LED support structure and method of manufacturing the same

Abstract

The application relates to the technical field of LED, in particular to an LED support structure and a preparation method thereof. The LED support structure comprises a lamp bead pad, at least one chip is arranged on the lamp bead pad; a plurality of pins are arranged on the lamp bead pad, one end of the pin is arranged on the lamp bead pad, the other end of the pin is bent to the outside of the lamp bead pad, and the plurality of pins are uniformly distributed on the circumferential side of the lamp bead pad. The application increases the balance of the lamp bead by arranging the pins uniformly on the circumference of the lamp bead pad, solves the problem that the left and right thrust and the up and down thrust of the lamp bead are inconsistent, and has a better combination effect with a PCB. The pin is connected to the circumferential side of the lamp bead pad, and the pin is connected to the circuit board by being bent to the outside. On the one hand, the contact area of the pin and the pad is increased. On the other hand, when the pin has a virtual welding problem and needs to be repaired, heating the pin by using a heating device will not cause the lamp bead to be overheated, thereby reducing the risk that the lamp bead is overheated by the heating device and fails.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED, in particular to a LED support structure and a preparation method thereof. BACKGROUND

[0002] LED is a kind of semiconductor component, which is widely used in indicator light, display light emitting diode plate, liquid crystal display backlight and daily lighting in recent years. The patch type LED lamp bead is a kind of LED, and its light emitting principle is to pass current through compound semiconductor, combine electrons and holes, and release part of energy in the form of light to achieve the effect of light emission.

[0003] At present, the setting of the conductive pin of the LED lamp bead on the market will be oxidized during the long-term use and aging process, which will cause the bonding problem, and thus will cause the problems of false welding, lamp falling and the like during the assembly and handling process of the screen body, and cause the maintenance difficulty. SUMMARY

[0004] In the related art, the bonding force between the LED support structure and the circuit board is insufficient, which causes the problems of false welding, lamp falling and the like during the assembly and handling process, and causes the maintenance difficulty.

[0005] In a first aspect, the embodiments of the present application provide a LED support structure, which comprises:

[0006] A lamp bead pad, on which at least one chip is installed;

[0007] A plurality of pins, one end of the pin is installed on the lamp bead pad, the other end is bent outward of the lamp bead pad, and the plurality of pins are uniformly distributed on the circumferential side of the lamp bead pad.

[0008] In combination with the first aspect, in an implementation mode, one end of the pin is installed on the lamp bead pad, the other end is bent outward of the lamp bead pad to form a connecting patch, and the projection area of the connecting patch in the direction perpendicular to the circuit board is greater than the projection area of the pin in the direction perpendicular to the circuit board.

[0009] In combination with the first aspect, in an implementation mode, the upper surface of the lamp bead pad is square, and one pin is arranged on each side of the lamp bead pad.

[0010] In combination with the first aspect, in an implementation mode, the connecting points on the four pins for connecting with the circuit board are symmetrically arranged in pairs with the lamp bead pad as the center.

[0011] In a second aspect, the present application provides a preparation method of a LED support, which comprises:

[0012] Step S1, stamping and electroplating a metal strip provided with pins to form a metal pressing plate, and injection molding the metal pressing plate to form an empty support;

[0013] Step S2, packaging the empty support and bending the pins to make the pins bend outside the lamp bead pad of the support structure;

[0014] Step S3, punching the packaged support structure to form an LED support.

[0015] In combination with the second aspect, in an embodiment, the bending of the pins comprises:

[0016] The pins are bent multiple times to make the pins at least partially adhere to the side of the lamp bead pad.

[0017] In combination with the second aspect, in an embodiment, the stamping of the metal strip provided with pins comprises:

[0018] The metal strip is stamped to form at least one metal pressing plate provided with four pins.

[0019] In combination with the second aspect, in an embodiment, the stamping of the metal strip to form at least one metal pressing plate comprises:

[0020] The metal strip is stamped to form multiple metal pressing plates, the multiple metal pressing plates are integrated, and at least one pin on each metal pressing plate is connected to a pin on another adjacent metal pressing plate.

