Display panel, preparation method of display panel and electronic device

Abstract

The embodiment of the application provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. The display panel comprises a substrate, a pixel definition layer, a protective layer and an isolation structure. The pixel definition layer is located on one side of the substrate, and the pixel definition layer comprises a pixel opening. The protective layer is located on the side, away from the substrate, of the pixel definition layer. The isolation structure is located on the side, away from the substrate, of the protective layer, and the isolation structure has an isolation opening. The orthogonal projection of the pixel opening on the substrate at least partially overlaps the orthogonal projection of the isolation opening on the substrate. The edge of the orthogonal projection of the isolation structure on the substrate is located within the orthogonal projection of the protective layer on the substrate. The embodiment of the application is not prone to damaging the pixel definition layer of the rear light-emitting unit, can make the second electrode of the rear light-emitting unit more effectively lap joint with the corresponding isolation structure, and thus can improve the display effect of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display panels.

[0003] However, there are still some problems with the display panel that need to be addressed. Summary of the Invention

[0004] To overcome the technical problems mentioned in the background, this application provides a display panel, which includes:

[0005] substrate;

[0006] A pixel defining layer is located on one side of the substrate, and the pixel defining layer includes pixel openings;

[0007] A protective layer is located on the side of the pixel defining layer away from the substrate;

[0008] An isolation structure is located on the side of the protective layer away from the substrate. The isolation structure has an isolation opening. The orthographic projection of the pixel opening on the substrate at least partially coincides with the orthographic projection of the isolation opening on the substrate. The edge of the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the protective layer on the substrate.

[0009] In some possible implementations, the protective layer includes a conductive material;

[0010] Preferably, the protective layer comprises a transparent material;

[0011] Preferably, the material of the protective layer includes a metal oxide semiconductor;

[0012] Preferably, the material of the protective layer includes indium gallium zinc oxide and / or indium gallium zinc tin oxide.

[0013] In some possible implementations, the orthographic projection of the isolation structure onto the substrate lies within the orthographic projection of the protective layer onto the substrate;

[0014] Preferably, the distance between the edge of the orthographic projection of the isolation structure on the substrate and the edge of the orthographic projection of the protective layer on the substrate is greater than 1 μm;

[0015] Preferably, the display panel further includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer including a pixel opening, and the distance between the edge of the orthographic projection of the side of the pixel opening away from the substrate on the substrate and the edge of the orthographic projection of the protective layer on the substrate is less than or equal to 0.3 μm;

[0016] Preferably, the thickness of the protective layer in the direction perpendicular to the substrate is greater than or equal to 10 nm and less than or equal to 20 nm.

[0017] In some possible implementations, the orthographic projection of the protective layer on the substrate is located outside the orthographic projection of the pixel opening on the substrate;

[0018] Preferably, the surface of the pixel defining layer on the side away from the substrate is flat;

[0019] Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0020] In some possible implementations, the protective layer includes a plurality of spaced-apart protective portions, with a gap between adjacent protective portions, and a portion of the gap's orthographic projection on the substrate lies within the orthographic projection of the isolation structure on the substrate;

[0021] Preferably, the orthographic projection of a portion of the spacing on the substrate coincides with the orthographic projection of the side of the isolation structure facing the substrate on the substrate.

[0022] In some possible implementations, the display panel further includes a first electrode layer located on one side of the substrate, the pixel defining layer located on the side of the first electrode layer away from the substrate, the first electrode layer including a plurality of spaced-apart first electrodes, and the pixel opening exposing at least a portion of the first electrodes;

[0023] Preferably, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the protective layer on the substrate;

[0024] Preferably, the first electrode includes an anode.

[0025] In some possible implementations, the display panel further includes a light-emitting functional layer, which includes a plurality of spaced-apart light-emitting portions;

[0026] Preferably, the display panel further includes a second electrode layer located on the side of the light-emitting functional layer away from the substrate, the second electrode layer including a plurality of second electrodes spaced apart, the second electrodes being located within the isolation opening;

[0027] Preferably, the isolation structure includes a conductive material, and the second electrode extends to be electrically connected to the isolation structure;

[0028] Preferably, the second electrode includes a cathode.

[0029] In some possible implementations, the display panel further includes a first encapsulation layer located on the side of the second electrode layer away from the substrate. The first encapsulation layer includes a plurality of spaced-apart encapsulation units, at least a portion of which extend from the side of the isolation structure to the side of the isolation structure away from the substrate. The side of the isolation structure is the face of the isolation structure facing the isolation opening.

[0030] Preferably, the packaging units are spaced apart on the side of the isolation structure away from the substrate;

[0031] Preferably, there is a gap between the packaging unit located on the side of the isolation structure away from the substrate and the side of the isolation structure away from the substrate;

[0032] Preferably, the orthographic projection of the packaging unit on the substrate covers the orthographic projection of the isolation opening on the substrate and the orthographic projection of a portion of the isolation structure on the substrate;

[0033] Preferably, the display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the substrate and a third encapsulation layer located on the side of the second encapsulation layer away from the substrate;

[0034] Preferably, the materials of both the first encapsulation layer and the third encapsulation layer include inorganic materials;

[0035] Preferably, the material of the second encapsulation layer includes an organic material.

[0036] In some possible implementations, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate;

[0037] Preferably, the second electrode is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, and the second electrode is electrically connected to the third isolation portion;

[0038] Preferably, the orthographic projection of the light-emitting portion on the substrate is located outside the orthographic projection of the third isolation portion and / or the first isolation portion on the substrate;

[0039] Preferably, the material of the third isolation portion includes molybdenum metal; and / or, the material of the first isolation portion includes aluminum metal; and / or, the material of the second isolation portion includes titanium metal.

[0040] In some possible implementations, this application also provides a method for manufacturing a display panel, the method comprising:

[0041] Provide substrate;

[0042] A pixel defining layer is formed on one side of the substrate, the pixel defining layer including pixel openings;

[0043] A protective layer and an isolation structure are sequentially formed on the side of the pixel defining layer away from the substrate. The isolation structure has an isolation opening. The orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially coincide. The edge of the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the protective layer on the substrate.

