A multi-lane SMP blind-mate device and method

Abstract

The specification relates to the technical field of antenna radio frequency, and particularly relates to a multi-channel SMP blind insertion device, which comprises a TR component mounting plate, a push-in coaxial radio frequency connector SMP is welded on the TR component mounting plate, and a first positioning pin is arranged on the insertion surface of the TR component mounting plate, the TR component mounting plate is inserted into a power divider plate and a liquid cooling pressing plate through the first positioning pin; the liquid cooling pressing plate is provided with a reserved hole for placing 128 groups of female-female connectors; a guide pressing plate is connected with the liquid cooling pressing plate, and each female-female radio frequency connector KK in the 128 groups of female-female connectors is positionally calibrated, and the target tolerance after the female-female radio frequency connector KK is connected is determined; an antenna subarray welding plate is provided with a second positioning pin, the antenna subarray welding plate is aligned with the guide pressing plate based on the second positioning pin, and the antenna subarray welding plate is inserted into the power divider plate and the liquid cooling pressing plate. The limiting liquid cooling plate and the guide pressing plate are introduced between the two plates, the position tolerance between the female-female connectors is constrained through the limiting liquid cooling plate and the guide pressing plate, which is beneficial to reducing the blind insertion risk, and improving the blind insertion efficiency and the maintenance efficiency.

Description

Technical Field

[0001] This specification relates to the field of antenna radio frequency technology, and in particular to a multi-channel SMP blind plug-in device. Background Art

[0002] The spacing between high-frequency phased array antennas determines that the thickness of the multi-channel digital sub-array unit is very small. Due to the strict weight limit, the sub-array unit is required to be as small as possible in three dimensions, and the internal high-integration design comes into being.

[0003] To achieve a highly integrated and miniaturized design of the sub-array units while taking into account maintainability, the microwave modules within the sub-array units all adopt a blind-plug interconnection method. The RF connectors involve both vertical and horizontal dimensions. It is necessary to control tolerances to ensure smooth assembly while fully considering electrical performance and electromagnetic compatibility. It is necessary to ensure not only good blind-plug contact but also easy maintenance.

[0004] An existing blind-mating tooling design method for 64-channel T / R component connectors employs a technical solution: a tooling design comprising a positioning post, a limiting plate, a pad, and a pin. The positioning post is used to position the connector and is placed in a circular hole in the limiting plate. When sintering a JSSMP-L connector, a pad is placed under the limiting plate to support the positioning post. When sintering an antenna board connector, a JSSMP-S connector, a pad is placed on the limiting plate to provide pressure for connector sintering. The soaker board (or antenna board) is connected to the pad and limiting plate via pins. However, this tooling is only used for sintering positioning of a single welding board, and the positioning pins must be inserted one by one into the positioning tooling before the SMP to be sintered is inserted into the welding board for mating. The assembly process is cumbersome and can only meet the sintering position accuracy of a single welding board connector, but cannot meet the blind-mating interconnection accuracy requirements of two 128-channel SMP-J connector boards via SMP-KK.

[0005] In view of this, how to reduce the risk of blind plugging of 128-channel connectors while improving blind plugging efficiency and maintenance efficiency has become a technical problem that needs to be solved urgently. Summary of the Invention

[0006] In view of this, embodiments of this specification provide a multi-channel SMP blind plugging device. One or more embodiments of this specification also relate to a multi-channel SMP blind plugging method to address technical deficiencies in the prior art.

[0007] According to a first aspect of an embodiment of this specification, a multi-channel SMP blind-mating device is provided, comprising:

[0008] The TR component mounting plate is welded with a push-in coaxial RF connector SMP, and a first positioning pin is provided on the insertion surface of the TR component mounting plate, which is used to be inserted with the power divider plate 5 and the liquid cooling pressure plate through the first positioning pin;

[0009] The liquid-cooled pressure plate is provided with reserved holes for placing 128 sets of double-female connectors;

[0010] A guide pressure plate connected to the liquid-cooled pressure plate is used to calibrate the position of each dual-female RF connector KK in the 128 groups of dual-female connectors to determine the target tolerance of the dual-female RF connector KK after insertion;

[0011] The antenna subarray welding plate is provided with a second positioning pin, which is used to align with the guide pressure plate based on the second positioning pin and perform plugging.

