A semiconductor sensor base detection device and detection method

Abstract

The present invention relates to the technical field of semiconductor sensor base detection, and discloses a semiconductor sensor base detection device and detection method. An electric telescopic rod is fixed in the middle of the bottom of the top plate, and a protective cover is fixedly installed on the output end of the electric telescopic rod. A detection piece is provided at the top of the protective cover, and stress points are evenly distributed on the bottom of the detection piece. A clamping assembly is installed on the top of the turntable, and the size of the protective cover corresponds to that of the base body. The detection piece and the base body are matched. The diameter size of the base body, whether the jack aperture has deviation, and whether the outer edge of the base body has defects or burrs can be measured by the distribution change of the stress points. The surface of the base body can be intuitively detected, errors in manual detection can be avoided, and detection accuracy can be improved. The outer edge of the mounting seat can be scraped and cleaned by multiple sets of scrapers, and the base body can be trimmed in real time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor sensor base detection, and in particular to a semiconductor sensor base detection device and detection method. Background Art

[0002] In automated production, various sensors are used to monitor and control various parameters in the production process to ensure that the equipment works in a normal or optimal state. When the sensor base is produced and processed, it is usually necessary to perform online quality inspection on the produced sensor base to ensure that the chip pins and sensor pins can be accurately inserted into the base, ensuring the subsequent sensor assembly accuracy.

[0003] However, existing base inspection usually uses observation to determine whether the sensor base has cracks and damage, which is quick and direct. However, there is currently a lack of equipment on the market that can detect the position and size of the jacks on the sensor base. However, in actual production and manufacturing, the base is generally prepared by injection molding, which can easily cause the jack size to be too large due to residue inside the mold, resulting in deviation from the center position of the base jack. At the same time, after long-term use of the mold, there will be wear and tear, resulting in the jack size being too small and the actual jack position deviating, which then leads to quality problems such as mismatch between the jack and the sensor pins. This will affect the assembly of the sensor pins and the base, and then defective products will appear.

[0004] Therefore, the present invention solves the above-mentioned problems through a semiconductor sensor base detection device and detection method. Summary of the Invention

[0005] The object of the present invention is to provide a semiconductor sensor base detection device and detection method to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a semiconductor sensor base detection device, comprising a workbench, legs fixed to the four corners of the bottom of the workbench, pillars fixed to the left and right sides of the top of the workbench, top plates fixed to the tops of the two groups of pillars, a turntable rotatably assembled in the middle of the workbench, a drive motor installed at the bottom of the turntable, an electric telescopic rod fixed to the middle of the bottom of the top plate, a protective cover fixed to the output end of the electric telescopic rod, a detection piece provided at the top of the protective cover, stress points distributed at the bottom of the detection piece, a clamping assembly installed at the top of the turntable, a base body corresponding to the clamping assembly installed at the middle limit of the top of the turntable, and the size of the protective cover corresponds to the base body, the detection piece and the base body match, and the diameter of the base body, whether the jack aperture has deviation, and whether the outer edge of the base body is defective or has burrs can be measured by the distribution change of the stress points, so that the surface of the base body can be intuitively detected, errors in manual detection can be avoided, and detection accuracy can be improved.

[0007] Preferably, the driving motor is fixed to the bottom of the workbench through a support rod, an annular accommodating groove is opened in the workbench, and the turntable is rotatably assembled in the annular accommodating groove through a bearing.

[0008] Preferably, the base body includes a bottom plate, a mounting seat is integrally formed on the top of the bottom plate, a central socket is provided at the center of the top of the mounting seat, and a plurality of groups of pin sockets are provided on the top of the mounting seat along the circumferential direction.

[0009] Preferably, the clamping assembly includes a slide opened on the top of the turntable, an electromagnet is fixed to the inner outer end of the slide, an armature plate is slidably assembled on the inner inner end of the slide, a support spring is connected between the electromagnet and the armature plate, a clamping plate is fixedly connected to the slide extending from the top of the armature plate, and the clamping plate is clamped and assembled on the outer wall of the base plate.