[0044] In some possible implementations, the step of sequentially forming a protective layer and an isolation structure on the side of the pixel defining layer away from the substrate includes:

[0045] A protective material layer and an isolation structure material layer are sequentially formed on the side of the pixel defining layer away from the substrate;

[0046] The protective material layer and the isolation structure material layer are patterned to form the protective layer and the isolation structure.

[0047] In some possible implementations, the step of patterning the protective material layer and the insulating structure material layer to form the protective layer and the insulating structure includes:

[0048] A patterned photoresist layer is formed on the side of the isolation structure material layer away from the substrate, and the isolation structure material layer is subjected to a first patterning process so that at least a portion of the isolation structure material layer forms a transition opening communicating with the pixel opening;

[0049] The patterned photoresist layer is ashed to expose at least a portion of the isolation structure material layer adjacent to the transition opening, and the isolation structure material layer is patterned a second time to form a protrusion facing the transition opening, wherein the side of the protrusion near the substrate contacts the side of the protective material layer away from the substrate.

[0050] Remove the protective material layer not covered by the isolation structure material layer, and remove the protrusion to form a protective layer. After the protrusion is removed, the portion of the protective layer covered by the protrusion is exposed.

[0051] The sidewall of the isolation structure material layer facing the transition opening is etched to form the isolation structure.

[0052] In some possible implementations, the display panel includes light-emitting units, which include a first light-emitting unit and a second light-emitting unit; after the step of sequentially forming a protective layer and an isolation structure on the side of the pixel defining layer away from the substrate, the method further includes:

[0053] A light-emitting functional layer of the first light-emitting unit is formed on the side of the isolation structure away from the substrate;

[0054] A second electrode layer is formed on the side of the light-emitting functional layer of the first light-emitting unit away from the substrate;

[0055] A first encapsulation layer is formed on the side of the second electrode layer away from the substrate;

[0056] A first etched protective layer is formed in the isolation opening corresponding to the first light-emitting unit, and the first etched protective layer extends to cover a portion of the isolation structure;

[0057] Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etch protection layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the substrate, and remove the first etch protection layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the first light-emitting unit, wherein the second electrode extends to be electrically connected to the isolation structure corresponding to the first light-emitting unit.

[0058] In some possible implementations, after the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer not covered by the first etch protection layer, and removing the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the substrate, and removing the first etch protection layer, the method further includes:

[0059] A light-emitting functional layer of a second light-emitting unit is formed on the side of the isolation structure away from the substrate, and the light-emitting functional layer of the second light-emitting unit covers the side of the packaging unit corresponding to the first light-emitting unit away from the substrate;

[0060] A second electrode layer is formed on the side of the light-emitting functional layer of the second light-emitting unit away from the substrate;

[0061] A first encapsulation layer is formed on the side of the second electrode layer away from the substrate;

[0062] A second etched protective layer is formed within the isolation opening corresponding to the second light-emitting unit;

[0063] Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit that are not covered by the second etch protective layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the substrate, and remove the second etch protective layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the second light-emitting unit, wherein the second electrode extends to be electrically connected to the isolation structure corresponding to the second light-emitting unit.

[0064] In some possible implementations, this application also provides an electronic device, which includes the display panel described in this application, or a display panel prepared by the method for preparing the display panel described in this application.

[0065] Compared with the prior art, this application has the following beneficial effects:

[0066] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By setting the edge of the orthogonal projection of the isolation structure on the substrate to be located within the orthogonal projection of the protective layer on the substrate, the pixel definition layer of the rear light-emitting unit can be protected, making it less likely to be damaged. This allows the second electrode of the rear light-emitting unit to be more effectively connected to the corresponding isolation structure, thereby improving the display effect of the display panel. Attached Figure Description

[0067] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0068] Figure 1 A cross-sectional schematic diagram of the display panel in the related technology provided in the embodiments of this application;

[0069] Figure 2 One of the cross-sectional schematic diagrams of the display panel provided in the embodiments of this application;

[0070] Figure 3a A second cross-sectional schematic diagram of the display panel provided in the embodiments of this application;

[0071] Figure 3bA third cross-sectional schematic diagram of the display panel provided in the embodiments of this application;

[0072] Figure 4 A cross-sectional schematic diagram of the display panel provided in the embodiments of this application, including a first encapsulation layer;

[0073] Figure 5 A cross-sectional schematic diagram of the display panel provided in the embodiments of this application, including a second encapsulation layer and a third encapsulation layer;

[0074] Figure 6 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0075] Figure 7 A cross-sectional schematic diagram showing a protective material layer sequentially formed on the side of the pixel defining layer away from the substrate, provided for an embodiment of this application;

[0076] Figure 8 A cross-sectional schematic diagram showing that, in an embodiment of this application, isolation structure material layers are sequentially formed on the side of the protective material layer away from the substrate;

[0077] Figure 9 A cross-sectional schematic diagram showing a patterned photoresist layer formed on the side of the isolation structure material layer away from the substrate, provided for an embodiment of this application;

[0078] Figure 10 A cross-sectional schematic diagram of the isolation structure material layer after the first patterning process provided in an embodiment of this application;

[0079] Figure 11 A cross-sectional schematic diagram of the patterned photoresist layer after ashing treatment, provided in an embodiment of this application;

[0080] Figure 12 This is a cross-sectional schematic diagram of the isolation structure material layer after a second patterning process, provided in an embodiment of this application.

[0081] Figure 13 A cross-sectional schematic diagram of the protective material layer after removing the protective material layer not covered by the isolation structural material layer, provided in an embodiment of this application;

[0082] Figure 14 This is a cross-sectional schematic diagram of the removed patterned photoresist layer provided in an embodiment of this application.

[0083] Figure 15 This is a schematic cross-sectional view of the sidewall of the isolation structure material layer facing the transition opening, provided in an embodiment of this application.

