Color filters and their manufacturing methods, display panels

Abstract

This application discloses a color filter and its manufacturing method, as well as a display panel. The color filter includes: a substrate; a first color resist and a second color resist formed on the substrate and spaced apart from each other; a third color resist formed on the surface of the substrate away from the first and second color resists; and a planarization layer formed on the surfaces of the first and second color resists; wherein the surface of the third color resist and the surface of the planarization layer are on the same horizontal plane. By using a color resist layer instead of a planarization layer to achieve planarization, the process flow is simplified, and the panel thickness is reduced.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to color filters and their manufacturing methods, and display panels. Background Technology

[0002] In the field of display technology, liquid crystal displays (LCDs) are widely used in various electronic devices due to their advantages such as thinness, low power consumption, and no radiation. The main components of an LCD include the liquid crystal panel, backlight, and driving circuitry. The liquid crystal panel is the core of the LCD, consisting of two glass substrates and a liquid crystal layer sandwiched between them. To ensure the alignment of the liquid crystal molecules, an alignment film needs to be fabricated on the glass substrates. Furthermore, to achieve color display, color filters need to be fabricated on the glass substrates. In the field of optical materials, color filters typically consist of resist layers of three colors: red (R), green (G), and blue (B). These resist layers are fabricated on the glass substrate using photolithography to form specific patterns, thereby achieving color display.

[0003] However, traditional color filter manufacturing processes often require the use of an organic overlay (OC layer) to achieve planarization, which increases the complexity and cost of the process. In thin film fabrication technology, spin coating is a commonly used method. It involves rotating a substrate at high speed, causing liquid coating material to be uniformly applied onto the substrate under centrifugal force. However, this method often results in uneven thickness when fabricating large-area films with high uniformity requirements.

[0004] Existing solutions primarily involve using an organic overlay (OC layer) to achieve planarization. While this method achieves planarization, it presents several challenges: First, the OC layer requires additional process steps, increasing complexity and cost. Second, the OC layer increases panel thickness, hindering thinner and lighter designs. Finally, the OC layer can affect the optical performance of the color resist layer, potentially impacting display quality. Summary of the Invention

[0005] The main technical problem solved by this application is to provide a color filter and its manufacturing method, and a display panel. By using a color resist layer instead of a planarization layer to achieve planarization, the production of the planarization layer is eliminated, reducing one process and saving material consumption. At the same time, the entire panel can be made thinner at the design level.

[0006] To address the aforementioned problems, a first aspect of this application provides a color filter, comprising: a substrate; a first color resist and a second color resist formed on the substrate and spaced apart from each other; a third color resist formed on a surface of the substrate away from the first and second color resists, and a planarization layer formed on the surfaces of the first and second color resists; wherein the surface of the third color resist and the surface of the planarization layer are located on the same horizontal plane.

[0007] In one specific embodiment, the planarization layer is at least partially the same material as the third color resist.

[0008] In one specific embodiment, the third color resist is formed by UV curing of a third color resist agent; wherein the third color resist agent comprises third color resist molecules.

[0009] In one specific embodiment, the planarization layer is formed by curing the third color resist agent to which third color resist molecules have been precipitated.

[0010] In one specific embodiment, the third photoresist comprises 20-40 wt% of a polymer resin, 10-20 wt% of a pigment, 2-3 wt% of a photoinitiator, 0.1-0.5 wt% of a crosslinking agent, and 40-60 wt% of a solvent; wherein the third photoresist molecule is the photoinitiator; the photoinitiator includes bis-(p-methoxyphenyl)copper, spiropyran, and spirooxazine.

[0011] To address the aforementioned problems, a second aspect of this application provides a method for manufacturing a color filter. The method includes: providing a substrate; wherein a first color resist and a second color resist are formed on the substrate; coating the surface of the substrate with a third photoresist; wherein the third photoresist covers the surfaces of the first and second color resists; pre-curing the third photoresist to obtain a semi-cured third photoresist; curing the third photoresist at a location on the substrate away from the first and second color resists to form a third color resist; and precipitating third color resist molecules in the third photoresist covering the surfaces of the first and second color resists; removing the precipitated third color resist molecules from the surface of the third photoresist to obtain a color filter with a smooth surface.

