Ceramic packaging substrate manufacturing equipment and method

Abstract

The present invention relates to the technical field of ceramic substrate processing, and in particular to a ceramic package substrate manufacturing device and method, comprising a base, wherein a processing table and a cutting table are arranged on the base, an L-shaped seat is welded on the cutting table, a Y-axis component is installed on the L-shaped seat, an X-axis component is arranged on the Y-axis component, a rectangular frame-type cutting seat is arranged in the processing table, a concave table is opened on the inner wall of the cutting seat, and is used to place the ceramic substrate; the ceramic package substrate manufacturing device provided by the present invention realizes that when a laser cutting machine is controlled to move downward for cutting processing, a longitudinal positioning component and a transverse positioning component are synchronously driven to position and fix the ceramic substrate through the setting of a first linkage component and a second linkage component, and when the cutting is completed and the laser cutting machine is controlled to move upward, the longitudinal positioning component and the transverse positioning component are synchronously driven to automatically unlock, and the ceramic substrate is no longer positioned and fixed.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic substrate processing, and in particular to a ceramic packaging substrate manufacturing device and method. Background Art

[0002] Ceramic package substrates are widely used in the field of electronic packaging, especially in high-frequency and high-power electronic devices. Due to their excellent thermal conductivity, insulation and mechanical strength, ceramic package substrates have become an ideal material choice. In the production process of ceramic package substrates, it is usually necessary to go through multiple processes such as sintering, cutting, grinding, and cleaning. The efficiency and precision of these processes are crucial to the quality of the final product.

[0003] A Chinese patent with authorization announcement number CN218396505U discloses a laser cutting device for ceramic substrate processing, including a fixed table, the upper end of the fixed table is fixedly connected to a shell, a slide groove is opened on the middle inner wall of the back side of the shell, a pushing mechanism is installed in the middle of the slide groove, a cutting mechanism is installed on the middle inner wall of the upper end of the shell, both sides of the lower end of the fixed table are fixedly connected to fixed plates, a driving mechanism is installed between the two fixed plates, and both sides of the fixed table are slidably sleeved and slidably connected to movable plates.

[0004] As in the above application, the existing cutting device for ceramic substrates is equipped with a positioning mechanism on the cutting seat, which is used to position and fix the ceramic substrate placed on the cutting seat to ensure the stability of its cutting. However, the positioning mechanism is separately arranged from the cutting mechanism, that is, it needs to be fixed before cutting, and then disassembled and fixed after cutting. It is impossible to achieve synchronous positioning and fixing of the ceramic substrate during cutting. After cutting is completed, when the cutting mechanism is moved upward, the positioning and fixing of the ceramic substrate is synchronously released, thereby affecting the efficiency of ceramic substrate cutting. Secondly, the positioning mechanism needs to be manually controlled to fix and disassemble the ceramic substrate before and after each cutting, which is also prone to safety hazards. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a ceramic package substrate manufacturing device and method.

[0006] The present invention adopts the following technical scheme: a ceramic package substrate manufacturing device, comprising a base, a processing table and a cutting table are arranged on the base, an L-shaped seat is welded on the cutting table, a Y-axis assembly is installed on the L-shaped seat, an X-axis assembly is arranged on the Y-axis assembly, a rectangular frame-type cutting seat is arranged in the processing table, a concave table is provided on the inner wall of the cutting seat, and is used to place the ceramic substrate, the cutting seat is provided with a plurality of grooves, a lateral positioning assembly, a longitudinal positioning assembly and a second linkage assembly are arranged in the grooves, and a laser cutting machine and a first linkage assembly are arranged on the X-axis assembly;

[0007] The X-axis assembly is transmission-connected to the longitudinal positioning assembly via a first linkage assembly, and the longitudinal positioning assembly is transmission-connected to the transverse positioning assembly via a second linkage assembly. When the X-axis assembly moves downward, the longitudinal positioning assembly is synchronously driven by the first linkage assembly to flip over and longitudinally position the ceramic substrate placed on the cutting seat. When the longitudinal positioning assembly flips over and longitudinally positions the ceramic substrate placed on the cutting seat, the transverse positioning assembly is synchronously driven by the second linkage assembly to transversely position the ceramic substrate placed on the cutting seat.

