Conductive foam and method of making the same, electronic device

Abstract

The application provides a conductive foam, a manufacturing method thereof and an electronic device, and relates to the technical field of electronic communication. The conductive foam is applied to the electronic device. The conductive foam comprises: a foam base body having at least one through hole; a conductive layer comprising a first sub-conductive layer and a second sub-conductive layer, the first sub-conductive layer covering at least a first surface of the foam base body, the first surface being used for electrically connecting with a first structure in the electronic device through the first sub-conductive layer, and the second sub-conductive layer being arranged in at least part of the through hole; wherein the first sub-conductive layer and the second sub-conductive layer are connected, and at least one of the first sub-conductive layer and the second sub-conductive layer comprises a conductive paste layer and is used for deforming under the action of external pressure. Thus, the conductive foam with conductivity and low working height in the first direction can be provided. When the conductive foam is applied to the electronic device, the thickness of the electronic device can be reduced, and radiation stray interference and the like can be reduced or eliminated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic communication, and in particular to a conductive foam, a manufacturing method thereof, and an electronic device. BACKGROUND

[0002] With the continuous development of mobile communication technology, the internal structure of electronic devices is becoming more and more complex, and the integration is becoming higher and higher. For example, taking a mobile phone as an example, the high integration of components included in the mobile phone makes the thickness of the mobile phone thinner and thinner. In this way, the distance between adjacent components in the thickness direction of the mobile phone becomes smaller and smaller. In this case, how to reduce radiated spurious emission (RSE) and how to avoid signal interference between adjacent components are particularly important.

[0003] In related technologies, foam is often provided in electronic devices to reduce radiated spurious emission, conduct electricity, prevent static electricity, and the like. However, the current foam cannot achieve a low working height, which leads to the fact that the electronic device cannot be made ultra-thin when the foam is applied to the electronic device.

[0004] Therefore, a new solution is urgently needed to solve the above problems. SUMMARY

[0005] Embodiments of the present application provide a conductive foam, a manufacturing method thereof, and an electronic device. The conductive foam has both conductivity and good compression or stretching, can achieve a low working height in a first direction, and can also have a large contact area with a structure in the electronic device.

[0006] To achieve the above object, the present application adopts the following technical solutions:

[0007] In a first aspect, the present application provides a conductive foam applied to an electronic device, the conductive foam comprising:

[0008] a foam base having at least one through hole;

[0009] a conductive layer comprising a first sub-conductive layer and a second sub-conductive layer, the first sub-conductive layer covering at least a first surface of the foam base, the first surface being configured to be electrically connected to a first structure in the electronic device through the first sub-conductive layer, and the second sub-conductive layer being arranged in at least part of the through hole;

[0010] wherein the first sub-conductive layer and the second sub-conductive layer are connected, and at least one of the first sub-conductive layer and the second sub-conductive layer comprises a conductive paste layer and is configured to be deformed under external pressure.

[0011] The conductive foam provided by the embodiments of the present application has the following advantages. On the one hand, the first sub-conductive layer covering at least the first surface of the foam substrate and the second sub-conductive layer located in the through hole of the foam substrate both have certain ductility, good conductivity, and large resistivity (10 -5 -10 -4 Ω×cm), and the second sub-conductive layer located in the through hole is connected with the first sub-conductive layer, so that the thickness of the first sub-conductive layer in the first direction can be further reduced. Meanwhile, at least one of the first sub-conductive layer and the second sub-conductive layer includes a conductive paste layer, the conductive paste in the conductive paste layer is in a liquid state before film formation, and the volume of the conductive paste is reduced during solidification, so that the conductive foam can exhibit good conductivity and can be deformed under the action of external pressure and has a low working height in the first direction. On the other hand, the foam substrate has elasticity, so that the conductive foam can be easily compressed or stretched, and the working height in the first direction is further reduced, for example, the working height of the conductive foam in the first direction can be 0.1-0.2 mm. On the other hand, the contact area of the conductive foam with the structure in the electronic device can be large, for example, the contact area can reach 70% or more.

[0012] In a possible implementation manner of the first aspect, the conductive paste layer includes a paste body and a plurality of connected conductive particles, and the conductive particles are doped in the paste body.

[0013] In this implementation manner, the plurality of connected conductive particles in the conductive paste layer can generate a plurality of current paths, so that the conductive paste layer is conductive. Meanwhile, the paste body in the conductive paste layer is soft, so that the conductive paste layer can be deformed under the action of external pressure.

[0014] In a possible implementation manner of the first aspect, the first sub-conductive layer includes a first conductive paste layer, the first conductive paste layer covers at least the first surface of the foam substrate, the first conductive paste layer includes a first paste body and a plurality of connected first conductive particles, the first conductive particles are doped in the first paste body, and the first conductive paste layer is used to be deformed under the action of external pressure.

[0015] In this implementation manner, on the one hand, the first conductive paste layer covering at least the first surface of the foam substrate and the second sub-conductive layer located in the through hole of the foam substrate both have certain ductility, good conductivity, and large resistivity (10 -5 -10 -4Ω×cm) and the second conductive sub-layer in the through hole is connected with the first conductive paste layer, so that the thickness of the first conductive paste layer in the first direction can be effectively reduced; the first conductive paste in the first conductive paste layer is in a liquid state before film formation, and the volume can be reduced during solidification, so that the conductive foam can exhibit good conductivity while being deformed under external pressure and having a low working height in the first direction; on the other hand, the foam substrate is elastic, so that the conductive foam can be easily compressed or stretched, and the working height in the first direction can be further reduced, for example, the working height of the conductive foam in the first direction can be 0.1-0.2 mm, specifically, the working height of the conductive foam in the first direction can be 0.1 mm, 0.15 mm or 0.2 mm, etc.; on the other hand, the contact area between the conductive foam and the structure in the electronic device is large, for example, the contact area can reach 70% or more, specifically, the contact area can be 70%, 80% or 90%, etc.

[0016] In a possible implementation of the first aspect, the first conductive sub-layer comprises a conductive foil, and the conductive foil is configured to be deformed under the external pressure.

[0017] The second conductive sub-layer comprises a second conductive paste layer, and the second conductive paste layer is arranged in at least part of the through hole and is configured to be deformed under the external pressure; the second conductive paste layer comprises a second paste body and a plurality of second conductive particles connected with the second paste body, the second conductive particles are doped in the second paste body, and part of the second conductive particles are connected with the conductive foil.

[0018] In this implementation, on the one hand, the second conductive paste layer in at least part of the through hole of the foam substrate has certain ductility, good conductivity, large resistivity and other properties, and at the same time, the second conductive paste in the second conductive paste layer is in a liquid state before film formation, and the volume can be reduced during solidification, and the foam substrate is elastic, so that the foam substrate and the second conductive paste layer in the through hole can be well compressed or stretched; on the other hand, the thickness of the conductive foil in the direction perpendicular to the foam substrate can be small, and the conductive foil can be compressed or stretched to a certain extent. Thus, the conductive foam can exhibit good conductivity while having a low working height in the first direction.

[0019] In a possible implementation of the first aspect, the second conductive sub-layer fills the entire through hole.

[0020] The first conductive paste layer also covers at least a first surface of the second conductive sub-layer; and the first surface of the second conductive sub-layer is close to the first surface of the foam substrate.

[0021] In the implementation, the conductive foam includes a foam base body with through holes, and a second sub-conductive layer in the through holes fills the through holes, and the second sub-conductive layer can be compressed or stretched at least.

[0022] In a possible implementation of the first aspect, the second sub-conductive layer fills a first part in the through holes, and the first conductive paste layer further fills a second part in the through holes other than the first part; and the first part is larger than the second part.

[0023] In the implementation, the conductive foam includes a foam base body with through holes, and a second sub-conductive layer in part of the through holes, and the second sub-conductive layer can be compressed or stretched at least; meanwhile, since the second sub-conductive layer occupies most of the through holes, the first conductive paste can flow into the small part of the through holes to connect with the second sub-conductive layer and form a first sub-conductive layer, so that the conductive foam can realize a lower working height in the first direction.

[0024] In a possible implementation of the first aspect, the second sub-conductive layer fills all of the through holes.

[0025] The first conductive paste layer has at least one gap, and the gap at least partially overlaps with the through holes in a direction perpendicular to the foam base body, and the second sub-conductive layer is further arranged in the gap at least.

[0026] In the implementation, the conductive foam includes a foam base body with through holes, and a second sub-conductive layer in part of the through holes, and the second sub-conductive layer can be compressed or stretched at least; meanwhile, the first conductive paste cannot be transferred into the through holes, and after solidification, a second sub-conductive layer needs to be formed in the second part in the through holes and the gap of the first conductive paste to realize the communication between the first conductive paste layer and the second sub-conductive layer, so that the conductive foam can realize a lower working height in the first direction.

[0027] In a possible implementation of the first aspect, the second sub-conductive layer is a second conductive paste layer, the second conductive paste layer includes a second paste body and a plurality of connected second conductive particles, the second conductive particles are doped in the second paste body, and part of the second conductive particles are connected with part of the first conductive particles.

[0028] In the implementation, the conductive foam includes a foam base body with through holes, and a second conductive paste layer is arranged in at least part of the through holes, and the second conductive paste layer can be compressed or stretched at least; meanwhile, the conductive foam also has a first conductive paste layer, and the first conductive paste layer is in communication with the second conductive layer, so that the conductive foam can realize a low working height in the first direction, and is easy to manufacture and simple to implement.

[0029] In a possible implementation of the first aspect, the first paste body is different from the second paste body.

[0030] In the implementation, by arranging the first conductive paste layer and the second conductive paste layer as different conductive paste layers, specifically, the first paste body is different from the second paste body, a conductive foam that can realize a low working height in the first direction is obtained, and the conductive foam is easy to manufacture and simple to implement.

[0031] In a possible implementation of the first aspect, the first paste body is a first resin, and the first resin is an epoxy resin; and the second paste body is a second resin, and the second resin is a silica gel resin.

[0032] In the implementation, the epoxy resin can make the first conductive layer have the characteristics of small viscosity, easy leveling, large volume change rate (for example, greater than 50%) after curing, easy curing, large internal stress, good heat dissipation, and the like, and the silica gel resin can make the second conductive layer have the characteristics of good elasticity, large viscosity, large adhesion, low volume shrinkage rate (for example, less than 10%) after curing, high temperature resistance, no internal stress, and the like, which is convenient for manufacturing, and can make the conductive foam have conductivity, good compression or stretching characteristics, and realize a low working height in the first direction.

[0033] In a possible implementation of the first aspect, the first paste body is the same as the second paste body, and the first conductive particle is the same as the second conductive particle.

[0034] In the implementation, by arranging the same conductive paste layer in the through holes of the conductive foam and at least the first surface, which can be the first conductive paste layer or the second conductive paste layer, the conductive foam is very convenient to manufacture, and has conductivity, good compression or stretching characteristics, and realizes a low working height in the first direction.

[0035] In a possible implementation manner of the first aspect, the shape of the foam substrate is a polyhedron, the first conductive paste layer coats the first surface and the second surface of the polyhedron, and the first conductive paste layer also coats the first surface and the second surface of the second conductive sub-layer; the extension direction of the through hole is the direction from the first surface of the polyhedron to the second surface of the polyhedron.

[0036] In the implementation manner, the first surface of the second conductive sub-layer is close to the first surface of the polyhedron, and the second surface of the second conductive sub-layer is close to the second surface of the polyhedron; the second surface of the polyhedron is used for electrically connecting the second structure in the electronic device through the first conductive paste layer.

[0037] In the implementation manner, the conductive foam of the polyhedron is easy to manufacture; meanwhile, since the two surfaces of the polyhedron have the first conductive paste layer, the conductive foam can be electrically connected to at least two surfaces of the structure in the electronic device, thereby expanding the application scenarios.

[0038] In a possible implementation manner of the first aspect, the first structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decoration piece.

[0039] In the implementation manner, the conductive foam can be electrically connected to at least one of the display screen, the camera assembly, the antenna, the metal middle frame, the circuit board, the reed, the shielding cover, the battery cover, and the decoration piece in the electronic device through the conductive layer.

[0040] In a possible implementation manner of the first aspect, the second structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decoration piece.

[0041] In the implementation manner, the conductive foam can be electrically connected to at least one of the display screen, the camera assembly, the antenna, the metal middle frame, the circuit board, the reed, the shielding cover, the battery cover, and the decoration piece in the electronic device through the conductive layer.

[0042] In a possible implementation manner of the first aspect, the conductive foam further includes an air structure, the air structure is arranged in at least one of the through holes and penetrates at least part of the second conductive sub-layer.

[0043] In the implementation manner, when the second conductive paste layer is arranged in the through hole penetrating the foam substrate, the air structure can be arranged to better remove the air in the conductive paste during compression or stretching of the conductive foam, thereby facilitating the compression or stretching of the conductive foam.

[0044] In a possible implementation manner of the first aspect, the shape of the through hole comprises a cylinder;

[0045] The doping concentration of the second conductive particles in the second slurry body is inversely proportional to the diameter of the circular face in the cylinder.

[0046] In this implementation manner, the doping concentration of the second conductive particles in the second slurry body can be designed by the diameter of the circular face in different cylinders, so as to obtain different conductive foams, thereby diversifying the types of the conductive foams.

[0047] In a possible implementation manner of the first aspect, the shape of the through hole comprises a cylinder;

[0048] The doping concentration of the second conductive particles in the second slurry body is non-related to the diameter of the circular face in the cylinder.

[0049] In this implementation manner, the doping concentration of the second conductive particles in the second slurry body can be designed, so as to obtain different conductive foams, thereby diversifying the types of the conductive foams.

[0050] Optionally, the first sub-conductive layer further comprises a mask layer, and the mask layer is arranged between the foam body and the first conductive slurry layer.

[0051] In this implementation manner, the conductive foam can form the through hole penetrating through the foam body by the template etching method, which is simple and easy to implement, and the thickness of the mask layer in the direction perpendicular to the foam body is relatively thin, which does not affect the working height of the conductive foam in the first direction. Meanwhile, when the surface micropores of the foam body after foaming are uneven, the mask layer can also flatten the foam body, so as to facilitate the formation of the first conductive slurry layer.

[0052] Optionally, the first conductive slurry layer comprises a first slurry body and first conductive particles, the first slurry body comprises a first resin, and the first conductive particles comprise first metal particles, and the first metal particles are doped in the first resin.

[0053] In this implementation manner, the first sub-conductive layer is set as the first conductive slurry layer, which is simple and easy to implement. Meanwhile, the first resin in the first conductive slurry layer has good ductility, and the first metal particles in the first conductive slurry layer have relatively optimal conductivity and resistivity, so that the conductive foam has conductivity and good compression or stretching characteristics, thereby realizing a low working height in the first direction.

[0054] Optionally, the second conductive slurry layer comprises a second slurry body and second conductive particles, the second slurry body comprises a second resin, and the second conductive particles comprise second metal particles, and the second metal particles are doped in the second resin.

[0055] In the implementation, the second sub-conductive layer is set as the second conductive paste layer, which is simple and easy to implement. Meanwhile, the second resin in the second conductive paste layer has good ductility, and the second metal particles in the second conductive paste layer have good conductivity and resistivity, etc., so that the conductive foam has conductivity and good compression or stretching characteristics, thereby achieving a low working height in the first direction.

[0056] Optionally, the first resin includes epoxy resin, and the first conductive particles include silver particles.

[0057] In the implementation, the first sub-conductive layer is set as the conductive silver paste layer, and the epoxy resin and the silver particles doped in the epoxy resin are arranged on the surface of the foam substrate, so that the conductive silver paste layer has the characteristics of small viscosity, easy leveling, large volume change rate (for example, greater than 50%) after curing, easy curing, large internal stress, good heat dissipation, etc., which is convenient for manufacturing and enables the conductive foam to have conductivity and good compression or stretching characteristics, thereby achieving a low working height in the first direction.

[0058] Optionally, the second resin includes silicone resin, and the second conductive particles include silver particles.

[0059] In the implementation, the second sub-conductive layer is set as the conductive silver paste layer, and the silicone resin and the silver particles doped in the silicone resin are arranged in the through hole of the foam substrate, so that the conductive silver paste layer has the characteristics of good elasticity, large viscosity, large adhesion, low volume shrinkage rate (for example, less than 10%) after curing, high temperature resistance, no internal stress, etc., which is convenient for manufacturing and enables the conductive foam to have conductivity and good compression or stretching characteristics, thereby achieving a low working height in the first direction.

[0060] In a second aspect, an electronic device is provided, which includes the conductive foam in the first aspect or any possible implementation of the first aspect.

[0061] The electronic device provided by the embodiments of the present application can reduce the thickness of the electronic device due to the use of the conductive foam in the first aspect or any possible implementation of the first aspect, and can reduce or eliminate radiation stray interference, etc., thereby effectively improving the performance of the electronic device.

[0062] In a possible implementation of the second aspect, the first structure in the electronic device is a display screen, and the second structure in the electronic device is a metal middle frame.

[0063] In the implementation, the first surface of the conductive foam can be electrically connected to the display screen through the conductive layer, and the second surface of the conductive foam can be electrically connected to the metal middle frame through the conductive layer. Since the conductive foam can be compressed or stretched well, the low working height in the first direction can be achieved, and the display screen can be prevented from being damaged, thereby ensuring excellent performance of the electronic device.