[0010] Preferably, the detection component is a circular inflatable airbag, and the diameter of the circular inflatable airbag is larger than the diameter of the mounting seat. The stress points are densely distributed at the bottom of the circular inflatable airbag, and the protective cover is sleeved on the mounting seat.

[0011] Preferably, the detection member is pressed onto the mounting seat to form a first deformation zone corresponding to the central insertion hole, a second deformation zone corresponding to the pin insertion hole, and a third deformation zone corresponding to the edge of the mounting seat.

[0012] Preferably, a cleaning assembly is installed inside the protective cover, and the cleaning assembly includes a receiving groove opened inside the protective cover, a slide is slidably installed in the receiving groove, a pressure-bearing part is connected between the outer wall of the slide and the inner wall of the receiving groove, the pressure-bearing part is connected to the detection part through an air guide tube, and an electromagnetic valve is fixedly installed on the air guide tube, the other side wall of the slide is fixedly connected to a guide rod extending to the inner cavity of the protective cover, and the outer end of the guide rod is fixed with a scraper corresponding to the mounting seat.

[0013] Preferably, the cleaning components are arranged into four groups along the circumferential direction of the protective cover, and the distance between two opposing groups of scrapers is greater than the diameter of the mounting seat, and the cleaning components are arranged below the detection member, and the pressure-bearing member is a pressure-bearing air bag.

[0014] The present invention also provides a method for detecting a semiconductor sensor base. The method is implemented using the semiconductor sensor base detection device described above. The steps of the method are as follows:

[0015] S1: When in use, place the base body on the turntable, then fix it with the clamping assembly, and then control the electric telescopic rod to extend outward, driving the protective cover to be placed on the base body:

[0016] S2: The inspection piece first contacts the mounting seat during its downward movement, so that the stress points where the bottom of the inspection piece contacts the mounting seat are all subjected to pressure. As it continues to move downward, the extrusion force on the inspection piece becomes greater and greater, thereby forming a first deformation zone and a second deformation zone at the corresponding positions of the inspection piece, the center socket, and the pin socket. That is, the range in the first deformation zone where no pressure change occurs at the stress point is the diameter size of the center socket. Similarly, the range in the second deformation zone where no pressure change occurs at the stress point is the diameter size of the pin socket. Based on the number of stress points in the stress-free distribution state, it is easy to detect the sizes of the center socket and the pin socket, thereby judging in real time whether the center socket and the pin socket meet the standards, directly judging defective products, and then eliminating the defective products.

[0017] S3: After the base body passes the inspection, the electric telescopic rod continues to move downward, causing the inspection piece and the mounting seat to continue to squeeze each other. This will form a third deformation zone under the compression of the outer edges of the inspection piece and the mounting seat. The number of stress points in the third deformation zone can be used to determine whether the mounting seat has burrs or not.

[0018] S4: Then the solenoid valve is controlled to open, so that the gas inside the detection part is introduced into the pressure-bearing part through the air guide tube, and then the expansion of the pressure-bearing part pushes the scraper at the end of the guide rod to move toward the mounting seat. When the pressure-bearing part is fully expanded, the guide rod gives the scraper an extrusion force on the mounting seat. At this time, the solenoid valve is controlled to close, and the electric telescopic rod is synchronously controlled to reset, driving the detection part to separate from the mounting seat. The drive motor starts to drive the turntable to start rotating. Then, during the rotation of the base body, multiple sets of scrapers are used to scrape and clean the outer edge of the mounting seat.

[0019] The technical effects and advantages of the present invention are as follows:

[0020] 1. The detection member of the present invention contacts the base body under the drive of the electric telescopic rod. In this way, the stress points where the bottom of the detection member contacts the base body will be subjected to pressure, that is, the pressure value will change. In this way, the diameter size of the base body, whether there is deviation in the hole diameter, and whether there is any defect or burr on the outer edge of the base body can be measured through the distribution change of the stress points. This can intuitively detect the surface of the base body, avoid errors in manual detection, and improve detection accuracy.

