A device for independent temperature control testing of batch memory sticks

Abstract

The present invention belongs to the field of memory testing technology, and specifically relates to a device for independent temperature control testing of batch memory sticks, comprising a test mainboard provided with a plurality of memory stick test stations arranged in parallel; the memory stick test stations are used to install the memory sticks to be tested; a plurality of temperature regulating plates are in the shape of flat strips and are arranged alternately with the plurality of memory stick test stations; temperature regulating elements are provided on opposite sides of the temperature regulating plates, and after the memory sticks are installed, the temperature regulating elements are close to the memory chips of the memory sticks and can regulate their temperature; the temperature regulating elements are electric heating films or cooling elements. In this solution, the temperature regulating plates are placed on both sides of the memory slots so that the temperature regulating plates are close to the memory chips on the memory sticks, and the temperature of the memory chips is controlled quickly, evenly and accurately; the memory stick guide blocks improve the positioning accuracy of the memory sticks, and the memory sticks can still be normally plugged in and out when the distance between the memory sticks and the temperature regulating plates is very small; the temperature regulating plates use PCB boards as support structures and replace cables, while reducing the overall thickness of the temperature regulating plates.

Description

Technical Field

[0001] The present invention belongs to the technical field of memory testing, and in particular relates to a device for independent temperature control testing of batch memory sticks. Background Art

[0002] During the production process, memory modules often need to be tested before shipment. These modules are inserted into the memory slots of a dedicated test motherboard. Test motherboards come in various configurations and may consist of multiple boards. These motherboards typically have multiple memory slots arranged side by side, allowing for simultaneous testing of multiple memory modules.

[0003] Since memory chips often perform differently at different temperatures, the memory stick test process often needs to control the memory stick to different temperatures. At the same time, since memory chips are sensitive to temperature, the more precise the control of the memory stick temperature during the memory stick test, the more beneficial it is for the test (the test temperature range is approximately -20℃ ~ 100℃).

[0004] On existing test motherboards, memory slots are closely arranged on the test motherboard and frequently need to be plugged in and out for replacement, making direct heat transfer difficult. Therefore, the temperature of the memory sticks is generally controlled by controlling the ambient temperature. That is, during testing, the memory sticks are generally placed in a temperature-controlled incubator, and the temperature adjustment during testing is achieved by controlling the temperature inside the incubator.

[0005] One existing incubator solution uses an open-bottomed heating hood positioned over the memory slot area of ​​the test motherboard. The bottom of the hood contacts the test motherboard, forming a nearly sealed cavity. A heating element is located within the hood, which heats the memory modules through radiant heat. A disadvantage of this radiant heating method is that the distance between the heating element and the memory modules varies, resulting in uneven temperatures.

[0006] Another existing incubator solution involves placing an open temperature-controlled hood over the memory slot area of ​​the test motherboard. The bottom of the hood contacts the test motherboard, forming a nearly sealed cavity. Hot (cold) air can be introduced into the cavity, or a fan or other device can be installed inside the cavity to circulate the air, heating (cooling) the memory modules through convection. However, due to the uncontrollable air flow within the incubator, the temperature control accuracy and temperature uniformity are relatively low.

[0007] A third existing incubator solution involves placing one or more test motherboards entirely inside the incubator. These motherboards are electrically connected to the outside of the incubator via connectors, and air circulation inside the incubator controls the overall ambient temperature. This solution allows for simultaneous testing of multiple memory modules, but due to the large internal space and convection heat transfer, temperature control accuracy and uniformity are limited.

[0008] This solution is designed based on the problem that the existing temperature box heating memory sticks has uneven heating of different parts of the memory stick and low hole position accuracy. Summary of the Invention

[0009] In order to solve the above problems existing in the prior art, the present invention provides a device for independent temperature control testing of batch memory modules.

[0010] The technical solution adopted in the present invention is:

[0011] A device for independent temperature control testing of batch memory modules, comprising:

[0012] The test motherboard is provided with a plurality of memory stick test stations arranged in parallel with each other; the memory stick test stations are used to install the memory sticks to be tested;

[0013] And multiple temperature regulating plates are in the form of flat strips and are arranged alternately with multiple memory stick test stations; independent temperature regulating elements are provided on opposite sides of the temperature regulating plates to independently control the temperature and improve the temperature control accuracy. After the memory stick is installed, the temperature regulating element is close to the memory chip of the memory stick and can regulate its temperature; the temperature regulating element is a heating element or a cooling element.

