A method for making single-sided patterned holes on a high-flatness FPC sheet

Abstract

A method for producing single-sided patterned hole filling on a thin FPC board with high flatness includes the following steps: step 1: cutting the carrier board, step 2: forming the carrier board, step 3: applying film to the circuit board, step 4: exposing the circuit board, step 5: developing, step 6: flattening, step 7: laminating the carrier board, step 8: patterned hole filling, and step 9: cutting and separating the boards. The present invention laminates a carrier board with rigidity to an ultra-thin circuit board, allowing the circuit board to remain flat during the patterned hole filling process, greatly reducing the risk of product wrinkles and board blockage during processing. Furthermore, compared to conventional fixture clamping, the laminated composite board formed by laminating the carrier board and the circuit board can not only effectively improve the problem of chemicals trapped inside the board affecting the quality of the finished circuit board, but can also simultaneously support two circuit boards for patterned hole filling, greatly improving processing efficiency. The present invention is highly practical and has strong promotional significance.

Description

Technical Field

[0001] The invention relates to the field of printed circuit board manufacturing technology, and in particular to a method for manufacturing a single-sided patterned hole-filling FPC thin plate with high flatness. Background Art

[0002] A printed circuit board (PCB), also known as a printed circuit board (PCB), is an important electronic component that supports and provides electrical connections for electronic components. Due to the development trend of PCBs, thin PCBs (i.e., sheets) have gradually appeared on the market. Compared to conventional PCBs, these boards are thinner in thickness.

[0003] Currently, the industry often uses a specialized jig with double-sided tape to create single-sided via-filling patterns on thin boards with a thickness of less than 0.15mm. The product is electroplated with a dry film coating on one side of the board and the patterned lines on the other. The thinner the board, the weaker the support strength when using conventional jigs for via-filling patterns, leading to quality issues such as wrinkles and blockages in the via-filling patterns. Furthermore, even if reinforced jigs are used to mitigate the problem of thin boards being difficult to fill with patterns, they can also make the board more susceptible to internal chemical buildup, significantly impacting the board's finished quality. Summary of the Invention

[0004] Based on this, it is necessary to provide a method for making a single-sided patterned hole-filling FPC sheet with high flatness in order to address the deficiencies in the prior art.

[0005] A method for producing a single-sided patterned hole-filling FPC sheet with high flatness, comprising the following steps:

[0006] Step 1: Cut the carrier board, cut a copper clad board that is not smaller than the circuit board, and use the roll of micro-adhesive film;

[0007] Step 2: Carrier board forming: Use a hot-press roller laminator to apply a micro-adhesive film on both sides of the copper-clad laminate to form it into a rigid carrier board;

[0008] Step 3: PCB filming: double-sided yellow glue, dry film and dry film protective film are applied to both sides of the PCB in sequence;

[0009] Step 4: Expose the PCB. Expose the pattern circuit on one side of the PCB and expose the entire board on the other side. The dry film protective film on the entire board exposed side is retained, while the dry film protective film on the pattern circuit exposed side is torn off.

[0010] Step 5: Development, both sides of the circuit board are developed;

[0011] Step 6: Flatten the developed circuit board and place it on a vacuum adsorption table. The board surface will be flattened by vacuum adsorption. When placing the circuit board, make sure that the exposed side of the circuit board is facing down.

[0012] Step 7: Laminating the carrier board: Laminating the carrier board from top to bottom on the flattened upper surface of the circuit board by adsorption, that is, the micro-adhesive film of the carrier board and the dry film protective film of the circuit board are tightly adhered to form a combined board body to be processed for pattern filling;

[0013] Step 8: Graphic hole filling, remove the assembled board from the vacuum adsorption table and send it to the graphic hole filling processing line for graphic hole filling processing;

[0014] Step 9: Unloading and separating the boards. Unloading and unloading the assembled boards that have completed the pattern-filled hole processing from the processing line, and separating the circuit board from the carrier board to obtain a finished thin circuit board with pattern-filled holes.

[0015] Furthermore, the copper-clad plate in step 1 is made of copper-free material and has a thickness of 0.6 mm.

[0016] Furthermore, the dry film protective film in step 3 is a release film, and the adhesion between the dry film protective film and the micro-adhesive film is smaller than the adhesion between the dry film and the dry film protective film.

