Online leveling mechanism, device, and method for correcting heating deformation of carrier plates

Abstract

The application relates to an online flattening mechanism for correcting the deformation of a carrier plate, comprising a fixed support, a carrier plate in a horizontal state and placed at the bottom of the upper side of the fixed support, a fixed flattening assembly arranged at the lower side of the fixed support, a first driving assembly arranged at the lower side of the fixed support, and a flexible flattening assembly in driving connection with the first driving assembly, so that the carrier plate is fixedly connected with the flexible flattening assembly and the fixed flattening assembly. In addition, the application also relates to a flattening device comprising the above flattening mechanism and a corresponding flattening method. The application can realize online flattening of the carrier plate by the device, improves the production efficiency, and greatly reduces the fragment rate of the fragile sheet in the loading and unloading process.

Description

Technical Field

[0001] This invention belongs to the field of metal sheet leveling technology, and more specifically, relates to an online leveling mechanism for correcting the heating deformation of a carrier plate, a leveling device including the leveling mechanism, and a method for leveling a carrier plate using the leveling mechanism and the leveling device. Background Technology

[0002] For large-area vacuum coating equipment, such as magnetron sputtering and hot-wire CVD, large-area metal carriers are frequently used. During the coating process, these metal carriers undergo frequent high and low temperature cycles, causing thermal deformation, which negatively impacts the success rate of wafer loading and unloading, as well as the breakage rate.

[0003] Currently, there are generally two approaches in the industry to address the problem of thermal deformation of large-area metal carrier plates: one is to use metal materials with extremely low coefficients of thermal expansion as carrier plates. Although this approach can solve the problem of thermal deformation of carrier plates, the material and processing costs are extremely high, which is not conducive to energy conservation and environmental protection; the other is to increase the thickness of the metal carrier plate. Although this approach can improve the thermal deformation of carrier plates to some extent, it cannot completely solve the problem. Moreover, as the carrier plate becomes thicker, the heat absorption of the carrier plate will increase, and the energy consumption will increase proportionally, resulting in higher electricity consumption, which is not conducive to energy conservation and environmental protection.

[0004] Therefore, in order to address the problem of thermal deformation of large-area metal carrier plates in large / large-area coating vacuum equipment, it is urgent to design a simple and practical online leveling mechanism and device for correcting the thermal deformation of metal carrier plates. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to perform online leveling of large-area metal carrier plates with fragile thin sheets in coating equipment. This invention does not require the carrier plate to have an extremely low coefficient of thermal expansion, nor does it require thickening the carrier plate. Leveling the carrier plate during the loading and unloading of fragile thin sheets improves production efficiency and significantly reduces the breakage rate of the fragile thin sheets during loading and unloading. Based on this, this invention provides an online leveling mechanism and apparatus for correcting heated deformation of the carrier plate, and also provides a method for leveling the carrier plate using this leveling mechanism and apparatus.

[0006] To solve the above-mentioned technical problems or achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0007] According to a first aspect of the present invention, an online leveling mechanism for correcting heating deformation of a carrier plate is provided, comprising:

[0008] Fixed bracket;

[0009] The carrier plate is placed horizontally on the bottom of the upper side of the fixed bracket;

[0010] A leveling assembly is fixed on the underside of a fixed bracket;

[0011] A first drive assembly is disposed on the lower side of the fixed bracket;

[0012] A flexible leveling component, wherein the first driving component is driven to connect with the flexible leveling component, thereby fixing the carrier plate to the flexible leveling component and the fixed leveling component respectively.

[0013] In one embodiment of the present invention, the carrier plate and the flexible leveling component are fixedly connected by a short-distance air-gap attraction force, which includes any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force and weak force; or the carrier plate and the flexible leveling component are fixedly connected by a contact element, which includes any one of mechanical bolts, nails, glue, adhesive, suction cups and bayonets.

[0014] The carrier plate and the fixed leveling assembly are fixedly connected by a short-distance air-gap attraction force, which includes any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force and weak force.

[0015] In one embodiment of the present invention, the fixed leveling component levels the carrier plate with a maximum height error of less than 10 mm and levels the carrier plate until the maximum height error is less than 1 mm; the flexible leveling component levels the carrier plate with a maximum height error of less than 30 mm.

[0016] In one embodiment of the present invention, the first drive assembly includes any one of a pneumatic cylinder, a hydraulic cylinder, an electric cylinder, and a linear motor.

[0017] In one embodiment of the present invention, the fixed leveling component and the first driving component are spaced apart and arranged in parallel; or the fixed leveling component and the first driving component are abutted together.

[0018] According to a second aspect of the present invention, an online leveling device for correcting heating deformation of a carrier plate is provided, comprising:

[0019] The calibration mechanism includes:

[0020] movable support frame;

[0021] The carrier plate is in a vertical position and placed inside one side of the movable support, and the carrier plate moves from a vertical position to a horizontal position as the movable support rotates.

[0022] A fixed correction assembly is located on the other side of the movable support;

[0023] A second drive assembly is disposed on the other side of the movable bracket;

[0024] The flexible correction component, the second drive component being drivenly connected to the flexible correction component, enables the load to...

[0025] The plates are fixedly connected to the flexible correction assembly and the fixed correction assembly, respectively.

[0026] and

[0027] The leveling mechanism levels the carrier plate when the correction mechanism corrects the carrier plate and rotates it to a horizontal state. The leveling mechanism adopts the online leveling mechanism for correcting the heating deformation of the carrier plate as described above.