[0012] In one specific embodiment, after the step of removing the third color resist molecules precipitated onto the surface of the third photoresist, the method further includes: curing the third photoresist from which the third color resist molecules have been precipitated to form a flat layer covering the surfaces of the first and second color resists, thereby obtaining a color filter with a smooth surface.

[0013] In one specific embodiment, the thickness of the third color resist is greater than the thickness of the first color resist and the thickness of the second color resist; the sum of the thicknesses of the first color resist and the planarization layer, and the sum of the thicknesses of the second color resist and the planarization layer, are all equal to the thickness of the third color resist, so that the surface of the third color resist and the surface of the planarization layer are on the same horizontal plane.

[0014] In one specific embodiment, the third photoresist comprises 20-40 wt% of a polymer resin, 10-20 wt% of a pigment, 2-3 wt% of a small molecule photoinitiator, 0.1-0.5 wt% of a crosslinking agent, and 40-60 wt% of a solvent; wherein the third photoresist molecule is the photoinitiator; the photoinitiator includes bis-(p-methoxyphenyl)copper, spiropyran, and spirooxazine.

[0015] In one specific embodiment, the step of curing the third photoresist located on the substrate away from the first and second photoresist locations to form a third photoresist, and causing the third photoresist molecules in the third photoresist covering the surfaces of the first and second photoresist to precipitate, includes: shielding the third photoresist located on the surfaces of the first and second photoresist locations, and exposing at least a portion of the third photoresist located away from the first and second photoresist locations; and subjecting the exposed third photoresist to ultraviolet light curing treatment to obtain the third photoresist.

[0016] In one specific embodiment, after the step of performing ultraviolet light curing treatment on the exposed third photoresist to obtain the third color resist, the method further includes: performing a precipitation treatment on the third photoresist located on the surfaces of the first color resist and the second color resist, so that the third color resist molecules are precipitated onto the surface of the third photoresist.

[0017] In one specific embodiment, the step of pre-curing the third photoresist to obtain a semi-cured third photoresist includes: placing the third photoresist at a first temperature and baking it for a first predetermined time to obtain a semi-cured third photoresist; the step of curing the third photoresist with precipitated third color resist molecules to form a planar layer covering the surfaces of the first color resist and the second color resist includes: placing the third photoresist with precipitated third color resist molecules at a second temperature and baking it for a second predetermined time to completely cure the third photoresist; wherein the second temperature is greater than the first temperature, and / or the second predetermined time is greater than the first predetermined time.

[0018] To address the aforementioned issues, a third aspect of this application provides a display panel comprising an array substrate, a color filter substrate, and a liquid crystal layer disposed between the array substrate and the color filter substrate, wherein a color filter as described in any embodiment of the first aspect is formed on the array substrate or the color filter substrate.

[0019] The beneficial effects of this application are: by first forming a first color filter and a second color filter on the substrate, and then forming a third color filter and a planarization layer on the substrate respectively, the surfaces of the third color filter and the planarization layer are located on the same horizontal plane, thereby saving the need to make a thicker planarization layer on the surface of the first color filter, the second color filter and the third color filter. This not only results in a color filter with a flat surface, but also reduces the manufacturing process, saves materials, reduces costs, and makes the entire panel thinner. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of an embodiment of the color filter of this application;

[0022] Figure 2 This is a schematic flowchart illustrating an embodiment of the method for manufacturing a color filter according to this application;

[0023] Figure 3 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S11;

[0024] Figure 4 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S12;

[0025] Figure 5 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S13;

[0026] Figure 6 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S14;

[0027] Figure 7 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S15;

[0028] Figure 8 This is a schematic diagram of the structure of a specific embodiment of the display panel of this application.