[0064] In a possible implementation of the second aspect, the first structure at least includes a camera assembly, and the camera assembly is configured to maintain electrical connection with the conductive foam during rotation.

[0065] In the implementation, the camera assembly, for example, a camera, is electrically connected to the conductive foam. Since the working height of the conductive foam in the first direction is low, the camera can be placed between the camera and other structures. During rotation of the camera in any direction, the camera can maintain electrical connection with the conductive foam due to the good compression or stretching of the conductive foam, thereby ensuring the performance of the electronic device. In addition, the conductive foam is an independent structure and can be separated. Therefore, when the conductive foam needs to be replaced, the electronic device does not need to be disassembled, thereby avoiding the whole electronic device from being scrapped. Moreover, the conductive foam can effectively absorb tolerances existing in electrical connection with the structure of the electronic device, thereby avoiding poor contact. In addition, the conductive foam can make the ground (GND) path short. In addition, if there is a problem such as glue overflow, the conductive foam can also be improved by strain. Therefore, the performance of the electronic device of the embodiment of the present application is greatly improved.

[0066] In a third aspect, a manufacturing method of the conductive foam is provided, and the manufacturing method includes:

[0067] forming at least one through hole on the foam base body;

[0068] forming a second conductive paste in at least part of the through hole;

[0069] forming a first conductive paste on at least a first surface of the foam base body;

[0070] solidifying the first conductive paste and the second conductive paste to form a first conductive paste layer and a second conductive paste layer.

[0071] The method for manufacturing the conductive foam provided in the embodiments of the present application forms a through hole on the foam substrate through mechanical punching, laser punching, chemical etching, etc., forms a second conductive paste in the through hole through spraying, sputtering, vacuum plating, etc., forms a first conductive paste on at least a first surface of the foam substrate through spraying, printing, sputtering, vacuum plating, dipping, etc., and bakes / heats to solidify to form a first conductive paste layer and a second conductive layer, which is simple and easy to implement. Meanwhile, the first conductive paste and the second conductive paste in the first conductive paste layer and the second conductive paste layer both have good ductility, good conductivity, large resistivity, etc., and are both in liquid state before film formation, and the volume is reduced during solidification, so that the conductive foam has good conductivity and can be deformed under pressure, in combination with the elasticity of the foam substrate, so that the conductive foam has a low working height in the first direction. Moreover, the first conductive paste and the second conductive paste are sintered into layers, and the volume is reduced to ensure the contact force between the plurality of first conductive particles and the first conductive particles, the contact force between the plurality of first conductive particles and the second conductive particles, and the contact force between the plurality of second conductive particles and the second conductive particles. In addition, when the first conductive paste and the second conductive paste are solidified into the first conductive paste layer and the second conductive paste layer respectively, the first conductive particles in the first conductive paste and the second conductive particles in the second conductive paste are spread out, so that the contact area of the conductive foam with the structure in the electronic device can be large.

[0072] In a fourth aspect, a method for manufacturing a conductive foam is provided, which comprises:

[0073] forming at least one through hole on the foam substrate;

[0074] forming a conductive film in the through hole;

[0075] forming a first conductive paste on at least a first surface of the foam substrate;

[0076] solidifying the first conductive paste to form a first conductive paste layer.

[0077] The manufacturing method of the conductive foam provided in the embodiments of the present application forms a through hole on the foam substrate through mechanical punching, laser punching, chemical etching method, etc., and forms a conductive film in the through hole, and forms a first conductive slurry on at least a first surface of the foam substrate through spraying, printing, spraying, vacuum plating, dipping, etc., and bakes / heat cures to form a first conductive slurry layer, which is simple and easy to implement; at the same time, the first conductive slurry in the first conductive slurry layer has good ductility, good conductivity, large resistivity and other performances, and before the first conductive slurry is formed into a film, it is all in a liquid state, and the volume will shrink in the curing process, so that the conductive foam shows good conductivity, and can also deform under the action of pressure, in combination with the elasticity of the foam substrate and the extension / stretching performance of the conductive film, the conductive foam can work at a low height in the first direction; and the first conductive slurry is sintered into a layer, and the volume is reduced to ensure the contact force between the plurality of first conductive particles and the first conductive particles, and the contact force between part of the first conductive particles and the conductive film; in addition, when the first conductive slurry is cured into the first conductive slurry layer, the first conductive particles in the first conductive slurry spread out, so that the contact area of the conductive foam with the structure in the electronic device can be larger.

[0078] In a fifth aspect, a manufacturing method of a conductive foam is provided, and the manufacturing method comprises:

[0079] forming at least one through hole on the foam substrate;

[0080] forming a first conductive slurry in the through hole and on at least a first surface of the foam substrate;

[0081] curing the first conductive slurry to form a first conductive slurry layer.

[0082] The manufacturing method of the conductive foam provided in the embodiments of the present application forms a through hole on the foam substrate through mechanical punching, laser punching, chemical etching method, etc., and forms a conductive film in the through hole, and forms a first conductive slurry on at least a first surface of the foam substrate through spraying, printing, spraying, vacuum plating, dipping, etc., and bakes / heat cures to form a first conductive slurry layer, which is simple and easy to implement; at the same time, the first conductive slurry in the first conductive slurry layer has good ductility, good conductivity, large resistivity and other performances, and before the first conductive slurry is formed into a film, it is all in a liquid state, and the volume will shrink in the curing process, so that the conductive foam shows good conductivity, and can also deform under the action of pressure, in combination with the elasticity of the foam substrate and the extension / stretching performance of the conductive film, the conductive foam can work at a low height in the first direction; and the first conductive slurry is sintered into a layer, and the volume is reduced to ensure the contact force between the plurality of first conductive particles and the first conductive particles, and the contact force between part of the first conductive particles and the conductive film; in addition, when the first conductive slurry is cured into the first conductive slurry layer, the first conductive particles in the first conductive slurry spread out, so that the contact area of the conductive foam with the structure in the electronic device can be larger.

[0083] In a sixth aspect, a method for manufacturing an electrically conductive foam is provided, the method comprising:

[0084] forming at least one through hole on the foam substrate;

[0085] forming a second conductive paste in at least part of the through hole;

[0086] curing the second conductive paste to form a second conductive paste layer;

[0087] forming an electrically conductive foil on at least a first surface of the foam substrate and at least a first surface of the second conductive paste layer.

[0088] The method for manufacturing an electrically conductive foam provided by the embodiments of the present application forms a through hole on the foam substrate by mechanical punching, laser punching, chemical etching, etc., forms a second conductive paste in the through hole by spraying, sputtering, vacuum plating, etc., forms an electrically conductive foil on at least a first surface of the foam substrate, and cures by baking / heating to form a second sub-conductive layer, which is simple and easy to implement. Meanwhile, the second conductive paste in the second conductive paste layer has good ductility, good electrical conductivity, and large resistivity, etc., and the second conductive paste is in a liquid state before film formation, and the volume shrinks during the curing process, so that the electrically conductive foam exhibits good electrical conductivity and can also deform under pressure. In combination with the elasticity of the foam substrate and the extension / stretching performance of the electrically conductive foil, the electrically conductive foam can work at a low height in the first direction. Furthermore, the second conductive paste is sintered into a layer, and the volume shrinks to ensure the contact force between the plurality of second conductive particles and the second conductive particles and the contact force between the plurality of second conductive particles and the electrically conductive foil. In addition, when the second conductive paste is cured into a second conductive paste layer, the second conductive particles in the second conductive paste spread out, so that the contact area of the electrically conductive foam with the structure in the electronic device can be larger.

[0089] The embodiments of the present application provide an electrically conductive foam, a method for manufacturing the same, and an electronic device. The second sub-conductive layer located in the through hole of the foam substrate and the first sub-conductive layer located on at least a first surface of the foam substrate both have good ductility, good electrical conductivity, and large resistivity, etc., and are connected to each other. Meanwhile, the foam substrate has good elasticity, so that the electrically conductive foam can work at a low height in the first direction. When the electrically conductive foam is applied to an electronic device, it can have a large contact area with the structure in the electronic device, and also can make the electronic device thinner and reduce or eliminate radiation interference, etc., effectively improving the performance of the electronic device and providing a good user experience. BRIEF DESCRIPTION OF DRAWINGS

[0090] Figure 1 A structural schematic diagram of a first electronic device provided by the embodiments of the present application is shown;

[0091] Figure 2 A structure diagram of a wrapping foam in the related art;

[0092] Figure 3 A structure diagram of a full-range drawing foam in the related art;

[0093] Figure 4 A structure diagram of a wrapping foam in the related art; Figure 2 A microstructure diagram of a wrapping foam in the related art;

[0094] Figure 5 A structure diagram of a wrapping foam in the related art; Figure 2 A microstructure diagram of a wrapping foam in the related art;

[0095] Figure 6 A structure diagram of a wrapping foam in the related art; Figure 2 A microstructure diagram of a wrapping foam in the related art;

[0096] Figure 7 A structure diagram of a wrapping foam in the related art;

[0097] Figure 8 A structure diagram of a wrapping foam in the related art; Figure 7 A structure diagram of a wrapping foam in the related art;

[0098] Figure 9 A structure diagram of a wrapping foam in the related art;

[0099] Figure 10 A structure diagram of a wrapping foam in the related art;

[0100] Figure 11 A structure diagram of a wrapping foam in the related art;

[0101] Figure 12a A structure diagram of a wrapping foam in the related art; Figure 12b

[0102] A structure diagram of a wrapping foam in the related art; Figure 13a Figure 13b Figure 13c A structure diagram of a wrapping foam in the related art;

[0103] Figure 14 A structure diagram of a wrapping foam in the related art;

[0104] Figure 15 A structure diagram of a wrapping foam in the related art;

[0105] ​​Figure 16 This is a schematic diagram of the structure of the seventh type of conductive foam provided in the embodiments of this application;

[0106] Figure 17 This is a schematic diagram of the structure of the eighth type of conductive foam provided in the embodiments of this application;

[0107] Figure 18 This is a structural schematic diagram of the ninth type of conductive foam provided in the embodiments of this application;

[0108] Figure 19 Figure a in the middle Figure 19 Figure b in the middle Figure 19 Figure c in the middle Figure 19 The d-graph in the figure is Figure 17 A schematic diagram illustrating the structure of conductive foam;

[0109] Figure 20 This is a schematic diagram of the structure of a second electronic device provided in an embodiment of this application;

[0110] Figure 21 This is a schematic diagram of the structure of a third electronic device provided in an embodiment of this application;

[0111] Figure 22 This is a schematic diagram of the structure of the first electronic device in the related technology;

[0112] Figure 23 This is a schematic diagram of the structure of a second type of electronic device in the related technology;

[0113] Figure 24 This is a schematic diagram of the structure of the fourth electronic device provided in the embodiments of this application;

[0114] Figure 25 This is a schematic diagram of the structure of the fifth electronic device provided in the embodiments of this application;

[0115] Figure 26 This is a schematic diagram of the structure of the sixth electronic device provided in the embodiments of this application;

[0116] Figure 27 This is a schematic diagram of the structure of the seventh electronic device provided in the embodiments of this application;

[0117] Figure 28 This is a schematic diagram of the structure of the eighth electronic device provided in the embodiments of this application;

[0118] Figure 29 This is a schematic diagram of the structure of the ninth electronic device provided in the embodiments of this application;

[0119] Figure 30 A flowchart illustrating a first method for manufacturing conductive foam provided in this application embodiment;

[0120] Figure 31 A flowchart illustrating a second method for manufacturing conductive foam provided in this application embodiment;

[0121] Figure 32 A flowchart illustrating a third method for manufacturing conductive foam provided in an embodiment of this application;

[0122] Figure 33 A flowchart illustrating a fourth method for manufacturing conductive foam provided in this application embodiment;

[0123] Figure 34 A flowchart illustrating a first method for manufacturing conductive foam in practical applications, as provided in the embodiments of this application.

[0124] Figure 35 Figure a in the middle Figure 35 Figure b in the middle and Figure 35 Figure c in the figure is a flowchart of the second method for manufacturing conductive foam in actual application according to the embodiments of this application;

[0125] Figure 36 This is a flowchart illustrating a third method for manufacturing conductive foam in a practical application provided by the embodiments of this application.

[0126] Figure label:

[0127] 01-Electronic device; 101-Display module; 1011-Display screen; 1012-Touch panel; 1013-Metal frame; 102-Middle frame; 1021-Bezel; 1022-Carrier plate; 103-Back cover; 501-Front-facing camera; 502-Shielding cover; 503-Conductive cloth; 504-PCB; 505-Steel bracket; 506-Screw; 507-Substrate of front-facing camera; 508-Rear camera; 509-Substrate of rear camera; 102-Middle frame; 105-Antenna; 106-Insulating material layer; 107-Plastic; 108-Spring; 109-Laser engraving surface; 110-Anti-oxidation layer; OZ-First direction (thickness direction of the phone); OX-Second direction (width direction of the phone); OY-Third direction (length direction of the phone); 111-Display screen;

[0128] 02-Wrapped foam; 131-Foam core; 132-Thermosetting adhesive; 133-Wrapping structure; 134-Adhesive backing of wrapped foam; 03-All-around brushed foam; 121-Adhesive backing of all-around brushed foam; 122-Metal wire; 1311-Micropores of wrapped foam; 1312-Closed-cell wrapping foam; 1331-Grid conductive fabric; 13311-Horizontal grid conductive fabric; 13312-Vertical grid conductive fabric; 1332-Plain weave conductive fabric;

[0129] 05 - conductive foam; 1 - foam base; 10 - first foam base; 11 - first surface of foam base; 12 - second surface of foam base; 13 - third surface of foam base; 14 - fourth surface of foam base; 2 - conductive layer; 21 - first conductive paste layer; 211 - first paste body; 212 - first conductive particle; 22 - second conductive paste layer; 201 - first surface of second conductive paste layer; 202 - second surface of second conductive paste layer; 221 - second paste body; 222 - second conductive particle; k - via hole; k1 - first part of via hole; k2 - second part of via hole; D1 - conductive path; x - void of first conductive paste layer; 3 - air structure; 4 - conductive foil; 23 - mask layer; 223 - flexible film; 224 - conductive film; d1 - first diameter of circular surface in cylinder; d2 - second diameter of circular surface in cylinder. DETAILED DESCRIPTION

[0130] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings. In the description of the embodiments of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; the "and / or" in the text only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone.

[0131] Hereinafter, the terms "first" and "second" are only used for description purposes, and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more features, and in the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more. The meaning of "at least one" is one or more.

[0132] First, some terms in the embodiments of the present application are explained and described to facilitate understanding by those skilled in the art.

[0133] 1. Foam

[0134] Foam refers to foamed materials such as polyurethane, plastic particles, etc., and is simply referred to as foam. Foam has the characteristics of light weight, elasticity, fast pressure-sensitive fixing, easy use, bending freely, ultra-thin volume, and reliable performance.

[0135] 2. Conductive foam

[0136] Conductive foam refers to wrapping conductive cloth or the like on the foam core, and after processing, it has good surface conductivity and the like, and can be easily fixed on the structure to be shielded by using adhesive tape or the like.

[0137] 3. Passive intermodulation (PIM)

[0138] Passive intermodulation refers to two or more frequencies mixing together in a non-linear device, thereby generating spurious signals.

[0139] 4. Radiated spurs

[0140] Radiated spurs refer to emissions at discrete frequencies other than the carrier frequency and sidebands due to normal modulation and switching transients, when modulated with a standard signal; radiated spurs can be harmonic components, intermodulation signals, etc. generated by some non-linear structures.

[0141] 5. Percolation theory of conductive paste

[0142] When the content of conductive particles in the conductive paste is high, the conductive network is mainly formed by direct lapping of the conductive particles.

[0143] 6. Tunneling effect theory or field emission theory of conductive paste

[0144] When the content of conductive particles in the conductive paste is low, the conductive particles are not sufficient to directly contact, at this time, an external electric field is externally imposed, and electrons penetrate the organic matter through tunneling effect and jump to the nearby conductive particles, so as to make the conductive network unblocked. When the tunneling effect theory or the field emission theory is dominant in the conductive paste, the PIM performance of the conductive paste is poor.

[0145] The above is a brief introduction to the terms involved in the embodiments of the present application, which will not be repeated below.

[0146] Exemplarily, Figure 1 An electronic device 01 to which the embodiments of the present application are applicable is shown.

[0147] As Figure 1 shown, taking the electronic device 01 as a mobile phone as an example, the mobile phone can include a display module 101, a middle frame 102, and a back shell 103, etc., the middle frame 102 is arranged between the display module 101 and the back shell 103, the middle frame 102 includes a frame 1021 and a bearing plate 1022 surrounded by the frame, and an internal structure such as components and the like is mounted on one side of the bearing plate 1022. The internal structure of the mobile phone can realize functions through electrical connection, and the electrical connection is usually weak force contact, which causes the contact interface of the internal structure to be prone to generate harmonic, passive intermodulation and other nonlinear products, and the nonlinear products are the main source of radiated spurs of the mobile phone, and the radiated spur interference is an important index for acceptance of the mobile phone.

[0148] In order to reduce or eliminate radiation interference, the internal structure of the mobile phone can be electrically connected by foam. The related technology provides a plurality of types of foams, such as fabric over foam (FOF), all-around wire foam, and the like. These foams are widely used due to low PIM and other characteristics.

