A feeding chip mounting structure and chip mounting machine with multi-specification linkage control

Abstract

The present invention relates to the field of PCB mounting technology, and specifically to a feeding patch structure and a patch machine with multi-specification linkage control, comprising: a connecting frame, which can reciprocate along the length direction of a PCB board; a first scraper and a second scraper, each of which is provided with two groups and is connected to an adjusting component arranged on the connecting frame, the first scraper and the second scraper form a quadrilateral frame plate, and an extension portion is arranged at the end of the first scraper; a blocking plate, which is slidably arranged in a through hole formed on the first scraper, and the length of the through hole is greater than the length of the blocking plate; a trigger mechanism, which is connected to the blocking plate, and the trigger mechanism comprises an elastic component and an abutment component connected to the connecting frame, and the elastic component cooperates with the abutment component to drive the blocking plate to move when the connecting frame moves to the end of the stroke, so that the lower end of the through hole is conductive or blocked, so as to achieve repeated scraping and coating, so that the raw materials are effectively utilized.

Description

Technical Field

[0001] The invention relates to the technical field of PCB mounting, in particular to a feeding chip mounting structure and a chip mounting machine with multi-specification linkage control. Background Art

[0002] SMT is a new generation of electronic assembly technology, which compresses traditional electronic components into devices with a volume of only a few tens of times smaller, thus achieving high density, high reliability, miniaturization, low cost and automated production of electronic product assembly.

[0003] SMT is a technology that can print solder paste on PCB pads, then place surface mount components on them, and then use reflow soldering to melt the solder paste so that each component can be assembled with the substrate pads. The quality of the patch depends on the quality of the solder paste scraping and the placement accuracy of the components. The placement accuracy of the components is based on optical components and can achieve excellent accuracy. Considering that the solder paste is in a fluid state and is not easy to control, the quality of the solder paste scraping has become the key to the quality of the patch at this stage.

[0004] With regard to the existing solder paste scraping device, in order to ensure the scraping quality, an excess amount of solder paste is generally applied to the steel mesh, and the scraper is in a straight state, so that during scraping, the excess solder paste will gather on both sides of the scraper on the steel mesh. If it is not cleaned in time, the amount of residual solder paste on the steel mesh will be excessive as the number of scraping times increases. At present, the excess solder paste on the steel mesh needs to be cleaned after a certain number of scrapings, which directly leads to a slow scraping speed and low output of the solder paste. Summary of the invention

[0005] The purpose of the present invention is to provide a feeding patch structure and a patch machine with multi-specification linkage control to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A feeding patch structure with multi-specification linkage control, comprising:

[0008] A connecting frame, wherein the connecting frame can reciprocate along the length direction of the PCB board;

[0009] The first scraper and the second scraper are each provided with two groups and connected to the adjustment assembly provided on the connecting frame. The first scraper and the second scraper form a quadrilateral frame plate, and an extension portion is provided at the end of the first scraper;

[0010] A blocking plate is slidably disposed in a through hole formed on the first scraper plate, wherein the length of the through hole is greater than the length of the blocking plate;

[0011] A trigger mechanism is connected to the blocking plate. The trigger mechanism includes an elastic component and an abutment component connected to the connecting frame. The elastic component cooperates with the abutment component to drive the blocking plate to move when the connecting frame moves to the end of the stroke, so that the lower end of the through hole is conductive or blocked.

[0012] As a further solution of the present invention: a telescopic plate is provided on the connecting frame, a side frame is connected to the telescopic plate, a retardation groove is formed on the side frame, a sliding connection is slidably installed in the retardation groove, and a horizontal axis is provided on both sides of the sliding connection;

[0013] A connecting rod that passes through the first scraper and is rotatably connected to the blocking plate is slidably sleeved with the horizontal axis.