[0012] In an optional embodiment of the present specification, 128 sets of push-in coaxial RF connectors SMP are welded on the TR component mounting plate.

[0013] In an optional embodiment of the present specification, the multi-channel SMP blind-mating device further includes:

[0014] The double-female connector extractor is used to press each of the double-female connectors into the push-in coaxial RF connector SMP slot of the TR component mounting plate after placing 128 groups of double-female connectors in the reserved holes of the liquid-cooled pressure plate for plugging.

[0015] In an optional embodiment of the present specification, the 128 sets of dual-female connectors are used to connect the push-in coaxial RF connector SMP and the dual-female RF connector KK.

[0016] In an optional embodiment of the present specification, the multi-channel SMP blind-mating device further includes:

[0017] A semi-escapement SMP connector is provided on one side of the TR component mounting plate and is used for plugging the TR component mounting plate into the TR component mounting plate;

[0018] The optical hole SMP connector is provided on one side of the antenna subarray welding board and is used for plugging the antenna subarray welding board.

[0019] In an optional embodiment of the present specification, the antenna subarray welding plate is provided with a pressure plate fixing screw, an antenna subarray fixing screw and a TR component extraction screw, which are used to realize blind plugging of the TR component mounting plate and the antenna subarray welding plate through 128 sets of double-female connectors to obtain the multi-channel SMP blind plugging device.

[0020] In an optional embodiment of the present specification, the antenna subarray welding plate is provided with multiple rows and columns of welding step holes therein, which are used to form welding grooves corresponding to the push-in coaxial RF connector SMP;

[0021] A solder protection groove is provided below the soldering step hole to prevent excess solder from overflowing.

[0022] In an optional embodiment of the present specification, a pin protection plate is provided on the back of the antenna subarray welding plate to prevent the length of the pin from exceeding the height of the welding slot.

[0023] According to a second aspect of the embodiments of this specification, a multi-channel SMP blind insertion method is provided, comprising:

[0024] Based on the reserved holes on the liquid-cooled press plate, 128 sets of double-female connectors are sequentially placed in the reserved holes, and a first position of a double-female RF connector KK of the double-female connector is determined, wherein the double-female connector is used to connect the push-in coaxial RF connector SMP and the double-female RF connector KK;

[0025] Calibrate the position of the dual-female RF connector KK by using a guide pressure plate to obtain a second position of the dual-female RF connector KK;

[0026] Based on the first position and the second position, the target tolerance of the dual-female RF connector KK is determined. When the target tolerance is within the preset tolerance, the TR component mounting plate and the antenna subarray welding plate are blind-plugged through 128 sets of dual-female connectors.

[0027] In an optional embodiment of the present specification, the step of calibrating the position of the dual-female RF connector KK by using a guide pressure plate to obtain a second position of the dual-female RF connector KK includes:

[0028] Performing a verticality check on the dual-female RF connector KK through a guide pressure plate to obtain a first check result;

[0029] Performing a concentricity check on the dual-female radio frequency connector KK through a guide pressure plate to obtain a second check result;

[0030] Based on the first verification result and the second verification result, a second position of the dual-female RF connector KK is obtained.

