Electrochemical deposition equipment

Abstract

An electrochemical deposition device comprises: a process tank body having a receiving tank, the receiving tank being used to hold electroplating liquid; a substrate carrier having a carrying surface, the carrying surface being used to hold a substrate to be coated, at least a portion of the substrate carrier being located in the receiving tank; and at least one drive component, the drive component being arranged on the process tank body and being used to control the movement of the substrate carrier along a first plane, the first plane intersecting with the normal direction of the carrying surface.

Description

Technical Field

[0001] The present disclosure relates to the field of electrochemical deposition, and in particular to an electrochemical deposition device. Background Art

[0002] Electrochemical deposition is a low-cost chemical film-forming method that can deposit metal layers of any thickness. Summary of the Invention

[0003] The present disclosure provides an electrochemical deposition device, comprising:

[0004] A process tank body having a receiving tank, wherein the receiving tank is used to receive the electroplating solution;

[0005] A substrate carrier having a carrying surface, the carrying surface being used to carry the substrate to be coated, at least a portion of the substrate carrier being located in the receiving tank;

[0006] At least one driving assembly is disposed on the process tank and is used to control the substrate carrier to move along a first plane, where the first plane intersects a normal direction of the carrying surface.

[0007] In some embodiments, the drive assembly includes:

[0008] Transmission adapter;

[0009] a first displacement unit, the first displacement unit being arranged on the process tank body and being used to control the transmission adapter to move along a first direction;

[0010] a second displacement unit, the second displacement unit being disposed on the transmission adapter and configured to control the substrate carrier to move along a second direction;

[0011] The first direction intersects with the second direction, and both intersect with the normal direction of the bearing surface.

[0012] In some embodiments, the first displacement unit comprises:

[0013] a first mounting member, wherein the first mounting member is provided with a first slideway extending along the first direction;

[0014] a first slider, the first slider being arranged on the first slideway;

[0015] a first motor, wherein a housing of the first motor is fixedly connected to the first mounting member, and a drive shaft of the first motor is connected to the first slider, for controlling the first slider to slide along the first slideway;

[0016] Wherein, the transmission adapter is connected to the first sliding block.

[0017] In some embodiments, the drive assembly further comprises:

[0018] A limiter is provided on the process tank body and is used to limit the movement range of the transmission adapter in the first direction.

[0019] In some embodiments, the second displacement unit comprises:

[0020] a second mounting member, wherein the second mounting member is provided with a second slideway extending along the second direction;

[0021] a second slider, the second slider being disposed on the second slideway;

[0022] A second motor, a housing of the second motor is fixedly connected to the second mounting member, and a driving shaft of the second motor is connected to the second slider, for controlling the second slider to slide along the second slideway.

[0023] In some embodiments, the process tank comprises:

[0024] A main tank body having the accommodating tank;

[0025] A reinforcement structure, wherein the reinforcement structure is fixed around the main tank body;

[0026] The first displacement unit is provided on the reinforcement structure, and an avoidance notch is provided on the side wall of the main slot body at a position corresponding to the first displacement unit.

[0027] In some embodiments, the electrochemical deposition apparatus includes two driving assemblies, and the two driving assemblies are respectively located on opposite sides of the process tank.

[0028] In some embodiments, the electrochemical deposition apparatus further comprises:

[0029] a jet plate, the jet plate being detachably disposed in the receiving tank and comprising a receiving shell having a first receiving cavity, the receiving shell being provided with a first liquid inlet and a plurality of liquid outlets, the first liquid inlet and the liquid outlets both being in communication with the first receiving cavity, the liquid outlets being disposed toward the bearing surface;

[0030] Wherein, the distance between the jet plate and the bearing surface is adjustable.

[0031] In some embodiments, the housing is further provided with a plurality of first mounting hole groups arranged along the first direction, each of the first mounting hole groups includes a plurality of first mounting holes arranged along a third direction; the third direction is a normal direction of the bearing surface;

[0032] The electrochemical deposition apparatus further comprises:

[0033] a mounting plate, wherein a plurality of second mounting hole groups are provided on the mounting plate, each of the second mounting hole groups includes a plurality of second mounting holes arranged along the third direction; the second mounting hole groups correspond one-to-one with the first mounting hole groups, and each second mounting hole is capable of being aligned with one of the first mounting holes;

[0034] A plurality of fasteners are provided, each of the fasteners being capable of extending into a first mounting hole and a second mounting hole that are opposite to each other, so as to fasten the accommodating shell and the mounting plate.

[0035] In some embodiments, each of the first mounting hole groups includes N first mounting holes, and the number of second mounting holes in each of the second mounting hole groups is greater than or equal to N; N is an integer greater than 1;

[0036] The distance between two adjacent first mounting holes in the same first mounting hole group is equal to the distance between two adjacent second mounting holes in the same second mounting hole group; the distance between two adjacent first mounting hole groups is equal to the distance between two adjacent second mounting hole groups.

[0037] In some embodiments, a portion of the second mounting hole groups include N second mounting holes, and the remaining second mounting hole groups include N+1 second mounting holes, and the N second mounting holes and the N+1 second mounting holes are arranged alternately.

[0038] In some embodiments, the electrochemical deposition apparatus further comprises a jet plate mounting member, wherein the jet plate mounting member is disposed on an inner wall of the process tank;

[0039] Wherein, one of the mounting plate and the jet plate mounting piece is provided with a protrusion, and the other is provided with a slot, and the protrusion is arranged in the slot.

[0040] In some embodiments, the accommodating shell includes: a first wall, a second wall arranged opposite to the first wall, and multiple side walls for connecting the first wall and the second wall, and the first wall, the second wall and the multiple side walls form the first accommodating cavity; wherein the liquid outlet is arranged on the first wall, and the first mounting hole is arranged on the side wall.

[0041] In some embodiments, the spray plate further comprises: a plurality of liquid return pipes, the liquid return pipes passing through the first accommodating cavity, the inlets of the first liquid return pipes being arranged on the first wall, and the outlets of the liquid return pipes being arranged on the second wall;

[0042] Wherein, a plurality of liquid outlets are arranged around the inlet of each liquid return pipeline.

[0043] In some embodiments, for at least a portion of the liquid return lines, a connecting line of centers of a plurality of liquid outlets around the liquid return lines forms a quadrilateral, a pentagon, or a hexagon.

[0044] In some embodiments, the jet plate further includes: at least one flow-uniform baffle located in the first accommodating chamber, the flow-uniform baffle divides the first accommodating chamber into a main chamber and at least one pressure-equalizing chamber, the first liquid inlet is connected to the pressure-equalizing chamber, the liquid outlet is connected to the main chamber, a plurality of evenly distributed through holes are provided on the flow-uniform baffle, and the pressure-equalizing chamber is connected to the main chamber through the through holes on the flow-uniform baffle.

[0045] In some embodiments, the jet plate further includes: a jet box arranged on the accommodating shell, the jet box having a second accommodating cavity, the second accommodating cavity being connected to the first accommodating cavity through the first liquid inlet; a second liquid inlet being provided on the jet box, the second liquid inlet being connected to the second accommodating cavity.

[0046] In some embodiments, a sealing ring is provided between the spray box and the accommodating shell, and the sealing ring surrounds the first liquid inlet.

[0047] In some embodiments, the process tank body is provided with a liquid circulation outlet, and the liquid circulation outlet is communicated with the holding tank;

[0048] The electrochemical deposition apparatus further comprises:

[0049] a filter screen located at the liquid circulation outlet, the filter screen being used to filter the electroplating liquid discharged from the holding tank to the liquid circulation outlet;

[0050] A circulation component, wherein the inlet of the circulation component is connected to the liquid circulation outlet, and the outlet of the circulation component is communicated with the first liquid inlet.

[0051] In some embodiments, the substrate carrier comprises:

[0052] A carrying plate having a first sub-carrying surface, wherein a hollow structure is provided on the carrying plate;

[0053] A support plate covering the hollow structure, wherein the support plate has a second sub-bearing surface, and the second sub-bearing surface and the first sub-bearing surface together constitute the bearing surface.

