A die bonding device with a pressure regulation function and a thermal pressing method that are universal for chips

Abstract

The present invention relates to the technical field of die bonding equipment, and in particular to a general-purpose die bonding equipment for chips with a pressure adjustment function and a hot pressing method. It includes a frame, on which a first intelligent moving platform is installed. The first intelligent moving platform is used to install a wafer tray. The wafer tray includes a number of wafers evenly distributed. A fixed frame is fixedly connected inside the frame. An electric rotating shaft is installed on the fixed frame. A fixed slide rail is fixedly connected to the electric rotating shaft. A slider is installed on the fixed slide rail. A swing arm is fixedly connected to the slider on the fixed slide rail. A sliding frame is slidably connected to the swing frame. A heat conducting plate is fixedly connected to the sliding frame. A heating element in contact and cooperation with the heat conducting plate is fixedly connected to the swing arm. In the present invention, the heat conducting plate contacts the wafer to heat the wafer, directly heating the contact surface between the wafer and the substrate, thereby more safely controlling the temperature for heating the wafer and reducing the probability of accidental scrapping of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonding equipment, and mainly mentions a die bonding equipment with a pressure regulating function for general-purpose chips and a hot pressing method. Background Art

[0002] During the chip production process, it is usually necessary to use a hot pressing die bonding equipment to install the wafer on the corresponding position of the substrate. The specific process is as follows: The die bonding equipment removes the wafer from the wafer tray through negative pressure, and at the same time heats the wafer and the substrate at a high temperature, presses the wafer to the corresponding position of the substrate for pressing, so that the heated wafer and the substrate are connected as a whole. During the above process, the heating temperature of the wafer must be strictly controlled to avoid damage to the internal structure of the wafer due to excessive heating temperature, or insufficient fixation between the wafer and the substrate due to too low heating temperature. The heating device of the existing die bonding equipment is usually directly set on the telescopic end of the electric push rod. Although this design facilitates the existing device to directly heat the wafer when sucking the wafer to heat the contact surface between the wafer and the substrate to a suitable temperature for pressing, when the existing device heats the wafer, it can only heat the back surface of the contact surface between the wafer and the substrate. Since the temperature transfer requires a certain process, there is a temperature difference between the two surfaces of the wafer. Therefore, the temperature of the heated surface of the wafer is usually higher than the temperature of the contact surface between the wafer and the substrate, resulting in the existing device requiring extremely high precision in controlling the heating temperature of the wafer. Otherwise, it is easy to cause the heated surface of the wafer to be overheated and melt, damaging the crystal circuit on the heated surface of the wafer, and ultimately resulting in the scrapping of the wafer. Summary of the Invention

[0003] In order to overcome the disadvantage that the heating device in the existing equipment can only heat the back surface of the contact surface between the wafer and the substrate, resulting in a relatively high precision required for controlling the temperature of the existing heating device, the present invention provides a die bonding equipment with a pressure regulating function for general-purpose chips and a hot pressing method.

[0004] Technical solution: A general chip die bonding device with a pressure regulating function, including a machine frame. Inside the machine frame, a first intelligent moving platform and a second intelligent moving platform are installed. The first intelligent moving platform is used to install a wafer tray. The wafer tray includes a number of wafers evenly distributed. A fixed frame is fixedly connected inside the machine frame. The fixed frame is located above the first intelligent moving platform and the second intelligent moving platform. The fixed frame is equipped with an electric rotating shaft. The electric rotating shaft is fixedly connected with a fixed slide rail. The fixed slide rail is equipped with a slider. The fixed slide rail is slidably connected with the fixed frame. A swing arm is fixedly connected to the slider on the fixed slide rail. One side of the swing arm away from the fixed slide rail is fixedly connected with an electric telescopic rod. The swing arm is rotatably connected with a swing frame. The fixed part of the electric telescopic rod is slidably connected with a sliding rod through a bracket. The sliding rod is rotatably connected with the swing frame. The swing frame is slidably connected with a sliding frame. The sliding frame is fixedly connected with a heat conducting plate. A heating element in contact and cooperation with the heat conducting plate is fixedly connected to the swing arm. The telescopic end of the electric telescopic rod is fixedly connected with a swing mechanism for controlling the swing of the swing frame and a pressure regulating mechanism for controlling the extrusion force between the wafer and the substrate.