[0031] This specification provides a multi-channel SMP blind plug-in device, including: a TR component mounting plate, welded with a push-in coaxial RF connector SMP, and a first positioning pin is provided on the plug-in surface of the TR component mounting plate, which is used to plug with the power divider plate and the liquid-cooled pressure plate through the first positioning pin; the liquid-cooled pressure plate is provided with a reserved hole for placing 128 groups of double-female connectors; a guide pressure plate is connected to the liquid-cooled pressure plate, and is used to calibrate the position of each double-female RF connector KK in the 128 groups of double-female connectors, and determine the target tolerance of the double-female RF connector KK after plugging; the antenna subarray welding plate is provided with a second positioning pin, which is used to align with the guide pressure plate based on the second positioning pin and plug.

[0032] By applying the multi-channel SMP blind-plug device provided in the embodiment of this specification, a limiting liquid cooling plate and a guide pressure plate are introduced between the TR component mounting plate and the antenna subarray welding plate, and the position tolerance constraint design between the double female connectors is performed through the limiting liquid cooling plate and the guide pressure plate, thereby realizing the design of a 128-channel connector blind-plug device, which is beneficial to reducing the risk of blind plugging of the 128-channel connector, while improving the blind plugging efficiency and maintenance efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1a This is a structural diagram of a multi-channel SMP blind-mating device provided by one embodiment of this specification;

[0034] Figure 1b This is a structural diagram of another multi-channel SMP blind-mating device provided by an embodiment of this specification;

[0035] Figure 1c This is a schematic structural diagram of another multi-channel SMP blind-mating device provided by one embodiment of this specification;

[0036] Figure 1d This is a product schematic diagram of a multi-channel SMP blind-mating device provided by one embodiment of this specification;

[0037] Figure 2 This is a flow chart of a multi-channel SMP blind insertion method provided by one embodiment of this specification;

[0038] Figure 3a This is a schematic diagram of a connector structure of a multi-channel SMP blind mating method provided by an embodiment of this specification;

[0039] Figure 3b This is a schematic diagram of a connector structure of another multi-channel SMP blind mating method provided by an embodiment of this specification;

[0040] Figure 4This is a schematic diagram of a welding tolerance structure of a multi-channel SMP blind insertion method provided by one embodiment of this specification;

[0041] Figure 5 This is a schematic diagram of blind plugging of components in a multi-channel SMP blind plugging method provided by an embodiment of this specification.

[0042] Among them, there are antenna subarray welding plate-1; guide pressure plate-2; double female connector-3; liquid cooling pressure plate-4; power divider plate-5; TR component mounting plate-6; semi-escapement SMP connector-7; optical hole SMP connector-8; positioning pin-9; antenna subarray fixing screw-10; pressure plate fixing screw-11; TR component extraction screw-12. DETAILED DESCRIPTION

[0043] The following description sets forth many specific details to facilitate a thorough understanding of this specification. However, this specification can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the scope of this specification. Therefore, this specification is not limited to the specific implementations disclosed below.

[0044] The terms used in one or more embodiments of this specification are for the purpose of describing specific embodiments only and are not intended to limit one or more embodiments of this specification. The singular forms "a," "the," and "the" used in one or more embodiments of this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0045] It should be understood that although the terms first, second, etc. may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of one or more embodiments of this specification, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0046] In addition, it should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in one or more embodiments of this specification are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0047] In the domestic field, blind-mating fixtures for 8-, 16-, and 64-channel connectors are available, but there is no precise and feasible technical solution for blind-mating 128-channel connectors. Subarrays require blind-mating of 128-channel connectors between antennas and components, and this requires high connector positional accuracy.

[0048] If traditional free-style soldering of connectors is used directly, that is, applying solder paste and then directly installing the connector into the soldering groove, this may cause the relative position of the connector after soldering to be inconsistent with that before soldering, and the positioning is inaccurate. As long as there is a large deviation in the positioning of one channel of a 128-channel connector, it will be difficult to achieve blind insertion of the 128-channel connector.

[0049] If a connector limiting tool is used to ensure that the deviation generated after sintering of the connectors at both ends meets the controllable requirements of blind insertion, 128 positioning pin toolings need to be pressed and slid into the 128 round holes of the limiting plate tooling one by one. On the one hand, high precision requirements are required for the positioning pin tooling, and on the other hand, the implementation efficiency is low.