[0014] As a further solution of the present invention: the elastic component comprises a telescopic frame slidably connected to the side frame, one end of the telescopic frame is rotatably mounted with an abutment roller, and the other end is connected to the side frame through a spring;

[0015] The elastic component also includes an abutment member arranged on the telescopic plate, and two symmetrical inclined surfaces are arranged on the side of the abutment member away from the telescopic plate. An outer protrusion is formed at the connection of the two inclined surfaces, and the abutment roller can roll between the two inclined surfaces via the outer protrusion.

[0016] As a further solution of the present invention: the abutment assembly includes a trigger wheel rotatably mounted on the telescopic plate and a trigger member No. 1 and a trigger member No. 2 adapted to the trigger wheel, and the trigger member No. 1 and the trigger member No. 2 are formed with mutually parallel guiding inclined surfaces.

[0017] As a further solution of the present invention: the adjustment assembly comprises two sets of slide grooves symmetrically arranged on the connecting frame, a slider is slidably installed in the slide groove, and the slider is rotatably connected to the quadrilateral frame plate;

[0018] The adjustment assembly also includes a driving motor fixedly mounted on the connecting frame, the output shaft of the driving motor is connected to a bidirectional screw rod, and the bidirectional screw rod is threadedly connected to the two groups of sliding blocks.

[0019] As a further solution of the present invention: it also includes:

[0020] Two sets of blanking heads are arranged at two ends of the connecting frame in the forward direction;

[0021] The feeding mechanism is arranged on the connecting frame and connected to the two groups of blanking heads. The feeding mechanism includes a feeding component and a switching component. The switching component can follow the movement of the telescopic plate to enable the feeding component to transport solder paste to the blanking head located in the movement direction of the connecting frame.

[0022] As a further solution of the present invention: the feeding assembly comprises a three-way pipe fixedly mounted on the connecting frame, a feeding pipe is connected to the middle of the three-way pipe, and a solenoid valve is installed on the feeding pipe;

[0023] A set of discharge pipes are connected to both sides of the three-way pipe, and the discharge pipes are connected to the blanking head;

[0024] The feeding assembly also includes a sealing plug that is sealingly and slidably mounted in the three-way pipe, and the sealing plug is fixedly connected to a follower frame that is slidably mounted on the three-way pipe.

[0025] As a further solution of the present invention: the switching assembly includes an engaging wheel rotatably mounted on the follower frame and a side plate fixedly connected to the side frame, a switching groove is formed on the side plate, and the switching groove cooperates with the engaging wheel to enable the sealing plug to move laterally in the three-way pipe when the height of the side plate changes.

[0026] As a further solution of the present invention: the switching slot includes two vertical slots arranged on the side plate, the two vertical slots are parallel and staggered, and the two vertical slots are connected by an inclined slot.

[0027] A chip mounter comprises the multi-specification linkage controlled feeding chip mount structure.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] By setting the quadrilateral frame plate and the blocking plate, the solder paste applied on the steel mesh can be evenly spread on the steel mesh under the action of the first scraper / the second scraper, and then can move toward the center line of the steel mesh again under the action of the second scraper / the first scraper, so that two scraping actions can be performed when the quadrilateral frame plate moves once, thereby improving the scraping effect of the solder paste, and because the solder paste has a tendency to move toward the center line of the steel mesh in the end, the excess solder paste can be gathered in one place, so as to facilitate subsequent collection or reuse;

[0030] Through the trigger mechanism, when the connecting frame drives the quadrilateral frame plate to move to the end of the stroke, the blocking plate can be kept separated from or attached to the steel mesh through the cooperation of the abutting wheel and the first trigger member or the second trigger member, so that the connecting frame can perform two scraping actions each time it moves;

[0031] By setting up the feeding mechanism, the conduction state of the blanking head and the movement state of the quadrilateral frame plate are mechanically linked, and the two are automatically matched to ensure that when the quadrilateral frame plate moves, the blanking head in its movement direction can always maintain a conduction state and apply the solder paste to the front part of the movement direction of the quadrilateral frame plate, so that the applied solder paste can be scraped under the action of the quadrilateral frame plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The present invention is a structural schematic diagram of an embodiment of a feeding patch structure with multi-specification linkage control.

