A heat sink and its preparation mold and method

Through the partition design and the application of micron-level capillary groove structure in the heat-smooth plate, the problems of large thickness and low heat dissipation efficiency of the heat-smooth plate are solved, and thinner and efficient heat dissipation are achieved, and manufacturing costs are reduced.

CN119043056BActive Publication Date: 2025-08-19ZHUHAI DEBIAO PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202411020135.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-29
Publication Date
2025-08-19
Estimated Expiration
2044-07-29

AI Technical Summary

Technical Problem

The existing heat-smooth plate has a large structural thickness, which limits its ultra-thin application and development and cannot meet the heat dissipation needs of high-performance electronic products.

Method used

The heat-smoothing plate adopts a partitioned design, including an upper shell plate, a lower shell plate, a support frame, a first liquid absorbent core and a second liquid absorbent core. By setting up liquid absorbent cores of different structures in the evaporation area and the condensation area, combined with a micron-scale capillary groove structure, an efficient circulating working fluid return path is formed, thereby achieving thinning and improving heat dissipation effect.

Benefits of technology

The thickness of the heat-smoothing plate is reduced, while improving the heat dissipation efficiency, reducing manufacturing costs and simplifying the preparation process to adapt to the heat dissipation needs of high-performance electronic products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a heat spreader, comprising an upper shell, a lower shell, a support frame, a first liquid wick, and a second liquid wick; the lower shell is arranged opposite to the upper shell, and the edges of the lower shell and the upper shell are connected at the side by the support frame and enclosed to form a cavity, the cavity comprising an evaporation zone and a condensation zone arranged in sequence along the extension direction of the heat spreader; a plurality of longitudinally extending first liquid wicks are arranged at intervals on the inner surface of the lower shell on the evaporation zone side; a second liquid wick is arranged on the inner surface of the lower shell on the condensation zone side; the second liquid wick comprises a plurality of mutually parallel first protrusions forming a first groove. The heat spreader of the present invention divides the cavity of the circulating medium into an evaporation zone and a condensation zone, thereby increasing the temperature difference between the evaporation zone and the condensation zone; liquid wicks of different structures are arranged according to the functions of the zones, forming a highly efficient circulating medium reflux path, thereby improving the heat dissipation effect and achieving a thinner thickness.
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Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices, and in particular to a heat spreader and a mold and method for preparing the same. Background Art

[0002] With the rapid development of new energy vehicles, aerospace, 5G communications and other fields, products and equipment are constantly developing towards high performance, high integration and miniaturization, resulting in a sharp increase in unit heat flux density. The inability to discharge the heat inside the product in a timely manner seriously affects the product performance and lifespan, and in severe cases will even lead to direct burning. Therefore, how to reduce the internal heat flux density of electronic products is particularly important. Heat pipes are widely used as gas-liquid phase change elements in the thermal management of high-power electronic components. However, due to the limitations of heat transfer space and contact area, heat pipes can only achieve one-dimensional heat conduction. The heat spreader converts the heat pipe from one-dimensional heat transfer to two-dimensional heat transfer, solving the problem of heat transfer space and contact area limitations.

[0003] However, as electronic products continue to evolve toward higher performance, functional integration, and miniaturization (small, light, and thin), heat flux density is increasing, and the demand for heat dissipation continues to grow. To improve the heat dissipation of electronic devices, the capillary wicks in current vapor chambers are primarily composed of sintered powder, copper mesh, or a composite of the two. Since vapor chambers require not only upper and lower cover plates, but also an additional capillary wick layer and an intermediate cavity layer, the overall structure is relatively thick, hindering the thinning of vapor chambers and limiting the application and development of wicks in ultra-thin vapor chambers. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to overcome the defects or shortcomings of the prior art and provide a heat spreader and a mold and method for preparing the same.

[0005] The present invention provides a heat spreader, characterized in that it includes an upper shell plate, a lower shell plate, a support frame, a first liquid absorbent core and a second liquid absorbent core; the lower shell plate is arranged opposite to the upper shell plate, and the edges of the lower shell plate and the upper shell plate are connected at the side by the support frame and enclosed to form a cavity, and a circulating working medium is stored in the cavity; the cavity includes an evaporation area and a condensation area arranged in sequence along the extension direction of the heat spreader; a plurality of longitudinally extending first liquid absorbent cores are arranged at intervals on the inner surface of the lower shell plate on the evaporation area side; the second liquid absorbent core is arranged on the inner surface of the lower shell plate on the condensation area side; the second liquid absorbent core includes a plurality of mutually parallel first protrusions, the first protrusions extending from one end of the condensation area away from the evaporation area to the end close to the evaporation area, and first grooves are formed between adjacent first protrusions and between the support frame and the adjacent first protrusions.