[0149] Exemplarily, Figure 2 A fabric over foam 02 in the related art is shown. As shown in Figure 2 The fabric over foam 02 includes a foam core 131, a thermosetting glue 132, a wrapping structure 133, and a back glue 134. The thermosetting glue 132 wraps around the foam core 131, the wrapping structure 133 wraps around part of the thermosetting glue 132, and is arranged apart from the back glue 134 on one side of the thermosetting glue 132. The fabric over foam 02 has a large amount of non-compressible due to a large number of internal layer structures, which causes the working height in the first direction to be difficult to compress. Even if the internal layer structure of the fabric over foam 02 is improved, for example, the non-compressible amount of the wrapping structure 133 is adjusted to about 0.05 mm, the working height of the fabric over foam 02 in the first direction is still greater than or equal to 0.2 mm, which is still relatively high in actual application. It should be noted that the first direction is the OZ direction shown in Figure 2 The OZ direction corresponds to the thickness direction of the mobile phone.

[0150] Exemplarily, Figure 3 An all-around wire foam 03 in the related art is shown. As shown in Figure 3 The structure of the all-around wire foam 03 is relatively simple compared with the structure of the fabric over foam 02, and only includes a back glue 121 and a metal wire 122. The back glue 121 can include any one of conductive glue, insulating glue, and the like, and the metal wire 122 can include copper wire and the like. However, when the all-around wire foam 03 is compressed, the metal wire 122 can be broken, or the metal wire 122 can not rebound and be permanently deformed, which causes the working height of the all-around wire foam 03 in the first direction to be difficult to compress. It should be noted that the first direction is the OZ direction shown in Figure 3 The OZ direction corresponds to the thickness direction of the mobile phone.

[0151] Therefore, based on the above examples, it can be seen that the foams provided in the related art cannot achieve a low working height in the first direction.

[0152] In order to enable the foam with a large non-compressible amount to achieve a low working height in the first direction, the related art considers improving the non-compressible amount of the foam. For example, the foam core can be improved.

[0153] Exemplarily, Figure 4 A foam with a large non-compressible amount is shown Figure 2A schematic diagram of the foam core 131 encasing foam 02. (See diagram below.) Figure 4 As shown, the foam core 131 has multiple micropores 1311, and the portion other than the micropores 1311 consists of closed pores 1312. Since the more overlapping foam cores with closed pores 1312 in the compression direction, the greater the incompressibility, it is possible to control the number and distribution of closed pores 1312 in the compression direction through the foaming process, thereby hoping to reduce the incompressibility to some extent. However, the foaming process is difficult to improve and may also lead to stress loss in the foam, which is an important indicator of foam performance. Therefore, improving the foam core is difficult and not feasible.

[0154] For example, the wrapping structure 133 of the foam 02 can be a conductive cloth or a conductive material layer, so related technologies also consider improving the conductive cloth or conductive material layer.

[0155] For example, Figure 5 It shows Figure 2 The diagram shows the wrapping structure 133 of the foam 02, which is a grid-patterned conductive cloth 1331. (See diagram for reference.) Figure 5 As shown, the checkered conductive fabric 1331 has a multi-strand cross-laminated structure, for example... Figure 5 The conductive fabric consists of a transverse grid-patterned conductive cloth 13311 along a second direction and a longitudinal grid-patterned conductive cloth 13312 along a third direction. The transverse grid-patterned conductive cloth 13311 has multiple strands, and the longitudinal grid-patterned conductive cloth 13312 has multiple strands. The transverse and longitudinal grid-patterned conductive cloths 13311 and 13312 are interlaced to form a stack. Therefore, when the grid-patterned conductive cloth possesses high toughness, it is relatively thick. Furthermore, because the multiple strands of the grid-patterned conductive cloth 1331 intersecting in different directions are located in different layers, the contact area between the grid-patterned conductive cloth 1331 and the structure in the electronic device is relatively small. The second direction is... Figure 5 The OX direction shown is the third direction. Figure 5 The OY direction shown can be understood as follows: the OX direction corresponds to the width direction of the phone, and the OY direction corresponds to the length direction of the phone.

[0156] For example, Figure 6 It shows Figure 2 The diagram shows the wrapping structure 133 of the foam 02, which is a plain weave conductive cloth 1332. (See diagram for reference.) Figure 6 As shown, the plain weave conductive cloth 1332 is prone to tearing due to the lack of orthogonal fabric.

[0157] In addition, the thinnest conductive cloth currently used is 30μm. If the thickness of the conductive cloth is further reduced, problems such as adhesive overflow are likely to occur. Therefore, it is difficult to improve the conductive cloth and it is not feasible.

[0158] Based on the above description, it can be known that the several improved technologies provided by the related art cannot achieve the purpose of achieving a low working height of the foam in the first direction.

[0159] Therefore, the present application provides a conductive foam, which is provided with a first sub-conductive layer covering at least a first surface of a foam substrate and a second sub-conductive layer located in at least part of a through hole of the foam substrate. The first sub-conductive layer and the second sub-conductive layer both have good ductility and good conductivity, and at least one of the first sub-conductive layer and the second sub-conductive layer comprises a conductive paste layer. The conductive paste in the conductive paste layer is in a liquid state before film formation and shrinks in volume during solidification. The conductive foam can exhibit good conductivity and can also deform under the action of external pressure and rebound well after the action of external pressure disappears, so as to effectively reduce the working height of the conductive foam in the first direction, and the conductive foam itself will not be broken or permanently deformed.

[0160] When the conductive foam of the present application is applied to an electronic device, the contact area of the conductive foam with the structure in the electronic device is large, and the thickness of the electronic device can be effectively reduced to achieve ultra-thinization. At the same time, the conductive foam can also reduce or eliminate radiation stray interference, etc.

[0161] The present application does not make any limitation on the specific type of electronic device. In some embodiments, the electronic device of the present application can include a mobile phone, a wearable device (such as a smart bracelet, a smart watch, earphones, etc.), a tablet computer, a laptop, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a cellular phone, a personal digital assistant (PDA), an internet of things (IOT) device such as an augmented reality (AR) \ virtual reality (VR) device, a vehicle-mounted electronic device, and can also be a television, a large screen, a printer, a projector, etc.

[0162] In the application, the electronic device is taken as a mobile phone as an example, such as Figure 1As shown, the mobile phone can include a display module 101, a middle frame 102, and a rear shell 103, etc. Among them, the display module 101 includes a display screen 1011 and a touch panel 1012 arranged on the light-emitting side of the display screen 1011; the display module 101 is mounted on one side of the bearing plate 1022, and the other side is mounted with internal structures such as camera assembly, antenna, circuit board, battery, etc. The frame 1021 constituting the middle frame 102 and the bearing plate 1022 can be an integrated structure; the rear shell 103 is mounted on the middle frame 102, and the rear shell 103 is used to protect the above-mentioned internal structures. As shown in Figure 1 As shown, the mobile phone can also include a metal frame 1013 mounted on the non-light-emitting side of the display screen 1011. The side of the metal frame 1013 away from the display screen 1011 can be pasted to one side of the middle frame 102 through a glue layer, so as to achieve the purpose of mounting the display module 101 on one side of the middle frame 102.

[0163] In some embodiments, in the electronic device of the present application, the first structure can be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative piece, etc. The second structure can be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative piece, etc. The first structure and the second structure can be the same, of course, they can also be different, and the specific application is subject to the actual application. For example, the camera assembly can include a camera; the circuit board can include a printed circuit board (PCB), a flexible printed circuit (FPC), etc.

[0164] It should be noted that the above-mentioned display screen can include a liquid crystal display (LCD), an organic light emitting diode (OLED) display screen, etc.

[0165] The above-mentioned touch panel can include a cover plate made of glass or transparent resin material, and a touch electrode pattern located on the side of the cover plate close to the display screen.

[0166] Here, only the content related to the invention point is introduced, and the remaining structures can be obtained by referring to the related technology, which will not be described in detail here.

[0167] Based on the above structure, the conductive foam provided by the present application can be electrically connected with any one of the first structure and / or any one of the second structure in the electronic device when it is applied to the electronic device, so as to realize the electrical connection of the structures in the electronic device through the conductive foam, and at the same time, the thickness of the electronic device can be thinned, and the radiation interference can be reduced or eliminated, etc., and the user experience is good.

[0168] In the application, at least one surface of the conductive foam provided by the embodiments of the present application is used to be electrically connected with at least one structure in the electronic device through the conductive layer, and the structure in the electronic device can include at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative piece, etc.

[0169] As an example, when the conductive foam includes a first surface, the first surface can be used to be electrically connected with a first structure through a first conductive paste layer, and the first surface can also be used to be electrically connected with a plurality of first structures through the first conductive paste layer, which is not limited herein.

[0170] As another example, when the conductive foam includes a first surface and other surfaces, for example, the conductive foam includes a first surface and a second surface, the first surface can be electrically connected with a first structure through a first conductive paste layer, and the second surface can be electrically connected with a second structure through the first conductive paste layer. The second structure can refer to the first structure, which is not described herein. The number of the first structure and the second structure can also be determined according to actual needs.

[0171] The conductive foam 05 provided by the embodiments of the present application will be described in detail below. Figures 7 to 18 The conductive foam 05 provided by the embodiments of the present application will be described in detail below. Figure 7 、 Figure 8 、 Figure 11 、 Figure 12b 、 Figures 13c to 18 As shown in the drawings, the conductive foam 05 provided by the present application can include:

[0172] a foam base 1 and a conductive layer 2.

[0173] The foam base 1 has at least one through hole k; the conductive layer 2 includes a first sub-conductive layer and a second sub-conductive layer, the first sub-conductive layer covers at least a first surface 11 of the foam base 1, the first surface 11 is used to be electrically connected with a first structure in the electronic device through the first sub-conductive layer, and the second sub-conductive layer is arranged in at least part of the through hole k; wherein the first sub-conductive layer and the second sub-conductive layer are connected, and at least one of the first sub-conductive layer and the second sub-conductive layer includes a conductive paste layer and is used to be deformed under the action of external pressure.

[0174] The conductive paste layer includes a paste body and a plurality of connected conductive particles, and the conductive particles are doped in the paste body.

[0175] The material of the foam body is not limited in the present application. For example, the material of the foam body can include polyurethane, silica-based resin, etc. For example, the foam body can be formed by a foaming process to serve as the core of the conductive foam. The surface of the foamed foam body has a plurality of micropores, and the foam body has elasticity and can be compressed, stretched, etc.

[0176] The shape of the foam body is not limited in the present application. For example, the shape of the foam body can include a polyhedron, a sphere, a cylinder, etc. When the shape of the foam body is a polyhedron, the polyhedron can include a regular polyhedron or an irregular polyhedron. When the shape of the foam body is a regular polyhedron, the regular polyhedron can include a cube, a hexahedron, an octahedron, etc. Figure 7 、 Figure 8 、 Figure 11 、 Figure 12b 、 Figures 13c to 18 The shape of the foam body 1 is a hexahedron.

[0177] The polyhedron has a plurality of surfaces, and the plurality of surfaces include at least a first surface that needs to be electrically connected to a first structure in an electronic device. Of course, at least one surface other than the first surface in the polyhedron can also be electrically connected to a structure other than the first structure in the electronic device. For example, the polyhedron can also be provided with a second surface that is electrically connected to a second structure in the electronic device. The number of surfaces that need to be electrically connected to the structure of the electronic device can be determined according to the actual application of the conductive foam. At this time, the electrical connection can be indirect electrical connection, i.e., the surface of the polyhedron is electrically connected to the structure in the electronic device through a conductive layer. Of course, the surface of the polyhedron can also be electrically connected to the structure in the electronic device through a first adhesive layer, a conductive layer, etc. in sequence, which is not limited herein.

[0178] The volume of the foam body is not limited in the present application.

[0179] It should be understood that the foam body has at least one through hole, which means that the foam body can have only one through hole, or the foam body can have a plurality of through holes, which can be determined according to the volume of the foam body, etc. Figures 7 to 8 、 Figure 11 、 Figures 14 to 18 The foam body 1 has four through holes k. Figure 12b and Figure 13cAll are illustrated by taking the example that the foam body 1 has three through holes k. Among them, each through hole penetrates the foam body in a direction. The application does not make specific limitations on the direction of each through hole. For example, each through hole can extend towards the direction of the first sub-conductive layer; or each through hole can extend towards the direction of the first sub-conductive layer and the direction of the second sub-conductive layer.

[0180] The application does not make specific limitations on the shape of each through hole. For example, the shape of each through hole can include a cylinder, a cube, a polyhedron, etc. The application does not make specific limitations on the size of each through hole. For example, the depth of each through hole along its extension direction can be determined according to the foam body; for example, the width of each through hole perpendicular to its extension direction can be determined according to the number of through holes, the foam body, the manufacturing process, etc.

[0181] The application does not make specific limitations on the manufacturing process of the above-mentioned through hole. For example, the through hole can be manufactured by mechanical punching, laser punching, template etching method, etc.

[0182] In application, when the shape of the through hole is a cylinder, and the diameters of the two circular faces of the cylinder are equal, the width of the through hole perpendicular to its extension direction is the diameter of the circular face.

[0183] As an example, when the through hole is manufactured by mechanical punching, the width of the through hole perpendicular to its extension direction, i.e. the diameter of the circular face, can be made larger.

[0184] As another example, when the through hole is manufactured by laser punching, the width of the through hole perpendicular to its extension direction, i.e. the diameter of the circular face, can be made smaller. For example, the diameter of the circular face can be in the range of 0.05-0.1 mm, specifically, the diameter of the circular face can be 0.05 mm, 0.08 mm or 0.1 mm, etc. Compared with mechanical punching, the contact area of the foam body after laser punching with the structure in the electronic device is larger.

[0185] As yet another example, when the through hole is manufactured by template etching method, the width of the through hole perpendicular to its extension direction is not limited, and the size of the through hole can be controlled according to the amount of etching liquid, etc.

[0186] It should be noted that when the foam body has multiple through holes, the shapes, sizes, etc. of the multiple through holes can be partially the same; or the shapes, sizes, etc. of the multiple through holes can be all the same; or the shapes, sizes, etc. of the multiple through holes can be all different, which is not specifically limited here. Figure 7 、 Figure 8 、 Figure 11 、 Figure 12b 、 Figures 13c to 18The shape of the plurality of through holes k in the foam base 1 is a cylinder (the diameters of the two circular faces of the cylinder are equal), and the sizes of the plurality of through holes k are the same.

[0187] It should be understood that the above-mentioned conductive layer coating at least the first surface of the foam base means that the conductive layer can only coat the first surface of the foam base, or the conductive layer can coat other surfaces of the foam base in addition to coating the first surface of the foam base, wherein the other surfaces refer to any one surface other than the first surface, which is not specifically limited here. For example, the shape of the foam base is a hexahedron, the conductive layer can coat one surface (the first surface) of the foam base, or the conductive layer can coat two surfaces (the first surface and the second surface) of the foam base, or the conductive layer can coat more than three surfaces of the foam base, which is subject to actual application.

[0188] The shape of the foam base is a hexahedron, and the conductive layer coats the foam base as follows:

[0189] As an example, Figures 7 to 8 The shape of the foam base 1 is a hexahedron, and the first sub-conductive layer coats the first surface 11 (the upper surface), the second surface 12 (the lower surface), the third surface 13 (the left surface), and the fourth surface 14 (the right surface) of the foam base 1.

[0190] As another example, Figure 11 , Figure 12b , Figure 13c , Figure 8 The shape of the foam base 1 is a hexahedron, and the first sub-conductive layer coats the first surface 11 (the upper surface) and the second surface 12 (the lower surface) of the foam base 1. Among them, the first surface 11 is used to electrically connect with the first structure in the electronic device based on the first sub-conductive layer, and the second surface 12 is used to electrically connect with the second structure in the electronic device based on the first sub-conductive layer. For example, the first structure can be a PCB, and the second structure can be an antenna. Of course, the first structure and the second structure can also be other structures in the electronic device, and the first structure and the second structure can be the same or different, which is not specifically limited here.

[0191] Of course, the conductive layer can also cover the first, second, third, fourth, fifth and sixth surfaces of the foam substrate. In this configuration, at least one of the first, second, third, fourth, fifth, and sixth surfaces is used for structural electrical connections between the conductive layer and the electronic device. For example, all of the first, second, third, fourth, fifth, and sixth surfaces may be used for structural electrical connections between the conductive layer and the electronic device. Specifically, the first surface may be used for a first structural electrical connection, the second surface for a second structural electrical connection, the third surface for a third structural electrical connection, the fourth surface for a fourth structural electrical connection, the fifth surface for a fifth structural electrical connection, and the sixth surface for a sixth structural electrical connection. Alternatively, only one surface may be used for a structural electrical connection between the conductive layer and the electronic device. Specifically, the first surface may be used for a first structural electrical connection, while the second, third, fourth, fifth, and sixth surfaces may not be used for structural electrical connections. Of course, other configurations are also possible, and no specific limitations are imposed here. Among them, the first structure, the second structure, the third structure, the fourth structure, the fifth structure and the sixth structure can be any one of the following: display screen, camera assembly, antenna, metal frame, circuit board, spring, shielding cover, battery cover, decorative parts, etc., depending on actual needs.

[0192] It should be understood that the above-mentioned second sub-conductive layer being disposed in at least part of the via means that: the second sub-conductive layer may be disposed only in part of the via; or, the second sub-conductive layer may be disposed in the entire via, filling the via completely, without any specific limitation here. Figures 14 to 18 , Figure 9 and Figure 10 The illustrations all take the portion where the second sub-conductive layer is located within the via k as an example. Figure 9 , Figure 10 The illustrations are all based on the example of the second sub-conductive layer being set in all vias k.

