Workpiece replacement system, workpiece replacement method and semiconductor process equipment

Abstract

The present disclosure provides a workpiece replacement system, a workpiece replacement method and a semiconductor process processing equipment. The workpiece replacement system is used to replace the workpiece processed by the semiconductor process processing equipment, and the semiconductor process processing equipment includes a processing chamber, a support seat located in the processing chamber, and a pin that can move in the processing chamber. The workpiece replacement system includes a workpiece unloading device and a robotic arm. The workpiece unloading device is arranged on the semiconductor process processing equipment, and grabs and holds the processed workpiece when the processed workpiece is displaced to the unloading position by the pin. While the robotic arm transports the workpiece to be processed into the processing chamber, it unloads the processed workpiece from the workpiece unloading device and transports it out of the processing chamber. The workpiece replacement system combines two times of entering and exiting the processing chamber to replace the workpiece into one time of entering and exiting the processing chamber by the robotic arm to replace the workpiece, which greatly shortens the wafer replacement process, compresses the total time of the heat treatment process, and thus improves the wafer production capacity.

Description

Technical Field

[0001] Exemplary embodiments of the present disclosure generally relate to the field of semiconductor manufacturing, and more particularly, to a workpiece replacement system, a workpiece replacement method, and semiconductor process equipment. Background Art

[0002] In the wafer processing process, such as the heat treatment process, an unloaded robot arm needs to enter the chamber to take out the processed wafer, and then put the wafer to be processed on the robot arm into the chamber again for processing. The long time for the two wafer changes will cause the total process time to be undesirably extended. Summary of the invention

[0003] In a first aspect of the present disclosure, a workpiece replacement system is provided for replacing a workpiece processed by a semiconductor process processing equipment, the semiconductor process processing equipment comprising: a processing chamber; a support seat, located in the processing chamber for supporting the workpiece; and a ejector pin, configured to be movable in the processing chamber to shift the workpiece toward or away from the support seat; the workpiece replacement system comprises: a workpiece unloading device, disposed on the semiconductor process processing equipment and configured to grab and hold the processed workpiece when the processed workpiece is shifted to a unloading position by the ejector pin; and a robot arm, configured to unload the processed workpiece from the workpiece unloading device and transport it out of the processing chamber while transporting the workpiece to be processed into the processing chamber.

[0004] The workpiece replacement system combines two times of entering and exiting the processing chamber to replace the workpiece into one time of entering and exiting the processing chamber by the robotic arm to replace the workpiece, greatly shortening the wafer changing process, compressing the total time of the heat treatment process, and thereby improving wafer production capacity.

[0005] In some embodiments, the workpiece unloading device includes multiple workpiece unloading mechanisms, each workpiece unloading mechanism includes a fixed base and a movable telescopic part, the telescopic part moves between an initial position and a unloading position relative to the base, the first end of the telescopic part is coupled to the base, and the second end of the telescopic part includes a grasping part, and when the telescopic part is in the unloading position, the grasping part grasps and holds the processed workpiece.

[0006] In some embodiments, the workpiece unloading mechanism is pneumatic, and a gas channel is formed in the base. When gas is delivered into the gas channel, the telescopic portion moves toward the unloading position, and when there is no gas in the gas channel or gas is extracted from the gas channel, the telescopic portion moves toward the initial position.

[0007] In some embodiments, the end of the base of the workpiece unloading mechanism forms a base stopper, the surface of the gripping portion facing the base includes a first stopper, and the first end of the telescopic portion includes a second stopper. When the telescopic portion is at the initial position, the first stopper abuts against the base stopper, and when the telescopic portion is at the unloading position, the second stopper abuts against the base stopper.

[0008] In some embodiments, the workpiece unloading mechanism is electric, the base portion includes a motor, the telescopic portion includes an adjustment portion, and the adjustment portion is configured to adjust any one of a displacement distance and a rotation angle of the gripping portion.

[0009] In some embodiments, the telescopic portion includes a sealing sleeve between the adjusting portion and the gripping portion, and a seal is disposed between the sealing sleeve and a wall of the processing chamber to seal and isolate the adjusting portion and the motor from the processing chamber.

[0010] In some embodiments, the workpiece unloading mechanism further includes a rack, which is disposed outside the adjustment portion and between the processing chamber and the motor.

[0011] In some embodiments, the plurality of workpiece removal mechanisms includes three or four evenly spaced workpiece removal mechanisms.

[0012] In some embodiments, the robot arm includes a robot arm, and the robot arm includes a first workpiece pallet and a second workpiece pallet, the first workpiece pallet is used to carry processed workpieces, and the second workpiece pallet is used to carry workpieces to be processed.

[0013] In some embodiments, the robot arm includes a first robot arm and a second robot arm, the first robot arm includes a workpiece pallet for carrying a processed workpiece, and the second robot arm includes a workpiece pallet for carrying a workpiece to be processed.

