A charging device, a liquid cooling heat dissipation unit and a liquid cooling heat dissipation component

Abstract

The embodiment of the application discloses a charging device, a liquid cooling heat dissipation unit and a liquid cooling heat dissipation component, wherein the liquid cooling heat dissipation component comprises heat dissipation pipes and a collecting pipe, the extension direction of the heat dissipation pipes is a first direction, the extension direction of the collecting pipe is a second direction, the direction perpendicular to the first direction and the second direction is a third direction, the number of the collecting pipes is two, the two collecting pipes are oppositely arranged in the first direction, and the two ends of the heat dissipation pipes are connected with the two collecting pipes respectively; the maximum size of the collecting pipe in the first direction is a first size, the maximum size of the collecting pipe in the third direction is a second size, and the ratio of the first size to the second size is between 5% and 50%. The installation space of the liquid cooling heat dissipation component can be relatively small.

Description

Technical Field

[0001] This application relates to the field of cooling and heat dissipation technology, specifically to a charging device, a liquid cooling heat dissipation unit, and a liquid cooling heat dissipation component. Background Technology

[0002] With the rapid development of electric vehicles, car charging technology has gone through several stages, including AC slow charging, DC fast charging, and DC supercharging. The charging current is constantly increasing, and correspondingly, the charging power is also constantly increasing, putting more and more pressure on heat dissipation during charging.

[0003] In related technologies, air cooling is the primary method for heat dissipation during charging. However, air cooling has limited heat dissipation capacity and is increasingly unable to meet the heat dissipation requirements under high charging power. To address this, some technologies employ liquid cooling processes, but the structural design of the liquid cooling components used lacks rationality and fails to meet practical application needs.

[0004] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects remains a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides a charging device, a liquid cooling heat dissipation unit, and a liquid cooling heat dissipation component, which can ensure heat dissipation efficiency while occupying relatively little installation space.

[0006] In a first aspect, embodiments of this application disclose a liquid cooling heat dissipation component, including a heat dissipation pipe and a manifold. The extension direction of the heat dissipation pipe is a first direction, the extension direction of the manifold is a second direction, and the direction perpendicular to the first and second directions is a third direction. There are two manifolds, which are arranged opposite to each other in the first direction. The two ends of the heat dissipation pipe are respectively connected to the two manifolds. The maximum dimension of the manifold in the first direction is a first dimension, and the maximum dimension of the manifold in the third direction is a second dimension. The ratio of the first dimension to the second dimension is between 5% and 50%.

[0007] By adopting this scheme, the manifold, with a fixed second dimension in the third direction, can significantly reduce its first dimension in the first direction. Thus, compared to a conventional circular tube, with a fixed volume ratio, the manifold in this embodiment can have a larger heat exchange area, thereby significantly improving the heat dissipation performance of the liquid cooling component. Furthermore, with a fixed heat exchange area, the manifold in this embodiment occupies less space in the first direction, allowing the liquid cooling component to be relatively smaller in that direction. This significantly reduces the installation space required for the liquid cooling component, and consequently, reduces the installation space required for the liquid cooling unit using this component. This is beneficial for the application of the liquid cooling component in environments with relatively limited space, such as in increasingly miniaturized charging devices.

[0008] For clarity, the following analysis will be conducted using a specific example.

[0009] The comparative example is a circular tube with an outer diameter of 10, meaning the dimensions in the first and third directions are both 10, and the dimension in the second direction is also set to 10. In actual installation, there isn't necessarily a perfectly existing cylindrical space for the tube; in fact, to ensure smooth installation, a rectangular cylindrical space is usually reserved to accommodate it. Therefore, the volume occupied by the circular tube is 10 * 10 * 10 = 1000, and its heat dissipation area is 3.14 * 5. 2 *2+3.14*10*10=471.

[0010] In this embodiment, the dimension in the first direction is significantly reduced, and under the condition that the dimension in the third direction remains unchanged, the volume occupied by the tube will obviously be reduced.

[0011] To be more specific, the manifold in this embodiment is set to a cuboid structure, with its dimensions set to 5 in the first direction, 20 in the third direction, and 10 in the second direction. Thus, its volume occupies 20*5*10=1000, which means the volume occupies the same, while the heat dissipation area is 20*5*2+(20*2+5*2)*10=700, which greatly increases the heat dissipation area. Correspondingly, under the condition that the heat dissipation area is basically the same as that of a circular tube, the volume occupies the same can be greatly reduced to achieve miniaturization.

[0012] In some alternative implementations, the ratio of the first dimension to the second dimension is between 10% and 20%. This not only allows for better control of the manifold's dimensions in the first direction to reduce its installation space, but also ensures sufficient heat dissipation area, resulting in relatively high heat dissipation performance.

[0013] In some alternative implementations, the manifold includes two first pipe walls arranged opposite each other in a first direction. The manifold has a manifold chamber, and at least one support rib extending in a second direction is provided in the manifold chamber. The two ends of the support rib in the first direction are respectively connected to the two first pipe walls.

[0014] With this configuration, the support ribs can reinforce the structural strength of the manifold in the first direction, which can largely overcome the problem of strength reduction caused by the reduction in the first dimension of the manifold. This can reduce the swelling or crushing of the manifold in the first direction during use, so that the structural strength of the liquid cooling heat dissipation component provided in this application embodiment can be relatively high.

[0015] In some optional implementations, the support rib includes a rib body and two rib connecting portions. The two connecting portions are located at both ends of the rib body in a first direction. The end faces of the two connecting portions away from the rib body are connecting surfaces. The connecting surfaces of the two connecting portions are respectively connected to the two first pipe walls. At least the dimension of the connecting surface of the connecting portion in a third direction is larger than the dimension of the rib body in the third direction. In this way, the connection strength between the support rib and the first pipe wall can be high, which can reduce the failure of the connection between the support rib and the first pipe wall caused by factors such as the scouring of the first liquid cooling medium during subsequent use, and the resulting bulging of the manifold along the first direction during use.

[0016] In the first direction, the dimensions of the rib connection in the third direction can be gradually varied. For ease of description, the two opposing walls of the rib connection in the third direction can be referred to as rib sidewalls. These rib sidewalls can be smooth curved surfaces, such as arc surfaces. Alternatively, the rib sidewalls can be inclined planes forming an angle with both the first and third directions; it should be understood that the inclined plane is also a plane. Alternatively, the dimensions of the rib connection in the third direction can be set to be constant. In this case, the dimensions of the rib connection in the third direction are all larger than the rib body, and a stepped surface can be formed between the rib connection and the rib body.

[0017] In the above implementation, the main body of the rib and the connecting part can be a one-piece structure, such as integral casting, which simplifies the forming process. Alternatively, the main body of the rib and the connecting part can be prepared separately and then assembled, which is also feasible.

[0018] In some alternative implementations, the support rib is provided with a through hole extending along a third direction. This through hole can connect the chambers on both sides of the support rib in the third direction, allowing the first liquid coolant to flow relatively uniformly within the manifold chamber, thereby effectively improving the heat dissipation performance of the first liquid coolant within the manifold.

[0019] The number of through holes can be one. Alternatively, the number of through holes can be multiple, in which case the through holes can be arranged at intervals in the second direction.

[0020] In some alternative implementations, the manifold includes a main body and two second pipe walls, which are separate from the main body. The two second pipe walls are connected to both ends of the main body in a second direction. The second pipe wall is a double-layer plate, which includes a first and a second blocking plate spaced apart along the second direction. Both the first and second blocking plates are connected to the main body.