[0193] It should be understood that the connection between the first sub-conductive layer and the second sub-conductive layer can be such that a portion of the first sub-conductive layer is connected to the entirety of the second sub-conductive layer; or, a portion of the first sub-conductive layer is connected to a portion of the second sub-conductive layer; or, the entirety of the first sub-conductive layer is connected to a portion of the second sub-conductive layer; of course, other methods are also possible, which are not specifically limited here.

[0194] It should be understood that the above-mentioned at least one of the first sub-conductive layer and the second sub-conductive layer includes the conductive paste layer refers to: the first sub-conductive layer includes the conductive paste layer, and the second sub-conductive layer does not include the conductive paste layer, for example, the second sub-conductive layer can include a conductive film; or, the first sub-conductive layer includes a non-conductive paste layer, and the second sub-conductive layer includes a conductive paste layer, for example, the first sub-conductive layer can include a conductive film; or, the first sub-conductive layer and the second sub-conductive layer both include the conductive paste layer, which is not specifically limited here.

[0195] The application does not specifically limit the conductive paste of the above-mentioned conductive paste layer, and the conductive paste can include, for example, a polymer conductive paste (baked or heated to cure into a film, with an organic polymer as a bonding phase), a sintering type conductive paste (sintered into a film, with a sintering temperature > 500℃, glass powder or oxide as a bonding phase), etc. The following embodiments of the application are described by taking the conductive paste as a polymer conductive paste as an example.

[0196] In applications, the conductive paste can include a paste body and a plurality of conductive particles, the plurality of conductive particles being doped in the paste body, the plurality of conductive particles not being connected before curing, and being connected after curing, so that a plurality of current paths are generated in the conductive paste layer formed after curing, thereby conducting electricity, and the conductive particles shrink in volume after curing to ensure the contact between adjacent particles, so that the PIM inside the conductive paste is effectively reduced; at the same time, the conductive particles spread out after curing, which can increase the contact area between the conductive paste layer and the structure in the electronic device.

[0197] The application does not specifically limit the paste body, and the paste body can include, for example, a resin, specifically, the resin can be any one of a silicone resin, a silane modified resin, an epoxy resin, a silica resin, etc. Among them, the silicone resin and the silane modified resin have the characteristics of good elasticity, relatively large viscosity, relatively large viscosity, relatively low volume shrinkage (for example, less than 10%) after curing, high temperature resistance, no internal stress, etc. The epoxy resin and the silica resin have the characteristics of relatively small viscosity, easy leveling, relatively large volume change rate (for example, greater than 50%) after curing, easy curing, relatively large internal stress, relatively good heat dissipation, etc.

[0198] The type, shape, particle size, etc. of the conductive particles are not specifically limited in the present application. For example, the conductive particles can include metal conductive particles, specifically, the metal conductive particles can be any one or a combination of silver (Ag) particles, copper (Cu) particles, gold (Au) particles, aluminum (Al) particles, nickel (Ni) particles, etc.; the shape of the metal conductive particles can include any one of spherical, thorn-shaped, flaky, rod-shaped, linear, etc.; the particle size of the metal conductive particles can be micron level, nanometer level, etc., specifically, the particle size of the metal conductive particles can be in the range of 5-20 μm, i.e. the particle size of the metal conductive particles can be 5 μm, 8 μm, 10 μm, 13 μm, 17 μm, or 20 μm, etc.

[0199] It should be noted that, due to the above characteristics, silica gel resin, silane modified resin, epoxy resin, and silica resin can all be applied to the surface and through hole of the foam substrate, and the epoxy resin and silica resin are preferably applied to the surface of the foam substrate, and the silica gel resin and silane modified resin are preferably applied to the through hole of the foam substrate.

[0200] The elastic modulus of the above-mentioned conductive particles is different. In the case of the same resin as the slurry body, the conductive particles with smaller elastic modulus are selected to be doped in the resin, which can cause the conductive slurry to deform slightly under low pressure, thereby increasing the contact area of the conductive foam and the structure in the electronic device. Among them, the elastic modulus of silver, gold and aluminum is small, and when doped in the resin to form a slurry layer, silver, gold and aluminum are good conductors and soft, which can be well compressed or stretched. Moreover, the silver particles, gold particles and aluminum particles in the conductive slurry layer can spread after compression, thereby realizing a larger contact area between the conductive slurry layer and the structure in the electronic device.

[0201] In addition, the required conductive particles can also be selected according to other conditions: as an example, the conductive particles can be selected according to the pressure, for example, when the pressure is high, nickel particles can be selected, which have more stable properties than silver particles, etc.; for example, when the pressure is moderate, copper particles can be selected, which have lower cost than silver particles, etc. As another example, the conductive particles can be selected according to the current of the conductive path in the conductive foam, for example, when the current is low or in the low current area, copper particles can be selected to reduce the cost; for example, when the current is high or in the high current area, silver particles, gold particles, etc. with low PIM can be selected to ensure the performance of the conductive foam.

[0202] The application does not make specific limitations on the doping concentration of the conductive particles in the conductive paste in the paste body. For example, the mass fraction of the conductive particles in the paste body can be greater than or equal to 80%, specifically, the mass fraction of the conductive particles in the paste body can be 80%, 85%, 90%, etc. The higher the mass fraction of the conductive particles in the paste body, the smaller the resistivity, and the worse the elongation at break, so the mass fraction of the conductive particles in the paste body can be set to be high to meet the compression or stretching of the conductive paste layer.

[0203] As an example, the conductive paste is conductive silver paste, which includes resin and silver particles. The silver particles are doped in the resin. The mass fraction of the silver particles can be 80%, and the mass fraction of the resin can be 20%. The resin can be compressed or stretched. The density of the silver particles can be 10, and the density of the resin can be 1. When the mass fraction is converted into volume fraction, the ratio of the volume fraction of the silver particles to the volume fraction of the resin can be 2:5. After the conductive silver paste is solidified, the volume can shrink by about 10%, and the ratio of the volume fraction of the silver particles to the volume fraction of the resin in the conductive silver paste layer can be 1:2.2. At the same time, since the silver particles are good conductors and soft in quality, they will deform after being activated at low pressure, further increasing the contact area. The tensile adhesion of the conductive silver paste can be in the range of 8-9 MPa, specifically, the tensile adhesion of the conductive silver paste can be 8 MPa or 9 MPa, etc.

[0204] It should be noted that the silver particles can be micron-sized spherical, thorn-shaped, flaky, rod-shaped silver, and can also be nanometer-sized silver wire, silver rod, etc., which is subject to actual application.

[0205] The application does not make specific limitations on the manufacturing process of the conductive paste layer. The manufacturing process of the conductive paste layer can be determined according to the position of the conductive paste layer. For example, when the first sub-conductive layer is a conductive paste layer, the conductive paste can be formed by printing, spraying, etc., and then the conductive paste can be baked / heat-cured to form the conductive paste layer. For example, when the second sub-conductive layer is a conductive paste layer, the conductive paste can be formed by dot coating, etc., and then the conductive paste can be baked / heat-cured to form the conductive paste layer.

[0206] As an example, when the paste body in the conductive paste is silicone resin or silane-modified resin, the silicone resin or silane-modified resin can be coated by spraying, and then the conductive paste can be baked / heat-cured. Of course, other manufacturing processes can also be used, which are not limited here.

[0207] As another example, when the slurry body in the conductive slurry is an epoxy resin, a silica resin, the epoxy resin, the silica resin can be printed first, and then the conductive slurry is baked / heat-cured, and of course other manufacturing processes can also be used, which are not limited here.

[0208] It should be noted that the slurry body can also be selected according to the material of the foam substrate. For example, a substrate with a material similar to that of the foam substrate can be selected as the slurry body. For example, a silicon rubber conductive foam can use a silica substrate resin, thereby improving the bonding of the foam substrate and the conductive slurry.

[0209] For example, Figure 9 and Figure 10 Both of them take the first sub-conductive layer as an example, which includes a first conductive slurry layer 21, and the first conductive slurry in the first conductive slurry layer 21 is a first polymer conductive slurry to explain the conductive mechanism. Among them, Figure 10 shows a schematic diagram of the first polymer conductive slurry before film formation; Figure 17 shows a schematic diagram of the first polymer conductive slurry after film formation.

[0210] As Figure 17 shown, before film formation, the first polymer conductive slurry, that is, before curing, the first conductive particles 212 do not directly contact, at this time the first conductive slurry layer does not have conductivity, and therefore will not produce a conductive path. As Figure 19 shown, during the curing process, as the solvent continues to evaporate, the distance between the first conductive particles 212 becomes smaller and smaller, until they directly contact each other to form a conductive path D1, which is the percolation theory of the first conductive slurry. Figure 19 Two conductive paths D1 are generated in the first conductive slurry layer as an example.

[0211] It should be noted that the mass fraction of the first conductive particles in the first conductive slurry should satisfy that the conductive mechanism of the first conductive slurry is at least dominated by the percolation theory. At this time, it includes: the conductive mechanism of the first conductive slurry is only the percolation theory; or, the conductive mechanism of the first conductive slurry is dominated by the percolation theory, and can also be assisted by the tunnel effect theory or the field emission theory. When the mass fraction of the first conductive particles in the first conductive slurry is greater than or equal to 80%, the conductive mechanism of the first conductive slurry can be at least dominated by the percolation theory.

[0212] The source of the external pressure action described above is not limited in the present application. For example, it can be the pressure action directly applied by the outside to the conductive foam; or it can also be the pressure action applied by the outside to other structures in the electronic device, and then applied to the conductive foam; or it can also be the pressure action applied to the conductive foam by other structures in the electronic device itself.

[0213] It should be understood that, in the case that the first sub-conductive layer includes the conductive paste layer and the second sub-conductive layer does not include the conductive paste layer, the above-mentioned first sub-conductive layer including the conductive paste layer means that the first sub-conductive layer can only include the first conductive paste layer, or the first sub-conductive layer can include at least one other film layer, such as a mask layer, in addition to the first conductive paste layer.

[0214] As an example, Figure 19 A schematic diagram showing that the first sub-conductive layer includes the first conductive paste layer 21 and the mask layer 23 is shown. As Figure 19 shown, the first sub-conductive layer includes the first conductive paste layer 21 and the mask layer 23, and the mask layer 23 is arranged between the foam substrate 1 and the first conductive paste layer 21.

[0215] The application does not make specific limitations on the material, thickness, etc. of the above-mentioned mask layer. For example, the material of the mask layer can include metal, such as copper, etc.

[0216] For example, the thickness of the mask layer can be in the range of 0.1-0.2 μm, and specifically, the thickness of the mask layer can be 0.1 μm, 0.15 μm, 0.2 μm, etc.

[0217] It should be noted that whether the first sub-conductive layer includes the mask layer can be determined according to the manufacturing process of the through hole in the foam substrate. Specifically, when the manufacturing process is the template etching method, the first sub-conductive layer includes the mask layer; when the manufacturing process is mechanical punching or laser punching, the first sub-conductive layer does not include the mask layer. In the case that the first sub-conductive layer includes the mask layer, the thickness of the mask layer can be set to be relatively thin so as not to affect the working height of the conductive foam in the first direction. In addition, when the surface of the foam substrate after foaming is uneven, the mask layer can also flatten the foam substrate, so as to facilitate the formation of the first conductive paste layer. The first direction is the OZ direction shown in the figure, which corresponds to the thickness direction of the mobile phone.

[0218] As an example, Figure 19 A schematic diagram showing the template etching method for manufacturing the conductive foam is shown. The process of manufacturing the conductive foam by the template etching method can include the following four steps: first, as shown in Figure 17 a figure, a mask metal layer 231 is first formed on the first surface and the second surface of the foam substrate 1; second, as shown in Figure 7 b figure, the mask metal layer 231 is treated by etching liquid, so that the foam substrate 1 has a plurality of through holes k, and the mask layer 23 is formed on the surface of the foam substrate 1; third, as shown in Figure 8 c figure, the second conductive paste is spot-coated in the plurality of through holes 10, so that the second conductive paste fills the through holes k; fourth, as shown in Figure 11As shown in the d diagram in the middle, the first conductive paste is printed on the first surface and the second surface of the second conductive paste, and the first surface and the second surface of the foam substrate 1, and after curing, a first conductive paste layer is formed. Based on the above four steps, the conductive foam as shown in Figure 12b can be formed.

[0219] It should be noted that in actual application, the conductive foam can also include a bonding layer, a release layer and the like. The type, position and the like of the bonding layer are not limited in the present application. For example, the bonding layer can include any one of conductive glue, insulating glue and the like. Specifically, the bonding layer can be any one of full-area conductive glue, partial-area insulating glue and the like. The bonding layer can be arranged on any surface of the foam substrate.

[0220] The type, position and the like of the release layer are not limited in the present application. For example, the release layer can include release paper. The release layer can be arranged on the side of the second bonding layer away from the conductive layer, so as to protect the second bonding layer. When the conductive foam is used, the release layer can be removed, so as to electrically connect the conductive layer and the structure in the electronic device through the second bonding layer.

[0221] The first surface of the foam substrate can be divided into at least a first area and a second area. In the direction perpendicular to the foam substrate, the height of the first sub-conductive layer in the first area is less than the height of the first sub-conductive layer in the second area. Specifically, the height of the first sub-conductive layer in different areas can be different when the first sub-conductive layer is sprayed or printed. In this way, when applied to an electronic device, the conductive foam can be electrically connected to at least two structures with different heights, thereby enriching the application of the conductive foam in the electronic device.

[0222] Here, only the content related to the invention point is introduced, and the remaining structures can be obtained by referring to the related art, which will not be described in detail here.

[0223] The conductive foam provided by the embodiment of the present application has the following advantages. On the one hand, the first sub-conductive layer covering at least the first surface of the foam substrate, and the second sub-conductive layer located in the through hole of the foam substrate both have certain ductility, good conductivity and large resistivity (10 -5 -10 -4The conductive foam has the advantages of low working height in the first direction, low thickness, low stress between the conductive foam and the structure in the electronic device, and the like. In addition, the conductive foam can be used to electrically connect the structure in the electronic device, reduce or eliminate radiation interference, and the like, thereby effectively improving the performance of the electronic device.

[0224] Therefore, the conductive foam with low working height in the first direction is provided. When the conductive foam is applied to the electronic device, the thickness of the electronic device can be reduced, and the stress between the conductive foam and the structure in the electronic device can be low. In addition, the structure in the electronic device can be electrically connected through the conductive foam, and the radiation interference can be reduced or eliminated, thereby effectively improving the performance of the electronic device.

[0225] Optionally, as an implementable manner, as shown in Figures 14-15 、 Figures 17-18 、 Figure 11 、 Figure 15 、 Figure 15 、 Figure 16 、 Figure 16 The first conductive paste layer 21 covers at least the first surface 11 of the foam base 1, and the first conductive paste layer 21 includes a first paste main body 211 and a plurality of first conductive particles 212 connected to each other. The first conductive particles 212 are doped in the first paste main body 211, and the first conductive paste layer 21 is used to deform under the action of external pressure.

[0226] The second conductive layer is not limited herein, and for example, the second conductive layer can include any one of a second conductive paste layer, a conductive film, and the like.

[0227] In the application, when the second sub-conductive layer is a conductive film, the second sub-conductive layer can include a flexible film and a conductive film, and the conductive film wraps the flexible film, so that the second sub-conductive layer can be conductive and elastic, that is, it can be well compressed or stretched. The material of the flexible film is not limited in the application, and the material of the flexible film can include PI, for example.

[0228] The material and number of layers of the conductive film are not limited in the application, and the material of the conductive film can include copper, nickel, gold, etc., and the conductive film can be single-layer or multi-layer, and the actual needs are for reference.

[0229] As an example, Figures 7 to 8 It is shown that the second sub-conductive layer includes a flexible film 223 and a conductive film 224, and the flexible film 223 is single-layer and the conductive film 224 is also single-layer.

[0230] In the application, when the second sub-conductive layer is a second conductive paste layer, the second sub-conductive layer can only include the second conductive paste layer; or, the second sub-conductive layer can include other film layers in addition to the second conductive paste layer, such as a flexible layer, and the second conductive paste layer can wrap the flexible layer.

[0231] The following embodiments of the application are described by taking the first conductive paste in the first conductive paste layer as the first polymer conductive paste and the second conductive paste in the second conductive paste layer as the second polymer conductive paste as an example.

[0232] The manufacturing process of the second conductive paste layer is not limited in the application, and the second conductive paste can be first applied by spot coating, and then the second conductive paste is baked / heat-cured to form the second conductive paste layer. Of course, other manufacturing processes can also be used, which are not limited here.

[0233] The second sub-conductive layer is connected with part of the first conductive particles, so that the second sub-conductive layer and the first conductive paste layer have an interface layer, and the second sub-conductive layer is connected with part of the first conductive particles in the interface layer. Because the second conductive particles do not directly contact before the second polymer conductive paste is formed, that is, before curing, the second conductive paste does not have conductivity and will not form a conductive path. After the first polymer conductive paste is sprayed / printed, and before the film is formed, because the first conductive particles do not directly contact, the first conductive paste does not have conductivity and will not form a conductive path. In addition, the second polymer conductive paste does not contact the first polymer conductive paste, there is no interface layer between the second polymer conductive paste and the first polymer conductive paste, and it does not have conductivity and will not form a conductive path. During the curing process, as the solvent continues to evaporate, the distance between the second conductive particles in the second polymer conductive paste becomes smaller and smaller until they directly contact each other to form a conductive path. At the same time, the distance between the first conductive particles in the first polymer conductive paste becomes smaller and smaller until they directly contact each other to form a conductive path. In addition, the second conductive particles and the first conductive particles directly contact each other to form a conductive path, forming an interface layer.