[0017] Furthermore, when the film is applied in step 3, a conductor plate is also applied to one end of the circuit board, and the width of the conductor plate is consistent with the width of the circuit board.

[0018] Furthermore, the steps 3 to 6 are repeated once, and in step 7 the circuit board and the other side of the carrier board are bonded together to form a combined board body supported by the carrier board and bonded to the circuit boards on both sides for pattern filling processing.

[0019] In summary, the beneficial effects of the method for producing single-sided patterned hole filling of an FPC sheet with high flatness of the present invention are: by designing a carrier board with rigid characteristics to fit with an ultra-thin circuit board, the circuit board can remain flat during the patterned hole filling process, which greatly reduces the risk of product wrinkles and board blockage during processing; and compared with conventional fixture clamping, the combined board body formed by the carrier board and the circuit board can not only effectively improve the problem of chemicals hidden in the board affecting the quality of the finished circuit board, but also can simultaneously support two circuit boards for patterned hole filling processing, greatly improving the processing efficiency; adding a wire board to the board head of the circuit board not only makes the circuit board easier to be pulled and thus smoothly transmitted on the production and processing line, but also can play a certain reinforcing role on the dry film protective film, reducing the risk of the dry film protective film falling off; the present invention is highly practical and has a strong promotional significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1This is a schematic diagram of the cross-sectional structure of a carrier board in a method for manufacturing a single-sided patterned hole-filling FPC sheet with high flatness according to the present invention;

[0021] Figure 2 This is a schematic diagram of the cross-sectional structure of a circuit board after film lamination in a method for manufacturing a single-sided patterned hole-filling FPC sheet with high flatness according to the present invention;

[0022] Figure 3 The figure is a schematic diagram of the cross-sectional structure of the combined board body in the method for manufacturing a single-sided patterned hole-filling FPC sheet with high flatness according to the present invention. DETAILED DESCRIPTION

[0023] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, and to analyze the advantages and spirit of the present invention, a further understanding is obtained through the following detailed description of the present invention in conjunction with the accompanying drawings and specific embodiments.

[0024] like Figures 1 to 3 As shown, the present invention provides a method for producing a single-sided patterned hole-filling FPC sheet with high flatness, comprising the following steps:

[0025] Step 1: Cut the carrier board 10, cut a 0.6mm thick copper-free copper clad board 11, and use the roll material micro-adhesive film 12;

[0026] Step 2: Forming the carrier board 10: Using a hot-press roller laminator, a micro-adhesive film 12 is attached to both sides of the copper-clad laminate 11 to form a rigid carrier board 10;

[0027] Step 3: Laminating the circuit boards 21: First, attach a conductor plate (not shown) of the same width to one end of each of the two circuit boards. Then, attach double-sided yellow tape (not shown), dry film 22, and dry film protective film 23 to both sides of the two circuit boards 21 in sequence. The dry film protective film 23 is a release film. The adhesion between the dry film protective film 23 and the micro-adhesive film 12 is weaker than the adhesion between the dry film 22 and the dry film protective film 23.

[0028] Step 4: Expose the circuit boards 21. The pattern circuits on one side of the two circuit boards 21 are exposed, while the other side is fully exposed. The dry film protective film 23 on the fully exposed side is retained, while the dry film protective film 23 on the pattern circuit exposed side is removed.

[0029] Step 5: Development: both sides of the two circuit boards 21 are developed;

[0030] Step 6: Flattening: Place one of the developed circuit boards 21 on a vacuum adsorption table to flatten the board surface through vacuum adsorption. When placing the circuit board 21, ensure that the exposed side of the pattern circuit of the circuit board 21 faces downwards.

[0031] Step 7: Laminating the carrier 10. Lay the carrier 10 from top to bottom on the upper surface of the circuit board 21 that has been flattened by adsorption. That is, the micro-adhesive film 12 of the carrier 10 is tightly adhered to the dry film protective film 23 of the circuit board 21. Then, remove the carrier 10 with the circuit board 21 on one side from the vacuum adsorption table. Then, place another circuit board 21 on the vacuum adsorption table to flatten it and laminate the other side of the carrier 10 to it. Finally, a combined board body 30 is formed to be processed for pattern filling.