[0084] Figure 16 A cross-sectional schematic diagram of a light-emitting functional layer in which a first light-emitting unit is formed on the side of the isolation structure away from the substrate, as provided in an embodiment of this application;

[0085] Figure 17 A cross-sectional schematic diagram of the second electrode layer formed on the side of the light-emitting functional layer of the first light-emitting unit away from the substrate, provided in an embodiment of this application;

[0086] Figure 18 One of the cross-sectional schematic diagrams provided in this application shows the formation of a first encapsulation layer on the side of the second electrode layer away from the substrate;

[0087] Figure 19 A cross-sectional schematic diagram of the formation of a first etched protective layer within the isolation opening corresponding to the first light-emitting unit, provided in an embodiment of this application;

[0088] Figure 20 This is a cross-sectional schematic diagram of the first encapsulation layer, light-emitting functional layer, and second electrode layer, which are not covered by the first etch protective layer, provided in an embodiment of this application.

[0089] Figure 21 A cross-sectional schematic diagram of a light-emitting functional layer in which a second light-emitting unit is formed on the side of the isolation structure away from the substrate, as provided in an embodiment of this application;

[0090] Figure 22 A cross-sectional schematic diagram showing the formation of a second electrode layer on the side of the light-emitting functional layer of the second light-emitting unit away from the substrate, provided in an embodiment of this application;

[0091] Figure 23 A second cross-sectional schematic diagram showing the formation of a first encapsulation layer on the side of the second electrode layer away from the substrate, provided as an embodiment of this application;

[0092] Figure 24 This is a cross-sectional schematic diagram of a second etched protective layer formed within the isolation opening corresponding to the second light-emitting unit, as provided in an embodiment of this application.

[0093] Reference numerals: 1. Substrate; 2. Pixel defining layer; 21. Pixel opening; 3. Isolation structure; 31. First isolation portion; 32. Second isolation portion; 33. Third isolation portion; 4. First electrode; 5. Light-emitting portion; 6. Second electrode; 7. Light-emitting unit; 8. Recess; 9. Isolation opening; 10. Protective layer; 101. Protective portion; 11. First encapsulation layer; 111. Encapsulation unit; 12. Second encapsulation layer; 13. Third encapsulation layer; 14. Protective material layer; 15. Isolation structure material layer; 151. Transition opening; 152. Protrusion; 16. Patterned photoresist layer; 17. First etch protection layer; 18. Second etch protection layer. Detailed Implementation

[0094] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0095] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0096] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0097] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0098] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0099] Increasing the density of light-emitting units (i.e., pixel density) in a display panel is a crucial way to improve display quality. However, current display panels manufactured using Fine Metal Mask (FMM) technology are limited by technological constraints that prevent further increases in light-emitting unit density. Through long-term research, the inventors discovered that to address this technical challenge, some display panels incorporate isolation structures. During the full-layer deposition of the light-emitting functional layer and the second electrode, the light-emitting functional layer and the second electrode can be disconnected at the isolation structure. Through multiple deposition and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed within different isolation openings.

[0100] Among them, patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 describe relevant technical solutions for isolation structures and encapsulation layers, the contents of which are incorporated herein by reference.

[0101] Please see Figure 1 The display panel in the related technology includes an array substrate 1, a pixel defining layer 2 located on one side of the array substrate 1, an isolation structure 3 located on the side of the pixel defining layer 2 away from the array substrate 1, and a light-emitting unit 7 located at least partially within an isolation opening 9 of the isolation structure 3. The light-emitting unit 7 includes a first light-emitting unit and a second light-emitting unit.

[0102] Through long-term research, the inventors discovered that, according to the preparation sequence of the first light-emitting unit and the second light-emitting unit, when preparing the first light-emitting unit, the second electrode 6 (such as a cathode) of the first light-emitting unit is also located inside the isolation opening 9 of the second light-emitting unit. Since the overlap between the second electrode 6 located inside the isolation opening 9 of the second light-emitting unit and the corresponding isolation structure 3 is relatively thin, when patterning the first light-emitting unit, the second electrode 6 located inside the isolation opening 9 of the second light-emitting unit cannot better protect the corresponding pixel defining layer 2, and may eventually damage the pixel defining layer 2 inside the isolation opening 9 of the second light-emitting unit, forming a pit 8 on the pixel defining layer 2.

[0103] Because the pixel defining layer 2 within the isolation opening 9 of the second light-emitting unit is damaged, the second electrode 6 of the second light-emitting unit is not easily connected to the corresponding isolation structure 3 during the fabrication of the second light-emitting unit, which can easily cause the second light-emitting unit to fail and ultimately affect the display effect of the display panel.

[0104] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0105] Please see Figure 2 This embodiment provides a display panel, which includes a substrate 1, a pixel defining layer 2, a protective layer 10, and an isolation structure 3.

[0106] A pixel defining layer 2 is located on one side of the substrate 1, and the pixel defining layer 2 includes a pixel opening 21; a protective layer 10 is located on the side of the pixel defining layer 2 away from the substrate 1; an isolation structure 3 is located on the side of the protective layer 10 away from the substrate 1, and the isolation structure 3 has an isolation opening 9. The orthographic projection of the pixel opening 21 on the substrate 1 and the orthographic projection of the isolation opening 9 on the substrate 1 at least partially coincide, and the edge of the orthographic projection of the isolation structure 3 on the substrate 1 is located within the orthographic projection of the protective layer 10 on the substrate 1. The isolation opening 9 is formed simultaneously with the patterning of the material of the isolation structure 3.

[0107] The substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each driving unit may include one or more semiconductor switching devices. The semiconductor switching devices may be formed by the interaction of multiple film layers in the substrate 1; for example, the semiconductor switching devices may be thin-film transistors formed by the interaction of multiple film layers.

[0108] The display panel also includes light-emitting units 7 located at least partially within the isolation opening 9. The light-emitting units 7 include a first light-emitting unit and a second light-emitting unit. The first light-emitting unit and the second light-emitting unit emit different colors. For example, the first light-emitting unit may emit red light, and the second light-emitting unit may emit green light.

