Substrate processing method and substrate

Abstract

The present invention discloses a substrate processing method and substrate. The substrate processing method includes the following steps: plugging a hole in the substrate with a first resin, opening a hole in the first resin to form a first hole body; plugging the first hole body with a second resin, opening a hole in the second resin to form a second hole body, wherein the opening area of ​​the second hole body is smaller than the opening area of ​​the first hole body, and the second hole peripheral wall of the second hole body is spaced apart from the first hole peripheral wall of the first hole body; and electroplating the substrate. In this solution, even if some metal burrs remain in the substrate hole, the second resin can cover the metal burrs. That is, the second resin in the second hole body can separate the electroplated layer from the metal burrs, effectively preventing the metal burrs from causing short circuits in the circuit board, thereby ensuring the substrate processing effect and the substrate yield rate.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a substrate processing method and a substrate. Background Art

[0002] Printed circuit boards are made through multiple processes. Specifically, they include drilling, deburring, resin plugging, mechanical drilling, and electroplating. Metal substrates have good ductility, and many metal burrs will be generated during the drilling process. If they are not completely removed, it will cause a short circuit during electrical testing, resulting in the scrapping of the circuit board. In related technologies, methods such as brushing and high-pressure water washing or etching are used to remove burrs, but this method is only suitable for burrs that are small in size and located at the hole mouth. For metal burrs with larger volume in the hole, the method of increasing the etching amount can partially remove the burrs, but it will cause the hole diameter to expand and affect the structure of the circuit board. Summary of the Invention

[0003] The main purpose of the present invention is to provide a substrate processing method and a substrate, aiming to solve the technical problem that metal burrs in substrate holes cannot be effectively removed.

[0004] To achieve the above objectives, a first embodiment of the present invention provides a substrate processing method, comprising the following steps:

[0005] Using a first resin to plug holes in the substrate, and opening holes in the first resin to form first holes;

[0006] Using a second resin to plug the first hole, and opening the second resin to form a second hole, wherein the opening area of ​​the second hole is smaller than the opening area of ​​the first hole, and the second hole wall of the second hole is spaced apart from the first hole wall of the first hole;

[0007] The substrate is electroplated.

[0008] In some embodiments, the first hole body and the second hole body are both circular holes, the pore size of the first hole body is D1, and the pore size of the second hole body is D2, wherein D1 and D2 satisfy: 250μm≤D1-D2≤350μm.

[0009] In some embodiments, along the thickness direction of the substrate, the first hole body has a first hole axis, the second hole body has a second hole axis, and the first hole axis coincides with the second hole axis.

[0010] In some embodiments, before the step of plugging the substrate with the first resin and opening the first resin to form the first hole, the following steps are included:

[0011] A third hole is formed in the substrate, wherein an opening area of ​​the third hole is larger than an opening area of ​​the first hole, and a peripheral wall of the first hole is spaced from a third peripheral wall of the third hole.

[0012] In some embodiments, along the thickness direction of the substrate, the third hole body has a third hole axis, the first hole body has a first hole axis, and the third hole axis coincides with the first hole axis.

[0013] In some embodiments, after the step of forming a third hole in the substrate, the following steps are included:

[0014] At least one of mechanical deburring, chemical deburring, laser deburring, ultrasonic deburring, and thermal deburring.

[0015] In some embodiments, after the step of opening pores in the second resin to form a second pore body, the method further comprises:

[0016] A BU process is performed on the substrate.

[0017] A second aspect of the present invention provides a substrate obtained by the substrate processing method of the above embodiment, the substrate comprising:

[0018] a base body, comprising the second pore body;

[0019] an electroplating layer covering a peripheral wall of the second hole of the second hole body;

[0020] Wherein, in the second hole, the second resin is located between the substrate and the electroplating layer.

[0021] In some embodiments, the substrate includes a plurality of second holes, and the second holes are spaced apart along a direction perpendicular to the thickness of the substrate.