[0014] As an alternative or supplement to the above-mentioned independent temperature control device for the memory stick: the temperature control plate includes a temperature control PCB board, a temperature control element, and a heat sink; the temperature control elements are attached to both sides of the temperature control PCB board, and the heat sink is attached to the outside of the temperature control element.

[0015] As an alternative or supplement to the above-mentioned independent temperature control device of the memory stick: an electrical connection device for electrically connecting to the test motherboard is provided at the end of the temperature control plate, and the electrical connection device includes a gold finger, a connector, a pin header or a welding point; each temperature control element has multiple temperature control zones. When the temperature control element adopts an electric heating film, each temperature control zone is provided with a mutually independent heating wire, and the heating wire is electrically connected to different solder pads provided on the temperature control PCB board of the temperature control plate.

[0016] As an alternative or supplement to the above-mentioned independent temperature control device for the memory stick: a temperature control circuit is provided on the test mainboard, and the temperature control circuit can adjust the power or opening and closing frequency of the temperature regulating element.

[0017] As an alternative or supplement to the above-mentioned independent temperature control device of the memory stick: a temperature sensor is provided on the temperature regulating plate, and an avoidance hole is provided at the position of the temperature sensor corresponding to the temperature regulating element. The temperature value measured by the temperature sensor on the temperature regulating plate and / or the temperature sensor of the memory stick is used to feedback control the power of the temperature regulating element.

[0018] As an alternative or supplement to the above-mentioned independent temperature control device for the memory stick: the distance between the temperature control element and the memory chip is 1-3 mm.

[0019] As an alternative or supplement to the above-mentioned independent temperature control device for memory sticks: memory stick guide blocks are respectively provided at both ends of the memory stick slot at each memory stick test station, and the memory stick guide blocks are used to position the memory stick when inserting and removing the memory stick from the memory stick slot.

[0020] As an alternative or supplement to the above-mentioned independent temperature control device for the memory stick: a positioning plate parallel to the test mainboard is provided above the memory stick guide block; there is a gap between the memory stick guide blocks for the temperature regulating plate to be inserted, and a positioning groove is provided on the positioning plate, each gap is correspondingly provided directly below the positioning groove, and the positioning groove is used for the insertion of the upper edge of the temperature regulating plate.

[0021] As an alternative or supplement to the above-mentioned independent temperature control device for the memory stick: a button and a slot ear buckle are provided on the memory stick guide block, the middle part of the slot ear buckle is rotatably connected to the memory stick guide block, the button is slidably placed vertically on the memory stick guide block, one end of the slot ear buckle extends to the bottom of the button, and the other end of the slot ear buckle extends to the bottom of the end of the memory stick test station, so that when the button moves downward, the slot ear buckle can push the end of the memory stick upward.

[0022] A temperature control method for a memory module independent temperature control device is characterized by the following steps:

[0023] S1: insert the memory stick into the memory stick test station and heat or cool it by the thermostat after power is turned on;

[0024] S2: The temperature sensor provided on the temperature regulating plate detects the temperature in real time;

[0025] S3: The controller compares the detection value of the temperature sensor with the preset value to control the power on and off and the power of the thermostat; when the thermostat has multiple thermostat zones, different thermostat zones are controlled separately.

[0026] The beneficial effects of the present invention are:

[0027] 1. In this solution, the temperature control plates are placed on both sides of the memory slots, so that the temperature control plates can be close to the memory chips on the memory stick, thereby achieving fast and uniform temperature control of the memory chips;

[0028] 2. The memory module guide block in this solution not only guides the memory module during insertion, but also secures the temperature control plate, preventing the memory module from colliding with the heating element and reducing the distance between the memory module and the heating element.