[0033] Figure 2 This is a schematic diagram of the structure after the driving device, trigger member No. 1 and trigger member No. 2 are removed in one embodiment of a feeding patch structure with multi-specification linkage control.

[0034] Figure 3 This is a schematic structural diagram from another angle after the driving device, trigger member No. 1 and trigger member No. 2 are removed in one embodiment of a feeding patch structure with multiple specifications linked control.

[0035] Figure 4 The present invention is a schematic structural diagram of an adjusting component and a quadrilateral frame plate in one embodiment of a feeding patch structure with multi-specification linkage control.

[0036] Figure 5 This is a structural exploded diagram of the quadrilateral frame plate and the sealing plate in one embodiment of a feeding patch structure with multi-specification linkage control.

[0037] Figure 6 A top view of a quadrilateral frame plate in an embodiment of a feeding patch structure with multi-specification linkage control.

[0038] Figure 7 The schematic diagram of the structure of the elastic component in one embodiment of a feeding patch structure with multi-specification linkage control.

[0039] Figure 8 The figure is a schematic diagram of the structure of the feeding mechanism in one embodiment of a feeding patch structure with multi-specification linkage control.

[0040] Fig. 9 An exploded diagram of the local structure of the feeding mechanism in one embodiment of a feeding patch structure with multi-specification linkage control.

[0041] In the figure: 1. driving device; 2. connecting frame; 201. slide groove; 3. scraper No. 1; 301. through hole; 302. extension part; 4. scraper No. 2; 5. sealing plate; 6. connecting rod; 7. connecting sleeve plate; 8. telescopic arm; 9. side frame, 901. retardation groove; 10. sliding connection; 11. horizontal axis; 12. telescopic frame; 13. spring; 14. abutment roller; 15. abutment member; 1501. inclined surface; 1502. outer protrusion; 16. trigger wheel; 17. trigger member No. 1; 18. trigger member No. 2; 19. slider; 20. bidirectional screw; 21. driving motor; 22. side plate; 2201. vertical groove; 2202. inclined groove; 23. three-way pipe; 24. blanking head; 25. solenoid valve; 26. follower frame; 2601. sealing plug; 27. interlocking wheel. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0044] See also Figures 1 to 9 In the embodiment of the present invention, a feeding patch structure with multi-specification linkage control includes: a frame (not shown in the figure), a connecting frame 2, a first scraper 3 and a second scraper 4, a blocking plate 5 and a trigger mechanism, so that under the action of the first scraper 3 / the second scraper 4, the solder paste applied on the steel mesh can be evenly spread on the steel mesh, and then can move toward the center line of the steel mesh again under the action of the second scraper 4 / the first scraper 3, so that when the quadrilateral frame moves once, two scraping actions can be performed, thereby improving the scraping effect of the solder paste, and because the solder paste eventually has a tendency to move toward the center line of the steel mesh, the excess solder paste can be gathered in one place, so as to facilitate subsequent collection or reuse, as follows:

[0045] The connecting frame 2 is connected to a driving device 1 arranged on the frame, and the driving device 1 can drive the connecting frame 2 to reciprocate along the length direction of the PCB board, and the driving device 1 can drive the connecting frame 2 to move toward the PCB board;

[0046] The first scraper 3 and the second scraper 4 are each provided with two groups, and are connected to the adjustment assembly provided on the connecting frame 2. The first scraper 3 and the second scraper 4 form a quadrilateral frame plate, and an extension portion 302 is provided at the end of the first scraper 3, wherein the adjustment assembly includes two groups of slide grooves 201 symmetrically provided on the connecting frame 2, and a slider 19 is slidably installed in the slide groove 201, and the slider 19 is rotatably connected to the quadrilateral frame plate;

[0047] Specifically, two groups of No. 1 scrapers 3 are rotatably connected to form a No. 1 bent plate group, and two groups of No. 2 scrapers 4 are rotatably connected to form a No. 2 bent plate group. The ends of the No. 1 bent plate group and the No. 2 bent plate group are rotatably connected, so that the quadrilateral frame plate can switch its shape as needed, and the connecting line at the connection between the No. 1 bent plate group and the No. 2 bent plate group is perpendicular to the movement direction of the connecting frame 2.