[0021] 2. The present invention can directly remove defective products after inspecting the base body. At the same time, the distribution of burrs and burrs can be determined by the number of stress points at the third deformation zone during inspection, and the length of burrs and burrs can be determined by the range of stress points at the third deformation zone. Then, the scraper and the mounting seat are brought into contact by the gas introduced by the inspection piece. In this way, when the motor drives the base body on the turntable to rotate, the outer edge of the mounting seat is scraped and cleaned by multiple sets of scrapers, and the base body can be trimmed in real time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention from a first perspective;

[0023] Figure 2 This is a schematic diagram of the overall structure of the present invention from a second viewing angle;

[0024] Figure 3 It is a schematic diagram of the local structure of the present invention;

[0025] Figure 4 It is a schematic cross-sectional view of the present invention;

[0026] Figure 5 This is a schematic diagram of the enlarged structure of part A of the present invention;

[0027] Figure 6 This is a schematic diagram of the structure of the detection element of the present invention;

[0028] Figure 7 This is an enlarged structural diagram of part B of the present invention;

[0029] Figure 8 This is a schematic structural diagram of the first state of the assembly of the detection member and the base body of the present invention;

[0030] Figure 9 This is a schematic diagram of the structure of the second state of the detection member and the base body assembled according to the present invention;

[0031] Figure 10 This is a schematic structural diagram of the third assembled state of the detection member and the base body of the present invention;

[0032] Figure 11 This is a schematic structural diagram of the fourth assembled state of the detection member and the base body of the present invention.

[0033] In the figure: 1. workbench; 2. support legs; 3. pillars; 4. top plate; 5. turntable; 6. drive motor; 7. electric telescopic rod; 8. protective cover; 9. detection part; 91. first deformation zone; 92. second deformation zone; 93. third deformation zone; 10. stress point; 11. clamping assembly; 111. slideway; 112. electromagnet; 113. armature plate; 114. support spring; 115. clamping plate; 12. base body; 121. bottom plate; 122. mounting seat; 123. center socket; 124. pin socket; 13. storage slot; 14. slide plate; 15. pressure-bearing part; 16. guide rod; 17. scraper; 18. air duct. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] Example 1:

[0036] This embodiment provides Figures 1 to 6The semiconductor sensor base detection device shown in the figure includes a workbench 1, with legs 2 fixed at the four corners of the bottom of the workbench 1, pillars 3 fixed on the left and right sides of the top of the workbench 1, and a top plate 4 fixed on the top of the two groups of pillars 3. A turntable 5 is rotatably assembled in the middle of the workbench 1, and a drive motor 6 is installed at the bottom of the turntable 5. An electric telescopic rod 7 is fixed in the middle of the bottom of the top plate 4, and a protective cover 8 is fixed at the output end of the electric telescopic rod 7. A detection part 9 is provided at the top of the protective cover 8, and stress points 10 are evenly distributed on the bottom of the detection part 9. A clamping assembly 11 is assembled on the top of the turntable 5, and a base body 12 corresponding to the clamping assembly 11 is installed in the middle limit position of the top of the turntable 5, and the size of the protective cover 8 corresponds to the base body 12. The detection part 9 and the base body 12 match, and the drive motor 6, the electric telescopic rod 7, the clamping assembly 11, and the stress point 10 are all connected to the controller through wires, and the controller can perform integrated control of the device.

[0037] When in use, the base body 12 is placed on the turntable 5, and then fixedly clamped by the clamping assembly 11, and the detection piece 9 and the base body 12 are facing each other, so the controller controls the electric telescopic rod 7 to extend outward, driving the protective cover 8 to be set on the base body 12, so that the detection piece 9 contacts the base body 12 during the downward movement, so that the stress points 10 where the bottom of the detection piece 9 contacts the base body 12 will be subjected to pressure, that is, the pressure value will change. In this way, the diameter size of the base body 12, whether the jack aperture has deviation, and whether the outer edge of the base body 12 is defective or has burrs can be measured through the distribution change of the stress points 10. The surface of the base body 12 can be intuitively inspected, the mistakes of manual inspection can be avoided, and the inspection accuracy can be improved. Specifically:

