A wafer processing device for assisting semiconductor wafer cleaning

Abstract

The present application discloses a wafer processing device for assisting semiconductor wafer cleaning, and relates to the technical field of semiconductor processing equipment; the present application utilizes three soft rods to move toward each other to clamp and fix the wafer, and utilizes magnetic force to limit the movement of the soft rods, thereby facilitating flipping; the wafer processing device for assisting semiconductor wafer cleaning achieves the technical effects of small footprint, high operating efficiency, strong applicability, relatively uniform force during wafer transfer, which is not easy to squeeze and damage the wafer, small wear on the wafer during the transfer process, and stable and reliable operation of the entire device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a wafer processing device for assisting semiconductor wafer cleaning. Background Art

[0002] In the semiconductor processing process, in order to improve the yield rate of semiconductor devices, it is usually necessary to clean the back of semiconductors such as wafers. Before the cleaning process, a flipping mechanism is needed to flip the semiconductor with the front side facing up so that the back of the semiconductor faces up to clean the back of the semiconductor.

[0003] In the prior art, in order to realize the flipping of the wafer, a plurality of mechanical arms with clamp structures at the working ends are usually used in cooperation with a carrier with a slider on the top surface as a clamp to perform the flipping operation during the wafer cleaning process (for example, the wafer flipping mechanism and wafer cleaning equipment disclosed in patent number CN112133671B);

[0004] Although the above solution can complete the transfer and flipping of wafers relatively efficiently, the transfer (handover) of wafers between robotic arms and between robotic arms and carriers is affected by the accuracy of the equipment. Figure 2 As shown in the figure, it is difficult for the clamping centers of different clamping devices (jaw 003 and clamp block 004) to overlap during transfer (handover), which makes it easy for the wafer to be squeezed and damaged or even fractured due to the squeezing force during transfer, seriously affecting the quality of the finished product; in order to solve the above problem, the prior art generally adopts a method of adding a rubber or silicone cushion 005 on the clamp block 004 or the jaw 003 to buffer and disperse the squeezing force, thereby reducing the risk of pressure damage and fracture (because the cushion 005 is positioned on the jaw 003 and the clamp block 004, which belong to different components, for the sake of clear expression, Figures 3 to 5 In the figure, the clamping jaw 003 and the clamping block 004 are all represented by the pad carrier 006); Figure 3 As shown, the cushioning effect of the thinner cushion 005 is relatively poor. Although it can reduce the risk of fracturing to a certain extent, the risk of pressure loss is still relatively high. The cushioning effect of the thicker cushion is better, but because the wafer is a round thin sheet, such as Figure 4 As shown in the figure, after a thicker soft pad 005 (for example, a soft pad 005 with a thickness of more than 0.8 cm) is squeezed multiple times, a V-shaped groove in the longitudinal section is easily generated, which not only affects the clamping and positioning, but also increases the cleaning dead corners of the wafer, affecting its cleaning effect; if it is frequently replaced, the process is not only cumbersome and costly, but also affects the production progress; if it is not frequently replaced, the clamping amount of the clamping jaw 003 and the clamping block 004 is controlled to compensate to overcome the influence of the indentation on the clamping, which not only requires high precision of the clamping equipment, but also easily increases the probability of the clamped wafer being squeezed and damaged due to improper adjustment, making it meaningless to add a thick soft pad; as shown in the figure, Figure 5As shown, the use of the soft pad 005 forming the groove is also prone to cause the edge of the wafer to be unable to contact the bottom of the groove when clamped due to the height difference between the wafer and the groove, thereby increasing the risk of squeeze damage due to uneven force.

[0005] Therefore, there is a need for a wafer processing device for assisting semiconductor wafer cleaning, which has a relatively uniform force on the wafer during transfer, is not easily squeezed and damaged, has little wear on the wafer during the transfer process, and has stable and reliable device operation. Summary of the invention

[0006] The embodiment of the present application solves the technical problems in the prior art of high risk of extrusion damage and easy wear of the wafer due to transfer and flipping of the wafer between different clamps when transferring the wafer during wafer cleaning by providing a wafer processing device for assisting semiconductor wafer cleaning. The embodiment of the present application achieves the technical effects of small footprint, high operating efficiency, strong applicability, relatively uniform force during wafer transfer, which makes it difficult to squeeze and damage the wafer, small wear on the wafer during the transfer process, and stable and reliable operation of the entire device.