[0021] In practice, the first blocking plate can be positioned away from the manifold chamber relative to the second blocking plate, meaning it can be located outside the second blocking plate. The first and second blocking plates form a double layer of protection. Even if the second blocking plate cracks due to the impact of the first liquid coolant, the first blocking plate can still provide protection, significantly reducing the possibility of leakage of the first liquid coolant at the connection between the second pipe wall and the main pipe body.

[0022] Furthermore, once a crack appears in the second endplate, the first liquid coolant can flow through the crack into the buffer gap between the first and second endplates. This allows the first liquid coolant to be present on both sides of the second endplate in the second direction, with similar pressures on both sides. Thus, the second endplate is essentially in a state of force balance in the second direction, reducing the likelihood of it experiencing greater impact from the first liquid coolant during subsequent use. Consequently, cracks in the second endplate are less likely to widen or increase, reducing the possibility of further damage. Without further damage, the second endplate effectively prevents the flow impact of the first liquid coolant in the manifold chamber from being directly transmitted to the buffer gap. The first liquid coolant in the buffer gap is almost stagnant, thus reducing its impact on the first endplate and minimizing damage. This further ensures the reliability of the seal.

[0023] The size of the aforementioned buffer gap in the second direction can be between approximately 0.1 mm and 1 mm. This reduces the encroachment on the pipe cavity formed within the main body of the pipe, allowing more space within the pipe cavity to form a manifold chamber. This also maximizes the capacity of the manifold in this embodiment to accommodate the first liquid cooling medium and its heat dissipation capabilities.

[0024] In some alternative implementations, a pipe cavity is formed inside the pipe body. The pipe cavity includes a main cavity and two installation cavities. The two installation cavities are located on both sides of the main cavity in a second direction. There is an installation step surface between the installation cavities and the main cavity. The second plug plate is located in the installation cavity and abuts against the installation step surface. The first plug plate includes a sealing body. A protruding plate is provided on the side of the sealing body facing the second plug plate. The protruding plate is located in the installation cavity and abuts against the second plug plate along the second direction. The sealing body is installed on the pipe body.

[0025] In the above implementation, the installation step surface effectively limits the installation position of the second endplate within the pipe cavity. The convex plate abuts against the second endplate in the second direction; on one hand, it limits the installation position of the first endplate relative to the main pipe body; on the other hand, it better limits the installation position of the second endplate. Even if the connection between the second endplate and the main pipe body fails due to factors such as the impact of the first liquid cooling medium during use, the abutment between the convex plate and the second endplate can still ensure that the position of the second endplate remains unchanged. In other words, it can still ensure the stable existence of the aforementioned buffer gap, which is of positive significance for ensuring the overall sealing effect of the second pipe wall on the pipe cavity.

[0026] In practice, a cover plate can also be provided at the end of the first blocking plate that is away from the second blocking plate. Specifically, the first blocking plate can be provided by the cover plate and the pipe body abutting each other along the axial direction, which can also limit the installation position of the first blocking plate relative to the pipe body.

[0027] In some alternative implementations, the manifold includes two first pipe walls and two third pipe walls. The two first pipe walls are arranged opposite each other in a first direction, and the two third pipe walls are arranged opposite each other in a third direction. At least a portion of the outer surface of each of the first and third pipe walls is a planar region. This allows for the convenient fabrication of corresponding perforated structures on the first and third pipe walls using machining processes. For example, mounting holes can be easily machined in the planar region of the first pipe wall for connection to a heat sink. Alternatively, inlet and outlet ports can be easily machined in the planar region of the third pipe wall. The inlet port introduces the first liquid coolant into the manifold, while the outlet port removes the first liquid coolant from the manifold.

[0028] In fact, the aforementioned manifold can be roughly shaped as a cuboid. The main body of the manifold can be roughly rectangular. The cross-section of this rectangular tube perpendicular to the second direction can be roughly rectangular, and the four corners of this rectangle can also be rounded. This reduces sharp edges on the outer wall of the main body, minimizing collision damage during transportation and installation, and also reducing collision injuries to other components or installation personnel. Furthermore, the rounded corner design facilitates the demolding and forming of the main body.

[0029] It should be understood that, in addition to the rectangular tubes mentioned above, the main body of the manifold can also be made of elliptical tubes, etc.

[0030] Secondly, embodiments of this application disclose a liquid cooling heat dissipation unit. The liquid cooling heat dissipation unit is used to connect with a liquid cooling component, and the liquid cooling component is used to contact the component to be cooled. The liquid cooling heat dissipation unit includes: the liquid cooling heat dissipation component, the liquid storage component, and the pumping component involved in any of the aforementioned first aspects and various implementations of the first aspect. The inlet of the liquid cooling heat dissipation component is connected to the outlet of the liquid cooling component, the outlet of the liquid cooling heat dissipation component is connected to the inlet of the liquid storage component, the outlet of the liquid storage component is connected to the inlet of the pumping component, and the outlet of the pumping component is connected to the inlet of the liquid cooling component.

[0031] Since the aforementioned liquid cooling heat dissipation component has the advantages of relatively small size and relatively good heat dissipation performance, the liquid cooling heat dissipation unit with this component can also have similar advantages, which will not be repeated here. In the liquid cooling heat dissipation unit, the inlet of the pumping component is connected to the liquid storage component, and the liquid storage component contains the first liquid cooling working fluid after being cooled by the liquid cooling heat dissipation component. That is to say, the pumping component directly introduces the first liquid cooling working fluid with a relatively low temperature from the liquid storage component. Therefore, the pump body, impeller, seals and other components of the pumping component are not easily damaged by thermal expansion, which can effectively extend the service life of the pumping component.

[0032] In practical applications, liquid cooling heat dissipation units may also include air supply components, such as fans, which can generate forced convection to enhance heat dissipation and cooling of the liquid cooling heat dissipation components and their internal first liquid cooling medium. In addition, liquid cooling heat dissipation components can also employ liquid cooling processes, specifically contact liquid cooling or immersion liquid cooling.

[0033] In specific applications, the liquid cooling heat dissipation unit may also include a frame. The aforementioned liquid cooling heat dissipation components, liquid storage components, pumping components, and air supply components can all be directly or indirectly installed on the frame to achieve integrated assembly of the liquid cooling heat dissipation unit. This can improve the structural compactness of the liquid cooling heat dissipation unit and facilitate the transportation and installation of the liquid cooling heat dissipation unit.

[0034] Thirdly, embodiments of this application disclose a charging device, including a liquid cooling heat dissipation unit and a charging gun as described in the second aspect. The charging gun contains a liquid cooling component, which is connected to the liquid cooling heat dissipation unit. The volume of the aforementioned liquid cooling heat dissipation unit can be relatively small, and correspondingly, the volume of the charging device equipped with this liquid cooling heat dissipation unit can also be relatively small, which is beneficial for the miniaturization design of the charging device. At the same time, the heat dissipation performance of the liquid cooling heat dissipation unit can be relatively good, which also helps to ensure the normal operation and performance of the charging device.

[0035] In practical applications, the charging device may also include a charging pile, and the aforementioned liquid cooling heat dissipation unit may be integrated inside the charging pile. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of one implementation of the charging device provided in the embodiments of this application;

[0037] Figure 2 This is a structural diagram of the liquid cooling heat dissipation unit, including the liquid cooling heat dissipation components, liquid storage components, pumping components, air supply components, and some connecting pipelines.

[0038] Figure 3 for Figure 2 A structural diagram from another perspective;

[0039] Figure 4 This is a schematic diagram of the liquid cooling heat dissipation component.

