RFID antenna and preparation method thereof

Abstract

The embodiment of the present invention discloses an RFID antenna and a method for preparing the same. The RFID antenna includes: a conductive structure, the conductive structure including a transmission portion and a binding portion; an adhesive layer, the adhesive layer having an antenna pattern; and a substrate. The transmission portion is die-cut along the contour of the antenna pattern, and at least a portion of the binding portion is die-cut along the contour of the antenna pattern. The conductive structure is used to be transferred to the substrate after die-cutting; after the conductive structure is transferred to the substrate, at least a portion of the binding portion is laser-cut. In the technical solution provided by the embodiment of the present invention, die-cutting can be used to quickly cut out most of the shape of the RFID antenna, and by transferring it to the substrate, waste from die-cutting can be conveniently eliminated. Laser cutting is used for the binding portion, which requires higher precision, to ensure cutting accuracy and consistency, reduce the risk of short circuit of the RFID antenna, and improve the reliability of the RFID antenna.

Description

Technical Field

[0001] The present invention relates to the technical field of wireless communications, and in particular to an RFID antenna and a preparation method thereof. Background Art

[0002] Radio Frequency Identification (RFID) technology, referred to as RFID technology, is an automatic identification technology in the field of wireless communications.

[0003] The transponder in an RFID system, also known as an RFID tag, consists of a chip and an antenna. With the continuous development of RFID technology for the Internet of Things (IoT), higher requirements are being placed on the performance consistency, reliability, and applicability of RFID tags. Since the antenna is a crucial component of an RFID tag, improvements are necessary in terms of its structural design, material selection, and production process.

[0004] Existing RFID antennas are prone to short circuit risks, which affects the reliability of RFID antennas and has become a technical problem that needs to be solved urgently in the industry. Summary of the Invention

[0005] The embodiments of the present invention provide an RFID antenna and a method for manufacturing the same, so as to solve the problem that the RFID antenna is prone to short circuit risk, which affects the reliability of the RFID antenna.

[0006] In order to achieve the above technical problems, the present invention adopts the following technical solutions:

[0007] An embodiment of the present invention provides an RFID antenna, comprising:

[0008] A conductive structure, comprising a transmission portion and a binding portion, wherein the transmission portion is used to receive or send wireless radio frequency signals, and the binding portion is used to bind the chip;

[0009] an adhesive layer, disposed on one side of the conductive structure, the adhesive layer having an antenna pattern;

[0010] A substrate is provided on a side of the adhesive layer away from the conductive structure; the adhesive layer is used to bond the conductive structure and the substrate;

[0011] The transmission portion is formed by die cutting along the contour of the antenna pattern, and at least a portion of the binding portion is formed by die cutting along the contour of the antenna pattern. The conductive structure is used to be transferred to the substrate after die cutting; after the conductive structure is transferred to the substrate, at least a portion of the binding portion is formed by laser cutting.

[0012] An embodiment of the present invention further provides a method for preparing an RFID antenna, comprising:

[0013] Providing a conductive layer and a carrier film, laminating one side of the conductive layer to one side of the carrier film and bonding them together through a first adhesive layer;

[0014] forming an adhesive layer on a side of the conductive layer away from the carrier film, wherein the adhesive layer has an antenna pattern;

[0015] Die-cutting the conductive layer along the outer contour of the antenna pattern to form a conductive structure; wherein the conductive structure includes a transmission portion and a binding portion, the transmission portion is used to receive or send wireless radio frequency signals, and the binding portion is used to bind the chip;

[0016] Providing a substrate, laminating the substrate with the side of the conductive layer away from the carrier film, and bonding the conductive structure to the substrate via the adhesive layer;

[0017] removing the waste material of the carrier film and the conductive layer after die cutting, and transferring the conductive structure to the substrate to form an initial antenna structure;

[0018] The binding portion of the initial antenna structure is cut by laser to form an RFID antenna.

[0019] The technical solution of the embodiment of the present invention is to bond one side of the conductive layer to the carrier film, form an adhesive layer with an antenna pattern on the other side, die-cut the conductive layer along the outer contour of the antenna pattern to form a conductive structure, and use the adhesive layer to transfer the conductive structure to the substrate, and then remove the carrier film and the waste generated by die-cutting, and then use laser cutting to form the binding part. Among them, die cutting can quickly cut out most of the shape of the RFID antenna, and it is easy to remove waste; laser cutting is used for some binding parts with higher precision requirements to ensure the accuracy and consistency of cutting. Through the above process, the processing efficiency is greatly improved while ensuring the processing accuracy of the RFID antenna. By performing laser cutting after the conductive structure is transferred to the substrate, the structure of the binding part is stable, the anti-short circuit effect is better, and the risk of short circuit of the RFID antenna is reduced, thereby improving the reliability of the RFID antenna.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0022] Figure 1 This is a schematic structural diagram of an RFID antenna provided by an embodiment of the present invention;

[0023] Figure 2 is a schematic structural diagram of a conductive structure provided by an embodiment of the present invention;

[0024] Figure 3 is a structural schematic diagram of an antenna pattern provided by an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the specific structure of a binding portion before laser cutting provided by an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the specific structure of a binding portion after laser cutting provided by an embodiment of the present invention;

[0027] Figure 6 is a schematic diagram of a marking structure provided by an embodiment of the present invention;

[0028] Figure 7 This is a flow chart of a method for preparing an RFID antenna provided by an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of a bonding process between a conductive layer and a carrier film provided by an embodiment of the present invention;

[0030] Figure 9 This is a schematic diagram of a bonding layer formation process provided by an embodiment of the present invention;

[0031] Figure 10 This is a schematic diagram of a process in which a conductive layer is laminated with a substrate after die-cutting, according to an embodiment of the present invention;

[0032] Figure 11 1 is a schematic diagram of a process of transferring a conductive structure to a substrate provided by an embodiment of the present invention;

[0033] Figure 12 This is a flow chart of another method for preparing an RFID antenna provided by an embodiment of the present invention;

[0034] Figure 13 This embodiment of the present invention provides a Figure 6 middle AA'Cross-sectional view of the direction;

[0035] Figure 14 is a schematic diagram of an adhesive layer profile provided by an embodiment of the present invention;

[0036] Figure 15 is a schematic diagram of a field of view provided by an embodiment of the present invention;

[0037] Figure 16 This is a schematic structural diagram of an embodiment of the present invention in which a second marking structure and a conductive structure are integrally arranged;

[0038] Figure 17 This is a structural diagram of a second marking structure and a conductive structure that are independently spaced apart and provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0040] Based on the above technical problems, this embodiment proposes the following solutions:

[0041] Figure 1 FIG. 1 is a schematic diagram of the structure of an RFID antenna provided by an embodiment of the present invention. Figure 1 As shown, the device includes: a conductive structure 110, the conductive structure 110 includes a transmission part 1101 and a binding part 1102, the transmission part 1101 is used to receive or send wireless radio frequency signals, and the binding part 1102 is used to bind the chip; an adhesive layer 120, which is arranged on one side of the conductive structure 110, and the adhesive layer 120 has an antenna pattern; a substrate 130, which is arranged on the side of the adhesive layer 120 away from the conductive structure 110; the adhesive layer 120 is used to bond the conductive structure 110 and the substrate 130; the transmission part 1101 is formed by die cutting along the contour of the antenna pattern, and at least part of the binding part 1102 is formed by die cutting along the contour of the antenna pattern, and the conductive structure 110 is used to be transferred to the substrate 130 after die cutting; after the conductive structure 110 is transferred to the substrate 130, at least part of the binding part 1102 is formed by laser cutting.