[0006] Compared with the prior art, the heat spreader of the present invention divides the cavity containing the circulating working fluid into an evaporation zone and a condensation zone, thereby expanding the temperature difference between the evaporation zone and the condensation zone; and configures a first liquid absorption core and a second liquid absorption core with different structures according to the functions of different zones: configuring the first liquid absorption core in the evaporation zone improves the heat transfer and mass transfer effect from bottom to top in the evaporation zone, and setting the second liquid absorption core in the condensation zone to bring the condensed circulating working fluid back to the evaporation zone, forming a circulating working fluid reflux path, which can improve the overall heat dissipation effect while achieving a thinning of the heat spreader thickness.

[0007] Furthermore, a groove is provided on the outer side wall of the first liquid absorbent core to increase the specific surface area of the first liquid absorbent core and improve the heat and mass transfer effect.

[0008] Furthermore, the first groove is a micron-scale capillary groove, which can use capillary force to quickly absorb the liquid circulating medium after condensation and heat release in the condensation area into the first groove of the second liquid absorbent core, thereby accelerating the reflux of the circulating medium.

[0009] Furthermore, the second wick includes a plurality of mutually parallel second protrusions, which are disposed within the first groove. The second protrusions extend from an end of the condensation zone away from the evaporation zone to an end closer to the evaporation zone. Second grooves are formed between adjacent second protrusions and between second protrusions and adjacent first protrusions. The depth of the second grooves is less than that of the first grooves. The provision of the first grooves ensures a certain depth-to-width ratio, allowing for rapid longitudinal recirculation of the circulating medium. The provision of the second grooves within the first grooves allows for a larger condensation zone, reducing vapor resistance in the condensation zone.

[0010] Furthermore, the first and second liquid absorbent cores are formed by sintering powder, and their microscopic outer surfaces are porous structures, which enhance the surface hydrophilicity while further increasing the specific surface area and improving the heat and mass transfer effects.

[0011] The present invention also provides a mold for preparing a heat spreader, which is formed by stacking several sheet mold units; a single sheet mold unit includes a functional part located at the top, and the functional part includes a first liquid absorbent core functional unit and a second liquid absorbent core functional unit arranged in sequence along the extension direction; after several sheet mold units are stacked and fixed, several first liquid absorbent core functional units form several first liquid absorbent core reverse structures, and several second liquid absorbent core functional units form a second liquid absorbent core reverse structure; the first liquid absorbent core reverse structure is a groove structure that is opposite in shape to and compatible with the first liquid absorbent core, and the second liquid absorbent core reverse structure is a groove structure that is opposite in shape to and compatible with the second liquid absorbent core.

[0012] Furthermore, a single sheet mold unit also includes a supporting portion connected to the bottom of the functional portion, and the supporting portion is provided with a connecting hole; after several sheet mold units are stacked and fixed, several connecting holes form connecting through holes for fixedly connecting several sheet mold units.

[0013] Compared to existing technologies, the vapor chamber mold of the present invention features a complex, high-precision mold constructed from simple, low-precision shapes. The sheet-like mold units can be reused and stacked into different shapes, resulting in different wick structures. The mold structure of the present invention is simple, avoiding the problem of a single mold only achieving a single result, and thus reducing manufacturing costs. Furthermore, if a mold location is damaged, only the corresponding sheet-like mold unit needs to be replaced, without having to scrap the entire mold, resulting in low maintenance costs.

[0014] The present invention also provides a method for preparing a vapor chamber, comprising the following steps:

[0015] S1. Designing a mold using software to obtain a mold model;

[0016] S2. Slice the mold model in step S1 using software to obtain a plurality of sheet-shaped mold unit models;

[0017] S3, laser cutting each of the sheet mold units according to the plurality of sheet mold unit models in step S2, and stacking and fixing the sheet mold units in sequence to obtain the mold matching the mold model;

[0018] S4, sintering the lower shell plate and the mold described in step 3 with high-temperature powder, and after demolding, obtaining the lower shell plate with the first and second liquid absorbent wicks sintered thereon;

[0019] S5, sealing and fixing the support frame, the upper shell plate, and the lower shell plate described in step S4 to obtain a heat spreader;

[0020] S6. Perform liquid injection and degassing treatment on the heat spreader.

