A method and device for improving the safety of a clean room in chip manufacturing based on a bus duct

Abstract

The application provides a method and device for improving the safety of a clean room in a chip manufacturing process based on a bus duct. The bus duct used in the application is provided with a cooling device. The cooling device is filled with a coolant in a cooling pipeline. The cooling pipeline is made of a heat-conducting metal material. The cooling pipeline and the bus are provided with a heat-conducting silica gel insulating sheet. The insulating sheet has a good heat exchange effect while limiting the temperature, thereby helping the bus to reduce the temperature. Meanwhile, the first bus duct and the second bus duct are connected through a concave-convex structure and a positioning structure, which facilitates the installation of the bus duct. After the first current noise signal is processed to obtain a second current noise signal, the second current noise signal is compared with a standard arc signal, so that it can be judged whether there is an arc phenomenon in the bus duct at present. When there is an arc phenomenon, a prompt information is sent out, so that the security personnel can check the bus duct. Through the above structure and method, the safety of the clean room is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of bus duct, in particular to a method and device for improving the safety of a clean room in chip processing based on a bus duct. BACKGROUND

[0002] In the clean room of chip processing, many special gases are used, such as hydrogen (H2), methane (CH4), silane (SiH4), phosphine (PH3) and acetylene (C2H2), etc. These gases are flammable and explosive gases. If these gases leak, and there are objects with high temperature in the clean room, combustion or even explosion may occur.

[0003] In the clean room, in order to meet the power demand of high-power electrical equipment, a bus duct is usually used to supply power to the equipment. However, the bus duct generates a large amount of heat during use, and as the use time increases, the connection of the bus duct will loosen due to thermal expansion and contraction, and arc phenomenon will occur at the loosened part, which poses a serious safety hazard to the clean room. SUMMARY

[0004] Therefore, the embodiments of the present application provide a method and device for improving the safety of a clean room in chip processing based on a bus duct, so as to improve the safety of the clean room in chip processing.

[0005] In a first aspect, the embodiments of the present application provide a method for improving the safety of a clean room in chip manufacturing based on a bus duct. The method is for a bus duct system arranged in a clean room in chip manufacturing. The bus duct system includes a first bus duct and a second bus duct. The first bus duct and the second bus duct each include a first protective shell, a cooling device, and N bus bars arranged in the first protective shell, where N is a positive integer. The cooling device includes N+1 cooling pipelines, a circulating motor, and a heat sink. The bus bars and the cooling pipelines are arranged alternately. An inlet of the circulating motor is in communication with an outlet of the heat sink through a pipeline. An inlet of the heat sink is in communication with one end of each cooling pipeline through a pipeline. An outlet of the circulating motor is in communication with the other end of each cooling pipeline. Each cooling pipeline is filled with a coolant. The coolant circulates under the action of the circulating motor. The heat sink dissipates heat from the coolant. The cooling pipelines are made of a heat-conductive metal material. The width of the bus bars is equal to the width of the cooling pipelines. Heat-conductive silica gel insulating sheets are arranged between the bus bars and the cooling pipelines. The first bus duct and the second bus duct each include a first connecting end and a second connecting end. One end of the N bus bars is connected to the first connecting end. The other end of the N bus bars is connected to the second connecting end. The first bus duct and the second bus duct are arranged alternately. The first connecting end of the first bus duct is connected to the second connecting end of the second bus duct. The first connecting end of the first bus duct includes at least one recess. The second connecting end of the second bus duct includes at least one protrusion. The number of the protrusions is equal to the number of the recesses. The first connecting end of the first bus duct is connected to the second connecting end of the second bus duct by inserting the protrusions into the recesses. The protrusions include at least one semicircular elastic positioning pin. The recesses include at least one semicircular positioning hole. The number of the positioning pins is equal to the number of the positioning holes. The positioning pins and the positioning holes are used for positioning and connecting the first connecting end of the first bus duct to the second connecting end of the second bus duct. The method includes the following steps:

[0006] Denoising the obtained first current noise signal of the bus duct system according to a standard current noise signal of the bus duct system to obtain a second current noise signal;

[0007] Extracting features from the second current noise signal and a standard arc signal respectively to obtain a first feature frame sequence corresponding to the second current noise signal and a second feature frame sequence corresponding to the standard arc signal;

[0008] Aligning the first feature frame sequence and the second feature frame sequence to generate an aligned sequence frame;

[0009] determining whether the target feature in the alignment sequence frame is continuously repeated and the time interval of the repeated occurrence is equal;

[0010] If yes, a prompt information that an arc phenomenon occurs in the bus duct system is sent.