[0014] In a second aspect of the present disclosure, a workpiece replacement method is provided, which is suitable for replacing workpieces processed by semiconductor process processing equipment using a workpiece replacement system in any of the above-mentioned embodiments. The workpiece replacement method includes unloading processed workpieces and placing workpieces to be processed. The unloading of processed workpieces and the placement of workpieces to be processed are completed by a robotic arm entering a processing chamber of the semiconductor process processing equipment at one time.

[0015] In some embodiments, unloading the processed workpiece includes: at the end of the semiconductor process, stopping the rotation of the processed workpiece; when the processed workpiece stops rotating, the ejector pin of the semiconductor process handling equipment moves upward to a first position, the first position is located below the processed workpiece and is a first distance away from the processed workpiece; the ejector pin moves upward and lifts the processed workpiece to a second position, the second position is located above the workpiece unloading position and is a second distance away from the workpiece unloading position; in the process of the ejector pin moving from the first position to the second position, the workpiece unloading device moves to the workpiece unloading position; the ejector pin moves downward from the second position toward the workpiece unloading position, and when the ejector pin moves to the workpiece unloading position, the workpiece unloading device grabs the processed workpiece and holds the processed workpiece at the workpiece unloading position.

[0016] In some embodiments, during the semiconductor process, a workpiece to be processed is placed on a robot arm, and the robot arm carries the workpiece to be processed and moves to an out-of-chamber waiting position located outside the processing chamber.

[0017] In some embodiments, when the semiconductor process is finished, the workpiece access port of the processing chamber is opened, and the robot arm carries the workpiece to be processed and moves to a waiting position in the processing chamber.

[0018] In some embodiments, before the robot arm moves to the waiting position in the chamber, it is determined whether the workpiece access port is fully opened.

[0019] In some embodiments, placing the workpiece to be processed includes moving the ejector downward from the workpiece unloading position to the workpiece placement waiting position to be processed. While the robot arm moves upward at a first speed to a position above the workpiece unloading position and a third distance from the workpiece unloading position, the ejector moves upward at a second speed greater than the first speed to the position where the workpiece to be processed carried by the robot arm is located and lifts the workpiece to be processed off the robot arm.

[0020] In some implementations, placing the workpiece to be processed includes using a pin to move the workpiece to be processed to a processing implementation position to place the workpiece to be processed in place.

[0021] In some implementations, after the workpiece to be processed is placed in place, the ejector pin moves downward to and stays in the initial position until the semiconductor process is completed.

[0022] In some embodiments, unloading the processed workpiece includes transferring the processed workpiece from the workpiece unloading device to the robot arm to unload the processed workpiece when the robot arm moves upward at a first speed to a workpiece unloading position.

[0023] In some embodiments, while the ejector pin moves the workpiece to be processed to the processing process implementation position, the robot arm carries the processed workpiece out of the processing chamber.

[0024] In some embodiments, the first distance is 1 mm and the second distance is 2.5 mm.

[0025] In some embodiments, the third distance is 4 mm.

[0026] In a third aspect of the present disclosure, a semiconductor process processing equipment is provided, comprising a processing chamber; a support seat located in the processing chamber for supporting a workpiece; a ejector pin configured to be movable in the processing chamber to shift the workpiece toward or away from the support seat; and a workpiece unloading device disposed on the semiconductor process processing equipment and configured to grab and hold the processed workpiece when the processed workpiece is shifted to a unloading position by the ejector pin.

[0027] In some embodiments, the workpiece unloading device includes multiple workpiece unloading mechanisms, each workpiece unloading mechanism includes a fixed base and a movable telescopic part, the telescopic part moves between an initial position and a unloading position relative to the base, the first end of the telescopic part is coupled to the base, and the second end of the telescopic part includes a grasping part, and when the telescopic part is in the unloading position, the grasping part grasps and holds the processed workpiece.

[0028] In some embodiments, the workpiece unloading mechanism is pneumatic, and a gas channel is formed in the base. When gas is delivered into the gas channel, the telescopic portion moves toward the unloading position, and when there is no gas in the gas channel or gas is extracted from the gas channel, the telescopic portion moves toward the initial position.

[0029] In some embodiments, the end of the base of the workpiece unloading mechanism forms a base stopper, the surface of the gripping portion facing the base includes a first stopper, and the first end of the telescopic portion includes a second stopper. When the telescopic portion is at the initial position, the first stopper abuts against the base stopper, and when the telescopic portion is at the unloading position, the second stopper abuts against the base stopper.

[0030] In some embodiments, the workpiece unloading mechanism is electric, the base portion includes a motor, the telescopic portion includes an adjustment portion, and the adjustment portion is configured to adjust any one of a displacement distance and a rotation angle of the gripping portion.

