A preparation device and preparation method of insulated gate bipolar transistor

Abstract

The present invention belongs to the field of semiconductor technology, and specifically is a preparation device and preparation method of an insulated gate bipolar transistor, including an ultrasonic cleaning machine, the side wall of the ultrasonic cleaning machine is fixedly connected to a support frame; the top of the support frame is fixedly connected to multiple groups of lifting platforms; the multiple groups of lifting platforms are arranged in an array on the support frame; the top side wall of the lifting platform is fixedly connected to multiple lifting electric cylinders; the output end of the lifting electric cylinder passes through the side wall of the lifting platform and is fixedly connected to a connecting frame; the bottom side wall of the connecting frame is fixedly connected to multiple fixing clips; the middle part of the fixing clip is symmetrically hinged with a pair of protective cover plates; the side wall of the protective cover plate is fixedly connected to a floating block, which plays a role in blocking impurities through the protective cover plate located on the outside of the IGBT, thereby reducing the problem of floating impurities on the surface of the cleaning liquid causing re-contamination of the IGBT when the IGBT is taken out, improving the cleaning effect of the IGBT, and improving the processing quality of the IGBT.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor technology, and in particular to a preparation device and a preparation method of an insulated gate bipolar transistor. Background Art

[0002] Insulated Gate Bipolar Transistor, or IGBT, is a composite fully controlled voltage-driven power semiconductor device.

[0003] IGBT is the core device for energy conversion and transmission, commonly known as the "CPU" of power electronic devices. It has the high input impedance effect of MOSFET and the advantage of low on-state voltage drop of FTR. It has the characteristics of both devices, with small driving power and low saturation voltage drop, and is suitable for converter systems with DC voltage of 600V and above.

[0004] In the process of preparing IGBT, it is necessary to clean the IGBT and remove the impurities generated in the preparation process from the surface of the IGBT. The traditional cleaning method is to place the IGBT inside an ultrasonic cleaning machine for cleaning, and then take the IGBT out of the ultrasonic cleaning machine after the cleaning is completed. However, during the cleaning process, the impurities adhering to the surface of the IGBT are cleaned away by the cleaning liquid, and some of the impurities will float on the surface of the cleaning liquid to form a dirt layer. In the process of taking the IGBT out of the cleaning liquid, the IGBT will pass through the surface of the cleaning liquid again, and then the IGBT will be contaminated again when passing through the dirt layer containing floating impurities, thereby reducing the cleaning effect.

[0005] To this end, the present invention provides a device and method for preparing an insulated gate bipolar transistor. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: the preparation device of an insulated gate bipolar transistor described in the present invention includes an ultrasonic cleaning machine, the side wall of the ultrasonic cleaning machine is fixedly connected to a support frame; a plurality of lifting platforms are fixedly connected to the top of the support frame; the plurality of lifting platforms are arranged in an array on the support frame; a plurality of lifting electric cylinders are fixedly connected to the top side wall of the lifting platform; the output end of the lifting electric cylinder passes through the side wall of the lifting platform and is fixedly connected to a connecting frame; a plurality of fixing clamps are fixedly connected to the bottom side wall of the connecting frame; a pair of protective cover plates are symmetrically arranged and hinged in the middle of the fixing clamps; a floating block is fixedly connected to the side wall of the protective cover plate. The above structure improves the cleaning effect of the IGBT and improves the processing quality of the IGBT.

[0008] Preferably, a first infusion tube is fixedly connected to the side wall of the ultrasonic cleaning machine; the first infusion tube passes through the side wall of the ultrasonic cleaning machine and extends to the interior of the ultrasonic cleaning machine; a plurality of outlet tubes are fixedly connected to the middle of the first infusion tube; the outlet tube is arranged upward away from the end of the first infusion tube; the first infusion tube and the outlet tube are connected to each other, and the above structure makes it easier for impurities to be shaken off by vibration, so that the impurities are separated from the IGBT, thereby improving the cleaning effect of the IGBT.

[0009] Preferably, the side wall of the ultrasonic cleaning machine is rotatably connected to a plurality of synchronous rollers; the synchronous rollers are arranged in an array inside the ultrasonic cleaning machine; a plurality of groups of arc-shaped cover plates are fixedly connected to the ends of the synchronous rollers; the arc-shaped cover plates are arranged in a circular array on the synchronous rollers; a synchronous belt is arranged between the plurality of groups of synchronous rollers; the synchronous belt is arranged at an angle; a material guide plate is fixedly connected to the inner side wall of the ultrasonic cleaning machine; the material guide plate is arranged at an angle; a collecting chamber is provided inside the ultrasonic cleaning machine; the arc-shaped cover plate is arranged directly above the liquid outlet pipe, and the impurities inside the ultrasonic cleaning machine are collected in a centralized manner through the above-mentioned structure, so that the impurities inside the ultrasonic cleaning machine are easier to clean and more convenient.