[0022] A third embodiment of the present invention provides a substrate, comprising:

[0023] a base body including a third pore body;

[0024] a first resin covering a peripheral wall of the third hole of the third hole body;

[0025] The second resin is located on a side of the first resin facing away from the substrate and covers the first resin.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] In the technical solution of the present invention, the substrate processing method includes the following steps: plugging the substrate holes with a first resin, opening the first resin to form a first hole body; plugging the first hole body with a second resin, opening the second resin to form a second hole body; and electroplating the substrate. In the prior art, after the substrate has completed the single resin plugging and opening process, electroplating is performed directly. However, the use of brushing, high-pressure water washing, or etching in the previous step is ineffective in removing large metal burrs within the holes, which can easily cause short circuits during electrical testing, rendering the circuit board scrapped. In this solution, after the first resin is used to open the hole, the second resin will be used to plug the first hole body and open the hole for the second resin. Since the opening area of ​​the second hole body is smaller than the opening area of ​​the first hole body, and the second hole wall of the second hole body is spaced apart from the first hole wall of the first hole body, even if some metal burrs remain in the hole of the substrate, the second resin can cover the part of the metal burrs, that is, the second resin in the second hole body can separate the electroplating layer from the metal burrs, effectively avoiding the situation where the metal burrs cause a short circuit in the circuit board, thereby ensuring the processing effect of the substrate and the yield rate of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0029] Figure 1 Schematic diagram of a substrate in one embodiment of the present invention; wherein the substrate is provided with a third hole, and burrs are present both inside and outside the third hole;

[0030] Figure 2 Schematic diagram of a substrate in one embodiment of the present invention; wherein the burrs outside the third hole body are removed;

[0031] Figure 3 Schematic diagram of a substrate in one embodiment of the present invention; wherein the burrs in the third hole are partially removed;

[0032] Figure 4 Schematic diagram of a substrate in one embodiment of the present invention; wherein the first resin fills the third hole;

[0033] Figure 5 Schematic diagram of a substrate in one embodiment of the present invention; wherein, a first hole is formed by opening a hole in the first resin;

[0034] Figure 6 Schematic diagram of a substrate in one embodiment of the present invention; wherein the second resin fills the first pores;

[0035] Figure 7 Schematic diagram of a substrate in one embodiment of the present invention; wherein, the second resin is opened to form a second hole;

[0036] Figure 8 Schematic diagram of a substrate in one embodiment of the present invention; wherein the electroplating layer covers the second hole peripheral wall of the second hole body;

[0037] Figure 9 is an operational flow chart of a substrate processing method according to an embodiment of the present invention;

[0038] Figure 10 FIG. 4 is an operational flow chart of a substrate processing method in another embodiment of the present invention.

[0039] Description of Figure Numbers:

[0040] substrate 10;

[0041] Base 100;

[0042] A third hole body 110; a third hole peripheral wall 111; a third hole axis 112;

[0043] First resin 120;

[0044] First hole body 130; first hole peripheral wall 131; first hole axis 132;

[0045] Second resin 140;

[0046] Second hole body 150; second hole peripheral wall 151; second hole axis 152;

[0047] burr 160;

[0048] Electroplating layer 200;

[0049] Thickness direction X.

[0050] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0052] Printed circuit boards are made through multiple processes. Specifically, they include drilling, deburring, resin plugging, mechanical drilling, and electroplating. Metal substrates have good ductility, and many metal burrs will be generated during the drilling process. If they are not completely removed, it will cause a short circuit during electrical testing, resulting in the scrapping of the circuit board. In related technologies, methods such as brushing and high-pressure water washing or etching are used to remove burrs, but this method is only suitable for burrs that are small in size and located at the hole mouth. For metal burrs with larger volume in the hole, the method of increasing the etching amount can partially remove the burrs, but it will cause the hole diameter to expand and affect the structure of the circuit board.

[0053] In view of this, the first embodiment of the present invention proposes a substrate processing method, through which the metal burrs 160 in the holes of the substrate 10 can be effectively removed to prevent the circuit board from short-circuiting. It can be understood that the substrate 10 can be a metal substrate 10. Specifically, the substrate 10 can be a copper substrate 10 or an aluminum substrate 10. Some embodiments of the present application are described by taking the substrate 10 as a copper substrate 10 as an example. Figures 1 to 9 To introduce the substrate processing method of the embodiment of the present application. Figure 9 , the substrate processing method includes the following steps:

[0054] S101: Reference Figures 3 to 5 The substrate 10 is plugged with a first resin 120 , and the first resin 120 is opened to form a first hole 130 .