[0042] In the embodiments of the present invention, the RFID antenna is a key component of the RFID tag, used to receive and transmit radio frequency signals. When the RFID tag is placed near a reader, it receives the radio frequency signals emitted by the reader, which are then transmitted to the chip via the RFID antenna. The RFID antenna is typically made of a conductive material. Alternatively, aluminum foil or copper foil can be used. The shape and size of the RFID antenna can be optimized based on the application and frequency of the RFID tag.

[0043] Specifically, the conductive structure 110 can be interpreted as the conductive part that constitutes the RFID antenna, which is responsible for receiving and sending radio frequency signals to achieve wireless transmission of data. Optionally, the material of the conductive structure 110 may include aluminum foil, copper foil, aluminum alloy foil or copper alloy foil or non-metallic conductive materials, etc. The chip can be interpreted as the intelligent part of the RFID electronic tag. The chip may include a memory and a processor. When the RFID electronic tag receives a radio frequency signal from a reader, the chip reads the data from the memory or writes the data into the memory, and then sends the corresponding response signal back to the reader through the conductive structure 110. The type of chip in the RFID electronic tag may include passive, semi-active or active, and its power consumption and functional characteristics are different. They can be set as needed and are not limited here.

[0044] In the embodiment of the present invention, the antenna pattern refers to the pattern of an antenna in the RFID field, wherein the antenna pattern is adapted to the outer contour shape of the conductive structure 110 in the RFID antenna and / or the tag structure in the RFID antenna.

[0045] Figure 2 Schematic diagram of a conductive structure provided by an embodiment of the present invention. Figure 2 As shown, the conductive structure 110 includes a transmission portion 1101 and a binding portion 1102, and a through groove 11022 is provided on the binding portion 1102. The transmission portion 1101 can be interpreted as the portion of the conductive structure 110 responsible for signal transmission, which is intended to effectively transmit current or electrical signals from one place to another. The transmission portion 1101 is used to receive or send wireless radio frequency signals. The binding portion 1102 can be interpreted as the area of ​​the conductive structure 110 used to fix or connect the conductive structure 110 to other components. Optionally, the binding portion 1102 can be connected by a conductive adhesive. The binding portion 1102 is used to bind the chip. The binding portion 1102 is used to electrically connect the conductive structure 110 and the chip.

[0046] The adhesive layer 120 is disposed on one side of the conductive structure 110 , and the adhesive layer 120 has an antenna pattern.

[0047] In the embodiment of the present invention, the bonding layer 120 can be interpreted as an adhesive layer used between the conductive structure 110 of the RFID antenna and the substrate 130 or between the antenna and other components. Optionally, the bonding layer 120 can include epoxy resin, polyurethane, acrylic glue, or UV glue.

[0048] Figure 3 Schematic diagram of an antenna pattern provided by an embodiment of the present invention. Figure 3 As shown, optionally, the antenna pattern may include a preset antenna pattern 1201 and a positioning mark dot pattern 1202. The antenna pattern may be interpreted as a pre-designed and defined specific shape or pattern, wherein the preset antenna pattern 1201 is adapted to the outer contour of the conductive structure 110 in the RFID antenna, and the positioning mark dot pattern 1202 is adapted to the outer contour of the tag structure in the RFID antenna. It should be understood that Figure 3 The antenna pattern shown refers to the shape of the adhesive layer 120 before the binding portion 1102 is laser processed. When the binding portion 1102 is laser processed, the depth of the laser cutting may overlap the thickness of the adhesive layer 120, causing the adhesive layer 120 to be partially cut. Therefore, in the finished structure of the RFID antenna, the actual shape of the adhesive layer 120 may not be exactly the same as the antenna pattern. Similarly, the preset antenna pattern 1201 and the positioning mark dot pattern 1202 in the antenna pattern are adapted to the overall outer contour shape of the conductive structure 110 and the marking structure before laser processing, rather than completely coinciding with the projected horizontal plane shape of the conductive structure 110 and the marking structure in the finished RFID antenna.

[0049] The substrate 130 is disposed on a side of the adhesive layer 120 away from the conductive structure 110 . The adhesive layer 120 is used to bond the conductive structure 110 and the substrate 130 .

[0050] In the embodiments of the present invention, substrate 130 can be interpreted as the primary material serving as the supporting structure of the RFID antenna. Optionally, the material of substrate 130 may include PET polyester film, PVC film, PI film, polyamide film, coated paper, thermal paper, or cellulose film. The selection of substrate 130 can be determined based on application requirements, budget, and manufacturing process. Substrate 130 and conductive structure 110 are bonded together via adhesive layer 120, providing support and protection for the RFID antenna. Because conductive structure 110 is first processed and then transferred to substrate 130 via adhesive layer 120, process variables during substrate 130 processing are reduced, allowing for flexible material selection for substrate 130, not limited to high-temperature-resistant or corrosion-resistant materials. Using a die-cutting process for conductive structure 110 reduces the difficulty of die-cutting and lowers requirements for thickness uniformity, material hardness, and other aspects of substrate 130, further expanding the range of substrate 130 options. In addition, since the conductive structure 110 is transferred to the substrate 130 after die-cutting, the surface of the substrate 130 is neater without cutting scratches or other damage, thereby improving the reliability and aesthetics of the substrate 130 to meet the needs of different users.

[0051] In the field of RFID antennas, the integration of chip and RFID antenna is called inlay, also called RFID transponder, which is the core part of RFID electronic tags. Inlay is a pre-assembled unit containing RFID chip and RFID antenna. Substrate 130 is the main carrier of inlay, which plays a supporting and fixing role. During the manufacturing process of RFID electronic tags, the chip and RFID antenna are usually bonded to the substrate 130. At the same time, the chip and RFID antenna are connected by sticky conductive material and fixed directly above the antenna pad. This structure forms the inlay, and then the packaging layer or printable surface material is added. On the other hand, the transmission part 1101 of the inlay is simplified, the part that plays the role of signal amplification is removed, and only the closed loop in the middle is retained. Such a structure is called an RFID chip module or loop. The loop can be read at close range and is used in some special application scenarios.