[0010] Preferably, a second infusion tube is fixedly connected to the side wall of the ultrasonic cleaning machine; a plurality of first delivery tubes are fixedly connected to the middle of the second infusion tube; the end of the first delivery tube is fixedly connected to the middle of the liquid outlet tube; a plurality of second delivery tubes are fixedly connected between the first delivery tubes; a plurality of water outlet holes are opened in the middle of the second delivery tube; the water outlet holes are arranged below the synchronous belt; the second infusion tube and the first delivery tube are interconnected; the first delivery tube and the second delivery tube are interconnected. Through the above structure, impurities on the synchronous belt are more easily dropped into the collection chamber for collection, thereby improving the effect of collecting impurities.

[0011] Preferably, a pair of elastic cloths are fixedly connected to the side walls of the protective cover plate; the elastic cloths are symmetrically arranged on the side walls of the protective cover plate; the elastic cloths are arranged between the pair of protective cover plates. The above structure reduces the contact between the IGBT and the topmost floating impurities of the cleaning liquid, thereby improving the protection effect of the IGBT.

[0012] Preferably, a fixing rod is fixedly connected to the top side wall of the protective cover plate; a first magnetic gasket is fixedly connected to the end of the fixing rod; a plurality of connecting components are fixedly connected to the bottom side wall of the lifting platform; a second magnetic gasket is fixedly connected to the end of the connecting component; the second magnetic gasket is arranged above the first magnetic gasket; a plurality of through holes are opened in the middle of the connecting frame; the connecting component is arranged inside the through hole. The above structure makes the installation, fixation and disassembly of the IGBT more convenient and quick.

[0013] Preferably, a pair of guide grooves are fixedly connected to both sides of the end of the protective cover plate; the guide grooves are arranged in an arc shape, and the above structure reduces the contact between the cleaning liquid and the IGBT inside the protective cover plate.

[0014] Preferably, the connecting assembly is a damper setting, and the above structure makes the opening and closing of the protective cover plate more stable, improves the protection effect of the protective cover plate, and increases the service life of the protective cover plate.

[0015] A method for preparing an insulated gate bipolar transistor, the method being applicable to a device for preparing the insulated gate bipolar transistor, the method comprising the following steps:

[0016] S1: First, prepare the screen printing plate, which is composed of a screen, a screen frame, and a photosensitive adhesive. Then, prepare the thermal grease. Mix the thermal grease with an appropriate diluent to obtain a thermal grease with a suitable viscosity. Then, place the thermal grease on the screen printing plate. Apply pressure to the thermal grease by using a scraper to squeeze the thermal grease from one side of the screen printing plate to the surface of the IGBT through the mesh. Then, dry the surface of the IGBT.

[0017] S2: Use a vacuum pump to extract the air in the welding chamber to form a vacuum environment, fix the IGBT component in the welding chamber through relevant clamps, heat the wall and internal medium, and under the heating effect, the solder melts to form a solder film layer. When the IGBT component contacts the solder film layer, the solder will solidify quickly and connect it. Finally, turn off the vacuum pump and heating components to quickly reduce the temperature inside the chamber, and then take out the welded IGBT module;

[0018] S3: preparing an appropriate cleaning liquid and placing the cleaning liquid in an ultrasonic cleaning machine (1), then placing the welded IGBT module in the ultrasonic cleaning machine (1) for cleaning, cleaning residual impurities on the surface of the IGBT module, and then taking the cleaned IGBT module out of the ultrasonic cleaning machine (1);

[0019] S4: Place the IGBT on the workbench of the marking machine, adjust the parameters of the laser, make the laser scan on the surface of the IGBT according to the preset trajectory, and leave a clear mark on the IGBT module through the laser beam;

[0020] S5: Assemble the IGBT module and the housing, then inject the plastic encapsulation material into the housing of the module, and then solidify the plastic encapsulation material by heating and pressure, so that the housing and the module are combined to form a protective effect on the IGBT module;

[0021] S6: Perform quality inspection on the completed IGBT, keep the test environment stable and consistent during the inspection process to ensure the accuracy of the test results.

[0022] Preferably, the cleaning liquid in S2 adopts a semi-aqueous cleaning agent, which is used to clean a large amount of impurity residues in the IGBT grooves and remove the high-temperature oxide film on the metal interface, thereby achieving a better protection effect on the chip.

[0023] The beneficial effects of the present invention are as follows:

[0024] 1. The present invention uses a protective cover plate located outside the IGBT to block impurities, thereby reducing the problem of floating impurities on the surface of the cleaning liquid causing re-contamination of the IGBT when the IGBT is taken out, improving the cleaning effect of the IGBT and improving the processing quality of the IGBT.

