A semiconductor chip packaging base

Abstract

The present invention relates to the field of semiconductor chip technology, and specifically to a semiconductor chip packaging base, including a fixed seat and a packaging frame, wherein the top of the fixed seat is provided with a packaging frame, and the top of the packaging frame is movably provided with a protective frame. The present invention provides safety protection for semiconductor chips through the protective frame, and at the same time seals the semiconductor chips inside the packaging frame to prevent the surface of the semiconductor chips from being contaminated, thereby improving the safety of the semiconductor chips after packaging. The semiconductor chips are packaged inside the packaging frame through the packaging component, and the upper and lower surfaces of the semiconductor chips are quickly cooled by the heat dissipation component provided inside the fixed seat, thereby significantly improving the heat dissipation efficiency of the semiconductor chips after packaging. In addition, the packaging base used for the semiconductor chips in the present application can quickly realize the stable packaging of the semiconductor chips, and can also be applied to the packaging of semiconductor chips of different specifications.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, in particular to a semiconductor chip packaging base. Background Art

[0002] Semiconductor packaging is the process of packaging chips into circuit devices to form external packages for different purposes in order to achieve functions such as protection, connection, and heat dissipation. The semiconductor packaging structure is an important part of semiconductor device design and has a great impact on the performance and service life of the chip.

[0003] When packaging semiconductor chips, the commonly used packaging methods include top-to-top packaging, QFN packaging, BGA packaging and SIP packaging. Among them, the top-to-top packaging directly solders the chip to the pins of the packaging base. Since the surface of the chip is exposed, the heat dissipation effect of the chip can be greatly improved. However, the surface protection effect of the chip is poor, and the chip is easily contaminated, which reduces the safety of the chip. The QFN package is a pinless surface mount package, but the existing QFN package base is limited by the specifications and dimensions of the package base, and has a small scope of application. In addition, due to its small size, the heat dissipation efficiency of the chip after packaging is low.

[0004] To this end, we propose a semiconductor chip packaging base. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a semiconductor chip packaging base, which is used to prevent the surface of the semiconductor chip from being contaminated, improve the safety of the semiconductor chip after packaging, and effectively improve the heat dissipation efficiency of the semiconductor chip after packaging.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor chip packaging base, comprising a fixing base and a packaging frame, the fixing base is provided with a packaging frame on the top, and a protective frame is movably provided on the top of the packaging frame, a packaging component is provided inside the packaging frame, and a heat dissipation component is provided inside the fixing base;

[0007] The packaging assembly includes a packaging chassis and a limiting frame, the limiting frame is arranged on the top of the fixing seat, and the packaging chassis is slidably arranged inside the limiting frame, sliders are arranged around the packaging chassis, and one side of the slider is slidably connected to the inside of the limiting frame, a first spring is arranged inside the slider, and one end of the first spring is connected to one side of the limiting frame;

[0008] The protective frame is provided with a packaging top frame movably inside, and connecting blocks are provided around the packaging top frame, connecting frames are provided around the top of the protective frame, and four connecting blocks are respectively slidably connected to the inside of four connecting frames, connecting rods are provided around the inside of the packaging top frame, and fixing columns are provided around the top of the fixing seat, and the bottom ends of the four connecting rods are respectively connected to the internal threads of the four fixing columns;

[0009] Packaging side frames are arranged on both sides of the packaging frame, and a plurality of electrode contacts are arranged on one side of the inner walls of the two packaging side frames.

[0010] Preferably, pre-tightening plates are provided on both sides of the inner wall of the package side frame, and a third spring is provided on one side of the pre-tightening plate, and one end of the third spring is connected to one side of the inner wall of the package side frame.

[0011] Preferably, one side of the pre-tightening plate is rotatably connected to the inside of the packaging side frame, and the other side of the pre-tightening plate is slidably connected to the inside of the packaging side frame.

[0012] Preferably, an adjustment rod is provided in the middle of the packaging frame, and one end of the adjustment rod is rotatably connected to one side of the packaging side frame, and a second spring is provided at one end of the adjustment rod, and one end of the second spring is connected to one side of the packaging side frame.

[0013] Preferably, support frames are arranged around the top of the fixing seat, and the bottom of the packaging side frame is slidably connected to the top of the support frame.

[0014] Preferably, the heat dissipation component includes a heat dissipation frame, a circulation channel is arranged inside the fixing seat, a heat dissipation frame is arranged inside the circulation channel, and a plurality of heat dissipation fans are arranged inside the heat dissipation frame.