[0050] In addition, conventional SMP-J connectors interconnected through SMP-KK usually have a strict assembly sequence. Once assembled, if you want to remove the module on one side alone, you often need to remove many other modules in the reverse assembly sequence, which brings a huge maintenance workload and greatly increases the maintenance time.

[0051] Therefore, in order to reduce the risk of blind mating of two 128-channel connectors and improve blind mating efficiency and maintenance efficiency, this specification provides a 128-channel high-density SMP blind mating device. On the one hand, a detachable positioning tool is designed to improve the connector positioning accuracy and mating accuracy, while ensuring the convenience of blind mating and rapid maintenance of the module connectors at both ends. On the other hand, when the sintering accuracy requirements of the welding plate are not high, the positioning tool is used to control the position accuracy of the middle SMP-KK to meet the blind mating requirements, so that the upper and lower SMP welding plates can be blind mated through the SMP-KK, thereby improving blind mating efficiency. On the other hand, by separating the antenna subarray board and the TR component on both sides of the positioning tool, the antenna power splitter is blind mated with the antenna subarray board pins, and the power splitter and the antenna subarray board are reserved with mounting holes and positioning pins, thereby realizing an integrated design of the power splitter and the antenna subarray. At the same time, one side of the component is also vertically interconnected with the cold plate to maximize the integration in the vertical direction and reduce the antenna height. On the other hand, the SMP and SMP-KK can be connected and separated by a number of tightening screws and fixing screws, ensuring the reliability and convenience of the installation and removal process.

[0052] In this specification, a multi-channel SMP blind plugging device is provided. This specification also relates to a multi-channel SMP blind plugging method, which will be described in detail one by one in the following embodiments.

[0053] See also Figure 1a and 1b , Figure 1a This is a structural diagram of a multi-channel SMP blind-mating device provided by one embodiment of this specification; Figure 1b This is a structural diagram of another multi-channel SMP blind plugging device provided by an embodiment of this specification. Figure 1a and Figure 1b As shown, the multi-channel SMP blind plug device comprises, from top to bottom: an antenna subarray welding plate 1, a guide pressure plate 2, 128 sets of double-female connectors 3, a liquid-cooling pressure plate 4, a power splitter board 5 and a TR (Transmitter and Receiver) component mounting plate 6.

[0054] To facilitate plugging and unplugging, a semi-escapement SMP connector 7 is provided on one side of the TR component mounting plate 6, with model JSMP (m) -jhd1 a, for plugging into the TR component mounting plate 6.

[0055] The antenna sub-array welding board 1 is provided with an optical hole SMP connector 8, model JSMP (m) -jhd1 as, and the middle double female connector 3 model is SMP-KK38, which is used for the antenna sub-array welding board 1 to be plugged in. Figure 1c , Figure 1cThis is a structural diagram of another multi-channel SMP blind-mating device provided by an embodiment of this specification.

[0056] Positioning pins 9 are provided on both the inserting surfaces of the TR assembly mounting plate 6 and the inserting surfaces of the antenna subarray welding plate 1 for preliminary positioning.

[0057] The antenna subarray welding plate 1 is provided with antenna subarray fixing screws 10, pressure plate fixing screws 11, and TR assembly extraction screws 12, which are used to blind-mate the TR assembly mounting plate 6 and the antenna subarray welding plate 1 through 128 sets of double-female connectors 3 to obtain the multi-channel SMP blind-mate device. See 1d, Figure 1d This is a product schematic diagram of a multi-channel SMP blind-mating device provided in one embodiment of this specification.

[0058] Specifically, the TR component mounting plate 6 is welded with a push-in coaxial RF connector SMP, and a first positioning pin is provided on the insertion surface of the TR component mounting plate 6 for mating with the power divider plate 5 and the liquid cooling pressure plate 4 through the first positioning pin.