[0025] 2. The present invention connects a pipeline at the end of the first infusion tube to transport hot distilled water to the inside of the first infusion tube, so that the hot distilled water is sprayed into the inside of the ultrasonic cleaning machine through the outlet pipe, thereby heating the cleaning liquid inside the ultrasonic cleaning machine, so that the impurities adhered to the surface of the IGBT are softened during the cleaning process, making the impurities easier to be shaken off by vibration, separating the impurities from the IGBT, and improving the cleaning effect of the IGBT. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the accompanying drawings.

[0027] Figure 1 is a flow chart of the method of the present invention;

[0028] Figure 2 It is a structural schematic diagram of the ultrasonic cleaning machine in the present invention;

[0029] Figure 3 It is a structural schematic diagram of the lifting platform in the present invention;

[0030] Figure 4 It is a structural schematic diagram of the protective cover plate in the present invention;

[0031] Figure 5 It is a structural schematic diagram of the floating block in the present invention;

[0032] Figure 6 It is a structural schematic diagram of the synchronous belt in the present invention;

[0033] Figure 7 It is a structural schematic diagram of the liquid outlet pipe in the present invention;

[0034] Figure 8 It is a structural schematic diagram of the second delivery pipe in the present invention;

[0035] Fig. 9 It is a structural schematic diagram of the arc-shaped cover plate in the present invention;

[0036] In the figure: 1. Ultrasonic cleaning machine; 11. Support frame; 12. Lifting platform; 14. Lifting electric cylinder; 15. Connecting frame; 16. Fixing clamp; 17. Protective cover; 18. Floating block; 2. First infusion pipe; 21. Liquid outlet pipe; 3. Synchronous roller; 31. Arc cover; 32. Synchronous belt; 33. Guide plate; 34. Collecting chamber; 4. Second infusion pipe; 41. First conveying pipe; 42. Second conveying pipe; 43. Water outlet; 5. Elastic cloth; 6. Fixing rod; 61. First magnetic gasket; 62. Connecting assembly; 63. Second magnetic gasket; 64. Through hole; 7. Guide groove. DETAILED DESCRIPTION

[0037] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0038] like Figures 2 to 5 As shown, a preparation device of an insulated gate bipolar transistor of the present invention comprises an ultrasonic cleaning machine 1, the side wall of the ultrasonic cleaning machine 1 is fixedly connected to a support frame 11; a plurality of lifting platforms 12 are fixedly connected to the top of the support frame 11; the plurality of lifting platforms 12 are arranged in an array on the support frame 11; a plurality of lifting electric cylinders 14 are fixedly connected to the top side wall of the lifting platform 12; the output end of the lifting electric cylinder 14 passes through the side wall of the lifting platform 12 and is fixedly connected to a connecting frame 15; a plurality of fixing clamps 16 are fixedly connected to the bottom side wall of the connecting frame 15; a pair of protective cover plates 17 are symmetrically hingedly arranged in the middle of the fixing clamp 16; a floating block 18 is fixedly connected to the side wall of the protective cover plate 17. When working, the pair of protective cover plates 17 are first opened, and then the IGBT is fixed by inserting the fixing clamp 16 into the inside of the fixing clamp 16, and then the restriction on the protective cover plate 17 is released to close the pair of protective cover plates 17, at this time, the switch of the lifting electric cylinder 14 is turned on, and the lifting The lowering cylinder 14 drives the connecting frame 15 to move downward. When the protective cover 17 enters the cleaning liquid, it is affected by the buoyancy of the liquid and the floating block 18 drives the protective cover 17 to open outward. At this time, the IGBT located on the fixing clamp 16 is cleaned under the action of the ultrasonic cleaning machine 1. After the cleaning is completed, the lifting cylinder 14 drives the entire connecting frame 15 to move upward. During the movement, the protective cover 17 is an upward force. Therefore, the liquid will push the protective cover 17 in the opposite direction, so that the protective cover 17 moves closer to the middle. When the floating block 18 approaches the surface of the liquid, the buoyancy will become smaller and smaller, thereby causing the protective cover 17 to close. When passing through the dirt layer on the surface of the cleaning liquid, the protective cover 17 located on the outside of the IGBT plays a blocking role on impurities, thereby reducing the problem of floating impurities on the surface of the cleaning liquid causing re-contamination of the IGBT when the IGBT is taken out, thereby improving the cleaning effect of the IGBT and improving the processing quality of the IGBT.