[0109] Following the fabrication sequence of the first and second light-emitting units, since the edge of the orthographic projection of the isolation structure 3 onto the substrate 1 lies within the orthographic projection of the protective layer 10 onto the substrate 1, the protective layer 10 can at least protect the pixel defining layer 2 at the overlap position between the second electrode 6 of the light-emitting unit 7 and the isolation structure 3. Therefore, when patterning the first light-emitting unit, it is not easy to damage the pixel defining layer 2 of the second light-emitting unit. When fabricating the second light-emitting unit, the second electrode 6 of the second light-emitting unit can overlap well with the corresponding isolation structure 3, thereby improving the yield of the second light-emitting unit and ultimately improving the display quality of the display panel.

[0110] Based on the above design, this embodiment sets the edge of the orthographic projection of the isolation structure 3 on the substrate 1 to be within the orthographic projection of the protective layer 10 on the substrate 1, which can protect the pixel defining layer 2 of the rear light-emitting unit 7 and prevent damage to the pixel defining layer 2 of the rear light-emitting unit 7. This allows the second electrode 6 of the rear light-emitting unit 7 to be more effectively connected to the corresponding isolation structure 3, thereby improving the display effect of the display panel.

[0111] In some possible implementations, please refer again. Figure 2The display panel also includes a first electrode layer located on one side of the substrate 1, a pixel defining layer 2 located on the side of the first electrode layer away from the substrate 1, the first electrode layer including a plurality of spaced first electrodes 4, a pixel opening 21 exposing at least a portion of the first electrodes 4, the display panel also includes a light-emitting functional layer including a plurality of spaced light-emitting portions 5, the display panel also includes a second electrode layer located on the side of the light-emitting functional layer away from the substrate 1, the second electrode layer including a plurality of spaced second electrodes 6, the second electrodes 6 located within an isolation opening 9, an isolation structure 3 including a conductive material, the second electrodes 6 extending to be electrically connected to the isolation structure 3, and the orthographic projection of the pixel opening 21 on the substrate 1 located within the orthographic projection of the isolation opening 9 on the substrate 1.

[0112] The isolation structure 3 allows the display panel to form film layers of different colors of light-emitting units 7 in different isolation openings 9 without the need for a fine metal mask. Specifically, when forming the light-emitting functional layer, the isolation structure 3 effectively isolates the light-emitting functional layer to form multiple spaced light-emitting parts 5. When forming the second electrode layer, the isolation structure 3 isolates the second electrode layer to form multiple spaced second electrodes 6, ensuring sufficient contact area between the second electrodes 6 and the isolation structure 3. This allows for effective electrical connection between the second electrodes 6 and the isolation structure 3, and effectively reduces the display defect rate caused by the manufacturing process. A first electrode 4, a light-emitting part 5, and a second electrode 6 form a light-emitting unit 7. The first electrode 4 can be an anode, and the second electrode 6 can be a cathode.

[0113] In this way, different light-emitting units 7 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 3, the light-emitting functional layer and the second electrode layer in each color light-emitting unit 7 of the display panel can be fabricated and patterned on the entire surface first, thereby eliminating the need for a fine metal mask and saving on the manufacturing cost of the display panel.

[0114] Preferably, the orthographic projection of the first electrode 4 on the substrate 1 at least partially coincides with the orthographic projection of the protective layer 10 on the substrate 1. The protective layer 10 can also protect the first electrode 4, thereby further improving the light-emitting effect of the light-emitting unit 7.

[0115] In some possible implementations, the protective layer 10 includes a conductive material, the material of the protective layer 10 includes a metal oxide semiconductor, and the material of the protective layer 10 includes indium gallium zinc oxide and / or indium gallium zinc tin oxide.

[0116] For example, the material of the protective layer 10 includes a metal oxide semiconductor and a dopant. The metal oxide semiconductor includes indium gallium zinc oxide and / or indium gallium zinc tin oxide, and the dopant includes boron and / or phosphorus. Therefore, the protective layer 10 can be made conductive by doping with boron or phosphorus, etc., so as to realize the conductiveization of the protective layer 10.

[0117] Since the protective layer 10 is non-conductive, it will not cause crosstalk between the light-emitting units 7. Because the protective layer 10 is a transparent film, it will not affect the light extraction efficiency of the light-emitting units 7.

[0118] In some embodiments, please refer again Figure 2 The orthographic projection of the isolation structure 3 on the substrate 1 lies within the orthographic projection of the protective layer 10 on the substrate 1. Thus, while effectively protecting the pixel defining layer 2, the protective layer 10 can also provide better support for the isolation structure 3, making the isolation structure 3 more stable.

[0119] In other embodiments, please refer to Figures 3a-3b The protective layer 10 includes a plurality of protective portions 101 spaced apart, with a gap between adjacent protective portions 101.

[0120] Please see again Figure 3a The orthographic projection of a portion of the spacing on the substrate 1 lies within the orthographic projection of the isolation structure 3 on the substrate 1. That is, the orthographic projection of the spacing between two adjacent protective portions 101 corresponding to the same isolation structure 3 on the substrate 1 lies within the orthographic projection of the isolation structure 3 on the substrate 1. The side of the isolation structure 3 away from the substrate 1 also has a groove recessed towards the substrate 1 at the position of the spacing between two adjacent protective portions 101.

[0121] Please see again Figure 3b The orthographic projection of a portion of the spacing on the substrate 1 coincides with the orthographic projection of the side of the isolation structure 3 closest to the substrate 1 on the substrate 1. That is, the orthographic projection of the spacing between two adjacent protective portions 101 corresponding to the same isolation structure 3 on the substrate 1 coincides with the orthographic projection of the side of the isolation structure 3 closest to the substrate 1 on the substrate 1.

[0122] Thus, while effectively protecting the pixel defining layer 2, the protective layer 10 can be designed in various ways.

[0123] Preferably, the orthographic projection of the isolation structure 3 and / or the protective layer 10 onto the substrate 1 is a mesh.

[0124] Preferably, please see again. Figure 2The distance L between the edge of the orthographic projection of the isolation structure 3 on the substrate 1 and the edge of the orthographic projection of the protective layer 10 on the substrate 1 is greater than 1 μm. For example, the distance L1 can be 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, or 4 μm. By reasonably setting the distance L1, the pixel defining layer 2 can be better protected.

