the sliding surface 441 is used to slide with the inner wall of the carrier 410, wherein the sliding surface 441 is consistent with the inner wall of the carrier 410, so that when the carrier 410 rotates or rolls, the balancing block 440 always remains at the lowest point inside the carrier 410, or has a tendency to move toward the lowest point; for example, the inner wall of the carrier 410 is an arc surface and the cross-section of the balancing block 440 is a semicircle; wherein the length of the balancing block 440 is equal to or substantially equal to the length of the carrier 410, or the length of the balancing block 440 is equal to or substantially equal to the length of the airbag 430, so that the balancing block 440 can act on the entire airbag 430 so that the airbag 430 can effectively bulge.

[0101] Further, such as Fig.23 , 24 As shown, a guide member 450 is provided on the inner wall of the carrier 410 for guiding the balancing weight 440 so that the balancing weight 440 can act on the first airbag 431 accurately and effectively. There are multiple groups of guide members 450. Specifically, the guide members 450 are located between every two adjacent installation channels 420. The bottom surface of the carrier 410 is provided with a telescopic member 442 and a reset member 443. The telescopic member 442 is connected to the bottom surface of the carrier 410 through the reset member 443, so that the telescopic member 442 can extend or retract relative to the balance block 440. In one embodiment, the reset member 443 can be a spring. In this way, when the balance block 440 moves inside the carrier 410, under the action of the guide member 450, the telescopic member 442 at the bottom of the balance block 440 can accurately act on the first airbag 431 after passing through the guide member 450, so that the second airbag 432 protrudes on the force-bearing section 140. Specifically, the guide member 450 is wedge-shaped, and has a guide surface 451 on the guide member 450. The guide surface 451 is used to guide and cooperate with the telescopic member 442 of the balance block 440, and the guide surface 451 is inclined upward along the fourth direction. , the fourth direction is at an acute angle to the cross-sectional tangent of the carrier 410, preferably between 15 and 30 degrees; in other words, when the carrier 410 rotates or rolls, the guide member 450 on the guide member 450 at the bottom is tilted from low to high along the tangent of the carrier 410, and as the carrier 410 rotates, the telescopic member 442 arranged on the balancing block 440 slides on the guide surface 451 and gradually retracts. After the telescopic member 442 jumps over the guide member 450, the telescopic member 442 is reset and popped out under the action of the reset member 443, so that the balancing block 440 can act on the first airbag 431 of the next installation channel 420; in this way, during the rotation of the carrier 410, the telescopic member 442 of the balancing block 440 passes from the previous first airbag 431 through the guide surface 451 to the next first airbag 431 and acts on the next first airbag 431, so that the next second airbag 432 convexly acts on the force-bearing section 140.

[0102] It is worth noting that the extension length of the telescopic member 442 should be greater than the maximum thickness of the guide member 450, so that the telescopic member 442 can contact and press on the first airbag 431 after jumping over the guide member 450, wherein the maximum thickness refers to the thickness at the thickest position of the wedge-shaped guide member 450.

[0103] Thus, by setting the airbag 430, when the carrier 410 is rolling or rotating, the force-bearing convexity of the airbag 430 acts on the polishing pad 130 located on the force-bearing section 140, thereby increasing the contact pressure between the polishing pad 130 and the polishing disk 110, which is beneficial to improving the effectiveness of the contact between the polishing pad 130 and the polishing disk 110; at the same time, the dust on the polishing disk 110 and the dust in the angle space 150 are removed by the nozzle 510, thereby improving the laying effect of the polishing pad 130. Further, after the polishing pad 130 is laid on the polishing disk 110, the adhesive layer 120 is activated to make the adhesive layer 120 adhesive, and the adhesiveness of the adhesive layer 120 is activated. In one embodiment, the adhesive layer 120 can be a thermosetting adhesive or a hot melt adhesive; thereby, the polishing pad 130 is bonded to the polishing disk 110. Since dust removal is performed while the polishing pad 130 is laid, the possibility of dust is reduced, and the polishing pad 130 and the polishing disk 110 are firmly bonded.