[0021] In combination with the second aspect, in an embodiment, the injection molding of the metal pressing plate to form an empty support comprises:

[0022] Multiple metal pressing plates and a gel are integrated to form multiple cup body structures by injection molding.

[0023] Multiple empty supports are formed by silk printing the multiple cup body structures.

[0024] In combination with the second aspect, in an embodiment, the punching of the packaged support structure to form an LED support comprises:

[0025] Excess metal strips on multiple packaged support structures are punched, and two pins connected to each other on adjacent support structures are separated to form multiple independent LED supports.

[0026] The technical scheme provided by the embodiments of the present application has at least the following beneficial effects:

[0027] The applicant finds that the LED support structure has the problem of insufficient bonding force with the circuit board, mainly because the left and right thrust and the up and down thrust of a single lamp bead are inconsistent, and the lamp bead is more likely to fall off from one side. The present application sets up evenly arranged pins in the circumferential direction of the lamp bead pad, increases the balance of the lamp bead, solves the problem of inconsistent left and right thrust and up and down thrust of the lamp bead, and has better bonding effect with the PCB. Further, the pins are connected to the circumferential side of the lamp bead pad, and the pins are connected to the circuit board by being bent outward. On the one hand, the contact area of the pins and the pad is increased. On the other hand, when the pins have problems such as virtual welding and need to be repaired, heating the pins with a heating device will not cause the lamp bead to overheat, thereby reducing the risk of failure of the lamp bead due to overheating caused by the heating device. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0029] Figure 1 It is a top view of the upright chip support structure in the embodiment of the present application.

[0030] Figure 2 It is a top view of the inverted chip support structure in the embodiment of the present application.

[0031] Figure 3 It is a top view of the hollow support in the embodiment of the present application.

[0032] Figure 4 It is a sectional view of the hollow support before the pins are bent in the embodiment of the present application.

[0033] Figure 5 It is a sectional view of the hollow support after the pins are bent in the embodiment of the present application.

[0034] Figure 6 It is a schematic view of four connected metal pressing plates in the embodiment of the present application.

[0035] In the figure: 1, lamp bead pad; 2, chip; 21, red light chip; 22, green light chip; 23, blue light chip; 3, pin; 31, connecting patch; 4, metal pressing plate; 41, punching area; 5, metal bonding wire. DETAILED DESCRIPTION

[0036] In order for those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0037] In the related art, the bonding force between the LED support structure and the circuit board is insufficient, resulting in problems such as virtual welding, light falling off, etc. during assembly and handling, causing maintenance difficulties.

[0038] In a first aspect, as shown in the drawings, Figure 3 The LED support structure comprises a lamp bead pad 1 and a plurality of pins 3, wherein

[0039] The lamp bead pad 1 is used to mount at least one chip 2; the plurality of pins 3 are mounted at one end of the lamp bead pad 1, and the other end is bent outwardly of the lamp bead pad 1, and the plurality of pins 3 are uniformly distributed on the circumferential side of the lamp bead pad 1.

[0040] It is worth noting that the present application increases the balance of the lamp bead by arranging the pins 3 uniformly around the circumference of the lamp bead pad, solves the problem of inconsistent left and right and up and down thrust of the lamp bead, and has a better combination effect with the PCB.

[0041] Further, in the related art, when the pins 3 need to be heated and removed due to problems such as virtual welding, since the pins 3 are too close to the lamp bead, the lamp bead is easily heated together, and the lamp bead is then overheated and fails. The pins 3 are connected to the circumferential side of the lamp bead pad 1 in the present application, and the pins 3 are connected to the circuit board by being bent outwardly. On the one hand, the contact area of the pins 3 and the pad is increased. On the other hand, when the pins 3 need to be repaired due to problems such as virtual welding, the pins 3 are heated by the heating device, and since the lamp bead is relatively far from the pins 3, the temperature of the lamp bead increases relatively slowly during this process, thereby reducing the risk of failure due to overheating of the lamp bead.