[0052] Printable facestock is the outermost layer of an RFID tag. It can be printed or labeled, allowing the tag to carry product information, icons, or trademarks. Printable facestock can be paper or plastic, and can be white or transparent to meet diverse design and application requirements.

[0053] The backing paper is a material used to protect the chip and RFID antenna when the RFID tag is not in use. The chip and RFID antenna are wrapped between the backing paper and the printable surface material. The backing paper can be made of release paper. If the backing paper is release paper, its inner side is coated with silicone oil to facilitate the label to be peeled off and attached to the surface of the object to be labeled. The silicone oil side of the release paper contacts the chip and antenna, providing protection and support. The other side of the release paper is usually made of paper or plastic, which can facilitate the release of the RFID tag during the terminal application process. When the RFID tag needs to be actually used, the manufacturer can easily tear off the release paper and attach the RFID tag to the final product.

[0054] Among them, the transmission part 1101 is formed by die cutting along the contour of the antenna pattern, and at least part of the binding part 1102 is formed by die cutting along the contour of the antenna pattern. The conductive structure 110 is used to be transferred to the substrate 130 after die cutting; after the conductive structure 110 is transferred to the substrate 130, at least part of the binding part 1102 is formed by laser cutting.

[0055] In embodiments of the present invention, die cutting can be defined as a method of cutting a material using a die cutter. The shape of the die cutter is impressed onto the material using high pressure, allowing for rapid and precise cutting to the desired shape and size. Furthermore, in one embodiment of the present invention, the die cutter is rotary, and the die cutting process employed can be a roller die cutting process. Laser cutting can be defined as a method of cutting a material using a laser beam, which uses a high-energy-density laser beam to locally heat the material until it melts or vaporizes, thereby achieving cutting.

[0056] The overall RFID antenna processing process adopts a combination of die cutting and laser cutting. The overall outline of the RFID antenna is completed by die cutting, and after being transferred to the substrate 130, the through groove 11022 is cut out by laser. This is because die cutting can meet the cutting accuracy requirements of the contour part of the RFID antenna. However, when the binding part 1102 used for the chip patch on the RFID antenna is short-circuited, the cutting accuracy requirements are higher, which cannot be met by die cutting. The binding part 1102 is cut by laser cutting with higher cutting accuracy. It should be understood here that the completion of the overall outline of the antenna by die cutting is not limited to the entire process of the overall outline being processed by die cutting only, and can also include first cutting out the general outline by die cutting, and then using laser or other methods to remove burrs on the edge of the die-cut antenna outline.

[0057] Among them, the essence of the anti-short circuit treatment of the chip patch area on the RFID antenna is to perform anti-short circuit cutting at the binding part 1102 to form a through groove 11022 to prevent the RFID antenna from causing the chip to short-circuit after the binding part 1102 is bound to the chip.

[0058] By performing laser cutting after the conductive structure 110 is transferred to the substrate 130, deformation of the binding portion 1102, which can occur when laser cutting is performed before transfer to the substrate 130, can be effectively avoided. Because the anti-short-circuit structure of the laser-cut binding portion 1102, namely the through-groove 11022, is relatively narrow, it is prone to deformation during the transfer process, which can lead to the risk of short circuits on both sides of the anti-short-circuit structure of the binding portion 1102. By performing laser cutting after the conductive structure 110 is transferred to the substrate 130, this embodiment stabilizes the structure of the binding portion 1102 and provides better short-circuit protection, thereby improving the reliability of the RFID antenna.

[0059] The RFID antenna provided in this embodiment is formed by bonding one side of the conductive layer to a carrier film, forming an adhesive layer 120 with an antenna pattern on the other side, and die-cutting the conductive layer along the outer contour of the antenna pattern to form a conductive structure 110. The conductive structure 110 is then transferred to the substrate 130 using the adhesive layer 120, the carrier film and the waste generated by die-cutting are removed, and then the binding part 1102 is cut by laser to form the RFID antenna. Among them, die-cutting can quickly cut out most of the shape of the RFID antenna, and waste removal is easy. Laser cutting is used for the binding part 1102, which requires higher precision, to ensure the accuracy and consistency of cutting. Through the above process, the processing efficiency is greatly improved while ensuring the processing accuracy of the RFID antenna. By performing laser cutting after the conductive structure 110 is transferred to the substrate 130, the structure of the binding part 1102 is stable, the anti-short circuit effect is better, and the risk of short circuit of the RFID antenna is reduced, thereby improving the reliability of the RFID antenna.

[0060] Based on the above embodiments, Figure 4 This is a schematic diagram of the specific structure of a binding portion before laser cutting provided by an embodiment of the present invention. Figure 4 As shown, the binding portion 1102 may include at least two pads 11021 for bonding the chip; the pads 11021 are formed by die cutting before the conductive structure 110 is transferred to the substrate 130. It is understood that before the binding portion 1102 is laser cut to form the anti-short circuit structure, the two pads 11021 are connected as one.

[0061] In this embodiment of the present invention, solder pads 11021 may be interpreted as metal areas used to connect to the chip, providing electrical contact and mechanical fixation. These pads are typically connected to the chip pins via soldering. The number of solder pads 11021 is determined by the required pins in the chip design. RFID antenna chips are designed with at least two pins for electrical connection. Die cutting is used to cut solder pads 11021 because it can achieve the required precision.

[0062] Figure 5 This is a schematic diagram of the specific structure of a binding portion after laser cutting provided by an embodiment of the present invention. Figure 5 As shown, the through-groove 11022 is disposed between two adjacent pads 11021 . The through-groove 11022 is formed by laser cutting after the conductive structure 110 is transferred to the substrate 130 .

[0063] The orthographic projection of the chip on substrate 130 is configured to at least partially cover the orthographic projection of through-slot 11022 on substrate 130. In embodiments of the present invention, an orthographic projection can be interpreted as the projection of an object on a specific plane and can be used to describe the positional relationship between the chip and through-slot 11022 on the surface of substrate 130. Having the orthographic projection of the chip on substrate 130 at least partially cover the orthographic projection of through-slot 11022 on substrate 130 ensures effective connection between the chip and pads 11021 on both sides of through-slot 11022, thereby optimizing the signal transmission path.

[0064] By performing laser cutting after the conductive structure 110 is transferred to the substrate 130, the embodiment of the present invention can effectively avoid deformation of the through-slot 11022, which can occur when laser cutting is performed before transfer to the substrate 130. Due to the narrow width of the through-slot 11022, deformation can easily occur during the transfer process, leading to the risk of short circuits on both sides of the through-slot 11022 of the binding portion 1102. By performing laser cutting to form the through-slot 11022 after the conductive structure 110 is transferred to the substrate 130, the embodiment of the present invention ensures a stable structure of the through-slot 11022, effectively preventing short circuits and thus improving the reliability of the RFID antenna.