[0011] Optionally, the bus duct system further comprises a second protective shell, the second protective shell surrounds the first connecting end of the first bus duct and the second connecting end of the second bus duct, and the first protective shell and the second protective shell are fixedly connected.

[0012] Optionally, the bus duct system further comprises a temperature sensor for detecting the temperature at the outlet of the circulating motor, the power of the circulating motor is proportional to the temperature, and the method further comprises:

[0013] After the temperature value collected by the temperature sensor is acquired, the power of the circulating motor is adjusted according to the temperature value.

[0014] Optionally, the coolant is natural ester insulating oil.

[0015] Optionally, a plurality of infrared thermal imagers are arranged in the chip manufacturing clean room, each infrared thermal imager is arranged in pairs with a first position of a bus duct to be imaged, and the method further comprises:

[0016] acquiring thermal infrared images photographed by each infrared thermal imager;

[0017] For each thermal infrared image, the gray values of the pixel points in the thermal infrared image are compared in pairs to determine whether there is a pixel point pair in the thermal infrared image whose difference value exceeds a preset threshold value;

[0018] If yes, a second position of a region formed by the pixel with a higher gray value in the pixel point pair exceeding the preset threshold value is determined.

[0019] The first position and the second position corresponding to the thermal infrared image are reported.

[0020] In a second aspect, the embodiments of the present application provide a device for improving the safety of a clean room in chip manufacturing based on a bus duct. The device is for a bus duct system arranged in a clean room in chip manufacturing. The bus duct system includes: a first bus duct and a second bus duct. The first bus duct and the second bus duct each include: a first protective shell, a cooling device, and N bus bars arranged in the first protective shell, where N is a positive integer. The cooling device includes: N+1 cooling pipelines, a circulating motor, and a radiator. The bus bars and the cooling pipelines are arranged alternately. An inlet of the circulating motor is in communication with an outlet of the radiator through a pipeline. An inlet of the radiator is in communication with one end of each cooling pipeline through a pipeline. An outlet of the circulating motor is in communication with the other end of each cooling pipeline. Each cooling pipeline is filled with a coolant. The coolant circulates under the action of the circulating motor. The radiator radiates heat from the coolant. The cooling pipelines are made of a heat-conductive metal material. The bus bars and the cooling pipelines have equal widths. Heat-conductive silica gel insulating sheets are arranged between the bus bars and the cooling pipelines. The first bus duct and the second bus duct each include a first connecting end and a second connecting end. One end of the N bus bars is connected to the first connecting end. The other end of the N bus bars is connected to the second connecting end. The first bus duct and the second bus duct are arranged alternately. The first connecting end of the first bus duct is connected to the second connecting end of the second bus duct. The first connecting end of the first bus duct includes at least one recess. The second connecting end of the second bus duct includes at least one protrusion. The number of the protrusions is equal to the number of the recesses. The first connecting end of the first bus duct is connected to the second connecting end of the second bus duct by inserting the protrusions into the recesses. The protrusions include at least one semicircular elastic positioning pin. The recesses include at least one semicircular positioning hole. The number of the positioning pins is equal to the number of the positioning holes. The positioning pins and the positioning holes are used for positioning connection between the first connecting end of the first bus duct and the second connecting end of the second bus duct. The device includes:

[0021] a processing unit configured to perform denoising processing on the obtained first current noise signal of the bus duct system according to a standard current noise signal of the bus duct system, to obtain a second current noise signal;

[0022] a first acquisition unit configured to respectively perform feature extraction on the second current noise signal and a standard arc signal, to obtain a first feature frame sequence corresponding to the second current noise signal, and a second feature frame sequence corresponding to the standard arc signal;

[0023] an alignment unit configured to align the first feature frame sequence and the second feature frame sequence, to generate an aligned sequence frame;

[0024] A determination unit is configured to determine whether the target feature in the alignment sequence frame is continuously repeated and the time interval of the repeated appearance is equal.

[0025] A prompt unit is configured to issue prompt information indicating that the arcing phenomenon occurs in the bus duct system if the determination result is positive.

[0026] Optionally, the bus duct system further comprises a second protective shell, the second protective shell surrounds the first connecting end of the first bus duct and the second connecting end of the second bus duct, and the first protective shell and the second protective shell are fixedly connected.

[0027] Optionally, the bus duct system further comprises a temperature sensor configured to detect the temperature at the outlet of the circulating motor, the power of the circulating motor is proportional to the temperature, and the device further comprises:

[0028] An adjustment unit is configured to adjust the power of the circulating motor according to the temperature value collected by the temperature sensor after the temperature value is acquired.