[0007] The embodiment of the present application provides a wafer processing device for assisting the cleaning of semiconductor wafers, including a cleaning device and a transfer device with a built-in carrier; three sliding clamps are positioned on the top of the carrier; a soft pad with a thickness of less than or equal to 3.5 mm is fixed on the sliding clamp;

[0008] The transfer equipment includes a base sliding vehicle, a support assembly fixed on the base sliding vehicle, and a wafer clamping assembly positioned on the support assembly;

[0009] The wafer clamping assembly comprises a base carrier plate, a rotating base plate, a shift block, an adsorbent and a clamping soft rod;

[0010] The basic bearing plate is a hard rectangular plate body arranged longitudinally, rotatably connected to the supporting assembly, and rotates under the drive of the power assembly;

[0011] The main body of the rotating base plate is rectangular, and there are two of them, which are symmetrical and arranged one above the other; the rotating base plate rotates around one of its sides and is connected to the basic bearing plate, and the axial direction of the rotating shaft is parallel to the horizontal ground; three sliding guide grooves are radially arranged on the rotating base plate; the shift blocks correspond to the sliding guide grooves one by one;

[0012] The adsorbent is an electromagnet fixed on the surface of the displacement block away from the sliding guide groove;

[0013] The number of the clamping soft rods is three, a positioning groove is arranged on the side wall, and end attractors made of ferromagnetic material are fixed on both ends.

[0014] Further, the positioning groove is an annular groove with a groove depth greater than 2.5 mm and less than 4 mm, and the distance from the end of the clamping soft rod is greater than 4 cm.

[0015] Further, the diameter of the clamping soft rod is less than 3 cm, and the length is greater than 10 cm and less than 20 cm.

[0016] Further, when the wafer needs to be flipped, the longitudinal section of the combination of the base carrier plate and the rotating substrate is in a "匚" shape; when the wafer is picked up and placed, the combination of the base carrier plate and the rotating substrate is in a "厂" shape;

[0017] When the wafer needs to be flipped, both ends of the clamping soft rod are adsorbed and fixed on the adsorbents on the two rotating substrates, and together with the two rotating substrates, a cage-like structure is formed;

[0018] When the wafer is picked up and placed, the bottom of the clamping soft rod is adsorbed on the adsorbent of the upper rotating substrate and moves along with the movement of the shifting block to clamp or release the wafer.

[0019] Further, the support assembly includes a support column and a support cross bar; the support column is a rigid column, longitudinally arranged, and the bottom is fixed on the top of the base sliding vehicle; the support cross bar is a rigid rod, fixed on the top of the support column, horizontally arranged, and plays a connecting role.

[0020] Preferably, the number of positioning grooves on the side wall of the clamping soft rod is multiple, and the grooves for clamping can be selectively replaced after wear.

[0021] Preferably, a through hole is provided on the rotating substrate, the depth direction of the through hole is the same as the thickness direction of the rotating substrate, and the area surrounded by the top edge of the through hole is more than two-thirds of the total area of the top surface of the rotating substrate;

[0022] The rotating plate is a rigid circular plate, rotatably connected to the above through hole, coaxial with the through hole, and rotates around its own axis under the coordinated control of the control unit and the power assembly;

[0023] The sliding guide groove, the shifting block and the adsorbent on the base carrier plate are all positioned on the rotating plate and rotate along with the rotation of the rotating plate;

[0024] Before the wafer is clamped by the sliding clamp block again after being flipped, the rotating plate is controlled to rotate by a certain angle so that the clamping positions of the sliding clamp blocks on the carrier in the cleaning equipment are different, thereby reducing the cleaning dead angle.

[0025] Preferably, the length of the clamping soft rod is greater than 8 cm and less than 15 cm, the number of positioning grooves on it is less than 10, and the distance between the positioning grooves is less than 2 cm.

[0026] Preferably, end holes are provided at both ends of the clamping soft rod;

[0027] The end hole is a straight hole, and the position near the bottom of the hole is conical, and the distance between the bottom of the hole and the nearest positioning groove is two to four centimeters;

[0028] The end attractor is in the shape of an annular sheet, with the end hole exposed;

[0029] A block top bearing body, a top matching column and an adsorption magnet are fixed on the top surface of the sliding clamp block;

[0030] The block top bearing body is plate-shaped or rod-shaped, arranged longitudinally, with the bottom fixed on the sliding clamp block, three to five centimeters away from the top matching column and farther away from the carrier axis relative to the top matching column, and the height is 0.7 to 0.85 times the length of the clamped soft rod, and a plate-shaped block top magnet is fixed at a position near the top of the surface close to the top matching column. The block top magnet is an electromagnet, which is used to adsorb the top of the clamped soft rod and thus limit the swing of the clamped soft rod;

[0031] The top matching column is a hard rod body with a sharp top, arranged longitudinally, and the bottom is fixed on the top surface of the sliding clamp block and matched with the end hole of the clamping soft rod;

[0032] The adsorption magnet is an annular electromagnet, which is sleeved on the top matching column and fixed on the top surface of the sliding clamp block, and matches the end attractor of the clamping soft rod.