[0065] Optionally, the antenna pattern includes a preset antenna pattern 1201; the transmission portion 1101 is formed by die-cutting along the contour of the preset antenna pattern 1201 before the conductive structure 110 is transferred to the substrate 130; the solder pad 11021 is formed by die-cutting along the contour of the preset antenna pattern 1201 before the conductive structure 110 is transferred to the substrate 130; the through groove 11022 is formed by laser cutting after the conductive structure 110 is transferred to the substrate 130; the orthographic projection of the conductive structure 110 on the substrate 130 completely covers the orthographic projection of the preset antenna pattern 1201 of the adhesive layer 120 on the substrate 130.

[0066] In the embodiment of the present invention, the preset antenna pattern 1201 can be interpreted as an antenna structure of a specific shape and layout that is pre-defined and designed in RFID antenna design, usually including a coil, a radiating element and other geometric structures to optimize radio frequency performance.

[0067] Before the RFID antenna is transferred to the substrate 130, the transmission part 1101 and the pad 11021 are completed by die cutting. This is because the contours of the transmission part 1101 and the pad 11021 do not require high precision, the accuracy of die cutting can be met, and the die cutting speed is fast, which can achieve mass production and ensure the consistency of each pad 11021 and transmission part 1101, thereby reducing performance fluctuations caused by cutting errors.

[0068] Laser cutting is performed after the RFID antenna is transferred to the substrate 130. This is because the width of the through-slot 11022 is extremely small. If the cutting process is performed before the transfer, the gap spacing is likely to change during the transfer process due to reasons such as metal foil stretching and warping, resulting in large errors. Therefore, laser cutting can only occur after the antenna is transferred to the substrate 130.

[0069] Figure 6 is a schematic diagram of a marking structure provided by an embodiment of the present invention. Figure 6 As shown, the RFID antenna further includes: at least one marking structure, and the antenna pattern of the adhesive layer 120 also includes a preset marking pattern; the marking structure is formed by die-cutting along the outline of the preset marking pattern before the conductive structure 110 is transferred to the substrate 130; the marking structure and the conductive structure 110 are arranged in the same layer; at least one marking structure at least partially overlaps with the conductive structure 110, or at least one marking structure is completely staggered with the conductive structure 110.

[0070] In the embodiments of the present invention, a marking structure can be interpreted as a specific graphic or symbol designed on an RFID antenna or tag. The marking structure provides a positioning reference during the manufacturing of RFID antennas and transponders, ensuring precise alignment of the components. A pre-set marking pattern can be interpreted as the specific shape and style of the marking structure determined during the design phase. This pre-set design helps ensure consistency in appearance and functionality across all RFID antennas.

[0071] Before transferring the conductive structure 110 to the substrate 130, the marking structure is formed by die-cutting along the outline of the pre-defined marking pattern on the adhesive layer 120. Placing the marking structure on the same layer as the conductive structure 110 reduces steps in the production process, simplifies the manufacturing process, and ensures the accuracy and consistency of the relative positioning of the two. Furthermore, since the marking structure and the conductive structure 110 are located on the same layer, the marking can be directly used to position the conductive structure 110, ensuring accurate alignment between the two.

[0072] Overlapping the marking structure with the conductive structure 110 allows for a closer distance between them, saving layout space and making them more suitable for laser cutting and positioning lenses with a small field of view. Completely staggering the marking structure with the conductive structure 110 allows for their independence, preventing interference from the marking structure and facilitating future maintenance and expansion.

[0073] Optional, such as Figure 6 As shown, the marking structure includes a first marking structure 12021 and a second marking structure 12022; the first marking structure 12021 is used as a positioning reference when the RFID antenna is fed; the second marking structure 12022 is used as a positioning reference when the through groove 11022 of the binding part 1102 is laser cut, and as a positioning reference when the chip is bound to the binding part 1102; the distance between the first marking structure 12021 and the transmission part 1101 is greater than or equal to the first preset distance; the distance between the second marking structure 12022 and the binding part 1102 is less than or equal to the second preset distance; the first preset distance is greater than or equal to the second preset distance.

[0074] In the embodiment of the present invention, the first marking structure 12021 can be interpreted as a marking structure used in the manufacturing and application process of the RFID antenna. Figure 6 As shown, during the actual production and chip binding process, RFID antennas are placed on a carrier tape in a plurality of parallel arrays. The carrier tape needs to be continuously moved so that the individual antennas placed thereon can enter the designated processing position or binding position. The above process can be understood as the feeding of RFID antennas. During the actual production and binding process, the processing position and binding position of the RFID antenna are usually fixed and unique. Therefore, it is necessary to use a photoelectric sensor to identify the marking structure corresponding to the individual RFID antenna, so as to determine the position of the individual RFID antenna during the feeding of the RFID antenna. Therefore, the first marking structure 12021 is specifically used as a positioning reference for the photoelectric sensor to determine the processing position of the individual RFID antenna during the laser processing feeding of the RFID antenna, and is used as a positioning reference for the photoelectric sensor to determine the binding position of the individual RFID antenna during the chip binding feeding of the RFID antenna, thereby ensuring that during the laser cutting and chip binding process, the RFID antenna can enter the laser processing position and the chip binding position in the correct timing.

[0075] The second marking structure 12022 can be interpreted as another marking element outside the first marking structure 12021. Specifically, the RFID antenna needs to use a visual sensor to determine the specific cutting position and binding position during laser cutting processing and chip binding. Among them, the second marking structure 12022 is used as a positioning reference for the visual sensor to determine the cutting position when the through groove 11022 of the binding part 1102 is laser cut, and is used as a positioning reference for the visual sensor to determine the binding position when the chip is bound to the binding part 1102. That is, the second marking structure 12022 enables the RFID antenna to effectively guide the cutting position and reduce errors during the laser cutting process, and ensure that the chip can be accurately placed in the predetermined position during the chip binding process.

[0076] In other words, both the first marking structure 12021 and the second marking structure 12022 are used throughout the entire RFID antenna production process and during the subsequent chip bonding phase. The first marking structure 12021 primarily ensures the accuracy of the processing and bonding positions of the conductive structure 110 during material routing. The second marking structure 12022 primarily ensures that the laser can accurately cut the through-grooves 11022 at the designated locations on the bonding portion 1102, and that the chip can be accurately and reliably attached to the bonding portion 1102.

[0077] The first preset distance can be interpreted as the pre-set distance between the first marking structure 12021 and the transmission unit 1101, which is used to ensure sufficient space between the two for processing or movement. The second preset distance can be interpreted as the set distance between the second marking structure 12022 and the binding unit 1102, which is used to ensure that other operations are not interfered with or hindered during the chip binding process.

[0078] First marking structure 12021 must be spaced at least a first predetermined distance from transmission unit 1101 to ensure adequate clearance for the RFID antenna during die-cutting and transmission, preventing interference and errors. Second marking structure 12022 must be spaced less than or equal to a second predetermined distance from binding unit 1102 to ensure the marking structure provides necessary positioning support during chip binding without impacting the operation of other components.