[0234] It should be noted that the mass fraction of the second conductive particles in the second polymer conductive paste should satisfy the condition that the conduction mechanism is at least dominated by percolation theory, which includes: the conduction mechanism of the second polymer conductive paste is percolation theory; or the conduction mechanism of the second polymer conductive paste is dominated by percolation theory, supplemented by tunnel effect theory or field emission theory. The conduction mechanism of the first polymer conductive paste can refer to that of the second polymer conductive paste, which will not be described here.

[0235] As shown in FIG. 1, the conductive foam can further include an air structure 3 arranged in at least one through hole k and penetrating at least part of the second sub-conductive layer. Figures 14 to 15

[0236] The air structure has air, and the type, shape, and direction of the air structure are not limited in the present application. For example, the air structure can include air columns and air balls; the shape of the air structure can include regular polyhedrons, irregular polyhedrons, spheres, and cylinders; and the direction of the air structure can be the same as or different from that of the through hole.

[0237] It should be understood that the air structure arranged in at least one through hole means that the air structure can be arranged in only one through hole or in multiple through holes, which is not limited here.

[0238] ​The number of air structures in the application can be determined according to the volume of the through hole, the manufacturing process of the through hole, etc., which is not specifically limited here. As an example, when the through hole is made by mechanical punching, the air structure can be arranged in one or more through holes due to the larger volume of the through hole. As another example, when the through hole is made by laser punching, the air structure can be arranged in one through hole or not arranged in the through hole due to the smaller volume of the through hole.

[0239] It should be understood that the at least partially penetrating second sub-conductive layer of the air structure described above means that the air structure can only penetrate part of the second sub-conductive layer; or the air structure can only penetrate the entire second sub-conductive layer; or the air structure can penetrate at least part of the first conductive paste layer in addition to penetrating the entire second sub-conductive layer, which is not specifically limited here.

[0240] As an example, Figures 17 to 18 The air structure 3 in the above formula penetrates the entire second sub-conductive layer and the entire first conductive paste layer 21.

[0241] If the through hole of the foam substrate is filled with conductive paste in the application, the rebound force of the conductive foam may increase sharply, which may cause interface damage, for example, when the conductive foam is electrically connected with the display screen of an electronic device, the display screen film may be damaged, etc. In addition, the conductive paste needs to be adjusted after solidification, which is complicated to manufacture. Therefore, by arranging the air structure, the rebound force of the conductive foam can be effectively reduced, and the stress does not need to be adjusted, which is simple and easy to implement. Especially when the through hole is made by mechanical punching, the air structure has a more obvious effect.

[0242] The conductive foam provided by the embodiments of the application has the following advantages. On the one hand, the first conductive paste layer covering at least the first surface of the foam substrate has certain ductility, good conductivity, and larger resistivity (10 -5 -10 -4The conductive foam has the advantages of low working height in the first direction, large contact area with the structure in the electronic device, and the like. The conductive foam has the advantages of low working height in the first direction, and the like. The conductive foam can be applied to the electronic device, so that the thickness of the electronic device can be reduced, and the stress between the conductive foam and the structure in the electronic device can be small. In addition, the structure in the electronic device can be electrically connected through the conductive foam, and the radiation interference can be reduced or eliminated, so that the performance of the electronic device can be improved.

[0243] Therefore, the conductive foam with low working height in the first direction is provided. When the conductive foam is applied to the electronic device, the thickness of the electronic device can be reduced, and the stress between the conductive foam and the structure in the electronic device can be small. In addition, the structure in the electronic device can be electrically connected through the conductive foam, and the radiation interference can be reduced or eliminated, so that the performance of the electronic device can be improved.

[0244] Optionally, as an implementable manner, as shown in Figures 7 to 8 The first sub-conductive layer includes a conductive foil 4, and the conductive foil 4 is used to deform under the action of external pressure. The second sub-conductive layer includes a second conductive paste layer 22, and the second conductive paste layer 22 is arranged in at least part of the through hole k and is used to deform under the action of external pressure. The second conductive paste layer 22 includes a second paste main body 221 and a plurality of second conductive particles 222 connected with each other. The second conductive particles 222 are doped in the second paste main body 221, and part of the second conductive particles 222 are connected with the conductive foil 4.

[0245] The material of the conductive foil is not limited in the present application. For example, the conductive foil can include a metal foil, such as an aluminum foil, and the like.

[0246] The number of layers of the conductive foil is not limited in the present application. For example, the conductive foil can be single-layered. Alternatively, the conductive foil can be multi-layered.

[0247] The application does not make specific limitations on the position of the conductive foil. For example, the conductive foil can coat at least the first surface of the foam substrate; or, the conductive foil can coat at least the surface of the second conductive paste layer close to the first surface of the foam substrate in addition to coating at least the first surface of the foam substrate.

[0248] As an example, Figures 14 to 15 The conductive foil 4 coats the first surface (upper surface) and the second surface (lower surface) of the foam substrate 1, and the conductive foil 4 coats the first surface (upper surface) and the second surface (lower surface) of the second conductive paste layer 22, wherein the first surface of the second conductive paste layer 22 is close to the first surface of the foam substrate 1, and the second surface of the second conductive paste layer 22 is close to the second surface of the foam substrate 1.

[0249] It should be noted that the thickness of the conductive foil in the direction perpendicular to the foam substrate can be thin, so as not to affect the working height of the conductive foam in the first direction.

[0250] The conductive foam provided by the application has the following advantages. On the one hand, the second conductive paste layer in at least part of the through holes of the foam substrate has certain ductility, good conductivity, and large resistivity, and the second conductive paste in the second conductive paste layer is in a liquid state before film formation, and the volume is reduced during solidification. In addition, the foam substrate has elasticity, so that the foam substrate and the second conductive paste layer in the through holes can be well compressed or stretched. On the other hand, the thickness of the conductive foil in the direction perpendicular to the foam substrate can be small, and the conductive foil can be compressed or stretched to a certain extent. Therefore, the conductive foam can exhibit good conductivity while having a low working height in the first direction.

[0251] Optionally, as an implementable manner, as shown in Figures 17 to 18 、 Figure 11 、 Figure 12b The second sub-conductive layer fills all the through holes k; the first conductive paste layer 21 also coats at least the first surface 201 of the second sub-conductive layer; wherein the first surface 201 of the second sub-conductive layer is close to the first surface 11 of the foam substrate 1.

[0252] The first conductive paste layer of the application coating at least the first surface of the second sub-conductive layer means that the first conductive paste layer can only coat the first surface of the second sub-conductive layer; or, the first conductive paste layer can coat other surfaces of the second sub-conductive layer in addition to coating the first surface of the second sub-conductive layer. Here, one surface of the second sub-conductive layer refers to the surface close to one surface of the foam substrate.

[0253] As an example, as shown in Figure 11 、 Figures 12a to 12b ,Figure 12a As shown in FIG. 1, the first conductive paste layer covers the first surface 11 of the foam substrate 1 and the first surface 201 of the second sub-conductive layer, and the first conductive paste layer also covers the second surface 12 of the foam substrate 1 and the second surface 202 of the second sub-conductive layer.

[0254] It should be understood that, when applied in an electronic device, the first surface of the foam substrate is used to electrically connect with a first structure in the electronic device based on the first conductive paste layer, and the second surface is used to electrically connect with a second structure in the electronic device based on the first conductive paste layer. For example, the first structure can be a PCB, and the second structure can be an antenna.

[0255] The conductive foam provided by the embodiments of the present application includes a foam substrate with a through hole, and a second sub-conductive layer filled with the through hole is formed by a conductive material in the through hole. The conductive material can be compressed or stretched at least. Meanwhile, the conductive foam also has a first conductive paste layer in communication with the second sub-conductive layer, so that the conductive foam can realize a lower working height in the first direction, and is easy to manufacture and simple to implement.

[0256] Optionally, as an implementable manner, as shown in Figure 12b and Figures 13a to 13c As shown in FIG. 1, the second sub-conductive layer fills the first part k1 in the through hole k, and the first conductive paste layer 21 also fills the second part k2 in the through hole k except the first part k1; wherein the first part k1 is greater than the second part k2.

[0257] The present application does not make specific limitation on the second sub-conductive layer, which can be different from the type of the first conductive paste layer. For example, the second sub-conductive layer is a conductive film. As an example, as shown in Figure 11 the second sub-conductive layer includes a flexible film 223 and a conductive film 224, and the conductive film 224 wraps the entire flexible film 223.

[0258] In application, the second sub-conductive layer can include a PI film and a copper film, and the copper film wraps the entire PI film.

[0259] Alternatively, the second sub-conductive layer can also be of the same type as the first conductive paste layer, i.e., the second sub-conductive layer is a second conductive paste layer, but the first conductive paste layer is different from the second conductive paste layer. For example, the first conductive paste layer can include a first paste body and first conductive particles, and the second conductive paste layer can include a second paste body and second conductive particles, which can be that the first paste body is different from the second paste body, and the first conductive particles are the same as the second conductive particles; or the first paste body is the same as the second paste body, and the first conductive particles are different from the second conductive particles; or the first paste body is different from the second paste body, and the first conductive particles are different from the second conductive particles, which are not limited here.

[0260] It should be noted that in the case where the first paste body is different from the second paste body, the first paste body can be provided with the characteristics of smaller viscosity, easy leveling, larger volume change rate (for example, greater than 50%) after curing, easy curing, larger internal stress, better heat dissipation, etc., and the second paste body can be provided with the characteristics of good elasticity, larger viscosity, larger adhesion, lower volume shrinkage rate (for example, less than 10%) after curing, high temperature resistance, no internal stress, etc.

[0261] As an example, the first resin can be an epoxy resin, and the first conductive particles can be silver (Ag) particles, the second resin can be a silicone resin, and the second conductive particles can be silver particles, at this time the first conductive paste and the second conductive paste are different conductive silver pastes.

[0262] As another example, the first resin can be an epoxy resin, and the first conductive particles can be copper particles, the second resin can be a silicone resin, and the second conductive particles can be copper particles, at this time the first conductive paste and the second conductive paste are different conductive copper pastes.

[0263] As another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles, the second resin can be an epoxy resin, and the second conductive particles can be copper particles, at this time the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0264] As another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles, the second resin can be a silicone resin, and the second conductive particles can be copper particles, at this time the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0265] As another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles, the second resin can be a silicone resin, and the second conductive particles can be copper particles, at this time the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0266] The first part is greater than the second part in the above description of the present application refers to the volume of the first part being greater than the volume of the second part. For example, the volume of the first part accounts for 80-90% of the total volume of the through hole, specifically, the volume of the first part accounts for 80%, 85% or 90% of the total volume of the through hole, and the like. At this time, the second sub-conductive layer occupies the first volume in the through hole, that is, the through hole is not filled, but the volume of the part that is not filled (that is, the second part) is small, so that the first conductive paste flows into the second part of the through hole and solidifies into a film, and at this time the first conductive paste layer fills a small part of the gap of the through hole.

[0267] As an example, Figures 13a to 13c The above-mentioned conductive foam is shown in the process of making, which can include the following two steps: first step: as shown in Figure 13a The second sub-conductive layer fills the first part k1 of the through hole k, and the second part k2 of the through hole k is not filled; the second step: as shown in Figure 13b The first conductive paste is printed or sprayed, and since the first part k1 is greater than the second part k2, the first conductive paste flows into the second part k2 to fill the through hole and form the first conductive paste layer 21.

[0268] It should be noted that the relationship between the first part and the second part can also not be limited, for example, the first part can be equal to the second part, specifically, the volume of the first part is equal to the volume of the second part; or the first part can be smaller than the second part, specifically, the volume of the first part is smaller than the volume of the second part, which can be determined according to actual process and the like.

[0269] The conductive foam provided by the embodiments of the present application includes a foam substrate with through holes, and part of the through holes is provided with a conductive material, which can be compressed or stretched at least, and at the same time, since the second sub-conductive layer occupies most of the through hole, the first conductive paste can also flow into the through hole to fill a small part of the through hole to connect with the second sub-conductive layer and form a first sub-conductive layer, so that the conductive foam can realize a low working height in the first direction.

[0270] Optionally, as an implementable way, as shown in Figure 13c The second sub-conductive layer fills the entire through hole k; the first conductive paste layer 21 has at least one gap x, and the gap x at least partially overlaps the through hole k in the direction perpendicular to the foam substrate 1, and the second sub-conductive layer is also arranged in the gap x.

[0271] The present application does not make specific limitations on the second sub-conductive layer, which can be different from the type of the first conductive paste layer, for example, the second sub-conductive layer is a conductive film. As an example, as shown in Figures 7 to 8As shown, the second sub-conductive layer includes a flexible film 223 and a conductive film 224, and the conductive film 224 wraps the entire flexible film 223.

[0272] In an application, the second sub-conductive layer can include a PI film and a copper film, and the copper film wraps the entire PI film.

[0273] Alternatively, the second sub-conductive layer can also be of the same type as the first conductive paste layer, i.e., the second sub-conductive layer is a second conductive paste layer, but the first conductive paste layer is different from the second conductive paste layer. For example, the first conductive paste layer can include a first paste body and first conductive particles, and the second conductive paste layer can include a second paste body and second conductive particles. The first paste body and the second paste body can be different, and the first conductive particles and the second conductive particles can be the same. Alternatively, the first paste body and the second paste body can be the same, and the first conductive particles and the second conductive particles can be different. Alternatively, the first paste body and the second paste body can be different, and the first conductive particles and the second conductive particles can be different. Here, no specific limitation is made.

[0274] It should be noted that in the case where the first paste body and the second paste body are different, the first paste body can be provided with the characteristics of smaller viscosity, easier leveling, larger volume change rate (e.g., greater than 50%) after solidification, easier solidification, larger internal stress, and better heat dissipation, and the second paste body can be provided with the characteristics of better elasticity, larger viscosity, larger adhesion, lower volume shrinkage rate (e.g., less than 10%) after solidification, high temperature resistance, and no internal stress.

[0275] As an example, the first resin can be an epoxy resin, and the first conductive particles can be silver (Ag) particles. The second resin can be a silicone resin, and the second conductive particles can be silver particles. In this case, the first conductive paste and the second conductive paste are different conductive silver pastes.

[0276] As another example, the first resin can be an epoxy resin, and the first conductive particles can be copper particles. The second resin can be a silicone resin, and the second conductive particles can be copper particles. In this case, the first conductive paste and the second conductive paste are different conductive copper pastes.

[0277] As yet another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles. The second resin can be an epoxy resin, and the second conductive particles can be copper particles. In this case, the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0278] As still another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles. The second resin can be a silicone resin, and the second conductive particles can be copper particles. In this case, the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0279] As still another example, the first resin can be silica gel resin, and the first conductive particles can be copper particles, the second resin can be epoxy resin, and the second conductive particles can be silver particles, at this time, the first conductive paste can be conductive copper paste, and the second conductive paste can be conductive silver paste. Of course, other first conductive paste and second conductive paste can also be used, and the specific application is subject to the actual application.

[0280] It should be understood that the first conductive paste layer having at least one gap means that the first conductive paste layer can have only one gap, or the first conductive paste layer can have multiple gaps, which are not specifically limited here.

[0281] It should be understood that the gap at least partially overlaps with the through hole in the direction perpendicular to the foam substrate means that the gap can partially overlap with the through hole in the direction perpendicular to the foam substrate, or the gap can fully overlap with the through hole in the direction perpendicular to the foam substrate, which is not specifically limited here.

[0282] It should be understood that the second sub-conductive layer is further provided at least in the gap means that the second sub-conductive layer can be provided only in the gap, or the second sub-conductive layer can be provided on the side of the first conductive paste layer away from the second sub-conductive layer, which is not specifically limited here.

[0283] The volume of the gap is not specifically limited in the present application, and can be determined according to the manufacturing process, etc. Figure 12b A part of the manufacturing process of the conductive foam is shown, which can include the following three steps: first step: as shown in Figures 13c to 15 , the second sub-conductive layer fills the first part k1 of the through hole k, the second part k2 of the through hole k is not filled, and the second part k2 is greater than the first part k1; second step: as shown in Figures 17 to 18 , when printing the first conductive paste, the first conductive paste cannot be in contact with the pad printing head due to the lack of any material support at the overlapping position with the through hole k, resulting in the failure to transfer the first conductive paste into the through hole k, and after baking / heat curing, the first conductive paste layer 21 forms a gap x at least partially overlapping with the through hole k; third step: as shown in Figure 7 , the second conductive paste is formed in the second part k2 and the gap x, and the second conductive paste layer 22 is formed after baking / heat curing.

[0284] It should be noted that the part of the first conductive paste layer can also be located below the second conductive particles in the second conductive paste layer.

[0285] The application does not specifically limit the relationship between the first part and the second part in the through hole. For example, the first part can be larger than the second part, specifically, the volume of the first part can be larger than the volume of the second part; or the first part can be equal to the second part, specifically, the volume of the first part is equal to the volume of the second part; or the first part can be smaller than the second part, specifically, the volume of the first part is smaller than the volume of the second part.