[0029] Optionally, the coolant is natural ester insulating oil.

[0030] Optionally, the chip manufacturing clean room is further provided with a plurality of infrared thermal imagers, each infrared thermal imager is arranged in pairs with a first position of a bus duct to be imaged, and the device further comprises:

[0031] A second acquisition unit is configured to acquire thermal infrared images captured by each infrared thermal imager.

[0032] A comparison unit is configured to compare the gray values of pixel points in each thermal infrared image in pairs, and determine whether there are pixel point pairs with a difference value exceeding a preset threshold in the thermal infrared image.

[0033] A determination unit is configured to determine a second position of a region formed by pixel points with higher gray values in the pixel point pairs exceeding the preset threshold if the determination result is positive.

[0034] A sending unit is configured to report the first position and the second position corresponding to the thermal infrared image.

[0035] The technical scheme provided by the embodiments of the present application can have the following beneficial effects:

[0036] The bus duct provided with a cooling device in the application, the cooling pipeline in the cooling device is filled with coolant, the cooling pipeline is made of heat-conducting metal material, and the heat-conducting silica gel insulation sheet is arranged between the cooling pipeline and the bus, which has good heat exchange effect while limiting the temperature, thereby facilitating the temperature reduction of the bus, meanwhile, the first bus duct and the second bus duct are connected through the concave-convex structure and the positioning structure, facilitating the installation of the bus duct, and the second current noise signal is obtained by processing the first current noise signal, and compared with the standard arc signal, so that whether the bus duct currently exists the arc phenomenon can be judged, and the prompt information is sent when the arc phenomenon exists, so that the security personnel can check the bus duct, through the above structure and method, the safety of the clean room is improved.

[0037] In order to make the above objectives, characteristics and advantages of the present application more apparent, the following preferred embodiments are specifically described below, and the accompanying drawings are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0039] Figure 1 A front view structural schematic diagram of a bus duct system provided by the embodiment of the present application;

[0040] Figure 2 A top view structural schematic diagram of a bus duct provided by the embodiment of the present application;

[0041] Figure 3 A flowchart of a method for improving the safety of a clean room in chip processing based on a bus duct provided by the embodiment of the present application;

[0042] Figure 4 A flowchart of another method for improving the safety of a clean room in chip processing based on a bus duct provided by the embodiment of the present application;

[0043] Figure 5 A structural schematic diagram of a device for improving the safety of a clean room in chip processing based on a bus duct provided by the embodiment of the present application. DETAILED DESCRIPTION

[0044] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0045] Figure 1 A front view structural schematic diagram of a bus duct system provided by an embodiment of the present application, Figure 2 A top view structural schematic diagram of a bus duct provided by an embodiment of the present application, as Figure 1 and Figure 2As shown in the present application, the bus duct system is arranged in the clean room in the chip manufacturing process, the bus duct system comprises a first bus duct and a second bus duct, the first bus duct and the second bus duct each comprise: a first protective shell, a cooling device and N bus bars arranged in the first protective shell, N is a positive integer, the cooling device comprises: N+1 cooling pipelines, a circulating motor (not shown) and a radiator (not shown), the bus bars and the cooling pipelines are arranged alternately, the inlet of the circulating motor is communicated with the outlet of the radiator through a pipeline, the inlet of the radiator is communicated with one end of each cooling pipeline through a pipeline, the outlet of the circulating motor is communicated with the other end of each cooling pipeline, each cooling pipeline is filled with a cooling agent, the cooling agent circulates under the action of the circulating motor, the radiator radiates the cooling agent, the cooling pipeline is made of a heat-conducting metal material, the width of the bus bar is equal to the width of the cooling pipeline, a heat-conducting silica gel insulating sheet (not shown) is arranged between the bus bar and the cooling pipeline, the bus bar and the cooling pipeline are in contact through the heat-conducting silica gel insulating sheet, the first bus duct and the second bus duct each comprise a first connecting end and a second connecting end, one end of the N bus bars is connected with the first connecting end, the other end of the N bus bars is connected with the second connecting end, the first bus duct and the second bus duct are arranged alternately, the first connecting end of the first bus duct is connected with the second connecting end of the second bus duct, the first connecting end of the first bus duct comprises at least one recess, the second connecting end of the second bus duct comprises at least one protrusion, the number of the protrusions is equal to the number of the recesses, the first connecting end of the first bus duct is connected with the second connecting end of the second bus duct by inserting the protrusions into the recesses, the protrusion comprises at least one semicircular elastic positioning pin, the recess comprises at least one semicircular positioning hole, the number of the positioning pins is equal to the number of the positioning holes, the positioning pins and the positioning holes are used for positioning connection of the first connecting end of the first bus duct and the second connecting end of the second bus duct.