[0040] Figure 5 for Figure 4 A schematic diagram of the manifold located on the lower side;

[0041] Figure 6 for Figure 5 A schematic diagram of the main body of the central tube from another perspective;

[0042] Figure 7 for Figure 6 A magnified view of a portion of the image;

[0043] Figure 8 for Figure 6 Side view;

[0044] Figure 9 for Figure 5 Schematic diagram of the structure of the second pipe wall;

[0045] Figure 10 for Figure 9 Schematic diagram of the structure of the first blocking plate section;

[0046] Figure 11 A flow path diagram of the first liquid cooling working fluid in a liquid-cooled heat dissipation component;

[0047] Figure 12 This is a flow path diagram of the first liquid cooling working fluid within a liquid-cooled heat dissipation component.

[0048] The annotations in the attached figures are explained as follows:

[0049] 100 charging device;

[0050] 1000 Liquid cooling heat dissipation unit, 1100 Liquid cooling heat dissipation component, 1110 Heat pipe, 1120 Manifold, 1121 Pipe body, 1121A First pipe wall, 1121A1 Mounting socket, 1121B Third pipe wall, 1121B1 Liquid inlet, 1121B2 Liquid outlet, 1121C Pipe chamber, 1121C1 Main chamber, 1121C2 Mounting chamber, 1121C3 Mounting step surface, 1121D Corner, 1122 Second pipe wall, 1122A First blocking plate, 1122A1 Main plate, 1122 A2 Cover plate, 1122A3 Protruding plate, 1122B Second blocking plate, 1122C Buffer gap, 1123 Support rib, 1123A Rib main body, 1123B Rib connecting part, 1123B1 Connecting surface, 1123C Through hole, 1124 Baffle, 1130 First mounting plate, 1140 Second mounting plate, 1150 Adapter, 1200 Liquid storage component, 1300 Pumping component, 1500 Air supply component, 1600 First connecting pipe, 1700 Frame, 1710 Base frame, 1720 Side frame, 1730 Top frame;

[0051] 2000 Charging gun, 2100 Main body, 2200 Liquid cooling component, 2300 Second connecting pipe. Detailed Implementation

[0052] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0053] In the description of the embodiments of this application, the terms "first," "second," "third," "primary," and "secondary" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," "third," "primary," and "secondary" may explicitly or implicitly include one or more of that feature.

[0054] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0055] In the description of the embodiments of this application, the term "multiple" refers to two or more. Furthermore, the use of "multiple" to describe the quantity of different components does not indicate a quantitative relationship between these components.

[0056] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0057] Please refer to Figures 1-3 , Figure 1 This is a schematic diagram of one implementation of the charging device provided in the embodiments of this application. Figure 2 This is a structural diagram of the liquid cooling heat dissipation unit, including the liquid cooling heat dissipation components, liquid storage components, pumping components, air supply components, and some connecting pipes. Figure 3 for Figure 2 A structural diagram from another perspective.

[0058] like Figure 1 As shown, this application embodiment relates to a charging device 100, which can be used, for example, to charge electric vehicles waiting for charging equipment, including a charging pile and a charging gun 2000.

[0059] The charging gun 2000 is the main functional module of the charging device, used to realize the core charging function. The charging gun 2000 includes a body 2100 and a liquid cooling component 2200. The body 2100 may include a circuit section and a connection section; the circuit section may include a circuit board and some electronic components, while the connection section may include an electrical connector plug for direct connection to the device to be charged. The liquid cooling component 2200 may be, for example, a liquid cooling plate, and the liquid cooling component 2200 can contact the body 2100.

[0060] The charging station may include a liquid cooling heat dissipation unit 1000. The liquid cooling heat dissipation unit 1000 may be connected to the aforementioned liquid cooling component 2200, and a first liquid cooling working fluid may circulate between the liquid cooling heat dissipation unit 1000 and the liquid cooling component 2200. The first liquid cooling working fluid may be, for example, water, fluoride, oil, etc.

[0061] During charging, the large amount of heat generated by the main body 2100 can be directly transferred to the liquid cooling component 2200, where it can be absorbed and carried away by the circulating first liquid cooling medium, thus achieving cooling of the main body 2100 of the charging gun 2000. Compared to traditional air cooling, the liquid cooling process using the liquid cooling unit 1000 and the liquid cooling component 2200 in this embodiment has better heat dissipation performance, better ensuring the internal operating temperature of the charging gun 2000. In particular, it is well-suited for cooling high-power charging guns 2000, better meeting the needs of use.

[0062] In some alternative implementations, the liquid cooling heat dissipation unit 1000 may include a liquid cooling heat dissipation component 1100, a liquid storage component 1200, and a pumping component 1300.

[0063] Combination Figures 1-3 The outlet of the liquid cooling component 2200 can be connected to the inlet of the liquid cooling heat dissipation component 1100 to introduce the relatively high-temperature first liquid cooling working fluid from the liquid cooling component 2200 into the liquid cooling heat dissipation component 1100. The liquid cooling heat dissipation component 1100 can cool down the first liquid cooling working fluid. The outlet of the liquid cooling heat dissipation component 1100 can be connected to the inlet of the liquid storage component 1200 to introduce the cooled first liquid cooling working fluid back into the liquid storage component 1200. The outlet of the liquid storage component 1200 can be connected to the inlet of the pumping component 1300, and the outlet of the pumping component 1300 can be connected to the inlet of the liquid cooling component 2200. The pumping component 1300 provides pumping driving force for the circulating first liquid cooling working fluid to ensure that the first liquid cooling working fluid can circulate between the components in a set sequence. Furthermore, since the pumping component 1300 directly introduces the first liquid cooling working fluid, which has a relatively low temperature inside the liquid storage component 1200, the pump body, impeller, seals and other components of the pumping component 1300 are not prone to thermal expansion damage, which can effectively extend the service life of the pumping component 1300.

[0064] In the above implementation, the heat dissipation and cooling method of the liquid cooling heat dissipation component 1100 can be liquid cooling and / or air cooling, etc.

[0065] When using liquid cooling technology to dissipate heat from the liquid-cooled heat dissipation component 1100, either a contact liquid cooling process or an immersion liquid cooling process can be used. When using a contact liquid cooling process, a contact liquid cooling component similar to the aforementioned liquid cooling component 2200 can be configured to cool the liquid-cooled heat dissipation component 1100. When using an immersion liquid cooling process, a liquid cooling cavity capable of containing and circulating a second liquid cooling medium can be constructed, and the liquid-cooled heat dissipation component 1100 can be at least partially immersed in the second liquid cooling medium within the liquid cooling cavity to directly cool the liquid-cooled heat dissipation component 1100 through the second liquid cooling medium. The second liquid cooling medium can also be water, fluoride, oil, etc.

[0066] When using air cooling technology to dissipate heat from the liquid-cooled heat dissipation component 1100, heat dissipation holes can be provided on the outer casing of the charging device to achieve heat dissipation and cooling of the liquid-cooled heat dissipation component 1100 by means of natural air convection.