[0033] Preferably, a rotating bearing plate is rotatably connected to the top surface of the sliding clamping block;

[0034] The rotating bearing plate is in the shape of a circular plate, arranged horizontally, and rotates around its own axis and is connected to the top surface of the sliding clamping block;

[0035] The adsorption magnet and the top matching column are both fixed on the rotating bearing plate;

[0036] During the cleaning process, the rotating carrier plate is controlled to rotate, driving the clamping soft rod to rotate, and then the wafer fixed by the clamping soft rod rotates accordingly, exposing the cleaning dead corner while changing the clamping position.

[0037] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0038] A wafer processing device for assisting semiconductor wafer cleaning is provided, the processing device comprises a basic sliding vehicle, a supporting assembly positioned on the basic sliding vehicle and a wafer clamping assembly positioned on the supporting assembly; the wafer clamping assembly comprises a U-shaped frame and three rubber soft rods positioned on the U-shaped frame; the U-shaped frame comprises two rotating base plates; three sliders located on the rotating base plates are used to fix the ends of the rubber soft rods by magnetic adsorption, so that the movement of the sliders can drive the three rubber soft rods with annular grooves on the side walls to move toward each other, thereby clamping and fixing the wafer located on the clamping block, thereby achieving wafer fixation. The invention relates to a method for arranging and transferring wafers by a plurality of methods, wherein the plurality of wafers are fixed and moved by the plurality of means of rotation. The plurality of wafers are fixed and moved by the plurality of means of rotation. The plurality of wafers are fixed and moved by the plurality of means of rotation. The plurality of wafers are fixed and moved by the plurality of means of rotation. The plurality of wafers are fixed and moved by the plurality of means of rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 The figure is a schematic diagram of the overall structure of a wafer processing device for assisting semiconductor wafer cleaning;

[0040] Figure 2 It is a schematic diagram of the state when the first clamping body and the second clamping body cooperate with each other to realize the transfer of the wafer;

[0041] Figure 3 A schematic diagram of the structure of a relatively thin cushion;

[0042] Figure 4 is a schematic diagram of the deformation state of a relatively thick cushion;

[0043] Figure 5 A schematic diagram of the positional relationship between the wafer and the indentation groove on the soft pad;

[0044] Figure 6 It is a schematic diagram of the appearance structure of the wafer clamping assembly;

[0045] Figure 7 is a schematic diagram of the deformation state of the wafer clamping assembly;

[0046] Figure 8 It is a schematic diagram of the structure of clamping the soft rod;

[0047] Fig. 9 It is a schematic diagram of the positional relationship between the sliding clamp block and the block top bearing body;

[0048] Fig.10It is a schematic diagram of the matching relationship between the sliding clamp block, the block top bearing body and the clamping soft rod;

[0049] Fig.11 It is a schematic diagram of the matching relationship between the top matching column and the clamping soft rod;

[0050] Fig.12 A schematic diagram of the state of a wafer being clamped by a clamping soft rod positioned on a sliding clamp block;

[0051] Fig.13 It is a schematic diagram of the positional relationship between the rotating carrier plate, the adsorption magnet and the clamping soft rod.

[0052] In the figure:

[0053] Cleaning equipment 001, carrier stage 010, sliding clamp block 011, block top carrier body 012, block top magnet 013, top matching column 014, rotating carrier plate 015, adsorption magnet 016, wafer 002, clamping claw 003, clamping block 004, soft pad 005, pad carrier body 006, basic sliding vehicle 100, supporting assembly 200, supporting column 210, supporting cross bar 220, wafer clamping assembly 300, basic carrier plate 310, rotating substrate 320, rotating plate 330, sliding guide groove 331, shifting block 332, adsorption body 333, clamping soft rod 340, positioning groove 341, end attraction body 342, end hole 343. DETAILED DESCRIPTION

[0054] To facilitate the understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0055] It should be noted that the terms “vertical”, “horizontal”, “up”, “down”, “left”, “right” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation method.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0057] Embodiment 1

[0058] like Figure 1As shown, the wafer processing device for assisting semiconductor wafer cleaning of the present application includes a cleaning device 001, a transfer device, a power component and a control unit.