[0046] Specifically, the cooling pipeline of the cooling device in the application is arranged in the first protective shell, the circulating motor and the heat sink are arranged outside the first protective shell, and can also be arranged outside the clean room. The adjacent two cooling pipelines dissipate heat from the busbar therebetween, so that the heat accumulated in the busbar during operation is dissipated through the cooling pipeline, thereby keeping the busbar at a relatively low temperature. The cooling pipeline is made of metal material, which is conducive to improving the heat conduction efficiency. The adjacent cooling pipeline and the busbar are provided with a heat-conducting silica gel insulating sheet, which can avoid the short circuit phenomenon of the busbar. The width of the cooling pipeline and the busbar is equal, which can maximize the contact area of the cooling pipeline and the busbar, and improve the heat dissipation efficiency. When installing the busbar slot, when the last busbar slot is the first busbar slot, the next busbar slot is the second busbar slot, at this time, the protruding part of the second busbar slot is inserted into the recessed part of the first busbar slot, when the last busbar slot is the second busbar slot, the next busbar slot is the first busbar slot, at this time, the protruding part of the first busbar slot can be inserted into the recessed part of the second busbar slot. During the insertion process, the contact position of the first busbar slot and the second busbar slot is positioned by the semicircular elastic positioning pin arranged on the protruding part and the semicircular positioning hole arranged on the recessed part. During the insertion process, only when the protruding part reaches the recessed part, the first busbar slot and the second busbar slot are fixed by the positioning structure composed of the protruding part and the recessed part. When the protruding part does not reach the recessed part, the first busbar slot and the second busbar slot will move relatively. The positioning structure can quickly install the busbar slot in place during assembly. When assembling the first busbar slot and the second busbar slot, the first busbar slot and the second busbar slot are alternately installed, so that the first busbar slot and the second busbar slot connected together meet the power demand of the electrical equipment in the clean room.

[0047] It should be noted that the specific arrangement position of the circulating motor and the heat sink can be set according to actual needs, which is not limited here. The number of busbars and the number of protruding parts can also be set according to actual needs, which is not limited here.

[0048] Figure 3 A flowchart of a method for improving the safety of a clean room in chip processing based on a busbar slot is provided for the busbar slot system shown in Figure 1 and Figure 2 , as shown in Figure 3 , the method comprises the following steps:

[0049] Step 301, according to the standard current noise signal of the busbar slot system, the first current noise signal of the busbar slot system is denoised to obtain the second current noise signal.

[0050] Step 302, respectively, the second current noise signal and standard arc signal feature extraction, obtain the second current noise signal corresponding first feature frame sequence, and the standard arc signal corresponding second feature frame sequence.

[0051] Step 303, the first feature frame sequence and the second feature frame sequence alignment, generate alignment sequence frame.

[0052] Step 304, determine whether the target feature in the alignment sequence frame is continuously repeated, and the time interval is equal when repeated.

[0053] Step 305, if so, the bus duct system arc phenomenon prompt information.

[0054] Specifically, Figure 1 And Figure 2 The bus duct system shown can effectively reduce the heat accumulated in the bus during the work process, reduce the probability of combustion and explosion when gas leakage occurs in the clean room, in order to reduce the probability of combustion and explosion caused by arc, it is also necessary to detect the bus duct, so as to issue a prompt when there is arc in the bus duct system, so that the maintenance personnel can solve the arc phenomenon as soon as possible, reduce the probability of simultaneous occurrence of arc and gas leakage, and improve the safety of the clean room.

[0055] When there is arc in the bus duct system, the current noise signal is different from the current noise signal when there is no arc (i.e. standard current noise) in the bus duct system. Because there is basically no other interference factors in the bus duct system, the above different reasons are probably caused by arc, so the standard current noise can be used to denoise the current first noise signal of the bus duct system to obtain the second current noise signal. Here, it is also understood as restoring the signal that affects the standard current signal. In order to determine whether the signal that affects the standard current signal is caused by arc, the second current noise signal and the standard arc signal need to be extracted. Then, the first feature frame sequence and the second feature frame sequence are aligned. If the second current noise signal is an arc signal, the features of the second current noise signal and the features of the standard arc signal are the same, or the change rule is the same. Then, the alignment sequence frame generated after alignment should present the phenomenon that the repeated features appear every certain time interval, that is, the appearance of the feature is regular. Therefore, when the target feature appears repeatedly every equal time interval in the sequence frame, and the target feature is continuous, it is determined that the bus duct system has arc phenomenon. At this time, prompt information needs to be issued so that maintenance personnel can check the bus duct system and eliminate the arc phenomenon.