[0005] In addition, particularly preferably, a temperature sensor is fixedly connected inside the heating element. The temperature sensor is in contact and cooperation with the heat conducting plate. The heating element is provided with a groove for heat preservation of the heat conducting plate.

[0006] In addition, particularly preferably, the swing mechanism includes a first limiting member. The first limiting member is slidably connected to the telescopic end of the electric telescopic rod. The first limiting member is in limiting cooperation with the sliding rod. A spring is installed between the first limiting member and the telescopic end of the electric telescopic rod. An air guide channel for sucking the wafer by negative pressure is provided inside the telescopic end of the electric telescopic rod. The sliding connection between the first limiting member and the telescopic end of the electric telescopic rod is communicated with the air guide channel. The swing frame is provided with a contraction assembly for controlling the sliding of the sliding frame.

[0007] In addition, particularly preferably, a second limiting member is slidably connected to the swing arm. A spring is installed between the second limiting member and the swing arm. The second limiting member is in limiting cooperation with the swing frame.

[0008] In addition, particularly preferably, the contraction assembly includes a first hydraulic telescopic rod. The first hydraulic telescopic rod is fixedly connected to the side of the swing frame close to the sliding frame. A magnetic attraction block is fixedly connected to the sliding frame. The telescopic end of the first hydraulic telescopic rod is magnetically attracted and matched with the magnetic attraction block. A spring is installed between the sliding frame and the swing frame. The fixed part of the electric telescopic rod is fixedly connected with a second hydraulic telescopic rod. The second hydraulic telescopic rod is communicated with the first hydraulic telescopic rod through a hose. A spring is installed between the telescopic rod of the second hydraulic telescopic rod and its fixed part.

[0009] In addition, it is particularly preferred that the pressure regulating mechanism includes pneumatic telescopic rods evenly distributed circumferentially. The pneumatic telescopic rods are fixedly connected to the telescopic ends of the electric telescopic rods. The telescopic ends of the pneumatic telescopic rods are slidably connected to the telescopic ends of the electric telescopic rods. The telescopic ends of the pneumatic telescopic rods are ball-jointed with pressing plates. The pressing plates are in pressing cooperation with the telescopic ends of the electric telescopic rods. A gas guide ring is fixedly connected to the fixed part of the electric telescopic rod. The pneumatic telescopic rods are communicated with the gas guide ring through hoses.

[0010] In addition, it is particularly preferred that the telescopic end of the second hydraulic telescopic rod is in pressing cooperation with the adjacent pressing plate.

[0011] In addition, it is particularly preferred that an elastic rope is installed between the pressing plate and the telescopic end of the electric telescopic rod.

[0012] In addition, it is particularly preferred that a fixing mechanism for stably fixing the substrate is further included. The fixing mechanism is arranged on the second intelligent mobile platform. The fixing mechanism includes sliding blocks. The sliding blocks are slidably connected to the upper side of the second intelligent mobile platform. Uniformly distributed fixing columns are fixedly connected to the upper sides of the sliding blocks. The fixing columns are slidably connected with circumferentially uniformly distributed positioning plates through spring telescopic rods. First pneumatic push rods are fixedly connected to the sliding blocks near the uniformly distributed fixing columns. The telescopic ends of the first pneumatic push rods are fixedly connected with moving rings. The moving rings are fixedly connected with circumferentially uniformly distributed first pressing blocks that are respectively in pressing cooperation with the adjacent positioning plates. The fixing columns are slidably connected with circumferentially uniformly distributed fixing plates through spring telescopic rods. Second pneumatic push rods are fixedly connected to the sliding blocks near the uniformly distributed fixing columns in a circumferentially uniform manner. The telescopic ends of the second pneumatic push rods are fixedly connected with second pressing blocks that are in pressing cooperation with the adjacent fixing plates.