[0028] In one embodiment of the present invention, the carrier plate and the flexible correction component are fixedly connected by a short-distance air-to-air attraction force, which includes any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force and weak force; or the carrier plate and the flexible correction component are fixedly connected by a contact element, which includes any one of mechanical bolts, nails, glue, adhesive, suction cups and bayonet.

[0029] The carrier plate and the fixed correction assembly are fixedly connected by a short-distance air-to-air attraction force, which can be any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force and weak force.

[0030] In one embodiment of the present invention, the fixed correction component corrects the carrier plate with a maximum plane height error of less than 20 mm and corrects the carrier plate to a maximum plane height error of less than 5 mm; the flexible correction component corrects the carrier plate with a maximum plane height error of less than 50 mm.

[0031] In one embodiment of the present invention, the second drive component may be the same as or different from the first drive component, and the second drive component includes any one of a cylinder, a hydraulic cylinder, an electric cylinder, and a linear motor.

[0032] In one embodiment of the present invention, the fixed correction component and the second driving component are spaced apart and arranged in parallel, or the fixed correction component and the second driving component are abutted together.

[0033] According to a third aspect of the present invention, an online leveling method for correcting the heating deformation of a carrier plate is provided. This leveling method is implemented using an online leveling mechanism for correcting the heating deformation of a carrier plate as described above, and includes the following steps:

[0034] Place the horizontally positioned carrier plate onto the fixed support of the leveling mechanism;

[0035] The first drive component of the control leveling mechanism pushes the flexible leveling component close to the carrier plate, and after the carrier plate is subjected to force, it is fixedly connected to the flexible leveling component.

[0036] The first drive component is controlled to retract the flexible leveling component, thereby reducing the distance between the carrier plate and the fixed leveling component, and causing the carrier plate to be fixedly connected to the fixed leveling component after being subjected to force.

[0037] In one embodiment of the invention, the distance between the carrier plate and the fixed leveling assembly is reduced to within 10 mm.

[0038] According to a fourth aspect of the present invention, an online leveling method for correcting heated deformation of a carrier plate is provided. This leveling method is implemented using the online leveling device for correcting heated deformation of a carrier plate as described above, and includes the following steps:

[0039] Place the vertically positioned carrier plate onto the movable support of the calibration mechanism;

[0040] The second drive component of the control correction mechanism pushes the flexible correction component close to the carrier plate, and after the carrier plate is subjected to force, it is fixedly connected to the flexible correction component.

[0041] The second drive assembly is controlled to retract the flexible correction assembly, thereby reducing the distance between the carrier plate and the fixed correction assembly, and causing the carrier plate to be fixedly connected to the fixed correction assembly after being subjected to force.

[0042] Control the rotation of the movable support so that the carrier plate moves from a vertical position to a horizontal position;

[0043] Place the horizontally positioned carrier plate onto the fixed support of the leveling mechanism;

[0044] The first drive component of the control leveling mechanism pushes the flexible leveling component close to the carrier plate, and after the carrier plate is subjected to force, it is fixedly connected to the flexible leveling component.

[0045] The first drive component is controlled to retract the flexible leveling component, thereby reducing the distance between the carrier plate and the fixed leveling component, and causing the carrier plate to be fixedly connected to the fixed leveling component after being subjected to force.

[0046] In one embodiment of the invention, the distance between the carrier plate and the fixed correction assembly is reduced to within 20 mm, and the distance between the carrier plate and the fixed leveling assembly is reduced to within 10 mm.

[0047] The technical solution provided by this invention has the following advantages compared with the prior art:

[0048] This invention enables online leveling of the carrier plate, greatly reducing the breakage rate of fragile thin sheets during loading and unloading, and achieving stability and success rate in loading and unloading fragile thin sheets from the carrier plate. This invention also features short correction time for fragile thin sheets and fast loading and unloading speeds. Furthermore, this invention has good compatibility, capable of leveling carrier plate deformation within 50mm while ensuring normal loading and unloading of fragile thin sheets. Finally, this invention has low cost and low debugging difficulty. Attached Figure Description

[0049] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0050] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0051] Figure 1 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in one embodiment of the present invention.

[0052] Figure 2 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in one embodiment of the present invention.

[0053] Figure 3 This diagram illustrates the structure of an online leveling mechanism for correcting heating deformation of a carrier plate, provided in another embodiment of the present invention.

[0054] Figure 4 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention.

[0055] Figure 5 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in another embodiment of the present invention;

[0056] Figure 6 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in another embodiment of the present invention;

[0057] Figure 7 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in another embodiment of the present invention;

[0058] Figure 8 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in another embodiment of the present invention;

[0059] Figure 9 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in another embodiment of the present invention;

[0060] Figure 10 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in another embodiment of the present invention;

[0061] Figure 11 A schematic diagram of an online leveling mechanism for correcting heating deformation of a carrier plate is shown in another embodiment of the present invention;

[0062] Figure 12 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in yet another embodiment of the present invention.

[0063] Figure 13 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in yet another embodiment of the present invention.

[0064] Figure 14 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in yet another embodiment of the present invention.

[0065] Figure 15 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in yet another embodiment of the present invention.

[0066] Figure 16 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in yet another embodiment of the present invention.

[0067] Figure 17 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in yet another embodiment of the present invention.

[0068] Figure 18 This diagram illustrates the structure of the correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, provided in yet another embodiment of the present invention.

