Display module, display equipment and manufacturing method

Abstract

The invention provides a display module, a display device and a manufacturing method of the display module, the display module comprises a flexible display panel, a main circuit board and a flexible circuit board, the flexible display panel comprises a display area, a binding area and a bending area connecting the display area and the binding area, the binding area is bent towards the backlight face of the display area through the bending area, and the main circuit board is arranged on the main circuit board. The main circuit board is located on the backlight face of the display area, the flexible circuit board is connected with the main circuit board and the flexible display panel, and at least part of the projection of the flexible circuit board in the first direction is located in the main circuit board or the binding area. In this way, through the arrangement that at least part of the projection of the flexible circuit board in the first direction is located in the main circuit board or the binding area, the back space, occupied by the flexible circuit board, of the display module can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display module, a display device and a manufacturing method. Background Art

[0002] With the rapid development of the display industry, small and medium-sized OLED (Organic Light Emitting Diode) display technology has become increasingly mature, and OLED display technology has begun to move towards medium and large-sized products. In related technologies, medium and large-sized flexible OLED products usually use PCB (Printed Circuit Board) boards to carry EL IC (Electroluminescent Integrated Circuit) in consideration of cost and routing design. The use of COP (Chip on Pi) packaging technology can make the lower frame very small, but there is a problem with the product structure. The PCB board needs to be electrically connected to the display panel (panel) through FPC (Flexible Printed Circuit) and bonded to the non-display surface of the panel. After the panel is bent (pad bending), the PCB+FPC occupies a large back space, affecting the overall space layout of the machine, which is not conducive to the overall machine making more designs for the under-screen structure. Summary of the invention

[0003] In view of this, the present application provides a display module, a display device and a method for manufacturing the display module.

[0004] The display module of the embodiment of the present application includes:

[0005] A flexible display panel, the flexible display panel comprising a display area, a binding area, and a bending area connecting the display area and the binding area, the binding area being bent toward a backlight surface of the display area through the bending area;

[0006] A main circuit board, located on the backlight surface of the display area;

[0007] A flexible circuit board is connected to the main circuit board and the flexible display panel respectively, and a projection of the flexible circuit board in a first direction is at least partially located in the main circuit board or the binding area.

[0008] In some embodiments, the flexible circuit board includes a first connection area, a second connection area, and a stacking area connecting the first connection area and the second connection area, the first connection area is bound to the binding area, the second connection area is bound to the main circuit board, and the stacking area is arranged between the display area and the binding area.

[0009] In certain embodiments, a surface of the stacking region is provided with an adhesive sticker for bonding.

[0010] In some embodiments, the stacking area includes a bending portion and a fixing portion, and the adhesive tape is disposed on the fixing portion.

[0011] In some embodiments, the bending portion adopts a single-layer structural plate.

[0012] In some embodiments, the flexible circuit board includes a first connection area, a second connection area, and a stacking area connecting the first connection area and the second connection area, the first connection area is bound to the binding area, the second connection area is bound to the main circuit board, and the stacking area is arranged between the display area and the main circuit board.

[0013] In some embodiments, the first connection area is located on the binding surface of the binding area, the binding surface is located on the side of the binding area away from the display area and is bound to the binding area, and the second connection area is located on the back side of the main circuit board and is bound to the main circuit board, the back side is the side of the main circuit board close to the display area.

[0014] In some embodiments, a back adhesive is further attached to the back of the main circuit board, and the thickness of the back adhesive is greater than the thickness of the flexible circuit board in the second connection area.

[0015] In some embodiments, the display module further includes:

[0016] A back film, laminated on the backlight surface of the display area;

[0017] A protective layer under the screen, laminated on a side of the back film away from the display area;

[0018] A polarizer, stacked on the display surface of the display area;

[0019] An adhesive layer, laminated on a side of the polarizer away from the display area;

[0020] The cover plate is stacked on a side of the adhesive layer away from the polarizer.

[0021] The display device according to the embodiment of the present application includes the display panel described in the above embodiment.

[0022] The method for manufacturing a display module according to an embodiment of the present application includes:

[0023] A flexible display panel, a flexible circuit board and a main circuit board are provided, wherein the flexible display panel comprises a display area, a binding area and a bending area connecting the display area and the binding area, wherein the binding area is bent toward a backlight surface of the display area through the bending area;

[0024] Using a binding process to bind the flexible circuit board to the binding area of ​​the flexible display panel and the main circuit board respectively;

[0025] The flexible circuit board is bent so that at least a portion of the projection of the flexible circuit board in the first direction is located within the binding area.