[0286] The conductive foam provided by the embodiment of the application includes a foam base body with through holes, and a conductive material is arranged in part of the through holes. The conductive material can be compressed or stretched at least, and at the same time, the first conductive paste cannot be transferred into the through hole. Therefore, after solidification, a second sub-conductive layer needs to be formed in the second part in the through hole and the gap of the first conductive paste, so as to realize the communication between the first conductive paste layer and the second sub-conductive layer, thereby enabling the conductive foam to realize a low working height in the first direction.

[0287] Optionally, as an implementable manner, as shown in Figure 8 、 Figure 11 、 Figure 12b 、 Figures 13c to 15 The second sub-conductive layer is a second conductive paste layer 22, the second conductive paste layer 22 includes a second paste main body 221 and a plurality of second conductive particles 222 connected with each other, the second conductive particles 222 are doped in the second paste main body 221, and part of the second conductive particles 222 are connected with part of the first conductive particles 212.

[0288] It should be understood that the first conductive paste layer and the second conductive paste layer described above can be different conductive paste layers, specifically, the first paste main body and the second paste main body can be different, and the first conductive particles and the second conductive particles can also be different; or the first paste main body and the second paste main body can be different, but the first conductive particles and the second conductive particles are the same; or the first conductive particles and the second conductive particles are different, but the first paste main body and the second paste main body are the same, which is not specifically limited here.

[0289] It should be noted that in the case where the first paste main body and the second paste main body are different, the first paste main body can be provided with the characteristics of smaller viscosity, easy leveling, larger volume change rate (for example, greater than 50%) after solidification, easy solidification, larger internal stress, better heat dissipation, etc., and the second paste main body can be provided with the characteristics of good elasticity, larger viscosity, larger adhesion, lower volume shrinkage rate (for example, less than 10%) after solidification, high temperature resistance, no internal stress, etc.

[0290] As an example, the first resin can be an epoxy resin, and the first conductive particles can be silver (Ag) particles, the second resin can be a silicone resin, and the second conductive particles can be silver particles, in which case the first conductive paste and the second conductive paste are different conductive silver pastes.

[0291] As another example, the first resin can be an epoxy resin, and the first conductive particles can be copper particles, the second resin can be a silicone resin, and the second conductive particles can be copper particles, in which case the first conductive paste and the second conductive paste are different conductive copper pastes.

[0292] As yet another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles, the second resin can be an epoxy resin, and the second conductive particles can be copper particles, in which case the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0293] As still another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles, the second resin can be a silicone resin, and the second conductive particles can be copper particles, in which case the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0294] As yet another example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles, the second resin can be a silicone resin, and the second conductive particles can be copper particles, in which case the first conductive paste is a conductive silver paste, and the second conductive paste is a conductive copper paste.

[0295] It should be understood that the first conductive paste layer and the second conductive paste layer described above in the present application can be the same conductive paste layer, specifically, the first paste body and the second paste body are the same, and the first conductive particles and the second conductive particles are the same.

[0296] As an example, the first resin can be an epoxy resin, and the first conductive particles can be silver particles, in which case the first conductive paste and the second conductive paste are both conductive silver pastes.

[0297] As another example, the first resin can be a silicone resin, and the first conductive particles can be silver particles, in which case the first conductive paste and the second conductive paste are both conductive silver pastes.

[0298] As yet another example, the first resin can be an epoxy resin, and the first conductive particles can be copper particles, in which case the first conductive paste and the second conductive paste are both conductive copper pastes.

[0299] As still another example, the first resin can be a silicone resin, and the first conductive particles can be copper particles, in which case the first conductive paste and the second conductive paste are both conductive copper pastes. Of course, there can be other first conductive paste layers and second conductive paste layers, and the specific application is subject to the actual application.

[0300] The conductive foam provided by the embodiments of the present application comprises a foam base with through holes, and a second conductive paste layer is arranged in at least part of the through holes. The second conductive paste layer can be compressed or stretched at least. In addition, the conductive foam also has a first conductive paste layer, which is in communication with the second conductive paste layer, so that the conductive foam can realize a low working height in the first direction, and is easy to manufacture and simple to realize.

[0301] Optionally, as an implementable manner, as shown in Figures 17 to 18 、 Figure 8 、 Figure 11 、 Figure 12b 、 Figure 13c 、 Figure 14 The shape of the foam base 1 is a polyhedron, the first conductive paste layer 21 covers the first surface 11 and the second surface 12 of the polyhedron, and the first conductive paste layer 21 also covers the first surface 201 and the second surface 202 of the second sub-conductive layer; the extension direction of the through hole k is the direction from the first surface 11 of the polyhedron to the second surface 12 of the polyhedron; wherein the first surface 201 of the second sub-conductive layer is close to the first surface 11 of the polyhedron, and the second surface 202 of the second sub-conductive layer is close to the second surface 12 of the polyhedron; the second surface 12 of the polyhedron is used for electrically connecting with a second structure in an electronic device through the first conductive paste layer 21.

[0302] The present application does not make specific limitations on the above-mentioned polyhedron. For example, the above-mentioned polyhedron can include a cube, a hexahedron, an octahedron, etc.

[0303] It should be noted that the first conductive paste layer can also cover other surfaces of the polyhedron. For example, the first conductive paste layer can cover all surfaces of the polyhedron. In this case, the polyhedron can be electrically connected with multiple structures in an electronic device through the first conductive paste layers of the surfaces.

[0304] The conductive foams with different structures will be described in detail below.

[0305] For example, as shown in Figure 15As shown in the figure, the foam substrate 1 has four identical cylindrical through holes k, each through hole k is filled with a second conductive paste layer, and the first surface 11 and the second surface 12 of the foam substrate 1, the first surface 201 and the second surface 202 of the second sub-conductive layer also have a first conductive paste layer 21. The first conductive paste layer 21 includes a first paste main body 211 and a first conductive particle 212, the first paste main body 211 is epoxy resin, and the first conductive particle 212 is silver particle; the second conductive paste layer includes a second paste main body 221 and a second conductive particle 222, the second paste main body 221 is silicone resin, and the second conductive particle 222 is silver particle.

[0306] As shown in the figure, Figure 8 the foam substrate 1 has four identical cylindrical through holes k, the first part k1 of each through hole k is filled with a conductive film, the first part k1 is larger than the second part k2, and the first surface and the second surface of the foam substrate 1, the first surface and the second surface of the second sub-conductive layer, and the second part k2 of each through hole k also have a first conductive paste layer 21. The first conductive paste layer 21 includes a first paste main body 211 and a first conductive particle 212, the first paste main body 211 is epoxy resin, and the first conductive particle 212 is silver particle; the conductive film includes a flexible film 223 and a conductive film 224, the flexible film 223 is a PI film, and the conductive film 224 is a copper film.

[0307] As shown in the figure, Figure 16 the foam substrate 1 has three identical cylindrical through holes k, the first part k1 of each through hole k is filled with a second conductive paste layer, the first part k1 is larger than the second part k2, and the first surface and the second surface of the foam substrate 1, the first surface and the second surface of the second sub-conductive layer, and the second part k2 of each through hole k also have a first conductive paste layer 21. The first conductive paste layer 21 includes a first paste main body 211 and a first conductive particle 212, the first paste main body 211 is epoxy resin, and the first conductive particle 212 is silver particle; the second conductive paste layer includes a second paste main body 221 and a second conductive particle 222, the second paste main body 221 is silicone resin, and the second conductive particle 222 is silver particle.

[0308] As shown in the figure, Figure 17As shown in the figure, the first surface and the second surface of the foam base 1, the first surface and the second surface of the second conductive sub-layer have a first conductive paste layer 21, the foam base 1 has three identical cylindrical through holes k, the first conductive paste layer 21 on the side of the first surface has three voids x, the first conductive paste layer 21 on the side of the second surface has three voids x, and each through hole k and each void x is filled with a second conductive paste layer. Among them, the first conductive paste layer 21 includes a first paste main body 211 and first conductive particles 212, the first paste main body 211 is epoxy resin, and the first conductive particles 212 are silver particles; the second conductive paste layer includes a second paste main body 221 and second conductive particles 222, the second paste main body 221 is silicone resin, and the second conductive particles 222 are silver particles.

[0309] As shown in the figure, Figure 8 The foam base 1 has four identical cylindrical through holes k, each through hole k is filled with a first conductive paste layer 21, and the first surface and the second surface of the foam base 1, the first surface and the second surface of the first conductive paste layer 21 in the through hole also have a first conductive paste layer 21. Among them, the first conductive paste layer 21 includes a first paste main body 211 and first conductive particles 212, the first paste main body 211 is epoxy resin, and the first conductive particles 212 are silver particles.

[0310] Figure 18 As shown in the figure, Figure 8 In the conductive foam, an air structure 3 is additionally arranged in one through hole k. Among them, the air structure 3 is an air column, and the air column penetrates the first conductive paste layer 21 and the second conductive paste layer 22.

[0311] As shown in the figure, Figure 7 to 8 The foam base 1 has four identical cylindrical through holes k, each through hole k is filled with a second conductive paste layer 22, and the first surface and the second surface of the foam base 1, the first surface and the second surface of the second conductive paste layer also have a conductive foil 4. Among them, the second conductive paste layer 22 includes a second paste main body 221 and second conductive particles 222, the second paste main body 221 is silicone resin, and the second conductive particles 222 are silver particles; the conductive foil 4 is an aluminum foil.

[0312] Figure 11 As shown in the figure, Figure 12b In the conductive foam, a mask layer 23 is further arranged between the first conductive paste layer 21 and the second conductive paste layer 22. Among them, the mask layer 23 is a metal mask layer.

[0313] Figure 13c As shown in the figure, Figure 15 The foam base 1 has four identical cylindrical through holes k, and the second diameter of each through hole k is d2. Among them, d2 is less than d1.

[0314] It should be noted that the embodiments of the present application are all illustrated by taking the same material in the plurality of through holes in the foam substrate as an example, of course, the same material in part of the plurality of through holes and different materials in part of the plurality of through holes can also be set; or, different materials in the plurality of through holes can also be set, which is not limited here.

[0315] Optionally, as an implementable way, as shown in Figures 17 to 18 、 Figure 8 、 Figure 18 、 Figure 8 、 Figure 18 、 Figure 14 , the shape of the through hole k includes a cylinder when the second conductive paste layer 22 and the first conductive paste layer 21 are different conductive paste layers; the doping concentration of the second conductive particles 222 in the second paste body 221 is inversely proportional to the diameter of the circular face in the cylinder.

[0316] It should be understood that, as shown in Figure 14 and Figure 20 , the conductive foam includes the first conductive paste layer 21 and the second conductive paste layer 22, and the second conductive paste layer 22 fills the through hole k, and the shape of the through hole k is a cylinder. The difference lies in that Figure 21 the first diameter d1 of the circular face in the cylinder of the through hole k is greater than Figure 22 the second diameter d2 of the circular face in the cylinder of the through hole k.

[0317] When the diameter of the circular face in the cylinder is large, the doping concentration of the first conductive particles in the first paste body can be greater than or equal to 70%, specifically, the doping concentration of the first conductive particles in the first paste body can be 70%, 75% or 80% and the like; the doping concentration of the second conductive particles in the second paste body can be greater than or equal to 50%, specifically, the doping concentration of the second conductive particles in the second paste body can be 50%, 60% or 70% and the like. Therefore, the thickness of the first conductive paste layer in the direction perpendicular to the conductive substrate can be in the range of 5-10 μm, specifically, the thickness of the first conductive paste layer in the direction perpendicular to the conductive substrate can be 5 μm, 8 μm or 10 μm and the like.

[0318] When the diameter of the circular face in the cylinder is small, the doping concentration of the first conductive particles in the first slurry body can be greater than or equal to 70%, specifically, the doping concentration of the first conductive particles in the first slurry body can be 70%, 75%, or 80%, etc.; the doping concentration of the second conductive particles in the second slurry body can be greater than or equal to 70%, specifically, the doping concentration of the second conductive particles in the second slurry body can be 70%, 75%, or 80%, etc. Thus, the thickness of the first conductive slurry layer in the direction perpendicular to the conductive substrate is in the range of 5-10 μm, specifically, the thickness of the first conductive slurry layer in the direction perpendicular to the conductive substrate can be 5 μm, 8 μm, or 10 μm, etc.

[0319] The conductive foam provided by the embodiments of the present application can be used to produce through holes with different pore sizes according to different processes, and the doping concentration of the conductive particles in the slurry body can be designed according to the through hole, and the concentration of the conductive particles can be as high as the percolation theory as the main conduction mechanism, so that when the content of the conductive particles is high, the conductive network is mainly formed by directly connecting the conductive particles, and there is no or auxiliary tunnel effect theory or field emission theory, which can not only affect the PIM performance, but also make the conductive foam easy to compress or stretch, and the working height in the first direction can be low.

[0320] It should be noted that when the diameter of the circular face in the cylinder is small, the width of the conductive foam in the second direction and the third direction can be further reduced. As an example, when the through hole is made by laser drilling, the working height of the conductive foam in the first direction, the second direction and the third direction can be small. The second direction is the OX direction shown in the figure, which can correspond to the width direction of the mobile phone; the third direction is the OY direction shown in the figure, which can correspond to the length direction of the mobile phone.

[0321] Optionally, as an implementable manner, as shown in Figure 23 When the second conductive slurry layer 22 and the first conductive slurry layer 21 are the same conductive slurry layer, the shape of the through hole k includes a cylinder; the doping concentration of the second conductive particles 222 in the second slurry body 221 is not related to the diameter of the circular face in the cylinder.

[0322] As an example, Figure 22 In the second sub-conductive layer in the through hole is the first conductive slurry layer 21, and the diameters of the two circular faces of the cylinder are the same.

[0323] It should be noted that the second sub-conductive layer in the through hole can also be the second conductive slurry layer, and the first surface and the second surface of the foam substrate, as well as the first surface and the second surface of the second conductive slurry layer, are also the second conductive slurry layer.

[0324] When the diameter of the circular face in the cylinder is large, the doping concentration of the second conductive particles in the second slurry body can be greater than or equal to 50%, specifically, the doping concentration of the second conductive particles in the second slurry body can be 50%, 60%, or 70%, etc. Thus, the thickness of the first conductive slurry layer in the direction perpendicular to the conductive substrate can range from 20 to 40 μm, specifically, the thickness of the first conductive slurry layer in the direction perpendicular to the conductive substrate can be 20 μm, 30 μm, or 40 μm, etc.

[0325] When the diameter of the circular face in the cylinder is large or small, the doping concentration of the second conductive particles in the second slurry body can be greater than or equal to 70%, specifically, the doping concentration of the second conductive particles in the second slurry body can be 70%, 75%, or 80%, etc. Thus, the thickness of the first conductive slurry layer in the direction perpendicular to the conductive substrate can range from 5 to 10 μm, specifically, the thickness of the first conductive slurry layer in the direction perpendicular to the conductive substrate can be 5 μm, 8 μm, or 10 μm, etc.

[0326] The conductive foam provided by the embodiments of the present application can be used to produce through holes with different pore sizes according to different processes, and the doping concentration of the conductive particles in the slurry body can be designed according to the through holes. Meanwhile, the concentration of the conductive particles can be high enough to use the percolation theory as the main conductive mechanism. Thus, when the content of the conductive particles is high, the conductive network is mainly formed by directly connecting the conductive particles, and there is no or auxiliary tunnel effect theory or field emission theory. In this way, the PIM performance can not be affected, and the conductive foam is easy to compress or stretch, and the working height in the first direction can be low.

[0327] The above only introduces the content related to the invention points, and the remaining structures can be obtained by referring to the related technologies, which will not be described in detail here.

[0328] The embodiments of the present application also provide an electronic device including the conductive foam described above.

[0329] The electronic device provided by the embodiments of the present application includes the conductive foam with a low working height in the first direction, so that the thickness of the electronic device can be effectively reduced, and the electronic device can reduce or eliminate the radiation stray interference, etc., thereby effectively improving the performance of the electronic device.

[0330] The shape of the conductive foam is hexahedron, and the various applications of the conductive foam in the electronic device are specifically described below.

[0331] Optionally, as shown in Figure 23 and Figure 20 , the first structure in the electronic device at least includes a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam when rotating.

[0332] The camera assembly is not limited in the present application, and the camera assembly may include a camera, for example.

[0333] In the case of a camera assembly being a camera, the camera may include a front camera and a rear camera. The front camera may be disposed on a side of the display module away from the middle frame, and the rear camera may be disposed on a side of the rear shell away from the middle frame, which is subject to actual application.

[0334] It should be understood that the first structure in the above-mentioned electronic device at least includes a camera assembly, which means that the first structure in the electronic device may only include a camera assembly, or the first structure in the electronic device may include other structures in addition to the camera assembly, which is not limited here.

[0335] Figure 21 And Figure 20 respectively show a structure diagram of the front camera 501 and the shielding cover 502 electrically connected in the related art.

[0336] As Figure 21 shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503, and the shielding cover 502 is electrically connected to the PCB 504, resulting in a long ground (GND) path to the PCB 504, which cannot effectively improve the electromagnetic shielding of the electronic device and other problems.

[0337] As Figure 24 shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503 and the bracket steel sheet 505, which may cause the substrate 507 of the front camera 501 to have no space to place the screw 506 to ensure the distance between the bracket steel sheet 505 and the substrate 507.