[0069] Figure 19 A schematic flowchart of an online leveling method for correcting heating deformation of a carrier plate, provided in one embodiment of the present invention, is shown.

[0070] Figure 20 A schematic flowchart of an online leveling method for correcting heating deformation of a carrier plate, provided in another embodiment of the present invention, is shown.

[0071] The components include: 1. Carrier plate; 2. Fixed bracket; 3. Fixed leveling assembly; 4. First drive assembly; 5. Flexible leveling assembly; 6. Movable bracket; 7. Fixed correction assembly; 8. Second drive assembly; and 9. Flexible correction assembly. Detailed Implementation

[0072] To better understand the above-described objectives, features, and advantages of this disclosure, embodiments of this disclosure will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0073] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways than those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0074] Figure 1 and Figure 2 This diagram illustrates the overall structure of an online leveling device for correcting heated deformation of a carrier plate according to one embodiment of the present invention, wherein... Figure 1 The structure of the leveling mechanism with the carrier plate 1 in a horizontal state is shown. Figure 2 The structure of the correction mechanism with the carrier plate 1 in a vertical position is shown.

[0075] like Figure 1 As shown, an online leveling mechanism for correcting the heating deformation of a carrier plate includes a carrier plate 1, a fixed bracket 2, a fixed leveling component 3, a first driving component 4, and a flexible leveling component 5. The carrier plate 1 is in a horizontal state and placed on the bottom of the upper side of the fixed bracket 2. The fixed leveling component 3 is disposed on the lower side of the fixed bracket 2. The first driving component 4 is disposed on the lower side of the fixed bracket 2. The flexible leveling component 5 is disposed on the first driving component 4. The first driving component 4 and the flexible leveling component 5 are drivenly connected. The first driving component 4 and the fixed leveling component 3 are spaced apart and arranged parallel to each other.

[0076] When the above-mentioned leveling mechanism is running, the first drive component 4 drives upward to push the flexible leveling component 5 close to the carrier plate 1. After the carrier plate 1 is subjected to force, it is fixedly connected to the flexible leveling component 5. The first drive component 4 drives downward to retract the flexible leveling component 5. The flexible leveling component 5 drives the connected carrier plate 1 downward to approach the fixed leveling component 3. After reaching the appropriate position, the carrier plate 1 is subjected to force and fixedly connected to the fixed leveling component 3, thereby achieving the leveling of the horizontal surface of the carrier plate 1, ensuring that the maximum height error of the plane is less than 1mm, and achieving the stability and success rate of loading and unloading fragile thin pieces on the carrier plate 1.

[0077] In this embodiment, as Figure 1As shown, when the uneven carrier plate 1 is in a horizontal state, the maximum height error of the plane is less than 30mm. For example, the maximum height error of the plane is 25mm. First, the first drive component 4 drives the flexible leveling component 5 upward to approach the carrier plate 1. After the carrier plate 1 is subjected to force, it is fixedly connected to the flexible leveling component 5, thus achieving initial leveling of the carrier plate 1. Then, the first drive component 4 drives the flexible leveling component 5 downward to retract. The flexible leveling component 5 drives the connected carrier plate 1 downward to approach the fixed leveling component 3, controlling the distance between the carrier plate 1 and the fixed leveling component 3 to be reduced to within 10mm. Finally, the fixed leveling component 3 levels the carrier plate 1 online, so that the uneven carrier plate 1 with a maximum height error of less than 10mm is leveled to a maximum height error of less than 1mm, thereby ensuring the flatness of the carrier plate 1 in a horizontal state and reducing the breakage rate of fragile thin sheets during the loading and unloading process.

[0078] In this embodiment, as Figure 1 As shown, the carrier plate 1 and the flexible leveling component 5 are fixedly connected by a short-distance, air-gap attraction force, which includes any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force, and weak force. Electromagnetic force is preferred for the connection between the carrier plate 1 and the flexible leveling component 5. For example, an iron block can be placed under the carrier plate 1, and an electromagnet can be placed on the flexible leveling component 5. The electromagnet attracts the iron block for fixed connection to achieve leveling. Alternatively, the carrier plate 1 and the flexible leveling component 5 can be fixedly connected by contact elements, including any one of mechanical bolts, nails, glue, adhesive, suction cups, and bayonets. Suction cup contact is a preferred connection between the carrier plate 1 and the flexible leveling component 5. A suction cup is placed on the flexible leveling component 5, and when the flexible leveling component 5 moves upwards towards the carrier plate 1, the suction cup is attracted to the carrier plate 1, completing the leveling of the carrier plate 1.

[0079] In this embodiment, as Figure 1 As shown, the carrier plate 1 and the fixed leveling assembly 3 are fixedly connected by a short-distance, air-tight attraction force, which includes any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force, and weak force. Electromagnetic force is preferred as the connection between the carrier plate 1 and the fixed leveling assembly 3. For example, an iron block is placed under the carrier plate 1, and an electromagnet is placed on the fixed leveling assembly 3. The electromagnet attracts the iron block for fixed connection to achieve leveling.

[0080] In this embodiment, as Figure 1 As shown, the first drive assembly 4 includes any one of a pneumatic cylinder, a hydraulic cylinder, an electric cylinder, and a linear motor. Preferably, the first drive assembly 4 is a pneumatic cylinder.