[0008] As a further description of the above technical solution: the longitudinal positioning assembly includes a rotating shaft rotatably connected in the cutting seat, both ends of the rotating shaft pass through the cutting seat and extend to the outside, and a longitudinal pressure plate is fixedly arranged on the rotating shaft in the groove.

[0009] As a further description of the above technical solution: the lateral positioning assembly includes a lateral positioning seat, a slider is welded to the bottom of the lateral positioning seat, the slider is slidably connected to a slide groove opened on the bottom plate inside the groove, and a spring is fixed between the lateral positioning seat and the inner side wall of the groove.

[0010] As a further description of the above technical solution: the first linkage assembly includes two inverted U-shaped frames and a linkage gear, the bottom ends of the two inverted U-shaped frames are welded with racks, the linkage gears are fixed to the two ends of the rotating shaft, the racks are meshed and connected with the linkage gears, a connecting rod is welded between the two inverted U-shaped frames, and a connecting seat is welded at the middle position of the connecting rod;

[0011] The second linkage assembly is a wedge-shaped block, and the wedge-shaped block is fixed on the outer wall of the longitudinal pressure plate.

[0012] As a further description of the above technical solution: the Y-axis assembly includes a first concave seat, which is welded and fixed to the lower surface of the horizontal end of the L-shaped seat, a Y-axis sliding seat is slidably connected in the first concave seat, an electric push rod is installed on the upper surface of the horizontal end of the L-shaped seat, and the bottom end of the electric push rod extends into the first concave seat and is fixedly connected to the Y-axis sliding seat.

[0013] As a further description of the above technical solution: the X-axis assembly includes a second concave seat, the second concave seat is welded and fixed on the Y-axis sliding seat, and the second concave seat and the first concave seat are arranged perpendicular to each other, an X-axis sliding seat is slidably arranged in the second concave seat, a lead screw is rotatably connected in the second concave seat, the X-axis sliding seat is threadedly connected to the lead screw, a lead screw motor for driving the lead screw to rotate is installed on the side wall of one end of the second concave seat along the length direction, and the laser cutting machine is fixed to the front surface of the X-axis sliding seat by a mounting seat bolt.

[0014] As a further description of the above technical solution: one end of the connecting seat away from the connecting rod is welded and fixed to the second concave seat, and there are two connecting seats in total, and the two connecting seats are symmetrical with respect to the first concave seat.

[0015] A method for manufacturing a ceramic package substrate is implemented based on the ceramic package substrate manufacturing device, comprising the following steps:

[0016] Collecting historical cutting processing data of the ceramic substrate, wherein the historical cutting processing data of the ceramic substrate is collected when the cutting of the ceramic substrate meets the standard, and the historical cutting processing data includes comprehensive cutting parameters and cutting moving speed of the ceramic substrate, wherein the comprehensive cutting parameters include a cutting coefficient of the ceramic substrate, a cutting power of a laser cutting machine, and a distance between the laser cutting machine and the ceramic substrate;

[0017] Based on historical cutting processing data, a machine learning model is trained to predict the cutting speed, and real-time comprehensive cutting parameters are collected to predict the cutting speed based on the trained machine learning model.

[0018] The moving speed of the laser cutting machine is controlled based on the predicted cutting moving speed.

[0019] As a further description of the above technical solution: the parameters affecting the cutting coefficient of the ceramic substrate include the hardness, brittleness and thickness of the ceramic substrate;

[0020] The expression of the cutting coefficient of the ceramic substrate is:

[0021] ;

[0022] In the formula, is the cutting coefficient of the ceramic substrate, is the hardness, For brittleness, is the thickness, , and is the weight factor, , and Both are greater than 0.

[0023] As a further description of the above technical solution: the training method of the machine learning model for predicting the cutting movement speed includes:

[0024] Convert the collected historical cutting processing data into a corresponding set of feature vectors;

[0025] Each group of feature vectors is used as the input of the machine learning model. The machine learning model takes the cutting movement speed corresponding to the cutting comprehensive parameters of each group of ceramic substrates as the output, and takes the cutting movement speed actually corresponding to the cutting comprehensive parameters of each group of ceramic substrates as the prediction target, and takes minimizing the loss function value of the machine learning model as the training target; when the loss function value of the machine learning model is less than or equal to the preset target loss value, the training is stopped.