[0042] In some preferred embodiments, as shown in the drawings, Figure 1 The pins 3 are mounted at one end of the lamp bead pad 1, and the other end is bent outwardly of the lamp bead pad 1 to form a connecting patch 31, and the projection area of the connecting patch 31 in the direction perpendicular to the circuit board is greater than the projection area of the pins 3 in the direction perpendicular to the circuit board.

[0043] It can be understood that the applicant finds that the factors affecting the insufficient bonding force of the lamp bead and the circuit board include the unevenness of the lamp bead pin 3 and the small contact area of the pin 3 with the circuit board. The application bends the pin 3 part into a connecting patch 31. The structure of the connecting patch 31 is flat and can be attached to the circuit board. At the same time, the projection area of the connecting patch 31 in the direction perpendicular to the circuit board is larger than the projection area of the pin 3 in the direction perpendicular to the circuit board. The contact area of the connecting patch 31 with the circuit board is large, so that the bonding of the lamp bead and the circuit board is more firm.

[0044] The application provides a specific embodiment as shown in Figure 3 The upper surface of the lamp bead pad 1 is square, and one of the four sides of the lamp bead pad 1 is provided with one of the pins 3. Further, the four connecting points of the four pins 3 for connecting with the circuit board are symmetrically arranged with the lamp bead pad 1 as the center, and the four pins 3 are uniformly distributed in the circumferential direction of the lamp bead pad 1. The four pins 3 include a first pin (R-pole), a second pin (common anode), a third pin (B-pole) and a fourth pin (G-pole).

[0045] It can be understood that the lamp bead pad 1 is square, and one of the four sides is provided with one of the pins 3 to jointly solve the problem of inconsistent left and right thrust and up and down thrust of the lamp bead, and increase the balance of the lamp bead.

[0046] Further, as shown in Figure 5 The pin 3 can be bent multiple times, at least part of the pin 3 is attached to the side of the lamp bead pad 1, and the other part is bent outward to be used for connecting with the circuit board.

[0047] It is worth noting that the pin 3 can be bent to increase the contact area with the lamp bead and the circuit board.

[0048] In some specific embodiments, the lamp bead pad 1 is mounted with a red light chip 21, a green light chip 22 and a blue light chip 23. In the application scheme, the way of mounting the chip on the lamp bead pad 1 includes a normal chip and a flip chip.

[0049] In the first alternative embodiment of the application, as shown in Figure 1 In this embodiment, the lamp bead pad 1 installs the red light chip 21, the green light chip 22 and the blue light chip 23 in a normal way.

[0050] It should be noted that the normal chip means that the light emitting surface of the chip is upward and fixed on the lamp bead pad 1, and the production process is relatively simple and the cost is low.

[0051] In the second alternative embodiment of the application, as shown in Figure 2 In this embodiment, the lamp bead pad 1 installs the red light chip 21, the green light chip 22 and the blue light chip 23 in a flip way.

[0052] It is worth mentioning that the flip chip is to fix the light-emitting surface of the chip downward on the lamp bead pad 1. The LED support structure made by the flip chip in this embodiment has lower resistance and higher current density, which is suitable for high-power applications. At the same time, it has better heat dissipation performance.

[0053] In combination with the above-mentioned second alternative embodiment using the flip chip, in an embodiment of the present application, the upper surface of the lamp bead pad 1 is square, and each of the four sides of the lamp bead pad 1 is provided with one of the pins 3. Further, the connection points on the four pins 3 for connecting with the circuit board are arranged symmetrically in pairs with the lamp bead pad 1 as the center, and the four pins 3 are uniformly distributed in the circumferential direction of the lamp bead pad 1. The four pins 3 include a first pin (R-pole), a second pin (common anode), a third pin (B-pole), and a fourth pin (G-pole).

[0054] Further, as shown in Figure 5 In the above-mentioned embodiment using the flip chip, the pin 3 can be bent multiple times, at least part of the pin 3 is attached to the side of the lamp bead pad 1, and the other part is bent outward to be connected with the circuit board.

[0055] In a second aspect, the present application provides a preparation method of the LED support structure, which comprises the following steps:

[0056] Step S1, punching and electroplating a metal strip to form a metal pressing plate 4, and injection molding the metal pressing plate 4 to form an empty support.