[0029] 10 Substrate; 11 First color resist; 12 Second color resist; 13 Third color resist; 101 Planarization layer; BM Black matrix. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless otherwise clearly indicated above. “Multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0032] It should be understood that the term "and / or" used herein is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0033] It should be understood that the terms "comprising," "including," or any other variations used herein are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0034] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0035] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in every place in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0036] This application provides a color filter; please refer to further details for its structure. Figure 1 , Figure 1 This is a schematic diagram of the structure of an embodiment of the color filter of this application. Figure 1 As shown, the color filter includes a substrate 10, on the surface of which are formed spaced-apart first color resists 11, second color resists 12, and third color resists 13. The first color resists 11, second color resists 12, and third color resists 13 are different colors. The colors shown in the figure do not indicate that the first color resists 11, second color resists 12, and third color resists 13 are fixed colors, but only that they are different colors. The surfaces of the first color resists 11 and second color resists 12 are also covered with a planarization layer 101 that is flush with (i.e., of equal thickness) the surface of the third color resist 13; that is, the surface of the third color resist 13 and the surface of the planarization layer 101 are on the same horizontal plane.

[0037] The planarization layer 101 and the third photoresist 13 are at least partially the same material. Specifically, the third photoresist 13 is formed by UV curing of a third photoresist agent. The third photoresist agent comprises third photoresist molecules. The planarization layer 101 is formed by curing a third photoresist agent with at least some third photoresist molecules precipitated, preferably by curing a third photoresist agent with all third photoresist molecules precipitated. Preferably, the planarization layer 101 is cured by thermosetting to minimize the risk of discoloration of residual third photoresist molecules during UV curing.

[0038] Because some third color resist molecules may not precipitate in planarization layer 101, when the third color resist 13 is a blue color resist, planarization layer 101 may be light blue. This is because after the B color resist is coated across the entire surface, it is pre-baked and semi-cured. Some of the chromophores of the photosensitizer combine with the polymer resin, resulting in permanent color change and forming a semi-cured color resist B', thus forming a light blue layer. Then, the third display area is exposed to excite most of the photosensitizer and combine with the resin to form the B color resist. Finally, after subsequent high-temperature baking, most of the unused photosensitizer remaining in the B' portion evaporates. Among them, planarization layer 101 is the B' color resist.

[0039] In one specific embodiment, a black matrix BM is provided in the phase-separated regions of the first color resist 11, the second color resist 12, and the third color resist 13 of the substrate 10 to absorb mixed light. In other embodiments, the black matrix BM may not be provided.

[0040] In this embodiment, the planarization layer 101 also covers the spacer area between the first color filter 11, the second color filter 12 and the third color filter 13, forming a color filter with a flat surface.

[0041] In other embodiments, a planarization layer is fabricated on the surfaces of the substrate 10 and the first color resist 11, the second color resist 12, and the third color resist 13. In this embodiment, the planarization layer 101 covers the entire surface of the color resist layer. Compared to the prior art, which involves fabricating a planarization layer on the surfaces of the first color resist 11, the second color resist 12, and the third color resist 13, increasing the thickness and requiring at least one more processing step, this application reduces the processing steps and thickness by using a non-photocurable third color resist layer instead of the second planarization layer to cover the surfaces of the first and second color resists 11 and 12.

[0042] The sum of the thickness of the first color resist 11 and the planarization layer 101 on its surface is equal to the thickness of the third color resist 13, and the sum of the thickness of the second color resist 12 and the planarization layer 101 on its surface is equal to the thickness of the third color resist 13. The thicknesses of the first color resist 11 and the second color resist 12 may be different or the same, and are not limited here.

[0043] This application provides a method for manufacturing a color filter. For details, please refer to [link to details]. Figure 2 , Figure 2 This is a schematic flowchart illustrating an embodiment of the method for manufacturing the color filter according to this application. Figure 2 As shown, the manufacturing method includes:

[0044] Step S11: Provide a substrate.

[0045] The substrate can be either an array substrate or a color filter substrate. That is, the color resist layer can be fabricated on either the array substrate or the color filter substrate.

[0046] In this specific embodiment, a first color resist and a second color resist have been formed on the substrate. The first color resist and the second color resist are first color resist layers and second color resist layers, and are disposed on the substrate surface at intervals.

[0047] Specifically, the substrate surface includes at least a first display area, a second display area, and a third display area spaced apart. This step specifically includes: coating a first photoresist onto the first display area of ​​the substrate and curing the first photoresist to obtain a first color resist; coating a second photoresist onto the second display area of ​​the substrate and curing the second photoresist to obtain a second color resist. The first photoresist is a coating agent that can form the first color resist after curing, and the second photoresist is a coating agent that can form the second color resist after curing. The first and second color resists are color resist layers of different colors, used to transmit different colors of light. Curing includes, but is not limited to, ultraviolet light curing.