[0038] See also Figure 1-Figure 3 The drive motor 6 is fixed to the bottom of the workbench 1 through a support rod (not shown), which ensures the stability of the drive motor 6. An annular accommodating groove is opened in the workbench 1, and the turntable 5 is rotatably assembled in the annular accommodating groove through a bearing. This can ensure the compact assembly of the turntable 5 and the workbench 1, and at the same time ensure that the turntable 5 can rotate under the drive of the drive motor 6, and at the same time prevent dust and other debris from entering the assembly gap between the turntable 5 and the workbench 1.

[0039] See also Figure 3 The base body 12 includes a bottom plate 121, and a mounting seat 122 is integrally formed on the top of the bottom plate 121. A center socket 123 is provided at the center of the top of the mounting seat 122, and several groups of pin sockets 124 are provided on the top of the mounting seat 122 along the circumferential direction. The center socket 123 facilitates the passage of the lead, and the pin sockets 124 facilitate the plug-in assembly of the semiconductor sensor pins, which can provide convenience for the subsequent assembly of the semiconductor sensor.

[0040] It should be noted that the diameter of the central jack 123 and the position and diameter of the pin jack 124 are all distributed according to the actual semiconductor sensor pin assembly requirements. This embodiment merely provides a schematic diagram for detecting the jacks.

[0041] See also Figure 3 and Figure 5 The clamping assembly 11 includes a slide 111 opened on the top of the turntable 5, an electromagnet 112 is fixed to the outer end of the slide 111, an armature plate 113 is slidably assembled on the inner end of the slide 111, a support spring 114 is connected between the electromagnet 112 and the armature plate 113, and the top of the armature plate 113 extends out of the slide 111 and is fixedly connected to a clamping plate 115, and the clamping plate 115 is clamped and assembled on the outer side wall of the bottom plate 121. In actual use, when the base When the base body 12 is placed on the turntable 5, the controller controls multiple groups of electromagnets 112 to be energized synchronously, which can generate a magnetic repulsive force on the armature plate 113, and then overcome the rebound force of the support spring 114 to push the clamping plate 115 to squeeze on the side wall of the base body 12, thereby achieving fixed clamping of the base body 12. When the controller controls the electromagnet 112 to lose power, the support spring 114 can drive the clamping plate 115 to reset and disengage from the fixed clamping of the base body 12.

[0042] It is worth noting that, please refer to Figure 4 and Figure 6 The detection part 9 is a circular inflatable air bag, and the diameter of the circular inflatable air bag is larger than the diameter of the mounting seat 122. The stress points 10 are densely distributed at the bottom of the circular inflatable air bag, and the protective cover 8 is mounted on the mounting seat 122. This ensures that when the detection part 9 is attached to the surface of the mounting seat 122, the stress points 10 can cover the mounting seat 122, making it convenient to detect the aperture of the jack by changing the number of stress points 10.

[0043] See also Figures 6-11 The detection member 9 is pressed onto the mounting seat 122 to form a first deformation zone 91 corresponding to the center socket 123 , a second deformation zone 92 corresponding to the pin socket 124 , and a third deformation zone 93 corresponding to the edge of the mounting seat 122 .

[0044] When the center socket 123 and the pin socket 124 on the base body 12 are of qualified size, the center socket 123 has a diameter of D, the pin socket 124 has a diameter of d, and the outer edge of the mounting seat 122 has no burrs, the deformation amount of the third deformation zone 93 is 0, that is, the number of stress points 10 under pressure in the third deformation zone 93 is 0. However, when the number of stress points 10 under pressure in the third deformation zone 93 increases, it indicates that the outer edge of the mounting seat 122 has burrs. Please refer to the schematic diagram. Figure 11 At this time, the outer edge of the mounting seat 122 needs to be cleaned specifically.

[0045] When the number of stress points 10 without stress in the second deformation zone 92 decreases, it indicates that the aperture d of the pin hole 124 is reduced, which directly indicates that the size of the pin hole 124 is unqualified. Figure 9 Once the size of the pin socket 124 is reduced, it will not be able to match the sensor pin, which will cause the subsequent sensor plug-in assembly to fail.