[0021] Compared with the existing technology, the heat spreader preparation method of the present invention converts the preparation of micron-level, complex-structured, and large-aspect-ratio three-dimensional liquid-absorbing cores into simple-shaped two-dimensional thin slice cutting and stacking and conventional high-temperature powder sintering based on the integration concept, reducing the difficulty of preparing micron-level liquid-absorbing cores and the dependence on expensive manufacturing equipment; realizes the integrated sintering of liquid-absorbing cores with different structures, and simplifies the heat spreader preparation process; the thin slices can be reused and stacked into different shapes, reducing the manufacturing cost of the heat spreader.

[0022] Furthermore, the slicing in step S2 is specifically performed along the extension direction of the mold model.

[0023] Furthermore, the precision of the slicing in step S2 and the laser cutting in step S3 is micron-level, and the micron-level precision can ensure that the prepared wick has good heat and mass transfer performance.

[0024] For better understanding and implementation, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is the main view of the heat sink structure.

[0026] Figure 2 Schematic diagram of the internal structure of the heat sink.

[0027] Figure 3 It is a three-dimensional diagram of the first liquid-absorbing core.

[0028] Figure 4 Schematic diagram of the cross section of the second absorbent core.

[0029] Figure 5 This is a three-dimensional diagram of the mold.

[0030] Figure 6 Schematic diagram of the sheet mold unit structure.

[0031] Figure 7 It is a schematic diagram of the Y-axis cross-section of the reverse structure of the second liquid-absorbing core.

[0032] Figure markings: 1-heat sink, 11-upper shell plate, 12-lower shell plate, 13-support frame, 14-first liquid absorbent core, 141-groove, 15-second liquid absorbent core, 151-first protrusion, 152-first groove, 153-second protrusion, 154-second groove, 16-cavity, 161 evaporation area, 162-condensation area, 2-mold, 21-first liquid absorbent core anti-structure, 22-second liquid absorbent core anti-structure, 23-connecting through hole, 3-sheet mold unit, 31-functional part, 311-first liquid absorbent core functional unit, 312-second liquid absorbent core functional unit, 32-support part, 321-connecting hole. DETAILED DESCRIPTION

[0033] The solution of the present invention is described in detail below with reference to the accompanying drawings.

[0034] Example 1

[0035] like Figure 1-4As shown, the heat spreader 1 of the present invention includes an upper shell plate 11, a lower shell plate 12, a support frame 13, a first liquid absorbent core 14 and a second liquid absorbent core 15; the lower shell plate 12 is arranged opposite to the upper shell plate 11, and the edges of the lower shell plate 12 and the upper shell plate 11 are sealed and connected at the side through the support frame 13; the materials used for the upper shell plate 11, the lower shell plate 12, the support frame 13, the first liquid absorbent core 14 and the second liquid absorbent core 15 include but are not limited to copper, aluminum, stainless steel, ceramic, and silicon.

[0036] The gaps between the upper shell plate 11 and the lower shell plate 12 are interconnected to form a cavity 16, in which a circulating working medium is sealed; the cavity 16 maintains a vacuum negative pressure state; the circulating working medium includes but is not limited to deionized water, ethanol, and acetone.

[0037] The cavity 16 includes an evaporation zone 161 and a condensation zone 162 sequentially arranged along the extension direction of the heat spreader 1 ; the circulating working medium absorbs heat and vaporizes in the evaporation zone 161 and releases heat and liquefies in the condensation zone 162 , thereby achieving a heat dissipation effect on the heat source.

[0038] A plurality of longitudinally extending first liquid absorption cores 14 are spaced apart on the inner surface of the lower shell plate 12 on the side of the evaporation area 161 .

[0039] In this embodiment, the upper and lower end surfaces of the first liquid absorbent core 14 are sealed with the inner surfaces of the upper shell plate 11 and the lower shell plate 12 respectively; the first liquid absorbent core 14 not only enhances the longitudinal heat and mass transfer performance, but also serves as a supporting structure to increase the overall stiffness and strength of the heat spreader 1, so that it can withstand greater working pressure and temperature changes.

[0040] In this embodiment, the first liquid absorbent core 14 is provided with a groove 141 on its outer wall to increase the specific surface area of the first liquid absorbent core 14 and improve the heat and mass transfer effect.