[0026] Beneficial effects:

[0027] The present invention provides a ceramic packaging substrate manufacturing device and method, which places the ceramic substrate to be cut into a cutting seat, so that the corners of the ceramic substrate are placed on the concave table, controls the Y-axis component to work, drives the X-axis component to move downward, and the X-axis component moves downward to drive the laser cutting machine to move downward to perform cutting processing. When the X-axis component moves downward, the longitudinal positioning component is synchronously driven to flip and longitudinally position the ceramic substrate placed on the cutting seat through the first linkage component. When the longitudinal positioning component flips and longitudinally positions the ceramic substrate placed on the cutting seat, the transverse positioning component is synchronously driven to transversely position the ceramic substrate placed on the cutting seat through the second linkage component, so that when the control is realized, When the laser cutting machine moves down to perform cutting processing, the first linkage component and the second linkage component are set to synchronously drive the longitudinal positioning component and the transverse positioning component to position and fix the ceramic substrate, and when the cutting is completed and the laser cutting machine is controlled to move up, the longitudinal positioning component and the transverse positioning component are synchronously driven to automatically unlock, and the ceramic substrate is no longer positioned and fixed. This fixing method greatly improves the cutting efficiency, and there is no need to set up separate drive control for the longitudinal positioning component and the transverse positioning component, which reduces costs and does not cause the problem of forgetting to use them. It also solves the problem of manual control and fixation before and after cutting, which is prone to safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments:

[0029] Figure 1 A schematic structural diagram of a ceramic packaging substrate manufacturing device provided by the present invention;

[0030] Figure 2 A schematic diagram of another structure of a ceramic package substrate manufacturing device provided by the present invention;

[0031] Figure 3 A cross-sectional view of a cutting seat provided by the present invention;

[0032] Figure 4 A schematic diagram of the structure of the cutting seat provided by the present invention;

[0033] Figure 5 A schematic cross-sectional view of a cutting seat provided by the present invention;

[0034] Figure 6 The present invention provides Figure 5 A in the enlarged view;

[0035] Figure 7 A schematic diagram of the connection structure of the X-axis assembly and the Y-axis assembly provided by the present invention;

[0036] Figure 8 This is a schematic structural diagram of the first linkage component provided by the present invention.

[0037] : 1. base; 2. processing table; 3. cutting seat; 31. concave table; 32. groove; 33. rotating shaft; 34. longitudinal pressure plate; 35. transverse positioning seat; 351. slider; 352. slide groove; 36. spring; 37. wedge block; 4. cutting table; 5. L-shaped seat; 6. Y-axis assembly; 61. first concave seat; 62. Y-axis sliding seat; 63. electric push rod; 7. X-axis assembly; 71. second concave seat; 72. X-axis sliding seat; 73. lead screw; 74. lead screw motor; 8. laser cutting machine; 91. inverted U-shaped frame; 92. rack; 93. connecting rod; 94. connecting seat; 95. linkage gear; 10. ceramic substrate. DETAILED DESCRIPTION

[0038] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below with reference to specific diagrams. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0039] Example 1

[0040] See also Figure 1-Figure 3 The embodiment of the present invention provides a technical solution: a ceramic package substrate manufacturing device, including a base 1, a processing table 2 and a cutting table 4 are arranged on the base 1, an L-shaped seat 5 is welded on the cutting table 4, a Y-axis assembly 6 is installed on the L-shaped seat 5, an X-axis assembly 7 is arranged on the Y-axis assembly 6, the processing table 2 is a concave structure, a rectangular frame-type cutting seat 3 is arranged in the processing table 2, a concave table 31 is opened on the inner wall of the cutting seat 3, and is used to place a ceramic substrate 10, the cutting seat 3 is opened with a plurality of grooves 32, a lateral positioning assembly, a longitudinal positioning assembly and a second linkage assembly are arranged in the groove 32, and a laser cutting machine 8 and a first linkage assembly are arranged on the X-axis assembly 7;

[0041] The X-axis assembly 7 is connected to the longitudinal positioning assembly through a first linkage assembly, and the longitudinal positioning assembly is connected to the transverse positioning assembly through a second linkage assembly. When the X-axis assembly 7 moves downward, the longitudinal positioning assembly is synchronously driven by the first linkage assembly to flip and longitudinally position the ceramic substrate 10 placed on the cutting seat 3. When the longitudinal positioning assembly flips and longitudinally positions the ceramic substrate 10 placed on the cutting seat 3, the transverse positioning assembly is synchronously driven by the second linkage assembly to transversely position the ceramic substrate 10 placed on the cutting seat 3.