[0125] Preferably, please see again. Figure 2 The distance L2 between the edge of the orthographic projection of the side of the 21-pixel opening away from the substrate 1 on the substrate 1 and the edge of the orthographic projection of the protective layer 10 on the substrate 1 is less than or equal to 0.3 μm. For example, the distance L2 can be 0.3 μm, 0.2 μm, 0.1 μm, or 0 μm, etc. By reasonably setting the distance L2, the protective layer 10 can better protect the pixel defining layer 2.

[0126] Preferably, please see again. Figure 2 Along the direction perpendicular to the substrate 1, the thickness D of the protective layer 10 ranges from greater than or equal to 10 nm to less than or equal to 20 nm. For example, the thickness D can be 10 nm, 12 nm, 15 nm, 18 nm, or 20 nm. By reasonably setting the thickness D, a good protective effect can be achieved for the pixel defining layer 2 without excessively increasing the thickness of the display panel.

[0127] In some possible implementations, please refer again. Figure 2 The orthographic projection of the protective layer 10 onto the substrate 1 is outside the orthographic projection of the pixel opening 21 onto the substrate 1, and the surface of the pixel defining layer 2 away from the substrate 1 is flat. Since the protective layer 10 can provide good protection for the pixel defining layer 2, the surface of the pixel defining layer 2 away from the substrate 1 is flat.

[0128] For some possible implementations, please refer to Figure 4 The display panel also includes a first encapsulation layer 11 located on the side of the second electrode layer away from the substrate 1. The first encapsulation layer 11 includes a plurality of encapsulation units 111 spaced apart. At least some of the encapsulation units 111 extend from the side of the isolation structure 3 to the side of the isolation structure 3 away from the substrate 1. The side of the isolation structure 3 is the face of the isolation structure 3 facing the isolation opening 9. The encapsulation units 111 are spaced apart on the side of the isolation structure 3 away from the substrate 1. There is a gap between the encapsulation units 111 located on the side of the isolation structure 3 away from the substrate 1 and the side of the isolation structure 3 away from the substrate 1. The orthographic projection of the encapsulation units 111 on the substrate 1 covers the orthographic projection of the isolation opening 9 on the substrate 1 and covers the orthographic projection of part of the isolation structure 3 on the substrate 1.

[0129] During the patterning process of the light-emitting unit 7, the first encapsulation layer 11 is disconnected at the isolation structure 3 to form an encapsulation unit 111. The encapsulation unit 111 can completely and independently encapsulate the corresponding light-emitting unit 7, thereby improving the display characteristics of the display panel.

[0130] Preferably, please refer to Figure 5 The display panel also includes a second encapsulation layer 12 located on the side of the first encapsulation layer 11 away from the substrate 1 and a third encapsulation layer 13 located on the side of the second encapsulation layer 12 away from the substrate 1. The materials of the first encapsulation layer 11 and the third encapsulation layer 13 both include inorganic materials, and the material of the second encapsulation layer 12 includes organic materials.

[0131] For example, the first encapsulation layer 11 and the third encapsulation layer 13 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 12 can be formed by inkjet printing (IJP). The second encapsulation layer 12 and the third encapsulation layer 13 can achieve a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0132] In some possible implementations, please refer again. Figure 4 The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked sequentially along the direction away from the substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1.

[0133] Since the second isolation portion 32 is located on the side of the first isolation portion 31 away from the substrate 1, and the lateral width of the second isolation portion 32 is greater than the lateral width of the first isolation portion 31, the second isolation portion 32 will disconnect the light-emitting functional layer and the second electrode layer at the isolation structure 3. In this way, the isolation structure 3 formed by the first isolation portion 31 and the second isolation portion 32 can more easily make each light-emitting unit 7 independently packaged.

[0134] Preferably, please see again. Figure 4 The second electrode 6 is electrically connected to the first isolation part 31. The first isolation part 31 includes a conductive material. The second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the first isolation part 31 so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the first isolation part 31.

[0135] Please see again Figure 5 The isolation structure 3 also includes a third isolation section 33 located on the side of the first isolation section 31 facing the substrate 1, and the second electrode 6 is electrically connected to the third isolation section 33.

[0136] The third isolation section 33 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the third isolation section 33 so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the third isolation section 33.

[0137] Specifically, the material of the third isolation portion 33 includes molybdenum metal; and / or, the material of the first isolation portion 31 includes aluminum metal; and / or, the material of the second isolation portion 32 includes titanium metal. Thus, when the isolation structure 3 isolates the second electrode layer into the second electrode 6, the second electrode 6 is more easily electrically connected to the first isolation portion 31 and / or the third isolation portion 33.

[0138] Preferably, the orthographic projection of the light-emitting portion 5 on the substrate 1 is outside the orthographic projection of the third isolation portion 33 and / or the first isolation portion 31 on the substrate 1. In this way, the light-emitting portion 5 does not overlap with the isolation structure 3, thus preventing crosstalk between different light-emitting units 7.

[0139] In summary, by setting the edge of the orthographic projection of the isolation structure 3 on the substrate 1 to be within the orthographic projection of the protective layer 10 on the substrate 1, this application can protect the pixel defining layer 2 of the rear light-emitting unit 7, making it less likely to damage the pixel defining layer 2 of the rear light-emitting unit 7. This allows the second electrode of the rear light-emitting unit 7 to be more effectively connected to the corresponding isolation structure 3, thereby improving the reliability and yield of the display panel and ultimately improving the display effect of the display panel.

[0140] For some possible implementations, please refer to Figure 6 This application also provides a method for manufacturing a display panel, the method comprising:

[0141] S10: Provide substrate 1.

[0142] S11: A pixel defining layer 2 is formed on one side of the substrate 1. The pixel defining layer 2 includes a pixel opening 21.

[0143] S12: A protective layer 10 and an isolation structure 3 are sequentially formed on the side of the pixel defining layer 2 away from the substrate 1. The isolation structure 3 has an isolation opening 9. The orthographic projection of the pixel opening 21 on the substrate 1 and the orthographic projection of the isolation opening 9 on the substrate 1 at least partially coincide. The edge of the orthographic projection of the isolation structure 3 on the substrate 1 is located within the orthographic projection of the protective layer 10 on the substrate 1.