[0039] like Figure 6As shown, a first infusion tube 2 is fixedly connected to the side wall of the ultrasonic cleaning machine 1; the first infusion tube 2 passes through the side wall of the ultrasonic cleaning machine 1 and extends to the inside of the ultrasonic cleaning machine 1; a plurality of outlet tubes 21 are fixedly connected to the middle of the first infusion tube 2; the outlet tube 21 is upwardly arranged away from the end of the first infusion tube 2; the first infusion tube 2 and the outlet tube 21 are connected to each other. When working, a one-way valve is provided on the outlet tube 21, and a switch valve is provided on the first infusion tube 2. By connecting a pipeline at the end of the first infusion tube 2, hot distilled water is transported to the inside of the first infusion tube 2, so that the hot distilled water is sprayed into the inside of the ultrasonic cleaning machine 1 through the outlet tube 21, and then the cleaning liquid inside the ultrasonic cleaning machine 1 is heated, so that the impurities adhered to the surface of the IGBT are softened during the cleaning process, so that the impurities are more easily shaken off by vibration, and the impurities and the IGBT are separated, thereby improving the cleaning effect of the IGBT.

[0040] like Figures 6 to 9 As shown, the side wall of the ultrasonic cleaning machine 1 is rotatably connected to a plurality of synchronous rollers 3; the synchronous rollers 3 are arranged in an array inside the ultrasonic cleaning machine 1; the ends of the synchronous rollers 3 are fixedly connected to a plurality of groups of arc-shaped cover plates 31; the arc-shaped cover plates 31 are arranged in a circumferential array on the synchronous rollers 3; a synchronous belt 32 is arranged between the plurality of groups of the synchronous rollers 3; the synchronous belt 32 is arranged obliquely; a guide plate 33 is fixedly connected to the inner side wall of the ultrasonic cleaning machine 1; the guide plate 33 is arranged obliquely; a collecting chamber 34 is provided inside the ultrasonic cleaning machine 1; the arc-shaped cover plate 31 is arranged directly above the liquid outlet pipe 21, and when working, by Hot distilled water is transported inside the first infusion tube 2, so that the hot distilled water is sprayed out from the end of the liquid outlet tube 21. The water flow sprayed from the end of the liquid outlet tube 21 impacts the arc cover plate 31, so that the arc cover plate 31 drives the synchronous roller 3 to rotate. At this time, impurities dropped after the IGBT is cleaned are concentrated on the surface of the synchronous belt 32. When the synchronous roller 3 rotates, it drives the synchronous belt 32 to move, and then the impurities accumulated on the surface of the synchronous belt 32 are transported through the guide plate 33 and fall into the collection chamber 34. After the cleaning liquid inside the ultrasonic cleaning machine 1 is discharged, the impurities inside the ultrasonic cleaning machine 1 are easier to clean and more convenient by collecting the impurities.

[0041] like Figures 6 to 8As shown, the side wall of the ultrasonic cleaning machine 1 is fixedly connected with a second infusion tube 4; a plurality of first delivery tubes 41 are fixedly connected to the middle of the second infusion tube 4; the end of the first delivery tube 41 is fixedly connected to the middle of the liquid outlet tube 21; a plurality of second delivery tubes 42 are fixedly connected between the first delivery tubes 41; a plurality of water outlet holes 43 are opened in the middle of the second delivery tube 42; the water outlet holes 43 are arranged below the synchronous belt 32; the second infusion tube 4 and the first delivery tube 41 are connected to each other; the first delivery tube 41 and the second delivery tube 42 are connected to each other. When working, the ultrasonic cleaning machine 1 Another second infusion tube 4 is arranged on the top, and by conveying hot distilled water into the second infusion tube 4, the hot distilled water can be sprayed into the ultrasonic cleaning machine 1 through the first conveying tube 41, the second conveying tube 42 and the water outlet 43. Because the water outlet 43 is arranged below the synchronous belt 32, the hot distilled water sprayed through the water outlet 43 will first contact the surface of the synchronous belt 32, and then produce a heating effect on the surface of the synchronous belt 32. The impurities on the synchronous belt 32 are softened by heating, so that the impurities on the synchronous belt 32 can be more easily dropped into the collecting chamber 34 for collection, thereby improving the collection effect of impurities.

[0042] like Figures 3 to 5 As shown, a pair of elastic cloths 5 are fixedly connected to the side walls of the protective cover plate 17; the elastic cloths 5 are symmetrically arranged on the side walls of the protective cover plate 17; the elastic cloths 5 are arranged between the pair of protective cover plates 17. When working, the position of the protective cover plate 17 near the top can be sealed by arranging the elastic cloth 5 between the pair of protective cover plates 17. In the process of the connecting frame 15 rising and driving the protective cover plate 17 to move up and down, when the floating block 18 has not completely fallen off the liquid, it will still have a pulling effect on the protective cover plate 17 to both sides. At this time, there will be a certain gap at the top of the protective cover plate 17, which will affect the IGBT located inside the protective cover plate 17. By arranging the elastic cloth 5 above the protective cover plate 17, the protective cover plate 17 can be sealed. Before the protective cover plate 17 is completely closed, the contact between the IGBT and the uppermost floating impurities of the cleaning liquid is reduced, thereby improving the protection effect of the IGBT.