[0067] Or such as Figures 1-3 As shown, the liquid cooling heat dissipation unit 1000 may also be provided with an air supply component 1500. The air supply component 1500 may be, for example, a fan, which can generate forced convection and enhance the heat dissipation and cooling of the liquid cooling heat dissipation unit 1100 and the first liquid cooling working fluid inside it. The number of air supply components 1500 may be one or more, and is not limited here. In a specific arrangement, the air supply component 1500 can be located upstream of the liquid cooling heat dissipation component 1100, meaning that the cooling air can first pass through the air supply component 1500 and then flow to the liquid cooling heat dissipation component 1100. In this case, the temperature of the cooling air flowing through the air supply component 1500 can be relatively low, and the cooling air can also better dissipate heat from the air supply component 1500, which is beneficial to ensuring the operating temperature and service life of the air supply component 1500. Alternatively, the air supply component 1500 can also be located downstream of the liquid cooling heat dissipation component 1100, meaning that the cooling air can first pass through the liquid cooling heat dissipation component 1100 and then flow to the air supply component 1500. In this case, the temperature of the cooling air in contact with the liquid cooling heat dissipation component 1100 can be relatively low, which can enhance the heat dissipation of the liquid cooling heat dissipation component 1100.

[0068] In this embodiment, the liquid cooling heat dissipation unit 1000 may further include a first connecting pipe 1600. The first connecting pipe 1600 is used to connect the liquid cooling heat dissipation component 1100, the liquid storage component 1200, and the pumping component 1300 inside the liquid cooling heat dissipation unit 1000. The first connecting pipe 1600 may be a rigid pipe; or it may be a flexible pipe; or it may be partially rigid and partially flexible. In short, the first connecting pipe 1600 can achieve the technical purpose of connecting different components. In specific applications, the first connecting pipe 1600 may also be equipped with some valve components for adjusting the flow rate and on / off state of the first liquid cooling working fluid. The number and placement of the valve components are not limited here.

[0069] The charging gun 2000 may also be equipped with a second connecting pipe 2200. The second connecting pipe 2200 can connect the liquid cooling component 2200 and the liquid cooling heat dissipation unit 1000. Specifically, it can connect to the liquid cooling heat dissipation component 1100 and the pumping component 1300 in the liquid cooling heat dissipation unit 1000. The structure of the second connecting pipe 2200 can be the same as that of the first connecting pipe 1600 mentioned above, and will not be described again here.

[0070] In some optional implementations, the liquid cooling heat dissipation unit 1000 provided in this application embodiment may further include a frame 1700. The aforementioned liquid cooling heat dissipation component 1100, liquid storage component 1200, pumping component 1300, and air supply component 1500 can all be directly or indirectly installed on the frame 1700 to achieve integrated assembly of the liquid cooling heat dissipation unit 1000, which can improve the structural compactness of the liquid cooling heat dissipation unit 1000 and facilitate the transportation and installation of the liquid cooling heat dissipation unit 1000.

[0071] Combination Figure 2 and Figure 3 In a specific example, the rack 1700 may include a base frame 1710, two side frames 1720, and a top frame 1730. The base frame 1710 and top frame 1730 can be arranged opposite each other, as can the two side frames 1720. Both side frames 1720 can be connected to the base frame 1710 and the top frame 1730. The two side frames 1720, the base frame 1710, and the top frame 1730 can enclose an installation space (not shown in the figure). For ease of description, the direction in which the two side frames 1720 are arranged opposite each other can be referred to as the X-direction, and the direction in which the base frame 1710 and the top frame 1730 are arranged opposite each other can be referred to as the Z-direction. The direction perpendicular to both the X and Z directions can be referred to as the Y-direction. The X and Z directions can be arranged at an angle, for example, 90 degrees, or other angle values, which are not limited here.

[0072] Both the liquid cooling heat dissipation component 1100 and the air supply component 1500 can be installed in the aforementioned installation space and can be arranged sequentially along the Y direction. In this case, a heat dissipation airflow channel for the liquid cooling heat dissipation component 1100 can also be formed within the installation space. Specifically, the liquid cooling heat dissipation component 1100 and the air supply component 1500 can be arranged at intervals along the Y direction. The liquid storage component 1200 can be installed on the top frame 1730 to fully utilize the space above the rack 1700 and avoid obstructing the heat dissipation airflow channel, thereby reducing air resistance in the heat dissipation airflow channel and improving the heat dissipation effect of the liquid cooling heat dissipation component 1100. The pumping component 1300 can be installed on the base frame 1710. Due to the large weight of the pumping component 1300, installing it on the base frame 1710 can improve its installation stability and reduce the possibility of damage to the rack 1700. Figure 2 In one implementation, the pumping component 1300 can be located on the side of the liquid cooling heat dissipation component 1100 away from the air supply component 1500. In other implementations, the pumping component 1300 can also be located on the side of the air supply component 1500 away from the liquid cooling component 1100. In other words, the installation position of the pumping component 1300 can actually be varied.

[0073] It should be understood that the specific structural form of the rack 1700 is not limited to... Figure 2 and Figure 3 As shown, in practical applications, the rack 1700 can also adopt other structural forms, as long as they meet the usage requirements. For example, the rack 1700 may not include the side frame 1720 and the top frame 1730. In this case, all components can be directly installed on the base frame 1710, and the structural form of the rack 1700 can be relatively simple. As another example, the rack 1700 may also include a sealing plate, which can be located on the side of the air supply component 1500 away from the liquid cooling heat dissipation component 1100. This sealing plate can be connected to the aforementioned base frame 1710, side frame 1720, and top frame 1730. Furthermore, the sealing plate may also be provided with ventilation holes so that the air supply component 1500 can introduce cooling air from the outside.

[0074] Furthermore, the mounting positions of the components in the liquid cooling heat dissipation unit 1000 on the rack 1700 are not limited to those of other components. Figure 2 and Figure 3As shown, in practical applications, those skilled in the art can flexibly adjust the installation positions of each component, as long as the usage requirements are met. For example, the pumping component 1300 can also be installed on the top frame 1730. In this case, the distance between the pumping component 1300 and the liquid storage component 1200 can be relatively close, and the first connecting pipe 1600 between them can be relatively short, which simplifies the connection structure between the pumping component 1300 and the liquid storage component 1200. Alternatively, the liquid storage component 1200 can also be installed on the base frame 1710. In this case, the support burden on the top frame 1730 can be reduced, the structure of the top frame 1730 can be relatively simple, which helps to reduce the cost of the top frame 1730, and also reduces the size of the liquid cooling heat dissipation unit 1000 in the Z direction; furthermore, the distance between the liquid storage component 1200 and the pumping component 1300 can also be relatively short, which also helps to reduce the size of the first connecting pipe 1600 between them.

[0075] Please refer to Figures 4-10 , Figure 4 This is a schematic diagram of the liquid cooling heat dissipation component. Figure 5 for Figure 4 A schematic diagram of the manifold located on the lower side. Figure 6 for Figure 5 A schematic diagram of the main body of the central tube from another perspective. Figure 7 for Figure 6 A magnified view of a portion of the image. Figure 8 for Figure 6 Side view, Figure 9 for Figure 5 A schematic diagram of the structure of the second pipe wall. Figure 10 for Figure 9 A schematic diagram of the structure of the first blocking plate section.

[0076] like Figure 4 As shown in the illustration, this application embodiment also provides a liquid cooling heat dissipation component 1100, including a heat dissipation pipe 1110 and a manifold 1120. The extension direction of the heat dissipation pipe 1110 is a first direction, and the extension direction of the manifold 1120 is a second direction. The direction perpendicular to the first and second directions is a third direction. In this application embodiment, the first direction is the aforementioned Z direction, the second direction is the aforementioned X direction, and the third direction is the aforementioned Y direction.