[0059] The liquid-cooled pressure plate 4 is provided with reserved holes for placing 128 sets of double-female connectors 3 .

[0060] The guide pressing plate 2 is connected to the liquid-cooling pressing plate 4 and is used to calibrate the position of each dual-female RF connector KK in the 128 groups of dual-female connectors 3 to determine the target tolerance of the dual-female RF connector KK after insertion.

[0061] The antenna sub-array welding plate 1 is provided with a second positioning pin, which is used to align with the guide pressure plate 2 based on the second positioning pin and perform insertion.

[0062] The 128 sets of dual-female connectors 3 are used to connect the push-in coaxial RF connector SMP and the dual-female RF connector KK.

[0063] The antenna sub-array welding plate 1 is internally provided with multiple rows and columns of welding step holes for forming welding grooves corresponding to the push-in coaxial RF connector SMP.

[0064] A solder protection groove is provided below the soldering step hole to prevent excess solder from overflowing.

[0065] The antenna subarray welding plate 1 is provided with a pin protection plate on the back to prevent the length of the pin from exceeding the height of the welding slot.

[0066] The multi-channel SMP blind plugging device includes: a double-female connector puller, which is used to press each of the double-female connectors into the push-in coaxial RF connector SMP slot of the TR component mounting plate 6 after placing 128 groups of double-female connectors 3 in the reserved holes of the liquid-cooled pressure plate 4 for plugging.

[0067] By applying the multi-channel SMP blind-plug device provided in the embodiment of this specification, a limiting liquid cooling plate and a guide pressure plate 2 are introduced between the TR component mounting plate 6 and the antenna subarray welding plate 1, and the position tolerance constraint design between the double-female connectors is performed through the limiting liquid cooling plate and the guide pressure plate 2, thereby realizing the design of a 128-channel connector blind-plug device, which is beneficial to reducing the risk of blind plugging of the 128-channel connector, while improving the blind plugging efficiency and maintenance efficiency.

[0068] Corresponding to the above device embodiment, this specification also provides an embodiment of a multi-channel SMP blind insertion method, Figure 2 FIG. 1 is a flow chart of a multi-channel SMP blind insertion method provided by an embodiment of this specification. Figure 2 As shown, the specific steps include the following steps.

[0069] Step S202: Based on the reserved holes on the liquid-cooled press plate, 128 sets of dual-female connectors 3 are sequentially placed in the reserved holes, and a first position of the dual-female RF connector KK of the dual-female connector is determined, wherein the dual-female connector is used to connect the push-in coaxial RF connector SMP and the dual-female RF connector KK;

[0070] Step S204: calibrating the position of the dual-female RF connector KK by using a guide pressure plate to obtain a second position of the dual-female RF connector KK;

[0071] Step S206: Based on the first position and the second position, determine the target tolerance of the dual-female RF connector KK. When the target tolerance is within the preset tolerance, blindly plug the TR component mounting plate and the antenna subarray welding plate through 128 sets of dual-female connectors 3.

[0072] Specifically, the position calibration of the dual-female RF connector KK by the guide pressing plate 2 to obtain the second position of the dual-female RF connector KK includes:

[0073] The verticality of the dual-female RF connector KK is checked by the guide plate 2 to obtain a first check result;

[0074] Performing a concentricity check on the dual-female RF connector KK through the guide pressing plate 2 to obtain a second check result;

[0075] Based on the first verification result and the second verification result, a second position of the dual-female RF connector KK is obtained.