[0046] On the contrary, when the number of stress points 10 without stress in the second deformation zone 92 increases, it indicates that the aperture d of the pin hole 124 has become larger. When the increase value exceeds the standard range, it directly indicates that the size of the pin hole 124 is unqualified. Please refer to the schematic diagram Figure 10 When the size increase of the pin socket 124 is within the standard range, it is allowed and does not affect the plug-in assembly between the pin socket 124 and the sensor pin. However, once the size increase of the pin socket 124 exceeds the standard range, it will cause the pin to detach during the subsequent sensor pin insertion process, and there will be clearance and loose welding during the subsequent pin welding, which greatly affects the assembly quality of the sensor.

[0047] Example 2:

[0048] During the use of the first embodiment, it was found that the size detection of the base body 12 and the size detection of the socket can be realized, and defective products can be directly eliminated. However, for the base body 12 whose socket size meets the standard, once the outer edge of the mounting seat 122 has a burr or burr, it is very easy to affect the subsequent assembly between the protective shell and the base body 12. Therefore, the mounting seat 122 needs to be cleaned. Based on this, this application document proposes the following improvement plan:

[0049] See also Figure 4 and Figure 7 A cleaning assembly is installed inside the protective cover 8, and the cleaning assembly includes a receiving groove 13 opened inside the protective cover 8, and a slide plate 14 is slidably installed in the receiving groove 13, and a pressure-bearing part 15 is connected between the outer wall of the slide plate 14 and the inner wall of the receiving groove 13. The pressure-bearing part 15 is connected to the detection part 9 through an air guide tube 18, and an electromagnetic valve is fixedly installed on the air guide tube 18. The other side wall of the slide plate 14 is fixedly connected to a guide rod 16 extending to the inner cavity of the protective cover 8, and the outer end of the guide rod 16 is fixed with a scraper 17 corresponding to the mounting seat 122, and the cleaning assembly is arranged in four groups along the circumferential direction of the protective cover 8, and the distance between the two opposing groups of scrapers 17 is greater than the diameter of the mounting seat 122, and the cleaning assembly is arranged below the detection part 9, and the pressure-bearing part 15 is a pressure air bag.

[0050] After the base body 12 passes the inspection, the controller controls the electric telescopic rod 7 to continue to move downward, prompting the detection piece 9 and the mounting seat 122 to continue to be squeezed, so that the deformation of the detection piece 9 becomes larger, and the contact amount between the detection piece 9 and the outer edge of the mounting seat 122 increases. This can prevent the burr from being directed downward, causing the detection piece 9 to be unable to contact the burr, and then a detection error occurs. Therefore, as the detection piece 9 continues to move downward, when the burr or burr contacts the detection piece 9, a third deformation zone 93 is formed under the squeezing of the outer edge of the detection piece 9 and the mounting seat 122. The distribution of the burr and burr can be determined by the number of stress points 10 at the third deformation zone 93, and the length of the burr and burr can be determined by the range of the stress points 10 at the third deformation zone 93.

[0051] After determining whether the mounting seat 122 has burrs and burrs, the controller controls the solenoid valve to open, so that the gas inside the detection part 9 is introduced into the pressure-bearing part 15 through the air guide tube 18, and then the expansion of the pressure-bearing part 15 pushes the scraper 17 at the end of the guide rod 16 to move toward the mounting seat 122. When the pressure-bearing part 15 is fully expanded, the scraper 17 can be given an extrusion force on the mounting seat 122 through the guide rod 16. At this time, the controller controls the solenoid valve to close, and synchronously controls the electric telescopic rod 7 to reset, which can drive the detection part 9 to move up and out of contact with the mounting seat 122. At the same time, the controller controls the drive motor 6 to work, which can drive the turntable 5 to start rotating. Then, in the process of driving the base body 12 to rotate, the outer edge of the mounting seat 122 is scraped and cleaned by multiple sets of scrapers 17, so that the base body 12 can be trimmed in real time.