[0059] The cleaning device 001 is used to clean the wafer 002 placed therein, which is a prior art and will not be described in detail here; the cleaning device 001 has a built-in carrier 010, and three sliding clamps 011 are slidably positioned on the top of the carrier 010. The sliding clamps 011 slide toward the axis of the carrier 010 or slide away from the axis of the carrier 010 under the coordinated control of the control unit and the power assembly, thereby clamping and fixing the wafer 002; a soft pad 005 is fixed on the surface of the sliding clamp 011 close to the axis of the carrier 010; the soft pad 005 is made of rubber or silicone and has a thickness of less than or equal to 3.5 mm.

[0060] like Figures 6 to 8 As shown, the transfer device is used to assist in the shifting and flipping of the wafer 002, and cooperates with the carrier 010 to put the wafer 002 into the cleaning device 001 or take it out of the cleaning device 001;

[0061] The transfer equipment includes a basic skid trolley 100, a support assembly 200 and a wafer clamping assembly 300;

[0062] The basic skid trolley 100 is a mobile trolley with wheels and / or guide rails at the bottom, which moves under the coordinated control of the control unit and the power assembly, and plays the role of bearing the support assembly 200. It is a prior art and will not be described in detail here;

[0063] The support assembly 200 is fixed on the top of the basic sliding vehicle 100, and the main body is a rod-shaped, plate-shaped or frame structure, which plays the role of providing a positioning basis for the wafer clamping assembly 300;

[0064] Furthermore, the support assembly 200 includes a support column 210 and a support cross bar 220; the support column 210 is a hard column, arranged longitudinally, and the bottom is fixed to the top of the basic sliding vehicle 100; the support cross bar 220 is a hard rod body, fixed to the top of the support column 210, arranged transversely, and plays a connecting role;

[0065] The wafer clamping assembly 300 is used to clamp and fix the wafer, and includes a base carrier plate 310, a rotating base plate 320, a shift block 332, an adsorbent 333 and a clamping soft rod 340;

[0066] The base bearing plate 310 is a longitudinally arranged rigid rectangular plate body. The edges near the top and bottom are both parallel to the horizontal ground, serving as a bearing, and is positioned at the end of the support cross bar 220 away from the support column 210. The base bearing plate 310 is rotatably connected to the support cross bar 220 and rotates under the coordinated control of the control unit and the power assembly. The rotation axis passes through its own geometric center and is parallel to the horizontal ground;

[0067] The main body of the rotating substrate 320 is rectangular, and the number is two. The two are symmetrically arranged and are both rotatably connected to the base bearing plate 310. The two rotating substrates 320 are arranged one above the other and are respectively positioned at the top and bottom of the base bearing plate 310. The rotating substrate 320 is rotatably connected to the base bearing plate 310 around one of its own sides. The axial direction of the rotation axis is parallel to the horizontal ground and rotates under the coordinated control of the control unit and the power assembly. When it is necessary to flip the wafer 002, the longitudinal section of the combination of the base bearing plate 310 and the rotating substrate 320 is in a "匚" shape. When picking and placing the wafer, the combination of the base bearing plate 310 and the rotating substrate 320 is in a "厂" shape;

[0068] For the convenience of description, the descriptions of the top surface, bottom surface, parallel to the ground, etc. of the components on the wafer clamping assembly 300 in this paragraph are all based on the fact that the longitudinal section of the combination of the base carrier plate 310 and the rotating substrate 320 of the wafer clamping assembly 300 is in a "C" shape; the two rotating substrates 320 have the same structure and are symmetric to each other, and only the structure of the upper rotating substrate 320 will be described in detail here; three sliding guide grooves 331 are radially arranged at the bottom of the upper rotating substrate 320 (three sliding guide grooves 331 are radially arranged at the top of the lower rotating substrate 320); the sliding guide grooves 331 are straight grooves, and the distances between them are equal, and are used to guide the movement of the displacement block 332; the displacement block 332 is a hard block, corresponding to the sliding guide groove 331 one by one and sliding along the sliding guide groove 331 under the control of the control unit and the power assembly; the surface (top surface or bottom surface) of the displacement block 332 away from the sliding guide groove 331 is a plane and parallel to the horizontal ground; the adsorbent 333 is an electromagnet, controlled by the control unit to be energized and de-energized, and is fixed on the surface of the displacement block 332 away from the sliding guide groove 331, and plays a role in adsorbing and fixing the clamping soft rod 340; the clamping soft rod 340 is a soft rod made of rubber or silica gel, and the number is three. A positioning groove 341 is provided on the side wall, and end attracting bodies 342 are fixed at both ends; the positioning groove 341 is an annular groove, the groove depth is greater than 2.5 mm and less than 4 mm, and the distance from the end of the clamping soft rod 340 is greater than 4 cm; the end attracting body 342 is a ferromagnetic material block or sheet, which can be attracted by a magnet and cooperates with the adsorbent 333; the diameter of the clamping soft rod 340 is less than 3 cm, and the length is greater than 10 cm and less than 20 cm; when the wafer 002 needs to be flipped, the clamping soft rod 340 is approximately vertical (stretched), and both ends are adsorbed and fixed on the adsorbents 333 on the two rotating substrates 320, and together with the two rotating substrates 320, a cage-like structure is formed; when picking and placing the wafer, the bottom of the clamping soft rod 340 is adsorbed on the adsorbent 333 of the upper rotating substrate 320, and moves along with the movement of the displacement block 332 to clamp or release the wafer 002.