[0079] Since the field of view angle of laser cutting is relatively small, while the field of view angle of die cutting is relatively large, the second preset distance is set to be less than or equal to the first preset distance. This arrangement, on the one hand, ensures that no interference occurs during operation, as the size of the chip is much smaller than the size of other components of the transmission unit 1101 and the binding unit 1102, thereby enabling accurate positioning and binding. On the other hand, it facilitates positioning the second marking structure 12022 within the field of view angle of the laser cutting during laser cutting and when the chip is bound to the pad 11021 of the binding unit 1102, thereby improving the accuracy of the laser cutting and thereby improving the reliability of the RFID antenna.

[0080] Figure 7 This is a flow chart of a method for preparing an RFID antenna provided by an embodiment of the present invention. Figure 7 As shown, optionally, based on the above embodiments, the method for preparing the RFID antenna includes:

[0081] S210 , providing a conductive layer 140 and a carrier film 160 , laminating one side of the conductive layer 140 to one side of the carrier film 160 and bonding them together through a first adhesive layer 150 .

[0082] Figure 8 FIG. 1 is a schematic diagram of a bonding process of a conductive layer and a carrier film provided by an embodiment of the present invention. Figure 8 As shown, in this embodiment of the present invention, conductive layer 140 can be interpreted as the portion of the RFID antenna responsible for signal transmission and reception, and is typically made of a conductive material. Alternatively, conductive layer 140 can be aluminum foil, copper foil, aluminum alloy foil, or copper alloy foil. Carrier film 160 can be interpreted as the material used to support and protect conductive layer 140 of the RFID antenna. Alternatively, carrier film 160 can be a PET plastic film. First adhesive layer 150 can be interpreted as the first layer of adhesive used to bond conductive layer 140 to carrier film 160.

[0083] A conductive layer 140 and a carrier film 160 are provided. One side of the carrier film 160 is a self-adhesive film with adhesive properties. The aluminum foil is directly laminated to the adhesive side of the carrier film 160. In this case, the first adhesive layer 150 is the adhesive layer on the carrier film 160. Optionally, the conductive layer 140 may comprise metal foil or a non-metallic material, and the carrier film 160 may comprise a plastic material.

[0084] S220 , forming an adhesive layer 120 on a side of the conductive layer 140 away from the carrier film 160 , wherein the adhesive layer 120 has an antenna pattern.

[0085] Specifically, Figure 9 FIG. 1 is a schematic diagram of a bonding layer forming process provided by an embodiment of the present invention. Figure 9As shown, in this embodiment of the present invention, an adhesive layer 120 having an antenna pattern is formed on the side of the conductive layer 140 away from the carrier film 160. The adhesive layer 120 facilitates the subsequent transfer of the conductive structure 110 to the substrate 130 and provides a contour for subsequent die cutting.

[0086] S230, die-cut the conductive layer 140 along the outer contour of the antenna pattern to form a conductive structure 110; wherein the conductive structure 110 includes a transmission part 1101 and a binding part 1102, the transmission part 1101 is used to receive or send wireless radio frequency signals, and the binding part 1102 is used to bind the chip.

[0087] Specifically, the antenna pattern is bonded to the conductive layer 140 with an adhesive. The adhesive layer 120 and the conductive layer 140 have different reflectivities, which can be utilized for die-cutting and positioning. The conductive layer 140 can be made of a metal foil that is die-cut along the outer contour of the antenna pattern.

[0088] S240 , providing a substrate 130 , laminating the substrate 130 with a side of the conductive layer 140 away from the carrier film 160 , and bonding the conductive structure 110 to the substrate 130 via the adhesive layer 120 .

[0089] Specifically, Figure 10 This is a schematic diagram of a process in which a conductive layer is laminated with a substrate after die-cutting according to an embodiment of the present invention. Figure 10 As shown, in this embodiment of the present invention, after the conductive layer 140 is die-cut along the antenna pattern of the adhesive layer 120, the conductive layer 140 is laminated with the substrate 130. At this point, the conductive structure 110 is sandwiched between the substrate 130 and the carrier film 160, and one side of the conductive structure is bonded to the surface of the substrate 130 via the adhesive layer 120. The adhesive layer 120 can be made of UV-curable adhesive, which is partially applied to the conductive layer 140. The adhesive pattern can include a preset antenna pattern 1201 and at least one preset marking pattern. The preset marking pattern can serve as a positioning reference point during die-cutting.

[0090] S250 , the carrier film 160 and the conductive layer 140 are removed by die-cutting waste, and the conductive structure 110 is transferred to the substrate 130 to form an initial antenna structure.

[0091] Specifically, Figure 11 FIG. 1 is a schematic diagram of a process of transferring a conductive structure to a substrate provided by an embodiment of the present invention. Figure 11As shown, in this embodiment of the present invention, when removing the carrier film 160, because the first adhesive layer 150 is fully applied and the adhesive layer 120 is only partially applied, the waste material of the conductive layer 140 only adheres to the carrier film 160 on one side, and the other side does not adhere to the substrate 130. Therefore, when the carrier film 160 is removed, the carrier film 160 will carry away the waste material of the conductive layer 140. Furthermore, because the conductive structure 110 was previously firmly bonded to the surface of the substrate 130 by the adhesive layer 120, when the carrier film 160 is removed and the waste material of the conductive layer 140 is carried away, the conductive structure 110 will be retained on the surface of the substrate 130. In other words, the entire process results in the conductive structure 110 being transferred to the substrate 130. S1 represents the removal and flipping of the carrier film 160.

[0092] S260 , cutting the binding portion 1102 of the initial antenna structure by laser to form an RFID antenna.

[0093] In this embodiment of the present invention, a binding portion 1102 is provided on the conductive layer 140 for bonding the chip. The conductive layer 140 is cut in the center of the chip attachment area to prevent short circuits after chip bonding. Due to the small size of the chip, the gap in the short-circuit prevention cutout of the conductive layer 140 is very narrow, so laser cutting can meet the size requirements.

[0094] The method for preparing the RFID antenna provided in this embodiment is to bond one side of the conductive layer 140 to the carrier film 160, form an adhesive layer 120 with an antenna pattern on the other side, die-cut the conductive layer 140 along the outer contour of the antenna pattern to form a conductive structure 110, and use the adhesive layer 120 to transfer the conductive structure 110 to the substrate 130. The carrier film 160 and the waste generated by the die-cutting are then removed, and the binding portion 1102 of the initial antenna is then laser-cut to form the RFID antenna. Die-cutting can quickly cut out most of the shape of the RFID antenna and is easy to remove waste. Laser cutting can ensure the accuracy and consistency of the cutting of the binding portion 1102, which requires higher precision. Through the above process, the processing efficiency is greatly improved while ensuring the processing accuracy of the RFID antenna.

[0095] Optional, Figure 12 This is a flow chart of another method for preparing an RFID antenna provided by an embodiment of the present invention. Figure 12 As shown, based on the above embodiments, the preparation method of the RFID antenna includes:

[0096] S310 , providing a conductive layer 140 and a carrier film 160 , laminating one side of the conductive layer 140 to one side of the carrier film 160 and bonding them together through a first adhesive layer 150 .