[0015] Preferably, a mounting base plate is provided at the bottom of the fixing seat, and a semiconductor cooling plate is provided at the top of the mounting base plate, wherein the cold end of the semiconductor cooling plate faces the inside of the circulation channel.

[0016] Preferably, a plurality of heat dissipation holes are disposed inside the package bottom frame and the package top frame, and a ventilation channel is also disposed inside the package top frame, and the inside of the ventilation channel is communicated with the inside of the heat dissipation holes.

[0017] Preferably, both sides of the bottom of the package top frame are provided with air guide frames, both sides of the top of the fixing seat are provided with through holes matched with the air guide frames, and the interiors of the two air guide frames are connected with the interior of the ventilation channel;

[0018] After the semiconductor chip is packaged inside the packaging frame, two air guide frames at the bottom of the packaging top frame are respectively inserted into the two through holes. At this time, the ventilation channel inside the packaging top frame is connected with the inside of the circulation channel through the air guide frame, and the heat dissipation fan inside the heat dissipation frame is used to circulate the air inside the ventilation channel and the air inside the circulation channel;

[0019] The cold end of the semiconductor refrigeration plate is used to cool the circulating air, and the cooled air dissipates heat from the upper and lower ends of the semiconductor chip. The circulating air can quickly dissipate heat from the surface of the semiconductor chip, which significantly improves the heat dissipation efficiency of the semiconductor chip.

[0020] Preferably, the method for using the semiconductor chip packaging base specifically comprises the following steps:

[0021] Step 1: Slide the protective frame from the top of the packaging frame to one side, place the semiconductor chip on the packaging frame, and then reset the protective frame on the packaging frame;

[0022] Step 2: Push the package top frame downward to make the lower end surface of the package top frame contact with the upper end surface of the semiconductor chip, and let the bottom of the package bottom frame slide into the interior of the fixing seat until the bottom of the package bottom frame contacts with the bottom of the inner wall of the fixing seat;

[0023] Step 3: Push the adjustment rod to drive the packaging side frame to approach one side of the semiconductor chip. The packaging side frames on both sides limit and clamp the two sides of the semiconductor chip. At the same time, the two pre-tightening plates inside the packaging side frame pre-tighten and limit the two sides of the semiconductor chip, so that the two sides of the semiconductor chip are respectively fitted with the electrode contacts on one side of the two packaging side frames. Finally, the four connecting rods inside the packaging top frame are threadedly connected with the four fixing columns on the top of the fixing seat to complete the packaging process of the semiconductor chip;

[0024] Step 4: When the semiconductor chip inside the packaging frame is being cooled, the cooling fan inside the cooling frame is used to circulate the air inside the ventilation channel and the air inside the circulation channel, and the cold end of the semiconductor refrigeration plate is used to cool the circulating air, so that the cooled air can cool the upper and lower ends of the semiconductor chip.

[0025] Compared with the prior art, it has the following beneficial effects:

[0026] 1. By placing the semiconductor chip inside the packaging frame, the protective frame arranged on the top of the packaging frame is used to safely protect the semiconductor chip, and the semiconductor chip inside the packaging frame is sealed to prevent the surface of the semiconductor chip from being contaminated, thereby improving the safety of the semiconductor chip after packaging. The semiconductor chip is packaged inside the packaging frame through the packaging component, and the upper and lower surfaces of the semiconductor chip are quickly cooled by the heat dissipation component arranged inside the fixing seat, which significantly improves the heat dissipation efficiency of the semiconductor chip after packaging. The packaging base used for the semiconductor chip in the present application can quickly realize the stable packaging of the semiconductor chip, and can also be applied to the packaging of semiconductor chips of different specifications.

[0027] 2. After placing the semiconductor chip on the packaging chassis, the bottom of the packaging chassis is sunk into the inside of the fixing seat. The surplus distance of the upper and lower displacement of the packaging chassis can be used to package semiconductor chips of different thicknesses. The packaging top frame, packaging frame and packaging chassis are used to provide comprehensive safety protection for the semiconductor chip to prevent the semiconductor chip from being contaminated. The coordination of the packaging chassis, packaging top frame and two packaging side frames ensures the stability of the semiconductor chip after packaging. At the same time, the two movable packaging side frames are used to allow the packaging frame to be suitable for packaging semiconductor chips of different lengths.