[0042] In this embodiment, when in use, the ceramic substrate 10 to be cut is placed in the cutting seat 3, so that the corners of the ceramic substrate 10 are placed on the concave platform 31, and the Y-axis component 6 is controlled to work, driving the X-axis component 7 to move downward, and the X-axis component 7 moves downward to drive the laser cutting machine 8 to move downward to perform cutting processing. When the X-axis component 7 moves downward, the longitudinal positioning component is synchronously driven by the first linkage component to flip and longitudinally position the ceramic substrate 10 placed on the cutting seat 3. When the longitudinal positioning component is flipped and longitudinally positions the ceramic substrate 10 placed on the cutting seat 3, the transverse positioning component is synchronously driven by the second linkage component to transversely position the ceramic substrate 10 placed on the cutting seat 3, that is, when the control is realized, When the laser cutting machine 8 is moved down for cutting processing, the first linkage component and the second linkage component are set to synchronously drive the longitudinal positioning component and the transverse positioning component to position and fix the ceramic substrate 10, and when the cutting is completed and the laser cutting machine 8 is controlled to move up, the longitudinal positioning component and the transverse positioning component are automatically driven to unlock automatically, and the ceramic substrate 10 is no longer positioned and fixed. This fixing method greatly improves the cutting efficiency, and there is no need to set up separate drive control for the longitudinal positioning component and the transverse positioning component, which reduces costs and does not cause the problem of forgetting to use them. It also solves the problem of manual control and fixation before and after cutting, which is prone to safety hazards.

[0043] Example 2

[0044] See also Figure 1-Figure 8 Based on the above embodiments, this embodiment specifically discloses the specific structures of the lateral positioning component, the longitudinal positioning component, the first linkage component and the second linkage component;

[0045] The longitudinal positioning assembly includes a rotating shaft 33 rotatably connected to the cutting seat 3 , both ends of the rotating shaft 33 pass through the cutting seat 3 and extend to the outside, and a longitudinal pressing plate 34 is fixedly provided in the groove 32 on the rotating shaft 33 .

[0046] The transverse positioning assembly includes a transverse positioning seat 35 , a slider 351 is welded at the bottom of the transverse positioning seat 35 , the slider 351 is slidably connected to a slide groove 352 opened on the bottom plate inside the groove 32 , and a spring 36 is fixed between the transverse positioning seat 35 and the inner side wall of the groove 32 .

[0047] The first linkage assembly includes two inverted U-shaped frames 91 and a linkage gear 95. The bottom ends of the two inverted U-shaped frames 91 are welded with racks 92. The linkage gear 95 is fixed to the two ends of the rotating shaft 33. The racks 92 are meshed and connected with the linkage gear 95. A connecting rod 93 is welded between the two inverted U-shaped frames 91. A connecting seat 94 is welded at the middle position of the connecting rod 93.

[0048] The second linkage component is a wedge block 37 , which is fixed on the outer wall of the longitudinal pressure plate 34 .

[0049] The Y-axis assembly 6 includes a first concave seat 61, which is welded and fixed to the lower surface of the horizontal end of the L-shaped seat 5. A Y-axis sliding seat 62 is slidably connected inside the first concave seat 61. An electric push rod 63 is installed on the upper surface of the horizontal end of the L-shaped seat 5. The bottom end of the electric push rod 63 extends into the first concave seat 61 and is fixedly connected to the Y-axis sliding seat 62.

[0050] The X-axis assembly 7 includes a second concave seat 71, which is welded and fixed on the Y-axis sliding seat 62, and the second concave seat 71 and the first concave seat 61 are arranged perpendicular to each other, an X-axis sliding seat 72 is slidably arranged in the second concave seat 71, a lead screw 73 is rotatably connected in the second concave seat 71, the X-axis sliding seat 72 is threadedly connected to the lead screw 73, a lead screw motor 74 for driving the lead screw 73 to rotate is installed on the side wall of one end of the second concave seat 71 along the length direction, and the laser cutting machine 8 is fixed to the front surface of the X-axis sliding seat 72 by a mounting seat bolt.