[0338] At this time, if single-sided conductive adhesive is used to ensure the distance between the bracket steel sheet 505 and the substrate 507, there may be a problem of not being able to contact; if double-sided conductive adhesive is used to ensure the distance between the bracket steel sheet 505 and the substrate 507, the bracket steel sheet 505 may be damaged while being disassembled. And if the bracket steel sheet 505 is an insert injection bracket steel sheet, although there is a screw 506 near the bracket steel sheet 505, the insert injection bracket steel sheet may cause the edge of the sealing glue to overflow, and if an insulating layer is formed between the bracket steel sheet 505 and the conductive adhesive, it may cause insufficient or no contact.

[0339] To solve the above problems, it can be considered to realize the electrical connection between the camera assembly such as the camera and the shielding cover by setting the conductive foam.

[0340] However, the conductive foam in the related art often cannot be placed near the camera due to problems such as high working height.

[0341] Therefore, the conductive foam with low working height in the first direction provided by the embodiments of the present application can well realize the electrical connection of the camera and other structures, and can improve the electromagnetic shielding and other problems in the electronic device.

[0342] Figure 24 A schematic diagram of the conductive foam 05 of the embodiments of the present application for electrically connecting the front camera 501 and the shielding cover 502 is shown. Figure 25 A schematic diagram of the conductive foam 05 of the embodiments of the present application for electrically connecting the rear camera 508 and the shielding cover 502 is shown.

[0343] As shown in Figure 25 , the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive foam 05, and the shielding cover 502 is fixedly connected to the PCB 504 through the screw 506.

[0344] As shown in Figure 25 , the middle frame 102 and the substrate 509 of the rear camera 508 are electrically connected through the conductive foam 05, the shielding cover 502 and the bracket steel sheet 505 are electrically connected through the conductive foam 05, and the substrate 509 of the rear camera 508 is also fixedly connected to the PCB 504 through the screw 506.

[0345] The electronic device provided by the embodiments of the present application can electrically connect the camera assembly such as the camera and the conductive foam. Since the working height of the conductive foam in the first direction is low, the conductive foam can be placed between the camera and other structures. During the rotation of the camera in any direction, the camera can always maintain electrical connection with the conductive foam due to the good compression or stretching of the conductive foam, thereby ensuring the performance of the electronic device. On the other hand, since the conductive foam is an independent structure and can be separated, when the conductive foam needs to be replaced, the electronic device does not need to be disassembled, thereby avoiding the overall scrapping of the electronic device. On the other hand, the conductive foam can effectively absorb the tolerance existing in the electrical connection of the structure of the electronic device, thereby avoiding poor contact. On the other hand, the conductive foam can make the ground (GND) path short. At the same time, if there is a problem such as glue overflow, the conductive foam can also be improved by strain. Therefore, the performance of the electronic device of the embodiments of the present application is greatly improved.

[0346] Optionally, in the electronic device of Figure 25 , as shown in Figure 25 , the first surface 11 of the foam base body 1 is electrically connected to the display screen 111 through the conductive layer, and the second surface 12 of the foam base body 1 is connected to the middle frame 102 through the conductive layer.

[0347] Thus, the first surface and the second surface in the foam body are electrically connected with the structure in the electronic device, so that the conductive foam can be conducted in the second direction and the third direction respectively, and the second direction and the third direction can be perpendicular.

[0348] The electronic device provided by the embodiment of the present application can effectively reduce the stress between the contact interface of the conductive foam and the antenna and the stress between the contact interface of the conductive foam and the middle frame, and effectively improve the performance of the electronic device.

[0349] Optionally, in the electronic device, Figure 26 as shown in the figure, the first surface 11 of the foam body 1 is electrically connected with the reed 108 through a conductive layer, and the second surface 12 of the foam body 1 is electrically connected with the PCB 504 through a conductive layer. Figure 26

[0350] Thus, the two surfaces in the foam body are electrically connected with the structure in the electronic device, so that the conductive foam can be conducted in the second direction and the third direction respectively, and the second direction and the third direction can be perpendicular.

[0351] It should be noted that, Figure 26 the PCB 504 in the electronic device can be replaced by a display screen, a battery cover, a decorative part or the like.

[0352] Figure 27 The middle frame 102 in the electronic device can be a metal middle frame, and the metal middle frame is wrapped with an anti-oxidation layer 110.

[0353] As shown in the figure, the surface of the middle frame 102 in contact with the reed 108 can be subjected to laser etching treatment to form a laser etching surface 109. Figure 27 The electronic device provided by the embodiment of the present application can effectively reduce the stress between the contact interface of the conductive foam and the reed and the stress between the contact interface of the conductive foam and the PCB, and effectively improve the performance of the electronic device.

[0354] Optionally, in the electronic device,

[0355] as shown in the figure, the first surface 11 of the foam body 1 is electrically connected with the reed 108 through a conductive layer, and the second surface 12 of the foam body 1 is electrically connected with the PCB 504 through a conductive layer. Figure 27 Figure 28

[0356] ​​​Thus, two surfaces in the foam substrate are electrically connected with the structures in the electronic device, so that the conductive foam can conduct electricity in the second direction and the third direction, respectively.

[0357] It should be noted that, as shown in Figure 28 , the electronic device can further include an antenna 105, a middle frame 102, and a plastic 107, and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107.

[0358] The side surface of the antenna 105 close to the spring 108 can be subjected to laser etching treatment to form a laser etching surface 109.

[0359] The antenna 105 can be wrapped with an anti-oxidation layer 110.

[0360] The electronic device provided by the embodiment of the present application realizes the electrical connection between the spring and the PCB through the conductive foam, which can effectively reduce the stress between the contact interfaces of the conductive foam and the spring and the stress between the contact interfaces of the conductive foam and the PCB, and effectively improves the performance of the electronic device.

[0361] Optionally, in the electronic device, Figure 28 , as shown in Figure 29 , the first surface 11 and the second surface 12 of the foam substrate 1 are electrically connected with the antenna 105 through a conductive layer, and the first surface 11 of the foam substrate 1 is also electrically connected with the middle frame 102 through a conductive layer, and one surface of the foam substrate is connected with the insulating material layer 106.

[0362] Thus, the first surface and the second surface in the foam substrate are electrically connected with the multiple structures in the electronic device, respectively, so that the conductive foam can conduct electricity in multiple directions.

[0363] It should be noted that, as shown in Figure 29 , the electronic device can further include a plastic 107, and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107.

[0364] The surface of the foam substrate connected with the insulating material layer can be provided with a first sub-conductive layer, or can not be provided with a first sub-conductive layer, which is not limited here.

[0365] The electronic device provided by the embodiment of the present application realizes the electrical connection between the antenna and the middle frame through the conductive foam, which can effectively reduce the stress between the contact interfaces of the conductive foam and the antenna and the stress between the contact interfaces of the conductive foam and the middle frame, and effectively improves the performance of the electronic device.

[0366] Optionally, in the electronic device, Figure 29 , as shown in Figure 24As shown, the first surface 11 and the third surface 13 of the foam substrate 1 are electrically connected to the antenna 105 through conductive layers, the first surface 11 and the fourth surface 14 of the foam substrate 1 are electrically connected to the middle frame 102 through conductive layers, and the second surface 12 of the foam substrate 1 is electrically connected to the PCB 504 through a conductive layer.

[0367] Thus, the first, second, third, and fourth surfaces of the foam substrate are electrically connected to multiple structures in the electronic device, thereby enabling the conductive foam to conduct in multiple directions.

[0368] It should be noted that, as Figure 29 As shown, the electronic device may also include a plastic 107, with an antenna 105 and a mid-frame 102 mounted on one side of the plastic 107.

[0369] The electronic device provided in this application embodiment achieves electrical connection between the antenna, the middle frame, and the PCB through conductive foam, which can effectively reduce the stress between the contact interface of the conductive foam and the antenna, the contact interface of the conductive foam and the middle frame, and the contact interface of the conductive foam and the PCB, thereby effectively improving the performance of the electronic device.

[0370] Optionally, in Figure 29 In electronic devices, such as Figure 30 As shown, the first surface 11 of the foam substrate 1 is electrically connected to the antenna 105 and the middle frame 102 respectively through a conductive layer, and one surface of the foam substrate 1 is also connected to the insulating material layer 106.

[0371] Thus, only the first surface of the foam matrix is ​​electrically connected to the structure in the electronic device, thereby enabling the conductive foam to conduct along the second direction.

[0372] It should be noted that, Figure 31 and Figure 32 The difference in the electronic devices shown is that, Figure 33 The antenna 105 in the electronic device shown has a different height from the middle frame 102 along the direction perpendicular to the foam substrate.

[0373] like Figure 7 As shown, the electronic device may also include a plastic 107, with an antenna 105 and a mid-frame 102 mounted on one side of the plastic 107.

[0374] The surface of the foam substrate connected to the insulating material layer may or may not have a first sub-conductive layer; no specific limitation is made here.

[0375] The electronic device provided by the embodiment of the present application, on the one hand, realizes the electrical connection of the antenna and the middle frame through the conductive foam, can effectively reduce the stress between the contact interface of the conductive foam and the antenna and the stress between the contact interface of the conductive foam and the middle frame, and effectively improves the performance of the electronic device; on the other hand, since the antenna and the middle frame are different in height along the direction perpendicular to the foam base body, one conductive foam realizes the electrical connection with structures of different heights in the electronic device, and the application of the conductive foam is enriched.

[0376] The embodiment of the present application provides a manufacturing method of the conductive foam.

[0377] As shown in the figure, the manufacturing method comprises the following steps. Figure 8

[0378] S11, forming at least one through hole on the foam base body.

[0379] The manufacturing process of the through hole is not limited in the present application, and the through hole can be formed by processes such as mechanical punching, laser punching and template etching.

[0380] S12, forming a second conductive paste in at least part of the through hole.

[0381] The manufacturing process of the second conductive paste is not limited in the present application, and the second conductive paste can be formed by processes such as dot coating.

[0382] S13, forming a first conductive paste on at least a first surface of the foam base body.

[0383] The manufacturing process of the first conductive paste is not limited in the present application, and the first conductive paste can be formed by processes such as spraying, printing, spraying and vacuum plating.

[0384] When the first conductive paste is formed by printing, the first conductive paste can be formed by pad printing process, wherein the process of pad printing process can include: slotting a steel plate, providing a pad printing head, thereby forming a pattern of the first conductive paste, and then transferring the pattern of the first conductive paste to at least a first surface of the foam base body in the pad printing process.

[0385] Specifically, the steel plate is slotted, and the first conductive paste is placed in the slot; a pad printing head is provided, the pad printing head is used to suck the first conductive paste in the slot, thereby forming a pattern of the first conductive paste; and the pattern of the first conductive paste is transferred to at least a first surface of the foam base body by using the pad printing head.

[0386] S14, curing the first conductive paste and the second conductive paste to form a first conductive paste layer and a second conductive paste layer.

[0387] ​The first conductive paste layer and the second conductive paste layer are connected and are used to deform under the action of external pressure, and the first surface is used to be electrically connected with a first structure in the electronic device through the first conductive paste layer.

[0388] The curing manner is not limited in the present application, and for example, baking, heating or the like can be used for curing.

[0389] It should be noted that after step S14, the manufacturing method can further include:

[0390] S15, forming an air structure in the at least one through hole.

[0391] The manufacturing method of the conductive foam provided by the present application has the following advantages. On the one hand, the first conductive paste is formed by spraying, printing, spraying, vacuum plating, dipping or the like, and the second conductive paste is formed by spot coating or the like, and the first conductive paste layer and the second conductive paste layer are formed by baking / heating curing, which is simple and easy to implement. On the other hand, the first conductive paste and the second conductive paste in the first conductive paste layer and the second conductive paste layer have certain ductility, good conductivity, and large resistivity (10 -5 -10 -4 Ω×cm), and the first conductive paste and the second conductive paste are in liquid state before film formation, and the volume is reduced during curing, so that the conductive foam has good conductivity and can deform under the action of pressure. Combined with the elasticity of the foam substrate, the conductive foam can work at a low height in the first direction. On the other hand, the conductive paste is sintered into a layer, and the volume is reduced to ensure the contact force between the plurality of conductive particles, so that the stress in the conductive paste is very small. On the other hand, when the first conductive paste and the second conductive paste are cured into the first conductive paste layer and the second conductive paste layer, the first conductive particles in the first conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be large.

[0392] The present application further provides a manufacturing method of a conductive foam.

[0393] As shown in Figure 11 The manufacturing method includes:

[0394] S21, forming at least one through hole on the foam substrate.

[0395] S22, forming a conductive film in the through hole.

[0396] S23, forming a first conductive paste on at least a first surface of the foam substrate.

[0397] S24, curing the first conductive paste to form a first conductive paste layer.

[0398] The manufacturing method of the conductive foam provided in the embodiments of the present application can form the conductive film in the through hole, which is simple and easy to implement. In addition, the first conductive paste is formed on at least the first surface of the foam substrate, and the first conductive paste layer is formed by baking / heating and curing, which is simple and easy to implement. Thus, a conductive foam with low working height and low stress in the first direction can be formed.

[0399] The embodiments of the present application further provide a manufacturing method of a conductive foam.

[0400] As shown in Figure 12b , the manufacturing method comprises the following steps:

[0401] S31, forming at least one through hole on the foam substrate.

[0402] S32, forming a first conductive paste on the through hole and at least the first surface of the foam substrate.

[0403] It should be understood that the manufacturing process of the present application for forming the first conductive paste on the through hole and at least the first surface of the foam substrate can be the same, of course, it can also be different, which is not specifically limited here.

[0404] For example, the process of dotting the first conductive paste in the through hole and the process of spraying the first conductive paste on at least the first surface of the foam substrate can be used for manufacturing.

[0405] S33, curing the first conductive paste to form a first conductive paste layer.

[0406] The manufacturing method of the conductive foam provided in the embodiments of the present application can form the conductive film in the through hole, which is simple and easy to implement. In addition, the first conductive paste is formed on at least the first surface of the foam substrate, and the first conductive paste layer is formed by baking / heating and curing, which is simple and easy to implement. Thus, a conductive foam with low working height and low stress in the first direction can be formed.

[0407] The embodiments of the present application further provide a manufacturing method of a conductive foam.

[0408] As shown in Figure 13c , the manufacturing method comprises the following steps:

[0409] S41, forming at least one through hole on the foam substrate.

[0410] S42, forming a second conductive paste in at least part of the through hole.

[0411] S43, curing the second conductive paste to form a second conductive paste layer.

[0412] S44, forming a conductive foil on at least the first surface of the foam substrate and at least the first surface of the second conductive paste layer.

[0413] The manufacturing method of the conductive foam provided in the embodiments of the present application is simple and easy to implement in that the second conductive paste is formed in the through hole and baked / heated to solidify to form a second conductive paste layer, and the conductive foil is formed on at least the first surface of the foam substrate and at least the first surface of the second conductive paste layer, thereby forming a conductive foam with low working height and low stress in the first direction.

[0414] The manufacturing method of the conductive foam with various structures provided in the present application is described in detail below.

[0415] As an example, Figure 14 and Figure 15 The manufacturing method of the conductive foam includes:

[0416] S110, mechanically punching the foam substrate 1 to form four through holes k.

[0417] S120, dotting the second conductive paste in each through hole k.

[0418] S130, printing the first conductive paste on the first surface 11 and the second surface 12 of the foam substrate 1 and the first surface and the second surface of the second conductive paste.

[0419] S140, solidifying the first conductive paste and the second conductive paste to form a first conductive paste layer 21 and a second conductive paste layer 22.

[0420] The manufacturing method of the conductive foam provided in the embodiments of the present application is simple and easy to implement in that the second conductive paste is formed in the through hole by a dotting process and the first conductive paste is printed on the first surface and the second surface of the foam substrate and the first surface and the second surface of the second conductive paste, and then baked / heated to solidify to form the first conductive paste layer and the second conductive paste layer.

[0421] As an example, Figure 16 The manufacturing method of the conductive foam includes:

[0422] S210, mechanically punching the foam substrate 1 to form four through holes k.

[0423] S220, forming a conductive film on the first part k1 of the through hole k.

[0424] S230, printing the first conductive paste on the first surface and the second surface of the foam substrate 1, the first surface and the second surface of the conductive film, and the second part k2 in the through hole k.

[0425] S240, solidifying the first conductive paste to form a first conductive paste layer 21.

[0426] The manufacturing method of the conductive foam provided in the embodiment of the present application forms a conductive film in the through hole, and prints the first conductive paste on the first surface and the second surface of the foam base, the first surface and the second surface of the conductive film, and the second part in the through hole, and then bakes / heat cures to form the second conductive paste layer, which is simple and easy to realize.

[0427] As an example, Figure 17 The manufacturing method of the conductive foam includes:

[0428] S310, mechanically punching the foam base 1 to form three through holes k.

[0429] S320, dotting the second conductive paste on the first part k1 of the through hole k.

[0430] S330, printing the first conductive paste on the first surface and the second surface of the foam base 1, the first surface and the second surface of the conductive film, and the second part k2 in the through hole k.

[0431] S340, curing the first conductive paste and the second conductive paste to form the first conductive paste layer 21 and the second conductive paste layer 22.

[0432] The manufacturing method of the conductive foam provided in the embodiment of the present application forms a conductive film in the through hole, and prints the first conductive paste on the first surface and the second surface of the foam base, the first surface and the second surface of the conductive film, and the second part in the through hole, and then bakes / heat cures to form the second conductive paste layer, which is simple and easy to realize.