[0028] 3. By controlling the two air guide frames at the bottom of the package top frame to be inserted into the two through holes respectively, the ventilation flow channel inside the package top frame is connected with the inside of the circulation flow channel through the air guide frame, and the cooling fan inside the heat dissipation frame is used to circulate the air inside the ventilation flow channel and the air inside the circulation flow channel. At the same time, the cold end of the semiconductor refrigeration plate is used to cool the circulating air, and the cooled air is used to dissipate the heat from the upper and lower ends of the semiconductor chip. The circulating air can quickly dissipate the heat on the surface of the semiconductor chip, which significantly improves the heat dissipation efficiency of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of a semiconductor chip packaging base structure according to an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of a package bottom frame and a package top frame structure according to an embodiment of the present invention;

[0031] Figure 3 A schematic diagram of a fixing base and a packaging chassis structure according to an embodiment of the present invention;

[0032] Figure 4 It is a schematic diagram of the internal structure of the limit frame and the slider according to an embodiment of the present invention;

[0033] Figure 5A schematic diagram of a packaging frame and a packaging side frame structure according to an embodiment of the present invention;

[0034] Figure 6 It is a schematic diagram of a packaging side frame and a pre-tightening plate structure according to an embodiment of the present invention;

[0035] Figure 7 A schematic diagram of a protective frame and a packaging top frame structure according to an embodiment of the present invention;

[0036] Figure 8 It is a schematic diagram of the structure of the fixing base and the heat dissipation frame according to an embodiment of the present invention.

[0037] In the figure, 10, fixing seat; 20, packaging frame; 30, protective frame; 11, packaging bottom frame; 12, limiting frame; 13, slider; 14, first spring; 15, packaging top frame; 16, connecting block; 17, connecting frame; 18, connecting rod; 19, fixing column; 21, packaging side frame; 22, adjusting rod; 23, second spring; 24, supporting frame; 25, pre-tightening plate; 26, third spring; 31, heat dissipation frame; 32, circulating flow channel; 33, mounting base; 34, semiconductor refrigeration plate; 35, heat dissipation hole; 36, air guide frame; 37, through hole. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Example 1

[0040] See also Figures 1 to 8As shown, a semiconductor chip packaging base includes a fixed seat 10 and a packaging frame 20, wherein the packaging frame 20 is arranged on the top of the fixed seat 10, and a protective frame 30 is movably arranged on the top of the packaging frame 20, wherein the interior of the protective frame 30 is slidably connected to the two sides of the packaging frame 20, and one side of the protective frame 30 is provided with two movable pins, the two movable pins are controlled by elastic sheets, and the limiting connection between the protective frame 30 and the packaging frame 20 is released by pushing the two movable pins to one side; the packaging frame 20 is provided with a packaging component, and the fixed seat 10 is provided with a heat dissipation component; by placing the semiconductor chip into the packaging frame 20, the protective frame 30 is provided with a heat dissipation component on the top of the packaging frame 20. The protective frame 30 is provided to provide safety protection for the semiconductor chip, and at the same time, the semiconductor chip inside the packaging frame 20 is sealed to prevent the surface of the semiconductor chip from being contaminated, thereby improving the safety of the semiconductor chip after packaging. The semiconductor chip is packaged inside the packaging frame 20 through the packaging component, and the upper and lower surfaces of the semiconductor chip are quickly cooled by the heat dissipation component provided inside the fixing seat 10, which significantly improves the heat dissipation efficiency of the semiconductor chip after packaging. In addition, the packaging base used for the semiconductor chip in the present application can quickly realize the stable packaging of the semiconductor chip, and can also be applicable to the packaging of semiconductor chips of different specifications.

[0041] Furthermore, the packaging assembly includes a packaging base frame 11 and a limiting frame 12. The limiting frame 12 is arranged on the top of the fixed seat 10, and the packaging base frame 11 is slidingly arranged inside the limiting frame 12. Sliders 13 are arranged around the packaging base frame 11, and one side of the slide 13 is slidably connected to the inside of the limiting frame 12. A first spring 14 is arranged inside the slide 13, and one end of the first spring 14 is connected to one side of the limiting frame 12. The slide 13 cooperates with the first spring 14 to slide inside the limiting frame 12, so that the packaging base frame 11 slides up and down inside the limiting frame 12. After the semiconductor chip is placed on the packaging base frame 11, the bottom of the packaging base frame 11 is sunk into the inside of the fixed seat 10. The surplus distance of the up and down displacement of the packaging base frame 11 can be used to package and process semiconductor chips of different thicknesses.