[0054] In some embodiments, the substrate carrier further comprises:

[0055] a conductive ring, disposed on the carrier plate and surrounding the support plate;

[0056] A lifting structure, fixedly connected to the carrying plate;

[0057] A conductive block is provided on the pulling structure and electrically connected to the conductive ring; the conductive block is connected to the driving assembly.

[0058] In some embodiments, the driving assembly includes: a first displacement unit and a second displacement unit, the second displacement unit including a second slider;

[0059] A limiting protrusion is provided on one of the conductive block and the second sliding block, and a limiting groove is provided on the other one, wherein the limiting protrusion is located in the limiting groove.

[0060] In some embodiments, the lifting structure comprises:

[0061] a first sealing plate and a second sealing plate arranged opposite to each other, wherein the first sealing plate and the second sealing plate are respectively used to be connected to two opposite surfaces of the carrying plate;

[0062] a handle, disposed between the first closing plate and the second closing plate and connected to the first closing plate and the second closing plate;

[0063] Wherein, at least a portion of the conductive block is disposed between the first sealing plate and the second sealing plate.

[0064] In some embodiments, an insulating layer is provided between the conductive block and the first sealing plate, and between the conductive block and the second sealing plate.

[0065] In some embodiments, the electrochemical deposition apparatus further includes an electrode structure, wherein the electrode structure includes a support frame and at least one metal mesh structure disposed on the support frame.

[0066] In some embodiments, the electrode structure includes a plurality of metal mesh structures, and the support frame includes a support portion electrically connected to each of the metal mesh structures.

[0067] In some embodiments, the electrode structure further comprises: a power supply portion and a transmission portion, wherein the power supply portion is used to load an electrical signal; each of the metal mesh structures is electrically connected to the power supply portion via the transmission portion;

[0068] At least one of the power supply unit and the transmission unit includes a conductive body and a protection layer covering the conductive body, wherein the conductivity of the conductive body is greater than the conductivity of the protection layer.

[0069] In some embodiments, the electrochemical deposition apparatus further comprises:

[0070] a third mounting member, arranged on the inner wall of the process tank;

[0071] The conductive part is fixed on the third mounting member and is located on a side of the third mounting member away from the bottom wall of the process tank body; wherein the end of the power supply part is pressed onto the conductive part.

[0072] In some embodiments, the electrochemical deposition apparatus further comprises:

[0073] A toggle clamp is provided on the process tank body, the toggle clamp comprising a handle and a pressing head, the handle being used to drive the pressing head to move along the depth direction of the receiving tank to press or move away from the electrification part;

[0074] Wherein, a buffer pad is provided on the surface of the electrification part facing the pressing head.

[0075] In some embodiments, the electrochemical deposition apparatus further comprises: an electrode mounting member having a mounting groove, the electrode mounting member being disposed on an inner wall of the process tank body;

[0076] The support frame is also provided with side wings, and the side wings are used to extend into the installation groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0078] Figure 1 This is a schematic three-dimensional diagram of an electrochemical deposition apparatus provided in some embodiments of the present disclosure.

[0079] Figure 2 FIG. 1 is a top view of an electrochemical deposition apparatus provided in some embodiments of the present disclosure.

[0080] Figure 3 This is a schematic diagram of part of the structure of the main tank body and the receiving tank provided in some embodiments of the present disclosure.

[0081] Figure 4 Schematic diagram of a drive assembly, substrate carrier, and reinforcement structure provided in some embodiments of the present disclosure.

[0082] Figure 5 This is a three-dimensional schematic diagram of a drive assembly provided in some embodiments of the present disclosure.

[0083] Figure 6 This is a schematic diagram of a first displacement unit provided in some embodiments of the present disclosure.

[0084] Figure 7 This is an overall schematic diagram of the spray plate and the mounting plate provided in some embodiments of the present disclosure.

[0085] Figure 8 Schematic cross-sectional view of a jet plate provided in some embodiments of the present disclosure.

[0086] Figure 9 For the Figure 7 Cross-sectional view along line A-A'.

[0087] Figure 10 FIG. 1 is a plan view of a first wall of a jet plate provided in some embodiments of the present disclosure.

[0088] Figure 11 FIG. 1 is a plan view of a second wall of a jet plate provided in some embodiments of the present disclosure.

[0089] Figure 12 This is a schematic diagram of the distribution of liquid return lines and liquid outlets provided in some embodiments of the present disclosure.

[0090] Figure 13 This is a schematic diagram of the distribution of the first mounting holes on the spray plate and the second mounting holes on the mounting plate provided in some embodiments of the present disclosure.

[0091] Figure 14 This is a schematic diagram of a jet component mounting plate provided in some embodiments of the present disclosure.

[0092] Figure 15 Schematic diagram of a three-dimensional substrate carrier provided in some embodiments of the present disclosure.

[0093] Figure 16 For the Figure 15 Cross-sectional view along line BB'.

[0094] Figure 17 Schematic diagram of the cooperation between the conductive block and the second slider.

[0095] Figure 18 This is a three-dimensional schematic diagram of the electrode structure provided in some embodiments of the present disclosure.

[0096] Figure 19 This is a three-dimensional schematic diagram from another angle of the electrode structure provided in some embodiments of the present disclosure.

[0097] Figure 20 This is a three-dimensional schematic diagram of the electrode structure provided in some other embodiments of the present disclosure.

[0098] Figure 21 This is a schematic three-dimensional diagram of an electrode mounting member provided in some embodiments of the present disclosure.

[0099] Figure 22 This is a partial schematic diagram of an electrochemical deposition apparatus provided in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0100] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0101] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0102] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should have the usual meanings understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0103] As used herein, "parallel" and "perpendicular" include the conditions described and conditions similar to the conditions described, and the range of the similar conditions is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within ±5°.

[0104] Electrochemical deposition is a technique in which a conductive material structure acts as the positive and negative electrodes in a metal ion plating solution under the action of an external electric field. Through the migration of positive and negative ions in the plating solution containing metal ions, the metal ions are reduced at the negative electrode, resulting in a metal coating on the surface of the conductive material. For example, when the metal ions in the plating solution are copper ions, the resulting metal coating is a copper film.

[0105] The plating solution is stored in the holding tank Sp of the electrochemical deposition equipment, which also houses an electrode structure. During the electrochemical deposition process, the substrate to be plated is secured to a substrate carrier 30. The substrate carrier 30, loaded with the substrate, is then placed in the holding tank Sp, facing the electrode structure. The negative terminal of the power supply is electrically connected to the seed layer on the substrate. The electrode structure is connected to the positive terminal of the power supply, creating an electric field between the electrode structure and the substrate. This causes the metal ions in the electrolyte to adhere to the substrate, forming an electrochemically deposited film.

[0106] The inventors have found that for surface areas exceeding 2.5m 2 When electrochemical deposition is performed on a substrate (for example, a substrate with a size of 1.5m*1.85m or larger), a voltage signal needs to be applied to the electrode structure 50 on the substrate through a power supply. Due to the large extension direction or width of the electrode structure, the voltage drop (IR drop) phenomenon will cause a voltage difference between the portion of the electrode structure 50 close to the power supply and the portion far away from the power supply, which will in turn cause differences in the electric fields formed in different regions of the subsequent electrode structure, resulting in a thickness difference of more than 20% in different regions of the metal coating formed on the substrate, which seriously affects the uniformity of the metal coating and reduces reliability.

[0107] Figure 1 is a three-dimensional schematic diagram of an electrochemical deposition device provided in some embodiments of the present disclosure, Figure 2 is a top view of an electrochemical deposition apparatus provided in some embodiments of the present disclosure, Figure 3 This is a schematic diagram of a portion of the structure of the main tank body and the receiving tank provided in some embodiments of the present disclosure. Figure 4 Schematic diagram of the drive assembly, substrate carrier and reinforcement structure provided in some embodiments of the present disclosure. Figures 1 to 4 As shown, the electrochemical deposition apparatus includes a process tank 10 having a receiving tank Sp, a substrate carrier 30, and at least one drive assembly 20. The receiving tank Sp is used to hold the electroplating solution. The substrate carrier 30 has a carrying surface for holding the substrate to be coated, with at least a portion of the substrate carrier 30 positioned within the receiving tank Sp. The substrate can be either a silicon substrate or a glass substrate.

