Polishing slurry treatment composition and polishing slurry treatment method

Abstract

The present application relates to a polishing waste liquid treatment composition and a polishing waste liquid treatment method, the polishing waste liquid treatment composition comprising: a first treatment liquid, the first treatment liquid comprising oxalic acid, an inorganic strong acid and water, wherein the pH of the first treatment liquid is 1-1.5; a second treatment liquid, the second treatment liquid comprising 13-LF, an inorganic strong base and water, wherein the pH of the second treatment liquid is 12-13. The advantages are that low-cost chemicals are used, the cost can be greatly reduced; non-toxic and harmless chemicals are used to replace toxic chemicals, preventing accidental injury when operating; the solution configuration can be completed without complex operation; only the treatment liquid needs to be poured into the waste polishing liquid and stirred and placed, without complex operation, which is simple and convenient.

Description

Technical Field

[0001] This invention relates to the field of polishing technology, and more particularly to a polishing waste liquid treatment composition and method. Background Technology

[0002] In wafer manufacturing, wafer grinding is a crucial step. This process typically involves using a grinding machine and polishing slurry to grind and polish the wafer. The grinding and polishing process generates waste liquid, which generally contains chemicals such as potassium permanganate and aluminum oxide. To meet emission standards, this waste liquid usually requires treatment to remove harmful substances.

[0003] Common treatment methods include precipitation and oxidation-reduction (ORR) methods. Precipitation relies on gravity to allow substances in the waste liquid to settle naturally. While inexpensive, precipitation is time-consuming, cannot remove other harmful substances, and often fails to achieve the required pH level. Oxidation-reduction (ORR) methods can remove harmful substances quickly and effectively adjust the pH of the waste liquid. While efficient, OCR is costly, toxic, and can cause harm to workers.

[0004] Currently, no effective solutions have been proposed for the problems of insufficient time and low cost, toxicity and harmfulness in related technologies. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a polishing waste liquid treatment composition and method, thereby solving problems such as the inability to meet the requirements of short time and low cost, and the presence of toxicity and harmful substances in related technologies.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] In a first aspect, the present invention provides a polishing waste liquid treatment composition for treating waste polishing liquid containing KMnO4 and Al2O3, comprising:

[0008] The first treatment solution comprises oxalic acid, an inorganic strong acid, and water, wherein the pH of the first treatment solution is 1 to 1.5.

[0009] The second treatment solution comprises 13-LF, an inorganic strong base, and water, wherein the pH of the second treatment solution is 12-13.

[0010] In some of these embodiments, the inorganic strong acid includes hydrochloric acid, sulfuric acid, and nitric acid.

[0011] In some of these embodiments, the inorganic strong base includes sodium hydroxide and potassium hydroxide.

[0012] In some of these embodiments, the mass concentration of the oxalic acid in the first treatment solution is equal to the mass concentration of the inorganic strong acid.

[0013] In some of these embodiments, the volume of the oxalic acid in the first treatment solution is equal to the volume of the inorganic strong acid.

[0014] In some of these embodiments, the volume ratio of the oxalic acid, the inorganic strong acid, and the water is 1:1:3-4.

[0015] In some of these embodiments, the volume of the 13-LF in the second treatment solution is equal to the volume of the inorganic strong base.

[0016] In some of these embodiments, the volume ratio of the 13-LF, the inorganic strong base, and the water is 1:1:3-5.

[0017] Secondly, the present invention provides a method for treating waste polishing liquid, for treating waste polishing liquid containing KMnO4 and Al2O3, comprising:

[0018] The first treatment liquid of the polishing waste liquid treatment composition as described in the first aspect is added to the waste polishing liquid at a first preset volume ratio and left to stand for a first preset time to reduce the high-valence manganese ions in the waste polishing liquid.

[0019] The second treatment liquid of the polishing waste liquid treatment composition as described in the first aspect is added to the waste polishing liquid at a second preset volume ratio, and left to stand for a second preset time to obtain clarified waste liquid and precipitate.

[0020] In some of these embodiments, the first preset volume ratio is 1:100-150.

[0021] In some of these embodiments, the first preset time is 15 min to 45 min.

[0022] In some of these embodiments, the second preset volume ratio is 1:200-300.

[0023] In some of these embodiments, the second preset time is 45 min to 75 min.

[0024] In some of these embodiments, it also includes:

[0025] Stir after adding the first treatment fluid to the waste polishing fluid.

[0026] In some of these embodiments, it also includes:

[0027] Stir after adding the second treatment fluid to the waste polishing fluid.

