A bonding copper sheet feeding device for semiconductor power device packaging

Abstract

The present invention relates to the field of semiconductor power device packaging technology, and specifically to a bonding copper sheet feeding device for semiconductor power device packaging, comprising a conveyor belt body and a vibration disk body, wherein a motor module is installed on the conveyor belt body, wherein there are two groups of motor modules, and the two groups of motor modules are stacked, and a sliding seat is installed on the upper end of the motor module, and after the vibration disk body is opened, as the conical spiral sheet lifts the copper sheet, under the action of a screening mechanism and an adjustment mechanism, all the copper sheets enter the transmission mechanism in a specific posture, which is convenient for subsequent feeding; under the action of the feeding mechanism, neatly arranged copper sheets are transferred to the position of a copper sheet placement disk along with a negative pressure air nozzle, and as the position of the copper sheet placement disk on the X-axis and Y-axis of the motor module changes, the copper sheets are accurately placed in the copper sheet placement disk; the overall feeding device has a high degree of automation, greatly improves the feeding speed, and reduces the cost of the factory.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor power device packaging, in particular to a bonding copper sheet feeding device for semiconductor power device packaging. Background Art

[0002] The main products of power semiconductors include power devices (diodes, IGBTs, MOSs, BJTs). Among them, the new power semiconductor device IGBT has become the mainstream development direction of switching devices in the field of power electronics.

[0003] IGBT module packaging is a very critical link in its processing, including chip mounting and copper sheet bonding. Copper sheet bonding refers to the process of bonding 3D-shaped copper sheets (as shown in the attached figure of the manual) Figure 1 The chip is fixed to the lead pins of the solder-coated chip and the copper frame (as shown in the figure) to achieve electrical connection between the chip and the copper frame pins, and then the chip packaging process is completed through reflow soldering and curing.

[0004] In the current IGBT packaging production line, the feeding method of bonding copper sheets is to manually place the copper sheets in bulk into a tray. The tray contains many squares, and each square corresponds to a bonding copper sheet. The bonding copper sheets are fed in the form of loose sheets. The size of the bonding copper sheets is only a few millimeters and has a special 3D shape. The square size of the tray is only slightly larger than the size of the bonding copper sheets, and the placement accuracy is required to be high during feeding. In view of the low efficiency and cumbersome work of manual feeding, the present invention proposes a bonding copper sheet feeding device for semiconductor power device packaging. Summary of the invention

[0005] In order to solve the above technical problems, an embodiment of the present invention provides a bonding copper sheet feeding device for semiconductor power device packaging, comprising a conveyor belt body and a vibration plate body, a motor module is installed on the conveyor belt body, the motor module has two groups, and the two groups of motor modules are stacked, the upper end of the motor module is installed with a sliding seat, the sliding seat is installed with a copper sheet placement plate, and further comprises:

[0006] A conical spiral piece, the conical spiral piece is installed in the vibration plate body, the conical spiral piece is inclined, and the vibration plate body drives the copper piece to rise along the edge of the conical spiral piece through rotation and vibration;

[0007] A screening mechanism, which is installed on the conical spiral sheet and connected to the vibration plate body, and removes the reversed copper sheets during the lifting process, so that the reversed copper sheets fall onto the vibration plate body and are screened again;

[0008] Support rods, there are several support rods, all of which are installed on the vibration plate body, and a support cover is installed at the other end of each support rod;

[0009] An adjustment mechanism, which is mounted on the support cover and connected to the vibration plate body, and which guides the placement of the copper sheets filtered by the screening mechanism, and adjusts the copper sheets passing through the adjustment mechanism to a fixed posture;

[0010] A transmission mechanism, which is installed between the vibration plate body and the conveyor belt body and connected to the adjustment mechanism, and which transports the copper sheet passing through the adjustment mechanism to one side of the conveyor belt body;

[0011] A feeding mechanism is installed above the conveyor belt body and connected to the transmission mechanism. The feeding mechanism places the copper sheet at the end of the transmission mechanism in the copper sheet placement tray.

[0012] Preferably, the screening mechanism includes a conical spiral groove opened at the front end part of the conical spiral piece, the conical spiral groove reduces the transport track diameter of the front end part of the conical spiral piece, a square hole 1 is opened on the front end part of the conical spiral piece, the width of the square hole 1 is smaller than the width of the copper sheet, the length of the square hole 1 is larger than the length of the bent part of the front end of the copper sheet, a square hole 2 is opened on the front end part of the conical spiral piece, the square hole 2 and the square hole 1 have the same shape and are arranged perpendicular to each other, laser sensors are arranged on the long sides of the square hole 1 and the square hole 2, and also includes a pneumatic mechanism arranged on the conical spiral piece.

[0013] Preferably, the pneumatic mechanism includes square hole three opened on the conical spiral blade, the square hole three is located on one side of square hole two, and the square holes one, two and three are distributed in a straight line, an air guide cover is installed on the vibration disk body, the air guide cover is conductively connected to the square hole three, a micro air pump is installed on the vibration disk body, an air pipe is installed on the micro air pump, and the air pipe is conductively connected to the air guide cover.