[0077] There are two manifolds 1120, which can be arranged opposite each other in the Z direction. The two ends of the heat dissipation pipe 1110 in the Z direction can be connected to the two manifolds 1120 respectively. There can be multiple heat dissipation pipes 1110, which can be arranged at intervals along the X direction. A manifold chamber (not shown in the figure) can be formed inside the manifold 1120, and a heat dissipation chamber (not shown in the figure) can be formed inside the heat dissipation pipe 1110. Each heat dissipation chamber can be connected to the manifold chamber to realize the flow of the first liquid cooling medium in the two manifolds 1120 and each heat dissipation pipe 1110.

[0078] In one specific example, the outer wall of the heat pipe 1110 may not be equipped with heat dissipation fins or other heat dissipation accessories; in this case, there can be relatively large gaps between the heat pipes 1110, and the overall structure of the liquid cooling component 1100 can be relatively simple. In another specific example, the heat pipe 1110 may be equipped with heat dissipation fins or other heat dissipation accessories; in this case, the liquid cooling component 1100 can have a larger heat dissipation area and better heat dissipation effect.

[0079] The liquid cooling heat dissipation component 1100 may further include a first mounting plate 1130. (See reference...) Figure 4 The orientation and positional relationship in the diagram, the Z direction can also be referred to as the up and down direction. The first mounting plate 1130 can be provided on the lower surface of the manifold 1120 located on the lower side. The connection method between the first mounting plate 1130 and the manifold 1120 can be, for example, welding. The provision of the first mounting plate 1130 allows for more diverse connection methods between the liquid cooling heat dissipation component 1100 and the aforementioned base frame 1710. For example, the manifold 1120 and the base frame 1710 can be connected by screws, and the corresponding screw holes can be opened in the first mounting plate 1130 instead of being located in the manifold 1120. This reduces the impact on the strength and sealing of the manifold 1120, while also ensuring convenient assembly and disassembly between the liquid cooling heat dissipation component 1100 and the frame 1700. In some examples, the upper surface of the upper one of the two manifolds 1120 may also be provided with the aforementioned first mounting part 1130 so as to connect with the top frame 1730, thereby improving the stability and reliability of the liquid cooling heat dissipation component 1100 installation.

[0080] The liquid cooling heat dissipation component 1100 may also include a second mounting plate 1140. As before... Figure 4As shown, in each heat dissipation pipe 1110, the two heat dissipation pipes 1110 located at both ends in the X direction can be provided with the aforementioned second mounting plate 1140. The connection between the second mounting plate 1140 and the heat dissipation pipe 1110 can also be welding. The second mounting plate 1140 is used to connect with the aforementioned side frame 1720, which also makes the connection between the liquid cooling heat dissipation component 1100 and the side frame 1720 more diversified, so as to facilitate the connection between the liquid cooling heat dissipation component 1100 and the side frame 1720.

[0081] In this embodiment, the maximum dimension of the manifold 1120 in the Z direction can be defined as a first dimension L1, and the maximum dimension of the manifold 1120 in the Y direction can be defined as a second dimension L2. The ratio of the first dimension L1 to the second dimension L2 can be between approximately 5% and 50%. Thus, given a fixed dimension of the manifold 1120 in the Y direction, its dimension in the Z direction can be significantly reduced. Compared to a circular tube, under a fixed volume ratio, the manifold 1120 in this embodiment can have a larger heat exchange area, which can further improve the heat dissipation performance of the liquid cooling component 1100. Furthermore, under a fixed heat exchange area, the space occupied by the manifold 1120 in the Z direction can be smaller, allowing the liquid cooling component 1100 to have a relatively smaller dimension in the Z direction. This significantly reduces the installation space occupied by the liquid cooling component 1100, which is beneficial for the miniaturization design of the liquid cooling unit 1000 and the charging device 100.

[0082] In some alternative implementations, the ratio between the first dimension L1 and the second dimension L2 can be between approximately 10% and 20%. This not only allows for better control of the dimensions of the manifold 1120 in the Z direction to reduce its installation space, but also ensures that the heat dissipation area of ​​the manifold 1120 is adequate, thus enabling the manifold 1120 to possess relatively high heat dissipation performance.

[0083] In some alternative implementations, such as Figure 5 As shown, the manifold 1120 may include a main body 1121 and two second pipe walls 1122. Both the main body 1121 and the two second pipe walls 1122 can be separate structures, manufactured separately and then assembled. After assembly, the two second pipe walls 1122 and the main body 1121 can enclose and form the manifold chamber of the manifold 1120.

[0084] The main body 1121 is the main structure of the manifold 1120. The main body 1121 can extend along the X direction, and the inner cavity of the main body 1121 can form a pipe chamber 1121C. The aforementioned first dimension L1 and second dimension L2 can be understood as referring to the dimensions of the main body 1121.

[0085] The main body 1121 may include two first pipe walls 1121A, which may be arranged opposite to each other in the Z direction. One of the two first pipe walls 1121A is used to connect to the heat dissipation pipe 1110. For ease of description, in the embodiments of this application, the first pipe wall 1121A connected to the heat dissipation pipe 1110 may be referred to as the primary pipe wall, and the first pipe wall 1121A not connected to the heat dissipation pipe 1110 may be referred to as the secondary pipe wall.

[0086] exist Figure 4 In the implementation method, the manifold 1120 located on the lower side can be referred to Figure 6 and Figure 7 , Figure 6 and Figure 7 The first pipe wall 1121A located on the upper side is the primary pipe wall, and the first pipe wall 1121A located on the lower side is the secondary pipe wall; conversely, in Figure 4 For the upper manifold 1120, the lower wall is the primary wall, and the upper wall is the secondary wall. The primary wall may have mounting holes 1121A1 that connect to the pipe chamber 1121C. There may be multiple mounting holes 1121A1, and the number of mounting holes 1121A1 may match the number of heat dissipation pipes 1110. During assembly, each heat dissipation pipe 1110 is inserted into its corresponding mounting hole 1121A1, allowing the heat dissipation chamber within each heat dissipation pipe 1110 to connect to the pipe chamber 1121C. Welding can also be performed between the heat dissipation pipes 1110 and the primary wall to ensure a tight seal at the connection. The primary wall may have a certain thickness to ensure reliable welding between the heat dissipation pipes 1110 and the primary wall. The secondary pipe wall can be connected to the aforementioned first mounting plate 1130, and ultimately used to connect to the frame 1700.

[0087] At least a portion of the outer wall surface of the two first pipe walls 1121A can be a planar area. For the first-stage pipe wall, the aforementioned mounting hole 1121A1 can be formed by cutting within the planar area of ​​the first-stage pipe wall, thus reducing the machining difficulty of the mounting hole 1121A1. Similarly, for the second-stage pipe wall, the aforementioned first mounting plate 1130 can be installed within the planar area of ​​the second-stage pipe wall to reduce the installation difficulty of the first mounting plate 1130.

[0088] The main body 1121 may also include two third pipe walls 1121B, which may be arranged opposite to each other in the Y direction. The third pipe wall 1121B may be provided with an inlet hole 1121B1 and an outlet hole 1121B2.

[0089] The inlet port 1121B1 can be connected to the liquid cooling component 2200 via the first connecting pipe 1600, so as to introduce the relatively high-temperature first liquid cooling working fluid in the liquid cooling component 2200 into the liquid cooling heat dissipation component 1100. The outlet port 1121B2 can be connected to the liquid storage component 1200 via the first connecting pipe 1600, so as to introduce the relatively low-temperature first liquid cooling working fluid after being cooled by the liquid cooling heat dissipation component 1100 into the liquid storage component 1200. In a specific example, both the inlet port 1121B1 and the outlet port 1121B2 can be directly connected to the first connecting pipe 1600. In another specific example, such as... Figure 4 As shown, the manifold 1120 can also be connected to a connector 1150, through which the inlet port 1121B1 and the outlet port 1121B2 can be indirectly connected to the first connecting pipe 1600. The connector 1150 is provided with internal piping, which can easily adjust the relative position of the first connecting pipe 1600 and the manifold 1120, thereby facilitating the arrangement and installation of the first connecting pipe 1600. The specific structural form of the connector 1150 is not limited here.