[0081] Therefore, in Figure 1In the above-described preferred embodiment, when leveling the horizontal carrier plate 1, the cylinder (first drive component 4) moves upward to push the flexible leveling component 5 close to the carrier plate 1. The electromagnet on the flexible leveling component 5 attracts the iron block set on the lower side of the carrier plate 1. After the carrier plate 1 is subjected to force, it is fixedly connected to the flexible leveling component 5. The cylinder moves downward and retracts. The flexible leveling component 5 drives the connected carrier plate 1 to move downward, gradually approaching the fixed leveling component 3. After reaching a suitable position (the distance between the carrier plate 1 and the fixed leveling component 3 is reduced to within 10mm), the electromagnet on the fixed leveling component 3 attracts the corresponding iron block set on the lower side of the carrier plate 1, so that the carrier plate 1 is subjected to force and fixedly connected to the fixed leveling component 3, thereby achieving the leveling of the horizontal surface of the carrier plate 1, ensuring that the maximum height error of the plane is less than 1mm, and achieving the stability and success rate of loading and unloading fragile thin sheets on the carrier plate.

[0082] like Figure 2 As shown, an online leveling device for correcting the heating deformation of a carrier plate includes, in addition to the above-mentioned... Figure 1 In addition to the leveling mechanism shown, there is also a correction mechanism in which the carrier plate 1 is in a vertical state. This correction mechanism includes the carrier plate 1, a movable support 6, a fixed correction component 7, a second drive component 8, and a flexible correction component 9, wherein the carrier plate 1 is in a vertical state and placed on one side of the movable support 6 (e.g., Figure 2 The fixing and correction component 7 is located on the inner side of the left side (as described in the text), and is disposed on the other side of the movable bracket 6 (e.g., on the left side). Figure 2 (as shown on the right side), the second drive assembly 8 is located on the other side of the movable bracket 6 (e.g., on the right side). Figure 2 (As shown on the right), the flexible correction component 9 is disposed on the second drive component 8, the second drive component 8 is drivenly connected to the flexible correction component 9, and the second drive component 8 is spaced apart from and parallel to the fixed correction component 7.

[0083] Similarly, during the operation of the above-mentioned correction mechanism, the second drive component 8 drives upward to push the flexible correction component 9 closer to the carrier plate 1. After the carrier plate 1 is subjected to force, it is fixedly connected to the flexible correction component 9. The second drive component 8 drives downward to retract the flexible correction component 9. The flexible correction component 9 drives the connected carrier plate 1 downward to approach the fixed correction component 7. After reaching the appropriate position, the carrier plate 1 is subjected to force and is fixedly connected to the fixed correction component 7. The carrier plate 1, the second drive component 8, and the fixed correction component 7 are all fixed on the movable bracket 6 as a whole. They can rotate or move with the rotation of the movable bracket 6, thereby enabling the carrier plate 1 to move stably from a vertical state to a horizontal state, reducing the positional displacement and unevenness of the carrier plate 1 during the movement, and achieving the best carrier plate correction effect.

[0084] In this embodiment, as Figure 2As shown, in a vertical state, the uneven carrier plate 1 has a maximum height error of less than 50mm. For example, if the maximum height error is 48mm, the second drive assembly 8 first drives the flexible correction assembly 9 upwards to approach the carrier plate 1. The carrier plate 1, under pressure, is fixedly connected to the flexible correction assembly 9, achieving initial correction. Then, the second drive assembly 8 drives the flexible correction assembly 9 downwards, causing it to retract. The flexible correction assembly 9 then drives the connected carrier plate 1 downwards to approach the fixed correction assembly 7, reducing the distance between the carrier plate 1 and the fixed correction assembly 7 to within 20mm. Finally, the fixed correction assembly 7 performs online correction of the carrier plate 1, leveling the uneven carrier plate 1 from a maximum height error of less than 20mm to a maximum height error of less than 5mm. Simultaneously, the carrier plate 1, the second drive assembly 8, and the fixed correction assembly 7 are all fixed to the movable support 6 as a whole, allowing the carrier plate 1 to move stably from a vertical state to a horizontal state as the movable support 6 rotates. After the carrier plate 1 stably transitions to a horizontal state, it is transported to... Figure 1 The leveling operation is performed in the leveling mechanism shown.

[0085] In this embodiment, as Figure 2 As shown, the carrier plate 1 and the flexible correction component 9 are fixedly connected by a short-distance, air-tight attraction force, which includes any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force, and weak force. Electromagnetic force is preferred for the connection between the carrier plate 1 and the flexible correction component 9. For example, an iron block is placed below the carrier plate 1, and an electromagnet is placed on the flexible correction component 9. The electromagnet attracts the iron block for a fixed connection to achieve correction. Alternatively, the carrier plate 1 and the flexible correction component 9 are fixedly connected by contact elements, including any one of mechanical bolts, nails, glue, adhesive, suction cups, and bayonets. Suction cup contact is preferred for the connection between the carrier plate 1 and the flexible correction component 9. A suction cup is placed on the flexible correction component 9, and when the flexible correction component 9 moves upwards towards the carrier plate 1, the suction cup is attracted to the carrier plate 1, completing the correction of the carrier plate 1.

[0086] In this embodiment, as Figure 2 As shown, the carrier plate 1 and the fixed correction component 7 are fixedly connected by a short-distance, air-tight attraction force, which includes any one of gravity, permanent magnet force, electromagnetic force, electrostatic force, strong force, and weak force. Preferably, the carrier plate 1 and the fixed correction component 7 are fixedly connected by electromagnetic force. For example, an iron block is placed below the carrier plate 1, and an electromagnet is placed on the fixed correction component 7. The electromagnet attracts the iron block for fixed connection to achieve correction.

