Fully automatic selective wave soldering equipment

Abstract

The present invention is applicable to the field of wave soldering technology, and in particular to a fully automatic selective wave soldering device, including a wave soldering machine body, and a solder tank is arranged on the surface of the wave soldering machine body, and a mounting frame is connected to the surface of the wave soldering machine body, and the mounting frame is arranged above the solder tank; a first electric lifting rod is installed on both sides of the interior of the mounting frame, and a lifting seat is slidably connected on both sides of the interior of the mounting frame, and a precision translation component is jointly arranged on the sides of the two lifting seats close to each other, and a fixed seat is arranged on the outside of the precision translation component, and a gas distribution plate is connected to the surface of the fixed seat. The fully automatic selective wave soldering device of the present invention can accurately identify whether the wave thrust of a specific area on the circuit board exceeds a preset range before wave soldering the target batch of circuit boards. This detection method uses air pressure regulation to adapt to components of different masses, thereby ensuring that the thrust is uniform and does not exceed the standard, and has extremely high accuracy.

Description

Technical Field

[0001] The invention relates to the technical field of wave soldering, in particular to a full-automatic selective wave soldering device. Background Art

[0002] Wave soldering is a common electronic manufacturing process used to solder electronic components to circuit boards. During the wave soldering process, solder is transferred to the components of the circuit board in the form of a wave, causing it to melt and form solder joints. The thrust of the wave is critical to the quality of soldering. If the thrust is too large, it may cause component displacement, poor solder joints or other quality problems. Therefore, ensuring accurate control of the wave thrust is of great significance to ensure soldering quality.

[0003] However, in current technology, the test of wave crest thrust mainly relies on manual inspection or simplified mechanical devices. These methods have their own limitations, resulting in the measurement results of wave crest thrust often being inaccurate and inconsistent. Although manual inspection can visually observe the situation during the wave crest soldering process, its accuracy and repeatability are difficult to guarantee. The results of manual inspection are highly dependent on the operator's experience and subjective judgment, and different operators may have different assessments of the thrust of the same wave crest. In addition, manual inspection often cannot provide continuous real-time data and can only be evaluated after the soldering process. This lag makes it difficult to detect and correct problems in a timely manner.

[0004] On the other hand, existing simplified mechanical devices, such as traditional thrust measurement instruments, are usually not adaptable to the actual conditions of different batches of circuit boards. These devices are often designed for specific test conditions and standards and cannot be flexibly adjusted to accommodate different circuit board thicknesses, component layouts, and material properties. Therefore, when processing different batches or different types of circuit boards, the mechanical devices may have errors, resulting in inaccurate test results. Summary of the invention

[0005] The purpose of the embodiments of the present invention is to provide a fully automatic selective wave soldering device, aiming to solve the technical problems mentioned in the background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A fully automatic selective wave soldering device comprises a wave soldering machine body, wherein a soldering tin tank is arranged on the surface of the wave soldering machine body, a mounting frame is connected to the surface of the wave soldering machine body, and the mounting frame is arranged above the soldering tin tank;

[0008] First electric lifting rods are installed on both sides of the mounting frame, lifting seats are slidably connected to both sides of the mounting frame, and a precision translation assembly is commonly provided on the sides of the two lifting seats close to each other, a fixed seat is provided on the outer side of the precision translation assembly, and a gas distribution plate is connected to the surface of the fixed seat;

[0009] An intelligent air pump is installed on the upper surface of the gas distribution plate, and a gas injection pipe is connected to the side of the intelligent air pump, a plurality of microfluidic air pipes are connected to the lower surface of the gas distribution plate, and an electronic pressure regulating valve is installed on the outer side of the microfluidic air pipe, a plurality of connecting columns are connected to the outer side of the gas distribution plate, and one end of the plurality of connecting columns is commonly connected to a mounting panel, a rubber cushion layer is provided on the lower surface of the mounting panel, and a plurality of first air holes are opened on the surface of the rubber cushion layer, a plurality of second air holes are opened on the upper surface of the mounting panel, a second electric lifting rod is installed on the side of the mounting panel, and a support block is connected to one end of the second electric lifting rod, and a support plate is connected to the side of the support block;

[0010] A plurality of mounting holes are provided on the surface of the supporting plate, and a hollow cylinder is connected to the inside of the mounting hole, a sealing push rod is movably connected to the inside of the hollow cylinder, and a fluorescent marking block is provided at one end of the sealing push rod close to the mounting panel, and a simulation disc is provided at one end of the sealing push rod away from the mounting panel, a limiting groove is provided inside the hollow cylinder, and a limiting protrusion is provided on the side of the sealing push rod.