[0026] In some embodiments, the preparation method further comprises:

[0027] Apply adhesive on the flexible circuit board.

[0028] The method for manufacturing the display module according to the embodiment of the present application further includes:

[0029] A flexible display panel, a flexible circuit board and a main circuit board are provided, wherein the flexible display panel comprises a display area, a binding area and a bending area connecting the display area and the binding area, wherein the binding area is bent toward a backlight surface of the display area through the bending area;

[0030] The flexible circuit board is arranged on the back side of the main circuit board and at least partially extends out of the main circuit board to be stacked with the binding area;

[0031] The flexible circuit board is respectively bound to the flexible display panel and the main circuit board through a binding process.

[0032] In the display module, display device and display module manufacturing method of the embodiments of the present application, the back space of the display module occupied by the flexible circuit board can be reduced by arranging that the projection of the flexible circuit board in the first direction is at least partially located within the main circuit board or the binding area.

[0033] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0035] Figure 1 is a back structural diagram of a display module according to an embodiment of the present application;

[0036] Figure 2 is a side structural diagram of a display module according to an embodiment of the present application;

[0037] Figure 3 yes Figure 2 A schematic diagram of the enlarged structure at A in the middle;

[0038] Figure 4 yes Figure 2 Another enlarged structural schematic diagram at A in the middle;

[0039] Figure 5 It is a schematic diagram of the back side of the main circuit board of the embodiment of the present application;

[0040] Figure 6 It is a schematic diagram of the structure of the flexible circuit board in the embodiment of the present application when it is not bent after being bound to the flexible circuit board and the main circuit board respectively;

[0041] Figure 7 is a schematic flow chart of a method for manufacturing a display module according to an embodiment of the present application;

[0042] Figure 8 It is another schematic diagram of a process of manufacturing a display module according to an embodiment of the present application;

[0043] Fig. 9 It is another schematic flow chart of the method for manufacturing the display module according to the embodiment of the present application.

[0044] Description of main component symbols:

[0045] Display module 10, flexible display panel 12, display area 121, display surface 1211, backlight surface 1212, binding area 122, binding surface 1221, bending area 123, main circuit board 14, flexible circuit board 16, first connection area 161, second connection area 162, stacking area 163, first fixing portion 1631, second fixing portion 1632, first bending portion 1633, second bending portion 1634, adhesive 17, adhesive backing 18;

[0046] Back film 21 , under-screen protective layer 22 , polarizer 23 , adhesive layer 24 , cover plate 25 , protective adhesive layer 26 . DETAILED DESCRIPTION

[0047] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0049] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0051] With the rapid development of the display industry, small and medium-sized organic light-emitting diode (OLED) display technology has become increasingly mature, and OLED display technology has begun to move towards medium and large-sized products.

[0052] In related technologies, medium and large-sized flexible OLED products usually use PCB (Printed Circuit Board) to carry EL IC (Electroluminescent Integrated Circuit) in consideration of cost and wiring design. COP (Chip on Pi) packaging technology can be used to make the bottom frame very small, but there is a problem with the product structure. The PCB needs to be electrically connected to the display panel (panel) through FPC (Flexible Printed Circuit) and bonded to the non-display surface of the panel. After the panel is bent (pad bending), the PCB+FPC occupies a large back space, affecting the spatial layout of the entire machine, and is not conducive to making more designs for the under-screen structure of the entire machine.

[0053] If the width of the PCB is reduced, there will not be enough space for layout of components. If the length of the FPC is shortened, there will be serious wrinkles due to expansion after the FPC is bonded to the PCB. If the length of the display panel is shortened, there will be insufficient space for wiring.

[0054] In view of this, please refer to Figure 1-3 The present application provides a display module 10, which includes a flexible display panel 12, a main circuit board 14 and a flexible circuit board 16. The flexible display panel 12 includes a display area 121, a binding area 122 and a bending area 123 connecting the display area 121 and the binding area 122, and the binding area 122 is bent toward the backlight surface 1212 of the display area 121 through the bending area 123; the main circuit board 14 is located on the backlight surface 1212 of the display area 121; the flexible circuit board 16 is connected to the main circuit board 14 and the flexible display panel 12 respectively, and the projection of the flexible circuit board 16 in the first direction is at least partially located in the main circuit board 14 or the binding area 122.