[0087] In this embodiment, the second drive assembly 8 includes any one of a pneumatic cylinder, a hydraulic cylinder, an electric cylinder, and a linear motor. Preferably, the second drive assembly 8 is the same as the first drive assembly 4, and the second drive assembly 8 is also a pneumatic cylinder.

[0088] Therefore, in Figure 2 In the best or preferred embodiment shown above, when the carrier plate 1 is corrected, the cylinder (second drive component 8) moves upward to push the flexible correction component 9 close to the carrier plate 1. The electromagnet on the flexible correction component 9 attracts the iron block set under the carrier plate 1. After the carrier plate 1 is subjected to force, it is fixedly connected to the flexible correction component 9. The cylinder moves downward to retract, and the flexible correction component 9 drives the connected carrier plate 1 to move downward, gradually approaching the fixed correction component 7. After reaching a suitable position (the distance between the carrier plate 1 and the fixed correction component 7 is reduced to within 20mm), the electromagnet on the fixed correction component 7 attracts the iron block set under the carrier plate 1, so that the carrier plate 1 is subjected to force and fixedly connected to the fixed correction component 7, thereby realizing the correction of the carrier plate 1. At the same time, the carrier plate 1, the cylinder, and the fixed correction component 7 are fixed on the movable support 6 as a whole. As the movable support 6 rotates, the carrier plate 1 can move from a vertical state to a horizontal state, ensuring the stability of the carrier plate 1 when moving from a vertical state to a horizontal state.

[0089] Normally, carrier plate 1 is in a horizontal position, so during leveling, it is only necessary to use, as shown in the example... Figure 1 The leveling mechanism shown performs a leveling operation to ensure that the maximum height error of the plane of the carrier plate 1 is less than 1mm, thereby achieving stability and success rate in loading and unloading fragile thin sheets on the carrier plate, improving production efficiency, and greatly reducing the breakage rate of fragile thin sheets during the loading and unloading process.

[0090] However, when the carrier plate 1 is in a vertical position, leveling the carrier plate 1 requires first using methods such as... Figure 2 The calibration mechanism shown is used to calibrate the carrier plate 1 so that it moves stably from a vertical position to a horizontal position, and then uses, as shown in the figure, to perform calibration. Figure 1 The leveling mechanism shown is used for leveling.

[0091] Specifically, such as Figure 1 and 2 As shown, when leveling the carrier plate 1, the second drive assembly 8 is controlled to push the flexible correction assembly 9 close to the carrier plate 1. After the carrier plate 1 is subjected to force, it is fixedly connected to the flexible correction assembly 9. Following the movement of the flexible correction assembly 9, the second drive assembly 8 is controlled to retract the flexible correction assembly 9. Thus, the flexible correction assembly 9 drives the connected carrier plate 1 to approach the fixed correction assembly 7, reducing the distance between the carrier plate 1 and the fixed correction assembly 7. After the carrier plate 1 is subjected to force, it is fixedly connected to the fixed correction assembly 7, realizing the correction of the carrier plate 1 and ensuring the stability of the carrier plate 1 from the vertical state to the horizontal state.

[0092] By controlling the rotation of the movable support 6, the carrier plate 1 moves from a vertical state to a horizontal state. At this time, the corrected carrier plate 1 enters the leveling mechanism. The first drive component 4 is controlled to push the flexible leveling component 5 close to the carrier plate 1. After the carrier plate 1 is subjected to force, it is fixedly connected to the flexible leveling component 5. Following the movement of the flexible leveling component 5, the first drive component 4 is controlled to retract the flexible leveling component 5. Thus, the flexible leveling component 5 drives the connected carrier plate 1 to approach the fixed leveling component 3, reducing the distance between the carrier plate 1 and the fixed leveling component 3. After the carrier plate 1 is subjected to force, it is fixedly connected to the fixed leveling component 3, realizing the leveling of the carrier plate 1, ensuring the flatness of the carrier plate 1 in the horizontal state, and reducing the breakage rate of fragile thin sheets during the loading and unloading process.

[0093] Figure 3 and 4 This diagram illustrates the overall structure of an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. Figure 3 The structure of the leveling mechanism with the carrier plate 1 in a horizontal state is shown. Figure 4 The structure of the correction mechanism with the carrier plate 1 in a vertical position is shown.

[0094] In this embodiment, a schematic diagram of the structure for correcting and leveling two carrier plates 1 is provided, as shown below. Figure 3 As shown, for two horizontal carrier plates 1, the leveling mechanism, while sharing a single fixed support 2, includes a fixed leveling component 3, a first driving component 4, and a flexible leveling component 5 respectively below each carrier plate 1. For example... Figure 3 The structural design is shown on both the left and right sides. Working principle and... Figure 1 Similarly, for each carrier plate 1, the corresponding first driving component 4 drives the corresponding flexible leveling component 5 to move upward. The corresponding flexible leveling component 5 approaches the corresponding carrier plate 1. After the corresponding carrier plate 1 is subjected to force, it is fixedly connected to the corresponding flexible leveling component 5. Then, the corresponding first driving component 4 moves downward and retracts, driving the corresponding flexible leveling component 5 and the connected carrier plate 1 downward to approach the corresponding fixed leveling component 3. After the corresponding carrier plate 1 is subjected to force, it is fixedly connected to the corresponding fixed leveling component 3, thereby achieving the leveling of the corresponding carrier plate 1. Of course, Figure 3 The leveling of the carrier plates 1 on the left and right sides can be carried out simultaneously or at different times.