[0056] In an implementable embodiment, the bus duct system further comprises a second protective shell, the second protective shell surrounds the first connecting end of the first bus duct and the second connecting end of the second bus duct, and the first protective shell is fixedly connected with the second protective shell.

[0057] Specifically, the second protective shell can isolate the connection between the first bus duct and the second bus duct from the external environment, which is conducive to further improving the safety of the clean room.

[0058] In an implementable embodiment, the bus duct system further comprises a temperature sensor for detecting the temperature at the outlet of the circulating motor, the power of the circulating motor is proportional to the temperature, and after obtaining the temperature value collected by the temperature sensor, the power of the circulating motor is adjusted according to the temperature value.

[0059] Specifically, when the circulating speed is constant, the cooling efficiency of the cooling device is fixed. At this time, the hotter the bus is, the hotter the temperature at the outlet of the circulating motor is, and the greater the temperature difference between the two objects is, the better the cooling effect is. Therefore, in order to enable the cooling device to carry away more heat from the bus, the power of the circulating motor can be increased, and the flow speed of the cooling liquid can be faster, so that the cooling device can carry away more heat from the bus, and the heat sink can dissipate more heat in unit time.

[0060] It should be noted that the proportional relationship between the power of the circulating motor and the temperature value can be set according to actual needs, which is not limited here.

[0061] In an implementable embodiment, the coolant is natural ester insulating oil.

[0062] Specifically, the natural ester insulating oil has two heat conduction and insulation effects, so even if the cooling liquid leaks, it will not affect the safety.

[0063] In an implementable embodiment, Figure 4 Another flowchart of a method for improving the safety of a clean room in a chip manufacturing process based on a bus duct is provided in the embodiments of the present application. The chip manufacturing clean room is also provided with a plurality of infrared thermal imagers, each of which is arranged in pairs with a first position of the bus duct to be imaged, as shown in Figure 4 The method further comprises the following steps:

[0064] Step 401: Obtain the thermal infrared images photographed by each infrared thermal imager.

[0065] Step 402: For each thermal infrared image, compare the gray values of the pixel points in the thermal infrared image in pairs to determine whether there are pixel point pairs in the thermal infrared image whose difference exceeds a preset threshold.

[0066] Step 403, if existing, determining the second position of the region composed of the pixel with higher gray value in the pixel pair exceeding the preset threshold.

[0067] Step 404, reporting the first position and the second position corresponding to the thermal infrared image.

[0068] Specifically, in order to enable the maintenance personnel to determine the position of the arc as soon as possible, a plurality of infrared thermal imagers are arranged in the clean room, each infrared thermal imager can perform thermal infrared imaging on a certain number of bus ducts to obtain the thermal infrared image of the bus duct at the corresponding position. Since the bus duct is fixed in position after installation, the infrared thermal imager and the first position of the bus duct to be imaged are arranged in pairs, and the specific bus duct where the problem occurs can be determined according to the thermal infrared image, thereby quickly determining the position of the arc.

[0069] When the arc phenomenon has been determined, the position of the temperature anomaly in the bus duct system is the position where the arc occurs, and when the arc occurs, the temperature at this position is significantly higher than the temperature at other positions, that is, the gray value of the thermal infrared image obtained by thermal infrared imaging at this position is significantly higher than the gray value of the thermal infrared image at other positions. Therefore, after obtaining the thermal infrared images captured by each infrared thermal imager, the gray values of the pixel points in each thermal infrared image are compared two by two to determine the pixel pairs whose gray value difference exceeds the preset threshold, and then the pixel with higher gray value in the pixel pair is taken as the target pixel. Since the temperature of the area affected by the arc will rise significantly when the arc occurs, a region can be determined according to the target pixel. At this time, the first position of the bus duct corresponding to the abnormal thermal infrared image and the second position of the region in the thermal infrared image can be reported, so that the maintenance personnel can determine the bus duct where the arc occurs and the approximate position of the arc in the bus duct.