[0031] In some embodiments, the telescopic portion includes a sealing sleeve between the adjusting portion and the gripping portion, and a seal is disposed between the sealing sleeve and a wall of the processing chamber to seal and isolate the adjusting portion and the motor from the processing chamber.

[0032] In some embodiments, the workpiece unloading mechanism further includes a rack, which is disposed outside the adjustment portion and between the processing chamber and the motor.

[0033] In some embodiments, the plurality of workpiece removal mechanisms includes three or four evenly spaced workpiece removal mechanisms.

[0034] In some embodiments, the semiconductor process handling equipment is a thermal treatment equipment that performs a thermal treatment process on a workpiece.

[0035] In some embodiments, the support base includes a magnetic levitation platform that holds and rotates the workpiece being processed during the thermal treatment process.

[0036] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0038] Figure 1 is a schematic structural diagram of a workpiece replacement system according to an embodiment of the present disclosure;

[0039] Figure 2 is a schematic structural diagram of a semiconductor process equipment according to an embodiment of the present disclosure;

[0040] Figure 3 is a schematic structural diagram of a pneumatic workpiece removal mechanism according to an embodiment of the present disclosure;

[0041] Figure 4 is a schematic structural diagram of a pneumatic workpiece removal mechanism according to an embodiment of the present disclosure;

[0042] Figure 5 is a schematic structural diagram of an electric workpiece unloading mechanism according to an embodiment of the present disclosure;

[0043] Figure 6 is a schematic structural diagram of a mechanical arm according to an embodiment of the present disclosure;

[0044] Figure 7 yes Figure 6 A magnified view of area A in the upper right part;

[0045] Figure 8 is a schematic diagram of a workpiece replacement method according to an embodiment of the present disclosure;

[0046] Fig. 9 4 is a flow chart of a workpiece replacement method according to an embodiment of the present disclosure.

[0047] Description of reference numerals:

[0048] 100: Workpiece replacement system;

[0049] 101: Semiconductor process equipment;

[0050] 1011: processing chamber;

[0051] 1012: support seat;

[0052] 1013: thimble;

[0053] 1014: Workpiece import and export;

[0054] 102: workpiece unloading device;

[0055] 1021: base;

[0056] 1022: telescopic part;

[0057] 1023: Grasping unit;

[0058] 1024: base limiting portion;

[0059] 1025: first limiting portion;

[0060] 1026: second limiting portion;

[0061] 1027: Electric motor;

[0062] 1028: Regulation Department;

[0063] 1029: rack;

[0064] 103: Robotic arm;

[0065] 1031: first workpiece pallet;

[0066] 1032: Second workpiece pallet. DETAILED DESCRIPTION

[0067] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0068] like Figure 1 As shown, the present disclosure provides a workpiece replacement system 100 for replacing a workpiece processed by a semiconductor process processing device 101, wherein the semiconductor process processing device 101 includes a processing chamber 1011, a support seat 1012 located in the processing chamber 1011 for supporting the workpiece, and a ejector pin 1013 configured to be able to move in the processing chamber 1011 to shift the workpiece toward or away from the support seat 1012.

[0069] The workpiece replacement system 100 includes a workpiece unloading device 102 and a robot arm 103. The workpiece unloading device 102 can be arranged on the side wall of the semiconductor process processing equipment 101 and the outer edge of the support seat 1012, and is configured to grab and hold the processed workpiece when the processed workpiece is shifted to the unloading position by the ejector pin 1013. The robot arm 103 is configured to unload the processed workpiece from the workpiece unloading device 102 and transport it out of the processing chamber 1011 while transporting the workpiece to be processed into the processing chamber 1011.

[0070] like Figure 2As shown, the semiconductor process equipment 101 can be a heat treatment equipment, a thin film deposition equipment, a cleaning equipment, an etching equipment, a photolithography equipment, etc. The workpiece processed by the process can be a wafer. The processing chamber 1011 is a reaction chamber of the above-mentioned processing equipment. In the case where the semiconductor process equipment 101 is a heat treatment equipment, the support seat 1012 in the reaction chamber can be a magnetic suspension platform, and during the implementation of the heat treatment process, the magnetic suspension platform fixes and rotates the workpiece being processed.

[0071] In some embodiments, the processing chamber 1011 also has a workpiece inlet and outlet 1014 (such as Figure 1 , Figure 2 As shown), it is used for the workpiece to be processed to enter the processing chamber 1011 from the workpiece inlet and outlet 1014, and it is used for the processed workpiece to be moved out from the workpiece inlet and outlet 1014.