[0055] It should be noted that in some embodiments, the first hole 130 may be a through hole. In other embodiments, the first hole 130 may also be a blind hole. Some embodiments of this application are described using the first hole 130 as a through hole. It is understood that when drilling holes in the first resin 120, mechanical drilling or laser drilling may be used, and the specific drilling method may depend on the actual situation.

[0056] Reference Figure 4 and Figure 5 When the first resin 120 is opened, part of the metal burrs 160 in the hole of the substrate 10 can be partially removed along with part of the first resin 120 , thereby achieving preliminary removal of the burrs 160 .

[0057] S102: Reference Figures 5 to 7 The first hole body 130 is plugged with a second resin 140, and the second resin 140 is opened to form a second hole body 150, wherein the opening area of ​​the second hole body 150 is smaller than the opening area of ​​the first hole body 130, and the second hole wall 151 of the second hole body 150 is spaced from the first hole wall 131 of the first hole body 130.

[0058] It should be noted that the material of the second resin 140 can be the same as that of the first resin 120. Specifically, both the first resin 120 and the second resin 140 can be epoxy resin. It is understood that because the second resin 140 is used to plug the first holes 130 before the second holes 150 are formed, the first holes 130 will appear before the second holes 150. After the second holes 150 are formed, the first holes 130 will be partially filled.

[0059] S103: Reference Figure 8 , electroplating is performed on the substrate 10. It should be noted that electroplating can enhance the electrical conductivity and corrosion resistance of the substrate 10. Specifically, the substrate 10 after cleaning and dehydration can be placed in an electroplating tank to ensure that the entire board surface is completely immersed. The substrate 10 is used as a cathode, and after power is applied, the anode gradually releases metal ions. During the electroplating process, the metal ions will be deposited on the surface of the substrate 10 to form an electroplating layer 200. The electroplating can be cooled, washed with water, and dried to ensure that there is no moisture on the surface of the substrate 10.

[0060] In the technical solution of the present invention, the substrate processing method includes the following steps: plugging the substrate 10 with a first resin 120, opening the first resin 120 to form a first hole 130; plugging the first hole 130 with a second resin 140, opening the second resin 140 to form a second hole 150; and electroplating the substrate 10. In the prior art, after a substrate has completed a single resin plugging and opening process, electroplating is performed directly. However, the use of brushing, high-pressure water washing, or etching in the previous steps is ineffective in removing large metal burrs within the holes, which can easily cause short circuits during electrical testing, rendering the circuit board scrapped. In this solution, after the first resin 120 is opened, the second resin 140 is used to plug the first hole 130, and the second resin 140 is opened. Since the opening area of ​​the second hole 150 is smaller than the opening area of ​​the first hole 130, and the second hole wall 151 of the second hole 150 is spaced from the first hole wall 131 of the first hole 130, Figure 8 Even if some metal burrs 160 remain in the hole of the substrate 10, the second resin 140 can cover the part of the metal burrs 160, that is, the second resin 140 in the second hole 150 can separate the electroplating layer 200 from the metal burrs 160, effectively avoiding the situation where the metal burrs 160 cause a short circuit in the circuit board, thereby ensuring the processing effect of the substrate 10 and the yield rate of the substrate 10.

[0061] Reference Figure 4 and Figure 5, the following describes the hole-forming operation of the first resin 120. In some embodiments, the first hole 130 can be a circular hole, that is, a circular hole can be formed in the first resin 120. In other embodiments, the first hole 130 can also be a rectangular hole. In other embodiments, the first hole 130 can also be a polygonal hole. The specific shape of the first hole 130 can be determined according to actual conditions. Some embodiments of the present application are described using the first hole 130 as a circular hole as an example.

[0062] Reference Figure 6 and Figure 7 The following describes the hole-forming operation of the second resin 140. It should be noted that the hole shape of the second resin 140 can be the same as or different from that of the first resin 120. Some embodiments of the present application are described by taking the hole shape of the second resin 140 as the same as that of the first resin 120 as an example.