[0108] The drive assembly 20 is disposed on the process tank 10 and is used to control the movement of the substrate carrier 30 along a first plane that intersects the normal direction of the support surface. For example, the first plane is perpendicular to the normal direction of the support surface. The normal direction of the support surface refers to a direction perpendicular to the support surface.

[0109] When electrochemical deposition is performed using the electrochemical deposition equipment in the embodiment of the present disclosure, the driving component 20 can be used to drive the substrate carrier 30 to move along the first plane, so that the position on the substrate that was originally in a strong electric field can be moved to a weak electric field, and the position on the substrate that was originally in a weak electric field can be moved to a strong electric field, which is beneficial to improving the uniformity of the film thickness formed on the substrate.

[0110] In some embodiments, as Figure 1 and Figure 3 As shown, the process tank body 10 may include: a main tank body 11 having a receiving tank Sp, and a reinforcement structure 12. The main tank body 11 may be made of an insulating material, such as polypropylene. The reinforcement structure 12 is arranged around the main tank body 11. The reinforcement structure 12 may include a plurality of reinforcement beams and reinforcement longitudinal beams. The drive assembly 20 may be arranged on the reinforcement structure 12. A roller 13 may be provided at the bottom of the process tank body 10 to facilitate the movement of the electrochemical deposition equipment. Figure 4 As shown, the process tank body 10 may be provided with a snap-fitting member 14 , which may be provided on the reinforcement structure 12 . The snap-fitting member 14 has a snap-fitting groove 14 v , so that it may snap-fit ​​with the installation base to keep the electrochemical process equipment fixed during the process.

[0111] In some embodiments, the electrochemical deposition apparatus includes two drive assemblies 20 , which are respectively disposed on opposite sides of the process tank 10 . The two drive assemblies 20 can simultaneously control the movement of the substrate carrier 30 , thereby improving the stability of the movement of the substrate carrier 30 .

[0112] Figure 5 is a three-dimensional schematic diagram of a drive assembly provided in some embodiments of the present disclosure, such as Figure 5 As shown, the driving assembly 20 includes: a transmission adapter 23 , a first displacement unit 21 and a second displacement unit 22 .

[0113] The first displacement unit 21 is provided on the process tank 10 and is used to control the transmission adapter 23 to move along the first direction. For example, a fixing plate 24 is provided on the reinforcement structure 12 , and the first displacement unit 21 is provided on the fixing plate 24 .

[0114] For example, the transmission adapter 23 may include a first connecting plate 231, a second connecting plate 232, and a reinforcing plate 233. The first connecting plate 231 is connected to the first displacement unit 21; the second connecting plate 232 is connected to the first connecting plate to support the second displacement unit 22. The first connecting plate 231 and the second connecting plate 232 may be substantially perpendicular. The reinforcing plate 233 is connected to the first connecting plate 231 and the second connecting plate 232, and is substantially perpendicular to both the first connecting plate 231 and the second connecting plate 232, thereby improving the overall stability of the transmission connector 23.

[0115] like Figure 5 As shown, the second displacement unit 22 is disposed on the transmission adapter 23 and is used to control the substrate carrier 30 to move along the second direction. The first direction and the second direction intersect, and both intersect the normal direction of the carrying surface.

[0116] For example, the first direction may be the depth direction of the accommodation groove Sp, and the second direction may be perpendicular to both the first direction and the normal direction of the bearing surface.

[0117] In the embodiment of the present disclosure, the first displacement unit 21 and the second displacement unit 22 can be used to control the substrate carrier 30 to move along a plane perpendicular to the normal direction of the carrying surface.

[0118] Figure 6 This is a schematic diagram of a first displacement unit provided in some embodiments of the present disclosure, combined with Figure 5 、 Figure 6 As shown, the first displacement unit 21 may include: a first mounting member 212, a first slider 213 and a first motor 211. The first mounting member 212 may be provided on the fixed plate 24, and the first mounting member 212 is provided with a first slide G1 extending along the first direction. The first slider 213 is slidably provided on the first slide G1. The housing of the first motor 211 is fixedly connected to the first mounting member 212, and the driving shaft of the first motor 211 is connected to the first slider 213 for controlling the first slider 213 to slide along the first slide G1. The transmission adapter 23 is fixedly connected to the first slider 213. The first motor 211 can be used to realize the movement of the first slider 213 along the first direction, thereby driving the transmission adapter 23 to move along the first direction, and then driving the second displacement unit 22 to move along the first direction.

[0119] In one example, a guide hole extending along a first direction is provided on the first slider 213, and a driving shaft of the first motor 211 passes through the guide hole and controls the first slider 213 to slide along the first slideway G1. The first electrode can be a linear electrode or a rotary motor.

[0120] In some embodiments, as Figure 5 As shown, the second displacement unit 22 may include a second mounting member 222, a second slider 223, and a second motor 221. The second mounting member 222 is mounted on the transmission adapter 23 and is provided with a second slideway G2 extending in the second direction. The second slider 223 is mounted on the second slideway G2. The housing of the second motor 221 is fixedly connected to the second mounting member 222, and the drive shaft of the second motor 221 is connected to the second slider 223 to control the second slider 223 to slide along the second slideway G2.

[0121] In some embodiments, as Figure 5 As shown, the drive assembly 20 further includes a stopper 25, which is disposed on the process tank body 10 and is used to limit the range of movement of the transmission adapter 23 in a first direction. For example, the stopper 25 can be disposed on the fixing plate 24, where the first direction is the depth direction of the receiving slot Sp. By providing the stopper 25, it is possible to prevent the substrate carrier 30 from being positioned too high, thereby preventing the seed layer on the substrate from fully contacting the electrolyte solution. At the same time, it is possible to prevent the substrate carrier 30 from being positioned too low, thereby preventing the substrate carrier 30 from colliding with the bottom wall of the process tank body 10.

[0122] In one example, if Figure 5 As shown, a limiting protrusion 23a is fixedly provided on the transmission adapter 23, and the limiter 25 includes two limiting members 251 arranged along the first direction. When the first displacement unit 21 controls the transmission adapter 23 to move along the first direction, the limiting protrusion 23a moves between the two limiting members 251.

[0123] like Figure 3 As shown, the main tank body 11 has a bottom wall and a side wall 11a. An avoidance notch 11v is provided on the side wall of the main tank body 11 at a position corresponding to the first displacement unit 21 to prevent the transmission adapter 23 from colliding with the main tank body 11 during movement.

[0124] In addition, if Figure 3 As shown, the main slot body 11 is further provided with a bent member 11s, which is arranged opposite the avoidance notch 11v and bends toward the middle of the receiving slot Sp. The bent member 11s can shield the second slider 223, preventing the second slider 223 from moving too far in the second direction.

[0125] Among them, Figure 3 As shown, the side wall 11a includes a first side wall portion 11a1 and a second side wall portion 11a2. The first side wall portion 11a1 is connected to the bottom wall, and the second side wall portion 11a2 is located on the side of the first side wall portion 11a1 away from the bottom wall and is connected to the first side wall portion 11a1. The portion of the receiving tank Sp corresponding to the first side wall portion 11a1 is the first receiving tank Sp1, and the portion of the receiving tank Sp corresponding to the second side wall portion 11a2 is the second receiving tank Sp2. The cross-sectional area of ​​the second receiving tank Sp2 is larger than the cross-sectional area of ​​the first receiving tank Sp1, thereby preventing the plating solution from overflowing. The cross-sectional area of ​​the first receiving tank Sp1 (or the second receiving tank Sp2) refers to the area of ​​the cross section of the first receiving tank Sp1 (or the second receiving tank Sp2) perpendicular to the height direction of the process tank body 10.