[0070] Figure 5 A structure schematic diagram of a device for improving the safety of a clean room in chip manufacturing based on a bus duct provided by an embodiment of the present application, the device is for a bus duct system arranged in a chip manufacturing clean room, such as Figure 1 and Figure 2As shown, the bus duct system comprises: a first bus duct and a second bus duct, the first bus duct and the second bus duct each comprise: a first protective shell, a cooling device and N bus bars arranged in the first protective shell, N is a positive integer, the cooling device comprises: N+1 cooling pipelines, a circulating motor and a radiator, the bus bars and the cooling pipelines are arranged alternately, the inlet of the circulating motor is communicated with the outlet of the radiator through a pipeline, the inlet of the radiator is communicated with one end of each cooling pipeline through a pipeline, the outlet of the circulating motor is communicated with the other end of each cooling pipeline, each cooling pipeline is filled with a cooling agent, the cooling agent circulates under the action of the circulating motor, the radiator radiates the cooling agent, the cooling pipeline is made of a heat-conducting metal material, the width of the bus bar is equal to the width of the cooling pipeline, a heat-conducting silica gel insulating sheet is arranged between the bus bar and the cooling pipeline, the first bus duct and the second bus duct each comprise a first connecting end and a second connecting end, one end of the N bus bars is connected with the first connecting end, the other end of the N bus bars is connected with the second connecting end, the first bus duct and the second bus duct are arranged alternately, the first connecting end of the first bus duct is connected with the second connecting end of the second bus duct, the first connecting end of the first bus duct comprises at least one recess, the second connecting end of the second bus duct comprises at least one protrusion, the number of the protrusions is equal to the number of the recesses, the first connecting end of the first bus duct and the second connecting end of the second bus duct are connected by inserting the protrusions into the recesses, the protrusion comprises at least one semicircular elastic positioning pin, the recess comprises at least one semicircular positioning hole, the number of the positioning pins is equal to the number of the positioning holes, the positioning pins and the positioning holes are used for positioning connection of the first connecting end of the first bus duct and the second connecting end of the second bus duct, and the first bus duct and the second bus duct are connected through the first connecting end and the second connecting end. Figure 5 As shown in the figure, the device comprises:

[0071] The processing unit 51 is configured to perform denoising processing on the obtained first current noise signal of the bus duct system according to a standard current noise signal of the bus duct system, to obtain a second current noise signal.

[0072] The first acquisition unit 52 is configured to respectively perform feature extraction on the second current noise signal and a standard arc signal, to obtain a first feature frame sequence corresponding to the second current noise signal, and a second feature frame sequence corresponding to the standard arc signal.

[0073] The alignment unit 53 is configured to align the first feature frame sequence and the second feature frame sequence to generate an aligned sequence frame.

[0074] The judging unit 54 is configured to judge whether the target feature in the alignment sequence frame is continuously repeated and the time interval of the repeated appearance is equal.

[0075] The prompting unit 55 is configured to issue a prompt information that the arcing phenomenon occurs in the bus duct system if the target feature is continuously repeated.

[0076] In an implementable embodiment, the bus duct system further comprises a second protective shell, the second protective shell surrounds the first connecting end of the first bus duct and the second connecting end of the second bus duct, and the first protective shell is fixedly connected with the second protective shell.

[0077] In an implementable embodiment, the bus duct system further comprises a temperature sensor configured to detect the temperature at the outlet of the circulating motor, the power of the circulating motor is proportional to the temperature, and the device further comprises:

[0078] The adjusting unit is configured to adjust the power of the circulating motor according to the temperature value collected by the temperature sensor after the temperature value is acquired.

[0079] In an implementable embodiment, the coolant is natural ester insulating oil.

[0080] In an implementable embodiment, the chip manufacturing clean room is further provided with a plurality of infrared thermal imagers, each of the infrared thermal imagers is arranged in pairs with a first position of a bus duct to be imaged, and the device further comprises:

[0081] The second acquiring unit is configured to acquire thermal infrared images captured by each of the infrared thermal imagers.

[0082] The comparing unit is configured to, for each thermal infrared image, compare the gray values of the pixel points in the thermal infrared image in pairs to determine whether there are pixel point pairs with a difference value exceeding a preset threshold value in the thermal infrared image.

[0083] The determining unit is configured to, if there are, determine a second position of a region formed by the pixel with a higher gray value in the pixel point pairs exceeding the preset threshold value.

[0084] The sending unit is configured to report the first position and the second position corresponding to the thermal infrared image.

[0085] Regarding Figure 5 The principle of the device for improving the safety of the clean room in the chip manufacturing process shown in the figure can refer to the description of the method for improving the safety of the clean room in the chip manufacturing process shown in Figures 1-4 herein.