[0072] The internal ejector pin 1013 of the processing chamber 1011 can adjust its own height. After the ejector pin 1013 rises and abuts against the lower surface of the processed workpiece, the workpiece will move synchronously with the ejector pin 1013 as the ejector pin 1013 rises. The number of ejector pins 1013 can be adjusted, for example, three ejector pins 1013 are evenly arranged. The lifting and lowering of the ejector pin 1013 can be driven by a motor. For example, a motor is arranged at the lower end of the processing chamber 1011, and the motor moves to lift and lower the three ejector pins 1013 to adjust the height of the ejector pin 1013.

[0073] The workpiece unloading device 102 is a device linked with the ejector pin 1013. For example, after the ejector pin 1013 lifts the processed workpiece, the workpiece unloading device 102 unloads the processed workpiece from the ejector pin 1013. The workpiece unloading device 102 may be entirely disposed in the processing chamber 1011, or partially disposed in the processing chamber 1011. The workpiece unloading device 102 may include a plurality of workpiece unloading mechanisms (for example, 3 or 4 uniformly arranged around the support seat 1012 or around the workpiece), and each workpiece unloading mechanism may include a fixed base 1021 and a movable telescopic portion 1022, the telescopic portion 1022 moves between an initial position and a unloading position relative to the base 1021, the first end of the telescopic portion 1022 is coupled to the base 1021, and the second end of the telescopic portion 1022 includes a gripping portion 1023, and when the telescopic portion 1022 is in the unloading position, the gripping portion 1023 grips and holds the processed workpiece, so that the processed workpiece is detached from the ejector pin 1013.

[0074] At least a portion of the telescopic portion 1022 can be retracted into the base 1021. When the telescopic portion 1022 is retracted into the base 1021, the position of the telescopic portion 1022 is the initial position. When the telescopic portion 1022 is extended out of the base 1021 and is in place, the position of the telescopic portion 1022 is the unloading position. The movement of the telescopic portion 1022 can be configured to be linked with the ejector pin 1013. For example, when the ejector pin 1013 lifts up the processed workpiece and moves upward, the telescopic portion 1022 moves from the initial position to the unloading position until it reaches the unloading position and is in place to prepare for grabbing the processed workpiece. In some embodiments, the movement of the telescopic portion 1022 from the unloading position to the initial position can occur in the process of the ejector pin 1013 lifting the workpiece to be processed and moving downward. The grabbing portion at the second end of the telescopic portion 1022 can be understood as Figure 3 , Figure 4 , Figure 5 The structure shown by the middle reference numeral 1023. The upper end surfaces of the plurality of gripping parts 1023 are located at the same horizontal plane to ensure the stability of holding up the processed workpiece.

[0075] The workpiece removal mechanism may be pneumatic, electric, hydraulic or in any other suitable manner.

[0076] For example Figure 3 , Figure 4 The pneumatic workpiece unloading mechanism shown in the figure can be completely located in the processing chamber 1011, and the base 1021 is connected to the inner wall of the processing chamber 1011. In some embodiments, in the pneumatic workpiece unloading mechanism, a gas channel (such as Figure 4 The first end of the telescopic part 1022 is inserted into the gas channel. When gas is delivered into the gas channel, the thrust generated by the increased gas pressure in the gas channel causes the telescopic part 1022 to extend out of the gas channel and move toward the unloading position. When there is no gas in the gas channel or gas is extracted from the gas channel, the telescopic part 1022 relies on its own gravity or the suction force caused by the reduced gas pressure in the gas channel to cause the telescopic part 1022 to retract into the gas channel and move toward the initial position.

[0077] The height of the unloading position can be defined by the structures configured on the telescopic part 1022 and the base 1021. For example, the end of the base 1021 forms a base limiter 1024, the surface of the gripping part 1023 facing the base 1021 includes a first limiter 1025, and the first end of the telescopic part 1022 includes a second limiter 1026. When gas is delivered into the gas channel, the telescopic part 1022 extends out of the gas channel until the second limiter 1026 abuts against the base limiter 1024, and the height position of the telescopic part 1022 is the unloading position. When there is no gas in the gas channel or gas is extracted from the gas channel, the telescopic part 1022 retracts into the gas channel until the first limiter 1025 abuts against the base limiter 1024, and the telescopic part 1022 is in the initial position. The initial position can be determined by setting the first limiting portion 1025 to abut against the base limiting portion 1024 , and the height of the removal position can be controlled by setting the second limiting portion 1026 to abut against the base limiting portion 1024 .

[0078] In some embodiments, the base 1021 and the telescopic portion 1022 of the pneumatic workpiece unloading mechanism are both made of transparent quartz material to reduce the impact on the temperature and airflow of the processing chamber 1011.

[0079] like Figure 5 The electric workpiece unloading mechanism is shown. In the electric workpiece unloading mechanism, the base 1021 includes a motor 1027, and the telescopic part 1022 includes an adjustment part 1028, and the adjustment part 1028 is configured to adjust any one of the displacement distance and the rotation angle of the gripping part 1023. For example, after configuring the electric workpiece unloading mechanism, by adjusting the adjustment part 1028, the extension length of the telescopic part 1022 can meet the requirements of the initial position and the unloading position, or by adjusting the adjustment part 1028, multiple gripping parts 1023 are located in the same plane, thereby improving the stability of holding up the processed workpiece.