[0126] like Figure 2 As shown, the electrochemical deposition device further includes: a jet plate 40, which is detachably disposed in the receiving tank Sp. Figure 7This is an overall schematic diagram of the jet plate and the mounting plate provided in some embodiments of the present disclosure. Figure 8 is a cross-sectional schematic diagram of a jet plate provided in some embodiments of the present disclosure, Figure 9 For the Figure 7 The cross-sectional view of the A-A' line, Figure 10 is a plan view of a first wall of a jet plate provided in some embodiments of the present disclosure, Figure 11 FIG. 1 is a plan view of the second wall of the jet plate provided in some embodiments of the present disclosure. Figures 7 to 11 As shown, the spray plate 40 includes a housing shell 41 having a first housing cavity CA1; a first liquid inlet 401 and multiple liquid outlets 402 are provided on the housing shell 41, and the first liquid inlet 401 and the liquid outlet 402 are both connected to the first housing cavity CA1, and the liquid outlet 402 is arranged toward the substrate carrier.

[0127] During the electrochemical deposition process, the electrode structure 50, the substrate to be electroplated, and the jet plate 40 are all arranged in the receiving tank Sp. The electrode structure 50 is connected to the anode of the power supply, and the substrate carrier 30 is connected to the cathode of the power supply, thereby forming an electric field between the electrode structure and the substrate. The plating solution enters the first receiving chamber CA1 from the first liquid inlet 401 of the jet plate 40 and flows out from the liquid outlet 402. Under the action of the electric field, the metal ions in the plating solution are deposited on the substrate to form a metal film layer. Since the plating solution flows out from the liquid outlet 402, when performing the electrochemical deposition process on a large-sized substrate, the distribution position and size of the liquid outlet 402 can be adjusted to improve the uniformity of the thickness of the film layer deposited on the substrate.

[0128] like Figures 9 to 11 As shown, the housing 41 includes a first wall 411, a second wall 412 disposed opposite the first wall 411, and a plurality of side walls 413 connecting the first wall 411 and the second wall 412. The first wall 411, the second wall 412, and the plurality of side walls 413 form a first housing chamber CA1. The liquid outlet 402 is disposed on the first wall 411. The spray plate 40 also includes a plurality of liquid return lines 403, which pass through the first housing chamber CA1. The inlet of the liquid return line 403 is disposed on the first wall 411, and the outlet of the liquid return line 403 is disposed on the second wall 412. The liquid return lines 403 are used to circulate the electroplating liquid on both sides of the spray plate 40.

[0129] Figure 12 Schematic diagram of the distribution of liquid return lines and liquid outlets provided in some embodiments of the present disclosure, such as Figure 12As shown, in some embodiments, the liquid outlets 402 are evenly distributed, the multiple liquid return pipes 403 are evenly distributed, the diameters of different liquid outlets 402 are the same, and the inner diameters of different liquid return pipes 403 are also the same, so that the flow rate of the plating liquid output at different positions is the same, thereby improving the uniformity of the deposited film layer on the substrate under the condition of uniform electric field.

[0130] The liquid outlet 402 may be circular, the liquid return line 403 may be cylindrical, and the diameter of the liquid outlet 402 may be smaller than the inner diameter of the liquid return line 403 .

[0131] In some embodiments, as Figure 12 As shown, each liquid return line 403 is provided with a plurality of adjacent liquid outlets 402. For at least a portion of the liquid return lines 403, the center lines connecting the plurality of liquid outlets 402 around the liquid return line 403 form a hexagon. Of course, the liquid outlets 402 may also be distributed in other ways, for example, the center lines connecting the plurality of liquid outlets 402 around the liquid return line 403 may form a quadrilateral or a pentagon.

[0132] Among them, when the center line connecting the multiple liquid outlets 402 around the return liquid pipeline 403 forms a polygon such as a quadrilateral, pentagon or hexagon, the center of the inlet of the return liquid pipeline 403 is located at the center position of the polygon. In this way, when the spray plate 40 is placed in the holding tank Sp for the electrochemical deposition process, the metal ions in the plating solution on one side of the polygon are more evenly distributed, so that the film layer deposited in the area corresponding to the polygon on the substrate is more evenly distributed.

[0133] It should be noted that the distribution of the liquid return line 403 and the liquid outlet 402 in the present disclosure is not limited to Figure 12 The arrangement method in the figure can be adjusted according to the actual process requirements and will not be explained here one by one.

[0134] like Figure 9 As shown, the jet plate 40 also includes: at least one flow-uniform baffle 43 located within the first accommodating chamber CA1. The flow-uniform baffle 43 divides the first accommodating chamber CA1 into a main chamber CA11 and at least one pressure-equalizing chamber CA12. The first liquid inlet 401 is connected to the pressure-equalizing chamber CA12, and the liquid outlet 402 is connected to the main chamber. The flow-uniform baffle 43 is provided with a plurality of evenly distributed through holes 404. The pressure-equalizing chamber CA12 is connected to the main chamber through the through holes 404 on the flow-uniform baffle 43. When the flow-uniform baffle 43 is not provided, the liquid pressure near the first liquid inlet 401 is higher, and the liquid pressure away from the first liquid inlet 401 is lower. After the flow-uniform baffle 43 is provided, the pressure distribution of the electroplating solution can be made more uniform.

[0135] like Figure 9As shown, the first liquid inlet 401 is located on the second wall 412; the jet plate 40 also includes: a jet box 42, the jet box 42 has a second accommodating chamber CA2, and the second accommodating chamber CA2 is connected to the first accommodating chamber CA1 through the first liquid inlet 401. The jet box 42 is provided with a second liquid inlet 42a, and the second liquid inlet 42a is connected to the second accommodating chamber CA2. The electroplating liquid enters the second accommodating chamber CA2 from the second liquid inlet 42a, then enters the pressure equalizing chamber CA12 through the first liquid inlet 401, and then enters the main chamber CA11 and flows out from the liquid outlet 402. It should be noted that the first liquid inlet 401 can also be set on the first wall 411, as long as the second accommodating chamber CA2 can be connected to the first accommodating chamber CA1 through the first liquid inlet 401.

[0136] In one example, two flow-distributing baffles 43 are provided within the first accommodating chamber CA1, thereby dividing the first accommodating chamber CA1 into a main chamber CA11 and two pressure-equalizing chambers CA12. The two flow-distributing baffles 43 are arranged along the height of the process tank 10. Accordingly, there are two jet boxes 42, each of which is in one-to-one communication with the pressure-equalizing chambers CA12.

[0137] In one example, the jet box 42 can be connected to the first wall 411 by fasteners such as screws. The second accommodating chamber CA2 is connected to the first accommodating chamber CA1 through two first liquid inlets 401. Of course, the second accommodating chamber CA2 can also be connected to the first accommodating chamber CA1 through other numbers of first liquid inlets 401. In addition, Figure 9 As shown, a sealing ring 47 is provided between the spray box 42 and the housing 41. The sealing ring 47 surrounds the first liquid inlet 401 to prevent leakage between the spray box 42 and the housing 41. The sealing ring 47 can be made of a flexible material such as rubber.

[0138] In one example, if Figure 9 As shown, the first wall 411 may include a first edge portion 411a and a second edge portion 411b, and the second wall 412 includes a first edge portion 412a and a second edge portion 412b. The liquid outlet 402 and the inlet of the liquid return line 403 are arranged on the first edge portion 411a of the first wall 411, and the outlet of the liquid return line 403 is arranged on the first edge portion 412a of the second wall 412. The second liquid inlet 42a is located on the second edge portion 412b of the second wall 412. The multiple side walls 413 of the housing 41 may include: an upper side wall, a lower side wall, a left side wall, and a right side wall. In one example, the upper side wall, one second edge portion 412b of the second wall 412, and one flow-distributing baffle 43 form an integrated structure; the lower side wall, another second edge portion 412b of the second wall 412, and another flow-distributing baffle 43 form an integrated structure.

[0139] Parts of the jet plate 40 that directly contact the plating solution, such as the first wall 411 , the second wall 412 , the side wall 413 and the jet box 42 , may be made of insulating materials, such as polypropylene (PP) and polymethyl methacrylate (PMMA), to prevent reaction with the plating solution.

[0140] In some embodiments, the distance between the spray plate 40 and the supporting surface is adjustable, so that the thickness of the film layer can be adjusted by adjusting the distance between the spray plate 40 and the supporting surface.