[0433] As an example, Figure 18 The manufacturing method of the conductive foam includes:

[0434] S410, mechanically punching the foam base 1 to form three through holes k.

[0435] S420, dotting the second conductive paste on the first part k1 of the through hole k.

[0436] S430, printing the first conductive paste on the first surface and the second surface of the foam base 1.

[0437] S440, curing the first conductive paste and the second conductive paste to form the first conductive paste layer 21 and the second conductive paste layer 22 with voids x.

[0438] S450, spraying the second conductive paste on the second part k2 of each through hole k, and the voids x of the first conductive paste layer 21.

[0439] S460, curing the second conductive paste to form the second conductive paste layer 22.

[0440] The method for manufacturing the conductive foam provided in the embodiments of the present application is simple and easy to implement by forming the first conductive slurry layer and the second conductive slurry layer through multiple steps.

[0441] As an example, Figure 34 The method for manufacturing the conductive foam includes:

[0442] S510, mechanically punching the foam substrate 1 to form four through holes k.

[0443] S520, dotting the first conductive slurry in the through holes k, and spraying the first conductive slurry on the first surface and the second surface of the foam substrate 1.

[0444] S530, curing the first conductive slurry to form the first conductive slurry layer 21.

[0445] The method for manufacturing the conductive foam provided in the embodiments of the present application is simple and easy to implement by dotting the first conductive slurry in the through holes, spraying the first conductive slurry on the first surface and the second surface of the foam substrate, and then baking / heating and curing to form the first conductive slurry layer.

[0446] As an example, Figure 35 The method for manufacturing the conductive foam includes:

[0447] S610, mechanically punching the foam substrate 1 to form four through holes k.

[0448] S620, dotting the second conductive slurry in each through hole k.

[0449] S630, printing the first conductive slurry on the first surface 11 and the second surface 12 of the foam substrate 1, and on the first surface and the second surface of the second conductive slurry.

[0450] S640, curing the first conductive slurry and the second conductive slurry to form the first conductive slurry layer 21 and the second conductive slurry layer 22.

[0451] S650, forming an air column in one through hole k.

[0452] The method for manufacturing the conductive foam provided in the embodiments of the present application forms the first conductive slurry layer and the second conductive slurry layer, and also forms an air column in the through hole, which is beneficial to the formation of the first conductive slurry layer and the second conductive slurry layer.

[0453] As an example, Figure 34 The method for manufacturing the conductive foam includes:

[0454] S710, mechanically punching the foam substrate 1 to form four through holes k.

[0455] S720, point the second conductive paste in the through hole k.

[0456] S730, solidify the second conductive paste to form a second conductive paste layer.

[0457] S740, form a conductive foil 4 on the first surface and the second surface of the foam substrate 1, the first surface and the second surface of the second conductive paste layer.

[0458] The manufacturing method of the conductive foam provided by the embodiment of the present application points the second conductive paste in the through hole, then bakes / heat cures to form a second conductive paste layer, and forms a conductive foil on the first surface and the second surface of the foam substrate and the first surface and the second surface of the second conductive paste layer, which is simple and easy to implement.

[0459] As an example, Figure 35 The manufacturing method of the conductive foam includes:

[0460] S810, form a mask plate on the first surface and the second surface of the foam substrate 1.

[0461] S820, apply an etching liquid on the mask plate to form a mask layer 23 and four through holes k.

[0462] S830, point the second conductive paste in the through hole k.

[0463] S840, print the first conductive paste on the first surface 11 and the second surface 12 of the foam substrate 1 and the first surface and the second surface of the second conductive paste.

[0464] S850, solidify the first conductive paste and the second conductive paste to form a first conductive paste layer 21 and a second conductive paste layer 22.

[0465] The manufacturing method of the conductive foam provided by the embodiment of the present application forms a first conductive paste layer and a second conductive paste layer through multiple steps, which is simple and easy to implement.

[0466] As an example, Figure 35 The manufacturing method of the conductive foam includes:

[0467] S910, laser punch on the foam substrate 1 to form four through holes k.

[0468] S920, point the second conductive paste in each through hole k.

[0469] S930, print the first conductive paste on the first surface 11 and the second surface 12 of the foam substrate 1 and the first surface and the second surface of the second conductive paste.

[0470] S940, curing the first conductive paste and the second conductive paste to form the first conductive paste layer 21 and the second conductive paste layer 22.

[0471] The manufacturing method of the conductive foam provided by the embodiments of the present application forms the first conductive paste layer and the second conductive paste layer through multiple steps, which is simple and easy to implement.

[0472] In applications, a first foam substrate with a large volume is generally selected, and a conductive layer, an adhesive layer, etc. are formed, and the first foam substrate is punched into multiple conductive foams with a small volume, and then a release layer is compounded, and the conductive foams are ready for use. When used, the release layer is torn off, and the conductive foam is electrically connected to at least one structure in an electronic device.

[0473] The following introduces various specific manufacturing methods:

[0474] As an example, as shown in Figure 35 The manufacturing method includes the following steps:

[0475] S011, cleaning the surface of the first foam substrate.

[0476] S012, mechanically punching holes in the first foam substrate to form multiple through holes.

[0477] S013, selecting a first conductive silver paste.

[0478] After step S013, selecting a first conductive silver paste, and before step S014, dotting the first conductive silver paste in the through holes, the manufacturing method can further include S021, adding a diluent. At this time, the selected first conductive silver paste can be diluted to obtain the required first conductive silver paste.

[0479] S014, dotting the first conductive silver paste in the through holes.

[0480] S015, spraying the first conductive silver paste on the first surface and the second surface of the first foam substrate, and the first surface and the second surface of the first conductive silver paste.

[0481] The above-mentioned spraying of the first conductive silver paste on the first surface and the second surface of the first foam substrate, and the first surface and the second surface of the first conductive silver paste can include: first, spraying the first conductive silver paste on the first surface of the first foam substrate and the first surface of the first conductive silver paste, and then spraying the first conductive silver paste on the second surface of the first foam substrate and the second surface of the first conductive silver paste; or, spraying the first conductive silver paste on the first surface and the second surface of the first foam substrate, and the first surface and the second surface of the first conductive silver paste at the same time, which is not limited here.

[0482] S016, baking and curing.

[0483] S017, detecting the resistivity and the height.

[0484] If the detected resistivity and height meet the requirements, the subsequent step is performed; if the detected resistivity and height do not meet the requirements, the material is discarded. At this time, the resistivity of the conductive foam needs to meet 10 -5 -10 -4 Ω*cm, specifically, the resistivity of the conductive foam can be 10 -5 Ω*cm, 10 -4 Ω*cm, etc.; the working height of the conductive foam in the first direction needs to meet 0.1-0.2mm, specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.15mm or 0.2mm, etc.

[0485] S018, covering the full-area conductive adhesive.

[0486] S019, punching.

[0487] In this way, a plurality of conductive foams provided by the present application are formed.

[0488] S020, covering the release paper.

[0489] The order of the above steps S011 and S012, and steps S013 and S021 is not specifically limited, for example, steps S011 and S012 can be performed first, and then steps S013 and S021 are performed; or steps S013 and S021 can be performed first, and then steps S011 and S012 are performed; or steps S011 and S012, and steps S013 and S021 can be performed simultaneously.

[0490] Figure 35 For Figure 36 The process flow chart of the conductive foam structure is combined. As shown in a of ​ , a first foam substrate 10 with a plurality of through holes is provided, wherein the through holes are not shown in ​ ; as shown in b of ​ , the first conductive silver paste is spot-coated in the through holes of the first foam substrate 10, and the first conductive silver paste is sprayed on the first surface and the second surface of the first foam substrate 10, the first surface and the second surface of the first conductive silver paste, and a first conductive paste layer 21 is formed after solidification; as shown in c of ​ , punching is performed to obtain a plurality of conductive foams, each of which includes a foam substrate 1 and a first conductive paste layer 21 formed on the first surface and the second surface of the foam substrate 1 and the first surface and the second surface of the first conductive silver paste.

[0491] As another example, as shown in ​ , the manufacturing method comprises:

[0492] S031, cleaning the surface of the first foam substrate.

[0493] S032, etching the first foam substrate with an etching solution to form a plurality of through holes.

[0494] S033, selecting a first conductive silver paste and a second conductive silver paste.

[0495] After step S033, selecting a first conductive silver paste and a second conductive silver paste, and before step S034, dispensing the first conductive silver paste into the through holes, the method can further comprise: S044, adding a diluent. At this time, the selected first conductive silver paste and the second conductive silver paste can be diluted to obtain the required first conductive silver paste and the second conductive silver paste.

[0496] S034, dispensing the first conductive silver paste into the through holes.

[0497] S035, slotting the steel plate.

[0498] S036, providing a pad printing head.

[0499] S037, forming a second conductive paste pattern.

[0500] S038, pad printing a second conductive silver paste pattern on the first surface and the second surface of the first foam substrate, and the first surface and the second surface of the first conductive silver paste.

[0501] S039, baking and curing.

[0502] S040, detecting the resistivity and height.

[0503] S041, applying a full-area conductive adhesive.

[0504] S042, die cutting.

[0505] S043, applying a release paper.

[0506] The order of steps S031 and S032, steps S033 and S044, and steps S035, S036, and S037 is not specifically limited. For example, steps S031 and S032 can be performed first, followed by steps S013 and S021, and steps S035, S036, and S037; or steps S033 and S044 can be performed first, followed by steps S035, S036, and S037, and then steps S031 and S032; or steps S031 and S032, steps S033 and S044, and steps S035, S036, and S037 can be performed simultaneously.

[0507] The structure of the conductive foam in the embodiments of the present application can refer to the above-mentioned embodiments, and will not be described here again.

[0508] Here, only the content related to the invention point is introduced, and the remaining manufacturing methods can be obtained by referring to the related art, and will not be described in detail here.

[0509] It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, and is not intended to limit the scope of the embodiments of the present application. Those skilled in the art can obviously make various equivalent modifications or changes according to the above examples, for example, some steps in each embodiment of the above detection method can be unnecessary, or some steps can be newly added, etc. Or a combination of any two or more embodiments. The modified, changed or combined scheme also falls within the scope of the embodiments of the present application.

[0510] It should also be understood that the above description of the embodiments of the present application focuses on the differences between the various embodiments, and the same or similar aspects that are not mentioned can be mutually referred to, and for the sake of brevity, will not be described here again.

[0511] It should also be understood that the size of the serial number of each process described above does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0512] It should also be understood that in the embodiments of the present application, "previously set" and "previously defined" can be achieved by previously saving the corresponding code, table or other means that can be used to indicate related information in the device (for example, including electronic devices), and the present application does not limit the specific implementation manner.

[0513] It should also be understood that the division of the modes, cases, categories and embodiments in the embodiments of the present application is only for the convenience of description, and should not constitute a special limitation. The features in various modes, categories, cases and embodiments can be combined without contradiction.

[0514] It should also be understood that in various embodiments of the present application, the terms and / or descriptions of different embodiments are consistent and can be mutually referred to if there is no special description and logical conflict, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0515] Finally, it should be pointed out that: the above is only a specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electrically conductive foam, characterized in that, The conductive foam is applied to an electronic device, and comprises: a foam base body having at least one through hole; a conductive layer comprising a first sub-conductive layer and a second sub-conductive layer, the first sub-conductive layer covering at least a first surface of the foam base body, the first sub-conductive layer being electrically connected to a first structure in the electronic device, and the second sub-conductive layer being arranged in at least part of the through hole; wherein the first sub-conductive layer and the second sub-conductive layer are connected, and both the first sub-conductive layer and the second sub-conductive layer are conductive paste layers and are used to deform under external pressure; the conductive paste layer is a polymer conductive paste layer, the polymer conductive paste layer is a baked or heated cured film, and an organic polymer is used as a bonding phase; in the case where the conductive paste layer is a polymer conductive paste layer, the conductive paste layer comprises a paste main body and a plurality of connected conductive particles, the conductive particles being doped in the paste main body, and the paste main body being any one of a silica gel resin, a silane modified resin, an epoxy resin, and a silica resin.

2. The electrically conductive foam of claim 1, wherein, the first sub-conductive layer comprises a first conductive paste layer, the first conductive paste layer covering at least the first surface of the foam base body, the first conductive paste layer comprising a first paste main body and a plurality of connected first conductive particles, the first conductive particles being doped in the first paste main body, and the first conductive paste layer being used to deform under the external pressure.

3. The electrically conductive foam according to claim 1 or 2, characterized in that, the first sub-conductive layer comprises a conductive foil, and the conductive foil is used to deform under the external pressure; the second sub-conductive layer comprises a second conductive paste layer, the second conductive paste layer being arranged in at least part of the through hole and being used to deform under the external pressure; the second conductive paste layer comprises a second paste main body and a plurality of connected second conductive particles, the second conductive particles being doped in the second paste main body, and part of the second conductive particles being connected to the conductive foil.

4. The electrically conductive foam of claim 2, wherein, the second sub-conductive layer fills the entire through hole; the first conductive paste layer also covers at least a first surface of the second sub-conductive layer; wherein the first surface of the second sub-conductive layer is close to the first surface of the foam base body.

5. The electrically conductive foam of claim 2, wherein, the second sub-conductive layer fills a first part of the through hole, and the first conductive paste layer also fills a second part of the through hole other than the first part; wherein the first part is larger than the second part.

6. The electrically conductive foam of claim 2, wherein, the second sub-conductive layer fills the entire through hole; the first conductive paste layer has at least one gap, along a direction perpendicular to the foam base body, the gap at least partially overlaps with the through hole, and the second sub-conductive layer is also arranged in at least the gap.

7. The electrically conductive foam according to any one of claims 2, 4 to 6, wherein, the second sub-conductive layer is a second conductive paste layer, the second conductive paste layer comprises a second paste main body and a plurality of connected second conductive particles, the second conductive particles being doped in the second paste main body, and part of the second conductive particles being connected to part of the first conductive particles.

8. The electrically conductive foam of claim 7, wherein, the first paste main body is different from the second paste main body.

9. The electrically conductive foam of claim 8, wherein, The first paste body is a first resin, and the first resin is an epoxy resin; and the second paste body is a second resin, and the second resin is a silica gel resin.

10. The electrically conductive foam of claim 7, wherein, The first paste body is the same as the second paste body, and the first conductive particles are the same as the second conductive particles.

11. The electrically conductive foam according to any one of claims 2, 8 to 10, wherein, The shape of the foam substrate is a polyhedron, the first conductive paste layer covers the first surface and the second surface of the polyhedron, and the first conductive paste layer also covers the first surface and the second surface of the second sub-conductive layer; and the extension direction of the through hole is the direction from the first surface of the polyhedron to the second surface of the polyhedron. The first surface of the second sub-conductive layer is close to the first surface of the polyhedron, and the second surface of the second sub-conductive layer is close to the second surface of the polyhedron; and the second surface of the polyhedron is used for electrically connecting with a second structure in the electronic device through the first conductive paste layer.

12. The electrically conductive foam of claim 11, wherein, The first structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decoration piece.

13. The electrically conductive foam of claim 11, wherein, The second structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decoration piece.

14. The electrically conductive foam of claim 11, wherein, The conductive foam further comprises an air structure, which is arranged in at least one of the through holes and at least penetrates part of the second sub-conductive layer.

15. The electrically conductive foam of claim 8, wherein, The shape of the through hole comprises a cylinder; The doping concentration of the second conductive particles in the second paste body is inversely proportional to the diameter of the circular face in the cylinder.

16. The electrically conductive foam of claim 10, wherein, The shape of the through hole comprises a cylinder; The doping concentration of the second conductive particles in the second paste body is not related to the diameter of the circular face in the cylinder.

17. An electronic device, comprising: The conductive foam comprises any one of claims 1-16.

18. The electronic device of claim 17, wherein, The first structure in the electronic device is a display screen, and the second structure in the electronic device is a metal middle frame.

19. The electronic device of claim 17, wherein, The first structure at least comprises a camera assembly, and the camera assembly is used for maintaining electrical connection with the conductive foam when rotating.

20. A method of making an electrically conductive foam, comprising: The manufacturing method comprises: forming at least one through hole on the foam substrate; forming a second conductive paste in at least part of the through hole; forming a first conductive paste on at least a first surface of the foam substrate; and forming a second conductive paste in at least part of the through hole. The first conductive paste and the second conductive paste are cured to form a first conductive paste layer and a second conductive paste layer; wherein the first conductive paste layer and the second conductive paste layer are connected, the first conductive paste layer is electrically connected with a first structure in an electronic device; the first conductive paste layer comprises a first paste main body and a plurality of connected first conductive particles, the first conductive particles are doped in the first paste main body, the first conductive paste layer is used for deforming under the action of external pressure, the first conductive paste layer is a polymer conductive paste layer, the polymer conductive paste layer is a baked or heated cured film, and an organic polymer is used as a bonding phase; in the case that the first conductive paste layer is a polymer conductive paste layer, the first paste main body is any one of a silica gel resin, a silane modified resin, an epoxy resin and a silica resin; the second conductive paste layer comprises a second paste main body and a plurality of connected second conductive particles, the second conductive particles are doped in the second paste main body, the second conductive paste layer is used for deforming under the action of the external pressure, and the second conductive paste layer is a polymer conductive paste layer or a sintered conductive paste layer; in the case that the second conductive paste layer is a polymer conductive paste layer, the second paste main body is any one of a silica gel resin, a silane modified resin, an epoxy resin and a silica resin.

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