[0048] The adjustment assembly further includes a drive motor 21 fixedly mounted on the connecting frame 2, the output shaft of the drive motor 21 is connected to a bidirectional screw rod 20, and the bidirectional screw rod 20 is threadedly connected to the two groups of sliders 19;

[0049] The blocking plate 5 is slidably disposed in a through hole 301 formed on the first scraper plate 3 , and the length of the through hole 301 is greater than the length of the blocking plate 5 .

[0050] When in use, you need to place the PCB on the rack first, and place the steel mesh on the upper part of the PCB and the lower part of the quadrilateral frame. When scraping the solder paste, move the PCB and the quadrilateral frame toward the steel mesh until the PCB, the quadrilateral frame and the steel mesh fit together. Then apply the solder paste when the center line of the steel mesh is in the forward direction of the quadrilateral frame, and scrape through the quadrilateral frame. The details are as follows:

[0051] For ease of understanding, Figure 6 Detailed description of the process of scraping solder paste:

[0052] When the quadrilateral frame moves from right to left, the blocking plate 5 is in a state of blocking the lower end of the through hole 301. At this time, the two groups of No. 2 scrapers 4 will first contact the solder paste and then push the solder paste to move. Since the No. 2 scraper 4 is in an inclined state, the solder paste has a lateral and longitudinal displacement on the steel mesh. As the No. 2 scraper 4 moves, the solder paste can be spread on the steel mesh. In the process, the solder paste can pass through the steel mesh and fall to the pins on the PCB board. As the No. 2 scraper 4 moves, the solder paste will move along the No. 2 scraper 4. The length direction of the scraper 4 moves toward the end of the second scraper 4, and as the solder paste flows, the solder paste will separate from the end of the second scraper 4. At this time, the solder paste will accumulate on both sides of the two second scrapers 4, and the extension portion 302 at the end of the first scraper 3 protrudes from the end of the second scraper 4, so that the solder paste accumulated on both sides of the second scraper 4 can gradually move toward the center line of the steel mesh under the guidance of the inner side of the first scraper 3 and the blocking plate 5, so that the remaining solder paste can be scraped for the second time, thereby improving the scraping effect of the solder paste;

[0053] When the quadrilateral frame moves from left to right, the blocking plate 5 is in a state of making the lower end of the through hole 301 conductive. At this time, the two groups of No. 1 scrapers 3 will first contact the solder paste and then push the solder paste to move. At the same time, since the No. 1 scraper 3 is in an inclined state, the solder paste has lateral and longitudinal displacements on the steel mesh, so that with the movement of the No. 1 scraper 3, the solder paste can be spread on the steel mesh, and with the movement of the No. 1 scraper 3, the solder paste will move toward the through hole 301 along the length direction of the No. 1 scraper 3, and as the solder paste flows, the solder paste will enter the through hole 301. At this time, the solder paste will accumulate on both sides of the through hole 301 on the two No. 1 scrapers 3, and since the end of the No. 2 scraper 4 protrudes from the through hole 301, the solder paste accumulated on both sides of the through hole 301 can gradually move toward the center line of the steel mesh under the guidance of the inner side of the No. 2 scraper 4.

[0054] Through the above arrangement, the solder paste applied on the steel mesh can be evenly spread on the steel mesh under the action of scraper No. 1 3 / scraper No. 2 4, and then can move toward the center line of the steel mesh again under the action of scraper No. 2 4 / scraper No. 1 3, so that two scraping actions can be performed when the quadrilateral frame moves once, thereby improving the scraping effect of the solder paste, and because the solder paste eventually has a tendency to move toward the center line of the steel mesh, excess solder paste can be gathered in one place, thereby facilitating subsequent collection or reuse.