[0041] In this embodiment, the first liquid-absorbing core 14 is a centrally symmetrical cylinder, and each outer wall of the cylinder is provided with a plurality of grooves 141. On each outer wall of the cylinder, the depth of the grooves 141 at both ends is greater than the depth of the middle groove 141, which is conducive to the transfer of the circulating medium in the middle groove 141.

[0042] The second liquid absorbent core 15 is provided on the inner surface of the lower shell plate 12 on the side of the condensation area 162, and the second liquid absorbent core 15 is sealedly connected to the inner surface of the lower shell plate 12; the second liquid absorbent core 15 includes a plurality of mutually parallel first protrusions 151, and the first protrusions 151 extend from one end of the condensation area 162 away from the evaporation area 161 to the end close to the evaporation area 161, and first grooves 152 are formed between adjacent first protrusions 151 and between the support frame 13 and the adjacent first protrusions 151.

[0043] In this embodiment, the first groove 152 is a micron-sized capillary groove, which can use capillary force to quickly absorb the liquid circulating medium after condensation and heat release in the condensation area 162 into the first groove 152 of the second liquid absorbent core 15, thereby accelerating the backflow of the circulating medium.

[0044] In this embodiment, the second wick 15 further includes a plurality of mutually parallel second protrusions 153 disposed within the first groove 152. The second protrusions 153 extend from the end of the condensation zone 162 away from the evaporation zone 161 to the end closer to the evaporation zone 161. Second grooves 154 are formed between adjacent second protrusions 153 and between a second protrusion 153 and an adjacent first protrusion 151. The depth of the second grooves 154 is less than that of the first grooves 153. The provision of the first grooves 152 ensures a certain depth-to-width ratio, allowing for rapid longitudinal recirculation of the circulating medium. The inclusion of the second grooves 154 within the first grooves 152 allows for a larger condensation zone 162, reducing the vapor resistance of the condensation zone 162.

[0045] In this embodiment, the first liquid absorbent core 14 and the second liquid absorbent core 15 are made of powder sintering, and the microscopic outer surface is a porous structure, which enhances the surface hydrophilicity while further increasing the specific surface area and improving the heat and mass transfer effect.

[0046] Example 2

[0047] like Figure 5-7 As shown, an embodiment of the present invention also provides a preparation mold 2 for the heat spreader 1, and the mold 2 is formed by stacking a number of sheet mold units 3. The upper surface shape of the sheet mold unit 3 is determined by the relative position of the sheet mold unit 3 in the mold 2. The sheet mold units 3 with different arrangements form the mold 2 with different shapes.

[0048] In this embodiment, the single sheet mold unit 3 includes a functional part 31 located at the top and a supporting part 32 connected to the bottom of the functional part; the functional part 31 includes a first liquid absorbent core functional unit 311 and a second liquid absorbent core functional unit 312 arranged in sequence along the extension direction; the supporting part 32 is provided with a connecting hole 321.

[0049] After several of the sheet mold units 3 are stacked and fixed, several of the first absorbent core functional units 311 form several first absorbent core reverse structures 21, and several of the second absorbent core functional units 312 form second absorbent core reverse structures 22; the first absorbent core reverse structure 21 is a groove structure that is opposite in shape to and compatible with the first absorbent core 14, and the second absorbent core reverse structure 22 is a groove structure that is opposite in shape to and compatible with the second absorbent core 15; the adaptation means that the size of the groove structure just accommodates the shape of the corresponding first absorbent core 14 and second absorbent core 15; several of the connecting holes 321 form connecting through holes 23 for fixedly connecting several of the sheet mold units 3.

[0050] Example 3

[0051] The embodiment of the present invention also provides a method for preparing a vapor chamber 1, comprising the following steps:

[0052] S1. Designing a mold using software to obtain a mold model;

[0053] S2. Based on the microstructure size of the wick, the mold 2 model in step S1 is sliced with micron-level precision using software in its extension direction to obtain the sheet mold unit 3 model;

[0054] S3. According to the sheet mold unit 3 model in step S2, the sheet mold unit 3 is cut out of thin iron sheet by laser with micron-level precision, the sheet mold units 3 are stacked in sequence to form the mold 2, and are fixed by the connecting through holes 23 and bolts.