[0097] S320 , forming an adhesive layer 120 on a side of the conductive layer 140 away from the carrier film 160 , wherein the adhesive layer 120 has an antenna pattern.

[0098] S330, the antenna pattern includes a preset antenna pattern 1201 and at least one preset marking pattern; using the preset marking pattern as a reference, the conductive layer 140 is die-cut along the outer contour of the preset antenna pattern 1201 to form a conductive structure 110 and a marking structure.

[0099] In this embodiment of the present invention, the preset antenna pattern 1201 can be interpreted as a specific shape or pattern of a pre-designed or defined antenna, and the preset marking pattern can be interpreted as a pre-designed or defined marking point pattern. The preset antenna pattern 1201 is adapted to the shape of the conductive layer 140 in the finished RFID antenna, and the preset marking pattern is adapted to the shape of the metal marking point in the finished RFID antenna.

[0100] The conductive structure 110 and the tag structure are cut simultaneously because, during the design phase, they are typically considered as a single entity. Through appropriate layout and antenna patterning, both can be processed simultaneously during the same die-cutting process. Simultaneous cutting of the conductive structure 110 and the tag structure reduces subsequent processing steps and improves production efficiency. The conductive structure 110 and the tag structure can be separate or partially overlapped. This means that the conductive layer 140 and the metal tag in the finished RFID antenna can be provided independently or integrated.

[0101] Optionally, based on the above embodiment, continue to refer to Figure 6 The antenna pattern includes a first preset marking pattern and a second preset marking pattern; the preset marking pattern is used as a reference, and the conductive layer 140 is die-cut along the outer contour of the preset antenna pattern 1201 to form a conductive structure 110 and a marking structure, including: taking the first preset marking pattern as a reference, and the conductive layer 140 is die-cut along the outer contour of the preset antenna pattern 1201 to form the conductive structure 110, the first marking structure 12021 and the second marking structure 12022; wherein, the first marking structure 12021 is connected to or spaced apart from the transmission part 1101 of the conductive structure 110, and the second marking structure 12022 is connected to or spaced apart from the binding part 1102 of the conductive structure 110; the distance between the first marking structure 12021 and the transmission part 1101 is greater than or equal to the distance between the second marking structure 12022 and the binding part 1102; the area of ​​the first marking structure 12021 is greater than or equal to the area of ​​the second marking structure 12022.

[0102] In this embodiment of the present invention, the first predetermined marking pattern can be interpreted as a reference for the RFID antenna during the die-cutting process, ensuring that the die-cut pattern is consistent with the overall design. The second predetermined marking pattern can be interpreted as a reference for the RFID antenna during the laser cutting process, ensuring that the laser-cut pattern is consistent with the overall design.

[0103] The first preset mark pattern is used as a reference because the conductive layer 140 and the adhesive layer 120 have different refractive indices for light. This characteristic can be utilized to use a coaxial laser sensor or a coaxial light source with vision to identify the outline of the first preset mark pattern and then perform die-cutting.

[0104] Figure 13 This embodiment of the present invention provides a Figure 6 middle AA' Specifically, Figure 13 As shown, after die-cutting, conductive layer 140 includes conductive structure 110, first marking structure 12021, and second marking structure 12022. Adhesive layer 120 exists between conductive structure 110, first marking structure 12021, second marking structure 12022, and substrate 130. Using the first predetermined marking pattern as a visual reference point, the glue of adhesive layer 120 is printed on a metal foil. The metal foil is specularly reflective, while the glue is partially diffusely reflective. Given the different reflectivities, a coaxial laser sensor or coaxial light source combined with a vision system can identify the glue markings on the metal foil, eliminating the need for additional coloring of the glue.

[0105] Figure 14 is a schematic diagram of the adhesive layer outline provided by an embodiment of the present invention. Figure 14 As shown, the actual die-cutting path should be slightly larger than the outer contour of the specific pattern of the adhesive layer 120. The projected area of ​​the conductive structure 110, the first marking structure 12021 and the second marking structure 12022 finally cut out in the horizontal plane direction should be slightly larger than the antenna pattern area of ​​the adhesive layer 120. The advantage of doing this is to avoid the glue layer of the adhesive layer 120 being exposed outside the conductive layer 140, thereby affecting the winding of the RFID antenna product.

[0106] S340, bonding the conductive structure 110, the first marking structure 12021 and the second marking structure 12022 to the substrate 130 through the adhesive layer 120; wherein the orthographic projections of the conductive structure 110, the first marking structure 12021 and the second marking structure 12022 on the substrate 130 completely cover the orthographic projection of the adhesive layer 120 on the substrate 130.

[0107] In an embodiment of the present invention, the conductive structure 110, first marking structure 12021, and second marking structure 12022 are placed on the same layer. These structures are then bonded together to the substrate 130 and ultimately transferred to the substrate 130, reducing the number of steps and improving efficiency. The orthographic projections of the conductive structure 110, first marking structure 12021, and second marking structure 12022 on the substrate 130 completely cover the orthographic projection of the adhesive layer 120 on the substrate 130. This ensures that the horizontal projections of the conductive structure 110, first marking structure 12021, and second marking structure 12022, when finally cut out, are slightly larger than the areas of the antenna pattern and positioning mark pattern on the adhesive layer 120. This prevents the adhesive layer from being exposed outside the metal layer, which could affect the reeling of the RFID antenna product.

[0108] S350 , removing the carrier film 160 and the conductive layer 140 by die-cutting waste to form an initial antenna structure.

[0109] S360 , using the second marking structure 12022 as a reference, laser cut the binding portion 1102 of the initial antenna structure to form a through slot 11022 and solder pads 11021 located on both sides of the through slot 11022 .

[0110] In an embodiment of the present invention, the through-groove 11022 can be interpreted as a groove-shaped structure provided between the pads 11021, and its main function is to prevent the conductive structure 110 from short-circuiting. The essence of the anti-short-circuit treatment of the chip patch area on the RFID antenna is to cut a through-groove 11022 at the binding portion 1102 to prevent the RFID antenna from short-circuiting. Since the size of the chip is very small, the through-groove 11022 of the anti-short-circuit cut-off treatment of the conductive structure 110 is very narrow. The through-groove 11022 is theoretically smaller than the spacing between the chip pins, and the width of the through-groove 11022 should be less than or equal to 0.25 mm. With the subsequent miniaturization of chips, the through-groove 11022 will become narrower and narrower. The laser cutting process can achieve more precise cutting to ensure that the shape and size of the through-groove 11022 meet the design requirements.