[0029] 3. The thermostat uses a PCB as its support structure instead of cables. The PI electric heating film and temperature sensor are directly placed on the thermostat PCB, which allows for flexible placement and a smaller overall thickness. By increasing the number of temperature sensors, the temperature of each part of the memory module can be measured more accurately. Furthermore, the temperature sensor and thermostat element (heating wire, etc.) can be placed at the corresponding memory chip location to improve temperature measurement accuracy.

[0030] 4. The electrical connection between the temperature control PCB and the test mainboard adopts the combination of gold fingers and slots, which replaces the cable connection, improves reliability, and compresses the space occupied by cables, makes the slot arrangement more compact, and enables the temperature control plate to be quickly removed for easy maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of this solution or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art.

[0032] Figure 1 This is a schematic diagram of the structure of the device used for independent temperature control testing of batch memory modules in this solution;

[0033] Figure 2 It is a structural diagram of the temperature regulating plate;

[0034] Figure 3 This is a diagram of the button and slot ear buckle matching;

[0035] Figure 4 This is an example diagram of the structure of the electric heating film.

[0036] In the figure: 1-test mainboard; 2-temperature control circuit; 3-heating block slot; 4-temperature regulating plate; 41-temperature sensor; 42-electric heating film; 421-electric heating film welding pad; 422-heating wire; 43-temperature regulating PCB board; 44-gold finger; 5-memory slot; 6-memory module guide block; 7-first positioning plate; 8-second positioning plate; 9-button; 10-slot ear buckle. DETAILED DESCRIPTION

[0037] The technical solution in this embodiment will be clearly and completely described below in conjunction with the accompanying drawings. The described embodiments are only a part of the embodiments, not all of them. Based on the embodiments in this solution, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this solution.

[0038] Example 1

[0039] like Figures 1 to 4As shown, this embodiment designs a device for independent temperature control testing of batch memory sticks, including a test motherboard 1, a temperature regulating plate 4, a memory stick guide block 6, a button 9, a slot ear buckle 10, a positioning plate and other components.

[0040] The test motherboard 1 includes multiple parallel memory stick test stations; each station is equipped with a memory slot 5 for installing and testing a memory stick. Furthermore, the test motherboard 1 is equipped with a temperature control circuit 2, switches, and components for testing memory stick functionality. The number of memory stick test stations can be determined based on the number of memory sticks to be tested, typically ranging from 2 to 32.

[0041] Memory slot 5 typically consists of an injection-molded housing and several spring clips. The central portion of the housing has a slot for inserting the memory module. The spring clips are fixed in two rows on either side of the slot, corresponding to the number of gold fingers on the memory module. One end of the spring clip contacts the gold fingers on the memory module, while the other end contacts the contacts on the test motherboard 1. Memory slot 5 is secured to test motherboard 1 using screws or other means. Once secured, the spring clips create electrical contact with test motherboard 1, establishing an electrical connection between test motherboard 1 and memory slot 5.

[0042] In addition to using industrial-grade, pluggable slots that are detachably connected to the test motherboard 1 via screws, memory slots 5 can also use standard slots soldered onto the motherboard. Standard slots are smaller than industrial-grade slots, can be more closely spaced on the motherboard, and are less expensive.

[0043] There are temperature regulating plates 4 on opposite sides of each memory stick test station. When the memory stick is inserted into the memory stick test station, the temperature regulating plates 4 can be close to the memory chip on the surface of the memory stick, generally 1-3 mm.

[0044] The temperature control plate 4 includes components such as a temperature control PCB board 43, an electric heating film 42, a temperature sensor 41, and a heat sink. The temperature control PCB board 43 is in the shape of an elongated strip. A gold finger 44 is provided at the end of each temperature control PCB board 43. A heating block slot 3 is correspondingly provided on the test main board 1. When the temperature control PCB board 43 is placed on both sides of the memory stick test station, the gold finger 44 is plugged and connected to the heating block slot 3 on the test main board 1. The heat sink can be made of a material with high thermal conductivity such as copper or aluminum. In addition, the specific shape of the heat sink can be a sheet, or a structure with a serrated surface, or an uneven surface, or a structure with fins on the surface, so as to increase the surface area of ​​the heat sink and improve the heat dissipation efficiency.