[0055] S4. In step S3, powder is scraped on the upper surface of the mold 2, and the lower shell plate 12 is placed on the powder surface. After being fastened, it is placed in a high-temperature atmosphere furnace for sintering. After demoulding, the lower shell plate 12 with the first liquid absorbent core 14 and the second liquid absorbent core 15 sintered thereon is obtained.

[0056] S5. Apply solder between the support frame 13, the upper shell plate 11 and the lower shell plate 12 described in step S4, and seal them by low-temperature brazing.

[0057] S6. Use the perfusion system to inject a certain amount of circulating working fluid into the heat soaking plate, and prepare the heat soaking plate through primary degassing and secondary degassing.

[0058] S7. Shape the heat spreader to meet the shape requirements and perform surface treatment by cleaning and anti-oxidation treatment.

[0059] In this embodiment, the sheet mold unit 3 in step S3 may also be cut from sheets of other materials.

[0060] In this embodiment, the micron-level precision in step S3 can ensure that the prepared first absorbent core 14 and second absorbent core 15 have good heat and mass transfer performance.

[0061] In this embodiment, the operating temperature of the high-temperature atmosphere furnace in step S4 is determined according to the melting point of the powder and the material used for the lower shell plate 12, ensuring that the first liquid absorbent core 14, the second liquid absorbent core 15 and the lower shell plate 12 are fixed as a whole after demolding. At the same time, the porosity of the first liquid absorbent core 14 and the second liquid absorbent core 15 should also be considered to adjust the operating temperature.

[0062] In this embodiment, the low-temperature brazing in step S5 has a low heating temperature, has a small thermal impact on the vapor chamber 1 , and is unlikely to cause deformation of the vapor chamber 1 or changes in the material structure.

[0063] The working principle of the present invention is as follows: the heat source is arranged in the outer surface area of the lower shell plate 12 on the side of the evaporation area 161, so that the heat of the heat source is transferred to the lower shell plate 12 and the first liquid absorbent core 14 in turn. The liquid circulating medium in the evaporation area 161 is heated and turned into steam, causing the gas and liquid in the evaporation area 161 to rise, driving the circulating medium vapor to move to the condensation area 162 located above the second liquid absorbent core 15. The circulating medium vapor is cooled and releases heat in the condensation area 162 to turn back into liquid. Under the action of the capillary force of the second liquid absorbent core 15, it flows back to the evaporation area 161 along the groove. Since the first liquid absorbent core 14 has a porous structure and a hydrophilic surface, the liquid circulating medium quickly spreads on the inner surface of the evaporation area 161 and undergoes the next round of heated vaporization.

[0064] Compared with the prior art, the present invention has the following beneficial effects:

[0065] (1) The heat spreader 1 of the present invention divides the cavity 16 containing the circulating medium into an evaporation zone 161 and a condensation zone 162, thereby increasing the temperature difference between the evaporation zone 161 and the condensation zone 162; the first wick 14 and the second wick 15 are respectively configured according to the functions of the different zones: the configuration of the first wick 14 in the evaporation zone 161 can improve the heat and mass transfer effect from bottom to top in the evaporation zone 161; the configuration of the micron-sized second wick 15 in the condensation zone 162 can quickly return the condensed circulating medium to the evaporation zone 161 under the capillary force of the first groove 152 and the second groove 154, thereby forming a highly efficient circulating medium return path, which can improve the overall heat dissipation effect while reducing the thickness of the heat spreader 1.

[0066] (2) The heat spreader mold 2 of the present invention has a sheet-like mold unit 3 that can be reused and stacked into different shapes to form wicks with different structures, thereby avoiding the problem of one mold 2 only being able to achieve one result, thereby reducing manufacturing costs. Furthermore, if a position of the mold 2 is damaged, only the corresponding sheet-like mold unit 3 needs to be replaced, without the entire mold 2 being scrapped, thereby reducing maintenance costs.

[0067] (3) The heat spreader preparation method of the present invention converts the preparation of micron-sized, complex-structured, and large-aspect-ratio three-dimensional wicks into two-dimensional thin slices of simple shapes cut and stacked, and then conventional high-temperature powder sintering based on the idea of integration, thereby reducing the difficulty of preparing micron-sized wicks and the dependence on expensive manufacturing equipment; achieving the integrated sintering of wicks with different structures, and simplifying the heat spreader preparation process; the thin slices can be reused and stacked into different shapes, thereby reducing the manufacturing cost of the heat spreader.