[0048] In this embodiment, the first color resist, the second color resist, and the third color resist can also be referred to as the first color resist layer, the second color resist layer, and the third color resist layer.

[0049] For more details, please refer to the following: Figure 3 , Figure 3 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S11. Figure 3 As shown, a first color resist 11 and a second color resist 12 are formed on the substrate 10 at intervals.

[0050] Step S12: Coat the surface of the substrate with a third photoresist.

[0051] This step includes uniformly coating the entire surface of the substrate with a third photoresist. This ensures the third photoresist covers the surfaces of the first and second color resists, the spacer area between the first and second color resists, and the third display area of ​​the substrate. It should be noted that the first, second, and third display areas each comprise multiple areas, corresponding to the light-emitting areas of the first, second, and third sub-pixels, respectively.

[0052] For details, please refer to further information. Figure 4 , Figure 4 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S12. (See diagram below.) Figure 4 As shown in Figure a, a third photoresist 103 is uniformly coated on the entire surface of the substrate 10. The third photoresist 103 covers the surfaces of the first color resist 11 and the second color resist 12, as well as the gap between the first color resist 11 and the second color resist 12. At this time, the third photoresist 103 is not exposed to light and is a colorless / transparent liquid. For a detailed principle structure, please refer to [link / reference needed]. Figure 4As shown in Figure b, the B-color resist pigment (third photoresist) comprises a photosensitizer (photoinitiator), resin, solution, crosslinking agent, and other additives. The photosensitizer is a small molecule reagent such as bis-(p-methoxyphenyl)copper, spiropyran, or spirooxazine, which changes color upon gaining energy through exposure to light or heat. The resin is a third-color resist resin, which cures under the influence of other additives and temperature and light.

[0053] Step S13: Pre-cur the third photoresist to obtain a semi-cured third photoresist.

[0054] Specifically, this includes placing a substrate coated with a third photoresist at a first temperature and baking it for a first predetermined time to semi-cur the third photoresist, thereby semi-curing it. In this specific embodiment, the third photoresist is semi-cured by high-temperature baking. In other embodiments, the third photoresist may be semi-cured by other methods, which are not limited here.

[0055] For details, please refer to further information. Figure 5 , Figure 5 for Figure 2 A structural schematic diagram of a specific embodiment of step S13. (See diagram below.) Figure 5 As shown in Figure a, the third photoresist 103 on the substrate 10 is pre-cured so that the third photoresist 103 covers the surfaces of the first color resist 11 and the second color resist 12, as well as the surface of the substrate 10 of the third display area. The third photoresist 103 is also disposed at the gap between the first color resist 11 and the second color resist 12. The B-color resist pigment contains a photosensitizer, resin, solution, crosslinking agent, and other additives. The photosensitizer is a small molecule reagent such as bis-(p-methoxyphenyl)copper, spiropyran, or spirooxazine, which changes color after gaining energy upon contact with light or heat. The resin is a B-color resist resin, which is cured under the action of other additives and temperature and light. At this time, the third photoresist 103 changes from a transparent viscous liquid to a slightly blue gel-like solid under light. For the specific reaction principle and structure, please refer to further details. Figure 5 As shown in Figure b, after a pre-baking process, the resin in the third color resist is grafted with photosensitizers and crosslinking agents. At this point, most of the photosensitizers remain uniformly dispersed in the color resist without change, while a small portion of the photosensitizers gain energy and change color upon heating, simultaneously becoming chemically active and grafted into the third color resist resin. The color resist then transforms from a transparent, viscous liquid into a slightly bluish, gel-like solid.

[0056] Step S14: The third photoresist at the position of the substrate away from the first and second photoresist is cured to form the third photoresist, and the third photoresist molecules in the third photoresist covering the surfaces of the first and second photoresist are precipitated.

[0057] This step includes: performing a full curing process on the third photoresist in the third display area of ​​the substrate, so that the photosensitive agent in the third photoresist is excited and combines with the resin, thereby curing to form the third color resist layer.