[0055] Furthermore, when the quadrilateral frame plate moves to the end of the stroke, the solder paste will be gathered in one place. At this time, the driving device 1 can be used to move the quadrilateral frame plate away from the steel mesh to create a gap between the two. At the same time, the driving device 1 continues to drive the quadrilateral frame plate to move, so that the gathered solder paste can be transferred from one side of the quadrilateral frame plate to the other side, so that when the quadrilateral frame plate moves in the opposite direction, this part of the solder paste can continue to be pushed, and then this part of the solder paste can be reused without cleaning it.

[0056] It should be noted that the lower ends of the No. 1 scraper 3, the No. 2 scraper 4 and the sealing plate 5 are all provided with a slope of 45° to 60°. Through the setting of the slope, the downward pressure of the solder paste can be increased, making it easier for the solder paste to pass through the steel mesh to the PCB board.

[0057] It should be noted that, since different types of PCB boards require different mounting areas, the driving motor 21 can be controlled to drive the bidirectional screw 20 connected thereto to rotate, and the two sliders 19 threadedly connected to the bidirectional screw 20 can be moved closer to or away from each other, thereby changing the shape of the quadrilateral frame plate to adapt to the width of the area where the PCB board needs to be mounted. Moreover, since the threaded connection has high precision and self-locking properties, the shape of the quadrilateral frame plate can remain constant after the shape of the quadrilateral frame plate is adjusted.

[0058] See also Figure 2 to Figure 4 , Figure 7 The connecting frame 2 is provided with a telescopic plate, the telescopic plate is connected to a side frame 9, a hysteresis groove 901 is formed on the side frame 9, a sliding connection member 10 is slidably installed in the hysteresis groove 901, and a horizontal axis 11 is provided on both sides of the sliding connection member 10. Specifically, the telescopic plate includes a connecting sleeve 7 fixedly installed on the connecting frame 2 and a telescopic arm 8 slidably installed in the connecting sleeve 7, and the telescopic arm 8 is fixedly connected to the side frame 9;

[0059] The connecting rod 6 that penetrates the first scraper 3 and is rotatably connected to the blocking plate 5 is slidably fitted with the transverse shaft 11, wherein the connecting rod 6 is an "L"-shaped structure, and one end of the connecting rod 6 is a hollow structure, and the transverse shaft 11 can be inserted and slid in the hollow structure;

[0060] The trigger mechanism is connected to the blocking plate 5, and the trigger mechanism includes an elastic component and an abutting component connected to the connecting frame 2. The elastic component cooperates with the abutting component to drive the blocking plate 5 to move when the connecting frame 2 moves to the end of the stroke, so that the lower end of the through hole 301 is conductive or blocked;

[0061] The elastic component includes a telescopic frame 12 slidably connected to the side frame 9, one end of the telescopic frame 12 is rotatably mounted with an abutment roller 14, and the other end is connected to the side frame 9 through a spring 13;

[0062] The elastic component further includes an abutment member 15 disposed on the telescopic plate, and the abutment member 15 is provided with two symmetrical inclined surfaces 1501 on a side away from the telescopic plate, and an outer protrusion 1502 is formed at the connection of the two inclined surfaces 1501, and the abutment roller 14 can roll between the two inclined surfaces 1501 via the outer protrusion 1502;

[0063] The abutment assembly includes a trigger wheel 16 rotatably mounted on the telescopic plate, and a trigger member 17 and a trigger member 18 adapted to the trigger wheel 16 , wherein the trigger member 17 and the trigger member 18 are formed with mutually parallel guiding inclined surfaces.

[0064] In the initial state, the abutment roller 14 is on the inclined surface 1501 at the lower part of the abutment member 15. At this time, the spring 13 is in a stretched state, so that the abutment roller 14 has a force acting on the inclined surface 1501, so that the side frame 9 has a downward pressure. The side frame 9 exerts a downward pressure on the sealing plate 5 through the horizontal axis 11 and the connecting rod 6, thereby ensuring the fit between the sealing plate 5 and the steel mesh when the two are fitted, so as to prevent excessive solder paste from remaining at the fitting position of the two.