[0011] Furthermore, one end of the gas injection pipe away from the intelligent gas pump is arranged inside the gas distribution plate, one end of the microfluidic gas pipe is connected to the inside of the gas distribution plate, and the other end of the microfluidic gas pipe is connected to the second vent and the first vent.

[0012] Furthermore, the hollow cylinder, the sealing push rod, the simulation disc, the microfluidic tube, the second vent hole, and the first vent hole are all on the same axis.

[0013] Furthermore, the fluorescent marker block is made of polystyrene material or acrylic resin material, and the surface of the fluorescent marker block is coated with fluorescent pigment, and the rubber cushion layer is made of silicone material or polyurethane material.

[0014] Furthermore, the distance between the upper surface of the fluorescent marker block and the upper surface of the hollow tube is set to 0.1-0.3 mm.

[0015] Furthermore, slide grooves are provided on both sides of the mounting frame, and sliders are provided on the sides of the two lifting seats that are away from each other. The lifting seats are slidably connected to the inside of the mounting frame through the cooperation of the sliders and the slide grooves, and one end of the first electric lifting rod is connected to the surface of the lifting seat.

[0016] Furthermore, the precision translation assembly comprises:

[0017] The sides of the two lifting seats close to each other are respectively installed with a bearing seat and a servo motor, and the output end of the servo motor and the inside of the bearing seat are jointly installed with a ball screw, the surface of the ball screw is meshedly connected with a ball nut, and the fixed seat is connected to the outside of the ball nut;

[0018] The sides of the two lifting seats close to each other are commonly connected with a guide slide bar, the surface of the ball nut is connected with a guide slider, and the side of the guide slider is provided with a guide through hole, and the guide slide bar is arranged inside the guide through hole.

[0019] The fully automatic selective wave soldering device provided by the present invention has the following significant advantages:

[0020] Before wave soldering the target batch of circuit boards, it is possible to accurately identify whether the wave thrust in a specific area on the circuit board exceeds the preset range. This detection method uses air pressure adjustment to adapt to components of different masses, thereby ensuring that the thrust is uniform and within the standard, with extremely high accuracy.

[0021] In addition, the detection method has strong recognition intuitiveness, does not need to set up a large number of sensing elements, simplifies system design, and reduces maintenance costs. The application of high-precision air pressure regulation and automatic control components not only improves the accuracy and efficiency of detection, but also extends the service life. In summary, the fully automatic selective wave soldering device of the present invention significantly enhances the pre-soldering pre-inspection capability and ensures high quality and stability during the soldering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a fully automatic selective wave soldering device.

[0023] Figure 2 It is a schematic diagram of the structure of a mounting frame in a fully automatic selective wave soldering device and various components carried on the mounting frame.

[0024] Figure 3 This is a schematic diagram of the front structure of a gas distribution plate in a fully automatic selective wave soldering device and various components mounted on the gas distribution plate.

[0025] Figure 4 For fully automatic selective wave soldering equipment Figure 3 Enlarged view of point A.

[0026] Figure 5 It is a structural schematic diagram of a sealing push rod and a hollow cylinder in a fully automatic selective wave soldering device in a sealed connection state.

[0027] Figure 6 It is a structural schematic diagram of a sealing push rod and a hollow cylinder in a fully automatic selective wave soldering device in a separated state.

[0028] Figure 7 It is a schematic diagram of the upward structure of the gas distribution plate in the fully automatic selective wave soldering device and various components carried on the gas distribution plate.