[0014] Preferably, the adjustment mechanism includes an arc-shaped plate fixed at the top end of the conical spiral sheet, the arc-shaped plate is inclined, a first guide rail is installed through the support cover, the distance between the first guide rail and the arc-shaped plate is greater than the thickness of the rear part of the copper sheet and less than the overall height of the copper sheet, a second guide rail is installed through the support cover, one end of the second guide rail is fixed to one side of the arc-shaped plate, the second guide rail supports the bottom of the copper sheet, the second guide rail is higher than the first guide rail, and the height difference between the second guide rail and the first guide rail is greater than the thickness of the rear part of the copper sheet, a third guide rail is installed through the support cover, the third guide rail is higher than the second guide rail, the distance between the third guide rail and the first guide rail gradually decreases from front to back, and the third guide rail limits the position of the front end 3D part of the copper sheet.

[0015] Preferably, the transmission mechanism comprises a support frame arranged on one side of the vibration plate body, a transmission module is installed on the support frame, a first slide rail is arranged on the transmission module, and the width of the first slide rail is greater than the length of the copper sheet.

[0016] Preferably, the feeding mechanism includes a gantry arranged above the conveyor belt body, a motor assembly is installed on the gantry, wheels are relatively installed on the motor assembly, belts are installed between the wheels, first rotating shafts are installed through the wheels, first rotating shafts are sleeved with first connecting rods, two first connecting rods are staggered front and back, a second connecting rod is fixed to one end of the first connecting rod, a negative pressure air nozzle is installed through the second connecting rod, and the negative pressure air nozzle is located above the end of the first slide rail.

[0017] Preferably, the motor module, vibration plate body, conveyor belt body, micro air pump, laser sensor, transmission module, motor assembly, and electric control valve are all electrically connected and connected to the internal system.

[0018] Preferably, a guide cover is installed on the vibration disk body, the guide cover is located below the arc plate and is inclined, and a feed hole is opened on the vibration disk body, and the feed hole is located at the end of the guide cover.

[0019] Preferably, an arc-shaped spiral plate is installed on the inner side of the conical spiral piece, the arc-shaped spiral plate is located on one side of square hole two, and the angle between the arc-shaped spiral plate and the connected conical spiral piece is an obtuse angle, an electric-controlled valve is installed through the air pipe, the electric-controlled valve is electrically connected to the laser sensor, a conduit is connected to the air pipe, the conduit is located between the micro air pump and the electric-controlled valve, an acceleration roller is installed through the conical spiral piece, the acceleration roller is used to accelerate the copper sheet passing through square hole one and square hole two, a turbine is sleeved on the acceleration roller, and the outlet end of the conduit corresponds to the position of the upper part of the turbine.

[0020] Preferably, in the conical spiral sheet, the portion after the conical spiral groove can be divided into two sections, namely section X and section Y, wherein section X starts from the head end of the conical spiral groove and ends at one side of square hole 2, and this section has a large spiral slope, and section Y starts from the other side of square hole 2 and ends at the end of the conical spiral sheet, and this section has a small spiral slope.

[0021] The present invention has at least the following beneficial effects:

[0022] 1. After the main body of the vibration plate is opened, as the conical spiral sheet lifts the copper sheet, under the action of the screening mechanism and the adjustment mechanism, all the copper sheets enter the transmission mechanism in a specific posture, which is convenient for subsequent loading;

[0023] 2. Under the action of the feeding mechanism, the neatly arranged copper sheets are transferred to the copper sheet placement plate along with the negative pressure air nozzle. As the motor module changes the position of the copper sheet placement plate on the X-axis and Y-axis, the copper sheets are accurately placed in the copper sheet placement plate.

[0024] 3. The overall feeding device has a high degree of automation, which greatly improves the feeding speed and reduces the cost of the factory;

[0025] 4. With the cooperation of the electric control valve, laser sensor, conduit, air pipe, arc spiral plate, turbine and acceleration roller, the inverted copper sheet will be turned over and enter the adjustment mechanism to improve the efficiency of material selection. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0027] Figure 1 It is a schematic diagram of the structure of the bonding copper sheet (copper sheet) of the present invention;

[0028] Figure 2 This is a schematic structural diagram of the contact state between the front copper sheet and the vibration plate body during the lifting process of the present invention;

[0029] Figure 3 This is a schematic structural diagram of the back copper sheet in contact with the vibration plate body during the lifting process of the present invention;

[0030] Figure 4 It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 5 This is a schematic diagram of the main structure of the vibration plate of the present invention;

[0032] Figure 6 For the present invention Figure 5 Schematic diagram of the structure at A in the middle;

[0033] Figure 7 This is a schematic diagram of the cross-sectional structure of the main body of the vibration plate of the present invention;

[0034] Figure 8 For the present invention Figure 7 Schematic diagram of the structure at B in the middle;

[0035] Fig. 9 It is a schematic diagram of the structure of the conical spiral blade of the present invention;

[0036] Fig.10 It is a schematic diagram of the structure of the contact part between the adjustment mechanism and the transmission mechanism of the present invention;

[0037] Fig.11 It is a schematic diagram of the structure of the conveyor belt main body and the feeding mechanism of the present invention;

[0038] Fig.12 For the present invention Fig.11 Schematic diagram of the structure at C in the middle;

[0039] Fig.13 This is a schematic diagram of the copper sheet placement plate structure of the present invention.