[0069] Further, one of the adsorbent 333 and the end attracting body 342 is provided with a protrusion and the other is provided with a depression, and the two can cooperate with each other so that they are coaxial after being adsorbed together.

[0070] Preferably, the support column 210 is an electric telescopic rod structure, which can control the height of the wafer clamping assembly 300.

[0071] The power assembly is used to provide power for the operation of various components of the wafer processing device for assisting in semiconductor wafer cleaning in the present application, preferably a motor, an electric telescopic rod, a ball screw structure, and / or a battery; the control unit plays a role in controlling the coordinated operation of various components of the wafer processing device for assisting in semiconductor wafer cleaning, which are all prior arts and will not be elaborated here.

[0072] Preferably, the control unit is a combination of a programmable logic controller and control buttons.

[0073] When the wafer processing device for assisting in semiconductor wafer cleaning in the embodiment of the present application is used, the steps are as follows:

[0074] 1. First, control the adsorbent 333 on the lower rotating substrate 320 to cut off the power, and then control the lower rotating substrate 320 to rotate (the rotation angle is greater than or equal to 90 degrees) so that the wafer clamping assembly 300 is deformed into a "factory" shape.

[0075] 2. Control the basic sliding vehicle 100 to run so that the wafer clamping assembly 300 moves to directly above the wafer 002 to be clamped (at this time, the wafer 002 to be cleaned is located on other carriers or load-bearing objects outside the cleaning device 001); then control the sliding block 332 to slide, clamp and fix the wafer 002 to be shifted and make it embedded in the positioning groove 341 (due to the shape and material of the clamping soft rod 340, the clamped wafer 002 is not easily damaged).

[0076] 3. Control the basic sliding vehicle 100 to run, fill the wafer clamping assembly 300 into the cleaning device 001 and move it to directly above the carrier 010 in the cleaning device 001; control the sliding clamp 011 to run to clamp and fix the wafer 002 to be cleaned; then control the sliding block 332 to slide and withdraw from the cleaning device 001; thereafter, perform the cleaning operation on the wafer 002.

[0077] 4. Control the wafer clamping assembly 300 to extend into the cleaning device 001 and move to directly above the carrier 010 in the cleaning device 001; control the clamping soft rod 340 to move to clamp and fix the wafer 002; take out the wafer 002 from the cleaning device 001.

[0078] 5. Control the lower rotating substrate 320 to rotate so that the longitudinal section of the combination of the basic bearing plate 310 and the rotating substrate 320 is in a "匚" shape; and control all the adsorbents 333 to be energized to fix both ends of the clamping soft rod 340.

[0079] 6. Control the wafer clamping assembly 300 to rotate 180 degrees, so that the original lower rotating substrate 320 becomes the upper rotating substrate 320, and then flip the wafer 002 with the front side cleaned; then control the adsorbent 333 on the lower rotating substrate 320 to cut off the power; control the lower rotating substrate 320 to rotate (the rotation angle is greater than or equal to 90 degrees), so that the wafer clamping assembly 300 deforms into a "factory" shape;

[0080] 7. Put the wafer 002 back on the stage of the cleaning device 001 for cleaning again, and take it out and place it after cleaning is completed.

[0081] Preferably, the number of the positioning grooves 341 on the side wall of the clamping soft rod 340 is multiple, and the grooves for clamping can be selectively replaced after wear.