[0141] Figure 13 Schematic diagram of the distribution of the first mounting holes on the jet plate and the second mounting holes on the mounting plate provided in some embodiments of the present disclosure, such as Figure 13 As shown, the housing 41 is further provided with a plurality of first mounting hole groups V1g arranged along a first direction. Each first mounting hole group V1g includes a plurality of first mounting holes V1 arranged along a third direction, which is the normal direction of the bearing surface. Specifically, the first mounting holes V1 can be provided on the sidewall 413 of the jet plate 40.

[0142] The electrochemical deposition apparatus further includes a mounting plate 40a and a plurality of fasteners. The mounting plate 40a is provided with a plurality of second mounting hole groups V2g, each of which includes a plurality of second mounting holes V2 arranged along a third direction. The second mounting hole groups V2g correspond one-to-one with the first mounting hole groups V1g, and each second mounting hole V2 is capable of being aligned with a first mounting hole V1. Each fastener is capable of extending into a first mounting hole V1 and a second mounting hole V2 that are aligned with each other to secure the housing 41 to the mounting plate 40a. For example, the fasteners are screws, and both the first mounting holes V1 and the second mounting holes V2 are threaded.

[0143] The mounting plate 40a can be fixed in a fixed position within the receiving slot Sp. When the distance between the jet plate 40 and the supporting surface needs to be adjusted, the relative position of the mounting plate 40a and the jet plate 40 can be adjusted, thereby adjusting the distance between the mounting plate 40a and the supporting surface. Once the relative position of the mounting plate 40a and the jet plate 40 is determined, the receiving housing 41 and the mounting plate 40a are secured using fasteners.

[0144] In some embodiments, as Figure 13 As shown, each first mounting hole group V1g includes N first mounting holes V1, where N is an integer greater than 1. The number of second mounting holes V2 in each second mounting hole group V2g is greater than or equal to N. The spacing between two adjacent first mounting holes V1 in the same first mounting hole group V1g is equal to the spacing between two adjacent second mounting holes V2 in the same second mounting hole group V2g; and the spacing between two adjacent first mounting hole groups V1g is equal to the spacing between two adjacent second mounting hole groups V2g.

[0145] In one example, some second mounting hole groups V2g include N second mounting holes V2, while another portion of the second mounting hole groups V2g includes N+1 second mounting holes V2. For example, the second mounting hole group V2g including N second mounting holes V2 is designated as a first-type mounting hole group, while the second mounting hole group V2g including N+1 second mounting holes V2 is designated as a second-type mounting hole group. The N second mounting holes V2 in the first-type mounting hole group are alternately arranged with the N+1 second mounting holes V2 in the second-type mounting hole group. This alternating arrangement allows for fine-tuning of the distance between the jet plate 40 and the support surface.

[0146] Taking N=2 as an example, the first mounting hole group V1g includes two first mounting holes V1, the first type mounting hole group includes two second mounting holes V2, and the second type mounting hole group includes three second mounting hole groups V2g. Figure 13 As shown in , if the position of the mounting plate 40a in the accommodating groove Sp is fixed, and when the two second mounting holes V2 on the left and the middle in the first type of mounting hole group are respectively opposite to the two first mounting holes V1 in the first mounting hole group V1g, there is a first distance between the jet plate 40 and the bearing surface; when the two second mounting holes V2 in the second type of mounting hole group are respectively opposite to the two first mounting holes V1 in the first mounting hole group V1g, there is a second distance between the jet plate 40 and the bearing surface; when the two second mounting holes V2 on the right and the middle in the first type of mounting hole group are respectively opposite to the two first mounting holes V1 in the first mounting hole group V1g, there is a third distance between the jet plate 40 and the bearing surface. For example, for any second mounting hole group V2g, the spacing between two adjacent second mounting holes V2 is D, and the perpendicular midline connecting the two adjacent second mounting holes V2 in the second-type mounting hole group passes through a second mounting hole V2 in the first-type mounting hole group. In this case, the difference between the first and second spacings, as well as the difference between the second and third spacings, is D / 2. For example, if D is set to 20 mm, the jet plate 40 can achieve a movement of 10 mm.

[0147] It should be noted that the above examples are schematically illustrated using N=2 as an example. Of course, N can also be other numbers, which will not be given one by one here.

[0148] like Figure 7 As shown, the spray plate 40 may further be provided with a lifting handle to facilitate lifting the spray plate 40 out of the receiving slot Sp, or placing the spray plate 40 in the receiving slot Sp.

[0149] like Figure 6As shown, the electrochemical deposition apparatus further includes a jet plate mounting member 60, which is disposed on the inner wall of the process tank 10. For example, the jet plate mounting member 60 can be mounted on the inner wall of the process tank 10 using fasteners such as screws. The fasteners used to mount the jet plate mounting member 60 can be made of titanium or an organic material, such as polyetheretherketone (PEEK), to prevent corrosion by the electroplating solution. Figure 14 Schematic diagram of the jet component mounting plate provided in some embodiments of the present disclosure, such as Figure 13 and Figure 14 As shown, one of the mounting plate 40a and the jet plate mounting member 60 is provided with a protrusion 61, and the other is provided with a slot 62. The protrusion 61 is disposed in the slot 62, thereby fixing the position of the mounting plate 40a. The slot 62 extends along the depth direction of the receiving slot Sp. During the electrochemical deposition process, the mounting plate 40a is first fixedly connected to the jet plate 40. Thereafter, the connected jet plate 40 and mounting plate 40a are placed in the receiving slot Sp along the depth direction of the receiving slot Sp, and the protrusion 61 is inserted into the slot 62. This arrangement of the slot 62 and the protrusion 61 allows the mounting plate 40a and the jet plate 40 to be easily removed from the receiving slot Sp, thereby facilitating maintenance of the jet plate 40 or adjusting the relative position between the mounting plate 40a and the jet plate 40.

[0150] In one example, two protrusions 61 are provided on the mounting plate 40 a , and two slots 62 are provided on the jet plate mounting member 60 . Of course, the number of the protrusions 61 and the slots 62 may be other numbers.

[0151] Figure 13 and Figure 14 In the figure, a groove is provided on the jet plate mounting member 60 and a protrusion 61 is provided on the mounting plate 40a. In other examples, a protrusion may be provided on the jet plate mounting member 60 and a slot may be provided on the mounting plate 40a.

[0152] In some embodiments, as Figure 3 As shown, the process tank body 10 is provided with a liquid circulation outlet V4, which is connected to the holding tank Sp. The electrochemical deposition apparatus further includes a filter screen 90 and a circulation assembly 92. The filter screen 90 is located at the liquid circulation outlet V4 and is used to filter the electroplating solution discharged from the holding tank Sp to the liquid circulation outlet V4. The edge of the filter screen 90 can be fixed to the inner surface of the side wall of the process tank body 10 using a pressure plate 91.

[0153] The inlet of the circulation component 92 is connected to the liquid circulation outlet V4, and the outlet of the circulation component 92 is connected to the first liquid inlet 401 of the spray plate 40. By disposing the circulation component 92, the circulation flow of the electroplating solution in the holding tank Sp can be achieved.

[0154] like Figure 3 As shown, the circulation component 92 may include: a first junction box 921 and a second junction box 922, the inlet of the first junction box 921 is connected to the liquid circulation outlet V4, the outlet of the first junction box 921 is connected to the inlet of the second junction box 922, and the outlet of the second junction box 922 can be connected through a pipe 923 (such as Figure 1 and Figure 2 ) is communicated with the second liquid inlet 42a of the spray plate 40, and further communicated with the first liquid inlet 401.

[0155] like Figure 3 As shown, the process tank body 10 may also be provided with a waste liquid port V6. After a certain period of electrochemical deposition process, the waste liquid port V6 may be opened to discharge the waste liquid in the holding tank Sp.

[0156] Figure 15 is a three-dimensional schematic diagram of a substrate carrier provided in some embodiments of the present disclosure, Figure 16 For the Figure 15 The cross-sectional view of the BB' line is as follows: Figure 15 As shown, the substrate carrier 30 includes a carrier plate 31 and a support plate 32. The carrier plate 31 has a first sub-carrying surface S11 and is provided with a hollow structure V5. The purpose of providing the hollow structure V5 is to reduce the overall weight of the substrate carrier 30 and facilitate the handling of the substrate carrier 30. The shape of the hollow structure V5 is not limited. For example, the hollow structure V5 can be a rectangular hole, a circular hole, or other irregularly shaped hole that passes through the carrier plate 31.