[0043] like Figure 3 to Figure 4As shown, the top side wall of the protective cover 17 is fixedly connected to a fixing rod 6; the end of the fixing rod 6 is fixedly connected to a first magnetic gasket 61; the bottom side wall of the lifting platform 12 is fixedly connected to a plurality of connecting components 62; the end of the connecting component 62 is fixedly connected to a second magnetic gasket 63; the second magnetic gasket 63 is arranged above the first magnetic gasket 61; a plurality of through holes 64 are opened in the middle of the connecting frame 15; the connecting component 62 is arranged inside the through hole 64. When working, by providing the first magnetic gasket 61 on the protective cover 17, when the protective cover 17 is not working, the protective cover 17 is close to the bottom of the second magnetic gasket 63 and is adsorbed by the second magnetic gasket 63, so that the first magnetic gasket 61 pulls a pair of protective cover plates 17 to both sides, thereby causing the protective cover plates 17 in the middle to be pulled to the left and right. The fixing clip 16 is exposed outside, which makes it easier to fix the IGBT. When the lifting cylinder 14 is controlled to drive the connecting frame 15 to move downward, the first magnetic gasket 61 will move downward with the protective cover 17, and the second magnetic gasket 63 cannot move, so the second magnetic gasket 63 and the first magnetic gasket 61 will fall off. When the magnetic adsorption of the second magnetic gasket 63 is lost, the protective cover 17 will close. After cleaning, the connecting frame 15 drives the protective cover 17 to rise, and when it is close to the second magnetic gasket 63, the protective cover 17 opens to both sides under the action of the first magnetic gasket 61, so that the internal IGBT is easier to take out. The cooperation of the first magnetic gasket 61 and the second magnetic gasket 63 makes the installation, fixation and disassembly of the IGBT more convenient and quick.

[0044] like Figure 4 As shown, a pair of guide grooves 7 are fixedly connected to both sides of the end of the protective cover plate 17; the guide grooves 7 are arranged in an arc shape. During operation, by providing the guide grooves 7 on the protective cover plate 17, when the protective cover plate 17 is taken out from the inside of the ultrasonic cleaning machine 1 and opened under the action of the first magnetic gasket 61, the liquid remaining on the surface of the protective cover plate 17 will gather to the middle due to the opening of the protective cover plate 17. At this time, by providing the guide grooves 7 on the protective cover plate 17, the cleaning liquid remaining on the surface of the protective cover plate 17 can be gathered and dripped to the end of the protective cover plate 17 through the guide grooves 7, thereby reducing the contact between the cleaning liquid and the IGBT inside the protective cover plate 17.

[0045] like Figure 3 As shown, the connecting component 62 is a damper setting. During operation, when the protective cover 17 moves upward to reset, after the first magnetic gasket 61 is close to the second magnetic gasket 63 and is magnetically attracted by the second magnetic gasket 63, the first magnetic gasket 61 quickly moves toward and collides with the second magnetic gasket 63. Under the action of the connecting component 62, the impact and vibration caused by the collision are reduced, so that the opening and closing of the protective cover 17 is smoother, the protection effect of the protective cover 17 is improved, and the service life of the protective cover 17 is increased.

[0046] like Figure 1 As shown, a method for preparing an insulated gate bipolar transistor is applicable to the above-mentioned insulated gate bipolar transistor preparation device, and the method comprises the following steps: S1: first prepare a screen printing plate, wherein the printing plate is composed of a screen, a screen frame and a photosensitive adhesive, then prepare thermal conductive silicone grease, mix the thermal conductive silicone grease with a suitable diluent to obtain thermal conductive silicone grease of suitable viscosity, then place the thermal conductive silicone grease on the screen printing plate, apply pressure to the thermal conductive silicone grease through the mesh from one side of the screen printing plate to the IGBT surface by using a scraper, and then dry the IGBT surface; S2: use a vacuum pump to extract the air in the welding cavity to form a vacuum environment, fix the IGBT component in the welding cavity by a related clamp, heat the wall and the internal medium, and under the heating action, the solder melts to form a solder film layer. When the IGBT component contacts the solder film layer, the solder will solidify quickly and connect it. Finally, turn off the vacuum pump and the heating component to quickly reduce the temperature inside the cavity, and then take out the soldered IGBT module; S3: by preparing an appropriate cleaning liquid, place the cleaning liquid in the ultrasonic cleaning machine 1, and then put the soldered IGBT module into the ultrasonic cleaning machine 1 for cleaning, clean the residual impurities on the surface of the IGBT module, and then take out the cleaned IGBT module from the ultrasonic cleaning machine 1; S4: Place the IGBT on the workbench of the marking machine, adjust the parameters of the laser, and make the laser scan the surface of the IGBT according to the preset trajectory. Scan, and leave a clear mark on the IGBT module by laser beam; S5: assemble the IGBT module and the shell, then inject the plastic packaging material into the shell of the module, and then solidify the plastic packaging material by heating and pressure, so that the shell and the module are combined to form a protective effect on the IGBT module; S6: perform quality inspection on the completed IGBT, keep the test environment stable and consistent during the inspection process, and ensure the accuracy of the test results; the cleaning liquid in S2 adopts a semi-aqueous cleaning agent, and uses the semi-aqueous cleaning agent to clean up a large amount of impurities remaining in the IGBT groove, and remove the high-temperature oxide film on the metal interface, so as to better protect the chip.