[0028] In some of these embodiments, the following are included:

[0029] Add the first treatment solution to the waste polishing solution at a volume ratio of 1:100, stir, and let stand for 30 minutes;

[0030] Add the second treatment solution to the waste polishing solution at a volume ratio of 1:200, stir, and let stand for 1 hour.

[0031] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0032] The present invention discloses a polishing waste liquid treatment composition and method, which uses low-cost chemicals, thus significantly reducing costs; it uses non-toxic and harmless chemicals to replace toxic chemicals, preventing accidental injury to workers during operation; the solution preparation can be completed without complicated operations; it is simple and convenient to simply pour the treatment liquid into the waste polishing liquid, stir and let it stand. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the final treatment result of the waste polishing fluid according to Embodiment 3 of the present invention;

[0034] Figure 2 This is a schematic diagram of the final treatment result of the waste polishing fluid according to Embodiment 4 of the present invention;

[0035] Figure 3 This is a schematic diagram of the treatment result after the discharge of the supernatant from the waste polishing liquid according to Embodiment 4 of the present invention;

[0036] Figures 4-5 This is a schematic diagram of the reaction result of waste polishing liquid and first treatment liquid according to Embodiment 5 of the present invention;

[0037] Figure 6 This is a schematic diagram of the final treatment result of the waste polishing fluid according to Embodiment 5 of the present invention. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0040] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0041] Example 1

[0042] This embodiment relates to the polishing waste liquid treatment composition of the present invention.

[0043] An illustrative embodiment of the present invention provides a polishing waste liquid treatment composition for treating waste polishing liquid containing KMnO4 and Al2O3, comprising a first treatment liquid and a second treatment liquid. The first treatment liquid comprises oxalic acid, an inorganic strong acid, and water; the second treatment liquid comprises 13-LF, an inorganic strong base, and water. The pH of the first treatment liquid is 1-1.5; the pH of the second treatment liquid is 12-13.

[0044] In this invention, the waste polishing slurry containing KMnO4 and Al2O3 is the waste polishing slurry generated from a chemical mechanical polishing process (e.g., polishing wafers).

[0045] In some of these embodiments, the inorganic strong acid includes hydrochloric acid, sulfuric acid, and nitric acid.

[0046] In some of these embodiments, oxalic acid can be replaced with citric acid.

[0047] In some of these embodiments, the mass concentration of oxalic acid in the first treatment solution is equal to the mass concentration of the inorganic strong acid.

[0048] Preferably, in the first treatment solution, the mass concentration of oxalic acid and the mass concentration of the inorganic strong acid are both 20%.

[0049] In some of these embodiments, the volume of oxalic acid in the first treatment solution is equal to the volume of the inorganic strong acid.

[0050] In some of these embodiments, the volume ratio of oxalic acid, inorganic strong acid, and water is 1:1:3-4.

[0051] Preferably, the volume ratio of oxalic acid, inorganic strong acid, and water is 1:1:3.

[0052] The 13-LF solution comprises 5% tetrapotassium pyrophosphate, 5% tridecyl alcohol ethoxylate, 1% potassium hydroxide, and 89% water. Tetrapotassium pyrophosphate acts as a reducing agent, inhibiting the oxidation of manganese ions to higher valence states and simultaneously adjusting the pH of the solution.

[0053] In some of these embodiments, the inorganic strong base includes sodium hydroxide and potassium hydroxide.

[0054] In some of these embodiments, if the inorganic strong base is a sodium hydroxide solution or a potassium hydroxide solution, the mass concentration of the sodium hydroxide solution or the potassium hydroxide solution is 15% to 25%.

[0055] In some of these embodiments, the volume of 13-LF in the second treatment solution is equal to the volume of the inorganic strong base.

[0056] In some of these embodiments, the volume ratio of 13-LF, inorganic strong base, and water is 1:1:3-5.

[0057] Preferably, the volume ratio of 13-LF, inorganic strong base, and water is 1:1:3.

[0058] In some of these embodiments, the volume ratio of the second treatment liquid to the first treatment liquid is 2-3:1.

[0059] Preferably, the volume ratio of the second treatment liquid to the first treatment liquid is 2:1.

[0060] The technical effects of this invention are as follows:

[0061] 1) Low cost: Using low-cost chemicals can significantly reduce costs;

[0062] 2) Non-toxic and harmless: Non-toxic and harmless chemicals are used to replace toxic chemicals to prevent accidental injury to staff during operation;

[0063] 3) Simple operation: The solution can be prepared without complicated operations.

[0064] Example 2

[0065] This embodiment relates to the polishing waste liquid treatment method of the present invention.