[0058] This step specifically includes: shielding the third photoresist located on the surfaces of the first and second color resists, and exposing at least the portion of the third photoresist located away from the first and second color resists, i.e., exposing the third photoresist in the third display area, to facilitate the formation of the third color resist in the third display area. The exposed third photoresist is then cured using ultraviolet light to obtain the third color resist. In other words, the third photoresist located in the third display area is cured. In one specific embodiment, a photomask can be used to partially shield the third photoresist. In other embodiments, a light-absorbing dry film can also be used to partially shield the third photoresist; this is not limited here.

[0059] Please refer to further details. Figure 6 , Figure 6 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S14 is shown below. Figure 6 As shown in Figure a, a photomask or mask 20 is disposed on the surface of the third photoresist 13 at least on the surfaces of the first color resist 11 and the second color resist 12, so as to at least block the third photoresist 13 on the surfaces of the first color resist 11 and the second color resist 12, and at least expose the third photoresist 13 in the third display area, and illuminate the third photoresist 13 in the third display area so that the third photoresist 13 forms the third color resist 13. Furthermore, the third photoresist 13 between the first color resist 11 and the second color resist 12 can also be illuminated, and the formed third color resist 13 can filter the mixed light between the first color resist 11 and the second color resist 12. In other embodiments, only the third photoresist 13 in the third display area may be exposed, which is not limited here. For a detailed description of the reaction principle and structure, please refer to the relevant documentation. Figure 6 As shown in Figure b, under the action of the photomask, some areas are translucent. At this time, most of the photosensitizers and crosslinking agents in the illuminated areas gain energy from the light radiation, increasing their activity and causing the degree of crosslinking of the resin in this part to increase, turning it into a dark blue hard block (the third color resist is blue). Other parts, due to the lack of light stimulation, do not change in color or hardness, but the photosensitizers there will precipitate in the resin due to compatibility issues, accumulating in greater quantities on the resin surface.

[0060] This step also includes: precipitating the third color resist molecules in the third photoresist covering the surfaces of the first and second color resists. Specifically, precipitation can be performed before curing the third photoresist, simultaneously with curing, or after curing. Preferably, while curing the third color resist molecules in the third photoresist, some of the blocked third color resist molecules will slowly precipitate due to incompatibility. After curing the third photoresist, to further accelerate the precipitation of the third color resist molecules on the surfaces of the first and second color resists, further technical means can be used to accelerate the precipitation of the third color resist molecules. Specifically, the precipitation of the third color resist molecules can be induced by a chemical reagent that is polarly attracted to or compatible with the third color resist molecules, causing the third color resist molecules to precipitate onto the surface of the third photoresist.

[0061] Step S15: Remove the third color resist molecules that have precipitated onto the surface of the third photoresist to obtain a color filter with a smooth surface.

[0062] This step specifically includes: removing the third color resist molecules from the surface of the third photoresist using a chemical etching process. Because the photosensitizer in the third photoresist is incompatible with the resin matrix, the photosensitizer precipitates onto the resin layer surface and can be removed by etching. The etching can be a full-surface etching process, where the entire resin surface is etched away, removing excess photosensitizer while simultaneously obtaining a stable and flat color resist layer.

[0063] This step further includes: further curing the third photoresist with the precipitated third color resist molecules to form a planar layer covering the surfaces of the first and second color resists, thereby obtaining a color filter with a smooth surface. Specifically, this includes: placing the third photoresist with the precipitated third color resist molecules at a second temperature for a second predetermined time to allow the third photoresist to completely cure and form a resin layer, which is also a planar layer. The second temperature is higher than the first temperature, and / or the second predetermined time is greater than the first predetermined time. Preferably, the first temperature is 80 degrees Celsius, the second temperature is 200 degrees Celsius, the first predetermined time is 30 minutes, and the second predetermined time is 60 minutes, but this is not limited. In other embodiments, the first temperature may be higher than the second temperature, and the second predetermined time may be much longer than the first predetermined time, for example, baking at 200 degrees Celsius for 1 minute for fixation, etc., but this is not limited.

[0064] It should be noted that the third photoresist that precipitates the third color resist molecules is a nearly transparent resin layer, and the resin layer is cured to form a smooth surface.