[0095] like Figure 4 As shown, for two vertically positioned carrier plates 1, the correction mechanism, while sharing a single movable support 6, includes a fixed correction component 7, a second drive component 8, and a flexible correction component 9 under each carrier plate 1. For example... Figure 4 The structural design features displays on both the top and bottom sides. Working principle and... Figure 2Similarly, for each carrier plate 1, the corresponding second driving component 8 drives the corresponding flexible correction component 9 to move upwards. The corresponding flexible correction component 9 approaches the corresponding carrier plate 1, and after the corresponding carrier plate 1 is subjected to force, it is fixedly connected to the corresponding flexible correction component 9. Then, the corresponding second driving component 8 moves downwards and retracts, driving the corresponding flexible correction component 9 and the connected carrier plate 1 downwards to approach the corresponding fixed correction component 7. After the corresponding carrier plate 1 is subjected to force, it is fixedly connected to the corresponding fixed correction component 7, thereby achieving the correction of the corresponding carrier plate 1. Of course, Figure 4 The calibration of the upper and lower carrier plates 1 can be performed simultaneously or at different times.

[0096] Figure 5 A schematic diagram of an online leveling mechanism for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention, is shown. In this embodiment, its structure is similar to... Figure 3 The structures are similar, but the difference is that for each corresponding carrier plate 1, the fixed leveling component 3 and the first driving component 4 are not spaced apart but abutted together.

[0097] Figure 6 This diagram illustrates the structure of an online leveling mechanism for correcting heated deformation of a carrier plate according to another embodiment of the present invention. In this embodiment, when the carrier plate 1 is in a horizontal state, the number of the first driving component 4, the flexible leveling component 5, and the fixed leveling component 3 designed for each carrier plate 1 can be selected according to actual needs. For example, for a given carrier plate 1, the number of fixed leveling components 3 can be multiple, such as 2, 3, 4, etc., and the number of components consisting of the first driving component 4 and the flexible leveling component 5 can also be multiple, such as 2, 3, 4, etc. Furthermore, in this embodiment, all the fixed leveling components 3 are arranged together, and all the components consisting of the first driving component 4 and the flexible leveling component 5 are arranged together, and these components are arranged or arranged in parallel at equal intervals.

[0098] Figure 7 A schematic diagram of an online leveling mechanism for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention, is shown. In this embodiment, its structure is similar to... Figure 6 The structures are similar, but the difference is that all the fixed leveling components 3 are arranged together, and all the first drive components 4 and flexible leveling components 5 are arranged together as a whole, and these components are all arranged in contact with each other.

[0099] Figure 8 A schematic diagram of an online leveling mechanism for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention, is shown. In this embodiment, its structure is similar to... Figure 6The structures are similar, but the difference is that the fixed leveling component 3 can be arranged or arranged in parallel with the overall first drive component 4 and flexible leveling component 5, intersecting each other and at equal intervals.

[0100] Figure 9 A schematic diagram of an online leveling mechanism for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention, is shown. In this embodiment, its structure is similar to... Figure 8 The structures are similar, but the difference is that the fixed leveling component 3 can be arranged or arranged to cross and abut against each other with the overall first drive component 4 and flexible leveling component 5.

[0101] Figure 10 A schematic diagram of an online leveling mechanism for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention, is shown. In this embodiment, its structure is similar to... Figure 6 The structures are similar, but the difference lies in that all the fixed leveling components 3 are arranged together, and all the first drive components 4 and flexible leveling components 5 are arranged together as a whole. All the fixed leveling components 3 are arranged parallel to each other at equal intervals, while the whole consisting of all the first drive components 4 and flexible leveling components 5 is arranged in abutment to each other. Alternatively, all the fixed leveling components 3 can be arranged in abutment to each other, while the whole consisting of all the first drive components 4 and flexible leveling components 5 can be arranged parallel to each other at equal intervals.

[0102] Figure 11 A schematic diagram of an online leveling mechanism for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention, is shown. In this embodiment, its structure is similar to... Figure 8 The structures are similar, but the difference is that the fixed leveling component 3 can be arranged in a cross pattern with the overall first drive component 4 and flexible leveling component 5, with each pair forming a group. The fixed leveling component 3 in each group is arranged to abut against the overall first drive component 4 and flexible leveling component 5, and each group is arranged or set at equal intervals.

[0103] Figure 12 This diagram illustrates the structure of a correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. In this embodiment, its structure is similar to... Figure 4 The structures are similar, but the difference is that for each corresponding carrier plate 1, the fixed correction component 7 and the second drive component 8 are not spaced apart but abutted together.

[0104] Figure 13This diagram illustrates the structure of a correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. In this embodiment, when the carrier plate 1 is in a horizontal state, the number of the second driving component 8, the flexible correction component 9, and the fixed leveling component 7 designed for each carrier plate 1 can be selected according to actual needs. For example, for a given carrier plate 1, the number of fixed correction components 7 can be multiple, such as 2, 3, 4, etc., and the number of components consisting of the second driving component 8 and the flexible correction component 9 can also be multiple, such as 2, 3, 4, etc. Furthermore, in this embodiment, all the fixed correction components 7 are arranged together, and all the components consisting of the second driving component 7 and the flexible correction component 9 are arranged together, with these components being equally spaced and parallel to each other.