[0068] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that, unless otherwise specified, "multiple" refers to two or more; the terms "first", "second", "third", etc. are only used to distinguish, and are not used to describe a specific order or sequence, nor can they be understood to indicate or imply relative importance. The term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of the present application, for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0069] The above-described embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A heat sink, characterized in that: The heat dissipation device comprises an upper shell plate, a lower shell plate, a support frame, a first liquid absorbent core and a second liquid absorbent core; the lower shell plate is arranged opposite to the upper shell plate, and the edges of the lower shell plate and the upper shell plate are connected at the side by the support frame and enclosed to form a cavity, wherein a circulating working medium is contained in the cavity; the cavity comprises an evaporation area and a condensation area arranged in sequence along the extension direction of the heat spreader; a plurality of longitudinally extending first liquid absorbent cores are arranged at intervals on the inner surface of the lower shell plate on the evaporation area side; a groove is provided on the outer side wall of the first liquid absorbent core; the first liquid absorbent core is a centrally symmetrical cylinder, each outer side wall of the cylinder is provided with a plurality of grooves, and on the outer side walls of each side of the cylinder, the depth of the grooves at both ends is greater than the groove in the middle; the second liquid absorbent core is provided on the inner surface of the lower shell plate on the condensation area side; The second wick includes a plurality of mutually parallel first protrusions, the first protrusions extending from an end of the condensation zone away from the evaporation zone to an end close to the evaporation zone, and first grooves are formed between adjacent first protrusions and between the support frame and the adjacent first protrusions, the first grooves being micron-scale capillary grooves; the first wick and the second wick are formed by sintering powder, and the microscopic outer surface is a porous structure; the second wick also includes a plurality of mutually parallel second protrusions, the second protrusions being arranged in the first grooves, the second protrusions extending from an end of the condensation zone away from the evaporation zone to an end close to the evaporation zone, and second grooves are formed between adjacent second protrusions and between the second protrusions and the adjacent first protrusions; The second trench has a depth smaller than that of the first trench.

2. A mold for preparing the heat spreader according to claim 1, characterized in that: The mold is formed by stacking several sheet mold units; a single sheet mold unit includes a functional part located at the top, and the functional part includes a first liquid absorbent core functional unit and a second liquid absorbent core functional unit arranged in sequence along the extension direction; after several sheet mold units are stacked and fixed, several first liquid absorbent core functional units form several first liquid absorbent core reverse structures, and several second liquid absorbent core functional units form a second liquid absorbent core reverse structure; the first liquid absorbent core reverse structure is a groove structure with a shape opposite to and compatible with the first liquid absorbent core, and the second liquid absorbent core reverse structure is a groove structure with a shape opposite to and compatible with the second liquid absorbent core.

3. The mold according to claim 2, characterized in that A single sheet mold unit further includes a supporting portion connected to the lower portion of the functional portion, and the supporting portion is provided with a connecting hole; after a plurality of sheet mold units are stacked and fixed, the plurality of connecting holes form a connecting through hole for fixedly connecting the plurality of sheet mold units.

4. A method for preparing a vapor chamber, characterized in that: The following steps are involved: S1. Using software to design a model of the overall shape of a mold for preparing the vapor chamber according to any one of claims 2-3 to obtain a mold model; S2. Slice the mold model in step S1 using software to obtain a plurality of sheet-shaped mold unit models; S3, laser cutting each of the sheet mold units according to the plurality of sheet mold unit models in step S2, and stacking and fixing the sheet mold units in sequence to obtain the mold matching the mold model; S4, sintering the lower shell plate and the mold described in step 3 with high-temperature powder, and after demolding, obtaining the lower shell plate with the first and second liquid absorbent wicks sintered thereon; S5, sealing and fixing the support frame, the upper shell plate, and the lower shell plate described in step S4 to obtain a heat spreader; S6. Perform liquid injection and degassing treatment on the heat spreader.

5. The method according to claim 4, characterized in that The slicing in step S2 is specifically performed along the extension direction of the mold model.

6. The method according to claim 5, characterized in that The precision of the slicing in step S2 and the laser cutting in step S3 is micron level.

Citation Information

Patent Citations

  • Flat-plate heat pipe

    CN101929813A

  • Ultrathin phase change heat transfer element with gas-liquid separation, uniform distribution and coplanar characteristics

    CN115342672A

  • Multi-scale composite wick vapor chamber and preparation method thereof

    CN117329889A

  • Patterned capillary backflow wick structure for etching processing

    CN218097345U