[0086] In the embodiments of the present application, it should be understood that the disclosed apparatus and method can be implemented in other manners. The embodiments described above are merely exemplary, for example, the division of the units is only a logical function division, and there can be another division manner in actual implementation; for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections can be indirect couplings or communication connections through some interfaces, and electrical, mechanical or other forms.

[0087] The units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments.

[0088] In addition, each functional unit in the embodiments provided by the present application can be integrated into one processing unit, or each unit can exist physically, or two or more units can be integrated into one unit.

[0089] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the parts that make contributions to the prior art or parts of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk, and various media that can store program codes.

[0090] It should be noted that: similar reference numerals and letters in the following drawings represent similar items, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", "third" and the like are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0091] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present application, and are used to illustrate the technical solutions of the present application, but not to limit the same. The protection scope of the present application is not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that any person skilled in the art can make modifications or easily think of changes to the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some of the technical features within the technical scope disclosed by the present application. The modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application. All should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for improving clean room safety in chip manufacturing based on bus ducts, characterized by, The method is for a bus duct system arranged in a chip manufacturing clean room, the bus duct system comprising: a first bus duct and a second bus duct, the first bus duct and the second bus duct each comprising: a first protective shell, a cooling device and N bus bars arranged in the first protective shell, N being a positive integer, the cooling device comprising: N+1 cooling pipelines, a circulating motor and a radiator, the bus bars and the cooling pipelines are arranged alternately, an inlet of the circulating motor is communicated with an outlet of the radiator through a pipeline, an inlet of the radiator is communicated with one end of each cooling pipeline through a pipeline, an outlet of the circulating motor is communicated with the other end of each cooling pipeline, each cooling pipeline is filled with a coolant, the coolant circulates under the action of the circulating motor, the radiator radiates the coolant, the cooling pipeline is made of a heat-conductive metal material, the width of the bus bar is equal to the width of the cooling pipeline, a heat-conductive silica gel insulating sheet is arranged between the bus bar and the cooling pipeline, the bus bar and the cooling pipeline are in contact through the heat-conductive silica gel insulating sheet, the first bus duct and the second bus duct each comprise a first connecting end and a second connecting end, one end of the N bus bars is connected with the first connecting end, the other end of the N bus bars is connected with the second connecting end, the first bus duct and the second bus duct are arranged alternately, the first connecting end of the first bus duct is connected with the second connecting end of the second bus duct, the first connecting end of the first bus duct comprises at least one recess, the second connecting end of the second bus duct comprises at least one protrusion, the number of the protrusions is equal to the number of the recesses, the first connecting end of the first bus duct and the second connecting end of the second bus duct are connected by inserting the protrusions into the recesses, the protrusion comprises at least one semicircular elastic positioning pin, the recess comprises at least one semicircular positioning hole, the number of the positioning pins is equal to the number of the positioning holes, the positioning pins and the positioning holes are used for positioning connection of the first connecting end of the first bus duct and the second connecting end of the second bus duct, the method comprises: de-noising the obtained first current noise signal of the bus duct system according to a standard current noise signal of the bus duct system to obtain a second current noise signal; extracting features from the second current noise signal and a standard arc signal respectively to obtain a first feature frame sequence corresponding to the second current noise signal and a second feature frame sequence corresponding to the standard arc signal; aligning the first feature frame sequence and the second feature frame sequence to generate an aligned sequence frame; judging whether a target feature in the aligned sequence frame is continuously repeated and the time interval when the target feature is repeatedly appears is equal; if yes, issuing prompt information that an arc phenomenon occurs in the bus duct system.

2. The method of claim 1, wherein, The bus duct system further comprises a second protective shell, the second protective shell surrounds the first connecting end of the first bus duct and the second connecting end of the second bus duct, the first protective shell and the second protective shell are fixedly connected.

3. The method of claim 1, wherein, The bus duct system further comprises a temperature sensor for detecting the temperature at the outlet of the circulating motor, the power of the circulating motor being proportional to the temperature, and the method further comprises: After obtaining the temperature value collected by the temperature sensor, adjusting the power of the circulating motor according to the temperature value.

4. The method of claim 1, wherein, The coolant is natural ester insulating oil.

5. The method of claim 1, wherein, The chip manufacturing clean room is also provided with a plurality of infrared thermal imagers, each of which is arranged in pairs with a first position of the bus duct to be imaged, and the method further comprises: Obtaining the thermal infrared image photographed by each infrared thermal imager; For each thermal infrared image, the gray values of the pixel points in the thermal infrared image are compared in pairs to determine whether there are pixel point pairs in the thermal infrared image whose difference exceeds a preset threshold value; If so, determining a second position of a region formed by the pixel point pair with a higher gray value that exceeds the preset threshold value; Reporting the first position and the second position corresponding to the thermal infrared image.