[0029] In the figure: 1. wave soldering machine body; 2. solder tank; 3. mounting frame; 4. solder tank cover; 5. lifting seat; 6. bearing seat; 7. first electric lifting rod; 8. ball screw; 9. ball nut; 10. fixed seat; 11. gas distribution plate; 12. mounting panel; 13. supporting plate; 14. guide slider; 15. guide slider; 16. servo motor; 17. intelligent air pump; 18. gas injection pipe; 19. electronic pressure regulating valve; 20. micro flow gas pipe; 21. connecting column; 22. hollow cylinder; 23. second electric lifting rod; 24. supporting block; 25. fluorescent marking block; 26. sealing push rod; 27. simulated disc; 28. rubber cushion; 29. ​​first vent; 30. limiting groove; 31. limiting protrusion block. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0031] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0032] like Figure 1-Figure 7 As shown, the fully automatic selective wave soldering device provided by the embodiment of the present invention includes a wave soldering machine body 1, and a solder tank 2 is arranged on the surface of the wave soldering machine body 1, a solder tank cover 4 is connected to the surface of the wave soldering machine body 1, and a mounting frame 3 is connected to the surface of the wave soldering machine body 1, and the mounting frame 3 is arranged above the solder tank 2. The mounting frame 3 is assembled with the wave soldering machine body 1 by a detachable connection method, such as a threaded connection. The surface of the wave soldering machine body 1 reserves an installation position for the mounting frame 3, so that the mounting frame 3 can be firmly fixed in a suitable position.

[0033] First electric lifting rods 7 are installed on both sides of the mounting frame 3, and lifting seats 5 are slidably connected on both sides of the mounting frame 3. Slide grooves are provided on both sides of the mounting frame 3, and sliders are provided on the sides of the two lifting seats 5 that are away from each other. The lifting seats 5 are slidably connected to the inside of the mounting frame 3 through the cooperation of the sliders and the slide grooves, and one end of the first electric lifting rod 7 is connected to the surface of the lifting seat 5.

[0034] The sides of the two lifting seats 5 that are close to each other are jointly provided with a precision translation assembly, which can adopt a high-precision screw transmission structure or a high-precision gear transmission structure, among which the high-precision screw transmission structure is the preferred solution. The screw transmission structure has high transmission accuracy and stability, and can achieve precise translation control. A fixed seat 10 is provided on the outside of the precision translation assembly, and a gas distribution plate 11 is connected to the surface of the fixed seat 10.

[0035] An intelligent air pump 17 is installed on the upper surface of the gas distribution plate 11, and a gas injection pipe 18 is connected to the side of the intelligent air pump 17. A plurality of micro-flow air pipes 20 are connected to the lower surface of the gas distribution plate 11, and an electronic pressure regulating valve 19 is installed on the outer side of the micro-flow air pipe 20. The intelligent air pump 17 has an automatic pressure regulating function and can automatically adjust the gas output pressure according to actual needs. The electronic pressure regulating valve 19 has a precise pressure control function and can achieve precise regulation of the gas pressure through electronic control.

[0036] The outer side of the gas distribution plate 11 is connected to a plurality of connecting columns 21, and one end of the plurality of connecting columns 21 is commonly connected to the mounting panel 12, a rubber pad layer 28 is provided on the lower surface of the mounting panel 12, and a plurality of first air holes 29 are provided on the surface of the rubber pad layer 28, a plurality of second air holes are provided on the upper surface of the mounting panel 12, an end of the gas injection pipe 18 away from the intelligent air pump 17 is provided inside the gas distribution plate 11, one end of the microfluidic gas pipe 20 is connected to the inside of the gas distribution plate 11, and the other end of the microfluidic gas pipe 20 is connected to the second air hole and the first air hole 29.

[0037] A second electric lifting rod 23 is installed on the side of the mounting panel 12, and one end of the second electric lifting rod 23 is connected to a support block 24, and the side of the support block 24 is connected to a support plate 13. A plurality of mounting holes are opened on the surface of the support plate 13, and a hollow cylinder 22 is connected to the inside of the mounting hole, and a sealing push rod 26 is movably connected to the inside of the hollow cylinder 22, and a fluorescent marker block 25 is arranged at one end of the sealing push rod 26 close to the mounting panel 12, and a simulation disc 27 is arranged at one end of the sealing push rod 26 away from the mounting panel 12. The sealing push rod 26 and the simulation disc 27 are both made of extremely low-density materials, such as polytetrafluoroethylene (PTFE) or lightweight plastics, to ensure that their mass is at an extremely low level. This material selection not only reduces the overall weight of the components, but also improves their wear resistance and chemical corrosion resistance. It should be noted that the total mass of the sealing push rod 26, the simulation disc 27 and the fluorescent marker block 25 has been pre-set, and the system can monitor and control this total mass in real time to ensure the accuracy and consistency of the test.