[0111] The second marking structure 12022 serves as a reference to ensure the precise relative positioning of components during the cutting process. Laser cutting technology is used to achieve high-precision cutting. Pads 11021 are used for connecting the chip. Through-slots 11022 reduce signal interference and improve RFID antenna performance. The chip's orthographic projection partially covers through-slots 11022, ensuring electrical connection between the chip and antenna. Furthermore, a rational layout allows for more efficient use of design space and facilitates better functional integration.

[0112] Furthermore, laser cutting can only be performed after the RFID antenna is transferred to substrate 130. This is because through-slots 11022 are very small. If cutting is performed before transfer, the spacing between through-slots 11022 may shift during the transfer process due to factors such as metal foil stretching and warping, increasing errors. Therefore, laser cutting can only be performed after the RFID antenna is transferred to substrate 130.

[0113] Specifically, the second mark structure 12022 is positioned very close to the through-groove 11022 on the conductive structure 110 for short-circuit prevention. For example, the conductive structure 110 is cut off for short-circuit prevention within a 4x6mm area around the second mark structure 12022. This ensures that the second mark structure 12022 and the chip-bonding area are both within the 4x6mm field of view of the visual camera. This way, the second mark structure 12022 serves as a visual reference point not only for laser cutting but also for subsequent chip bonding.

[0114] Furthermore, if the size of the second mark structure 12022 is too large, resulting in the second mark structure 12022 being unable to be located together with the chip binding area within the field of view of the visual camera, the second mark structure 12022 can be cross-cut using a laser to reconstruct the mark structure, thereby converting the original oversized regional mark structure (which can be a square or circular mark structure) into a cross mark structure to ensure that the center point after the cross cutting is located within the field of view of the positioning camera.

[0115] Figure 15 Schematic diagram of a field of view provided by an embodiment of the present invention. Figure 15 As shown in the figure, the field of view (FOV), also known as the field angle of view, refers to the angular range within which a camera can capture an image within an imaging scene. It is also often referred to as the field of view. FOV can be quantified from three perspectives: horizontal, vertical, and diagonal. b1 is the FOV determined by the diameter of the visible range, P1 is the FOV of the lens, and a1 is the diameter of the lens' visible range. b2 is the FOV determined by the length of the imaging format, P2 is the FOV of the lens, and a2 is the diameter of the lens' visible range.

[0116] Figure 16 This is a structural diagram of an embodiment of the present invention in which a second marking structure and a conductive structure are integrally arranged. Figure 17 1 is a schematic diagram of a structure in which a second marking structure and a conductive structure are independently spaced apart and arranged in an embodiment of the present invention. Figure 16 and Figure 17As shown, the second marking structure 12022 pattern form, number, and distribution position can be in a variety of ways; it can be set as a whole with the conductive structure 110, or it can be set separately and spaced apart from the conductive structure 110. Among them, the second marking structure 12022 can be set as a whole with the conductive structure 110 in a variety of ways, such as Figure 16 As shown, it can be A: the second marking structure 12022 is located above the conductive structure 110 , it can be B: the second marking structure 12022 is located below the conductive structure 110 , or it can be C: the second marking structure 12022 is located on both sides of the conductive structure 110 .

[0117] S370 , using the second marking structure 12022 as a reference, bind a chip to the pad 11021 of the binding portion 1102 to form an RFID transponder; wherein the orthographic projection of the chip on the substrate 130 at least partially covers the orthographic projection of the through-groove 11022 on the substrate 130 .

[0118] In this embodiment of the present invention, the second marking structure 12022 is used as a reference to ensure the relative position of each component during the binding process. By binding the chip to the pad 11021, the electrical contact between the chip and the RFID antenna is ensured, ensuring the stability and reliability of signal transmission.

[0119] Optionally, the peeling force between the carrier film 160 and the conductive layer 140 is smaller than the peeling force between the substrate 130 and the conductive layer 140 .

[0120] In an embodiment of the present invention, after the conductive layer 140 is compounded with the substrate 130, although both sides of the conductive layer 140 are respectively bonded to the carrier film 160 and the substrate 130, the bonding relationship between the conductive layer 140 and the substrate 130 is stronger, that is, the peeling force between the carrier film 160 and the conductive layer 140 is smaller than the peeling force between the substrate 130 and the conductive layer 140. Therefore, when the carrier film 160 is removed, the conductive structure 110 on the conductive layer 140 will be retained on the substrate 130, and the waste of the conductive layer 140 after die-cutting will be removed.

[0121] Specifically, the carrier film 160 is a low-viscosity self-adhesive film. This means that the first adhesive layer 150 is fully coated on the carrier film 160, thus covering the entire conductive layer 140. The adhesive layer 120 is partially coated on the conductive layer 140 and is made of a UV-curable adhesive. The viscosity of the adhesive layer 120 after curing is much greater than that of the first adhesive layer 150. Therefore, the peel force between the conductive layer 140 and the substrate 130 is greater than the peel force between the conductive layer 140 and the carrier film 160. Actual testing has shown that the peel force between the conductive layer 140 and the substrate 130 is 4-6 N / 15mm, while the peel force between the conductive layer 140 and the carrier film 160 is 0.03-0.05 N / 15mm (the unit N / 15mm refers to the force required to peel a 15mm wide strip).

[0122] Therefore, by removing the carrier film 160 , the discharge of the conductive layer 140 and the transfer of the conductive layer 140 to the substrate 130 can be completed simultaneously.

[0123] The technical solution of the embodiment of the present invention is to transfer the conductive structure 110, the first marking structure 12021, and the second marking structure 12022 to the substrate 130 through the adhesive layer 120, and then remove the carrier film 160 and the waste generated by die cutting. Then, based on the second marking structure 12022, the binding portion 1102 of the initial antenna structure is laser cut to form a through-groove 11022 and pads 11021 located on both sides of the through-groove 11022. A chip is then bonded to the pads 11021 of the binding portion 1102 to form an RFID antenna. Since only a few processing steps are required after transferring the conductive structure 110, the first marking structure 12021, and the second marking structure 12022 to the substrate 130, there are no requirements for the material of the substrate 130. In other words, this transfer method eliminates material restrictions on the substrate 130. In addition, the use of laser cutting for the binding portion 1102 with high precision requirements can ensure the accuracy of the size and position of the through groove 11022 and the pad 11021, which is convenient for subsequent maintenance and replacement of chips.