[0047] Working principle: first open a pair of protective covers 17, then insert the IGBT into the fixing clamp 16 so that the fixing clamp 16 fixes the IGBT, then release the restriction on the protective covers 17 so that the pair of protective covers 17 are closed, then turn on the switch of the lifting electric cylinder 14, and drive the connecting frame 15 to move downward through the lifting electric cylinder 14. When the protective cover 17 enters the cleaning liquid, it is affected by the buoyancy of the liquid, and the floating block 18 drives the protective cover 17 to open outward. At this time, the IGBT located on the fixing clamp 16 is cleaned under the action of the ultrasonic cleaning machine 1, and after the cleaning is completed, the lifting electric cylinder 14 is driven to move downward. The entire connecting frame 15 is driven to move upward. During the movement, the protective cover 17 is an upward force, so the liquid will push the protective cover 17 in the opposite direction, causing the protective cover 17 to move toward the middle. When the floating block 18 is close to the liquid surface, the buoyancy will become smaller and smaller, thereby causing the protective cover 17 to close. When passing through the dirt layer on the surface of the cleaning liquid, the protective cover 17 located on the outside of the IGBT can block impurities, thereby reducing the problem of floating impurities on the surface of the cleaning liquid causing re-contamination of the IGBT when taking out the IGBT, improving the cleaning effect of the IGBT, and improving the processing quality of the IGBT.

[0048] A one-way valve is provided on the liquid outlet pipe 21, and a switch valve is provided on the first liquid infusion pipe 2. By connecting a pipeline at the end of the first liquid infusion pipe 2, hot distilled water is transported to the inside of the first liquid infusion pipe 2, so that the hot distilled water is sprayed into the inside of the ultrasonic cleaning machine 1 through the liquid outlet pipe 21, and then the cleaning liquid inside the ultrasonic cleaning machine 1 is heated, so that impurities adhered to the surface of the IGBT are softened during the cleaning process, so that the impurities can be more easily shaken off by vibration, and the impurities and the IGBT are separated, thereby improving the cleaning effect of the IGBT.

[0049] Hot distilled water is transported into the first infusion tube 2 so that the hot distilled water is sprayed out from the end of the liquid outlet tube 21. The water flow sprayed from the end of the liquid outlet tube 21 impacts the arc cover plate 31, so that the arc cover plate 31 drives the synchronous roller 3 to rotate. At this time, impurities dropped after the IGBT is cleaned are concentrated on the surface of the synchronous belt 32. When the synchronous roller 3 rotates, it drives the synchronous belt 32 to move, and then the impurities accumulated on the surface of the synchronous belt 32 are transported through the guide plate 33 and fall into the collection chamber 34. After the cleaning liquid in the ultrasonic cleaning machine 1 is discharged, the impurities in the ultrasonic cleaning machine 1 are easier to clean and more convenient by collecting the impurities in a centralized manner.

[0050] By providing another second infusion tube 4 on the ultrasonic cleaning machine 1 and delivering hot distilled water to the inside of the second infusion tube 4, the hot distilled water can be sprayed into the inside of the ultrasonic cleaning machine 1 through the first delivery tube 41, the second delivery tube 42 and the water outlet 43. Because the water outlet 43 is provided below the synchronous belt 32, the hot distilled water sprayed through the water outlet 43 will first contact the surface of the synchronous belt 32, thereby producing a heating effect on the surface of the synchronous belt 32. The impurities on the synchronous belt 32 are softened by heating, so that the impurities on the synchronous belt 32 can be more easily dropped into the collecting chamber 34 for collection, thereby improving the effect of collecting impurities.

[0051] By providing an elastic cloth 5 between a pair of protective cover plates 17, the position near the top of the protective cover plates 17 can be sealed. When the connecting frame 15 rises and drives the protective cover plates 17 to move up and down, when the floating block 18 has not completely shed the liquid, it will still have a pulling effect on the protective cover plates 17 to both sides. At this time, there will be a certain gap on the top of the protective cover plates 17, which will in turn affect the IGBT located inside the protective cover plates 17. By providing an elastic cloth 5 above the protective cover plates 17, the protective cover plates 17 can be sealed. Before the protective cover plates 17 are completely closed, the contact between the IGBT and the topmost floating impurities of the cleaning liquid is reduced, thereby improving the protection effect on the IGBT.