[0076] When actually designing the multi-channel SMP blind plug-in device, the power divider board 5, the liquid-cooled pressure plate 4 and the TR component mounting plate 6 are first docked through the positioning pins set at the four corners, and then 128 groups of double-female connectors 3 (i.e., 128 groups of SMP-KK) are placed in the reserved holes of the liquid-cooled pressure plate 4 in sequence; then the SMP-KK puller is used to align the single SMP-KK, and the 128 groups of SMP-KK are pressed into the SMP slot of the component mounting plate to complete the individual plug-in of the SMP-KK; secondly, the TR component mounting plate 6 is connected to the liquid-cooled plate through equal-length fixing screws. It should be noted that after the KK and the component SMP are plugged in, there are position differences in the 128 groups of plugged KKs. Therefore, the verticality and concentricity of each KK need to be calibrated through the guide plate. After the calibration is completed, each SMP-KK passes through the positioning holes of the upper guide pressure plate 2 and the lower liquid-cooled pressure plate 4, and the constraints ensure the overall spacing tolerance and position tolerance after the KK is connected.

[0077] After the calibration is completed, the liquid-cooled pressure plate 4 and the guide pressure plate 2 are tightened based on the mounting screws around them, and then the antenna sub-array welding plate 1 is aligned with the guide pressure plate 2 below through the positioning pins designed around it. After a small range of adjustment and trial insertion, the two are preliminarily plugged in.

[0078] Then, use the 8-14 screws reserved in the middle of the antenna subarray welding plate 1 to gradually press the four corners of the antenna subarray SMP welding plate so that it gradually fits with the guide pressure plate 2 below, and finally achieves overall blind insertion.

[0079] In this embodiment, blind-mating two high-density, multi-row SMP panels requires designing the SMP-KK positional tolerance constraints between the two panels. This requires ensuring that the SMP-KK coaxiality and mounting spacing meet blind-mating requirements. Therefore, this embodiment incorporates a limited liquid cooling plate and a guide pressure plate 2 between the TR assembly mounting plate 6 and the antenna subarray welding plate 1.

[0080] Specifically, first, the first layer of limiting liquid cooling plate and the TR component mounting plate 6 are matched through positioning pins, and then 128 groups of SMP-KK are placed in the reserved groove of the cold plate to ensure the installation positioning of the first layer of welding plate and KK; then the second layer of guide pressure plate 2 and the inserted KK are positioned row by row, and the individual deviations from the KK position are calibrated in turn, so that each KK can finally pass through the reserved positioning hole of the second layer of pressure plate, that is, the position constraint of the two ends of KK is realized through the reserved positioning holes on both sides of the two pressure plates, ensuring that the position of KK in each row and column is consistent with the spacing between the pressure plate holes.

[0081] By applying the method provided in the embodiments of this specification, there is no need to design a separate connector blind-plug welding tooling for the welding plate, and there is no need to insert the positioning pins into the positioning tooling one by one, and then insert the SMP to be sintered into the welding plate, which reduces the sintering process and improves the sintering efficiency of the connector. When the sintering accuracy requirements of the welding plate are not high, the position accuracy of the middle SMP-KK is controlled by the positioning tooling to meet the blind plugging requirements, and the upper and lower SMP welding plates can be blind-plugged through the SMP-KK, thereby improving the blind plugging efficiency.

[0082] In the embodiment of this specification, positioning pins are left at the four corners of the antenna sub-array welding plate 1 for fixing with the liquid cooling press plate 4 and the guide press plate 2 .

[0083] Inside the welding plate, multiple rows and columns of welding step holes are designed. In addition to ensuring the position tolerance and aperture tolerance of the welding holes, in order to meet the welding requirements, a solder protection groove with a diameter of 2.2mm and a depth of 1.4mm is designed under the SMP fixed step groove to prevent excess solder from overflowing. A pin protection plate is designed on the back of the welding plate to prevent the pins from exceeding the welding groove.

[0084] Considering the operation and tooling space constraints, the embodiment of this specification designs the SMP welding pitch to be 12mm×12mm, the maximum matrix number is 16×8 SMPs, and the welding hole spacing tolerance requirement is ±0.05.