[0038] The hollow cylinder 22, the sealing push rod 26, the simulation disc 27, the microfluidic tube 20, the second vent hole, and the first vent hole 29 are all on the same axis, and good sealing performance is maintained between the sealing push rod 26 and the hollow cylinder 22. This sealing performance is achieved by selecting highly sealing materials, precise manufacturing processes and effective sealing structures, thereby preventing gas leakage and maintaining a stable air pressure.

[0039] A limiting groove 30 is provided inside the hollow cylinder 22, and a limiting protrusion 31 is provided on the side of the sealing push rod 26. The limiting protrusion 31 is fixed inside the limiting groove 30 by a sliding connection, and the limiting groove 30 and the limiting protrusion 31 are used together to accurately limit the movement position of the sealing push rod 26 inside the hollow cylinder 22. This design prevents the sealing push rod 26 from sliding out of the bottom port of the hollow cylinder 22, ensuring its stability and reliability during operation.

[0040] In one embodiment of the present invention, when a wave soldering operation is performed on a target batch of circuit boards using a fully automatic selective wave soldering device, the wave thrust in the solder tank 2 should first be detected to determine whether the components on the circuit board will move due to the wave thrust, thereby causing soldering quality problems. The specific operation process is as follows:

[0041] The staff first puts the mounting frame 3 into the solder bath cover 4 and installs it at the predetermined position. Then, the first electric lifting rod 7 is started to drive the lifting seat 5 to slide up and down inside the mounting frame 3 until the plurality of simulated discs 27 are adjusted to an appropriate height, that is, the lower surface of the simulated disc 27 is the same as the height of the components on the circuit board during wave soldering. It should be noted that at this time, the top ends of the plurality of hollow cylinders 22 are tightly against the surface of the rubber pad 28.

[0042] The gas distribution plate 11 is moved to the top of the target wave crest by the precision translation assembly so that several simulated discs 27 are aligned with the wave crest. Subsequently, the circuit board components to be soldered by the wave crest are determined, and the simulated discs 27 on the supporting plate 13 corresponding to these components are identified. According to the mass of each circuit board component, the electronic pressure regulating valve 19 installed on the microfluidic gas tube 20 corresponding to the simulated disc 27 is adjusted so that appropriate air pressure is injected into the corresponding hollow cylinder 22. The injection value of the air pressure should be such that the total mass of the sealing push rod 26, the simulated disc 27 and the fluorescent marker block 25 plus the sum of the friction force and the air pressure is equal to the mass of the circuit board component. For areas outside the wave crest, a larger air pressure is applied to ensure that the sealing push rods 26 in these areas will not move under the thrust of the wave crest.

[0043] After the peak thrust test is completed, the second electric lifting rod 23 is opened to move the support block 24 and the support plate 13 downward, thereby separating the support plate 13 from the mounting panel 12 and fully revealing the surface of the rubber cushion layer 28. The staff can use external equipment (such as a high-resolution scanner or image recognition system) to detect which areas have fluorescent marks and determine the specific corresponding components.

[0044] If the test finds that the wave crest still pushes the simulated disc 27 to a certain distance and causes the sealing push rod 26 to drive the fluorescent marker block 25 to move upward, leaving a mark, it indicates that the wave crest thrust is too large. At this time, the wave crest thrust needs to be adjusted to ensure that the thrust during the welding process is appropriate, thereby ensuring the welding quality of the circuit board components.

[0045] Through the above technical solutions, the fully automatic selective wave soldering device has demonstrated excellent detection capabilities. Before wave soldering the target batch of circuit boards, the device can accurately identify whether the wave thrust in a specific area on the circuit board exceeds the preset range. This detection method uses air pressure regulation to adapt to components of different masses, ensuring that the thrust is uniform and does not exceed the standard, with high accuracy.