[0144] Please see Figure 7 and Figure 8 A protective material layer 14 and an isolation structure material layer 15 are sequentially formed on the side of the pixel defining layer 2 away from the substrate 1.

[0145] The protective material layer 14 and the isolation structure material layer 15 are patterned to form the protective layer 10 and the isolation structure 3.

[0146] Specifically, please see Figures 9-10 A patterned photoresist layer 16 is formed on the side of the isolation structure material layer 15 away from the substrate 1, and the isolation structure material layer 15 is subjected to a first patterning process so that at least a portion of the isolation structure material layer 15 forms a transition opening 151 communicating with the pixel opening 21.

[0147] Please see Figures 11-12 The patterned photoresist layer 16 is ashed to expose at least part of the isolation structure material layer 15 adjacent to the transition opening 151, and the isolation structure material layer 15 is patterned a second time to form a protrusion 152 facing the transition opening 151. The side of the protrusion 152 near the substrate 1 contacts the side of the protective material layer 14 away from the substrate 1.

[0148] Please see Figure 13 The protective material layer 14 not covered by the isolation structural material layer 15 is removed, and the protrusion 152 is also removed to form a protective layer 10. After the protrusion 152 is removed, the part of the protective layer 10 covered by the protrusion 152 is exposed.

[0149] Please see Figure 14 Remove the patterned photoresist layer 16.

[0150] Please see Figure 15 The sidewall of the isolation structure material layer 15 facing the transition opening 151 is etched to form the isolation structure 3.

[0151] In some possible implementations, the display panel includes a light-emitting unit 7, which includes a first light-emitting unit and a second light-emitting unit; after the step of sequentially forming a protective layer 10 and an isolation structure 3 on the side of the pixel defining layer 2 away from the substrate 1, the method further includes:

[0152] Please see Figure 16 A light-emitting functional layer of the first light-emitting unit is formed on the side of the isolation structure 3 away from the substrate 1.

[0153] The light-emitting functional layer is broken at the isolation structure 3, so that at least part of the light-emitting functional layer is located in the isolation opening 9 to form the light-emitting part 5. By controlling the evaporation angle, the light-emitting part 5 can be prevented from contacting the isolation structure 3.

[0154] Please see Figure 17 A second electrode layer is formed on the side of the first light-emitting unit away from the substrate 1.

[0155] The second electrode layer is broken at the isolation structure 3, so that at least part of the second electrode layer is located within the isolation opening 9 to form the second electrode 6. By controlling the evaporation angle, the second electrode 6 can extend from the isolation opening 9 to make electrical contact with the isolation structure 3, so as to connect to adjacent second electrodes 6 or connect the second electrode 6 to other circuits. In this way, the manufacturing difficulty of the display panel can be reduced.

[0156] Please see Figure 18 A first encapsulation layer 11 is formed on the side of the second electrode layer away from the substrate 1.

[0157] Please see Figure 19 A first etched protective layer 17 is formed in the isolation opening 9 corresponding to the first light-emitting unit, and the first etched protective layer 17 extends to cover the partial isolation structure 3.

[0158] The first etched protective layer 17 can protect the light-emitting functional layer, the second electrode layer and the first encapsulation layer 11 corresponding to the first light-emitting unit.

[0159] Please see Figure 20 Remove the first encapsulation layer 11, the light-emitting functional layer and the second electrode layer that are not covered by the first etch protection layer 17, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the substrate 1, and remove the first etch protection layer 17, so as to form the light-emitting part 5, the second electrode 6 and the encapsulation unit 111 in the isolation opening 9 corresponding to the first light-emitting unit, and the second electrode 6 extends to the isolation structure 3 corresponding to the first light-emitting unit for electrical connection.

[0160] After removing the first encapsulation layer 11, the light-emitting functional layer, and the second electrode layer that are not covered by the first etched protective layer 17, the first electrode 4, the light-emitting part 5 of the first light-emitting unit, and the second electrode 6 form the first light-emitting unit. The first light-emitting unit is completely covered by the encapsulation unit 111, thereby reducing the risk of the vapor deposition material entering the vapor deposition equipment after being exposed to the air, causing equipment contamination and film breakage.

[0161] In this way, without the need for a precision mask, the light-emitting part 5, the second electrode 6 and the encapsulation unit 111 can be formed only in the pixel opening 21 corresponding to the first light-emitting unit, and the second electrode 6 can be electrically connected to the isolation structure 3, thereby forming the first light-emitting unit in the pixel opening 21 corresponding to the first light-emitting unit at a lower cost.

[0162] Since the protective layer 10 can protect the pixel definition layer 2 corresponding to the second light-emitting unit, the pixel definition layer 2 of the second light-emitting unit is not easily damaged when the first light-emitting unit is patterned.

[0163] Please see Figure 21A light-emitting functional layer of the second light-emitting unit is formed on the side of the isolation structure 3 away from the substrate 1, and the light-emitting functional layer of the second light-emitting unit covers the side of the encapsulation unit 111 corresponding to the first light-emitting unit away from the substrate 1.

[0164] Based on the formation of the first light-emitting unit, the light-emitting functional layer of the second light-emitting unit is formed. The light-emitting functional layer of the second light-emitting unit will cover the encapsulation unit 111 corresponding to the first light-emitting unit. At the same time, the light-emitting part 5 of the second light-emitting unit will be formed in the pixel opening 21 corresponding to the second light-emitting unit.

[0165] Please see Figure 22 A second electrode layer is formed on the side of the light-emitting functional layer of the second light-emitting unit away from the substrate 1.

[0166] When the second electrode layer is formed, the second electrode layer will be disconnected at the isolation structure 3, and the second electrode 6 of the second light-emitting unit will be formed in the pixel opening 21 corresponding to the second light-emitting unit. The second electrode 6 of the second light-emitting unit is connected to the electrode of the corresponding isolation structure 3.

[0167] Please see Figure 23 A first encapsulation layer 11 is formed on the side of the second electrode layer away from the substrate 1.