[0063] Reference Figure 5 and Figure 7 In some embodiments, both the first hole body 130 and the second hole body 150 can be circular holes. The aperture of the first hole body 130 can be D1, and the aperture of the second hole body 150 can be D2. Wherein, D1 and D2 satisfy: 250μm≤D1-D2≤350μm. Exemplarily, D1-D2 can be 250μm, 270μm, 290μm, 300μm, 325μm, 340μm or 350μm. The first hole body 130 and the second hole body 150 of this scheme adopt the above-mentioned setting, which can enable the residual second resin 140 layer to effectively cover the first resin 120 layer, effectively isolate the burrs 160 and the electroplating layer 200, prevent the substrate 10 from short circuiting, and ensure the yield of the substrate 10. After batch verification, the applicant found that the short-circuit scrap rate of the substrate 10 can be directly reduced from the original 93.75% to 0%.

[0064] Reference Figure 5 and Figure 7 , the relative opening positions of the first hole body 130 and the second hole body 150 are described below. In some embodiments, along the thickness direction X of the substrate 10, Figure 5 The orientation in the figure is used as a reference, that is, along the up-down direction. The first hole body 130 has a first hole axis 132, and the second hole body 150 has a second hole axis 152. The first hole axis 132 and the second hole axis 152 coincide with each other, meaning that the opening position of the first resin 120 and the opening position of the second resin 140 can be located at the same position. This solution ensures that the residual second resin 140 covers the first resin 120, preventing the metal burr 160 from connecting to the electroplating layer 200 and causing a short circuit.

[0065] In other embodiments, the first hole axis 132 may be parallel only to the second hole axis 152, but not coincident with the second hole axis 152. That is, the opening position of the first resin 120 may be spaced apart from the opening position of the second resin 140. When the burrs 160 on one side of the first hole 130 are larger and the burrs 160 on the other side are smaller, the opening position of the second hole 150 may be offset toward the side with smaller burrs 160 when the second hole 150 is opened. This allows the second resin 140 layer to better cover the burrs 160, thereby ensuring the yield rate of the substrate 10.

[0066] Reference Figure 1 、 Figure 3 and Figure 4 In some embodiments, before the step of plugging the substrate 10 with the first resin 120 and opening the first resin 120 to form the first hole 130 , the following steps are included:

[0067] The substrate 10 is provided with a third hole 110 . The opening area of ​​the third hole 110 is larger than the opening area of ​​the first hole 130 , and the second hole peripheral wall 151 is spaced apart from the third hole peripheral wall 111 of the third hole 110 .

[0068] It is understood that the substrate 10 can be drilled using mechanical drilling or laser drilling. Because the opening area of ​​the third hole 110 is larger than the opening area of ​​the first hole 130, and the first hole peripheral wall 131 is spaced apart from the third hole peripheral wall 111, the metal burrs 160 in the hole can be partially removed simultaneously when the first resin 120 is drilled, preventing the metal burrs 160 from being pulled back and forth, and ensuring the cleaning effect of the burrs 160.

[0069] It should be noted that the hole-making operation of the substrate 10 can be the same as or different from the hole-making operation of the first resin 120. Some embodiments of the present application are described by taking the hole-making operation of the substrate 10 as the same as the hole-making operation of the first resin 120 as an example. It can be understood that the third hole 110 can also be a circular hole. The aperture of the third hole 110 can be larger than the aperture of the first hole 130. The specific size of the third hole 110 can be determined according to actual conditions. Figure 1 and Figure 5 , the third hole 110 will appear before the first hole 130, and when the first hole 130 appears, the third hole 110 has been partially filled.

[0070] Reference Figure 1 and Figure 5 , the relative opening positions of the third hole body 110 and the first hole body 130 are described below. In some embodiments, along the thickness direction X of the substrate 10, Figure 1The orientation in the reference direction is used, that is, along the vertical direction. The third hole 110 has a third hole axis 112, and the first hole 130 has a first hole axis 132. The third hole axis 112 and the first hole axis 132 coincide, meaning that the opening position of the substrate 10 and the opening position of the first resin 120 can be located at the same position. This solution ensures uniform coverage of the third hole 110 by the residual first resin 120.