[0090] In practical applications, the liquid inlet 1121B1 and the liquid outlet 1121B2 can be located in the same manifold 1120, or the liquid inlet 1121B1 and the liquid outlet 1121B2 can be located in two different manifolds 1120. This is specifically related to the process design in the liquid cooling heat dissipation component 1100.

[0091] In the two third pipe walls 1121B, at least a portion of the outer wall surface of at least one can be a planar region. Specifically, the third pipe wall 1121B can be cut in the planar region to form the above-mentioned inlet hole 1121B1 and outlet hole 1121B2, thereby facilitating the processing and forming of the inlet hole 1121B1 and outlet hole 1121B2.

[0092] exist Figures 4-8In this implementation, the cross-section of the outer wall of the main pipe 1121 perpendicular to the X direction can be approximately rectangular. Therefore, the main pipe 1121 can be approximately a rectangular pipe, and correspondingly, the manifold 1120 can be approximately a cuboid structure. The aforementioned first dimension L1 can be the width of the rectangle, and the aforementioned second dimension L2 can be the length of the rectangle. Most areas of the outer walls of the two first pipe walls 1121A and the two third pipe walls 1121B can be planar areas, facilitating the placement of the aforementioned mounting holes 1121A1, the first mounting plate 1130, the inlet hole 1121B1, and the outlet hole 1121B2. Furthermore, rounded corners can be provided at the four corners of the rectangle. This reduces the sharp edges on the outer wall of the main body 1121, which can reduce collision damage to the manifold 1120 during transportation and installation. It can also reduce collision damage to other components or installers. Moreover, the design of these rounded corners is also conducive to the demolding of the main body 1121.

[0093] The shape of the cross-section perpendicular to the X-direction of the inner wall of pipe chamber 1121C can be varied and is not specifically limited here. Figures 6-8 In this implementation, the cross-section of the inner wall of the pipe chamber 1121C perpendicular to the X direction can be approximately elongated, and both ends of this cross-section in the Y direction can be arc-shaped, facilitating demolding of the inner wall of the pipe body 1121. In this case, the minimum dimension of the first pipe wall 1121A in the Z direction can be L3, and the minimum dimension of the third pipe wall 1121B in the Y direction can be L4. L3 and L4 can be equal or unequal, and this is not limited here. The four corners of the pipe body 1121 can form corner portions 1121D. The dimension of the corner portion 1121D in the Z direction can be greater than L3, and the dimension in the Y direction can be greater than L4. That is, the dimension of the corner portion 1121D can be relatively large, which helps to improve the structural strength of the pipe body 1121.

[0094] It should be understood that the cross-sectional shape of the outer wall of the pipe body 1121 perpendicular to the X direction is not limited to the above description, and can actually be set to other shapes, as long as the aforementioned proportional relationship between the first dimension L1 and the second dimension L2 can be satisfied. For example, the cross-section of the outer wall of the pipe body 1121 perpendicular to the X direction can also be elliptical. In this case, the first dimension L1 can be the minor axis dimension of the ellipse, and the second dimension L2 can be the major axis dimension of the ellipse. As another example, the shape of the outer wall of the pipe body 1121 can be consistent with the shape of the inner wall of the pipe chamber 1121C, which is also feasible.

[0095] In some optional implementations, at least one support rib 1123 extending in the X direction may be provided inside the pipe chamber 1121C, and the two ends of the support rib 1123 in the Z direction may be connected to the two first pipe walls 1121A respectively. With this configuration, the support rib 1123 can reinforce the structural strength of the pipe body 1121 in the Z direction, which can largely overcome the problem of strength reduction caused by the reduction of the first dimension L1 of the pipe body 1121. This can reduce the swelling or crushing of the manifold 1120 in the Z direction during use, so that the structural strength of the liquid cooling heat dissipation component 1100 provided in this application embodiment can be relatively high.

[0096] Combination Figure 8 The supporting rib 1123 may include a rib body portion 1123A and two rib connecting portions 1123B. The two rib connecting portions 1123B may be located at opposite ends of the rib body portion 1123A in the Z direction. The end faces of the two rib connecting portions 1123B away from the rib body portion 1123A in the Z direction may be connecting surfaces 1123B1, and the connecting surfaces 1123B1 of the two rib connecting portions 1123B may be connected to the two first pipe walls 1121A respectively. Furthermore, in the rib connecting portion 1123B, at least the dimension L6 of the connecting surface 1123B1 in the Y direction may be greater than the dimension L5 of the rib body portion 1123A in the Y direction. In this way, the connection strength between the support rib 1123 and the first pipe wall 1121A can be relatively high, which can reduce the failure of the connection between the support rib 1123 and the first pipe wall 1121A caused by factors such as the scouring of the first liquid cooling medium during subsequent use, as well as the resulting swelling of the manifold 1120 along the Z direction during use.

[0097] In the Z direction, the dimension of the rib connection 1123B in the Y direction can be gradually varied; that is, the dimension of the rib connection 1123B in the Y direction can gradually decrease from L6 to L5. For ease of description, the two wall surfaces of the rib connection 1123B that are arranged opposite each other in the Y direction can be referred to as the rib side wall surfaces. Figures 6-8 In one implementation, the sidewall of the rib can be an arc-shaped surface. Alternatively, in some other implementations of this application, the sidewall of the rib can also be an inclined surface that forms an angle with the Z direction (and the Y direction).

[0098] Alternatively, the dimension of the rib connection 1123B in the Y direction can be set to remain unchanged. In this case, the dimension of the rib connection 1123B in the Y direction can be L6, and a stepped surface can be formed between the rib connection 1123B and the rib body 1123A.

[0099] The dimension L5 of the main body 1123A in the Y direction can be related to the aforementioned dimensions L3 and L4. For example, L5 can be controlled to be about one to two times that of L3 or L4 to ensure the strength and support performance of the supporting rib 1123. Of course, the dimension L5 of the main body 1123A can also be designed without referring to the aforementioned dimensions L3 and L4, as long as the supporting rib 1123 can perform its corresponding function.

[0100] In the above implementations, the main body 1123A and the connecting part 1123B can be integrally formed structures, such as integral casting, which simplifies the forming process. Alternatively, the main body 1123A and the connecting part 1123B can be prepared separately and then assembled, which is also feasible.

[0101] Similarly, the support rib 1123 and the tube body 1121 can be integrally formed, such as by integral casting, which simplifies the forming process. Alternatively, the support rib 1123 and the tube body 1121 can be prepared separately and then assembled, which is also feasible.

[0102] The support rib 1123 may also be provided with a through hole 1123C, which can connect the chambers on both sides of the support rib 1123 in the Y direction, so that the first liquid cooling medium can flow relatively uniformly in the manifold 1120, which can effectively improve the heat dissipation performance of the first liquid cooling medium in the manifold 1120.

[0103] The through hole 1123C and the aforementioned mounting hole 1121A1 can be interconnected. The through hole 1123C and the mounting hole 1121A1 can be machined simultaneously, thus allowing them to be directly connected, and simplifying the machining process. Alternatively, the through hole 1123C and the mounting hole 1121A1 can be machined separately, in which case they can be directly connected or not directly connected.