6. A device for improving clean room safety in chip manufacturing based on bus ducts, characterized by The device is for a bus duct system arranged in a chip manufacturing clean room, the bus duct system comprising: a first bus duct and a second bus duct, the first bus duct and the second bus duct each comprising: a first protective shell, a cooling device, and N bus bars arranged in the first protective shell, N being a positive integer, the cooling device comprising: N+1 cooling pipelines, a circulating motor, and a radiator, the bus bars and the cooling pipelines are arranged alternately, the inlet of the circulating motor is in communication with the outlet of the radiator through a pipeline, the inlet of the radiator is in communication with one end of each cooling pipeline through a pipeline, the outlet of the circulating motor is in communication with the other end of each cooling pipeline, each cooling pipeline is filled with a coolant, the coolant circulates under the action of the circulating motor, the radiator radiates the coolant, the cooling pipeline is made of a heat-conducting metal material, the width of the bus bar is equal to the width of the cooling pipeline, a heat-conducting silica gel insulating sheet is arranged between the bus bar and the cooling pipeline, the first bus duct and the second bus duct each comprise a first connecting end and a second connecting end, one end of the N bus bars is connected to the first connecting end, the other end of the N bus bars is connected to the second connecting end, the first bus duct and the second bus duct are arranged alternately, the first connecting end of the first bus duct is connected to the second connecting end of the second bus duct, the first connecting end of the first bus duct comprises at least one recess, the second connecting end of the second bus duct comprises at least one protrusion, the number of the protrusions is equal to the number of the recesses, the first connecting end of the first bus duct and the second connecting end of the second bus duct are connected by inserting the protrusions into the recesses, the protrusion comprises at least one semicircular elastic positioning pin, the recess comprises at least one semicircular positioning hole, the number of the positioning pins is equal to the number of the positioning holes, the positioning pins and the positioning holes are used for positioning and connecting the first connecting end of the first bus duct and the second connecting end of the second bus duct, and the device comprises: The processing unit is configured to perform denoising processing on the obtained first current noise signal of the bus duct system according to a standard current noise signal of the bus duct system, to obtain a second current noise signal. The first acquisition unit is configured to perform feature extraction on the second current noise signal and a standard arc signal respectively, to obtain a first feature frame sequence corresponding to the second current noise signal, and a second feature frame sequence corresponding to the standard arc signal. The alignment unit is configured to align the first feature frame sequence and the second feature frame sequence, to generate an aligned sequence frame. The judgment unit is configured to judge whether a target feature in the aligned sequence frame is continuously repeated and a time interval when the target feature is repeatedly appears is equal. The prompt unit is configured to issue prompt information of an arc phenomenon occurring in the bus duct system if the target feature is continuously repeated and the time interval when the target feature is repeatedly appears is equal.

7. The apparatus of claim 6, wherein, The bus duct system further comprises a second protective shell, the second protective shell surrounds the first connecting end of the first bus duct and the second connecting end of the second bus duct, and the first protective shell and the second protective shell are fixedly connected.

8. The apparatus of claim 6, wherein, The bus duct system further comprises a temperature sensor configured to detect a temperature at an outlet of the circulating motor, and the power of the circulating motor is proportional to the temperature. The adjusting unit is configured to adjust the power of the circulating motor according to the temperature value after obtaining the temperature value collected by the temperature sensor.

9. The apparatus of claim 6, wherein, The coolant is natural ester insulating oil.

10. The apparatus of claim 6, wherein, The chip manufacturing clean room is further provided with a plurality of infrared thermal imagers, each of the infrared thermal imagers is arranged in pairs with a first position of a bus duct to be imaged, and the device further comprises: The second acquisition unit is configured to acquire thermal infrared images photographed by each of the infrared thermal imagers. The comparison unit is configured to, for each thermal infrared image, compare gray values of pixel points in the thermal infrared image in pairs to determine whether there is a pixel point pair with a difference value exceeding a preset threshold value in the thermal infrared image. The determination unit is configured to determine a second position of a region formed by a pixel with a higher gray value in the pixel point pair exceeding the preset threshold value if the pixel point pair exists. The sending unit is configured to report the first position and the second position corresponding to the thermal infrared image.

Images