[0157] The support plate 32 covers the hollow structure V5 and has a second sub-carrying surface S12. The second sub-carrying surface S12 and the first sub-carrying surface S11 together form a carrying surface S1 for carrying the substrate to be coated. The thickness of the support plate 32 is less than that of the carrying plate 31.

[0158] The carrier plate 31 and the support plate 32 are both made of insulating materials, such as acrylic, polypropylene (PP), polymethyl methacrylate (PMMA), etc. The support plate 32 can be fixedly bonded to the support plate 32 by adhesive.

[0159] like Figure 15As shown, the substrate carrier 30 also includes: a conductive ring 33 and a pulling structure 35. The conductive ring 33 is arranged on the carrier plate 31 and surrounds the support plate 32. The pulling structure 35 is fixedly connected to the carrier plate 31. The substrate carrier 30 in the embodiment of the present disclosure can carry two substrates at the same time, so that the electrochemical deposition process can be performed on the two substrates at the same time, thereby improving the production effect. That is, the substrate carrier 30 has two carrying surfaces. At this time, the substrate carrier 30 includes a carrier plate 31 and two support plates 32, and conductive rings 33 are provided on opposite sides of the carrier plate 31.

[0160] like Figure 15 As shown, the lifting structure 35 includes: a lifting beam 353, and a first sealing plate 351 and a second sealing plate 352 arranged opposite to each other. The first sealing plate 351 and the second sealing plate 352 are respectively used to connect with two opposite surfaces of the carrier plate 31. The first sealing plate 351 and the second sealing plate 352 are components with the same shape, size and material. The first sealing plate 351 and the second sealing plate 352 can be fixedly connected to the carrier plate 31 by fasteners such as screws. The lifting beam 353 is arranged between the first sealing plate 351 and the second sealing plate 352, and is connected to the first sealing plate 351 and the second sealing plate 352. A first hanging ring 354 can be provided on the lifting beam 353. When the electrochemical deposition process is carried out, the first hanging ring 354 can be grabbed by a robot to place the substrate carrier 30 in the receiving tank Sp. After the electrochemical deposition process is completed, the first hanging ring 354 can be grabbed by a robot to take the substrate carrier 30 out of the receiving tank Sp.

[0161] In one example, the handle 353 , the first hanging ring 354 , the first closing plate 351 , and the second closing plate 352 may all be made of a relatively strong material, such as stainless steel.

[0162] like Figure 15 As shown, the substrate carrier 30 further includes a conductive block 36, which is disposed on the lifting structure 35 and electrically connected to the conductive ring 33. In one example, at least a portion of the conductive block 36 is located between the first sealing plate 351 and the second sealing plate 352, and is located at the end of the lifting beam 353. When the materials of the first sealing plate 351 and the second sealing plate 352 are both conductive materials, an insulating layer may be provided between the conductive block 36 and the first sealing plate 351, and between the conductive block 36 and the second sealing plate 352. In one example, as shown in FIG. Figure 15 As shown, a connector 34 may be further provided on the carrier plate 31. The connector 34 is located on one side of the conductive ring 33 near the handle 353 and may be integral with the conductive ring 33. The conductive block 36 may be electrically connected to the connector 34 via a conductive structure such as a wire or a flexible cable.

[0163] In one example, both the conductive block 36 and the conductive ring 33 can be made of copper with good conductivity.

[0164] When performing the electrochemical deposition process, the substrate is fixed on the supporting plate 31, and the seed layer on the substrate can be electrically connected to the conductive ring 33 using conductive tape or other conductive parts. In addition, the negative pole of the power supply is connected to the conductive block 36, so that the negative pole voltage provided by the power supply is transmitted to the conductive ring 33 via the conductive block 36, and then transmitted from the conductive ring 33 to the seed layer on the substrate.

[0165] In some embodiments, the conductive block 36 may be physically connected to the driving assembly 20 , so as to move under the control of the driving assembly 20 , thereby moving the entire substrate carrier 30 .

[0166] As described above, the driving assembly 20 includes a first displacement unit 21 and a second displacement unit 22, and the second displacement unit 22 includes a second slider 223; in this case, Figure 17 As shown, a limiting protrusion 2231 is provided on one of the conductive block 36 and the second slider 223, and a limiting groove is provided on the other. The limiting protrusion 2231 is located in the limiting groove, so that the movement of the second slider 223 drives the movement of the conductive block 36, and further drives the movement of the entire substrate carrier 30.

[0167] In one example, if Figure 17 As shown, a weight-reducing groove 36 a or a hollow structure is provided on the conductive block 36 to reduce the overall weight of the substrate carrier 30 .

[0168] like Figure 2 As shown, in some embodiments, the electrochemical deposition apparatus further includes an electrode structure 50, which is connected to the anode of the power supply, thereby forming an electric field between the electrode structure 50 and the substrate. As described above, the two sides of the substrate carrier 30 can simultaneously support two substrates. In this case, the electrochemical deposition apparatus can include two electrode structures 50, which are respectively disposed on opposite sides of the substrate carrier 30.

[0169] Figure 18 is a three-dimensional schematic diagram of an electrode structure provided in some embodiments of the present disclosure, Figure 19 This is a three-dimensional schematic diagram of the electrode structure provided in some embodiments of the present disclosure from another angle, such as Figure 18 and Figure 19 As shown, the electrode structure 50 includes a support frame 51 and at least one metal mesh structure 52 disposed on the support frame 51. The metal mesh structure 52 and the support frame 51 may both be made of titanium to reduce or prevent the support frame 51 from being corroded by the electroplating solution.

[0170] like Figure 18 and Figure 19As shown, the electrode structure 50 includes a metal mesh structure 52, and the support frame 51 includes a support frame 511. The edge of the metal mesh structure 52 is connected to the support frame 511. In addition, the support frame 51 may also include a support bar 512, and both ends of the support bar 512 are connected to the support frame 511.

[0171] In one example, an insulating protective layer (not shown) is provided on the support frame 511 and / or the support bars 512. For example, an insulating protective layer is provided on the support frame 511.

[0172] like Figure 18 and Figure 19 As shown, the electrode structure 50 may further include: a power supply unit 53 and a transmission unit 54, wherein the power supply unit 53 is used to load an electrical signal. Each metal mesh structure 52 is electrically connected to the power supply unit 53 via the transmission unit 54. For example, Figure 18 and Figure 19 As shown, the electrode structure 50 includes a metal mesh structure 52, which can be electrically connected to the power supply portion 53 via two transmission portions 54. For example, the transmission portion 54 extends along the depth direction of the receiving slot Sp, and the power supply portion 53 and the transmission portion 54 extend in a direction that intersects, for example, are perpendicular to each other.

[0173] In some embodiments, at least one of the power supply unit 53 and the transmission unit 54 includes a conductive body and a protective layer covering the conductive body, wherein the conductive body has a greater conductivity than the protective layer. The protective layer is used to prevent the conductive body from reacting with metal ions in the electroplating solution, and the protective layer is less reactive than the conductive body. For example, at least one of the power supply unit 53 and the transmission unit 54 may be a titanium-clad copper structure, wherein the conductive body is primarily composed of copper and the protective layer is primarily composed of titanium. For example, both the power supply unit 53 and the transmission unit 54 may be titanium-clad copper structures.

[0174] Figure 20 is a three-dimensional schematic diagram of an electrode structure 50 provided in some other embodiments of the present disclosure, Figure 20 The electrode structure 50 shown in FIG. Figure 18 、 Figure 19 Similarly, they all include a support frame 51, a metal mesh structure 52 arranged on the support frame 51, a power supply unit 53 and a transmission unit 54, and each metal mesh structure 52 is connected to the power supply unit 53 through the transmission unit 54. Figure 18 、 Figure 19 The difference is that in Figure 20 In the embodiment, the electrode structure 50 includes a plurality of metal mesh structures 52 , and different metal mesh structures 52 are insulated from each other. The support frame 51 includes a support portion 51 a electrically connected to each metal mesh structure 52 .