[0065] When the connecting frame 2 moves with the driving device 1, the quadrilateral frame plate can perform the scraping action, and when the connecting frame 2 moves to the end of the stroke, the trigger wheel 16 can cooperate with the No. 1 trigger member 17, so that under the action of the guiding inclined surface on the No. 1 trigger member 17, the trigger wheel 16 can drive the telescopic arm 8 to move upward, and at this time, the side frame 9, the telescopic frame 12, and the abutting roller 14 all move upward, and at the same time, the abutting roller 14 will move along the above-mentioned inclined surface 1501 toward the outer protrusion 1502 to further stretch the spring 13 , and after the abutment wheel 14 moves over the outer protrusion 1502, the spring 13 can actively drive the side frame 9, the telescopic frame 12 and the abutment roller 14 to move upward by releasing elastic potential energy, so as to drive the blocking plate 5 to move upward and maintain it, so that the lower end of the through hole 301 on the No. 1 scraper 3 is connected, so that when the quadrilateral frame plate follows the reverse movement of the connecting frame 2, the solder paste can move from the through hole 301 to the inner side of the No. 2 scraper 4, thereby ensuring that two scraping actions can be performed during one movement of the quadrilateral frame plate.

[0066] Similarly, after the above state is switched, when the connecting frame 2 moves to the end of the stroke again, the abutment wheel 16 will cooperate with the second trigger member 18 to move the blocking plate 5 downward to fit the steel mesh.

[0067] Through the above arrangement, when the connecting frame 2 drives the quadrilateral frame plate to move to the end of the stroke, the sealing plate 5 can be kept separated or attached to the steel mesh through the cooperation of the abutment wheel 16 and the trigger member No. 17 or the trigger member No. 2 18, so that the connecting frame 2 can perform two scraping actions each time it moves.

[0068] See also Figure 2 , Figure 3 , Figure 7 to Figure 9 The multi-specification linkage-controlled feeding patch structure also includes: two sets of blanking heads 24 and a feeding mechanism.

[0069] The two groups of blanking heads 24 are arranged at both ends of the connecting frame 2 in the forward direction;

[0070] The feeding mechanism is arranged on the connecting frame 2 and connected to the two groups of the blanking heads 24. The feeding mechanism includes a feeding component and a switching component. The switching component can follow the movement of the telescopic arm 8 so that the feeding component can transport solder paste to the blanking heads 24 located in the movement direction of the connecting frame 2.

[0071] The feeding assembly includes a three-way pipe 23 fixedly mounted on the connecting frame 2, a feeding pipe is connected to the middle of the three-way pipe 23, and a solenoid valve 25 is installed on the feeding pipe, wherein the solenoid valve 25 is electrically connected to the driving motor 21, and the driving device 21 can control the conduction amount of the solenoid valve 25 when rotating forward or reversely, so that when the scraping width formed by the quadrilateral frame plate is large, the larger the opening of the solenoid valve 25, the larger the amount of solder paste falling, and vice versa, the smaller the opening, so that when mounting PCB boards of different specifications, the amount of solder paste can be automatically matched with the PCB board, avoiding the occurrence of excessive or insufficient supply of solder paste;

[0072] It is worth noting that during the first scraping, it is necessary to manually apply an appropriate amount of solder paste on the steel mesh to keep the solder paste in an excessive state to prevent the loss of solder paste resulting in insufficient solder paste supply, causing some pins on the PCB board to have no solder paste, thereby avoiding cold solder joints and solder leaks during subsequent mounting.

[0073] A set of discharge pipes are connected to both sides of the three-way pipe 23, and the discharge pipes are connected to the blanking head 24;

[0074] The feeding assembly further comprises a sealing plug 2601 sealingly and slidably mounted in the tee pipe 23, and the sealing plug 2601 is fixedly connected to a follower frame 26 slidably mounted on the tee pipe 23;

[0075] The switching assembly includes an engaging wheel 27 rotatably mounted on the follower frame 26 and a side plate 22 fixedly connected to the side frame 9, and a switching groove is formed on the side plate 22. The switching groove cooperates with the engaging wheel 27 to enable the sealing plug 2601 to move laterally in the three-way pipe 23 when the height of the side plate 22 changes;

[0076] The switching slot includes two vertical slots 2201 arranged on the side plate 22 , the two vertical slots 2201 are parallel and staggered, and the two vertical slots 2201 are connected by an inclined slot 2202 .