[0045] The two sides of the temperature control PCB board 43 are respectively fixed with electric heating films 42, and the electric heating films 42 on both sides independently heat the memory sticks of two different memory stick test stations. One or more temperature sensors 41 are provided on the temperature control PCB board 43 for detecting the temperature on both sides of the memory stick as feedback values ​​for temperature control. The electric heating film 42 is provided with avoidance holes corresponding to the positions of the temperature sensors 41 to separate the temperature sensors 41 from the electric heating film 42. The temperature sensor 41 is connected to the temperature control circuit 2 through an analog-to-digital conversion circuit. The temperature control circuit 2 controls the heating power and switching frequency of the electric heating film 42 according to the temperature values ​​measured by the temperature sensor 41 on the temperature control chip, the temperature sensor of the memory stick, and the temperature sensors in other temperature control areas. A pair or more electric heating film pads 421 for supplying power to the electric heating film 42 are provided on the temperature control PCB board 43, see Figure 4 , used to electrically connect the heating wires 422 of the electric heating film 42. The number of heating wires 422 determines the precise temperature control of a specific area on the memory module; the density of heating wires 422 determines the heating intensity of a specific area on the memory module. The multiple pairs of heating wires 422 enable zoned temperature control of the memory module, improving temperature control precision and, in turn, the accuracy of memory module testing. The temperature control PCB 43 is equipped with gold fingers for electrical connection to the connector. The electric heating film 42 can be a PI electric heating film 42, which is composed of a PI film and a heating wire 422. The heating wire 422 can be distributed in an S-shape on the PI film. Multiple temperature control zones can be preset on the PI electric heating film 42, each of which is provided with a heating wire 422. The position of the temperature control zone can correspond to a memory chip or multiple memory chips on the same side of a single memory stick. The two ends of the heating wire 422 are connected to the electric heating film pad 421 at the end of the electric heating film to facilitate welding connection to the pad of the temperature control PCB board 43. Different heating wires 422 can achieve independent temperature control, realizing zoned temperature control on a single temperature control sheet 4, thereby realizing independent temperature control of different chips in the memory stick, and performance testing after independent temperature control. Similarly, the cooling element can also be set with different temperature control zones.

[0046] like Figure 4As shown, two temperature control zones, A and B, can be set up to achieve dual-zone temperature control. In this structure, two heating wires 422 are installed within the heating film, evenly spaced on the left and right sides of the heating film. Each end of the heating wire 422 is connected to a corresponding electric heating film pad 421 for soldering to the corresponding pad on the PCB. The heating wire 422 is electrically connected to the temperature control circuit via the temperature control PCB board 43 and the test motherboard. The temperature control circuit controls the heating power of the two heating zones of the heating film by controlling the switching frequency of the power supply of the two heating wires 422 on the heating film, thereby achieving zoned temperature control within a single heating film. Similarly, the number of temperature control zones for a single heating film can be increased to three, four, or even more, thereby improving the temperature control accuracy of the memory module by increasing the number of temperature control zones. It should be noted that the heating wire 422 does not refer to a metal wire used for electrical conduction. According to the manufacturing process of the heating film, the heating wire 422 is formed by etching copper foil, using a common industry process and will not be described in detail here.

[0047] In addition, the PI electric heating film 42 can also be replaced by other temperature control elements, for example: replacing the PI electric heating film 42 with a cooling element; or, the PI electric heating film 42 and the cooling element can be installed on the temperature control PCB board 43 at the same time, so as to use the cooling element to cool the memory chip to achieve low temperature control.

[0048] The test main board 1 is provided with a temperature control circuit 2 , which supplies power to the electric heating film 42 through a temperature adjustment PCB board 43 and controls the heating power of the electric heating film 42 accordingly.