[0080] In some embodiments, the telescopic portion 1022 may include a sealing sleeve located between the adjustment portion 1028 and the gripping portion 1023, and a seal is disposed between the sealing sleeve and the wall of the processing chamber 1011 to seal and isolate the adjustment portion 1028 and the motor 1027 outside the processing chamber 1011. By providing a stretchable sealing sleeve, the sealing of the processing chamber 1011 can be maintained.

[0081] In some embodiments, the workpiece unloading mechanism may further include a frame 1029, which is disposed outside the adjusting portion 1028 and between the processing chamber 1011 and the motor 1027, so as to fix the motor 1027 and the adjusting portion 1028 to the outer wall of the processing chamber 1011. Alternatively, the seal, the sealing sleeve, the adjusting portion 1028, the motor 1027 and the frame 1029 are all disposed outside the processing chamber 1011, the seal, the sealing sleeve, the motor 1027 are connected to the outer wall of the processing chamber 1011 through the frame 1029, and the telescopic portion 1022 and the grabbing portion 1023 pass through the wall of the processing chamber 1011 and are located in the processing chamber 1021, so as to minimize the internal space of the processing chamber 1011.

[0082] In some embodiments, in the electric workpiece removal device 102 , the gripping portion 1023 and the telescopic portion 1022 located in the processing chamber 1011 are made of transparent quartz material to reduce the impact on the temperature and airflow of the processing chamber 1011 .

[0083] In some embodiments, the robot 103 may include a robot including a first workpiece pallet 1031 and a second workpiece pallet 1032 , wherein the first workpiece pallet 1031 is used to carry processed workpieces, and the second workpiece pallet 1032 is used to carry workpieces to be processed.

[0084] like Figure 6 , Figure 7 As shown, the first workpiece tray 1031 and the second workpiece tray 1032 are arranged at intervals in the upper and lower parts, and the first workpiece tray 1031 located at the upper part (the tray above the robot arm 103) is used to carry the processed workpiece, and the second workpiece tray 1032 located at the lower part (the tray below the robot arm 103) is used to carry the workpiece to be processed. By setting the workpiece trays at two heights, after the robot arm 103 enters the processing chamber 1011, the removal of the processed workpiece and the placement of the workpiece to be processed can be completed at one time.

[0085] In some embodiments, the robot 103 may include a first robot and a second robot, the first robot including a workpiece tray for carrying a processed workpiece, and the second robot including a workpiece tray for carrying a workpiece to be processed. The workpiece trays of the two robot arms are arranged in an upper and lower spacing, the workpiece tray of the first robot arm located at the upper side is used to carry the processed workpiece, and the workpiece tray of the second robot arm located at the lower side is used to carry the workpiece to be processed. By setting the workpiece trays at two heights, after the robot 103 enters the processing chamber 1011, the removal of the processed workpiece and the placement of the workpiece to be processed can be completed at one time.

[0086] The present disclosure provides a workpiece replacement method, which is suitable for replacing workpieces processed by semiconductor process processing equipment using a workpiece replacement system in any of the above-mentioned embodiments. The workpiece replacement method includes unloading processed workpieces and placing workpieces to be processed. The unloading of processed workpieces and the placement of workpieces to be processed are completed by a robotic arm entering a processing chamber of the semiconductor process processing equipment at one time.

[0087] When the workpiece replacement system provided by the embodiment of the present disclosure is applied, the first workpiece tray of the robot arm is empty, and the second workpiece tray of the robot arm carries the workpiece to be processed. Both workpiece trays are located outside the processing chamber. After the process implemented in the processing chamber is completed, the ejector rises to lift the processed workpiece and then rises to 2.5 mm above the unloading position. The gripping part of the workpiece unloading mechanism rises to the unloading position, and when the ejector drops to the unloading position, the processed workpiece is gripped by the gripping part. The first workpiece tray and the second workpiece tray of the robot arm are controlled to enter the processing chamber together and rise synchronously. When the first workpiece tray rises to the unloading position, the processed workpiece is gripped by the first workpiece tray. After the second workpiece tray enters the processing chamber, the ejector gradually rises and the speed is faster than the speed of the second workpiece tray until the workpiece to be processed is gripped from the second workpiece tray by the ejector. The first workpiece tray carrying the processed workpiece and the empty second workpiece tray are controlled to be moved out of the processing chamber to complete the replacement of the workpiece. Through the workpiece replacement system disclosed in the present invention, the robot arm can complete the replacement of the processed workpiece and the workpiece to be processed by entering and exiting the processing chamber once, thereby improving the workpiece replacement efficiency, shortening the total process time, and improving the process capacity.