[0082] Preferably, the end attractor 342 is detachably fixed on the clamping soft rod 340. When the clamping soft rod 340 needs to be replaced due to long-term use, the end attractor 342 can be removed and installed on the new clamping soft rod 340, saving costs.

[0083] The technical solutions in the above embodiments of the present application at least have the following technical effects or advantages:

[0084] It solves the technical problems in the prior art that during the process of cleaning wafers, when transferring wafers, there is a high risk of extrusion damage to the wafers due to the transfer and flipping of the wafers between different clamps and easy wear; it realizes the technical effects that the wafer processing device for assisting in semiconductor wafer cleaning has a small floor area, high operation efficiency, strong applicability, the force on the wafer is relatively uniform during wafer transfer and it is not easy to be extruded and damaged, the wear of the wafer during the transfer process is small, and the whole device runs stably and reliably.

[0085] Embodiment Two

[0086] In order to further improve the cleaning effect and reduce the cleaning dead angle, in this embodiment of the present application, the structure of the rotating substrate 320 is optimized and improved on the basis of the above embodiment. Specifically:

[0087] As Figure 6 and Figure 7 shown, a through hole is provided on the rotating substrate 320, the depth direction of the through hole is the same as the thickness direction of the rotating substrate 320, and the area surrounded by the top edge of the through hole is more than two-thirds of the total area of the top surface of the rotating substrate 320 (including the surface occupied by the through hole);

[0088] The rotating plate 330 is a rigid circular plate, which is rotatably connected to the above through hole, coaxial with the through hole, and rotates around its own axis under the coordinated control of the control unit and the power assembly;

[0089] The sliding guide groove 331 , the displacement block 332 and the adsorption body 333 on the base bearing plate 310 are all positioned on the rotating plate 330 and rotate along with the rotation of the rotating plate 330 .

[0090] Before the wafer 002 is flipped and clamped again by the sliding clamp 011, the rotating plate 330 is controlled to rotate a certain angle (preferably 5 to 10 degrees) so that the sliding clamp 011 on the carrier 010 in the cleaning equipment 001 clamps at different positions, thereby reducing cleaning dead angles.

[0091] Embodiment 3

[0092] In order to further reduce the probability of the clamped wafer 002 being squeezed and damaged and further improve the quality of the finished product, the embodiment of the present application further optimizes and improves the structure of the sliding clamp block 011 and the structure of the clamping soft rod 340 on the basis of the above embodiment, specifically:

[0093] like Figures 9 to 12 As shown, the length of the clamping rod 340 is greater than 8 cm and less than 15 cm, the number of the positioning grooves 341 thereon is less than 10, and the spacing between the positioning grooves 341 is less than 2 cm; both ends of the clamping rod 340 are provided with end holes 343; the end holes 343 are straight holes, and the position near the bottom of the hole is conical, and the distance between the bottom of the hole and the nearest positioning groove 341 is two to four centimeters;

[0094] The end attractor 342 is in the shape of an annular sheet, exposing the end hole 343;

[0095] The top surface of the sliding clamp block 011 is fixed with a block top bearing body 012, a top matching column 014 and an adsorption magnet 016;

[0096] The block top carrier 012 is plate-shaped or rod-shaped, arranged longitudinally, and the bottom is fixed on the sliding clamp 011, three to five centimeters away from the top matching column 014 and farther away from the axis of the carrier 010 relative to the top matching column 014, and the height is 0.7 to 0.85 times the length of the clamping soft rod 340. A plate-shaped block top magnet 013 is fixed near the top of the surface close to the top matching column 014. The block top magnet 013 is an electromagnet, which is used to absorb the top of the clamping soft rod 340 and thus limit the swing of the clamping soft rod 340;

[0097] like Fig.11 As shown, the top matching column 014 is a hard rod body with a sharp top, arranged longitudinally, and the bottom is fixed on the top surface of the sliding clamp block 011 and matches with the end hole 343 of the clamping soft rod 340; the top matching column 014 can be just inserted into the end hole 343;

[0098] The adsorption magnet 016 is a ring-shaped electromagnet, which is sleeved on the top matching column 014 and fixed on the top surface of the sliding clamp block 011, and matches the end attracting body 342 of the clamping soft rod 340.

[0099] Preferably, the main body of the end attraction body 342 is tubular, and the end away from the clamping soft rod 340 is a flat annular sheet; the end attraction body 342 is inserted into and detachably fixed in the end hole 343 of the clamping soft rod 340.