[0051] One end of the connecting seat 94 away from the connecting rod 93 is welded and fixed to the second concave seat 71 , and there are two connecting seats 94 in total, and the two connecting seats 94 are symmetrical to each other with respect to the first concave seat 61 .

[0052] Specifically, on the basis of the above embodiment, when the ceramic substrate 10 to be cut is placed in the cutting seat 3 and is ready for cutting, the electric push rod 63 is first controlled to extend, driving the Y-axis sliding seat 62 to move downward in the first concave seat 61, and the Y-axis sliding seat 62 moves downward to drive the X-axis assembly 7 to move downward, so that the laser cutting machine 8 fixed on the X-axis assembly 7 moves downward, that is, the laser cutting machine 8 moves downward to perform laser cutting, and when the X-axis assembly 7 moves downward, the second concave seat 71 moves downward, and the second concave seat 71 is connected to the connecting seat 94, the connecting rod 93 and The inverted U-shaped frame 91 drives the rack 92 to move downward, and the rack 92 moves downward to drive the rotating shaft 33 to rotate through the linkage gear 95. The rotation of the rotating shaft 33 drives the longitudinal pressing plate 34 to flip and press on the upper surface of the ceramic substrate 10, so as to longitudinally position the ceramic substrate 10. In the process of flipping the longitudinal pressing plate 34, the wedge block 37 is synchronously driven to be pressed and fixed on the side wall of the transverse positioning seat 35, so as to fix the transverse positioning seat 35. Thus, the ceramic substrate 10 is transversely positioned and fixed through the transverse positioning seat 35, that is, the automatic positioning of the ceramic substrate 10 is realized.

[0053] When the cutting is completed, the Y-axis sliding seat 62 is controlled to move up. Similarly, the rack 92 moves up, and the rack 92 moves up to drive the rotating shaft 33 to rotate in the opposite direction through the linkage gear 95. The reverse rotation of the rotating shaft 33 drives the longitudinal pressure plate 34 to flip open and unlock the ceramic substrate 10 longitudinally. At the same time, after the longitudinal pressure plate 34 flips open, it drives the wedge block 37 to separate from the transverse positioning seat 35, thereby realizing the transverse positioning unlocking of the ceramic substrate 10.

[0054] Example 3

[0055] Reference Figure 1-Figure 8 A ceramic package substrate manufacturing method is implemented based on a ceramic package substrate manufacturing device, comprising the following steps:

[0056] Collecting historical cutting processing data of the ceramic substrate 10, the historical cutting processing data of the ceramic substrate 10 is collected when the cutting of the ceramic substrate 10 meets the standard, and the historical cutting processing data includes comprehensive cutting parameters and cutting moving speed of the ceramic substrate 10, and the comprehensive cutting parameters include the cutting coefficient of the ceramic substrate 10, the cutting power of the laser cutting machine 8, and the distance between the laser cutting machine 8 and the ceramic substrate 10;

[0057] It should be noted that when the ceramic substrate 10 is not defective or damaged after cutting, it is recorded as a case where the cutting meets the standards.

[0058] Based on historical cutting processing data, a machine learning model is trained to predict the cutting speed, and real-time comprehensive cutting parameters are collected to predict the cutting speed based on the trained machine learning model.

[0059] The moving speed of the laser cutting machine 8 is controlled based on the predicted cutting moving speed.

[0060] Parameters affecting the cutting coefficient of the ceramic substrate 10 include the hardness, brittleness and thickness of the ceramic substrate 10;

[0061] The expression of the cutting coefficient of the ceramic substrate 10 is:

[0062] ;

[0063] In the formula, is the cutting coefficient of the ceramic substrate 10, is the hardness, For brittleness, is the thickness, , and is the weight factor, , and Both are greater than 0.

[0064] Specifically, the higher the hardness of the ceramic substrate 10, the greater the difficulty in cutting, and the lower the cutting speed will generally be. Conversely, the more brittle the ceramic substrate 10 is, the more likely it is to crack or break. Therefore, the cutting speed needs to be reduced to avoid material damage. Therefore, the greater the brittleness of the ceramic substrate 10, the slower the cutting speed, and vice versa. The thickness is the cutting thickness, that is, the feed depth. The greater the cutting thickness, the slower the cutting speed, and vice versa. In summary, the greater the cutting coefficient of the ceramic substrate 10, the lower the cutting speed, and vice versa.