[0088] In some embodiments, Figure 8 As shown, unloading processed workpieces includes:

[0089] Step 1: At the end of the semiconductor process, the rotation of the processed workpiece is stopped.

[0090] Step 2: When the processed workpiece stops rotating, the ejector pin of the semiconductor process equipment moves upward to a first position, wherein the first position is located below the processed workpiece and is a first distance away from the processed workpiece.

[0091] Step 3: The ejector moves upward and lifts the processed workpiece to a second position, wherein the second position is above the workpiece unloading position and is a second distance away from the workpiece unloading position.

[0092] Step 4: When the ejector pin moves from the first position to the second position, the workpiece unloading device moves to the workpiece unloading position.

[0093] Step 5: The ejector moves downward from the second position toward the workpiece unloading position. When the ejector moves to the workpiece unloading position, the workpiece unloading device grabs the processed workpiece and holds the processed workpiece at the workpiece unloading position.

[0094] In some embodiments, during the semiconductor process, a workpiece to be processed is placed on a robot arm, and the robot arm carries the workpiece to be processed and moves to an out-of-chamber waiting position located outside the processing chamber.

[0095] In some embodiments, when the semiconductor process is finished, the workpiece entrance and exit of the processing chamber are opened, and the robot arm carries the workpiece to be processed and moves to a waiting position in the processing chamber.

[0096] In some embodiments, before the robot arm moves to the waiting position in the chamber, it is determined whether the workpiece access port is fully opened.

[0097] In some embodiments, placing the workpiece to be processed includes moving the ejector downward from the workpiece unloading position to the workpiece placement waiting position to be processed. While the robot arm moves upward at a first speed to a position above the workpiece unloading position and a third distance from the workpiece unloading position, the ejector moves upward at a second speed greater than the first speed to the position where the workpiece to be processed carried by the robot arm is located and lifts the workpiece to be processed off the robot arm.

[0098] In some embodiments, placing the workpiece to be processed includes using a pin to move the workpiece to be processed to a processing implementation position to place the workpiece to be processed in place.

[0099] In some embodiments, after the workpiece to be processed is placed in place, the ejector pin moves downward to and stays in the initial position until the semiconductor process is completed.

[0100] In some embodiments, unloading the processed workpiece includes transferring the processed workpiece from the workpiece unloading device to the robot arm to unload the processed workpiece when the robot arm moves upward at a first speed to a workpiece unloading position.

[0101] In some embodiments, while the ejector pin moves the workpiece to be processed to the processing process implementation position, the robot arm carries the processed workpiece out of the processing chamber.

[0102] In some embodiments, the first distance is 1 mm and the second distance is 2.5 mm.

[0103] In some embodiments, the third distance is 4 mm.

[0104] In some embodiments, Fig. 9As shown, the workpiece replacement method according to the embodiment of the present disclosure is described by taking the replacement of the workpiece in the heat treatment equipment as an example. While the heat treatment process is in progress, the tray under the robot arm is loaded with the workpiece to be processed, and is moved to the "waiting position outside the chamber" together with the unloaded tray above the robot arm. When the process is completed, the chamber door (the workpiece entrance and exit of the processing chamber) is opened. After confirming that the chamber door is fully opened, the tray above the robot arm and the tray below the robot arm begin to move to the "waiting position inside the chamber"; when the heat treatment process is completed, the processed workpiece begins to decelerate to a stop, and at the same time as it stops, the ejector pin under the processed workpiece just moves to a position 1mm away from the processed workpiece, and the ejector pin continues It moves up to 2.5mm above the workpiece unloading position, the workpiece unloading device lifts it into place, and the ejector moves down to the "waiting position for workpieces to be processed". During the downward movement of the ejector, the processed workpiece is grabbed by the workpiece unloading device, and the processed workpiece enters the waiting-for-unloading state in the processing chamber; at the same time, the tray under the robotic arm is controlled to move to the "waiting position in the chamber" in time and space, and will not interfere with the ejector and other components in the chamber. At this time, the tray under the robotic arm is 1mm above the ejector, and the tray under the robotic arm and the ejector move up at the same time, and the ejector speed is faster than the tray below. When the upper tray moves to 4mm above the "workpiece unloading position", the processed workpiece on the workpiece unloading device is unloaded to realize the unloading process of the processing chamber. The upper tray and the lower tray move up synchronously. During the unloading process of the upper tray, the ejector unloads the workpiece to be processed from the square tray below to realize the loading process of the processing chamber; the tray above the robotic arm moves the processed workpiece out of the processing chamber, and the lower tray moves out of the processing chamber empty. The ejector supports the workpiece to be processed to the processing process implementation position, and the ejector continues to move down and is in the initial position. The initial position of the ejector is set at the position that has the least impact on the workpiece processing. After confirming that the chamber door is closed in place, the processing area starts processing. The robotic arm outside the processing chamber places the processed workpiece in the specified position, loads the next workpiece to be processed and moves it to the "waiting position outside the chamber", forming a film changing cycle.