[0013] In addition, it is particularly preferred that a general chip hot pressing method is applied to the above-mentioned die bonding equipment for a general chip with a pressure regulating function, and the specific method is as follows:

[0014] S1: Install the wafer tray on the upper side of the first intelligent mobile platform, and install the substrate on the upper side of the second intelligent mobile platform by sequentially activating the first pneumatic push rod and the second pneumatic push rod;

[0015] S2: Start the heating element to heat the heat conducting plate, and rotate the electric telescopic rod to the upper side of the wafer by controlling the electric rotating shaft;

[0016] S3: By controlling the electric telescopic rod, the telescopic end of the electric telescopic rod drives the adjacent components to move downward until they contact the adjacent wafer. Subsequently, the air duct is evacuated to a negative pressure state. The wafer is fixed on the lower side of the telescopic end of the electric telescopic rod, and the first limiting member is driven by the negative pressure to be in limiting cooperation with the sliding rod.

[0017] S4: By controlling the electric telescopic rod, the telescopic end of the electric telescopic rod drives the wafer and the adjacent components to move upward. The telescopic end of the electric telescopic rod drives the swing frame to rotate through the first limiting member and the sliding rod. When the electric telescopic rod resets, the heat conducting plate is located under the wafer and they are in contact with each other to heat the wafer.

[0018] S5: By controlling the electric rotating shaft, the electric telescopic rod is rotated to directly above the substrate. The telescopic end of the electric telescopic rod is controlled to drive the adjacent components to extend downward. The swing frame drives the heat conducting plate to rotate away from the wafer, and the wafer is driven by the telescopic end of the electric telescopic rod to contact the substrate.

[0019] S6: Stop maintaining the negative pressure state in the air duct, introduce air into the air guide ring, control the telescopic end of the pneumatic telescopic rod to extend, provide a fixed extrusion force to the wafer, and install the wafer on the substrate.

[0020] S7: After controlling the telescopic end of the electric telescopic rod to retract, repeat the above process to install wafers at other positions. When the substrate is full, replace the substrate.

[0021] S8: When all the wafers are hot-pressed, turn off the electric control components such as the heating element.

[0022] Compared with the prior art, the present invention has the following advantages: The present invention heats the wafer by contacting the heat conducting plate with the wafer, directly heating the contact surface between the wafer and the substrate, avoiding the problem of temperature difference between the contact surface of the wafer and the substrate and its heated surface in the traditional heating method when heating the whole wafer, and thus more safely controlling the temperature of heating the wafer and reducing the probability of accidental scrapping of the wafer.

[0023] The present invention separately arranges the heating element and other devices, uses the heat conducting plate for heat conduction, reduces the influence of high temperature on the heating element on other devices, and thus ensures the operation accuracy of the pneumatic device and the electric device thereon to guarantee the accuracy of clamping the wafer by this device.

[0024] The present invention introduces gas into the air guide ring, and the gas controls the pneumatic telescopic rods and the extrusion plates evenly distributed circumferentially to apply pressure to the wafer. While the pressure applied to the wafer is more uniform, it is convenient for the staff to adjust the pressure received by the wafer.

[0025] The present invention positions the substrate through a positioning plate and uses a fixing plate for positioning, so that only the fixing plate is worn during the process of the sliding block driving the substrate to move, thereby ensuring the positioning accuracy of the positioning plate for the substrate and increasing the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0027] Figure 2 is a three-dimensional structural schematic diagram of the frame, wafer chuck and fixing frame of the present invention;

[0028] Figure 3 is a three-dimensional structural schematic diagram of the first intelligent mobile platform and the second intelligent mobile platform of the present invention;

[0029] Figure 4 is a three-dimensional structural schematic diagram of the fixing frame, electric rotating shaft and fixing slide rail of the present invention;

[0030] Figure 5 is a three-dimensional structural schematic diagram of the wafer chuck, swing arm and electric telescopic rod of the present invention;

[0031] Figure 6 is a three-dimensional structural schematic diagram of the swing arm, electric telescopic rod and swing frame of the present invention;

[0032] Figure 7 is an exploded view of the swing frame, sliding rod and sliding frame of the present invention;

[0033] Figure 8 is a special state diagram of the swing frame, sliding rod and sliding frame of the present invention;

[0034] Figure 9 is a detailed display diagram of the swing frame, sliding frame and magnetic attraction block of the present invention;

[0035] Figure 10 is a sectional view of the electric telescopic rod and the extrusion plate of the present invention;

[0036] Figure 11 is a three-dimensional structural schematic diagram of the air guide channel, extrusion plate and elastic rope of the present invention;

[0037] Figure 12 is a three-dimensional structural schematic diagram of the second intelligent mobile platform and the sliding block of the present invention;

[0038] Figure 13 is a three-dimensional structural schematic diagram of the sliding block, fixing column and positioning plate of the present invention;

[0039] Figure 14 is a three-dimensional structural schematic diagram of the fixing column, positioning plate and fixing plate of the present invention.