[0049] Memory stick guide blocks 6 are provided at both ends of each heating block slot 3, and guide grooves are provided on the opposite sides of the memory stick guide blocks 6 at both ends of the same heating block slot 3. The ends of the memory stick guide blocks 6 can be inserted into the guide grooves to guide the insertion or removal of the memory stick using the memory stick guide blocks 6. During the insertion of the memory stick into the memory slot 5, the memory slot 5 is positioned and aligned by the guide grooves. The height of the guide groove of the memory stick guide block 6 is higher than the height of the thermostat 4. When inserting the memory stick, the memory stick first contacts the guide groove and then goes down between the thermostats 4. When there are two or more memory slots 5, there is a gap between the memory stick guide blocks 6 on adjacent memory slots 5, which can accommodate the installation of the thermostat 4 and also realize the limitation of the thermostat 4.

[0050] A positioning plate parallel to the test motherboard is provided above the memory stick guide block 6. The positioning plate is fixed by screws or other means. The memory stick guide block 6 and the positioning plate cooperate to fix the thermostat 4. The positioning plate includes a first positioning plate 7 and a second positioning plate 8, which respectively fix the two ends of the thermostat 4. The number of positioning plates and memory stick guide blocks 6 is one-to-many, that is, one positioning plate can cover the tops of multiple memory stick guide blocks 6. Positioning grooves are provided on the positioning plate corresponding to the gaps between the memory stick guide blocks 6, so that the upper edge of the end of the thermostat 4 can be snapped into the positioning groove. The positioning plate restricts the position of the thermostat 4 through the positioning groove. At the same time, the end of the thermostat 4 is also snapped between adjacent memory stick guide blocks 6. The thermostat 4 in this embodiment can be quickly replaced. After removing the positioning plate of the thermostat 4, the thermostat 4 can be directly plugged in and out.

[0051] The memory module guide block 6 is provided with a button 9 and a slot tab 10. The middle portion of the slot tab 10 is rotatably connected to the memory module guide block 6. The button 9 is slidably positioned vertically on the memory module guide block 6. One end of the slot tab 10 extends below the button 9, and the other end extends below the end of the memory module testing station. When the button 9 is moved downward, the slot tab 10 can lift the end of the memory module upward. When the operator presses down the two buttons 9 corresponding to the first positioning plate 7 and the second positioning plate 8, the two buttons 9 respectively press down one end of the slot tab 10 and lift the other end of the corresponding slot tab 10 upward, thereby lifting the two ends of the memory module and removing it from the memory slot 5. When the memory module is inserted, the other end of the slot tab 10 presses under the memory module. When removing the memory module, simply press the tab to make the memory module pop up. A torsion spring is installed at the pivoting connection between slot tab 10 and memory slot 5, keeping the other end of slot tab 10 in the highest position when no memory stick is inserted. Button 9 above the other end of slot tab 10 is restrained within a positioning block, allowing for free vertical movement. When button 9 is pressed, it moves downward, driving slot tab 10 downward and ejecting the memory stick.

[0052] The temperature sensor 41 and the PI heating film (i.e., electric heating film or PI electric heating film) are both electrically connected to the temperature control circuit on the test mainboard 1. When the expected temperature is given, the temperature control circuit supplies power to the PI heating film to make it generate heat. The temperature sensor 41 provides real-time feedback on the temperature data surrounding the memory stick. When the temperature surrounding the memory stick reaches the expected temperature, the temperature control circuit stops supplying power to the PI heating film. The temperature control circuit then adjusts the opening and closing or power of the PI heating film according to the temperature value fed back by the temperature sensor 41, thereby stabilizing the temperature at the expected temperature. When multiple memory sticks are tested at the same time, the temperature control circuit can independently control the PI heating films on both sides of each memory stick based on the temperature data fed back by the temperature sensors 41 on both sides of each memory stick, thereby achieving independent temperature control of each memory stick. When the PI heating film has two or more temperature control zones, the temperature control circuit can independently control the corresponding temperature control zones based on the data fed back by the temperature sensors 41 corresponding to each temperature control zone, thereby achieving precise temperature control of each area of ​​the memory stick. Specifically: a controller such as a single-chip microcomputer or MCU can be set on the test mainboard 1. When the detection module composed of the temperature sensor 41 detects the temperature value, the controller records the real-time data and compares it with the preset temperature value. After comparison, the temperature control circuit is fed back to control the temperature. The PI heating film at the installation position of the temperature sensor 41 is heated. Specifically, the temperature of different temperature adjustment zones of the PI heating film can be controlled separately.