[0085] When designing a single SMP soldering groove, the SMP step diameters are 2.5mm and 4.2mm respectively, that is, the maximum size of the soldering groove is 0.2mm larger than the SMP body diameter, the center conductor diameter is 0.38mm, and the opening diameter is 3 times that. Figure 3a and Figure 3b , Figure 3a This is a schematic diagram of a connector structure of a multi-channel SMP blind mating method provided by an embodiment of this specification; Figure 3b This is a schematic diagram of a connector structure of another multi-channel SMP blind plugging method provided by an embodiment of this specification.

[0086] In this embodiment, the axially rotatable nature of the SMP-KK is exploited by placing two pressure plates at each end of the SMP-KK to constrain its floating angle. This means that the SMP-KK matrix is ​​first inserted into the liquid-cooling pressure plate 4, and then the entire matrix is ​​finally inserted by adjusting the local SMP-KK angle that affects the assembly of the guide pressure plate 2.

[0087] When the SMP-KK matrix is ​​simultaneously plugged into the liquid-cooled press plate 4 and the guide press plate 2, its local tolerance has been transformed into an overall tolerance, which ultimately depends on the tolerance of the press plate.

[0088] At this point, to achieve the blind insertion of the second SMP matrix structure plate with the first plate, it is only necessary to ensure that the spacing tolerance of the welding plate holes and the spacing tolerance of the pressure plate holes meet the technical requirements. Finally, the spacing tolerance of the four positioning columns of the welding plate and the pressure plate is ±0.05, and the hole diameter tolerance is required to be 0.2±0.05. Figure 4 , Figure 4 This is a schematic diagram of the welding tolerance structure of a multi-channel SMP blind insertion method provided in one embodiment of this specification.

[0089] In the embodiments of this specification, in order to improve the stability and reliability of blind plugging of components, it is necessary to design auxiliary plugging and unplugging of components so that the blind plugging effect between components meets the array requirements.

[0090] In the specific design, when a single SMP-KK is plugged into an SMP, first connect the liquid cooling platen 4 with the SMP welding plate through the positioning holes at the four corners, and then place several SMP-KKs into the reserved holes of the liquid cooling platen 4 in sequence.

[0091] Then use the SMP-KK puller to align the single SMP-KK and press it into the SMP slot to complete the single SMP-KK insertion.

[0092] When blind-plugging a single SMP matrix welding plate, first install and tighten the two pressure plates that have been integrally plugged into the SMP-KK with screws, then align the single SMP matrix welding plate with the lower pressure plate through positioning, and make trial insertions by adjusting the position in a small range to initially plug the two together. Then, use 4-6 screws to gradually press the upper SMP matrix welding plate to gradually fit it with the lower pressure plate, and finally achieve overall blind plugging. Figure 5 , Figure 5 This is a schematic diagram of blind plugging of components in a multi-channel SMP blind plugging method provided by an embodiment of this specification.

[0093] By applying the multi-channel SMP blind plugging method provided in the embodiments of this specification, a limiting liquid cooling plate and a guide pressure plate are introduced between the TR component mounting plate and the antenna subarray welding plate, and the position tolerance constraint design between the double female connectors is performed through the limiting liquid cooling plate and the guide pressure plate, thereby realizing the design of a 128-channel connector blind plugging device, which is beneficial to reducing the risk of blind plugging of the 128-channel connector, while improving the blind plugging efficiency and maintenance efficiency.

[0094] The above is a schematic diagram of a multi-channel SMP blind-mating method according to this embodiment. It should be noted that the technical solution of this multi-channel SMP blind-mating method and the technical solution of the multi-channel SMP blind-mating device described above share the same concept. For details not described in detail in the technical solution of the multi-channel SMP blind-mating method, please refer to the description of the technical solution of the multi-channel SMP blind-mating device described above.

[0095] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or the sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0096] It should be noted that for the aforementioned method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the embodiments of this specification are not limited by the order of the actions described, because according to the embodiments of this specification, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the embodiments of this specification.