[0104] The number of through holes 1123C can be one. Or, as... Figure 6 and Figure 7 As shown, the number of through holes 1123C can also be multiple. In this case, each through hole 1123C can be arranged at intervals in the X direction.

[0105] Combination Figure 5Two second pipe walls 1122 can be located on opposite sides of the main pipe portion 1121 in the X direction, and the two second pipe walls 1122 can be connected to both ends of the main pipe portion 1121 in the X direction to seal both ends of the pipe chamber 1121C. The connection method between the second pipe walls 1122 and the main pipe portion 1121 can be, for example, welding, to ensure the sealing performance of the connection between the second pipe walls 1122 and the main pipe portion 1121. After installation, the second pipe walls 1122 and the main pipe portion 1121 can enclose each other to form the aforementioned manifold chamber.

[0106] In some alternative implementations, such as Figure 9 As shown, the second pipe wall 1122 can be a double-layer plate portion. The double-layer plate portion can include a first blocking plate portion 1122A and a second blocking plate portion 1122B spaced apart along the X direction. Both the first blocking plate portion 1122A and the second blocking plate portion 1122B can be connected to the pipe body portion 1121. The first blocking plate portion 1122A can be located outside the second blocking plate portion 1122B, that is, the first blocking plate portion 1122A can be located on the side of the second blocking plate portion 1122B away from the manifold chamber. A buffer gap 1122C can be formed between the first blocking plate portion 1122A and the second blocking plate portion 1122B. The side of the second blocking plate portion 1122B away from the first blocking plate portion 1122A is the manifold chamber.

[0107] With this configuration, the first blocking plate portion 1122A and the second blocking plate portion 1122B can form a double-layer protection. Even if the second blocking plate portion 1122B cracks due to the impact of the first liquid coolant, the first blocking plate portion 1122A can still provide protection, significantly reducing the possibility of leakage of the first liquid coolant at the connection between the second pipe wall 1122 and the pipe body portion 1121. Furthermore, once a crack appears in the second blocking plate portion 1122B, the first liquid coolant can flow into the buffer gap 1122C through the crack, ensuring that the first liquid coolant is present on both sides of the second blocking plate portion 1122B in the X direction, and that the pressure of the first liquid coolant on both sides is similar. This keeps the second blocking plate portion 1122B in a state of near-equilibrium in the X direction, reducing the likelihood of it being subjected to greater impact from the first liquid coolant during subsequent use. Consequently, cracks on the second blocking plate portion 1122B are less likely to expand or increase, reducing the risk of leakage. The possibility of greater damage to 22B is reduced; however, if the second blocking plate portion 1122B does not suffer further damage, the second blocking plate portion 1122B can effectively prevent the flow impact of the first liquid cooling working fluid in the manifold chamber from being directly transmitted to the buffer gap 1122C. The first liquid cooling working fluid in the buffer gap 1122C is almost in a non-flowing state. In this way, the first liquid cooling working fluid in the buffer gap 1122C is less likely to impact the first blocking plate portion 1122A, and the first blocking plate portion 1122A is less likely to be damaged. This can ensure the reliability of the seal to a greater extent.

[0108] Here, the dimensions of the buffer gap 1122C in the X direction are not limited in this embodiment. In practical applications, those skilled in the art can set it according to specific needs, as long as it meets the requirements of use. In a specific example, the dimensions of the buffer gap 1123C in the X direction can be between approximately 0.1 mm and 1 mm. This reduces the encroachment on the pipe chamber 1121C formed within the main body 1121, allowing more space within the pipe chamber 1121C to form a manifold chamber. This also maximizes the capacity of the manifold 1120 in this embodiment to accommodate and dissipate the first liquid cooling medium.

[0109] Combination Figure 7 , Figure 9 and Figure 10The pipe chamber 1121C may include a main chamber 1121C1 and an installation chamber 1121C2. The installation chamber 1121C2 may have a larger dimension in at least one of the Y and Z directions than the main chamber 1121C1. Thus, the inner wall of the pipe chamber 1121C may form an installation step surface 1121C3 between the main chamber 1121C1 and the installation chamber 1121C2. The first blocking plate portion 1122A may include a main plate portion 1122A1. The cross-sectional shape and dimensions of the main plate portion 1122A1 perpendicular to the X direction may be substantially the same as the cross-sectional shape and dimensions of the mounting chamber 1121C2 perpendicular to the X direction. A cover plate portion 1122A2 may be provided at the end of the main plate portion 1122A1 opposite to the second blocking plate portion 1122B in the X direction. The size of the cover plate portion 1122A2 in at least one of the Z and Y directions may be larger than that of the mounting chamber 1121C2. Therefore, the cover plate portion 1122A2 may be located in the mounting chamber 1121C2. On the outside; the main body plate portion 1122A1 may be provided with a protruding plate portion 1122A3 at one end facing the second blocking plate portion 1122B in the X direction. The dimensions of the protruding plate portion 1122A3 in both the Z and Y directions are not greater than the mounting chamber 1121C2, and at least one of the dimensions of the protruding plate portion 1122A3 in the Z and Y directions is smaller than the mounting chamber 1121C2. In this way, the protruding plate portion 1122A3 can also be inserted into the mounting chamber 1121C2, and a buffer gap 1122C can be formed between the protruding plate portion 1122A3 and the inner wall surface of the mounting chamber 1121C2.

[0110] During installation, the second plug plate portion 1122B can be inserted into the installation chamber 1121C2 and abut against the installation step surface 1121C3 in the X direction. The second plug plate portion 1122B can be connected to the pipe body portion 1121 by welding or other means to ensure the sealing performance at the connection between the second plug plate portion 1122B and the pipe body portion 1121. The main body plate portion 1122A1 can also be inserted into the installation chamber 1121C2, and the cover plate portion 1122A2 can abut against the axial end face of the pipe body portion 1121 in the X direction to control the insertion size of the main body plate portion 1122A1 in the installation chamber 1121C2. The first plug plate portion 1122A and the pipe body portion 1121 can also be connected by welding or other means to ensure the sealing performance at the connection between the pipe body portion 1121 and the first plug plate portion 1122A. The protruding plate portion 1122A3 can abut against the second blocking plate portion 1122B along the X direction. This allows for better control over the installation position of the second blocking plate portion 1122B. Even if the connection between the second blocking plate portion 1122B and the main pipe portion 1121 fails due to factors such as the impact of the first liquid cooling medium during use, the abutment between the protruding plate portion 1122A3 and the second blocking plate portion 1122B can still ensure that the position of the second blocking plate portion 1122B remains unchanged. In other words, the stable existence of the buffer gap 1122C can still be guaranteed. This is of positive significance for ensuring the overall sealing effect of the second pipe wall 1122 on the pipe chamber 1121C.