[0040] In the figure: 1. conveyor belt body; 11. vibration plate body; 12. motor module; 13. sliding seat; 14. copper plate placement plate; 15. conical spiral sheet; 2. screening mechanism; 21. conical spiral groove; 22. square hole 1; 23. square hole 2; 24. laser sensor; 3. pneumatic mechanism; 31. square hole 3; 32. air guide cover; 33. micro air pump; 34. air pipe; 4. support rod; 41. support cover; 5. adjustment mechanism; 51. arc plate; 52. The first guide rail; 53, the second guide rail; 54, the third guide rail; 6, the transmission mechanism; 61, the support frame; 62, the transmission module; 63, the first slide rail; 7, the feeding mechanism; 71, the gantry; 72, the motor assembly; 73, the rotating wheel; 74, the first rotating shaft; 75, the first connecting rod; 76, the second connecting rod; 77, the negative pressure air nozzle; 80, the guide cover; 81, the feeding hole; 91, the arc spiral plate; 92, the electric control valve; 93, the conduit; 94, the acceleration roller; 95, the turbine. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0042] The terms used in the embodiments of the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. The singular forms "a", "said" and "the" used in the embodiments of the present disclosure and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two, and other quantifiers are similar.

[0043] It should be understood that, although the terms first, second, third, etc. may be used to describe in the disclosed embodiments, these descriptions should not be limited to these terms. These terms are only used to distinguish the described objects. For example, without departing from the scope of the disclosed embodiments, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0044] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include the plural forms, unless the context clearly indicates other meanings.

[0045] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements. Example

[0047] See also Figure 4-13 The present invention provides a technical solution: a bonding copper sheet feeding device for semiconductor power device packaging, comprising a conveyor belt body 1 and a vibration plate body 11, a motor module 12 is installed on the conveyor belt body 1, two groups of motor modules 12 are stacked, the motor modules 12 are prior art, the stacked motor modules 12 can move the object to be transferred in the X-axis and Y-axis directions arbitrarily, a sliding seat 13 is installed on the upper end of the motor module 12, a copper sheet placement plate 14 is installed on the sliding seat 13, and also includes:

[0048] The conical spiral piece 15 is installed in the vibration plate body 11. The conical spiral piece 15 is inclined. The vibration plate body 11 drives the copper sheet to rise along the edge of the conical spiral piece 15 through rotation and vibration.

[0049] Screening mechanism 2, which is installed on the conical spiral sheet 15 and connected to the vibration plate body 11. The screening mechanism 2 removes the reversed copper sheets during the lifting process, so that the reversed copper sheets fall onto the vibration plate body 11 and are screened again;

[0050] Support rods 4, there are several support rods 4, all of which are installed on the vibration plate body 11, and a support cover 41 is installed at the other end of the support rod 4;

[0051] The adjustment mechanism 5 is installed on the support cover 41 and connected to the vibration plate body 11. The adjustment mechanism 5 guides the placement of the copper sheets after being filtered by the screening mechanism 2, and adjusts the copper sheets passing through the adjustment mechanism 5 to a fixed posture;

[0052] The transmission mechanism 6 is installed between the vibration plate body 11 and the conveyor belt body 1 and is connected to the adjustment mechanism 5. The transmission mechanism 6 transports the copper sheet passing through the adjustment mechanism 5 to one side of the conveyor belt body 1;

[0053] The feeding mechanism 7 is installed above the conveyor belt body 1 and is connected to the transmission mechanism 6. The feeding mechanism 7 places the copper sheet at the end of the transmission mechanism 6 in the copper sheet placement tray 14.

[0054] The screening mechanism 2 includes a conical spiral groove 21 opened at the front end portion of the conical spiral piece 15, the conical spiral groove 21 reduces the transport track diameter of the front end portion of the conical spiral piece 15, a square hole 12 is opened on the front end portion of the conical spiral piece 15, the width of the square hole 122 is less than the width of the copper sheet, the length of the square hole 122 is greater than the length of the bent portion of the front end of the copper sheet, a square hole 23 is opened on the front end portion of the conical spiral piece 15, the square hole 23 and the square hole 122 have the same shape and are arranged perpendicular to each other, laser sensors 24 are arranged on the long sides of the square hole 122 and the square hole 23, and also includes a pneumatic mechanism 3 arranged on the conical spiral piece 15.

[0055] The front end portion of the conical spiral piece 15 has a smaller transport track diameter, which can prevent multiple copper sheets from entering the square hole 22 at the same time, making subsequent screening easier.