[0052] By providing the first magnetic gasket 61 on the protective cover 17, when the protective cover 17 is not working, the protective cover 17 is close to the bottom of the second magnetic gasket 63 and is adsorbed by the second magnetic gasket 63, so that the first magnetic gasket 61 pulls the pair of protective cover plates 17 to both sides, thereby exposing the fixing clip 16 located in the middle of the protective cover plate 17 to the outside, making the fixing of the IGBT more convenient. When the control lifting electric cylinder 14 drives the connecting frame 15 to move downward, because the first magnetic gasket 61 will move downward with the protective cover plate 17, and the second magnetic gasket 63 cannot move, so the second magnetic gasket 63 and the first magnetic gasket 61 fall off, and the protective cover 17 closes due to the loss of magnetic adsorption of the second magnetic gasket 63. After cleaning, the connecting frame 15 drives the protective cover 17 to rise, and when it is close to the second magnetic gasket 63, the protective cover 17 opens to both sides under the action of the first magnetic gasket 61, so that the internal IGBT is easier to take out. The cooperation of the first magnetic gasket 61 and the second magnetic gasket 63 makes the installation, fixation and disassembly of the IGBT more convenient and quick.

[0053] By providing a guide groove 7 on the protective cover 17, when the protective cover 17 is taken out from the inside of the ultrasonic cleaning machine 1 and opened under the action of the first magnetic gasket 61, the liquid remaining on the surface of the protective cover 17 will gather to the middle due to the opening of the protective cover 17. At this time, by providing the guide groove 7 on the protective cover 17, the cleaning liquid remaining on the surface of the protective cover 17 can be gathered and dripped to the end of the protective cover 17 through the guide groove 7, thereby reducing the contact between the cleaning liquid and the IGBT inside the protective cover 17.

[0054] When the protective cover 17 moves upward to reset, after the first magnetic gasket 61 approaches the second magnetic gasket 63 and is magnetically attracted by the second magnetic gasket 63, the first magnetic gasket 61 quickly moves toward and collides with the second magnetic gasket 63. Under the action of the connecting component 62, the impact and vibration caused by the collision are reduced, making the opening and closing of the protective cover 17 smoother, thereby improving the protection effect of the protective cover 17 and increasing the service life of the protective cover 17.

[0055] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A device for preparing an insulated gate bipolar transistor, comprising an ultrasonic cleaning machine (1), characterized in that: The side wall of the ultrasonic cleaning machine (1) is fixedly connected to a support frame (11); a plurality of lifting platforms (12) are fixedly connected to the top of the support frame (11); the plurality of lifting platforms (12) are arranged in an array on the support frame (11); a plurality of lifting electric cylinders (14) are fixedly connected to the top side wall of the lifting platform (12); the output end of the lifting electric cylinder (14) passes through the side wall of the lifting platform (12) and is fixedly connected to a connecting frame (15); a plurality of fixing clamps (16) are fixedly connected to the bottom side wall of the connecting frame (15); a pair of protective cover plates (17) are symmetrically arranged and hinged in the middle of the fixing clamps (16); a floating block (18) is fixedly connected to the side wall of the protective cover plate (17); When the protective cover (17) enters the cleaning liquid, the floating block (18) will drive the protective cover (17) to open outward due to the buoyancy of the liquid. At this time, the IGBT located on the fixing clamp (16) is cleaned under the action of the ultrasonic cleaning machine (1). After the cleaning is completed, the lifting electric cylinder (14) drives the entire connecting frame (15) to move upward. During the movement, the protective cover (17) is an upward force, and the liquid will push the protective cover (17) in the opposite direction, so that the protective cover (17) moves toward the middle. When the floating block (18) approaches the surface of the liquid, the buoyancy will decrease, thereby causing the protective cover (17) to close.

2. The device for preparing an insulated gate bipolar transistor according to claim 1, characterized in that: A first liquid infusion tube (2) is fixedly connected to the side wall of the ultrasonic cleaning machine (1); the first liquid infusion tube (2) penetrates the side wall of the ultrasonic cleaning machine (1) and extends to the inside of the ultrasonic cleaning machine (1); a plurality of liquid outlet tubes (21) are fixedly connected to the middle of the first liquid infusion tube (2); the liquid outlet tubes (21) are arranged upward away from the ends of the first liquid infusion tube (2); and the first liquid infusion tube (2) and the liquid outlet tubes (21) are connected to each other.

3. The device for preparing an insulated gate bipolar transistor according to claim 2, characterized in that: The ultrasonic cleaning machine (1) has a side wall rotatably connected to a plurality of synchronous rollers (3); the synchronous rollers (3) are arranged in an array inside the ultrasonic cleaning machine (1); a plurality of groups of arc-shaped cover plates (31) are fixedly connected to the ends of the synchronous rollers (3); the arc-shaped cover plates (31) are arranged in a circumferential array on the synchronous rollers (3); a synchronous belt (32) is arranged between the plurality of groups of synchronous rollers (3); the synchronous belt (32) is arranged in an inclined manner; a guide plate (33) is fixedly connected to the side wall inside the ultrasonic cleaning machine (1); the guide plate (33) is arranged in an inclined manner; a collecting chamber (34) is provided inside the ultrasonic cleaning machine (1); and the arc-shaped cover plate (31) is arranged directly above the liquid outlet pipe (21).