[0105] Figure 14 This diagram illustrates the structure of a correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. In this embodiment, its structure is similar to... Figure 13 The structures are similar, but the difference is that all the fixed correction components 7 are arranged together, and all the second drive components 8 and flexible correction components 9 are arranged together as a whole, and these components are all arranged in contact with each other.

[0106] Figure 15 This diagram illustrates the structure of a correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. In this embodiment, its structure is similar to... Figure 13 The structures are similar, but the difference is that the fixed correction component 7 and the overall second drive component 8 and flexible correction component 9 can be arranged or arranged in parallel with each other and at equal intervals.

[0107] Figure 16 This diagram illustrates the structure of a correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. In this embodiment, its structure is similar to... Figure 15 The structures are similar, but the difference is that the fixed correction component 7 and the overall second drive component 8 and flexible correction component 9 can be arranged or arranged to cross and abut against each other.

[0108] Figure 17 This diagram illustrates the structure of a correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. In this embodiment, its structure is similar to... Figure 15The structures are similar, but the difference lies in that all the fixed correction components 7 are arranged together, and all the second drive components 8 and flexible correction components 9 are arranged together as a whole. All the fixed correction components 7 are arranged parallel to each other at equal intervals, while all the second drive components 8 and flexible correction components 9 are arranged in abutment to each other. Alternatively, all the fixed correction components 7 can be arranged in abutment to each other, while all the second drive components 8 and flexible correction components 9 can be arranged parallel to each other at equal intervals.

[0109] Figure 18 This diagram illustrates the structure of a correction mechanism in an online leveling device for correcting heated deformation of a carrier plate, according to another embodiment of the present invention. In this embodiment, its structure is similar to... Figure 15 The structures are similar, but the difference is that the fixed correction component 7 and the overall second drive component 8 and flexible correction component 9 can be arranged in a cross arrangement, with each pair forming a group. The fixed correction component 7 and the overall second drive component 8 and flexible correction component 9 in the group are arranged to abut against each other, and each group is arranged or set at equal intervals.

[0110] The above embodiments of the present invention can be used in photovoltaic industry equipment, but the invention is not limited to use in photovoltaic industry equipment, nor is it limited to use in the new energy industry, nor is it limited to use in the semiconductor industry, etc.

[0111] also, Figure 19 This diagram illustrates a flow chart of an online leveling method for correcting heated deformation of a carrier plate, provided in one embodiment of the present invention. Figure 19 As shown, the online leveling method for correcting the heating deformation of a carrier plate in this embodiment is implemented by the aforementioned online leveling mechanism for correcting the heating deformation of a carrier plate. The leveling method includes the following steps:

[0112] S1: Place the horizontally positioned carrier plate 1 onto the fixed bracket 2 of the leveling mechanism;

[0113] S2: The first drive component 4 of the leveling mechanism pushes the flexible leveling component 5 close to the carrier plate 1, and the carrier plate 1 is fixedly connected to the flexible leveling component 5 after being subjected to force.

[0114] S3: Control the first drive component 4 to retract the flexible leveling component 5, thereby reducing the distance between the carrier plate 1 and the fixed leveling component 3, and causing the carrier plate 1 to be fixedly connected to the fixed leveling component 3 after being subjected to force.

[0115] Figure 20 A schematic flowchart of an online leveling method for correcting heated deformation of a carrier plate, provided in another embodiment of the present invention, is shown. Figure 20As shown, the online leveling method for correcting the heating deformation of a carrier plate in this embodiment is implemented using the aforementioned online leveling device for correcting the heating deformation of a carrier plate. The leveling method includes the following steps:

[0116] S10: Place the vertically positioned carrier plate 1 onto the movable support 6 of the calibration mechanism;

[0117] S20: The second drive component 8 of the control correction mechanism pushes the flexible correction component 9 close to the carrier plate 1, and the carrier plate 1 is fixedly connected to the flexible correction component 9 after being subjected to force.

[0118] S30: Control the second drive component 8 to retract the flexible correction component 9, thereby reducing the distance between the carrier plate 1 and the fixed correction component 7, and causing the carrier plate 1 to be fixedly connected to the fixed correction component 7 after being subjected to force.

[0119] S40: Control the rotation of the movable support 6 so that the carrier plate 1 moves from a vertical state to a horizontal state;

[0120] S50: Place the horizontally positioned carrier plate 1 onto the fixed bracket 2 of the leveling mechanism;

[0121] S60: The first drive component 4 of the leveling mechanism pushes the flexible leveling component 5 close to the carrier plate 1, and the carrier plate 1 is fixedly connected to the flexible leveling component 5 after being subjected to force.

[0122] S70: Control the first drive component 4 to retract the flexible leveling component 5, thereby reducing the distance between the carrier plate 1 and the fixed leveling component 3, and causing the carrier plate 1 to be fixedly connected to the fixed leveling component 3 after being subjected to force.

[0123] In summary, this invention provides online leveling for large-area metal carrier plates containing fragile flakes in coating equipment. This invention does not require the carrier plate to have an extremely low coefficient of thermal expansion, nor does it require thickening the carrier plate. By leveling the carrier plate during the loading and unloading of fragile flakes, it improves production efficiency and significantly reduces the breakage rate of fragile flakes during loading and unloading. This invention enables online leveling of the carrier plate, greatly reducing the breakage rate of fragile flakes during loading and unloading, and achieving stability and a high success rate in loading and unloading fragile flakes from the carrier plate.