[0056] The vibration plate body 11 is turned on, and the vibration plate body 11 drives the copper sheet to vibrate and rotate inside it. Under the guidance of the conical spiral sheet 15, the copper sheet is lifted along the conical spiral sheet 15, and then passes through the conical spiral groove 21. Since the conical spiral groove 21 reduces the transport track diameter of the front end of the conical spiral sheet 15, the narrowed conical spiral sheet 15 cannot allow two or more copper sheets to pass through in parallel at the same time. The excess copper sheets fall back into the vibration plate body 11 from the conical spiral groove 21. Starting from the narrowed part of the conical spiral sheet 15, the copper sheets will pass through the conical spiral sheet 15 in turn, passing through the square hole 1 22 and the square hole 2 23 on the way, and further screening is carried out;

[0057] However, since the front end 3D of the copper sheet is narrow, it cannot form a stable support with the vibration plate body 11, that is, there will be 6 states between the copper sheet rising along the conical spiral sheet 15 and the vibration plate body 11, among which Figure 2 There are three states for the front of the copper sheet (A1, A2, A3). Figure 3 There are three states (B1, B2, B3) for the back side of the copper sheet. When the copper sheet is in the three states of the front side and passes through the square hole 1 22 and the square hole 23, since the supporting points of the copper sheet are all on the plane of the rear part of the copper sheet, the 3D part of the front part of the copper sheet is in a suspended state and will not contact the square hole 1 22 and the square hole 23. The copper sheet can pass through the screening mechanism 2 smoothly. When the copper sheet is in the reverse state, the supporting points of the copper sheet on the reverse side are located at the top and the end thereof. When passing through the square hole 1 22 and the square hole 23 in the states B2 and B3, the 3D part of the top of the copper sheet will sink into the square hole 1 22, blocking the laser sensor 24 in the square hole 1 22. Then the laser sensor 24 sends a signal to the electric control valve 92, and the electric control valve 92 opens. Start, the airflow drawn by the micro air pump 33 blows out from the square hole three 31 through the air pipe 34 and the air guide cover 32, and blows the edge part of the copper sheet that contacts the vibration disk body 11. When passing through the square hole one 22 and the square hole two 23 in the B1 state, the 3D part of the top of the copper sheet will sink into the square hole two 23, blocking the laser sensor 24 in the square hole two 23. Similarly, the airflow blows the edge of the copper sheet, and because the copper sheet as a whole has a certain bandwidth, only one side of it is blown by airflow, which will cause the inverted copper sheet to flip over. After the copper sheet flips over, it is blocked by the arc spiral plate 91, and with the operation of the vibration disk body 11, it moves from the arc spiral plate 91 to the conical spiral sheet 15 again, and continues to move;

[0058] The pneumatic mechanism 3 includes a square hole three 31 opened on the conical spiral blade 15, the square hole three 31 is located on one side of the square hole two 23, and the square holes one 22, the square holes two 23, and the square holes three 31 are distributed in a straight line, an air guide cover 32 is installed on the vibration disk body 11, and the air guide cover 32 is conductively connected to the square hole three 31, a micro air pump 33 is installed on the vibration disk body 11, and an air pipe 34 is installed on the micro air pump 33, and the air pipe 34 is conductively connected to the air guide cover 32.

[0059] The adjustment mechanism 5 includes an arc-shaped plate 51 fixed on the top end of the conical spiral sheet 15, and the arc-shaped plate 51 is inclined. A first guide rail 52 is installed through the support cover 41, and the distance between the first guide rail 52 and the arc-shaped plate 51 is greater than the thickness of the rear part of the copper sheet and less than the overall height of the copper sheet. A second guide rail 53 is installed through the support cover 41, and one end of the second guide rail 53 is fixed to one side of the arc-shaped plate 51, and the second guide rail 53 supports the bottom of the copper sheet. The second guide rail 53 is higher than the first guide rail 52, and the height difference between the second guide rail 53 and the first guide rail 52 is greater than the thickness of the rear part of the copper sheet. The first guide rail 52 and the second guide rail 53 are both sheet-shaped. A third guide rail 54 is installed through the support cover 41, and the third guide rail 54 is higher than the second guide rail 53. The distance between the third guide rail 54 and the first guide rail 52 gradually decreases from front to back, and the third guide rail 54 limits the position of the front end 3D part of the copper sheet.

[0060] The copper sheets passing through the screening mechanism 2 are all facing up. During the process of lifting the copper sheets facing up along the conical spiral sheet 15, after the lifting height is higher than the vibration disk body 11, as the copper sheets continue to vibrate, the copper sheets slide along the inclined conical spiral sheet 15 toward the position of the arc plate 51. At this time, due to the obstruction of the first guide rail 52, the 3D part of the front end of the copper sheet is in contact with the first guide rail 52, and the center of gravity of the entire copper sheet is located in the plane of the rear end part. Finally, the rear end part of the copper sheet is located between the first guide rail 52 and the arc plate 51, and the distance between the first guide rail 52 and the arc plate 51 only allows a single copper sheet to pass through, thereby avoiding the stacking of copper sheets. After passing through the arc plate 51, the second guide rail 53 replaces the arc plate 51 to support the bottom of the copper sheet, thereby limiting the copper sheet from moving from the second guide rail 53 in a fixed posture.