[0168] Please see Figure 24 A second etched protective layer 18 is formed within the isolation opening 9 corresponding to the second light-emitting unit.

[0169] The second etched protective layer 18 can protect the corresponding light-emitting layer, the second electrode layer, and the first encapsulation layer 11 of the second light-emitting unit.

[0170] Please see again Figure 4 The first encapsulation layer 11, the light-emitting functional layer and the second electrode layer of the second light-emitting unit that are not covered by the second etch protection layer 18 are removed, and the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the substrate 1 are removed, and the second etch protection layer 18 is removed, so that the light-emitting part 5, the second electrode 6 and the encapsulation unit 111 are formed in the isolation opening 9 corresponding to the second light-emitting unit, and the second electrode 6 extends to the isolation structure 3 corresponding to the second light-emitting unit for electrical connection.

[0171] After removing the first encapsulation layer 11, the light-emitting functional layer, and the second electrode layer that are not covered by the second etched protective layer 18, the first electrode 4, the light-emitting part 5 of the second light-emitting unit, and the second electrode 6 form the second light-emitting unit. The second light-emitting unit is completely covered by the encapsulation unit 111, thereby reducing the risk of the vapor deposition material entering the vapor deposition equipment after being exposed to the air, causing equipment contamination and film breakage.

[0172] In this way, without the need for a precision mask, the light-emitting part 5, the second electrode 6 and the encapsulation unit 111 can be formed only in the pixel opening 21 corresponding to the second light-emitting unit, and the second electrode 6 can be electrically connected to the isolation structure 3, thereby forming the second light-emitting unit in the pixel opening 21 corresponding to the second light-emitting unit at a lower cost.

[0173] Since the pixel defining layer 2 of the second light-emitting unit is not easily damaged when the first light-emitting unit is patterned, the second electrode of the second light-emitting unit can be well connected with the corresponding isolation structure 3 when the second light-emitting unit is fabricated, thereby improving the yield of the second light-emitting unit and ultimately improving the display quality of the display panel formed by the above method.

[0174] In some possible embodiments, this application also provides an electronic device that includes the display panel described in this application, or includes a display panel prepared by the method described in this application. This electronic device may include a device with image processing capabilities, such as a server, personal computer, laptop computer, etc. Because this electronic device includes the display panel described in this application, it has better display quality.

[0175] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0176] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; A pixel defining layer is located on one side of the substrate, and the pixel defining layer includes pixel openings; A protective layer is located on the side of the pixel defining layer away from the substrate, and the protective layer is non-conductive; An isolation structure is located on the side of the protective layer away from the substrate. The isolation structure includes a third isolation portion, a first isolation portion, and a second isolation portion stacked sequentially along a direction away from the substrate. The orthographic projection of the side of the first isolation portion away from the substrate onto the substrate lies within the orthographic projection of the second isolation portion onto the substrate. The orthographic projection of the third isolation portion onto the substrate lies within the orthographic projection of the second isolation portion onto the substrate. The orthographic projection of the second isolation portion onto the substrate lies within the orthographic projection of the protective layer onto the substrate. The isolation structure has an isolation opening. The orthographic projection of the pixel opening onto the substrate and the orthographic projection of the isolation opening onto the substrate at least partially coincide. The edge of the orthographic projection of the isolation structure onto the substrate lies within the orthographic projection of the protective layer onto the substrate. The light-emitting functional layer includes a plurality of spaced-apart light-emitting portions, at least a portion of which is located within the isolation opening, a portion of which extends to the protective layer on the side away from the substrate and contacts the protective layer, and the orthographic projection of the light-emitting portion on the substrate is located outside the orthographic projection of the third isolation portion on the substrate.

2. The display panel according to claim 1, characterized in that, The protective layer includes a conductive material.

3. The display panel according to claim 1, characterized in that, The protective layer comprises a transparent material.

4. The display panel according to claim 1, characterized in that, The material of the protective layer includes metal oxide semiconductor.

5. The display panel according to claim 1, characterized in that, The protective layer is made of indium gallium zinc oxide and / or indium gallium zinc tin oxide.

6. The display panel according to claim 1, characterized in that, The distance between the edge of the orthographic projection of the isolation structure on the substrate and the edge of the orthographic projection of the protective layer on the substrate is greater than 1 μm.

7. The display panel according to claim 1, characterized in that, The display panel further includes a pixel defining layer located between the substrate and the isolation structure. The pixel defining layer includes a pixel opening, and the distance between the edge of the orthographic projection of the side of the pixel opening away from the substrate and the edge of the orthographic projection of the protective layer on the substrate is less than or equal to 0.3 μm.

8. The display panel according to claim 1, characterized in that, Along a direction perpendicular to the substrate, the thickness of the protective layer ranges from greater than or equal to 10 nm to less than or equal to 20 nm.

9. The display panel according to claim 1, characterized in that, The orthographic projection of the protective layer on the substrate is outside the orthographic projection of the pixel opening on the substrate.

10. The display panel according to claim 1, characterized in that, The surface of the pixel defining layer on the side away from the substrate is flat; The orthographic projection of the pixel opening on the substrate lies within the orthographic projection of the isolation opening on the substrate.

11. The display panel according to claim 1, characterized in that, The protective layer includes a plurality of spaced-apart protective portions, with a gap between adjacent protective portions, and a portion of the gap is projected onto the substrate in the orthogonal projection of the isolation structure onto the substrate.

12. The display panel according to claim 11, characterized in that, The orthographic projection of part of the spacing on the substrate coincides with the orthographic projection of the side of the isolation structure facing the substrate on the substrate.

13. The display panel according to claim 1, characterized in that, The display panel further includes a first electrode layer located on one side of the substrate, and the pixel defining layer is located on the side of the first electrode layer away from the substrate. The first electrode layer includes a plurality of spaced-apart first electrodes, and the pixel opening exposes at least a portion of the first electrodes.

14. The display panel according to claim 13, characterized in that, The orthographic projection of the first electrode on the substrate at least partially coincides with the orthographic projection of the protective layer on the substrate; The first electrode includes an anode.