[0053] The above embodiments are merely examples for the purpose of illustrating the present invention clearly and are not intended to limit the embodiments. It is not necessary and impossible to enumerate all embodiments here. Obvious changes or modifications derived therefrom are still within the scope of protection of this technology.

Claims

1. A device for independent temperature control testing of batch memory modules, characterized by: include: A test motherboard (1) is provided with a plurality of memory bar test stations arranged in parallel with each other; the memory bar test stations are used to install memory bars to be tested; and a plurality of temperature regulating plates (4) in the form of flat strips, which are arranged alternately with the plurality of memory stick test stations; independent temperature regulating elements are provided on opposite sides of the temperature regulating plates (4) to independently control the temperature and improve the temperature control accuracy; after the memory stick is installed, the temperature regulating elements are close to the memory chips of the memory stick and can regulate the temperature thereof; the temperature regulating elements are heating elements or cooling elements; The end of the temperature regulating plate (4) is provided with an electrical connection device for electrically connecting to the test mainboard (1), and the electrical connection device includes a gold finger (44), a connector, a pin header or a welding point; each temperature regulating element has a plurality of temperature regulating partitions, and when the temperature regulating element adopts an electric heating film, each temperature regulating partition is provided with a mutually independent heating wire (422), and the heating wire (422) is electrically connected to different solder pads provided on the temperature regulating PCB board (43) of the temperature regulating plate (4); The test mainboard (1) is provided with a temperature control circuit (2), and the temperature control circuit (2) is capable of adjusting the power or the opening and closing frequency of the temperature regulating element; the temperature regulating plate is provided with a temperature sensor (41), and a avoidance hole is provided at the position of the temperature regulating element corresponding to the temperature sensor (41), and the temperature value measured by the temperature sensor (41) on the temperature regulating plate and / or the temperature sensor of the memory module is used to perform feedback control on the power of the temperature regulating element; The distance between the temperature regulating element and the memory chip is 1-3 mm.

2. The device for independent temperature control testing of batch memory modules according to claim 1, characterized in that: The temperature control sheet includes a temperature control PCB board, a temperature control element, and a heat sink. The temperature control elements are attached to both sides of the temperature control PCB board, and the heat sink is attached to the outside of the temperature control element.

3. The device for independent temperature control testing of batch memory modules according to claim 1 or 2, characterized in that: Memory bar guide blocks (6) are respectively provided at both ends of the memory bar slot (5) at each memory bar test station, and the memory bar guide blocks (6) are used for positioning the memory bar when inserting or removing the memory bar from the memory bar slot (5).

4. The device for independent temperature control testing of batch memory modules according to claim 3, characterized in that: A positioning plate parallel to the test mainboard is provided above the memory bar guide block (6); a gap for the temperature regulating plate (4) to be snapped in is provided between the memory bar guide blocks (6); a positioning groove is provided on the positioning plate, each gap being correspondingly provided directly below the positioning groove, and the positioning groove is used for snapping in the upper edge of the temperature regulating plate (4).

5. The device for independent temperature control testing of batch memory modules according to claim 4, characterized in that: The memory stick guide block (6) is provided with a button (9) and a slot ear button (10), the middle portion of the slot ear button (10) is rotatably connected to the memory stick guide block (6), the button (9) is slidably placed vertically on the memory stick guide block (6), one end of the slot ear button (10) extends below the button (9), and the other end of the slot ear button (10) extends below the end of the memory stick test station, so that when the button (9) moves downward, the slot ear button (10) can push the end of the memory stick upward.

6. The temperature control method of the independent temperature control device for a memory stick according to any one of claims 1 to 2, characterized in that: Here are the steps: S1: inserting the memory stick into the memory stick test station and heating or cooling the memory stick by the thermostat (4) after power is turned on; S2: The temperature sensor provided on the temperature regulating plate (4) detects the temperature regulating temperature in real time; S3: The controller compares the detection value of the temperature sensor with the preset value to control the on / off power and the electric power of the temperature regulating plate (4); when the temperature regulating plate (4) has multiple temperature regulating zones, the different temperature regulating zones are controlled separately.

Images