[0071] In other embodiments, the third hole axis 112 may be parallel to the first hole axis 132 but not coincident with the first hole axis 132, that is, the opening position of the substrate 10 may be spaced apart from the opening position of the first resin 120. When the burrs 160 on one side of the third hole 110 are larger and the burrs 160 on the other side are smaller, the opening position of the first hole 130 may be offset toward the side with smaller burrs 160 when the first hole 130 is opened. This allows the first resin 120 layer to better cover the burrs 160, thereby ensuring the yield rate of the substrate 10.

[0072] In some embodiments, after the step of forming the third hole 110 on the substrate 10, the following steps are included:

[0073] At least one of mechanical deburring 160, chemical deburring 160, laser deburring 160, ultrasonic deburring 160, and thermal deburring 160. It should be noted that mechanical deburring 160 may employ a deburring machine or vibration deburring 160. Chemical deburring 160 may selectively erode burrs 160 using a chemical liquid. Laser deburring 160 may irradiate burrs 160 using a laser beam. Ultrasonic deburring 160 may utilize bubbles generated by ultrasound in a cleaning solution to remove burrs 160. Thermal deburring 160 may utilize a hot air stream to rapidly impact burrs 160, causing them to fall off.

[0074] Specifically, in some embodiments, referring to Figure 1 and Figure 2 , high pressure water washing can be used to preliminarily remove the burrs 160 outside the third hole body 110. Figure 2 and Figure 3 , a chemical liquid may be used to etch the burr 160 in the third hole body 110 to reduce the volume of the burr 160 .

[0075] In some embodiments, after the step of opening the second resin 140 to form the second pores 150 , the following steps are included:

[0076] The substrate 10 is subjected to a BU process. The BU process protects the circuit and improves conductivity. Specifically, the BU process may include coating a protective layer, laminating, and wiring. The specific operation of the BU process can be referred to in related known techniques.

[0077] Reference Figure 8 In a second aspect, an embodiment of the present invention provides a substrate 10, which is obtained by the substrate processing method of the above embodiment. The substrate 10 includes a base 100 and an electroplating layer 200. The base 100 includes a second hole body 150. The electroplating layer 200 covers the second hole wall 151 of the second hole body 150. It should be noted that in the second hole body 150, the second resin 140 is located between the base 100 and the electroplating layer 200, that is, the second resin 140 can effectively isolate the burrs 160 of the base 100 from the electroplating layer 200. This solution can effectively avoid the situation where the metal burrs 160 cause a short circuit in the circuit board, thereby ensuring the yield rate of the circuit board.

[0078] Reference Figure 8 In some embodiments, the base 100 may include a plurality of second holes 150. The sizes and shapes of the second holes 150 may be the same or different, and their specific arrangement may depend on the actual situation. The second holes 150 are arranged at intervals along the thickness direction X perpendicular to the base 100. Specifically, in some embodiments, the interval between two adjacent second holes 150 may be uniform or non-uniform. In some embodiments of the present application, the interval between two adjacent second holes 150 is described as uniform as an example.

[0079] Reference Figure 7 In a third aspect, an embodiment of the present invention provides a substrate 10, comprising a base 100, a first resin 120, and a second resin 140. The base 100 includes a third hole 110. The first resin 120 can cover a third hole peripheral wall 111 of the third hole 110. The second resin 140 can be located on a side of the first resin 120 facing away from the base 100 and cover the first resin 120. This solution can effectively prevent metal burrs 160 from causing short circuits in the circuit board, thereby ensuring the yield rate of the circuit board.

[0080] Reference Figure 10 , the specific operating steps of the substrate processing method of some embodiments are introduced below.

[0081] S201: Reference Figure 1 , a third hole 110 is formed in the substrate 10. It is understood that the third hole 110 can be a through hole. The specific number of third holes 110 can be determined according to actual conditions. Specifically, the hole formation operation can be performed by mechanical drilling or laser drilling.

[0082] S202: Reference Figure 1 and Figure 2 , remove the burrs 160 outside the third hole body 110. Specifically, the burrs 160 can be removed by high-pressure water washing.