[0057] Specifically, the above-mentioned step S1 includes:

[0058] Step S1a, punching the metal strip to form at least one metal pressing plate 4, and each of the metal pressing plates 4 is provided with four pins 3.

[0059] For step S1a, the present application provides an alternative embodiment, which includes: punching the metal strip to form a plurality of metal pressing plates 4, and the plurality of metal pressing plates 4 are connected as a whole, and at least one pin 3 on each of the metal pressing plates 4 is connected with the pin 3 on the adjacent another metal pressing plate 4.

[0060] Further, in an embodiment of the present application, Figure 6 As shown in Figure 6 It is worth mentioning that,

[0061] It is worth noting that in the related art, the LED support of each lamp bead needs to be fixed by setting a clamping point on the side of the lamp bead pad 1 without a pin 3, so that the pin 3 can be cut off and bent. Otherwise, the lamp bead will fall off, which will cause the die bonding and wire bonding and packaging to fail. In the embodiment of the present application, the pins 3 are uniformly arranged on the circumferential side of the lamp bead pad 1. Therefore, the side of the lamp bead pad 1 does not have a clamping point for fixing the lamp bead. At this time, if the pin 3 is cut off, the lamp bead support will directly fall off and cannot be packaged subsequently. Therefore, in the above embodiment, the pins 3 on the metal pressing plate 4 of the adjacent lamp beads are connected to each other, and the plurality of pins 3 are connected to each other, so that a plurality of lamp beads form a whole, which ensures that the lamp beads will not break and will not fall off when bent.

[0062] Step S1b, electroplating the metal pressing plate 4.

[0063] Step S1c, integrally forming a cup structure by injection molding the metal pressing plate 4 and the glue.

[0064] Specifically, PPA glue (polyphthalamide) is integrally injection molded to form a cup structure. Further, when there are a plurality of connected metal pressing plates 4, a plurality of cup structures are integrally formed by injection molding the plurality of metal pressing plates 4 and the glue.

[0065] It should be noted that the pins 3 on the metal pressing plate 4 do not need to be injection molded in the above injection molding step.

[0066] Step S1d, silk printing the cup structure to form an empty support.

[0067] Specifically, for white light, a silk printing process can be used to brush ink on five surfaces (black light does not need this process), and finally an empty support is formed. It should be noted that the silk printing process refers to the text, symbols or patterns printed on the support by silk screen printing technology.

[0068] Step S2, packaging the empty support and bending the pin 3 to make the pin 3 bend outward of the lamp bead pad 1.

[0069] In the first embodiment of step S2 of the present application, die bonding, wire bonding (flip chip structure does not need this process), and packaging are performed on the empty support. The lamp bead support structure before bending is shown in FIG. 8. Subsequently, the pin 3 is bent. Figure 4

[0070] In the second embodiment of step S2 of the present application, the pin 3 is bent first, and then the die bonding, wire bonding, and packaging processes are performed.

[0071] It is worth noting that the sequence of the two embodiments of the above step S2 will not affect the preparation of the LED support, and the assembly personnel can choose the appropriate embodiment according to the actual production conditions.​

[0072] Specifically, the cross-sectional view of the single lamp bead support after the bending step of pin 3 is shown in Figure 5 Figure 4 Figure 5 As can be clearly understood by comparison, the contact area between pin 3 and lamp bead pad 1 after bending is larger, greatly improving the combination effect of the two.

[0073] In some preferred embodiments, the pin 3 of the present application can be bent multiple times, with at least part of the pin 3 adhering to the side of the lamp bead pad 1, and the other part being bent outward to connect with the circuit board.

[0074] It is worth noting that the pin 3 can be bent to increase the contact area with the lamp bead and the circuit board at the same time, step S3, and the packaged support structure is punched to form an LED support.

[0075] Specifically, the excess metal strip on the plurality of support structures is punched, and the two pins 3 connected to each other on the adjacent support structures are separated to form a plurality of independent LED supports.