[0065] Please refer to further details. Figure 7 , Figure 7 for Figure 2 A schematic diagram of the structure of a specific embodiment of step S15 is shown below. Figure 7As shown in Figure a, the photomask or mask on the surface of the third photoresist 103 is etched, thereby simultaneously removing the third color resist molecules on the surface of the third photoresist, thus transforming the third photoresist 103 into a planarization layer 101. For the specific reaction principle and structure, please refer to [reference needed]. Figure 7 As shown in Figure b, the entire resin surface is etched under the action of etching, and excess photosensitizer is released, thereby obtaining a stable and flat color resist layer.

[0066] This application also provides a third photoresist, comprising 20-40 wt% (by weight) polymer resin, 10-20 wt% pigment, 2-3 wt% small molecule photoinitiator (also known as photosensitizer), 0.1-0.5 wt% crosslinking agent, and 40-60 wt% solvent. The photoinitiator is a third color-blocking molecule in the third photoresist, which is a small molecule that has undergone (grinding) treatment and can permanently change color under ultraviolet light irradiation. It should be noted that processing it into a small molecule allows for better compatibility with the other solvents in the third photoresist. This small molecule photoinitiator, due to its high polarity, can precipitate within the photoresist. Because this photoresist contains a photoinitiator, it is itself a colorless or other colored color resist, but changes color upon contact with light, forming a colored third color resist. Specifically, the photoinitiator can be bis-(p-methoxyphenyl)copper, spiropyran, spirooxazine, etc.

[0067] It should be noted that the above-described proportions of the components of the third photoresist are a preferred embodiment and not a limitation. It is understood that the third photoresist can also have other proportions, but the above proportions are optimal, satisfying the requirements of the third photoresist while allowing a large amount of uncured third photoresist molecules to precipitate, thereby forming a nearly transparent resin layer. This resin layer replaces the planarization layer, thus saving materials and processes.

[0068] In one specific embodiment, the third color resist is a blue color resist, and the first and second color resists are either red or green color resists. When the first color resist is red, the second color resist is green; when the first color resist is green, the second color resist is red. In other embodiments, the third color resist can also be red or green, and this is not limited thereto. It should be noted that the third color resist is preferably a blue color resist because blue color resists, due to the influence of human eye sensitivity, require a larger aperture ratio or a higher thickness.

[0069] In this embodiment, the thickness of the third photoresist is greater than the thickness of the first photoresist and also greater than the thickness of the second photoresist. The sum of the thickness of the first photoresist and the thickness of the third photoresist formed on its surface equals the thickness of the third photoresist, and the sum of the thickness of the second photoresist and the thickness of the third photoresist formed on its surface also equals the thickness of the third photoresist, thus forming a photoresist layer of equal thickness. Therefore, it is unnecessary to fabricate an OC layer on the surfaces of the first, second, and third photoresists.

[0070] Furthermore, when the first color resist, the second color resist, and the third color resist are formed on the color filter substrate, before step S11, a black matrix layer is further formed on the substrate. The black matrix layer is disposed at intervals between each display area, that is, at the non-light-emitting areas of the corresponding sub-pixels; no specific limitation is made here.

[0071] This application also provides a display panel, for details please refer to further reading. Figure 8 , Figure 8 This is a schematic diagram of the structure of a specific embodiment of the display panel of this application. Figure 8 As shown, the display panel includes: an array substrate 100, a color filter substrate 200, and a liquid crystal layer 300 located between the array substrate 100 and the color filter substrate 200. A first transparent electrode 110 is disposed on the side of the array substrate 100 near the liquid crystal layer 300, and a second transparent electrode 210 is disposed on the side of the color filter substrate 200 near the liquid crystal layer 300. A color filter can be disposed on the array substrate 100 or the color filter substrate 200. Specifically, the color filter is disposed on the side of the first transparent electrode 110 or the second transparent electrode 210 away from the liquid crystal layer 300, as shown in the diagram. Figure 8 The layer is indicated by the dashed line.

[0072] The beneficial effects of this embodiment are: by using an RGB color resist layer to replace the OC layer to achieve planarization, a process is reduced at the manufacturing level, thereby saving material consumption and reducing costs. At the same time, the entire panel can be made thinner at the design level.