[0077] In the initial state, the side frame 9 is at the lower end of its stroke, at which time the engaging wheel 27 is at the end of the vertical groove 2201 at the upper part of the side plate 22, so that the sealing plug 2601 can block one of the discharge pipes and make the other discharge pipe conductive. At this time, the external pumping device can inject solder paste into the three-way pipe 23, and the solder paste is transported to the blanking head 24 through the conductive discharge pipe, wherein the blanking head 24 is in front of the direction in which the connecting frame 2 is about to move, so that when scraping, the quadrilateral frame plate can act on the solder paste, and when the connecting frame 2 moves to the end of the stroke, the side frame 9 will move upward, and The side plate 22 is driven to move upward. At this time, the engaging wheel 27 will move along the vertical groove 2201 to the inclined groove 2202, and with the cooperation of the inclined groove 2202 and the engaging wheel 27, the follower frame 26 will move horizontally and drive the sealing plug 2601 to move horizontally until the engaging wheel 27 moves to the vertical groove 2201 at the lower part. At this time, the sealing plug 2601 can block the originally conductive discharge pipe and make the originally blocked discharge pipe conductive, and make the connecting frame 2 move in the opposite direction, and the blanking head 24 that can discharge materials will also switch accordingly, and ensure that the blanking head 24 that can discharge materials is always in front of the movement direction of the quadrilateral frame.

[0078] Through the above-mentioned arrangement, the conduction state of the blanking head 24 and the movement state of the quadrilateral frame plate are mechanically linked, and the two are automatically matched to ensure that when the quadrilateral frame plate moves, the blanking head 24 in its movement direction can always maintain a conduction state and apply the solder paste to the front part of the movement direction of the quadrilateral frame plate, so that the applied solder paste can be scraped under the action of the quadrilateral frame plate.

[0079] It should be noted that the two ends of the three-way pipe 23 are connected through a conduit, and the blanking head 24 can be conducted only under a certain pressure, which is significant in that:

[0080] When the sealing plug 2601 is in the process of sealing one of the discharge pipes, it can also seal one end of the conduit. At this time, the solder paste can enter the blanking head 24 from the other discharge pipe. When the sealing plug 2601 moves, it can squeeze the space on one side to squeeze the solder paste in the space from the conduit into the space on the other side, so that buffering can be performed under the action of the conduit, and prevent the solder paste in the three-way pipe 23 from being squeezed into the discharge pipe and falling onto the steel mesh from the blanking head 24 when the sealing plug 2601 switches its position.

[0081] As an embodiment of the present invention, a chip placement machine is also proposed, including the multi-specification linkage controlled feeding chip placement structure.

[0082] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0083] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A feeding patch structure with multi-specification linkage control, characterized in that: include: A connecting frame (2), wherein the connecting frame (2) is capable of reciprocating along the length direction of the PCB board; The first scraper (3) and the second scraper (4) are each provided with two groups and connected to the adjustment assembly provided on the connecting frame (2); the first scraper (3) and the second scraper (4) form a quadrilateral frame plate, and an extension portion (302) is provided at the end of the first scraper (3); A blocking plate (5) is slidably disposed in a through hole (301) formed on the first scraper plate (3), wherein the length of the through hole (301) is greater than the length of the blocking plate (5); A trigger mechanism is connected to the blocking plate (5), the trigger mechanism comprising an elastic component and an abutment component connected to the connecting frame (2), the elastic component cooperates with the abutment component and can drive the blocking plate (5) to move when the connecting frame (2) moves to the end of the stroke, so that the lower end of the through hole (301) is conductive or blocked.