[0052] After the trimming is completed, the controller controls the solenoid valve to open, so that the gas inside the pressure-bearing part 15 will flow back to the inside of the detection part 9 through the air duct 18, and then the scraper 17 starts to reset. At the same time, the controller controls each unit to start resetting, so as to facilitate the detection of the next group of base bodies 12.

[0053] Example 3:

[0054] This embodiment provides a method for detecting a semiconductor sensor base. The method is implemented using the semiconductor sensor base detection device described above. The steps of the method are as follows:

[0055] S1: When in use, place the base body 12 on the turntable 5, and then fix it with the clamping assembly 11, and then control the electric telescopic rod 7 to extend outward, driving the protective cover 8 to be set on the base body 12:

[0056] S2: The detection part 9 first contacts the mounting seat 122 during the downward movement, so that the stress points 10 where the bottom of the detection part 9 contacts the mounting seat 122 will be subjected to pressure. As the downward movement continues, the extrusion force on the detection part 9 becomes greater and greater, thereby causing the corresponding positions of the detection part 9 and the center socket 123 and the pin socket 124 to form a first deformation zone 91 and a second deformation zone 92. That is, the range in which the stress point 10 in the first deformation zone 91 does not undergo a pressure change is the diameter size of the center socket 123. Similarly, the range in which the stress point 10 in the second deformation zone 92 does not undergo a pressure change is the diameter size of the pin socket 124. Based on the number of stress points 10 in a stress-free distribution state, it is easy to detect the sizes of the center socket 123 and the pin socket 124, thereby judging in real time whether the center socket 123 and the pin socket 124 meet the standards, directly judging whether they are defective products, and then eliminating the defective products.

[0057] S3: After the base body 12 passes the inspection, the electric telescopic rod 7 continues to move downward, causing the detection member 9 and the mounting seat 122 to continue to be squeezed. In this way, the outer edges of the detection member 9 and the mounting seat 122 are squeezed to form a third deformation zone 93. The number of stress points 10 in the third deformation zone 93 can be used to determine whether the mounting seat 122 has burrs or burrs;

[0058] S4: Then the solenoid valve is controlled to open, so that the gas inside the detection part 9 is introduced into the pressure-bearing part 15 through the air guide tube 18, and then the expansion of the pressure-bearing part 15 pushes the scraper 17 at the end of the guide rod 16 to move toward the mounting seat 122. When the pressure-bearing part 15 is fully expanded, the scraper 17 is given an extrusion force on the mounting seat 122 through the guide rod 16. At this time, the solenoid valve is controlled to close, and the electric telescopic rod 7 is synchronously controlled to reset, driving the detection part 9 to separate from the mounting seat 122. The drive motor 6 works to drive the turntable 5 to start rotating. Then, during the rotation of the base body 12, the outer edge of the mounting seat 122 is scraped and cleaned by multiple groups of scrapers 17.

[0059] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor sensor base detection device, comprising a workbench, legs fixed to the four corners of the bottom of the workbench, pillars fixed to the left and right sides of the top of the workbench, and top plates fixed to the tops of the two sets of pillars, characterized in that: A turntable is installed in the middle of the workbench, a drive motor is installed at the bottom of the turntable, an electric telescopic rod is fixed in the middle of the bottom of the top plate, and a protective cover is fixed at the output end of the electric telescopic rod. A detection piece is set at the top of the protective cover, and stress points are evenly distributed at the bottom of the detection piece. A clamping component is installed on the top of the turntable, and a base body corresponding to the clamping component is installed in the middle limit of the top of the turntable. The size of the protective cover corresponds to the base body, and the detection piece and the base body match. The stress points are connected to the controller through wires. The base body includes a bottom plate, the top of the bottom plate is integrally formed with a mounting seat, the top center of the mounting seat is provided with a central jack, and the top of the mounting seat is provided with a plurality of groups of pin jacks along the circumferential direction; the pin jacks facilitate the plug-in assembly of the semiconductor sensor pins; The test piece is a circular inflatable air bag, and the diameter of the circular inflatable air bag is larger than the diameter of the mounting base. The stress points are densely distributed at the bottom of the circular inflatable air bag, and the protective cover is set on the mounting base. The detection piece is pressed on the mounting seat to form a first deformation zone corresponding to the central insertion hole, a second deformation zone corresponding to the pin insertion hole, and a third deformation zone corresponding to the edge of the mounting seat; A cleaning assembly is installed inside the protective cover, and the cleaning assembly includes a storage groove opened inside the protective cover, a slide is slidably installed in the storage groove, a pressure-bearing part is connected between the outer wall of the slide and the inner wall of the storage groove, the pressure-bearing part is connected to the detection part through an air guide pipe, and an electromagnetic valve is fixedly installed on the air guide pipe, and the other side wall of the slide is fixedly connected to a guide rod extending to the inner cavity of the protective cover, and the outer end of the guide rod is fixed with a scraper corresponding to the mounting seat.