[0061] The transmission mechanism 6 includes a support frame 61 arranged on one side of the vibration plate body 11 , a transmission module 62 is installed on the support frame 61 , a first slide rail 63 is arranged on the transmission module 62 , and the width of the first slide rail 63 is greater than the length of the copper sheet.

[0062] The copper sheet guided by the first guide rail 52, the second guide rail 53, and the third guide rail 54 enters the transmission module 62. The transmission module 62 is a prior art and can refer to an electric slide rail. The transmission module 62 continues to transport the copper sheet entering the inside.

[0063] The feeding mechanism 7 includes a gantry 71 arranged above the conveyor belt body 1, and a motor assembly 72 is installed on the gantry 71, and rotating wheels 73 are relatively installed on the motor assembly 72, and belts are installed between the rotating wheels 73. The rotating wheels 73 are all penetrated by a first rotating shaft 74, and the first rotating shaft 74 is sleeved with a first connecting rod 75. The two first connecting rods 75 are staggered front and back, and a second connecting rod 76 is fixed at one end of the first connecting rod 75. A negative pressure air nozzle 77 is penetrated and installed on the second connecting rod 76, and the negative pressure air nozzle 77 is located above the end of the first slide rail 63.

[0064] After the transmission mechanism 6 sends the copper sheet to the end of the first slide rail 63, the motor assembly 72 is turned on. The motor assembly 72 is the existing technology. It controls the rotation of the turntable 73. The turntable 73 drives the adjacent turntable 73 to rotate through the belt. During the rotation of the turntable 73, the first connecting rod 75 is driven to rotate synchronously. The first connecting rod 75 drives the negative pressure air nozzle 77 to rotate and move through the second connecting rod 76. Under the action of the negative pressure air nozzle 77, the copper sheet at the end of the first slide rail 63 enters the copper sheet placement tray 14 area. The copper sheet placement tray 14 moves precisely under the action of the motor module 12 to ensure that the copper sheet can be directly placed in the copper sheet placement tray 14, thereby completing the loading.

[0065] The motor module 12, the vibration plate body 11, the conveyor belt body 1, the micro air pump 33, the laser sensor 24, the transmission module 62, the motor assembly 72, and the electric control valve 92 are all electrically connected and connected to the internal system.

[0066] Those skilled in the art only need to perform programming to directly and accurately complete the mutual coordination between the various components.

[0067] A guide cover 80 is installed on the vibration plate body 11 . The guide cover 80 is located below the arc plate 51 and is inclined. A feed hole 81 is opened on the vibration plate body 11 . The feed hole 81 is located at the end of the guide cover 80 .

[0068] When the copper sheet facing upward is lifted along the conical spiral sheet 15, after the lifting height is higher than the vibration disk body 11, as the copper sheet continues to vibrate, the copper sheet slides along the inclined conical spiral sheet 15 toward the position of the arc plate 51. If multiple copper sheets pass through at the same time, since only a single copper sheet can pass between the first guide rail 52 and the arc plate 51, the excess copper sheets will be squeezed and slide down along the arc plate 51. Under the guidance of the guide cover 80, the fallen copper sheet passes through the feed hole 81 and re-enters the interior of the vibration disk body 11 for screening again. At the same time, even if the copper sheet passes through the screening mechanism 2 in the reverse state due to equipment failure or external interference, the inverted copper sheet cannot pass through the first guide rail 52, the second guide rail 53, and the third slide rail 54 smoothly in this step. After moving a certain distance and losing the support of the arc plate 51 on its bottom, it slides into the guide cover 80 and is screened again.

[0069] An arc-shaped spiral plate 91 is installed on the inner side of the conical spiral piece 15, and the arc-shaped spiral plate 91 is located on one side of the square hole 23, and the angle between the arc-shaped spiral plate 91 and the connected conical spiral piece 15 is an obtuse angle. An electric-controlled valve 92 is installed through the air pipe 34, and the electric-controlled valve 92 is electrically connected to the laser sensor 24. A conduit 93 is connected to the air pipe 34, and the conduit 93 is located between the micro air pump 33 and the electric-controlled valve 92. An acceleration roller 94 is installed through the conical spiral piece 15, and the acceleration roller 94 is used to accelerate the copper sheet passing through the square hole 1 22 and the square hole 23. A turbine 95 is sleeved on the acceleration roller 94, and the outlet end of the conduit 93 corresponds to a part of the position on the turbine 95.

[0070] In the conical spiral piece 15, the part after the conical spiral groove 21 can be divided into two sections, namely, section X and section Y, wherein section X starts from the head end of the conical spiral groove 21 and ends at one side of the second square hole 23, and the spiral slope of this section is large, and section Y starts from the other side of the second square hole 23 and ends at the end of the conical spiral piece 15, and the spiral slope of this section is small.