[0175] When the electrode structure 50 includes multiple metal mesh structures 52 , the voltages of different metal mesh structures 52 can be controlled separately, thereby improving the uniformity of the electric fields corresponding to the different metal mesh structures 52 and thus improving the uniformity of film formation on the substrate.

[0176] For example, during electrochemical deposition, the electrode structure 50 is prone to edge discharge, resulting in greater electric field strength at the edge than in the central region. To prevent this phenomenon, the multiple metal mesh structures 52 in the electrode structure 50 in the embodiment of the present disclosure may include: a central metal mesh structure 52a and at least one edge metal mesh structure 52b surrounding the central metal mesh structure 52a, wherein the central metal mesh structure 52a and the edge metal mesh structure 52b are separated by an insulating frame 581. By separately controlling the voltages of the central metal mesh structure 52a and the edge metal mesh structure 52b, the uniformity of film formation is improved.

[0177] exist Figure 20 In the embodiment, each support portion 51a can be made of titanium. An insulating protective layer can be provided on at least one support portion 51a. For example, the support portion 51a supporting the edge metal mesh structure 52b can be provided with an insulating protective layer. Furthermore, a protective cover can be provided on the transmission portion 54 connected to the central metal mesh structure 52a to prevent the transmission portion 54 from reacting with the plating solution.

[0178] In some embodiments, as Figures 18 to 20 As shown, a second hanging ring 56 is provided on the power supply part 53. When the electrochemical deposition process is performed, the second hanging ring 56 can be grabbed by a robot arm to place the substrate carrier 30 in the receiving tank Sp. After the electrochemical deposition process is completed, the second hanging ring 56 can be grabbed by a robot arm to remove the substrate carrier 30 from the receiving tank Sp.

[0179] In some embodiments, as Figure 20 As shown, the electrode structure 50 may further include a first reinforcement block 58 and a second reinforcement block 59. The first reinforcement block 58 is disposed on the power supply portion 53, and the second reinforcement block 59 may be connected to the transmission portion 54 corresponding to the different metal mesh structures 52. The first reinforcement block 58 and the second reinforcement block 59 may improve the structural stability of the electrode structure 50. Both the first reinforcement block 58 and the second reinforcement block 59 may be made of insulating material.

[0180] like Figure 3 As shown, the electrochemical deposition apparatus may further include an electrode mounting member 70, which is disposed on the inner wall of the process tank body 10. For example, the electrode mounting member 70 may be mounted on the inner wall of the process tank body 10 using fasteners such as screws. The fasteners used to mount the electrode mounting member 70 may be made of titanium or an organic material, such as polyetheretherketone (PEEK), to prevent corrosion by the electroplating solution.

[0181] Figure 21 This is a three-dimensional schematic diagram of an electrode mounting member provided in some embodiments of the present disclosure, such as Figures 18 to 21 As shown, the electrode mounting member 70 has a mounting groove 71, and the support frame 51 is further provided with a side wing 57, which is used to extend into the mounting groove 71, thereby locking the electrode structure 50 in the receiving groove Sp. The side wing 57 and the support frame 51 can be made of the same material.

[0182] The electrode mounting member 70 may be provided with a plurality of mounting slots 71 arranged along the normal direction of the support surface. During the electrochemical deposition process, the side wings 57 may be inserted into different mounting slots 71 according to specific process requirements, thereby adjusting the distance between the electrode structure and the substrate, and thereby adjusting the film thickness on the substrate.

[0183] In addition, each electrode structure 50 corresponds to two electrode mounting members 70 , and the two electrode mounting members 70 respectively fix the two ends of the electrode structure 50 to improve the arrangement stability of the electrode structure 50 in the receiving groove Sp.

[0184] Figure 22 A partial schematic diagram of an electrochemical deposition apparatus provided in some embodiments of the present disclosure, such as Figure 22 As shown, a third mounting member 72 is further provided on the inner wall of the process tank body 10. The third mounting member 72 can be provided on a side of the electrode mounting member 70 away from the bottom wall of the process tank body 10. A conductive portion 73 is fixed to the third mounting member 72 and is located on a side of the third mounting member 72 away from the bottom wall of the process tank body 10. The end of the power supply portion 53 of the electrode structure 50 is pressed against the conductive portion 73. The conductive portion 73 can be connected to the anode of a power supply, thereby transmitting the anode voltage to the electrode structure 50.

[0185] like Figure 22 As shown, in some embodiments, a toggle clamp 80 may be provided on the process tank body 10. The toggle clamp 80 may include: a fixed seat 81, a handle 82, and a pressing head 83. The fixed seat 81 is fixed to the side wall of the process tank body 10 and serves as a bearing component of the toggle clamp 80. The handle 82 is used to drive the pressing head 83 to move along the depth direction of the receiving tank Sp to press or move away from the power supply part 53. For example, the handle 82 includes an operating part 821 and a connecting rod part 822. The operating part 821 is used for the operator to hold, and the connecting rod part 822 is connected to the pressing head 83, and the connecting rod part 822 is rotatably connected to the fixed seat 81. By controlling the rise or fall of the operating part 821, the descent or rise of the pressing head 83 is controlled. When performing the electrochemical deposition process, the toggle clamp 80 can be used to further fix the electrode structure 50 to ensure the stability of the electrode structure 50 in the receiving tank Sp.

[0186] like Figure 22 As shown, a buffer pad 55 is provided on the surface of the power supply portion 53 facing the pressing head 83 , thereby buffering the pressure of the shaft clamp and preventing the instantaneous force of the shaft clamp from damaging the electrode structure 50 .

[0187] In the disclosed embodiment, each electrode structure 50 can correspond to two axis clamps. In addition, as described above, the substrate carrier 30 can simultaneously carry two substrates. In this case, two electrode structures 50 can be set in the receiving tank Sp, and the circulation components 92 are set on opposite sides of the process tank body 10.

[0188] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. An electrochemical deposition apparatus comprising: A process tank body having a receiving tank, wherein the receiving tank is used to receive the electroplating solution; A substrate carrier having a carrying surface, the carrying surface being used to carry the substrate to be coated, at least a portion of the substrate carrier being located in the receiving tank; at least one driving assembly, the driving assembly being disposed on the process tank and configured to control the substrate carrier to move along a first plane intersecting a normal direction of the carrying surface; The electrochemical deposition apparatus further comprises: a jet plate, the jet plate being detachably disposed in the receiving tank and comprising a receiving shell having a first receiving chamber, the receiving shell being provided with a first liquid inlet and a plurality of liquid outlets, the first liquid inlet and the liquid outlets being both in communication with the first receiving chamber, the liquid outlets being disposed toward the bearing surface; wherein the distance between the jet plate and the bearing surface is adjustable; The housing is further provided with a plurality of first mounting hole groups arranged along a first direction, each of the first mounting hole groups includes a plurality of first mounting holes arranged along a third direction; the third direction is a normal direction of the bearing surface; The electrochemical deposition apparatus further comprises: a mounting plate, wherein a plurality of second mounting hole groups are provided on the mounting plate, each of the second mounting hole groups includes a plurality of second mounting holes arranged along the third direction; the second mounting hole groups correspond one-to-one with the first mounting hole groups, and each second mounting hole is capable of being aligned with one of the first mounting holes; A plurality of fasteners, each of which can extend into a first mounting hole and a second mounting hole that are opposite to each other to fasten the accommodating shell and the mounting plate; Each first mounting hole group includes N first mounting holes, and the number of second mounting holes in each second mounting hole group is greater than or equal to N; N is an integer greater than 1; the spacing between two adjacent first mounting holes in the same first mounting hole group is equal to the spacing between two adjacent second mounting holes in the same second mounting hole group; the spacing between two adjacent first mounting hole groups is equal to the spacing between two adjacent second mounting hole groups; Some of the second mounting hole groups include N second mounting holes, and the remaining second mounting hole groups include N+1 second mounting holes, and the N second mounting holes and the N+1 second mounting holes are arranged alternately.