[0105] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0106] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0107] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0108] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0109] The disclosure above provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0110] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A workpiece replacement system for replacing a workpiece processed by a semiconductor process processing device, wherein: The semiconductor process equipment comprises: a processing chamber; a support seat, located in the processing chamber and used for supporting a workpiece; and an ejector pin configured to be movable in the processing chamber to displace a workpiece toward or away from the support seat; The workpiece replacement system comprises: a workpiece unloading device disposed on the semiconductor process equipment and configured to grasp and hold the processed workpiece when the processed workpiece is displaced to the unloading position by the ejector pin; and a robot arm configured to unload the processed workpiece from the workpiece unloading device and transport it out of the processing chamber while transporting the workpiece to be processed into the processing chamber; Wherein, the workpiece unloading device includes a plurality of workpiece unloading mechanisms, each of which includes a fixed base and a movable telescopic part, the telescopic part moves between an initial position and a unloading position relative to the base, the first end of the telescopic part is coupled to the base, and the second end of the telescopic part includes a grasping part, and when the telescopic part is in the unloading position, the grasping part grasps and holds the processed workpiece.

2. The workpiece replacement system according to claim 1, wherein: The workpiece removal mechanism is pneumatic, and a gas channel is formed in the base; When gas is delivered into the gas channel, the telescopic portion moves toward the removal position, and when gas does not exist in the gas channel or gas is extracted from the gas channel, the telescopic portion moves toward the initial position.

3. The workpiece replacement system according to claim 2, wherein: The end of the base of the workpiece unloading mechanism forms a base limiting portion, the surface of the gripping portion facing the base includes a first limiting portion, and the first end of the telescopic portion includes a second limiting portion; When the telescopic portion is located at the initial position, the first limiting portion abuts against the base limiting portion, and when the telescopic portion is located at the removal position, the second limiting portion abuts against the base limiting portion.

4. The workpiece replacement system according to claim 1, wherein: The workpiece unloading mechanism is electric, the base portion includes a motor, and the telescopic portion includes an adjustment portion configured to adjust any one of a displacement distance and a rotation angle of the gripping portion.

5. The workpiece replacement system according to claim 4, wherein: The telescopic portion includes a sealing sleeve located between the adjusting portion and the gripping portion, and a sealing member is disposed between the sealing sleeve and a wall of the processing chamber to seal and isolate the adjusting portion and the motor from the processing chamber.

6. The workpiece replacement system according to claim 4, wherein: The workpiece unloading mechanism further includes a frame disposed outside the adjustment portion and located between the processing chamber and the motor.

7. The workpiece replacement system according to any one of claims 1 to 6, wherein: The plurality of workpiece unloading mechanisms include three or four evenly distributed workpiece unloading mechanisms.

8. The workpiece replacement system according to any one of claims 1 to 6, wherein: The robot arm includes a robot arm, and the robot arm includes a first workpiece pallet and a second workpiece pallet. The first workpiece pallet is used to carry processed workpieces, and the second workpiece pallet is used to carry workpieces to be processed.

9. The workpiece replacement system according to any one of claims 1 to 6, wherein: The robot arm comprises a first robot arm and a second robot arm, the first robot arm comprises a workpiece pallet for carrying processed workpieces, and the second robot arm comprises a workpiece pallet for carrying workpieces to be processed.

10. A workpiece replacement method, suitable for replacing workpieces processed by semiconductor process processing equipment using a workpiece replacement system according to any one of claims 1 to 9, the workpiece replacement method comprising removing processed workpieces and placing workpieces to be processed, the removing of processed workpieces and the placing of workpieces to be processed are completed by a robotic arm entering a processing chamber of the semiconductor process processing equipment at one time.

11. The workpiece replacement method according to claim 10, wherein unloading the processed workpiece comprises: At the end of the semiconductor process, the rotation of the processed workpiece is stopped; When the processed workpiece stops rotating, the ejector pin of the semiconductor process equipment moves upward to a first position, wherein the first position is located below the processed workpiece and is a first distance away from the processed workpiece; The ejector moves upward and lifts the processed workpiece to a second position, wherein the second position is located above the workpiece unloading position and is a second distance away from the workpiece unloading position; During the process of the ejector moving from the first position to the second position, the workpiece unloading device moves to the workpiece unloading position; The ejector pin moves downward from the second position toward the workpiece unloading position. When the ejector pin moves to the workpiece unloading position, the workpiece unloading device grabs the processed workpiece and holds the processed workpiece at the workpiece unloading position.