[0083] S203: Reference Figure 2 and Figure 3 , remove the burrs 160 in the third hole body 110. Specifically, a chemical liquid can be used to etch the burrs 160. It is understood that after etching, the aperture of the third hole body 110 will be partially enlarged, and the volume of the burrs 160 in the third hole body 110 will be reduced but will still remain.

[0084] S204: Reference Figure 3 and Figure 4 , the third hole 110 is plugged with the first resin 120. It is understood that the first resin 120 can fill the entire third hole 110.

[0085] S205: Reference Figure 4 and Figure 5 The first resin 120 is drilled to form a first hole 130. The first hole axis 132 of the first hole 130 can coincide with the third hole axis 112 of the third hole 110. The opening area of ​​the first hole 130 can be smaller than the opening area of ​​the third hole 110, and the first hole wall 131 can be spaced apart from the third hole wall 111. Because the first resin 120 has good cutting performance, the metal burrs 160 are partially removed when the first hole 130 is drilled.

[0086] S206: Reference Figure 5 and Figure 6 , the first hole 130 is plugged with the second resin 140. It is understood that the second resin 140 can fill the entire first hole 130.

[0087] S207: Reference Figure 7 The second resin 140 is then perforated to form a second hole 150. The second hole axis 152 of the second hole 150 can coincide with the first hole axis 132 of the first hole 130. The opening area of ​​the second hole 150 can be smaller than that of the first hole 130, and the second hole wall 151 is spaced apart from the first hole wall 131. Thus, the remaining second resin 140 can separate the metal burr 160 from the electroplated layer 200 in subsequent steps, effectively preventing short circuits in the substrate 10.

[0088] S208: Reference Figure 8 , electroplating is performed on the substrate 10. The specific operation of electroplating can refer to the relevant known technology.

[0089] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0090] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or", "and / or" or "and / or" appear in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0091] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present description and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A substrate processing method, characterized in that: The steps include: A first resin is used to plug a hole in the substrate, and the first resin is opened to form a first hole body. When the first resin is opened, part of the metal burrs in the hole of the substrate can be partially removed along with part of the first resin, thereby achieving preliminary removal of the metal burrs; Using a second resin to plug the first hole, and using the second resin to open a hole to form a second hole, wherein the opening area of ​​the second hole is smaller than the opening area of ​​the first hole, and the second hole wall of the second hole is spaced apart from the first hole wall of the first hole, and the second resin can cover the remaining metal burrs; The substrate is electroplated.

2. The substrate processing method according to claim 1, wherein: The first hole body and the second hole body are both circular holes. The pore diameter of the first hole body is D1, and the pore diameter of the second hole body is D2. The relationship between D1 and D2 satisfies: 250 μm≤D1-D2≤350 μm.

3. The substrate processing method according to claim 1, wherein: Along the thickness direction of the substrate, the first hole body has a first hole axis, the second hole body has a second hole axis, and the first hole axis coincides with the second hole axis.

4. The substrate processing method according to claim 1, wherein: Before the step of plugging the substrate with the first resin and opening the first resin to form the first hole, the following steps are included: A third hole is formed in the substrate, wherein an opening area of ​​the third hole is larger than an opening area of ​​the first hole, and a peripheral wall of the first hole is spaced from a third peripheral wall of the third hole.

5. The substrate processing method according to claim 4, wherein: Along the thickness direction of the substrate, the third hole body has a third hole axis, the first hole body has a first hole axis, and the third hole axis coincides with the first hole axis.

6. The substrate processing method according to claim 4, wherein: After the step of forming the third hole in the substrate, the method includes the following steps: At least one of mechanical deburring, chemical deburring, laser deburring, ultrasonic deburring, and thermal deburring.

7. The substrate processing method according to claim 1, wherein: After the step of opening pores in the second resin to form a second pore body, the method further comprises: A BU process is performed on the substrate.

8. A substrate, characterized in that Obtained by the substrate processing method according to any one of claims 1 to 7, the substrate comprises: a base body, comprising the second pore body; an electroplating layer covering a peripheral wall of the second hole of the second hole body; Wherein, in the second hole, the second resin is located between the substrate and the electroplating layer.

9. The substrate according to claim 8, wherein The base includes a plurality of second holes, and the second holes are arranged at intervals along a direction perpendicular to the thickness of the base.

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