15. The display panel according to claim 1, characterized in that, The display panel further includes a second electrode layer located on the side of the light-emitting functional layer away from the substrate. The second electrode layer includes a plurality of second electrodes spaced apart and the second electrodes are located within the isolation opening. The isolation structure includes a conductive material, and the second electrode extends to be electrically connected to the isolation structure; The second electrode includes a cathode.

16. The display panel according to claim 15, characterized in that, The display panel further includes a first encapsulation layer located on the side of the second electrode layer away from the substrate. The first encapsulation layer includes a plurality of encapsulation units spaced apart. At least a portion of the encapsulation units extend from the side of the isolation structure to the side of the isolation structure away from the substrate. The side of the isolation structure is the surface of the isolation structure facing the isolation opening. The packaging units are spaced apart on the side of the isolation structure away from the substrate; There is a gap between the packaging unit located on the side of the isolation structure away from the substrate and the side of the isolation structure away from the substrate; The orthographic projection of the packaging unit on the substrate covers the orthographic projection of the isolation opening on the substrate and the orthographic projection of the isolation structure on the substrate.

17. The display panel according to claim 16, characterized in that, The display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the substrate and a third encapsulation layer located on the side of the second encapsulation layer away from the substrate; Both the first encapsulation layer and the third encapsulation layer are made of inorganic materials; The material of the second encapsulation layer includes organic materials.

18. The display panel according to claim 15, characterized in that, The second electrode is electrically connected to the third isolation section; The material of the third isolation part includes molybdenum metal; and / or, the material of the first isolation part includes aluminum metal; and / or, the material of the second isolation part includes titanium metal.

19. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; A pixel defining layer is formed on one side of the substrate, the pixel defining layer including pixel openings; A protective layer and an isolation structure are sequentially formed on the side of the pixel defining layer away from the substrate. The protective layer is non-conductive. The isolation structure includes a third isolation portion, a first isolation portion, and a second isolation portion sequentially stacked along a direction away from the substrate. The orthographic projection of the side of the first isolation portion away from the substrate onto the substrate is located within the orthographic projection of the second isolation portion onto the substrate. The orthographic projection of the third isolation portion onto the substrate is located within the orthographic projection of the second isolation portion onto the substrate. The orthographic projection of the second isolation portion onto the substrate is located within the orthographic projection of the protective layer onto the substrate. The isolation structure has an isolation opening. The orthographic projection of the pixel opening onto the substrate and the orthographic projection of the isolation opening onto the substrate at least partially coincide. The edge of the orthographic projection of the isolation structure onto the substrate is located within the orthographic projection of the protective layer onto the substrate. A light-emitting functional layer is formed, the light-emitting functional layer including a plurality of spaced light-emitting portions, at least a portion of the light-emitting portions being located within the isolation opening, a portion of the light-emitting portions extending to the protective layer on the side away from the substrate and contacting the protective layer, and the orthogonal projection of the light-emitting portions on the substrate being located outside the orthogonal projection of the third isolation portion on the substrate.

20. The method for manufacturing a display panel according to claim 19, characterized in that, The step of sequentially forming a protective layer and an isolation structure on the side of the pixel defining layer away from the substrate includes: A protective material layer and an isolation structure material layer are sequentially formed on the side of the pixel defining layer away from the substrate; The protective material layer and the isolation structure material layer are patterned to form the protective layer and the isolation structure.

21. The method for manufacturing a display panel according to claim 20, characterized in that, The step of patterning the protective material layer and the isolation structure material layer to form the protective layer and the isolation structure includes: A patterned photoresist layer is formed on the side of the isolation structure material layer away from the substrate, and the isolation structure material layer is subjected to a first patterning process so that at least a portion of the isolation structure material layer forms a transition opening communicating with the pixel opening; The patterned photoresist layer is ashed to expose at least a portion of the isolation structure material layer adjacent to the transition opening, and the isolation structure material layer is patterned a second time to form a protrusion facing the transition opening, wherein the side of the protrusion near the substrate contacts the side of the protective material layer away from the substrate. Remove the protective material layer not covered by the isolation structure material layer, and remove the protrusion to form a protective layer. After the protrusion is removed, the portion of the protective layer covered by the protrusion is exposed. The sidewall of the isolation structure material layer facing the transition opening is etched to form the isolation structure.

22. The method for manufacturing a display panel according to claim 21, characterized in that, The display panel includes a light-emitting unit, which includes a first light-emitting unit and a second light-emitting unit; After the step of sequentially forming a protective layer and an isolation structure on the side of the pixel defining layer away from the substrate, the method further includes: A light-emitting functional layer of the first light-emitting unit is formed on the side of the isolation structure away from the substrate; A second electrode layer is formed on the side of the light-emitting functional layer of the first light-emitting unit away from the substrate; a first encapsulation layer is formed on the side of the second electrode layer away from the substrate; A first etched protective layer is formed in the isolation opening corresponding to the first light-emitting unit, and the first etched protective layer extends to cover a portion of the isolation structure; Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etch protection layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the substrate, and remove the first etch protection layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the first light-emitting unit, wherein the second electrode extends to be electrically connected to the isolation structure corresponding to the first light-emitting unit.

23. The method for manufacturing a display panel according to claim 22, characterized in that, After the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer not covered by the first etch protective layer, and removing the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the substrate, and removing the first etch protective layer, the method further includes: A light-emitting functional layer of a second light-emitting unit is formed on the side of the isolation structure away from the substrate, and the light-emitting functional layer of the second light-emitting unit covers the side of the packaging unit corresponding to the first light-emitting unit away from the substrate; A second electrode layer is formed on the side of the light-emitting functional layer of the second light-emitting unit away from the substrate; A first encapsulation layer is formed on the side of the second electrode layer away from the substrate; A second etched protective layer is formed within the isolation opening corresponding to the second light-emitting unit; Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit that are not covered by the second etch protective layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the substrate, and remove the second etch protective layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the second light-emitting unit, wherein the second electrode extends to be electrically connected to the isolation structure corresponding to the second light-emitting unit.

24. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-18, or a display panel prepared by the method for preparing a display panel as described in any one of claims 19-23.

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