[0032] Step 8: Pattern hole filling, remove the assembled plate 30 from the vacuum adsorption table and send it to the pattern hole filling processing line for pattern hole filling processing;

[0033] Step 9: Unloading and separating the boards. Unloading and unloading the assembled board 30 that has completed the pattern-filled hole processing from the processing line, and separating the circuit board 21 from the carrier board 10, thereby obtaining a finished thin circuit board 21 with pattern-filled holes.

[0034] In summary, the beneficial effects of the method for producing single-sided patterned hole filling of a high-flatness FPC thin plate of the present invention are: by designing a carrier board 10 with rigid characteristics to fit with the ultra-thin circuit board 21, the circuit board 21 can remain flat during the patterned hole filling process, greatly reducing the risk of product wrinkles and board blockage during processing; and compared with conventional fixture clamping, the combined board body 30 formed by the carrier board 10 and the circuit board 21 can not only effectively improve the problem of the hidden liquid in the board affecting the quality of the finished product of the circuit board 21, but also can simultaneously support two circuit boards 21 for patterned hole filling processing, greatly improving the processing efficiency; adding a wire board to the board head of the circuit board 21 not only makes the circuit board 21 easier to be pulled and thus smoothly transmitted on the production and processing line, but also can play a certain reinforcing role on the dry film protective film 23, reducing the risk of the dry film protective film 23 falling off; the present invention is highly practical and has a strong promotional significance.

[0035] The above-described embodiment merely represents one embodiment of the invention, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the inventive concept, and these modifications and improvements fall within the scope of the invention. Therefore, the scope of patent protection for an invention shall be determined by the appended claims.

Claims

1. A method for producing a single-sided patterned hole-filling FPC sheet with high flatness, characterized in that: The steps include: Step 1: Cut the carrier board, cut a copper clad board that is not smaller than the circuit board, and use the roll of micro-adhesive film; Step 2: Carrier board forming: Use a hot-press roller laminator to apply a micro-adhesive film on both sides of the copper-clad laminate to form it into a rigid carrier board; Step 3: PCB filming: double-sided yellow glue, dry film and dry film protective film are applied to both sides of the PCB in sequence; Step 4: Expose the PCB. Expose the pattern circuit on one side of the PCB and expose the entire board on the other side. The dry film protective film on the entire board exposed side is retained, while the dry film protective film on the pattern circuit exposed side is torn off. Step 5: Development, both sides of the circuit board are developed; Step 6: Flatten the developed circuit board and place it on a vacuum adsorption table. The board surface will be flattened by vacuum adsorption. When placing the circuit board, make sure that the exposed side of the circuit board is facing down. Step 7: Laminating the carrier board: Laminating the carrier board from top to bottom on the flattened upper surface of the circuit board by adsorption, that is, the micro-adhesive film of the carrier board and the dry film protective film of the circuit board are tightly adhered to form a combined board body to be processed for pattern filling; Step 8: Graphic hole filling, remove the assembled board from the vacuum adsorption table and send it to the graphic hole filling processing line for graphic hole filling processing; Step 9: Unloading and separating the boards. Unloading and unloading the assembled boards that have completed the pattern-filled hole processing from the processing line, and separating the circuit board from the carrier board to obtain a finished thin circuit board with pattern-filled holes.

2. The method for producing a single-sided patterned hole-filling FPC sheet with high flatness according to claim 1, wherein: The copper clad plate in step 1 is made of copper-free material and has a thickness of 0.6 mm.

3. The method for producing a single-sided patterned hole-filling FPC sheet with high flatness according to claim 1, wherein: The dry film protective film in step 3 is a release film, and the adhesion between the dry film protective film and the micro-adhesive film is smaller than the adhesion between the dry film and the dry film protective film.

4. The method for producing a single-sided patterned hole-filling FPC sheet with high flatness according to claim 1, wherein: When the film is applied in step 3, a conductor plate is also applied to one end of the circuit board, and the width of the conductor plate is consistent with the width of the circuit board.

5. The method for producing a single-sided patterned hole-filling FPC sheet with high flatness according to claim 1, wherein: The steps 3 to 6 are repeated once, and in step 7 the circuit board and the other side of the carrier board are bonded together to form a combined board body supported by the carrier board and bonded to the circuit boards on both sides to be processed with pattern filling.

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