2. The electrochemical deposition apparatus according to claim 1, wherein: The drive assembly includes: Transmission adapter; a first displacement unit, the first displacement unit being arranged on the process tank body and being used to control the transmission adapter to move along a first direction; a second displacement unit, the second displacement unit being disposed on the transmission adapter and configured to control the substrate carrier to move along a second direction; The first direction intersects with the second direction, and both intersect with the normal direction of the bearing surface.

3. The electrochemical deposition apparatus according to claim 2, wherein: The first displacement unit includes: a first mounting member, wherein the first mounting member is provided with a first slideway extending along the first direction; a first slider, the first slider being arranged on the first slideway; a first motor, wherein a housing of the first motor is fixedly connected to the first mounting member, and a drive shaft of the first motor is connected to the first slider, for controlling the first slider to slide along the first slideway; Wherein, the transmission adapter is connected to the first sliding block.

4. The electrochemical deposition apparatus according to claim 2, wherein: The drive assembly further includes: A limiter is provided on the process tank body and is used to limit the movement range of the transmission adapter in the first direction.

5. The electrochemical deposition apparatus according to claim 2, wherein: The second displacement unit includes: a second mounting member, wherein the second mounting member is provided with a second slideway extending along the second direction; a second slider, the second slider being disposed on the second slideway; A second motor, a housing of the second motor is fixedly connected to the second mounting member, and a driving shaft of the second motor is connected to the second slider, for controlling the second slider to slide along the second slideway.

6. The electrochemical deposition apparatus according to claim 2, wherein: The process tank body comprises: A main tank body having the accommodating tank; A reinforcement structure, wherein the reinforcement structure is fixed around the main tank body; The first displacement unit is provided on the reinforcement structure, and an avoidance notch is provided on the side wall of the main slot body at a position corresponding to the first displacement unit.

7. The electrochemical deposition apparatus according to any one of claims 1 to 6, wherein: The electrochemical deposition equipment includes two driving assemblies, which are respectively located on opposite sides of the process tank.

8. The electrochemical deposition apparatus according to any one of claims 1 to 7, wherein: The electrochemical deposition equipment further includes a jet plate mounting member, wherein the jet plate mounting member is disposed on the inner wall of the process tank body; Wherein, one of the mounting plate and the jet plate mounting piece is provided with a protrusion, and the other is provided with a slot, and the protrusion is arranged in the slot.

9. The electrochemical deposition apparatus according to any one of claims 1 to 7, wherein: The accommodating shell includes: a first wall, a second wall arranged opposite to the first wall, and multiple side walls for connecting the first wall and the second wall, the first wall, the second wall and the multiple side walls form the first accommodating cavity; wherein the liquid outlet is arranged on the first wall, and the first mounting hole is arranged on the side wall.

10. The electrochemical deposition apparatus according to claim 9, wherein: The spray plate further includes: a plurality of liquid return pipes, the liquid return pipes passing through the first accommodating cavity, the inlets of the first liquid return pipes being arranged on the first wall, and the outlets of the liquid return pipes being arranged on the second wall; Wherein, a plurality of liquid outlets are arranged around the inlet of each liquid return pipeline.

11. The electrochemical deposition apparatus according to claim 10, wherein: For at least a portion of the liquid return pipelines, a center line connecting the plurality of liquid outlets around the liquid return pipelines forms a quadrilateral, a pentagon or a hexagon.

12. The electrochemical deposition apparatus according to claim 11, wherein: The jet plate also includes: at least one flow-uniform baffle located in the first accommodating chamber, the flow-uniform baffle divides the first accommodating chamber into a main chamber and at least one pressure-equalizing chamber, the first liquid inlet is connected to the pressure-equalizing chamber, the liquid outlet is connected to the main chamber, and a plurality of evenly distributed through holes are provided on the flow-uniform baffle, and the pressure-equalizing chamber is connected to the main chamber through the through holes on the flow-uniform baffle.

13. The electrochemical deposition apparatus according to claim 12, wherein: The jet plate also includes: a jet box arranged on the accommodating shell, the jet box having a second accommodating cavity, the second accommodating cavity being connected to the first accommodating cavity through the first liquid inlet; a second liquid inlet is provided on the jet box, the second liquid inlet is connected to the second accommodating cavity.

14. The electrochemical deposition apparatus according to claim 13, wherein: A sealing ring is provided between the jet box and the accommodating shell, and the sealing ring surrounds the first liquid inlet.

15. The electrochemical deposition apparatus according to any one of claims 1 to 7, wherein: The process tank body is provided with a liquid circulation outlet, and the liquid circulation outlet is communicated with the holding tank; The electrochemical deposition apparatus further comprises: a filter screen located at the liquid circulation outlet, the filter screen being used to filter the electroplating liquid discharged from the holding tank to the liquid circulation outlet; A circulation component, wherein the inlet of the circulation component is connected to the liquid circulation outlet, and the outlet of the circulation component is communicated with the first liquid inlet.

16. The electrochemical deposition apparatus according to any one of claims 1 to 7, wherein: The substrate carrier comprises: A carrying plate having a first sub-carrying surface, wherein a hollow structure is provided on the carrying plate; A support plate covering the hollow structure, wherein the support plate has a second sub-bearing surface, and the second sub-bearing surface and the first sub-bearing surface together constitute the bearing surface.

17. The electrochemical deposition apparatus according to claim 16, wherein: The substrate carrier further comprises: a conductive ring, disposed on the carrier plate and surrounding the support plate; A lifting structure, fixedly connected to the carrying plate; A conductive block is provided on the pulling structure and electrically connected to the conductive ring; the conductive block is connected to the driving assembly.

18. The electrochemical deposition apparatus according to claim 17, wherein: The driving assembly includes: a first displacement unit and a second displacement unit, wherein the second displacement unit includes a second slider; A limiting protrusion is provided on one of the conductive block and the second sliding block, and a limiting groove is provided on the other one, wherein the limiting protrusion is located in the limiting groove.

19. The electrochemical deposition apparatus according to claim 17, wherein: The pulling structure includes: a first sealing plate and a second sealing plate arranged opposite to each other, wherein the first sealing plate and the second sealing plate are respectively used to be connected to two opposite surfaces of the carrying plate; a handle, disposed between the first closing plate and the second closing plate and connected to the first closing plate and the second closing plate; Wherein, at least a portion of the conductive block is disposed between the first sealing plate and the second sealing plate.

20. The electrochemical deposition apparatus according to claim 19, wherein: An insulating layer is provided between the conductive block and the first sealing plate, and between the conductive block and the second sealing plate.

21. The electrochemical deposition apparatus according to any one of claims 1 to 7, wherein: The electrochemical deposition equipment further includes an electrode structure, which includes a support frame and at least one metal mesh structure arranged on the support frame.

22. The electrochemical deposition apparatus according to claim 21, wherein: The electrode structure includes a plurality of metal mesh structures, and the support frame includes a support portion electrically connected to each of the metal mesh structures.

23. The electrochemical deposition apparatus according to claim 21, wherein: The electrode structure further comprises: a power supply part and a transmission part, wherein the power supply part is used to load an electrical signal; each of the metal mesh structures is electrically connected to the power supply part via the transmission part; At least one of the power supply unit and the transmission unit includes a conductive body and a protection layer covering the conductive body, wherein the conductivity of the conductive body is greater than the conductivity of the protection layer.

24. The electrochemical deposition apparatus according to claim 23, wherein: The electrochemical deposition apparatus further comprises: a third mounting member, arranged on the inner wall of the process tank; The conductive part is fixed on the third mounting member and is located on a side of the third mounting member away from the bottom wall of the process tank body; wherein the end of the power supply part is pressed onto the conductive part.

25. The electrochemical deposition apparatus according to claim 23, wherein: The electrochemical deposition apparatus further comprises: A toggle clamp is provided on the process tank body, the toggle clamp comprising a handle and a pressing head, the handle being used to drive the pressing head to move along the depth direction of the receiving tank to press or move away from the electrification part; Wherein, a buffer pad is provided on the surface of the electrification part facing the pressing head.

26. The electrochemical deposition apparatus according to claim 21, wherein The electrochemical deposition equipment further includes: an electrode mounting member having a mounting groove, wherein the electrode mounting member is arranged on the inner wall of the process tank body; The support frame is also provided with side wings, and the side wings are used to extend into the installation groove.

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