4. The device for preparing an insulated gate bipolar transistor according to claim 3, characterized in that: The side wall of the ultrasonic cleaning machine (1) is fixedly connected to a second infusion tube (4); a plurality of first delivery tubes (41) are fixedly connected to the middle of the second infusion tube (4); the end of the first delivery tube (41) is fixedly connected to the middle of the liquid outlet tube (21); a plurality of second delivery tubes (42) are fixedly connected between the first delivery tubes (41); a plurality of water outlet holes (43) are opened in the middle of the second delivery tube (42); the water outlet holes (43) are arranged below the synchronous belt (32); the second infusion tube (4) and the first delivery tube (41) are connected to each other; and the first delivery tube (41) and the second delivery tube (42) are connected to each other.

5. The device for manufacturing an insulated gate bipolar transistor according to claim 4, characterized in that: A pair of elastic cloths (5) are fixedly connected to the side walls of the protective cover plate (17); the elastic cloths (5) are symmetrically arranged on the side walls of both sides of the protective cover plate (17); and the elastic cloths (5) are arranged between the pair of protective cover plates (17).

6. The device for preparing an insulated gate bipolar transistor according to claim 5, characterized in that: The top side wall of the protective cover plate (17) is fixedly connected to a fixing rod (6); the end of the fixing rod (6) is fixedly connected to a first magnetic gasket (61); the bottom side wall of the lifting platform (12) is fixedly connected to a plurality of connection components (62); the end of the connection component (62) is fixedly connected to a second magnetic gasket (63); the second magnetic gasket (63) is arranged above the first magnetic gasket (61); a plurality of through holes (64) are opened in the middle of the connection frame (15); and the connection component (62) is arranged inside the through holes (64).

7. The device for manufacturing an insulated gate bipolar transistor according to claim 6, characterized in that: A pair of guide grooves (7) are fixedly connected to both sides of the end of the protective cover plate (17); the guide grooves (7) are arranged in an arc shape.

8. The device for manufacturing an insulated gate bipolar transistor according to claim 7, characterized in that: The connecting component (62) is provided as a damper.

9. A method for preparing an insulated gate bipolar transistor, characterized in that: The method is applicable to the manufacturing device of the insulated gate bipolar transistor according to any one of claims 1 to 8, and the method comprises the following steps: S1: First, prepare the screen printing plate, which is composed of a screen, a screen frame and a photosensitive adhesive. Then, prepare the thermal grease. Mix the thermal grease with a suitable diluent to obtain a thermal grease with a suitable viscosity. Then, place the thermal grease on the screen printing plate. Apply pressure to the thermal grease by using a scraper to squeeze the thermal grease from one side of the screen printing plate to the surface of the IGBT through the mesh. Then, dry the surface of the IGBT. S2: Use a vacuum pump to extract the air in the welding chamber to form a vacuum environment, fix the IGBT component in the welding chamber through relevant clamps, heat the wall and the internal medium, and under the heating effect, the solder melts to form a solder film layer; when the IGBT component contacts the solder film layer, the solder will solidify quickly and connect it, and finally turn off the vacuum pump and the heating component to quickly reduce the temperature inside the chamber, and then take out the welded IGBT module; S3: preparing an appropriate cleaning liquid and placing the cleaning liquid in an ultrasonic cleaning machine (1), then placing the welded IGBT module in the ultrasonic cleaning machine (1) for cleaning, cleaning residual impurities on the surface of the IGBT module, and then taking the cleaned IGBT module out of the ultrasonic cleaning machine (1); S4: Place the IGBT on the workbench of the marking machine, adjust the parameters of the laser, make the laser scan on the surface of the IGBT according to the preset trajectory, and leave a clear mark on the IGBT module through the laser beam; S5: Assemble the IGBT module and the housing, then inject the plastic encapsulation material into the housing of the module, and then solidify the plastic encapsulation material by heating and pressure, so that the housing and the module are combined to form a protective effect on the IGBT module; S6: Perform quality inspection on the completed IGBT, keep the test environment stable and consistent during the inspection process to ensure the accuracy of the test results.

10. The method for preparing an insulated gate bipolar transistor according to claim 9, characterized in that: The cleaning liquid in S2 uses a semi-aqueous cleaning agent, which is used to clean a large amount of impurity residues in the IGBT grooves and remove the high-temperature oxide film on the metal interface, thereby achieving a better protection effect on the chip.

Images