[0104] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0105] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A polishing device, characterized in that: The device comprises a device body, wherein the device body comprises: Polishing discs; A laying mechanism, the laying mechanism is used to lay the polishing pad on the polishing disc, the laying mechanism comprises: A carrier, wherein the carrier has a bearing surface, the bearing surface is used to bear a polishing pad, the bearing surface has at least one connecting portion, the connecting portion is used to detachably connect the polishing pad, so that the polishing pad can be attached to the bearing surface; the bearing surface can be pressed and matched with the polishing disk, so that the polishing pad and the polishing disk form a force-bearing section; the carrier has a rotational freedom around and a movement freedom along a third direction, so that when the carrier is rotating, the force-bearing section can move along the third direction, and the third direction refers to the direction in which the polishing pad is laid; Wherein, the surface of the polishing disc is provided with a sticky layer, or the side of the polishing pad close to the polishing disc has a sticky layer, the sticky layer has a first state and a second state, the sticky layer is not sticky in the first state, and the sticky layer is sticky in the second state; after the polishing pad is laid on the polishing disc, the sticky layer is switched from the first state to the second state so that the polishing pad is adhered to the polishing disc; When laying the polishing pad, an angle space is formed between the polishing disc and the polishing pad; the polishing device also includes a dust removal mechanism, which removes dust in the angle space, and the dust removal mechanism includes: A nozzle, the nozzle is arranged at one side of the polishing disc, the nozzle is used to form a dust removal airflow, the dust removal airflow forms an airflow channel, the airflow channel is located at one side of the force-bearing section, and is parallel or substantially parallel to the force-bearing section; the nozzle has a degree of freedom of movement along a third direction, so that the dust removal airflow can move along the third direction; The carrier has a plurality of airbags, each of which is long and straight and arranged on the bearing surface of the carrier. The airbags are parallel or substantially parallel to the axial direction of the carrier. The interior of the carrier is hollow, and a plurality of mounting channels are arranged on the bearing surface of the carrier, the mounting channels are connected to the interior of the carrier, and the airbag is movably connected to the mounting channels along the radial direction of the cross section of the carrier, so that the airbag can move along the radial direction of the cross section of the carrier; A balancing block is arranged inside the carrier, and the balancing block is arranged to be smooth so that when the carrier rolls, the balancing block is at the lowest point of the carrier or has a tendency to move toward the lowest point. The balancing block acts on the airbag so that the airbag convexly acts on the force-bearing section.

2. A polishing device according to claim 1, characterized in that: The distance between the airflow channel and the stress-bearing section is L, wherein 5cm≤L≤20cm.

3. A polishing device according to claim 1, characterized in that: It also includes a driving mechanism, which is used to drive the carrier to move and rotate along the third direction; and the driving mechanism is used to drive the nozzle to move along the third direction.

4. A polishing device according to claim 1, characterized in that: A plurality of limit plates are arranged on the installation channel, a movable plate is arranged between the limit plates, the airbag is connected to the movable plate, and the airbag is located on the side of the movable plate away from the axial direction of the carrier so that the movable plate and the airbag can move between the limit plates.

5. A polishing device according to claim 1, characterized in that: The length of the balancing block is equal to or substantially equal to the length of the carrier, and a sliding surface is provided on the bottom surface of the balancing block, the shape of the sliding surface matches the inner wall of the carrier, so that when the carrier rolls, the balancing block is at the lowest point of the carrier or has a tendency to move toward the lowest point.

6. A polishing device according to claim 5, characterized in that: A plurality of guide members are arranged on the inner wall of the carrier, the guide members are arranged in a wedge shape, the guide members are arranged between two adjacent mounting channels, the guide members have a guide surface, the guide surface is arranged obliquely along a fourth direction, and an acute angle exists between the fourth direction and the cross-sectional tangent direction of the carrier; The bottom of the balancing block is provided with a telescopic member and a reset member, the telescopic member is movably connected to the bottom of the balancing block through the reset member, and the reset member is used to reset the telescopic member so that the telescopic member can extend or retract relative to the balancing block; When the carrier is rotating, the telescopic part of the balancing weight passes from the previous airbag through the guide surface to the next airbag and acts on the next airbag, so that the next airbag convexly acts on the force-bearing section.

7. A polishing device according to claim 6, characterized in that: The angle is between 15° and 30°.

8. A polishing device according to claim 6, characterized in that: The extended length of the telescopic member is greater than the maximum thickness of the guide member in the radial direction of the carrier.

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