[0071] The spiral slope of the conical spiral sheet 15 of the X section is large, which can slow down the moving speed of the copper sheet that has not passed through the square hole 1 22 and the square hole 23, so that the distance the copper sheet moves each time is reduced, and it is prevented that the reversed copper sheet directly skips the screening of the square hole 1 22 and the square hole 23 due to a single movement distance that is too large. In the default state, the micro air pump 33 is always turned on, and the electric control valve 92 is closed. In this state, the airflow generated by the micro air pump 33 is ejected from the conduit 93, and this part of the airflow blows the blades of the turbine 95, thereby driving the turbine 95 to rotate. The wheel 95 drives the accelerating roller 94 to rotate, and the rotating accelerating roller 94 accelerates the copper sheets passing through the square hole 1 22 and the square hole 23. At this time, the moving speed of the copper sheets in the X section of the conical spiral sheet 15 is slowed down, and the moving speed of the copper sheets in the Y section is accelerated, ensuring that there is enough time to screen the copper sheets when they pass through the square hole 1 22 and the square hole 23, and the copper sheets at the front are accelerated by the accelerating roller 94 and quickly leave the screening area of ​​the square hole 1 22 and the square hole 23, thereby preventing the copper sheets from stacking.

[0072] The working principle of the present invention is as follows: the vibration plate body 11 is turned on, and the vibration plate body 11 drives the copper sheet to vibrate and rotate inside it. Under the guidance of the conical spiral sheet 15, the copper sheet is lifted along the conical spiral sheet 15 in a spiral manner, and then passes through the conical spiral groove 21. Since the conical spiral groove 21 reduces the transport track diameter of the front end of the conical spiral sheet 15, the narrowed conical spiral sheet 15 cannot allow two or more copper sheets to pass through in parallel at the same time. The excess copper sheets fall back into the vibration plate body 11 from the conical spiral groove 21. Starting from the narrowed part of the conical spiral sheet 15, the copper sheets will pass through the conical spiral sheet 15 in turn, and will be screened through the square hole 1 22 and the square hole 2 23 on the way.

[0073] However, since the front end 3D of the copper sheet is narrow, it cannot form a stable support with the vibration plate body 11, that is, there will be 6 states between the copper sheet rising along the conical spiral sheet 15 and the vibration plate body 11, among which Figure 2 There are three states for the front of the copper sheet (A1, A2, A3). Figure 3There are three states (B1, B2, B3) for the back of the copper sheet. When the copper sheet is in the three states of the front side and passes through the square hole 1 22 and the square hole 23, since the supporting points of the copper sheet are all on the plane of the rear part of the copper sheet, the 3D part of the front part of the copper sheet is in a suspended state and will not contact the square hole 1 22 and the square hole 23. The copper sheet can pass through the screening mechanism 2 smoothly. When the copper sheet is in the reverse state, the supporting points of the copper sheet on the reverse side are located at its top and end. When passing through the square hole 1 22 and the square hole 23 in the B2 and B3 states, the 3D part of the top of the copper sheet will sink into the square hole 1 22, blocking the laser sensor 24 in the square hole 1 22. Then the laser sensor 24 sends a signal to the electric control valve 92, and the electric control valve 92 opens. The airflow extracted by the micro air pump 33 blows out the airflow from the square hole 31 through the air pipe 34 and the air guide cover 32, and blows the edge part of the copper sheet that contacts the vibration disk body 11. When passing through the square hole 1 22 and the square hole 2 23 in the B1 state, the 3D part of the top of the copper sheet will sink into the square hole 23, blocking the laser sensor 24 in the square hole 23. Similarly, the airflow blows the edge of the copper sheet. Since the copper sheet as a whole has a certain width, only one side of it is blown by the airflow, which will cause the inverted copper sheet to flip over. After the copper sheet flips over, it is blocked by the arc spiral plate 91, and with the operation of the vibration disk body 11, it moves from the arc spiral plate 91 to the conical spiral plate 15 again, and continues to move, preventing the copper sheet from falling back to the bottom of the vibration disk body 11, thereby improving the transportation efficiency of the copper sheet; at the same time, the angle between the arc spiral plate 31 and the conical spiral plate 15 can be adjusted according to the size, shape and quality of the copper sheet. When the vibration disk body 11 is in operation, the flat part of the copper sheet is in contact with the arc spiral plate 91 as much as possible, and continues to move in a relatively stable state;

[0074] The copper sheets passing through the screening mechanism 2 are all facing up. During the process of lifting the copper sheets facing up along the conical spiral sheet 15, after the lifting height is higher than the vibration plate body 11, as the copper sheets continue to vibrate, the copper sheets slide along the inclined conical spiral sheet 15 toward the position of the arc plate 51. At this time, due to the obstruction of the first guide rail 52, the 3D part of the front end of the copper sheet fits with the first guide rail 52, and the center of gravity of the copper sheet as a whole is located at the plane of the rear end part. The arc plate 51 itself also has an inclined angle. Finally, after continuous up and down vibration and forward movement of the copper sheet, the flat part of the copper sheet passes through the first guide rail 52, the bottom is supported by the arc plate 51, and the 3D part of the front end is intercepted by the first guide rail 52.