[0046] In addition, the recognition of this technical solution is intuitive, and there is no need to set up a large number of sensing components, which simplifies the system design and reduces maintenance costs. Due to the use of high-precision air pressure regulation and automatic control components, this solution not only improves the accuracy and efficiency of detection, but also has a longer service life. Overall, this technical solution significantly improves the pre-inspection capability before wave soldering, ensuring high quality and stability during the soldering process.

[0047] In this embodiment, the fluorescent marker block 25 is made of polystyrene material or acrylic resin material, and the surface of the fluorescent marker block 25 is coated with fluorescent pigment, and the rubber pad layer 28 is made of silicone material or polyurethane material.

[0048] This material setting ensures that the fluorescent marker block 25 has excellent fluorescent reflection effect under lighting conditions, thereby achieving high-contrast visual marking and facilitating accurate detection. At the same time, the use of polystyrene and acrylic resin materials ensures the firmness and stability of the marker block, avoiding deformation or breakage under high temperature or other environmental conditions.

[0049] The choice of silicone and polyurethane materials ensures that the rubber pad 28 has excellent elasticity and durability, which can effectively buffer and absorb the impact force during the wave soldering process while providing uniform pressure distribution. This material combination improves the overall durability and reliability of the system, making the detection process more stable and long-lasting.

[0050] In this embodiment, the distance between the upper surface of the fluorescent marker block 25 and the upper surface of the hollow cylinder 22 is set to 0.1-0.3 mm.

[0051] This distance setting ensures that the slight displacement of the component can be accurately detected during the wave soldering process. This distance range is small enough to respond sensitively to slight thrust changes, while avoiding the reduction in detection sensitivity caused by excessive distance. Reasonable distance setting enables the fluorescent marker block 25 to produce clear markings when the component is displaced, thereby improving the accuracy and reliability of detection. This precise distance control helps to optimize the soldering process and ensure that the soldering quality of the circuit board meets the standards.

[0052] In this embodiment, the precision translation assembly includes:

[0053] The sides of the two lifting seats 5 close to each other are respectively installed with a bearing seat 6 and a servo motor 16, and the output end of the servo motor 16 and the inside of the bearing seat 6 are jointly installed with a ball screw 8, the surface of the ball screw 8 is meshedly connected with a ball nut 9, and the fixed seat 10 is connected to the outside of the ball nut 9;

[0054] The sides of the two lifting seats 5 close to each other are connected with a guide slide bar 15, the surface of the ball nut 9 is connected with a guide slider 14, and a guide through hole is opened on the side of the guide slider 14, and the guide slide bar 15 is set inside the guide through hole.

[0055] In this embodiment, when it is necessary to drive the gas distribution plate 11 to translate above the solder tank 2, the servo motor 16 can be turned on, and the servo motor 16 drives the ball screw 8 to rotate through the bearing seat 6, so that the ball nut 9 engaged with the outer side of the ball screw 8 translates, and the ball nut 9 can move smoothly along the preset trajectory under the guidance of the guide slide bar 15 and the guide slider 14 until the gas distribution plate 11 is moved to the appropriate position.