[0076] It can be understood that after the packaging process is completed, the two connected pins 3 on the adjacent lamp bead empty support can be cut off to separate the adjacent lamp bead empty support and form an LED support of multiple independent lamp beads. Further, Figure 6 The dashed part between the four metal pressing plates 4 in the middle is the position of the metal strip that needs to be punched during step S3.

[0077] Further, after the punching is completed, an LED support of a single lamp bead is formed, and after testing, banding, packaging and other processes, the preparation of the LED lamp bead can be completed.

[0078] In summary, the present application increases the balance of the lamp bead by arranging the pins uniformly around the circumference of the lamp bead pad, solves the problem of inconsistent left and right thrust and up and down thrust, and has a better combination effect with the PCB. Further, the pins of the present application are connected to the circumferential side of the lamp bead pad, and the pins are bent outward to connect with the circuit board. On the one hand, the contact area between the pins and the pads is increased. On the other hand, when the pins need to be repaired due to problems such as virtual welding, heating the pins using a heating device will not cause the lamp bead to overheat, thereby reducing the risk of failure of the lamp bead due to the temperature being too high caused by the heating device.

[0079] ​​In the description of the present application, it should be noted that the terms "upper", "lower", and the like are used for indicating the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. Unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0080] It should be noted that in the present application, relational terms such as "first" and "second" and the like are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0081] The above is only a specific embodiment of the present application, which enables those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features applied herein.

Claims

1. A method of manufacturing an LED holder, characterized by, The application relates to an LED support structure comprising: a lamp bead pad (1) for mounting at least one chip (2); a plurality of pins (3) mounted on one end of the lamp bead pad (1) and bent outwards on the other end of the lamp bead pad (1), and the plurality of pins (3) are uniformly distributed on the circumferential side of the lamp bead pad (1); the preparation method comprises: step S1: stamping and electroplating a metal strip provided with pins (3) to form a metal pressing plate (4), and injection molding the metal pressing plate (4) to form an empty support; step S2: packaging the empty support and bending the pins (3) so that the pins (3) are bent outwards on the lamp bead pad (1) of the support structure; step S3: punching the packaged support structure to form an LED support; the pin (3) is bent, comprising: the pin (3) is bent multiple times so that at least part of the pin (3) is attached to the side of the lamp bead pad (1), and the other part is bent outwards and used to connect with a circuit board; the metal strip provided with the pin (3) is stamped, comprising: stamping the metal strip to form at least one metal pressing plate (4), and the metal pressing plate (4) is provided with four pins (3); the metal strip is stamped to form at least one metal pressing plate (4), comprising: stamping the metal strip to form a plurality of metal pressing plates (4), and the plurality of metal pressing plates (4) are connected as a whole, and at least one pin (3) on each metal pressing plate (4) is connected with a pin (3) on an adjacent metal pressing plate (4).

2. The method of claim 1, wherein: One end of the pin (3) is mounted on the lamp bead pad (1), and the other end is bent outwards on the lamp bead pad (1) to form a connecting patch (31), and the projection area of the connecting patch (31) in the direction perpendicular to the circuit board is greater than the projection area of the pin (3) in the direction perpendicular to the circuit board.

3. The method of claim 1, wherein: The upper surface of the lamp bead pad (1) is square, and one pin (3) is arranged on each of the four sides of the lamp bead pad (1).

4. The method for preparing the LED bracket as described in claim 3, characterized in that: The connecting points for connecting with the circuit board on the four pins (3) are symmetrically arranged with the lamp bead pad (1) as the center.

5. The method for preparing the LED bracket as described in claim 1, characterized in that, The metal pressing plate (4) is injection molded to form an empty support, comprising: a plurality of metal pressing plates (4) and a gel are integrally formed into a plurality of cup body structures through injection molding; the plurality of cup body structures are silk-screened to form a plurality of empty supports.

6. The method for preparing the LED bracket as described in claim 5, characterized in that, the packaged support structure is punched to form an LED support, comprising: the excess metal strip on the plurality of packaged support structures is punched, and two pins (3) connected with each other on adjacent support structures are separated to form a plurality of independent LED supports.

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