[0065] It should be noted that the size of the weight factor is a specific value obtained by quantifying each data to facilitate subsequent comparison. The size of the weight factor depends on the number of comprehensive parameters and the preliminary setting of the corresponding weight factor for each set of comprehensive parameters by technical personnel in this field.

[0066] The training method of the machine learning model to predict the cutting movement speed includes:

[0067] Convert the collected historical cutting processing data into a corresponding set of feature vectors;

[0068] Each group of feature vectors is used as the input of the machine learning model. The machine learning model takes the cutting movement speed corresponding to the cutting comprehensive parameters of each group of ceramic substrates 10 as the output, and takes the cutting movement speed actually corresponding to the cutting comprehensive parameters of each group of ceramic substrates 10 as the prediction target. Minimizing the loss function value of the machine learning model is used as the training target; training is stopped when the loss function value of the machine learning model is less than or equal to the preset target loss value.

[0069] The machine learning model may be one of support vector machine regression, random forest regression or neural network regression models.

[0070] The loss function value of the machine learning model is the mean square error.

[0071] Mean square error is one of the commonly used loss functions. The model is trained with minimization as the goal, so that the machine learning model can better fit the data, thereby improving the performance and accuracy of the model.

[0072] In the loss function is the loss function value of the machine learning model, is the feature vector group number; is the number of eigenvector groups; For the The cutting movement speed corresponding to the group feature vector, For the The cutting movement speed corresponding to the group feature vector in real time.

[0073] Other model parameters of the machine learning model, such as target loss value, optimization algorithm, ratio of training set, test set, validation set, and optimization of loss function, are all obtained through actual engineering implementation and continuous experimental tuning.

[0074] In this embodiment, by collecting historical cutting processing data of the ceramic substrate 10, a machine learning model that predicts the cutting movement speed is trained based on the historical cutting processing data, real-time comprehensive cutting parameters are collected, and the cutting movement speed is predicted based on the trained machine learning model. Based on the predicted cutting movement speed, the movement speed of the laser cutting machine 8 is controlled, thereby realizing intelligent and automatic adjustment of the movement speed of the laser cutting machine 8, making the cutting of the ceramic substrate 10 by the laser cutting machine 8 more stable, and achieving faster and more accurate cutting.