[0042] The protective frame 30 is provided with a packaging top frame 15 in an internal movement, and the packaging top frame 15 is provided with connecting blocks 16 on all sides, and the top of the protective frame 30 is provided with connecting frames 17 on all sides, and the four connecting blocks 16 are respectively slidably connected with the inside of the four connecting frames 17, and the packaging top frame 15 is provided with connecting rods 18 on all sides, and the top of the fixing seat 10 is provided with fixing columns 19 on all sides, and the bottom ends of the four connecting rods 18 are respectively connected with the internal threads of the four fixing columns 19, wherein the fixing columns 19 are provided with internal threaded holes matching the connecting rods 18, and the surface of the connecting rods 18 is provided with external threads, so that when the semiconductor chip is packaged, the semiconductor chip is placed in the packaging top frame 15. The chip is placed into the packaging frame 20, and then the protective frame 30 is slid to the top of the packaging frame 20, and then the packaging top frame 15 is pushed downward, and the lower end surface of the packaging top frame 15 is used to contact the upper end surface of the semiconductor chip, and the upper and lower end surfaces of the semiconductor chip are clamped and limited by the packaging top frame 15 and the packaging bottom frame 11. Finally, the four connecting rods 18 inside the packaging top frame 15 are threadedly connected with the four fixing columns 19 on the top of the fixing seat 10 to achieve rapid positioning of the semiconductor chip inside the packaging frame 20, and the packaging top frame 15, the packaging frame 20 and the packaging bottom frame 11 are used to provide comprehensive safety protection for the semiconductor chip to prevent the semiconductor chip from being contaminated.

[0043] Package side frames 21 are provided on both sides of the package frame 20, and a plurality of electrode contacts are provided on one side of the inner wall of the two package side frames 21. An adjusting rod 22 is provided in the middle of the package frame 20, and one end of the adjusting rod 22 is rotatably connected to one side of the package side frame 21. A second spring 23 is provided at one end of the adjusting rod 22, and one end of the second spring 23 is connected to one side of the package side frame 21. Support frames 24 are provided around the top of the fixing seat 10, and the bottom of the package side frame 21 is slidably connected to the top of the support frame 24. An external thread is provided at one end of the adjusting rod 22 away from the second spring 23, and an internal thread hole is provided on one side of the package frame 20. When the semiconductor chip is placed on the package, the adjusting rod 22 is provided with a plurality of threaded holes. After being installed on the bottom frame 11, the semiconductor chip is pressed down by the packaging top frame 15. At this time, the packaging side frame 21 is driven to approach one side of the semiconductor chip by pushing the adjustment rod 22, and the two sides of the semiconductor chip are limited and clamped by the packaging side frames 21 on both sides, so that the two sides of the semiconductor chip are respectively fitted with the electrode contacts on one side of the two packaging side frames 21, and the packaging operation of the semiconductor chip inside the packaging frame 20 is completed. The stability of the semiconductor chip after packaging is guaranteed by the coordinated use of the packaging bottom frame 11, the packaging top frame 15 and the two packaging side frames 21. At the same time, the two movable packaging side frames 21 are used to allow the packaging frame 20 to be suitable for semiconductor chips of different length specifications for packaging processing.

[0044] Furthermore, pre-tightening plates 25 are provided on both sides of the inner wall of the packaging side frame 21, and a third spring 26 is provided on one side of the pre-tightening plate 25, one end of the third spring 26 is connected to one side of the inner wall of the packaging side frame 21, wherein one side of the pre-tightening plate 25 is rotationally connected to the inside of the packaging side frame 21, and the other side of the pre-tightening plate 25 is slidingly connected to the inside of the packaging side frame 21. After controlling the packaging side frame 21 to fit the side of the semiconductor chip, the two pre-tightening plates 25 inside the packaging side frame 21 are used to pre-tighten and limit the two sides of the semiconductor chip, thereby ensuring the stability of the semiconductor chip inside the packaging frame 20, avoiding position displacement of the semiconductor chip after packaging, and improving the position accuracy of the semiconductor chip packaged inside the packaging frame 20.