[0055] In the display module 10 of the embodiment of the present application, by locating at least part of the projection of the flexible circuit board 16 in the first direction within the main circuit board 14 or the binding area 122, the back space of the display module 10 occupied by the flexible circuit board 16 can be reduced, which is conducive to making more designs for the back space of the display module 10.

[0056] Specifically, the flexible display panel 12 may be an organic light-emitting diode (OLED) display panel, that is, the flexible display panel 12 uses an organic light-emitting diode for display, so that the display function can be achieved without a backlight.

[0057] The flexible display panel 12 can be divided into a display area 121, a bending area 123 and a binding area 122 by area. The display area 121 is used to realize the display function, the binding area 122 is used to realize the binding with the circuit board, the bending area 123 is located between the binding area 122 and the display area 121, and the display area 121 and the binding area 122 are connected through the bending area 123. The display area 121 may include a display surface 1211 and a backlight surface 1212 arranged opposite to each other, and the bending area 123 is bent toward the backlight surface 1212 of the display area 121, so that the binding area 122 is located on the backlight surface 1212 of the display area 121, and a gap may be formed between the binding area 122 and the display area 121.

[0058] The main circuit board 14 may be a printed circuit board (PCB), which is located on the backlight surface 1212 of the display area 121 and is spaced apart on the side of the binding area 122 away from the bending area 123. The main circuit board 14 may include a front surface and a back surface facing each other. The back surface of the main circuit board 14 is the side of the main circuit board 14 close to the display area 121, and the surface of the main circuit board 14 is the side of the main circuit board 14 away from the display area 121. The surface of the main circuit board 14 may be integrated with a plurality of electronic devices, which may together form an electroluminescent integrated circuit for driving the flexible display panel 12 to emit light.

[0059] The flexible printed circuit 16 (FPC) may include multiple pieces, and the multiple flexible printed circuits 16 are arranged at intervals along the length direction of the main circuit board 14. Each flexible printed circuit 16 is respectively connected to the main circuit board 14 and the binding area 122, and at least part of the projection of the flexible printed circuit 16 in the first direction is located in the binding area 122 and / or in the main circuit board 14. That is, at least part of the projection of the flexible printed circuit 16 in the first direction is located in the binding area 122, or at least part of the projection of the flexible printed circuit 16 in the first direction is located in the main circuit board 14, or at least part of the projection of the flexible printed circuit 16 in the first direction is located in the binding area 122 and the main circuit board 14. It should be noted that the first direction is a direction perpendicular to the display area 121.

[0060] It can be understood that at least part of the projection of the flexible circuit board 16 in the first direction is located in the binding area 122 and / or the main circuit board 14, that is, at least part of the flexible circuit board 16 is hidden in the binding area 122 of the flexible display panel 12 and / or the main circuit board 14. This can ensure the length of the flexible circuit board 16 and avoid serious wrinkles in the flexible circuit board 16 due to expansion after binding. At the same time, the flexible circuit board 16 can reduce the space under the screen of the display module 10 occupied by the flexible circuit board 16, which is conducive to making more designs for the display module 10 and improving product performance.

[0061] See also Figure 3 In some embodiments, the flexible circuit board 16 includes a first connection area 161, a second connection area 162, and a stacking area 163 connecting the first connection area 161 and the second connection area 162. The first connection area 161 is bound to the binding area 122, the second connection area 162 is bound to the main circuit board 14, and the stacking area 163 is basically located between the display area 121 and the binding area 122.

[0062] In this embodiment, the entire flexible circuit board 16 may be a single-layer board structure or a part of it may be a single-layer board structure. The projection of the stacking area 163 in the first direction is basically located in the binding area 122. The first connection area 161 may be located on the binding surface 1221 of the binding area 122 and bound to the binding area 122. Among them, the binding surface 1221 is located on the side of the binding area 122 away from the display area 121. The second connection area 162 is located on the back of the main circuit board 14 and is bound to the main circuit board 14, and the back of the main circuit board 14 is the side of the main circuit board 14 close to the display area 121. A gap is formed between the display area 121 and the binding area 122, and the stacking area 163 is bent and arranged in the gap formed between the display area 121 and the binding area 122, and the two sides of the stacking area 163 extend out of the gap respectively, one side is connected to the first connection area 161, and the other side is connected to the second connection area 162.