2. The semiconductor sensor base detection device according to claim 1, characterized in that: The driving motor is fixed to the bottom of the workbench through a supporting rod. An annular receiving groove is provided in the workbench. The turntable is rotatably assembled in the annular receiving groove through a bearing.

3. The semiconductor sensor base detection device according to claim 2, characterized in that: The clamping assembly includes a slideway opened on the top of the turntable, an electromagnet is fixed at the outer end of the slideway, an armature plate is slidably assembled at the inner end of the slideway, a support spring is connected between the electromagnet and the armature plate, and a clamping plate is fixedly connected to the slideway extending from the top of the armature plate, and the clamping plate is clamped and assembled on the outer wall of the base plate.

4. The semiconductor sensor base detection device according to claim 1, characterized in that: The cleaning components are arranged into four groups along the circumferential direction of the protective cover, and the distance between two opposing groups of scrapers is greater than the diameter of the mounting seat. The cleaning components are arranged below the detection part, and the pressure-bearing part is a pressure-bearing air bag.

5. A method for detecting a semiconductor sensor base, the method being implemented using the semiconductor sensor base detection device according to claim 4, characterized in that: The steps of the detection method are: S1: When in use, place the base body on the turntable, then fix it with the clamping assembly, and then control the electric telescopic rod to extend outward, driving the protective cover to be placed on the base body; S2: The inspection piece first contacts the mounting seat during its downward movement, so that the stress points where the bottom of the inspection piece contacts the mounting seat are all subjected to pressure. As it continues to move downward, the extrusion force on the inspection piece becomes greater and greater, thereby forming a first deformation zone and a second deformation zone at the corresponding positions of the inspection piece, the center socket, and the pin socket. That is, the range in the first deformation zone where no pressure change occurs at the stress point is the diameter size of the center socket. Similarly, the range in the second deformation zone where no pressure change occurs at the stress point is the diameter size of the pin socket. Based on the number of stress points in the stress-free distribution state, it is easy to detect the sizes of the center socket and the pin socket, thereby judging in real time whether the center socket and the pin socket meet the standards, directly judging defective products, and then eliminating the defective products. S3: After the base body passes the inspection, the electric telescopic rod continues to move downward, causing the inspection piece and the mounting seat to continue to squeeze each other. This will form a third deformation zone under the compression of the outer edges of the inspection piece and the mounting seat. The number of stress points in the third deformation zone can be used to determine whether the mounting seat has burrs or not. S4: Then the solenoid valve is controlled to open, so that the gas inside the detection part is introduced into the pressure-bearing part through the air guide tube, and then the expansion of the pressure-bearing part pushes the scraper at the end of the guide rod to move toward the mounting seat. When the pressure-bearing part is fully expanded, the guide rod gives the scraper an extrusion force on the mounting seat. At this time, the solenoid valve is controlled to close, and the electric telescopic rod is synchronously controlled to reset, driving the detection part to separate from the mounting seat. The drive motor starts to drive the turntable to start rotating. Then, during the rotation of the base body, multiple sets of scrapers are used to scrape and clean the outer edge of the mounting seat.

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