2. A multi-specification linkage controlled feeding patch structure according to claim 1, characterized in that: The connecting frame (2) is provided with a telescopic plate, the telescopic plate is connected to a side frame (9), a retardation groove (901) is formed on the side frame (9), a sliding connection member (10) is slidably installed in the retardation groove (901), and horizontal axes (11) are provided on both sides of the sliding connection member (10); A connecting rod (6) that penetrates the first scraper (3) and is rotatably connected to the blocking plate (5) is slidably fitted with the horizontal axis (11).

3. A multi-specification linkage controlled feeding patch structure according to claim 2, characterized in that: The elastic component comprises a telescopic frame (12) slidably connected to the side frame (9); an abutment roller (14) is rotatably mounted on one end of the telescopic frame (12), and the other end is connected to the side frame (9) via a spring (13); The elastic component also includes an abutment member (15) arranged on the telescopic plate, and the abutment member (15) is provided with two symmetrical inclined surfaces (1501) on a side away from the telescopic plate, and an outer protrusion (1502) is formed at the connection between the two inclined surfaces (1501), and the abutment roller (14) can roll between the two inclined surfaces (1501) via the outer protrusion (1502).

4. A feeding patch structure with multi-specification linkage control according to claim 2, characterized in that: The abutment assembly comprises a trigger wheel (16) rotatably mounted on the telescopic plate, and a first trigger member (17) and a second trigger member (18) adapted to the trigger wheel (16); the first trigger member (17) and the second trigger member (18) are formed with mutually parallel guiding inclined surfaces.

5. The feeding patch structure with multi-specification linkage control according to claim 1 is characterized in that: The adjustment assembly comprises two groups of slide grooves (201) symmetrically arranged on the connecting frame (2), a slider (19) being slidably mounted in the slide grooves (201), and the slider (19) being rotatably connected to the quadrilateral frame plate; The adjustment assembly also includes a drive motor (21) fixedly mounted on the connecting frame (2), the output shaft of the drive motor (21) being connected to a bidirectional screw rod (20), and the bidirectional screw rod (20) being threadedly connected to the two sets of sliders (19).

6. The multi-specification linkage controlled feeding patch structure according to claim 3 is characterized in that: Also includes: Two groups of blanking heads (24) are arranged at two ends of the connecting frame (2) in the forward direction; A feeding mechanism is arranged on the connecting frame (2) and connected to the two groups of blanking heads (24), wherein the feeding mechanism comprises a feeding component and a switching component, wherein the switching component can follow the movement of the telescopic plate so that the feeding component can transport solder paste to the blanking heads (24) located in the movement direction of the connecting frame (2).

7. A feeding patch structure with multi-specification linkage control according to claim 6, characterized in that: The feeding assembly comprises a three-way pipe (23) fixedly mounted on the connecting frame (2), a feeding pipe is connected to the middle of the three-way pipe (23), and a solenoid valve (25) is installed on the feeding pipe; A set of discharge pipes are connected to both sides of the three-way pipe (23), and the discharge pipes are connected to the blanking head (24); The feeding assembly also includes a sealing plug (2601) sealingly and slidably mounted in the three-way pipe (23), and the sealing plug (2601) is fixedly connected to a follower frame (26) slidably mounted on the three-way pipe (23).

8. The multi-specification linkage controlled feeding patch structure according to claim 7, characterized in that: The switching assembly comprises an engaging wheel (27) rotatably mounted on the follower frame (26) and a side plate (22) fixedly connected to the side frame (9), wherein a switching groove is formed on the side plate (22), and the switching groove cooperates with the engaging wheel (27) to enable the sealing plug (2601) to move laterally in the three-way pipe (23) when the height of the side plate (22) changes.

9. A feeding patch structure with multi-specification linkage control according to claim 8, characterized in that: The switching slot comprises two vertical slots (2201) arranged on the side plate (22), the two vertical slots (2201) are parallel and staggered, and the two vertical slots (2201) are connected by an inclined slot (2202).

10. A chip mounter, characterized in that: It comprises a feeding patch structure with multi-specification linkage control as described in any one of claims 1 to 9.

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