[0063] In this way, by disposing the stacking area 163 in the gap between the display area 121 and the binding area 122 , the back space occupied by the flexible circuit board 16 of the display module 10 can be reduced, thereby improving the back space utilization of the display module 10 .

[0064] In some embodiments, a glue sticker 17 for bonding is provided on the surface of the stacking area 163. The glue sticker 17 can fix the stacking area 163 between the binding area 122 and the display area 121, thereby preventing the stacking area 163 from shaking and affecting the binding of the flexible circuit board 16 with the main circuit board 14 and the flexible display panel 12.

[0065] In some embodiments, the stacking area 163 includes a bending portion and a fixing portion, and the adhesive tape 17 is disposed on the fixing portion. The bending portion adopts a single-layer plate structure.

[0066] Please refer to further Figure 3Specifically, the stacking area 163 may include a first fixing portion 1631, a second fixing portion 1632, a first bending portion 1633, and a second bending portion 1634. The first fixing portion 1631 is arranged close to the binding area 122, and the second fixing portion 1632 is arranged at intervals on a side of the first fixing portion 1631 close to the display area 121. The first fixing portion 1631 is connected to the first connection area 161 through the first bending portion 1633, and is connected to the second fixing portion 1632 through the second bending portion 1634. The second fixing portion 1632 also at least partially extends to connect with the second connection area 162. The adhesive 17 is arranged on the first fixing portion 1631 and the second fixing portion 1632, wherein the first fixing portion 1631 can be fixed to the binding area 122 and the second fixing portion 1632 through the adhesive 17, and the second fixing portion 1632 can also be fixed to the display area 121 by the adhesive 17. In this way, it is ensured that the stacking area 163 is fixedly disposed between the display area 121 and the binding area 122 .

[0067] See also Figure 4 In some embodiments, the flexible circuit board 16 includes a first connection area 161, a second connection area 162, and a stacking area 163 connecting the first connection area 161 and the second connection area 162, the first connection area 161 is bound to the binding area 122, the second connection area 162 is bound to the main circuit board 14, and the stacking area 163 is arranged between the display area 121 and the main circuit board 14.

[0068] In this embodiment, the projection of the stacking area 163 in the first direction is basically located in the main circuit board 14, and the first connection area 161 can be located on the binding surface 1221 of the binding area 122 and bound to the binding area 122. The binding surface 1221 is located on the side of the binding area 122 away from the display area 121. The second connection area 162 is located on the back of the main circuit board 14 and bound to the main circuit board 14, and the back of the main circuit board 14 is the side of the main circuit board 14 close to the display area 121. The stacking area 163 is arranged on the back of the main circuit board 14, and one side of the stacking area 163 is connected to the second connection area 162, and the other side extends out of the back of the main circuit board 14 and is connected to the first connection area 161 located on the binding area 122.

[0069] In this way, by disposing the stacking area 163 on the back side of the main circuit board 14 , the space occupied by the flexible circuit board 16 on the back side of the display module 10 can be reduced, thereby improving the utilization rate of the space on the back side of the display module 10 .

[0070] See also Figure 3 or Figure 4In some embodiments, the display module 10 further includes a back film 21, a protective layer 22 under the screen, a polarizer 23, an adhesive layer 24, a cover plate 25, and a protective adhesive layer 26. The back film is laminated on the backlight surface 1212 of the display area 121, and the protective layer 22 under the screen is laminated on the side of the back film 21 away from the display area 121. The polarizer 23 is laminated on the display surface 1211 of the display area 121, the adhesive layer 24 is laminated on the side of the polarizer 23 away from the display area 121, the cover plate 25 is laminated on the side of the adhesive layer 24 away from the polarizer 23, the cover plate 25 is fixedly connected to the polarizer 23 through the adhesive layer 24, and the protective adhesive layer 26 is disposed between the protective layer 22 under the screen and the binding area 122 and close to the bending area 123.