[0066] An illustrative embodiment of the present invention provides a method for treating waste polishing liquid containing KMnO4 and Al2O3, comprising:

[0067] Step S102: Add the first treatment liquid of the polishing waste liquid treatment composition as described in Example 1 to the waste polishing liquid at a first preset volume ratio, and let it stand for a first preset time to reduce the high-valence manganese ions in the waste polishing liquid.

[0068] Step S104: Add the second treatment liquid of the polishing waste liquid treatment composition as described in Example 1 to the waste polishing liquid at a second preset volume ratio, and let it stand for a second preset time to obtain clarified waste liquid and precipitate.

[0069] In step S102, the first preset volume ratio is the volume ratio of the first treatment liquid to the waste polishing liquid.

[0070] In step S102, the first preset volume ratio is 1:100-150.

[0071] Preferably, the first preset volume ratio is 1:100.

[0072] In step S102, the first preset time is 15min-45min.

[0073] Preferably, the first preset time is 30 minutes.

[0074] Furthermore, step S102 also includes:

[0075] Stir after adding the first treatment fluid to the waste polishing fluid.

[0076] In some of these embodiments, the reaction temperature in step S102 is room temperature.

[0077] In step S104, the second preset volume ratio is the volume ratio of the second processing liquid to the waste polishing liquid.

[0078] In step S104, the second preset volume ratio is 1:200-300.

[0079] Preferably, the second preset volume ratio is 1:200.

[0080] In step S104, the second preset time is 45 min to 75 min.

[0081] Preferably, the second preset time is 1 hour.

[0082] Furthermore, step S104 also includes:

[0083] Stir after adding the second treatment fluid to the waste polishing fluid.

[0084] In some of these embodiments, the reaction temperature in step S104 is room temperature.

[0085] The technical effects of this invention are as follows:

[0086] 1) Low cost: Using low-cost chemicals can significantly reduce costs;

[0087] 2) Non-toxic and harmless: Non-toxic and harmless chemicals are used to replace toxic chemicals to prevent accidental injury to staff during operation;

[0088] 3) Simple operation: Simply pour the treatment liquid into the waste polishing liquid, stir and let it stand. There are no complicated operations, making it simple and convenient.

[0089] Example 3

[0090] This embodiment is a specific implementation of the present invention.

[0091] In this embodiment, the first treatment solution is oxalic acid, hydrochloric acid and water in a volume ratio of 1:1:3, the mass concentration of oxalic acid is 20%, the mass concentration of hydrochloric acid is 20%, the pH of the first treatment solution is 1~1.5, and the volume ratio of the first treatment solution to the waste polishing solution is 1:100.

[0092] In this embodiment, the second treatment solution is 13-LF, potassium hydroxide and water in a volume ratio of 1:1:3, the pH of the second treatment solution is 12~13, and the volume ratio of the second treatment solution to the waste polishing solution is 1:200.

[0093] The processing method in this embodiment is as follows:

[0094] Pour the first treatment solution into the waste polishing solution containing KMnO4 and Al2O3, stir, and let stand for 30 minutes to allow oxalic acid to fully react with KMnO4 (the products are generally manganese chloride, potassium chloride, and carbon dioxide).

[0095] Pour the second treatment solution into the waste polishing solution, stir, and let stand for 1 hour to allow Al ions to precipitate.

[0096] The final processing result is as follows Figure 1 As shown, the precipitates (aluminum hydroxide and manganese dioxide) are deposited at the bottom of the container, and the supernatant is a clear liquid that meets the emission standards.

[0097] Example 4

[0098] This embodiment is a specific implementation of the present invention.

[0099] In this embodiment, the first treatment solution is oxalic acid, hydrochloric acid and water in a volume ratio of 1:1:3, the mass concentration of oxalic acid is 20%, the mass concentration of hydrochloric acid is 20%, the pH of the first treatment solution is 1~1.5, and the volume ratio of the first treatment solution to the waste polishing solution is 1:100.

[0100] In this embodiment, the second treatment solution is 13-LF, potassium hydroxide and water in a volume ratio of 1:1:3, the pH of the second treatment solution is 12~13, and the volume ratio of the second treatment solution to the waste polishing solution is 1:200.

[0101] The processing method in this embodiment is as follows:

[0102] Pour the first treatment solution into the waste polishing solution containing KMnO4 and Al2O3, stir, and let stand for 30 minutes to allow oxalic acid to fully react with KMnO4 (the products are generally manganese chloride, potassium chloride, and carbon dioxide).

[0103] Pour the second treatment solution into the waste polishing solution, stir, and let stand for 1 hour to allow Al ions to precipitate.

[0104] The final processing result is as follows Figure 2 As shown, the precipitates (aluminum hydroxide and manganese dioxide) are deposited at the bottom of the container, and the supernatant is a clear liquid that meets the emission standards.