[0056] By setting up a precision translation assembly, a high-precision and high-stability translation operation can be achieved. The servo motor 16 provides precise rotation control, the cooperation of the ball screw 8 and the ball nut 9 ensures smooth movement, and the guide slide bar 15 and the guide slide block 14 further ensure the accuracy of the translation path. This setting effectively reduces vibration and error during movement, improves the overall performance and accuracy of the system, and enables the gas distribution plate 11 to accurately align with a specific wave crest in the solder tank 2, ensuring the reliability and consistency of the wave soldering process.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A fully automatic selective wave soldering device, comprising a wave soldering machine body (1), wherein a solder tank (2) is arranged on the surface of the wave soldering machine body (1), characterized in that: A mounting frame (3) is connected to the surface of the wave soldering machine body (1), and the mounting frame (3) is arranged above the soldering tank (2); First electric lifting rods (7) are installed on both sides of the interior of the mounting frame (3), lifting seats (5) are slidably connected to both sides of the interior of the mounting frame (3), and a precision translation assembly is commonly provided on the sides of the two lifting seats (5) close to each other, a fixed seat (10) is provided on the outside of the precision translation assembly, and a gas distribution plate (11) is connected to the surface of the fixed seat (10); An intelligent air pump (17) is installed on the upper surface of the gas distribution plate (11), and a gas injection pipe (18) is connected to the side of the intelligent air pump (17); a plurality of microfluidic air pipes (20) are connected to the lower surface of the gas distribution plate (11), and an electronic pressure regulating valve (19) is installed on the outer side of the microfluidic air pipe (20); a plurality of connecting columns (21) are connected to the outer side of the gas distribution plate (11), and one end of the plurality of connecting columns (21) is commonly connected to a mounting panel (12); a rubber cushion layer (28) is provided on the lower surface of the mounting panel (12), and a plurality of first passages are provided on the surface of the rubber cushion layer (28); A plurality of second vent holes are provided on the upper surface of the mounting panel (12); a second electric lifting rod (23) is installed on the side of the mounting panel (12); one end of the second electric lifting rod (23) is connected to a support block (24); and a side of the support block (24) is connected to a support plate (13); The surface of the support plate (13) is provided with a plurality of mounting holes, and the interior of the mounting holes is connected to a hollow cylinder (22), the interior of the hollow cylinder (22) is movably connected to a sealing push rod (26), and the end of the sealing push rod (26) close to the mounting panel (12) is provided with a fluorescent marking block (25), and the end of the sealing push rod (26) away from the mounting panel (12) is provided with a simulation disc (27), the interior of the hollow cylinder (22) is provided with a limiting groove (30), and the side of the sealing push rod (26) is provided with a limiting protrusion (31).

2. The fully automatic selective wave soldering device according to claim 1, characterized in that: One end of the gas injection pipe (18) away from the intelligent gas pump (17) is arranged inside the gas distribution plate (11), one end of the microfluidic gas pipe (20) is connected to the inside of the gas distribution plate (11), and the other end of the microfluidic gas pipe (20) is connected to the second vent hole and the first vent hole (29).

3. The fully automatic selective wave soldering device according to claim 2, characterized in that: The hollow cylinder (22), the sealing push rod (26), the simulation disc (27), the microfluidic tube (20), the second vent hole, and the first vent hole (29) are all on the same axis.

4. The fully automatic selective wave soldering device according to claim 1, characterized in that: The fluorescent marker block (25) is made of a polystyrene material or an acrylic resin material, and the surface of the fluorescent marker block (25) is coated with fluorescent pigments, and the rubber cushion layer (28) is made of a silicone material or a polyurethane material.

5. The fully automatic selective wave soldering device according to claim 1, characterized in that: The distance between the upper surface of the fluorescent marker block (25) and the upper surface of the hollow cylinder (22) is set to 0.1-0.3 mm.

6. The fully automatic selective wave soldering device according to claim 1, characterized in that: Slide grooves are provided on both sides of the interior of the mounting frame (3), and sliding blocks are provided on the sides of the two lifting seats (5) that are away from each other. The lifting seats (5) are slidably connected to the interior of the mounting frame (3) through the cooperation of the sliding blocks and the slide grooves, and one end of the first electric lifting rod (7) is connected to the surface of the lifting seat (5).

7. The fully automatic selective wave soldering device according to claim 1, characterized in that: The precision translation assembly comprises: A bearing seat (6) and a servo motor (16) are respectively installed on the sides of the two lifting seats (5) that are close to each other, and a ball screw (8) is installed on the output end of the servo motor (16) and the inside of the bearing seat (6), and a ball nut (9) is meshingly connected to the surface of the ball screw (8), and the fixed seat (10) is connected to the outside of the ball nut (9); The sides of the two lifting seats (5) close to each other are commonly connected to a guide slide bar (15), the surface of the ball nut (9) is connected to a guide slider (14), and a guide through hole is provided on the side of the guide slider (14), and the guide slide bar (15) is arranged to penetrate the inside of the guide through hole.

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