[0111] It should be understood that the above description of the specific structural form of the first blocking plate portion 1122A is only an exemplary illustration of the embodiments of this application. In practical applications, the first blocking plate portion 1122A can also adopt other structural forms, as long as they can meet the requirements of use. For example, the first blocking plate portion 1122A may only include the cover plate portion 1122A2. In this case, the first blocking plate portion 1122A may be entirely located outside the mounting chamber 1121C2. As another example, the first blocking plate portion 1122A may only include the main plate portion 1122A1. In this case, the first blocking plate portion 1122A may be at least partially embedded in the mounting chamber 1121C2, but the first blocking plate portion 1122A and the second blocking plate portion 1122B are not in direct contact. For example, the first blocking plate portion 1122A may also include only the cover plate portion 1122A2 and the main plate portion 1122A1. In this case, the main plate portion 1122A1 of the first blocking plate portion 1122A may be located in the mounting chamber 1121C2, while the cover plate portion 1122A2 may be located outside the mounting chamber 1121C2, and the first blocking plate portion 1122A still does not contact the second blocking plate portion 1122B. For example, the first blocking plate portion 1122A may also include only the main plate portion 1122A1 and the protruding plate portion 1122A3. In this case, the main plate portion 1122A1 may be at least partially embedded in the mounting chamber 1121C2, and the first blocking plate portion 1122A may contact the second blocking plate portion 1122B through the protruding plate portion 1122A3. For example, the first blocking plate portion 1122A may only include the cover plate portion 1122A2 and the protruding plate portion 1122A3. In this case, the protruding plate portion 1122A3 of the first blocking plate portion 1122A may be located in the mounting chamber 1121C2, while the cover plate portion 1122A2 may be located outside the mounting chamber 1121C2. The protruding plate portion 1122A3 and the second blocking plate portion 1122B may abut against each other, and a buffer gap 1122C may be formed between the protruding plate portion 1122A3 and the tube body portion 1121.

[0112] Since both the cover plate portion 1122A2 and the main body plate portion 1122A1 can seal the mounting chamber 1121C2, in this embodiment of the application, the first blocking plate portion 1122A may also include a blocking main body portion, which may include at least one of the cover plate portion 1122A2 and the main body plate portion 1122A1.

[0113] Please refer to Figure 11 and Figure 12 , Figure 11 This is a flow path diagram of the first liquid cooling working fluid within a liquid-cooled heat dissipation component. Figure 12 This is a flow path diagram of the first liquid cooling working fluid within a liquid-cooled heat dissipation component.

[0114] like Figure 11As shown, the liquid cooling heat dissipation component 1100 can be a single-flow design. In this case, the flow direction of the first liquid cooling medium within each heat dissipation pipe 1110 of the liquid cooling heat dissipation component 1100 is generally unidirectional, such as... Figure 11 The flow shown is from top to bottom, or it could be from bottom to top. The inlet port 1121B1 and the outlet port 1121B2 can be respectively provided in the two manifolds 1120.

[0115] like Figure 12 As shown, the liquid cooling heat dissipation component 1100 can also be a dual-flow design. A baffle 1124 can be installed in the lower of the two manifolds 1120 to divide the manifold chamber within the lower manifold 1120 into two separate chambers. In this way, in one part of the heat dissipation pipes 1110, the first liquid cooling medium can flow from top to bottom, while in the other part, it can flow from bottom to top. Both the inlet port 1121B1 and the outlet port 1121B2 can be located in the lower manifold 1120.

[0116] It should be understood that the liquid cooling heat dissipation component 1100 can also be configured with more processes, such as three processes, four processes, etc., which can be determined according to the actual use needs. For different process design requirements, those skilled in the art can selectively set baffles 1124 at different positions in the two manifolds 1120 in order to adjust the flow direction of the first liquid cooling working fluid in different heat dissipation pipes 1110.

[0117] Furthermore, in the descriptions of the above implementations, this application uses the application of the liquid cooling heat dissipation unit 1000 and the liquid cooling heat dissipation component 1100 in a charging device as an example. However, in reality, the application scope of the liquid cooling heat dissipation unit 1000 and the liquid cooling heat dissipation component 1100 mentioned in this application is not limited to charging devices; they can also be applied to other scenarios requiring heat dissipation. In other words, this application does not actually limit the application scenarios of the liquid cooling heat dissipation unit 1000 and the liquid cooling heat dissipation component 1100.

[0118] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A liquid-cooled heat dissipation component, characterized in that, It includes a heat sink and a manifold. The heat sink extends in a first direction, the manifold extends in a second direction, and a third direction is perpendicular to both the first and second directions. There are two manifolds, which are arranged opposite each other in the first direction. The two ends of the heat sink are connected to the two manifolds respectively. The maximum dimension of the manifold in the first direction is the first dimension, and the maximum dimension of the manifold in the third direction is the second dimension. The ratio of the first dimension to the second dimension is between 5% and 50%. The manifold includes two first pipe walls, which are arranged opposite to each other in the first direction. The manifold has a manifold chamber, and at least one supporting rib extending in the second direction is provided in the manifold chamber. The two ends of the supporting rib in the first direction are respectively connected to the two first pipe walls. The supporting rib includes a rib body and two rib connecting parts. The two rib connecting parts are located at both ends of the rib body in the first direction. The end faces of the two rib connecting parts away from the rib body are connecting surfaces. The connecting surfaces of the two rib connecting parts are respectively connected to the two first pipe walls. At least the dimension of the connecting surface of the rib connecting part in the third direction is greater than the dimension of the rib body in the third direction.

2. The liquid-cooled heat dissipation component according to claim 1, characterized in that, The ratio of the first dimension to the second dimension is between 10% and 20%.

3. The liquid-cooled heat dissipation component according to claim 1, characterized in that, The supporting rib is provided with a through hole extending along the third direction.

4. The liquid-cooled heat dissipation component according to any one of claims 1-3, characterized in that, The manifold includes a main body and two second pipe walls. The two second pipe walls and the main body are separate structures. The two second pipe walls are respectively connected to the two ends of the main body in the second direction. The second pipe wall is a double-layer plate section, which includes a first blocking plate section and a second blocking plate section arranged at intervals along the second direction. Both the first blocking plate section and the second blocking plate section are connected to the pipe body section.

5. The liquid-cooled heat dissipation component according to claim 4, characterized in that, The inner side of the main body of the pipe forms a pipe cavity, which includes a main cavity and two installation cavities. The two installation cavities are respectively located on both sides of the main cavity in the second direction. There is an installation step surface between the installation cavities and the main cavity. The second blocking plate is located in the installation cavity, and the second blocking plate abuts against the installation step surface. The first blocking plate portion includes a blocking main body portion, and a protruding plate portion is provided on the side of the blocking main body portion facing the second blocking plate portion. The protruding plate portion is located in the mounting cavity, and the protruding plate portion and the second blocking plate portion abut against each other along the second direction. The blocking main body portion is installed on the pipe main body portion.

6. The liquid-cooled heat dissipation component according to any one of claims 1-3, characterized in that, The manifold includes two first pipe walls and two third pipe walls. The two first pipe walls are arranged opposite each other in the first direction, and the two third pipe walls are arranged opposite each other in the third direction. At least a portion of the outer wall surface of the first pipe wall is a planar region, and at least a portion of the outer wall surface of the third pipe wall is a planar region.

7. A liquid-cooled heat dissipation unit, characterized in that, The liquid cooling heat dissipation unit is used to connect with the liquid cooling component, the liquid cooling component is used to contact the component to be cooled, and the liquid cooling heat dissipation unit includes: a liquid cooling heat dissipation component, a liquid storage component, and a pumping component as described in any one of claims 1-6, wherein the inlet of the liquid cooling heat dissipation component is connected to the outlet of the liquid cooling component, the outlet of the liquid cooling heat dissipation component is connected to the inlet of the liquid storage component, the outlet of the liquid storage component is connected to the inlet of the pumping component, and the outlet of the pumping component is connected to the inlet of the liquid cooling component.

8. A charging device, characterized in that, It includes the liquid cooling heat dissipation unit and the charging gun as described in claim 7, wherein the charging gun is provided with a liquid cooling component, and the liquid cooling component is connected to the liquid cooling heat dissipation unit.

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