[0105] The treatment results after discharging the supernatant are as follows Figure 3 As shown, the precipitates (aluminum hydroxide and manganese dioxide) are deposited at the bottom of the container.

[0106] Example 5

[0107] This embodiment is a specific implementation of the present invention.

[0108] In this embodiment, the first treatment solution is oxalic acid, hydrochloric acid and water in a volume ratio of 1:1:3, the mass concentration of oxalic acid is 20%, the mass concentration of hydrochloric acid is 20%, the pH of the first treatment solution is 1~1.5, and the volume ratio of the first treatment solution to the waste polishing solution is 1:100.

[0109] In this embodiment, the second treatment solution is 13-LF, potassium hydroxide and water in a volume ratio of 1:1:3, the pH of the second treatment solution is 12~13, and the volume ratio of the second treatment solution to the waste polishing solution is 1:200.

[0110] The processing method in this embodiment is as follows:

[0111] Pour the first treatment solution into the waste polishing solution containing KMnO4 and Al2O3, stir, and let stand for 30 minutes to allow oxalic acid to fully react with KMnO4 (the products are generally manganese chloride, potassium chloride, and carbon dioxide); (during this process, the color of the waste polishing solution gradually changes from purple to clear and transparent, indicating that the high-valence manganese ions have been completely reduced, such as...) Figure 4 , Figure 5 (As shown)

[0112] Pour the second treatment solution into the waste polishing solution, stir, and let stand for 1 hour to allow Al ions to precipitate. (When the pH of the waste polishing solution is weakly acidic (e.g., pH=4-5), Al ions precipitate; when the pH of the waste polishing solution is alkaline (e.g., pH=8.1-10.4), manganese hydroxide precipitates.)

[0113] The final processing result is as follows Figure 6 As shown, the precipitates (aluminum hydroxide and manganese dioxide) are deposited at the bottom of the container, and the supernatant is a clear liquid that meets the emission standards.

[0114] The above description is merely a preferred embodiment of the present invention and does not limit the implementation and protection scope of the present invention. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A polishing waste liquid treatment composition for treating a waste polishing liquid containing KMnO4 and Al2O3, characterized by, Comprising: ​ A first treatment liquid, the first treatment liquid comprising oxalic acid, inorganic strong acid and water; wherein the pH of the first treatment liquid is 1-1.5; the mass concentration of the oxalic acid is equal to the mass concentration of the inorganic strong acid; in the first treatment liquid, the volume ratio of the oxalic acid, the inorganic strong acid, the water is 1:1:3-4; A second treatment liquid, the second treatment liquid comprising 13-LF, inorganic strong base and water; wherein the pH of the second treatment liquid is 12-13; 13-LF comprises 5% tetrapotassium pyrophosphate, 5% tridecyl alcohol ethoxylate, 1% potassium hydroxide, 89% water; in the second treatment liquid, the volume ratio of the 13-LF, the inorganic strong base, the water is 1:1:3-5.

2. The spent polishing solution treatment composition of claim 1, wherein, The inorganic strong acid is hydrochloric acid, sulfuric acid, nitric acid.

3. The spent polishing solution treatment composition of claim 1, wherein, The inorganic strong base is sodium hydroxide, potassium hydroxide.

4. A polishing waste liquid treatment method for treating a waste polishing liquid containing KMnO4 and Al2O3, characterized by, Comprising: Adding the first treatment liquid of the polishing waste liquid treatment composition as claimed in any one of claims 1-3 to the waste polishing liquid according to a first preset volume ratio, standing for a first preset time, for reducing the high-valent manganese ions of the waste polishing liquid, wherein the first preset volume ratio is 1:100-150; Adding the second treatment liquid of the polishing waste liquid treatment composition as claimed in any one of claims 1-3 to the waste polishing liquid according to a second preset volume ratio, standing for a second preset time, for obtaining clear waste liquid and precipitate, wherein the second preset volume ratio is 1:200-300.

5. The polishing slurry treatment method according to Claim 4, wherein The first preset time is 15min-45min.

6. The polishing slurry treatment method according to Claim 4, wherein The second preset time is 45min-75min.

7. The polishing slurry treatment method according to Claim 4, wherein Further comprising: Stirring after adding the first treatment liquid to the waste polishing liquid; And / or Stirring after adding the second treatment liquid to the waste polishing liquid.

8. The polishing slurry treatment method according to any one of claims 4 to 7, wherein Comprising: Adding the first treatment liquid to the waste polishing liquid according to a volume ratio of 1:100, stirring, standing for 30min; Adding the second treatment liquid to the waste polishing liquid according to a volume ratio of 1:200, stirring, standing for 1h.

Images