[0071] Among them, the back film 21 can play a supporting role. The back film 21 can be supported by materials such as polyethylene terephthalate (PET) and cycloolefin polymer (COP). The under-screen protective layer 22 can play a role in heat dissipation and support. The under-screen protective layer 22 can include an adhesive layer 24, a buffer layer and a heat dissipation layer. The material of the buffer layer may include foam, and the material of the heat dissipation layer may include metal; the protective adhesive layer 26 can be, for example, ultraviolet curing adhesive (UV adhesive), MCL (Micro Coating Layer), etc. The polarizer 23 can control the direction of a specific light beam. When natural light passes through the polarizer 23, the light perpendicular to the transmission axis of the polarizer 23 will be absorbed and cannot pass through, thereby leaving only the light parallel to the transmission axis of the polarizer 23, forming a light-dark contrast, and achieving the function of picture display. The polarizer 23 can be made of a composite of PVA film, TAC film, protective film, release film and pressure-sensitive adhesive. The adhesive layer 24 may be made of optical acrylic glue, and is used to fix the cover plate 25 to the polarizer 23. The protective adhesive layer 26 is used to fix the under-screen protective layer 22 to the binding area 122.

[0072] See also Figure 3-5 In some embodiments, the back of the main circuit board 14 is also attached with adhesive 18, and the adhesive 18 plays a bonding role. The main circuit board 14 can be bonded to the under-screen protective layer 22 through the adhesive 18. It should be noted that when the adhesive 18 is attached to the back of the main circuit board 14, a position for binding with the flexible circuit board 16 needs to be reserved, and if the stacking area 163 is set on the back of the main circuit board 14, the position of the stacking area 163 also needs to be reserved.

[0073] Furthermore, the thickness of the adhesive backing 18 is greater than the thickness of the flexible circuit board 16 in the second connection area 162 , so that the flexible circuit board 16 can be prevented from affecting the bonding of the main circuit board 14 with the under-screen protective layer 22 through the adhesive backing 18 .

[0074] The embodiment of the present application further provides a display device, which includes the display module 10 of the above embodiment.

[0075] In the display device of the embodiment of the present application, by locating at least part of the projection of the flexible circuit board 12 in the first direction within the main circuit board 14 or the binding area 122, the back space of the display module 10 occupied by the flexible circuit board 12 can be reduced. This is conducive to the display module 10 making more designs for the space under the screen and improving the performance of the display device.

[0076] Exemplarily, the display device can be any of various types of computer system devices that are mobile or portable and perform wireless communication. Specifically, the display device can be a mobile phone or smart phone (e.g., a phone based on iPhoneTM, a phone based on AndroidTM), a portable game device (e.g., Nintendo DSTM, PlayStation PortableTM, Gameboy AdvanceTM, iPhoneTM), a tablet computer, a portable Internet device, a data storage device, etc. The display device can also be other wearable devices (e.g., smart bracelets, smart watches, AR glasses, VR glasses, etc.).

[0077] Please combine Figure 3 , Figure 6 and Figure 7 The present application also provides a method for manufacturing a display module 10, which is used to manufacture the display module 10 of the above embodiment. The manufacturing method includes:

[0078] 01. Provide a flexible display panel, a flexible circuit board and a main circuit board, wherein the flexible display panel includes a display area, a binding area and a bending area connecting the display area and the binding area, and the binding area is bent toward the backlight surface of the display area through the bending area;

[0079] 02. Use a binding process to bind the flexible circuit board to the binding area of ​​the flexible display panel and the main circuit board respectively;

[0080] 03. Bend the flexible circuit board so that a projection of at least a portion of the flexible circuit board in the first direction is located within the binding area.

[0081] In the manufacturing method of the embodiment of the present application, by bending the flexible circuit board, the projection of the flexible circuit board in the first direction is at least partially located in the binding area, which can reduce the occupation of the back space of the display module by the flexible circuit board, thereby improving the utilization rate of the back space of the display module.

[0082] It should be noted that in step 03, the flexible circuit board needs to be bent twice so that the projection of the flexible circuit board in the first direction is located within the binding area, forming a Figure 3 Flexible circuit board in.

[0083] See also Figure 6 and 8 In some embodiments, before step 02, the manufacturing method further includes:

[0084] 04. Apply glue on the flexible circuit board.

[0085] In this way, after applying adhesive on the flexible circuit board, the adhesive can fix the stacking area between the binding area and the display area, thereby avoiding subsequent shaking of the flexible circuit board and affecting the binding of the flexible circuit board to the main circuit board and the flexible display panel.