[0045] Example 2

[0046] In order to improve the heat dissipation performance of the semiconductor chip after packaging, the heat dissipation component includes a heat dissipation frame 31, a circulating flow channel 32 is arranged inside the fixed seat 10, and a heat dissipation frame 31 is arranged inside the circulating flow channel 32, and a plurality of heat dissipation fans are arranged inside the heat dissipation frame 31, and the heat dissipation fans are used to realize the air circulation flow inside the circulating flow channel 32, a mounting base plate 33 is arranged at the bottom of the fixed seat 10, and a semiconductor cooling plate 34 is arranged on the top of the mounting base plate 33, wherein the cold end of the semiconductor cooling plate 34 faces the inside of the circulating flow channel 32, a plurality of heat dissipation holes 35 are arranged inside the packaging bottom frame 11 and the packaging top frame 15, and a ventilation flow channel is also arranged inside the packaging top frame 15, and the interior of the ventilation flow channel is connected with the interior of the heat dissipation hole 35, and air guide frames 36 are arranged on both sides of the bottom of the packaging top frame 15, and the top of the fixed seat 10 is provided with a plurality of heat dissipation holes 3 ... Through holes 37 cooperating with the air guide frames 36 are provided on both sides of the part, and the interiors of the two air guide frames 36 are connected with the interior of the ventilation channel. After the semiconductor chip is packaged inside the packaging frame 20, the two air guide frames 36 at the bottom of the packaging top frame 15 are respectively inserted into the two through holes 37. At this time, the ventilation channel inside the packaging top frame 15 is connected with the interior of the circulation channel 32 through the air guide frames 36. The cooling fan inside the heat dissipation frame 31 is used to circulate the air inside the ventilation channel and the air inside the circulation channel 32. At the same time, the cold end of the semiconductor refrigeration plate 34 is used to cool the circulating air, so that the cooled air can dissipate heat from the upper and lower ends of the semiconductor chip. The circulating air can quickly dissipate the heat on the surface of the semiconductor chip, which significantly improves the heat dissipation efficiency of the semiconductor chip.

[0047] Example 3

[0048] Furthermore, this embodiment also discloses a method for using a semiconductor chip packaging base, which specifically includes the following steps:

[0049] Step 1: Slide the protection frame 30 from the top of the packaging frame 20 to one side, place the semiconductor chip on the packaging base frame 11, and then reset the protection frame 30 on the packaging frame 20;

[0050] Step 2: Push the package top frame 15 downward to make the lower end surface of the package top frame 15 contact the upper end surface of the semiconductor chip, and let the bottom of the package bottom frame 11 slide into the interior of the fixing seat 10 until the bottom of the package bottom frame 11 contacts the bottom of the inner wall of the fixing seat 10;

[0051] Step 3: Push the adjustment rod 22 to drive the packaging side frame 21 to approach one side of the semiconductor chip. The packaging side frames 21 on both sides limit and clamp the two sides of the semiconductor chip. At the same time, the two pre-tightening plates 25 inside the packaging side frames 21 pre-tighten and limit the two sides of the semiconductor chip, so that the two sides of the semiconductor chip are respectively fitted with the electrode contacts on one side of the two packaging side frames 21. Finally, the four connecting rods 18 inside the packaging top frame 15 are threadedly connected with the four fixing columns 19 on the top of the fixing seat 10 to complete the packaging process of the semiconductor chip;

[0052] Step 4: When the semiconductor chip inside the packaging frame 20 is subjected to heat dissipation, the heat dissipation fan inside the heat dissipation frame 31 is used to circulate the air inside the ventilation channel and the air inside the circulation channel 32. At the same time, the cold end of the semiconductor refrigeration plate 34 is used to cool the circulating air, so that the cooled air dissipates heat from the upper and lower ends of the semiconductor chip.

[0053] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0054] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging base, comprising a fixing base (10) and a packaging frame (20), wherein the packaging frame (20) is arranged on the top of the fixing base (10), and a protective frame (30) is movably arranged on the top of the packaging frame (20), characterized in that: A packaging component is disposed inside the packaging frame (20), and a heat dissipation component is disposed inside the fixing seat (10); The heat dissipation component comprises a heat dissipation frame (31), a circulating flow channel (32) is arranged inside the fixing seat (10), and a heat dissipation frame (31) is arranged inside the circulating flow channel (32), a plurality of heat dissipation fans are arranged inside the heat dissipation frame (31), a mounting base plate (33) is arranged at the bottom of the fixing seat (10), and a semiconductor cooling sheet (34) is arranged on the top of the mounting base plate (33), wherein the cold end of the semiconductor cooling sheet (34) faces the inside of the circulating flow channel (32); The packaging assembly comprises a packaging base frame (11) and a limiting frame (12); the limiting frame (12) is arranged on the top of the fixing seat (10), and the packaging base frame (11) is slidably arranged inside the limiting frame (12); sliders (13) are arranged around the packaging base frame (11), and one side of the slider (13) is slidably connected to the inside of the limiting frame (12); a first spring (14) is arranged inside the slider (13), and one end of the first spring (14) is connected to one side of the limiting frame (12); The protective frame (30) is provided with a packaging top frame (15) movably disposed inside, and the packaging top frame (15) is provided with connecting blocks (16) on all four sides, the top of the protective frame (30) is provided with connecting frames (17) on all four sides, and the four connecting blocks (16) are respectively slidably connected to the inside of the four connecting frames (17), the packaging top frame (15) is provided with connecting rods (18) on all four sides, the top of the fixing seat (10) is provided with fixing columns (19) on all four sides, and the bottom ends of the four connecting rods (18) are respectively connected to the internal threads of the four fixing columns (19); Packaging side frames (21) are provided on both sides of the packaging frame (20), and a plurality of electrode contacts are provided on one side of the inner wall of the two packaging side frames (21).