[0075] The basic principles, main features and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and the description in the specification are only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A ceramic package substrate manufacturing device, comprising a base (1), wherein a processing table (2) and a cutting table (4) are arranged on the base (1), an L-shaped seat (5) is welded on the cutting table (4), a Y-axis assembly (6) is mounted on the L-shaped seat (5), and an X-axis assembly (7) is arranged on the Y-axis assembly (6), characterized in that: A rectangular frame-type cutting seat (3) is arranged in the processing table (2), a concave platform (31) is provided on the inner wall of the cutting seat (3), a groove (32) is provided in the cutting seat (3), a transverse positioning component, a longitudinal positioning component and a second linkage component are arranged in the groove (32), and a laser cutting machine (8) and a first linkage component are arranged on the X-axis component (7); The X-axis assembly (7) is transmission-connected to the longitudinal positioning assembly via a first linkage assembly, and the longitudinal positioning assembly is transmission-connected to the transverse positioning assembly via a second linkage assembly; when the X-axis assembly (7) moves downward, the longitudinal positioning assembly is synchronously driven by the first linkage assembly to flip and longitudinally position the ceramic substrate (10) placed on the cutting seat (3); when the longitudinal positioning assembly flips and longitudinally positions the ceramic substrate (10) placed on the cutting seat (3), the transverse positioning assembly is synchronously driven by the second linkage assembly to transversely position the ceramic substrate (10) placed on the cutting seat (3); The longitudinal positioning assembly comprises a rotating shaft (33) rotatably connected to the cutting seat (3), two ends of the rotating shaft (33) pass through the cutting seat (3) and extend to the outside, and a longitudinal pressing plate (34) is fixedly provided on the rotating shaft (33) and located in the groove (32); The transverse positioning assembly comprises a transverse positioning seat (35), a slider (351) is welded to the bottom of the transverse positioning seat (35), the slider (351) is slidably connected to a slide groove (352) provided on the inner bottom plate of the groove (32), and a spring (36) is fixed between the transverse positioning seat (35) and the inner side wall of the groove (32); The first linkage assembly comprises two inverted U-shaped frames (91) and a linkage gear (95); a rack (92) is welded to the bottom ends of the two inverted U-shaped frames (91); the linkage gear (95) is fixed to both ends of the rotating shaft (33); the rack (92) is meshedly connected to the linkage gear (95); a connecting rod (93) is welded between the two inverted U-shaped frames (91); and a connecting seat (94) is welded at the middle of the connecting rod (93); The second linkage component is a wedge-shaped block (37), and the wedge-shaped block (37) is fixed on the outer wall of the longitudinal pressure plate (34); The Y-axis assembly (6) comprises a first concave seat (61), the first concave seat (61) being welded and fixed to the lower surface of the horizontal end of the L-shaped seat (5), a Y-axis sliding seat (62) being slidably connected inside the first concave seat (61), an electric push rod (63) being installed on the upper surface of the horizontal end of the L-shaped seat (5), the bottom end of the electric push rod (63) extending into the first concave seat (61) and being fixedly connected to the Y-axis sliding seat (62); The X-axis assembly (7) comprises a second concave seat (71), the second concave seat (71) being welded and fixed on the Y-axis sliding seat (62), and the second concave seat (71) and the first concave seat (61) being arranged perpendicular to each other, an X-axis sliding seat (72) being slidably arranged in the second concave seat (71), a lead screw (73) being rotatably connected in the second concave seat (71), the X-axis sliding seat (72) being threadedly connected to the lead screw (73), a lead screw motor (74) for driving the lead screw (73) to rotate being installed on a side wall at one end of the second concave seat (71) in the length direction, and the laser cutting machine (8) being fixed to the surface of the X-axis sliding seat (72) by means of mounting seat bolts.

2. The ceramic package substrate manufacturing equipment according to claim 1, characterized in that: One end of the connecting seat (94) away from the connecting rod (93) is welded and fixed to the second concave seat (71), and two connecting seats (94) are provided in total, and the two connecting seats (94) are symmetrical with respect to the first concave seat (61).

3. A method for manufacturing a ceramic package substrate, implemented based on a ceramic package substrate manufacturing device as claimed in any one of claims 1 to 2, characterized in that: The following steps are involved: Collecting historical cutting processing data of the ceramic substrate (10), wherein the historical cutting processing data of the ceramic substrate (10) is collected when the cutting of the ceramic substrate (10) meets the standard, and the historical cutting processing data includes comprehensive cutting parameters and cutting movement speed of the ceramic substrate (10), and the comprehensive cutting parameters include a cutting coefficient of the ceramic substrate (10), a cutting power of a laser cutting machine (8), and a distance between the laser cutting machine (8) and the ceramic substrate (10); Based on historical cutting processing data, a machine learning model is trained to predict the cutting speed, and real-time comprehensive cutting parameters are collected to predict the cutting speed based on the trained machine learning model. The moving speed of the laser cutting machine (8) is controlled based on the predicted cutting moving speed.

4. The method for manufacturing a ceramic package substrate according to claim 3, characterized in that: Parameters affecting the cutting coefficient of the ceramic substrate (10) include hardness, brittleness and thickness of the ceramic substrate (10); The expression of the cutting coefficient of the ceramic substrate (10) is: ； In the formula, is the cutting factor of the ceramic substrate (10), is the hardness, For brittleness, is the thickness, , and is the weight factor, , and Both are greater than 0.

5. The method for manufacturing a ceramic package substrate according to claim 3, characterized in that: The training method of the machine learning model for predicting the cutting movement speed includes: Convert the collected historical cutting processing data into a corresponding set of feature vectors; Each group of feature vectors is used as input of the machine learning model; the machine learning model uses the cutting movement speed corresponding to the cutting comprehensive parameters of each group of ceramic substrates (10) as output, uses the cutting movement speed actually corresponding to the cutting comprehensive parameters of each group of ceramic substrates (10) as a prediction target, and uses minimizing the loss function value of the machine learning model as a training target; and stops training when the loss function value of the machine learning model is less than or equal to a preset target loss value.

Images