[0086] Please combine Fig. 9 The present application also provides a method for manufacturing a display module 10, which is used to manufacture the display module 10 of the above embodiment. The manufacturing method includes:

[0087] 101. Provide a flexible display panel, a flexible circuit board, and a main circuit board, wherein the flexible display panel includes a display area, a binding area, and a bending area connecting the display area and the binding area, wherein the binding area is bent toward a backlight surface of the display area through the bending area;

[0088] 102, disposing a flexible circuit board on the back side of the main circuit board and at least partially extending out of the main circuit board to be stacked with the binding area;

[0089] 103 , respectively bind the flexible circuit board to the flexible display panel and the main circuit board through a binding process.

[0090] In the manufacturing method of the embodiment of the present application, the flexible circuit board is arranged on the back side of the main circuit board and at least partially extends out of the main circuit board to be stacked with the binding area, which can reduce the occupation of the back space of the display module by the flexible circuit board, thereby improving the utilization rate of the back space of the display module.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0092] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that: The display module comprises: A flexible display panel, the flexible display panel comprising a display area, a binding area, and a bending area connecting the display area and the binding area, the binding area being bent toward a backlight surface of the display area through the bending area; A main circuit board, located on the backlight surface of the display area; A flexible circuit board is connected to the main circuit board and the flexible display panel respectively, and a projection of the flexible circuit board in a first direction is at least partially located in the main circuit board or the binding area.

2. The display module according to claim 1, characterized in that: The flexible circuit board includes a first connection area, a second connection area and a stacking area connecting the first connection area and the second connection area, the first connection area is bound to the binding area, the second connection area is bound to the main circuit board, and the stacking area is arranged between the display area and the binding area.

3. The display module according to claim 2, characterized in that: The surface of the stacking area is provided with an adhesive sticker for bonding.

4. The display module according to claim 3, characterized in that: The stacking area includes a bending portion and a fixing portion, and the adhesive label is arranged on the fixing portion.

5. The display module according to claim 4, characterized in that: The bending portion adopts a single-layer structural plate.

6. The display module according to claim 1, characterized in that: The flexible circuit board includes a first connection area, a second connection area and a stacking area connecting the first connection area and the second connection area, the first connection area is bound to the binding area, the second connection area is bound to the main circuit board, and the stacking area is arranged between the display area and the main circuit board.

7. The display module according to any one of claims 2 to 6, characterized in that: The first connection area is located on the binding surface of the binding area and is bound to the binding area. The binding surface is located on the side of the binding area away from the display area. The second connection area is located on the back side of the main circuit board and is bound to the main circuit board. The back side is the side of the main circuit board close to the display area.

8. The display module according to claim 7, characterized in that: A back adhesive is also attached to the back of the main circuit board, and the thickness of the back adhesive is greater than the thickness of the flexible circuit board in the second connection area.

9. The display module according to claim 8, characterized in that: The display module also includes: A back film, laminated on the backlight surface of the display area; A protective layer under the screen, laminated on a side of the back film away from the display area; A polarizer, stacked on the display surface of the display area; An adhesive layer, laminated on a side of the polarizer away from the display area; The cover plate is stacked on a side of the adhesive layer away from the polarizer.

10. A display device, characterized in that: A display module comprising any one of claims 1 to 9.

11. A method for manufacturing a display module, characterized in that: The production method comprises: A flexible display panel, a flexible circuit board and a main circuit board are provided, wherein the flexible display panel comprises a display area, a binding area and a bending area connecting the display area and the binding area, wherein the binding area is bent toward a backlight surface of the display area through the bending area; Using a binding process to bind the flexible circuit board to the binding area of ​​the flexible display panel and the main circuit board respectively; The flexible circuit board is bent so that at least a portion of the projection of the flexible circuit board in the first direction is located within the binding area.

12. The manufacturing method according to claim 11, characterized in that: The production method further comprises: Apply adhesive on the flexible circuit board.

13. A method for manufacturing a display module, characterized in that: The production method comprises: A flexible display panel, a flexible circuit board and a main circuit board are provided, wherein the flexible display panel comprises a display area, a binding area and a bending area connecting the display area and the binding area, wherein the binding area is bent toward a backlight surface of the display area through the bending area; The flexible circuit board is arranged on the back side of the main circuit board and at least partially extends out of the main circuit board to be stacked with the binding area; The flexible circuit board is respectively bound to the flexible display panel and the main circuit board through a binding process.

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