2. The semiconductor chip packaging base according to claim 1, characterized in that: Pre-tightening plates (25) are provided on both sides of the inner wall of the packaging side frame (21), and a third spring (26) is provided on one side of the pre-tightening plate (25), and one end of the third spring (26) is connected to one side of the inner wall of the packaging side frame (21).

3. The semiconductor chip packaging base according to claim 2, characterized in that: One side of the pre-tightening plate (25) is rotatably connected to the inside of the packaging side frame (21), and the other side of the pre-tightening plate (25) is slidably connected to the inside of the packaging side frame (21).

4. The semiconductor chip packaging base according to claim 1, characterized in that: An adjusting rod (22) is provided in the middle of the packaging frame (20), and one end of the adjusting rod (22) is rotatably connected to one side of the packaging side frame (21); a second spring (23) is provided at one end of the adjusting rod (22), and one end of the second spring (23) is connected to one side of the packaging side frame (21).

5. The semiconductor chip packaging base according to claim 1, characterized in that: Support frames (24) are arranged around the top of the fixing seat (10), and the bottom of the packaging side frame (21) is slidably connected to the top of the support frame (24).

6. The semiconductor chip packaging base according to claim 1, characterized in that: A plurality of heat dissipation holes (35) are arranged inside the packaging bottom frame (11) and the packaging top frame (15), and a ventilation channel is also arranged inside the packaging top frame (15), and the interior of the ventilation channel is connected to the interior of the heat dissipation holes (35).

7. The semiconductor chip packaging base according to claim 6, characterized in that: Air guide frames (36) are provided on both sides of the bottom of the packaging top frame (15), through holes (37) matching with the air guide frames (36) are provided on both sides of the top of the fixing seat (10), and the interiors of the two air guide frames (36) are connected to the interior of the ventilation channel.

8. The semiconductor chip packaging base according to claim 1, characterized in that: The method for using a semiconductor chip packaging base specifically comprises the following steps: Step 1: Slide the protection frame (30) from the top of the packaging frame (20) to one side, place the semiconductor chip on the packaging base frame (11), and then reset the protection frame (30) on the packaging frame (20); Step 2: Push the package top frame (15) downwards so that the lower end surface of the package top frame (15) contacts the upper end surface of the semiconductor chip, and slide the bottom of the package bottom frame (11) into the interior of the fixing seat (10) until the bottom of the package bottom frame (11) contacts the bottom of the inner wall of the fixing seat (10); Step 3: Push the adjustment rod (22) to drive the packaging side frame (21) to approach one side of the semiconductor chip. The packaging side frames (21) on both sides limit and clamp the two sides of the semiconductor chip. At the same time, the two pre-tightening plates (25) inside the packaging side frames (21) pre-tighten and limit the two sides of the semiconductor chip, so that the two sides of the semiconductor chip are respectively fitted with the electrode contacts on one side of the two packaging side frames (21). Finally, the four connecting rods (18) inside the packaging top frame (15) are threadedly connected with the four fixing columns (19) on the top of the fixing seat (10), thereby completing the packaging process of the semiconductor chip; Step 4: When the semiconductor chip inside the packaging frame (20) is subjected to heat dissipation, the heat dissipation fan inside the heat dissipation frame (31) is used to circulate the air inside the ventilation channel and the air inside the circulation channel (32), and at the same time, the cold end of the semiconductor refrigeration plate (34) is used to cool the circulating air, so that the cooled air dissipates heat from the upper and lower ends of the semiconductor chip.

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