12. The workpiece replacement method according to claim 11, wherein: During the implementation of the semiconductor process, the workpiece to be processed is placed on the robot arm; The robot arm carries the workpiece to be processed and moves to an out-of-chamber waiting position outside the processing chamber.

13. The workpiece replacement method according to claim 12, wherein: When the semiconductor process is finished, the workpiece inlet and outlet of the processing chamber are opened; The robot arm carries the workpiece to be processed and moves to a waiting position in the processing chamber.

14. The workpiece replacement method according to claim 13, wherein: Before the robot arm moves to the waiting position in the chamber, it is determined whether the workpiece inlet and outlet are fully opened.

15. The workpiece replacement method according to claim 13, wherein placing the workpiece to be processed comprises: The ejector pin moves downward from the workpiece unloading position to a waiting position for placing the workpiece to be processed; The robot arm moves upward at a first speed to a position above the workpiece unloading position and a third distance away from the workpiece unloading position, and the ejector pin moves upward at a second speed greater than the first speed to the position of the workpiece to be processed carried by the robot arm and lifts the workpiece to be processed to separate from the robot arm.

16. The workpiece replacement method according to claim 15, wherein placing the workpiece to be processed comprises: The ejector pin moves the workpiece to be processed to a processing process implementation position to place the workpiece to be processed in place.

17. The workpiece replacement method according to claim 16, wherein: After the workpiece to be processed is placed in place, the ejector pin moves downward to and stays in the initial position until the semiconductor process is completed.

18. The workpiece replacement method according to claim 15, wherein unloading the processed workpiece comprises: When the robot arm moves upward to the workpiece unloading position at the first speed, the processed workpiece is transferred from the workpiece unloading device to the robot arm to unload the processed workpiece.

19. The workpiece replacement method according to claim 15, wherein: When the ejector pin moves the workpiece to be processed to the processing process implementation position, the robot arm carries the processed workpiece out of the processing chamber.

20. The workpiece replacement method according to claim 19, wherein: The first distance is 1 mm, and the second distance is 2.5 mm.

21. The workpiece replacement method according to any one of claims 15 to 20, wherein: The third distance is 4 mm.

22. A semiconductor process equipment, comprising: a processing chamber; A support seat, located in the processing chamber and used for supporting a workpiece; an ejector pin configured to be movable in the processing chamber to displace the workpiece toward or away from the support seat; a workpiece unloading device, disposed on the semiconductor process equipment and configured to grab and hold the processed workpiece when the processed workpiece is displaced to the unloading position by the ejector pin; In which, the workpiece unloading device includes multiple workpiece unloading mechanisms, each workpiece unloading mechanism includes a fixed base and a movable telescopic part, the telescopic part moves between an initial position and a unloading position relative to the base, the first end of the telescopic part is coupled to the base, and the second end of the telescopic part includes a grasping part. When the telescopic part is in the unloading position, multiple grasping parts grasp and hold the same processed workpiece.

23. The semiconductor processing equipment according to claim 22, wherein: The workpiece removal mechanism is pneumatic, and a gas channel is formed in the base; When gas is delivered into the gas channel, the telescopic portion moves toward the removal position, and when gas does not exist in the gas channel or gas is extracted from the gas channel, the telescopic portion moves toward the initial position.

24. The semiconductor processing equipment according to claim 23, wherein: The end of the base of the workpiece unloading mechanism forms a base limiting portion, the surface of the gripping portion facing the base includes a first limiting portion, and the first end of the telescopic portion includes a second limiting portion; When the telescopic portion is located at the initial position, the first limiting portion abuts against the base limiting portion, and when the telescopic portion is located at the removal position, the second limiting portion abuts against the base limiting portion.

25. The semiconductor processing equipment according to claim 22, wherein: The workpiece unloading mechanism is electric, the base portion includes a motor, and the telescopic portion includes an adjustment portion configured to adjust any one of a displacement distance and a rotation angle of the gripping portion.

26. The semiconductor processing equipment according to claim 25, wherein: The telescopic portion includes a sealing sleeve located between the adjusting portion and the gripping portion, and a sealing member is disposed between the sealing sleeve and a wall of the processing chamber to seal and isolate the adjusting portion and the motor from the processing chamber.

27. The semiconductor processing equipment according to claim 25, wherein: The workpiece unloading mechanism further includes a frame disposed outside the adjustment portion and located between the processing chamber and the motor.

28. The semiconductor process equipment according to any one of claims 22 to 27, wherein: The plurality of workpiece unloading mechanisms include three or four evenly distributed workpiece unloading mechanisms.

29. The semiconductor process equipment according to any one of claims 22 to 27, wherein: The semiconductor process equipment is a heat treatment equipment for performing a heat treatment process on a workpiece.

30. The semiconductor processing equipment according to claim 29, wherein: The support base includes a magnetic suspension platform, which fixes and rotates the workpiece being processed during the thermal treatment process.

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