[0100] When the wafer 002 needs to be loaded onto the carrier 010 of the cleaning device 001, the position of the sliding clamp 011 is first adjusted according to the specifications of the wafer 002, and then the position of the top matching column 014 is adjusted; then the wafer clamping assembly 300 is controlled to carry the wafer 002 into the cleaning device 001; thereafter, the adsorption magnet 016 is controlled to be energized, and the clamping soft rod 340 is controlled to move downward and sleeve on the top matching column 014 so that it is adsorbed and fixed by the adsorption magnet 016; thereafter, the upper rotating substrate 320 is controlled to be moved upward. The shift blocks 332 are moved away from each other and the adsorbent 333 thereon is controlled to be powered off, while the top magnet 013 is controlled to be powered on to fix the soft clamping rod 340; thereafter, the cleaning operation is performed; after one side is cleaned, the wafer clamping assembly 300 is controlled to extend into the cleaning equipment 001, and then the soft clamping rod 340 is re-fixed on the wafer clamping assembly 300 by controlling the top magnet 013 to be powered off and the adsorbent 333 to be powered on; thereafter, the shifting and flipping operations of the wafer 002 are continued.

[0101] Embodiment 4

[0102] In order to further reduce the cleaning dead angle, the embodiment of the present application further optimizes and improves the structure of the components on the sliding clamp block 011 on the basis of the above embodiment, so that the wafer 002 can rotate during the cleaning process, thereby eliminating the cleaning dead angle and changing the clamping position to reduce the extrusion damage to the wafer 002; specifically:

[0103] like Fig.13 As shown, a rotating carrier plate 015 is rotatably connected to the top surface of the sliding clamp block 011; the rotating carrier plate 015 is in the shape of a circular plate, is horizontally arranged, is rotatably connected to the top surface of the sliding clamp block 011 around its own axis, and rotates under the coordinated control of the control unit and the power assembly; the adsorption magnet 016 and the top matching column 014 are both fixed on the rotating carrier plate 015;

[0104] During the cleaning process, the rotating carrier plate 015 is controlled to rotate, driving the clamping soft rod 340 to rotate, thereby causing the wafer 002 fixed by the clamping soft rod 340 to rotate accordingly, exposing the cleaning blind spot while changing the clamping position.

[0105] The existence of the rotating carrier plate 015 also serves to balance the wear of the positioning groove 341 .

[0106] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer processing device for assisting semiconductor wafer cleaning, comprising a cleaning device (001) with a built-in carrier (010) and a transfer device; three sliding clamps (011) are positioned on the top of the carrier (010); characterized in that: A soft pad (005) with a thickness less than or equal to 3.5 mm is fixed on the sliding clamp block (011). The transfer device includes a basic sliding vehicle (100), a support assembly (200) fixed on the basic sliding vehicle (100), and a wafer clamping assembly (300) positioned on the support assembly (200). The wafer clamping assembly (300) includes a basic bearing plate (310), a rotating substrate (320), a shifting block (332), an adsorbent (333), and a clamping soft rod (340). The basic bearing plate (310) is a longitudinally arranged rigid rectangular plate body, rotatably connected to the support assembly (200), and rotates under the drive of a power assembly. The main body of the rotating substrate (320) is rectangular, and the number is two. They are symmetrically arranged, one above the other. The rotating substrate (320) is rotatably connected to the basic bearing plate (310) around one of its sides, and the axial direction of the rotating shaft is parallel to the horizontal ground. Three sliding guide grooves (331) are radially arranged on the rotating substrate (320). The shifting blocks (332) correspond to the sliding guide grooves (331) one by one. The adsorbent (333) is an electromagnet, fixed on the surface of the shifting block (332) away from the sliding guide groove (331). The number of the clamping soft rods (340) is three. A positioning groove (341) is provided on the side wall, and end attracting bodies (342) made of ferromagnetic material are fixed at both ends. When the wafer (002) needs to be flipped, the longitudinal section of the combination of the basic bearing plate (310) and the rotating substrate (320) is in an inverted "C" shape. When picking up and placing the wafer, the combination of the basic bearing plate (310) and the rotating substrate (320) is in an inverted "L" shape. When the wafer (002) needs to be flipped, both ends of the clamping soft rod (340) are adsorbed and fixed on the adsorbents (333) on the two rotating substrates (320), and together with the two rotating substrates (320), they form a cage-like structure. When picking up and placing the wafer, the bottom of the clamping soft rod (340) is adsorbed on the adsorbent (333) of the upper rotating substrate (320), and moves along with the movement of the shifting block (332) to clamp or release the wafer (002).