[0075] by Figure 2Taking the movement of the copper sheet in state A2 as an example, when the copper sheet moves to the position of the arc plate 51, the front 3D part of the copper sheet first contacts the first guide rail 52. Since its 3D part is higher than the first guide rail 52, the copper sheet will continue to move. After the rear end of the copper sheet is completely on the arc plate 51, since its center of gravity is located on the plane part and the arc plate 51 is tilted, during the vibration and movement process, the 3D part of the copper sheet starts to rotate with the part in contact with the first guide rail as the axis. Finally, the plane part of the copper sheet is located between the first guide rail 52 and the arc plate 51, and its 3D part is still The copper sheet is blocked by the first guide rail 52, that is, the copper sheet is finally located between the first guide rail 52 and the curved plate 51. When the copper sheet moves in the A1 state, its plane part will be directly located between the first guide rail 52 and the curved plate 51 during the movement, and its 3D part will be blocked by the first guide rail 52. When the copper sheet moves in the A3 state, its plane part will first be located on the curved plate 51, and its center of gravity will also be located in the plane part. The curved plate 51 is tilted, and its plane part will be directly located between the first guide rail 52 and the curved plate 51 during the movement, and its 3D part will be blocked by the first guide rail 52.

[0076] The distance between the first guide rail 52 and the curved plate 51 allows only a single copper sheet to pass through, thereby preventing the copper sheets from being stacked. After continuing to move for a distance in this posture, the gap below the 3D part of the front end of the copper sheet is penetrated by the third guide rail 54. After passing through the curved plate 51, the second guide rail 53 replaces the curved plate 51 to support the bottom of the copper sheet, the first guide rail 52 blocks and limits the 3D part of the copper sheet, and the third guide rail 54 supports the 3D part of the front end of the copper sheet, thereby limiting the copper sheet from moving from the second guide rail 53 in a fixed posture;

[0077] The copper sheet after passing through the first guide rail 52, the second guide rail 53, and the third slide rail 54 enters the transmission module 62. The transmission module 62 is a prior art, which can refer to a conveyor belt. The transmission module 62 continues to transport the copper sheet entering the inside thereof.

[0078] After the transmission mechanism 6 sends the copper sheet to the end of the first slide rail 63, the motor assembly 72 is turned on, the control wheel 73 rotates, and the wheel 73 drives the adjacent wheel 73 to rotate through the belt. During the rotation of the wheel 73, the two first connecting rods 75 are driven to rotate synchronously. The first connecting rod 75 drives the negative pressure air nozzle 77 to move downward and close to the copper sheet through the second connecting rod 76, and at the same time, the negative pressure air nozzle 77 moves along the trajectory of the first connecting rod 75. Under the action of the negative pressure air nozzle 77, the copper sheet at the end of the first slide rail 63 enters the copper sheet placement tray 14 area, and the first connecting rod 75 rotates twice each time (taking and discharging materials), and the motor module 12 drives the copper sheet placement tray 14 to move accurately once through the sliding seat 13, ensuring that the copper sheet can be directly placed in the copper sheet placement tray 14, thereby completing the loading.

[0079] Finally, it should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other. For the system or device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0080] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A bonding copper sheet feeding device for semiconductor power device packaging, comprising a conveyor belt body (1) and a vibration plate body (11), wherein a motor module (12) is mounted on the conveyor belt body (1), wherein the motor module (12) has two groups, and the two groups of the motor modules (12) are stacked, wherein a sliding seat (13) is mounted on the upper end of the motor module (12), and a copper sheet placement plate (14) is mounted on the sliding seat (13), wherein the characteristics are: Also includes: A conical spiral piece (15), the conical spiral piece (15) being installed in the vibration plate body (11), the conical spiral piece (15) being inclined, and the vibration plate body (11) driving the copper piece to be lifted along the edge of the conical spiral piece (15) through rotation and vibration; A screening mechanism (2), the screening mechanism (2) being mounted on the conical spiral sheet (15) and connected to the vibration plate body (11), the screening mechanism (2) removing the copper sheets that are turned upside down during the lifting process, causing the turned upside down copper sheets to fall onto the vibration plate body (11) for re-screening; Support rods (4), there are a plurality of support rods (4), all of which are mounted on the vibration plate body (11), and a support cover (41) is mounted on the other end of the support rod (4); An adjustment mechanism (5), the adjustment mechanism (5) being mounted on the support cover (41) and connected to the vibration plate body (11), the adjustment mechanism (5) guiding the placement of the copper sheets filtered by the screening mechanism (2) and adjusting the copper sheets that have passed through the adjustment mechanism (5) to a fixed posture; A transmission mechanism (6), the transmission mechanism (6) being installed between the vibration plate body (11) and the conveyor belt body (1), and being connected to the adjustment mechanism (5), the transmission mechanism (6) conveying the copper sheet passing through the adjustment mechanism (5) to one side of the conveyor belt body (1); A feeding mechanism (7), the feeding mechanism (7) being installed above the conveyor belt body (1) and connected to the transmission mechanism (6), the feeding mechanism (7) placing the copper sheet at the end of the transmission mechanism (6) in the copper sheet placement tray (14); The screening mechanism (2) comprises a conical spiral groove (21) provided at the front end of the conical spiral piece (15), the conical spiral groove (21) reduces the transport track diameter of the front end of the conical spiral piece (15), a square hole (22) is provided at the front end of the conical spiral piece (15), the width of the square hole (22) is less than the width of the copper sheet and greater than the length of the front end bending portion of the copper sheet, the length of the square hole (22) is greater than the width of the copper sheet, a square hole (23) is provided at the front end of the conical spiral piece (15), the square hole (23) and the square hole (22) are of the same shape and are arranged perpendicular to each other, laser sensors (24) are arranged on the long sides of the square hole (22) and the square hole (23), and a pneumatic mechanism (3) is also provided on the conical spiral piece (15).

2. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 1, characterized in that: The pneumatic mechanism (3) comprises a square hole three (31) formed on the conical spiral sheet (15), the square hole three (31) being located on one side of the square hole two (23), and the square hole one (22), the square hole two (23), and the square hole three (31) being arranged in a straight line. An air guide cover (32) is mounted on the vibration plate body (11), and the air guide cover (32) is conductively connected to the square hole three (31). A micro air pump (33) is mounted on the vibration plate body (11), and an air pipe (34) is mounted on the micro air pump (33), and the air pipe (34) is conductively connected to the air guide cover (32).

3. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 2, characterized in that: The adjustment mechanism (5) comprises an arc-shaped plate (51) fixed to the top end of the conical spiral sheet (15), the arc-shaped plate (51) being arranged in an inclined manner, a first guide rail (52) being installed through the support cover (41), the distance between the first guide rail (52) and the arc-shaped plate (51) being greater than the thickness of the rear part of the copper sheet and less than the height of the entire copper sheet, a second guide rail (53) being installed through the support cover (41), one end of the second guide rail (53) being fixed to one side of the arc-shaped plate (51), the second guide rail (53) supporting the bottom of the copper sheet, the The second guide rail (53) is located higher than the first guide rail (52), and the height difference between the second guide rail (53) and the first guide rail (52) is greater than the thickness of the rear portion of the copper sheet; the first guide rail (52) and the second guide rail (53) are both in sheet shape; a third guide rail (54) is installed through the support cover (41); the third guide rail (54) is located higher than the second guide rail (53); the distance between the third guide rail (54) and the first guide rail (52) gradually decreases from front to back; and the third guide rail (54) limits the position of a 3D portion of the front end of the copper sheet.

4. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 1, characterized in that: The transmission mechanism (6) comprises a support frame (61) arranged on one side of the vibration plate body (11), a transmission module (62) being mounted on the support frame (61), a first slide rail (63) being arranged on the transmission module (62), and a width of the first slide rail (63) being greater than a length of the copper sheet.

5. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 4, characterized in that: The feeding mechanism (7) comprises a gantry (71) arranged above the conveyor belt body (1), a motor assembly (72) being mounted on the gantry (71), a rotating wheel (73) being mounted on the motor assembly (72) in a relative manner, a belt being mounted between the rotating wheels (73), a first rotating shaft (74) being penetrated and mounted on each of the rotating wheels (73), a first connecting rod (75) being sleeved on each of the first rotating shafts (74), the two first connecting rods (75) being arranged in a front-to-back staggered manner, a second connecting rod (76) being fixed to one end of the first connecting rod (75), a negative pressure air nozzle (77) being penetrated and mounted on the second connecting rod (76), and the negative pressure air nozzle (77) being located above the end of the first slide rail (63).

6. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 5, characterized in that: The motor module (12), the conveyor belt body (1), the vibration plate body (11), the electric control valve (92), the micro air pump (33), the laser sensor (24), the transmission module (62), and the motor assembly (72) are all electrically connected to each other and are all connected to an internal system.

7. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 6, characterized in that: A guide cover (80) is installed on the vibration plate body (11); the guide cover (80) is located below the arc-shaped plate (51) and is arranged obliquely; a feed hole (81) is opened on the vibration plate body (11); the feed hole (81) is located at the end of the guide cover (80).

8. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 2, characterized in that: An arc-shaped spiral plate (91) is installed inside the conical spiral piece (15), the arc-shaped spiral plate (91) is located on one side of the square hole 2 (23), and the angle between the arc-shaped spiral plate (91) and the connected conical spiral piece (15) is an obtuse angle. An electric control valve (92) is installed through the air pipe (34), the electric control valve (92) is electrically connected to the laser sensor (24), a conduit (93) is connected to the air pipe (34), the conduit (93) is located between the micro air pump (33) and the electric control valve (92), an acceleration roller (94) is installed through the conical spiral piece (15), the acceleration roller (94) is used to accelerate the copper sheet passing through the square hole 1 (22) and the square hole 2 (23), a turbine (95) is sleeved on the acceleration roller (94), and the outlet end of the conduit (93) corresponds to the position of the upper part of the turbine (95).

9. The bonding copper sheet feeding device for semiconductor power device packaging according to claim 8, characterized in that: In the conical spiral sheet (15), the portion after the conical spiral groove (21) can be divided into two sections, namely section X and section Y, wherein section X starts from the head end of the conical spiral groove (21) and ends at one side of the second square hole (23), and the spiral slope of this section is large, and section Y starts from the other side of the second square hole (23) and ends at the end of the conical spiral sheet (15), and the spiral slope of this section is small.

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