[0097] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] The preferred embodiments disclosed above are intended only to help illustrate this specification. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made based on the content of the embodiments of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the embodiments of this specification, so that those skilled in the art can better understand and utilize this specification. This specification is limited only by the claims and their full scope and equivalents.

Claims

1. A multi-channel SMP blind-mating device, characterized in that: include: A TR component mounting plate is welded with a push-in coaxial RF connector SMP, and a first positioning pin is provided on the mating surface of the TR component mounting plate, for mating with the power divider plate and the liquid cooling press plate through the first positioning pin; The liquid-cooled pressure plate is provided with reserved holes for placing 128 sets of double-female connectors; A guide pressure plate connected to the liquid-cooled pressure plate is used to calibrate the position of each dual-female RF connector KK in the 128 groups of dual-female connectors to determine the target tolerance of the dual-female RF connector KK after insertion; The antenna subarray welding plate is provided with a second positioning pin, which is used to align with the guide pressure plate based on the second positioning pin and perform plugging.

2. A multi-channel SMP blind mating device according to claim 1, characterized in that: Also includes: The double-female connector extractor is used to press each of the double-female connectors into the push-in coaxial RF connector SMP slot of the TR component mounting plate after placing 128 groups of double-female connectors in the reserved holes of the liquid-cooled pressure plate for plugging.

3. The multi-channel SMP blind mating device according to claim 1, characterized in that: The double-female connectors in group 128 are used to connect the push-in coaxial RF connector SMP and the double-female RF connector KK.

4. The multi-channel SMP blind mating device according to claim 1, characterized in that: Also includes: A semi-escapement SMP connector is provided on one side of the TR component mounting plate and is used for plugging the TR component mounting plate into the TR component mounting plate; The optical hole SMP connector is provided on one side of the antenna subarray welding board and is used for plugging the antenna subarray welding board.

5. The multi-channel SMP blind mating device according to claim 1, characterized in that: The antenna subarray welding plate is provided with a pressure plate fixing screw, an antenna subarray fixing screw and a TR component extraction screw, which are used to realize the blind plugging of the TR component mounting plate and the antenna subarray welding plate through 128 sets of double-female connectors to obtain the multi-channel SMP blind plugging device.

6. The multi-channel SMP blind mating device according to claim 1, characterized in that: The antenna subarray welding plate is provided with multiple rows and columns of welding step holes for forming welding slots corresponding to the push-in coaxial RF connector SMP; A solder protection groove is provided below the soldering step hole to prevent excess solder from overflowing.

7. The multi-channel SMP blind mating device according to claim 1, characterized in that: The antenna subarray welding plate is provided with a pin protection plate on the back to prevent the length of the pin from exceeding the height of the welding slot.

8. A multi-channel SMP blind mating method, implemented using a multi-channel SMP blind mating device according to any one of claims 1 to 7, characterized in that: include: Based on the reserved holes on the liquid-cooled press plate, 128 sets of double-female connectors are sequentially placed in the reserved holes, and a first position of a double-female RF connector KK of the double-female connector is determined, wherein the double-female connector is used to connect the push-in coaxial RF connector SMP and the double-female RF connector KK; Calibrate the position of the dual-female RF connector KK by using a guide pressure plate to obtain a second position of the dual-female RF connector KK; Based on the first position and the second position, the target tolerance of the dual-female RF connector KK is determined. When the target tolerance is within the preset tolerance, the TR component mounting plate and the antenna subarray welding plate are blind-plugged through 128 sets of dual-female connectors.

9. The method according to claim 8, characterized in that The step of calibrating the position of the dual-female RF connector KK by using the guide pressure plate to obtain the second position of the dual-female RF connector KK includes: Performing a verticality check on the dual-female RF connector KK through a guide pressure plate to obtain a first check result; Performing a concentricity check on the dual-female radio frequency connector KK through a guide pressure plate to obtain a second check result; Based on the first verification result and the second verification result, a second position of the dual-female RF connector KK is obtained.

Images