[0073] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A color filter, characterized in that, The color filter includes: substrate; A first color resist and a second color resist are formed on the substrate and are spaced apart from each other; A third color filter is formed on the surface of the substrate away from the first and second color filters, and a planarization layer is formed on the surfaces of the first and second color filters; wherein the surface of the third color filter and the surface of the planarization layer are located on the same horizontal plane, and the planarization layer also covers the gap between the first color filter, the second color filter and the third color filter, forming a color filter with a completely flat surface; the planarization layer and the third color filter are at least partially the same material; the third color filter is formed by UV curing of a third color resist agent, the third color resist agent comprising third color resist molecules; the planarization layer is formed by curing a third color resist agent from which the third color resist molecules have been precipitated.

2. The color filter according to claim 1, characterized in that, The third color resist comprises 20-40 wt% polymer resin, 10-20 wt% pigment, 2-3 wt% photoinitiator, 0.1-0.5 wt% crosslinking agent, and 40-60 wt% solvent; wherein the third color resist molecule is the photoinitiator; the photoinitiator includes bis-(p-methoxyphenyl)copper, spiropyran, and spirooxazine.

3. A method for manufacturing a color filter, characterized in that, The method for manufacturing the color filter includes: A substrate is provided; wherein a first color resist and a second color resist are formed on the substrate; A third photoresist is uniformly coated on the entire surface of the substrate; wherein the third photoresist covers the surfaces of the first and second color resists. The third photoresist is pre-cured to obtain a semi-cured third photoresist; The third photoresist located on the substrate away from the first and second photoresist is cured to form the third photoresist, and the third photoresist molecules in the third photoresist covering the surfaces of the first and second photoresist are precipitated. The third color resist molecules precipitated onto the surface of the third photoresist are removed, and the third photoresist on which the third color resist molecules precipitated is cured to form a flat layer covering the surfaces of the first color resist and the second color resist. The flat layer also covers the gap between the first color resist, the second color resist and the third color resist, forming a color filter with a flat surface.

4. The method for manufacturing a color filter according to claim 3, characterized in that, The thickness of the third color resist is greater than the thickness of the first color resist and the thickness of the second color resist; the sum of the thickness of the first color resist and the thickness of the planarization layer, as well as the sum of the thickness of the second color resist and the thickness of the planarization layer, are all equal to the thickness of the third color resist, so that the surface of the third color resist and the surface of the planarization layer are on the same horizontal plane.

5. The method for manufacturing a color filter according to claim 3, characterized in that, The step of curing the third photoresist at a position on the substrate away from the first and second photoresists to form a third photoresist, and precipitating the third photoresist molecules in the third photoresist covering the surfaces of the first and second photoresists, includes: The third photoresist located on the surfaces of the first and second color resists is shielded, and at least a portion of the third photoresist located away from the first and second color resists is exposed. The exposed third photoresist is subjected to ultraviolet light curing treatment to obtain the third color resist.

6. The method for manufacturing a color filter according to claim 5, characterized in that, After the step of performing ultraviolet curing treatment on the exposed third photoresist to obtain the third color resist, the method further includes: The third photoresist located on the surfaces of the first and second photoresist is subjected to a precipitation treatment so that the third photoresist molecules are precipitated onto the surface of the third photoresist.

7. The method for manufacturing a color filter according to claim 3, characterized in that, The step of pre-curing the third photoresist to obtain a semi-cured third photoresist includes: The third photoresist is placed at a first temperature and baked for a first predetermined time to obtain a semi-cured third photoresist; The step of curing the third photoresist from which the third color resist molecules are precipitated to form a planar layer covering the surfaces of the first and second color resists includes: The third photoresist, from which the third color resist molecules are precipitated, is placed at a second temperature and baked for a second predetermined time to allow the third photoresist to fully cure. Wherein, the second temperature is greater than the first temperature, and / or the second predetermined time is greater than the first predetermined time.

8. A display panel, characterized in that, The display panel includes an array substrate and a color filter substrate, and a liquid crystal layer disposed between the array substrate and the color filter substrate, wherein a color filter as described in any one of claims 1 to 2 is formed on the array substrate or the color filter substrate.

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