[0124] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to the process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0125] The above descriptions are merely embodiments of this application, which enable those skilled in the art to understand and implement this application. Various modifications to the embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

Claims

1. An online flatness mechanism for correcting the deformation of a carrier plate, applied to a film deposition vacuum device, characterized in that, The application relates to a leveling device for fragile sheet, which comprises the following parts: a fixed support; a carrier plate which is placed at the bottom of the upper side of the fixed support in a horizontal state and is used for carrying fragile sheet and adapting to the online feeding process of a coating vacuum equipment; a fixed leveling assembly which is arranged at the lower side of the fixed support and is fixedly connected with the carrier plate through short-distance space attraction; a first driving assembly which is arranged at the lower side of the fixed support; a flexible leveling assembly which is drivingly connected with the first driving assembly, so that the carrier plate is fixedly connected with the flexible leveling assembly and the fixed leveling assembly respectively, and the flexible leveling assembly is fixedly connected with the carrier plate through short-distance space attraction, wherein the short-distance space attraction comprises any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force; the flexible leveling assembly preliminarily levels the carrier plate with a maximum height error of a plane less than 30 mm; the fixed leveling assembly finely levels the carrier plate with a maximum height error of a plane less than 10 mm; and the fixed leveling assembly levels the carrier plate to a maximum height error of a plane less than 1 mm.

2. An online flattening device for correcting the deformation of a carrier plate, applied to a coating vacuum device, characterized in that, The application further relates to a correction device for fragile sheet, which comprises the following parts: a correction mechanism which comprises: a movable support; a carrier plate which is placed at the inner side of one side of the movable support in a vertical state and is moved from the vertical state to a horizontal state along with the rotation of the movable support; a fixed correction assembly which is arranged at the other side of the movable support; a second driving assembly which is arranged at the other side of the movable support; a flexible correction assembly which is drivingly connected with the second driving assembly, so that the carrier plate is fixedly connected with the flexible correction assembly and the fixed correction assembly respectively; and a leveling mechanism which levels the carrier plate when the carrier plate is corrected and rotated to a horizontal state by the correction mechanism, and the leveling mechanism adopts the online correction carrier plate heating deformation leveling mechanism in the preceding claim 1.

3. The online flatness device for correcting the deformation of a carrier plate according to claim 2, wherein The carrier plate and the flexible correction assembly are fixedly connected through short-distance space attraction, the short-distance space attraction comprises any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force, or the carrier plate and the flexible correction assembly are fixedly connected through a contact element, the contact element comprises any one of mechanical bolts, nails, glue, adhesive, suction cups and bayonets; The carrier plate and the fixed correction assembly are fixedly connected through short-distance space attraction, the short-distance space attraction comprises any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force.

4. The online flatness device for correcting the deformation of a carrier plate according to claim 2, wherein The fixed correction assembly corrects the carrier plate with a maximum height error of a plane less than 20 mm and corrects the carrier plate to a maximum height error of a plane less than 5 mm; and the flexible correction assembly corrects the carrier plate with a maximum height error of a plane less than 50 mm.

5. An online flatness correction method for heating and deforming a carrier plate to flatten the carrier plate, applied to a film deposition vacuum apparatus, characterized by, The leveling method is implemented through the online correction carrier plate heating deformation leveling mechanism in the preceding claim 1, and the leveling method comprises the following steps: Place the carrier plate in a horizontal state on the fixed support of the leveling mechanism; Control the first drive assembly of the leveling mechanism to push the flexible leveling assembly close to the carrier plate, and make the carrier plate fixedly connected with the flexible leveling assembly after being stressed; Control the first drive assembly to retract the flexible leveling assembly, so that the distance between the carrier plate and the fixed leveling assembly is reduced, and the carrier plate is fixedly connected with the fixed leveling assembly after being stressed.

6. The online leveling method for correcting heating deformation of a carrier plate according to claim 5, characterized in that, The distance between the carrier plate and the fixed leveling assembly is reduced to within 10mm.

7. An online flatness correction method for heating and deforming a carrier plate to flatten the carrier plate, applied to a film deposition vacuum apparatus, characterized by, The leveling method is implemented by the online leveling device for correcting the heating deformation of the carrier plate according to any one of the preceding claims 2-4, and the leveling method comprises the following steps: Place the carrier plate in a vertical state on the movable support of the correction mechanism; Control the second drive assembly of the correction mechanism to push the flexible correction assembly close to the carrier plate, and make the carrier plate fixedly connected with the flexible correction assembly after being stressed; Control the second drive assembly to retract the flexible correction assembly, so that the distance between the carrier plate and the fixed correction assembly is reduced, and the carrier plate is fixedly connected with the fixed correction assembly after being stressed. Control the movable support to rotate, so that the carrier plate moves from the vertical state to the horizontal state; Place the carrier plate in a horizontal state on the fixed support of the leveling mechanism; Control the first drive assembly of the leveling mechanism to push the flexible leveling assembly close to the carrier plate, and make the carrier plate fixedly connected with the flexible leveling assembly after being stressed; Control the first drive assembly to retract the flexible leveling assembly, so that the distance between the carrier plate and the fixed leveling assembly is reduced, and the carrier plate is fixedly connected with the fixed leveling assembly after being stressed.

8. The online leveling method for correcting heating deformation of a carrier plate according to claim 7, characterized in that, The distance between the carrier plate and the fixed correction assembly is reduced to within 20mm, and the distance between the carrier plate and the fixed leveling assembly is reduced to within 10mm.

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