2. The wafer processing device for assisting semiconductor wafer cleaning according to claim 1, characterized in that: The positioning groove (341) is an annular groove, the groove depth is greater than 2.5 mm and less than 4 mm, and the distance from the end of the clamping soft rod (340) is greater than 4 cm.

3. The wafer processing device for assisting semiconductor wafer cleaning according to claim 1, characterized in that: The diameter of the clamping soft rod (340) is less than 3 cm, and the length is greater than 10 cm and less than 20 cm.

4. The wafer processing device for assisting semiconductor wafer cleaning according to claim 1, characterized in that: The support assembly (200) includes a support column (210) and a support cross bar (220). The support column (210) is a rigid column body, longitudinally arranged, and the bottom is fixed on the top of the basic sliding vehicle (100). The support cross bar (220) is a rigid rod body, fixed on the top of the support column (210), horizontally arranged, and plays a connecting role.

5. The wafer processing device for assisting semiconductor wafer cleaning according to claim 1, characterized in that: The number of the positioning grooves (341) on the side wall of the clamping soft rod (340) is multiple, and the grooves for clamping can be selectively replaced after wear.

6. The wafer processing device for assisting semiconductor wafer cleaning according to claim 1, characterized in that: The rotating substrate (320) is provided with a through hole, the depth direction of the through hole is the same as the thickness direction of the rotating substrate (320), and the area enclosed by the top edge of the through hole is more than two thirds of the total area of ​​the top surface of the rotating substrate (320); The rotating plate (330) is a hard circular plate, which is rotatably connected to the through hole, is coaxial with the through hole, and rotates around its own axis under the coordinated control of the control unit and the power assembly; The sliding guide groove (331), the displacement block (332) and the adsorption body (333) on the base bearing plate (310) are all positioned on the rotating plate (330) and rotate along with the rotation of the rotating plate (330); Before the wafer (002) is flipped over and clamped again by the sliding clamp (011), the rotating plate (330) is controlled to rotate a certain angle so that the position of the sliding clamp (011) on the carrier (010) in the cleaning device (001) is different, thereby reducing cleaning dead corners.

7. The wafer processing device for assisting semiconductor wafer cleaning according to claim 1, characterized in that: The length of the clamping soft rod (340) is greater than 8 centimeters and less than 15 centimeters, the number of the positioning grooves (341) thereon is less than 10, and the spacing between the positioning grooves (341) is less than 2 centimeters.

8. The wafer processing device for assisting semiconductor wafer cleaning according to claim 7, characterized in that: Both ends of the clamping soft rod (340) are provided with end holes (343); The end hole (343) is a straight hole, and the position near the bottom of the hole is conical, and the bottom of the hole is two to four centimeters away from the nearest positioning groove (341); the end attracting body (342) is an annular sheet, exposing the end hole (343); A block top bearing body (012), a top matching column (014) and an adsorption magnet (016) are fixed on the top surface of the sliding clamp block (011); The block top carrier (012) is plate-shaped or rod-shaped, arranged longitudinally, and its bottom is fixed on the sliding clamp (011). It is three to five centimeters away from the top matching column (014) and is farther away from the axis of the carrier (010) relative to the top matching column (014). The height is 0.7 to 0.85 times the length of the clamping soft rod (340). A plate-shaped block top magnet (013) is fixed at a position near the top of the surface close to the top matching column (014). The block top magnet (013) is an electromagnet and is used to absorb the top of the clamping soft rod (340) and thus limit the swing of the clamping soft rod (340); the top matching column (014) is a hard rod body with a sharp top, arranged longitudinally, and its bottom is fixed on the top surface of the sliding clamp (011) and matches with the end hole (343) of the clamping soft rod (340); The adsorption magnet (016) is an annular electromagnet, which is sleeved on the top matching column (014) and fixed on the top surface of the sliding clamp (011), and matches the end attractor (342) of the clamping soft rod (340).

9. The wafer processing device for assisting semiconductor wafer cleaning according to claim 8, characterized in that: A rotating bearing plate (015) is rotatably connected to the top surface of the sliding clamp block (011); The rotating bearing plate (015) is in the shape of a circular plate, is arranged horizontally, and is connected to the top surface of the sliding clamping block (011) by rotating around its own axis; The adsorption magnet (016) and the top matching column (014) are both fixed on the rotating bearing plate (015); During the cleaning process, the rotating carrier plate (015) is controlled to rotate, driving the clamping soft rod (340) to rotate, thereby causing the wafer (002) fixed by the clamping soft rod (340) to rotate accordingly, exposing the cleaning dead corner while changing the clamping position.

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