[0124] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. An RFID antenna, characterized in that: include: A conductive structure, comprising a transmission portion and a binding portion, wherein the transmission portion is used to receive or send wireless radio frequency signals, and the binding portion is used to bind the chip; an adhesive layer, disposed on one side of the conductive structure, the adhesive layer having an antenna pattern; A substrate is provided on a side of the adhesive layer away from the conductive structure; the adhesive layer is used to bond the conductive structure and the substrate; The transmission portion is formed by die cutting along the outline of the antenna pattern, at least a portion of the binding portion is formed by die cutting along the outline of the antenna pattern, and the conductive structure is used to be transferred to the substrate after die cutting; After the conductive structure is transferred to the substrate, at least a portion of the binding portion is formed by laser cutting; Wherein, the binding part includes: A through groove, the through groove being provided between two adjacent pads, the through groove being formed by laser cutting after the conductive structure is transferred to the substrate; the binding portion comprising: at least two pads, the pads being used to bind the chip; the pads being formed by die cutting before the conductive structure is transferred to the substrate; The antenna pattern includes a preset antenna pattern; the transmission portion is formed by die-cutting along the outline of the preset antenna pattern before the conductive structure is transferred to the substrate; the pad is formed by die-cutting along the outline of the preset antenna pattern before the conductive structure is transferred to the substrate; the through-groove is formed by laser cutting after the conductive structure is transferred to the substrate; The RFID antenna further comprises: at least one marking structure, the marking structure comprising a second marking structure, the second marking structure being used as a positioning reference when the through-groove of the binding portion is laser cut, and as a positioning reference when the chip is bound to the binding portion; The marking structure further includes a first marking structure; the first marking structure is used as a positioning reference when the RFID antenna is feeding; the distance between the first marking structure and the transmission part is greater than or equal to a first preset distance; the distance between the second marking structure and the binding part is less than or equal to a second preset distance; the first preset distance is greater than or equal to the second preset distance; The area of ​​the first marking structure is greater than or equal to the area of ​​the second marking structure; The orthographic projection areas of the conductive structure, the first marking structure, and the second marking structure on the substrate are larger than the orthographic projection areas of the corresponding antenna patterns of the adhesive layer on the substrate; The width of the through groove is smaller than the spacing between the pins of the chip; The peeling force between the conductive layer and the substrate is 4-6 N / 15 mm.

2. The RFID antenna according to claim 1, wherein: The orthographic projection of the chip on the substrate at least partially covers the orthographic projection of the through-groove on the substrate.

3. The RFID antenna according to claim 2, wherein: The orthographic projection of the conductive structure on the substrate completely covers the orthographic projection of the preset antenna pattern of the adhesive layer on the substrate.

4. The RFID antenna according to claim 3, wherein: The antenna pattern of the adhesive layer further includes a preset marking pattern; the marking structure is formed by die-cutting along the outline of the preset marking pattern before the conductive structure is transferred to the substrate; The marking structure and the conductive structure are arranged in the same layer; At least one of the marking structures at least partially overlaps with the conductive structure, or at least one of the marking structures is completely offset from the conductive structure.

5. A method for preparing an RFID antenna, characterized in that: include: Providing a conductive layer and a carrier film, laminating one side of the conductive layer to one side of the carrier film and bonding them together through a first adhesive layer; forming an adhesive layer on a side of the conductive layer away from the carrier film, wherein the adhesive layer has an antenna pattern; The conductive layer is die-cut along the outer contour of the antenna pattern to form a conductive structure; wherein the conductive structure includes a transmission portion and a binding portion, the transmission portion is used to receive or send wireless radio frequency signals, and the binding portion is used to bind a chip; wherein the binding portion includes: a through-groove, the through-groove is arranged between two adjacent pads, and the through-groove is formed by laser cutting after the conductive structure is transferred to the substrate; wherein the RFID antenna further includes: at least one marking structure, the marking structure includes a second marking structure, the second marking structure is used to serve as a positioning reference when the through-groove of the binding portion is laser cut, and serves as a positioning reference when the chip is bound to the binding portion; Providing a substrate, laminating the substrate with the side of the conductive layer away from the carrier film, and bonding the conductive structure to the substrate via the adhesive layer; removing the waste material of the carrier film and the conductive layer after die cutting, and transferring the conductive structure to the substrate to form an initial antenna structure; The binding portion of the initial antenna structure is laser cut to form an RFID antenna; the binding portion includes: at least two pads, the pads being used to bind the chip; the pads being formed by die cutting before the conductive structure is transferred to the substrate; The antenna pattern includes a preset antenna pattern; the transmission portion is formed by die-cutting along the outline of the preset antenna pattern before the conductive structure is transferred to the substrate; the pad is formed by die-cutting along the outline of the preset antenna pattern before the conductive structure is transferred to the substrate; the through-groove is formed by laser cutting after the conductive structure is transferred to the substrate; The marking structure further includes a first marking structure; the first marking structure is used as a positioning reference when the RFID antenna is feeding; the distance between the first marking structure and the transmission part is greater than or equal to a first preset distance; the distance between the second marking structure and the binding part is less than or equal to a second preset distance; the first preset distance is greater than or equal to the second preset distance; The area of ​​the first marking structure is greater than or equal to the area of ​​the second marking structure; The orthographic projection areas of the first marking structure and the second marking structure on the substrate are larger than the area of ​​the antenna pattern of the adhesive layer; The width of the through groove is smaller than the spacing between the pins of the chip; The peeling force between the carrier film and the conductive layer is smaller than the peeling force between the substrate and the conductive layer; the peeling force between the conductive layer and the substrate is 4-6N / 15mm, and the peeling force between the conductive layer and the carrier film is 0.03-0.05N / 15mm.

6. The method for preparing an RFID antenna according to claim 5, wherein: The antenna pattern includes a preset antenna pattern and at least one preset marking pattern; The die-cutting of the conductive layer along the outer contour of the antenna pattern to form a conductive structure comprises: Taking the preset marking pattern as a reference, the conductive layer is die-cut along the outer contour of the preset antenna pattern to form a conductive structure and a marking structure.

7. The method for preparing an RFID antenna according to claim 6, wherein: The antenna pattern includes a first preset marking pattern and a second preset marking pattern; The method of die-cutting the conductive layer along the outer contour of the preset antenna pattern using the preset marking pattern as a reference to form a conductive structure and a marking structure includes: Using the first preset marking pattern as a reference, die-cutting the conductive layer along the outer contour of the preset antenna pattern to form a conductive structure, a first marking structure, and a second marking structure; The first marking structure is connected to or spaced apart from the transmission portion of the conductive structure, and the second marking structure is connected to or spaced apart from the binding portion of the conductive structure.

8. The method for preparing an RFID antenna according to claim 7, wherein: Compounding a substrate with a side of the conductive layer away from the carrier film, and bonding the conductive structure to the substrate via the adhesive layer, comprising: bonding the conductive structure, the first marking structure, and the second marking structure to the substrate via the adhesive layer; The orthographic projections of the conductive structure, the first marking structure, and the second marking structure on the substrate completely cover the orthographic projection of the adhesive layer on the substrate.

9. The method for preparing an RFID antenna according to claim 7, wherein: The step of laser cutting the binding portion of the initial antenna structure to form an RFID antenna comprises: Using the second marking structure as a reference, the binding portion of the initial antenna structure is laser cut to form a through slot and solder pads located on both sides of the through slot; The second marking structure is used as a reference, and a chip is bonded to the pad of the bonding portion to form an RFID transponder; wherein the orthographic projection of the chip on the substrate at least partially covers the orthographic projection of the through-groove on the substrate.

Images