[0040] The labels in the figure are: 1, frame; 101, wafer tray; 102, wafer; 2, first intelligent mobile platform; 3, second intelligent mobile platform; 4, fixing frame; 5, electric rotating shaft; 6, fixed slide rail; 7, swing arm; 8, electric telescopic rod; 81, air duct; 9, swing frame; 10, sliding rod; 11, sliding frame; 12, heat conducting plate; 13, heating element; 131, temperature sensor; 14, first limiting member; 15, second limiting member; 16, first hydraulic telescopic rod; 17, magnetic attraction block; 18, second hydraulic telescopic rod; 19, pneumatic telescopic rod; 20, extrusion plate; 21, air guide ring; 22, elastic cord; 23, sliding block; 24, fixed column; 25, positioning plate; 26, first pneumatic push rod; 27, moving ring; 28, first extrusion block; 29, fixing plate; 30, second pneumatic push rod; 31, second extrusion block. Detailed implementation manners

[0041] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in combination with the specific implementation manners and with reference to the accompanying drawings. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In addition, in the following descriptions, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present invention.

[0042] Embodiment 1: When heating a wafer with the existing device, only the back surface of the contact surface between the wafer and the substrate can be heated. Since the temperature transfer requires a certain process, there is a temperature difference between the two surfaces of the wafer. Therefore, the temperature of the heated surface of the wafer is usually higher than the temperature of the contact surface between the wafer and the substrate, resulting in the need for extremely high precision in controlling the heating temperature of the wafer by the existing device. Otherwise, it is easy to cause the heated surface of the wafer to be overheated and melt.

[0043] To address the above problems, the present invention proposes a die bonding device for chips that is universal and has a pressure adjustment function. Refer to Figures 1 - 7, including a machine frame 1, a control terminal is installed outside the machine frame 1, a first intelligent mobile platform 2 and a second intelligent mobile platform 3 are installed inside the machine frame 1. Both the first intelligent mobile platform 2 and the second intelligent mobile platform 3 are electrically connected to the control terminal. Both the first intelligent mobile platform 2 and the second intelligent mobile platform 3 are intelligent devices. The first intelligent mobile platform 2 is used to install a wafer plate 101, and the wafer plate 101 includes a number of uniformly distributed wafers 102. The first intelligent mobile platform 2 is used to drive the wafer plate 101 to move according to a program, facilitating other components to suck the wafers 102 by negative pressure. The second intelligent mobile platform 3 is used to drive a substrate to move according to a program (in Embodiment 1, the second intelligent mobile platform 3 installs the substrate through an existing electric chuck), facilitating continuously thermally pressing and installing the wafers 102 on the substrate. A fixed frame 4 is fixedly connected inside the machine frame 1. The fixed frame 4 is located above the first intelligent mobile platform 2 and the second intelligent mobile platform 3. An electric rotating shaft 5 electrically connected to the control terminal is installed on the right side of the fixed frame 4. A fixed slide rail 6 is fixedly connected to the left side of the electric rotating shaft 5. The fixed slide rail 6 is provided with a slider, and the fixed slide rail 6 is slidably connected to the fixed frame 4, facilitating the fixed slide rail 6 and its components to rotate more stably along the fixed frame 4. A swing arm 7 is fixedly connected to the slider on the fixed slide rail 6. The slider on the fixed slide rail 6 is used to drive the swing arm 7 to move, thereby facilitating the staff to adjust the distance between the swing arm 7 and the electric rotating shaft 5 and increasing the applicability of the swing arm 7. An electric telescopic rod 8 electrically connected to the control terminal is fixedly connected to the left side of the swing arm 7. A swing frame 9 is rotatably connected to the left side of the swing arm 7. The fixed part of the electric telescopic rod 8 is slidably connected to a sliding rod 10 through a bracket. The sliding rod 10 is rotatably connected to the swing frame 9. By controlling the sliding rod 10 to slide up and down, the sliding rod 10 controls the swing frame 9 to swing. A sliding frame 11 is slidably connected to the front side of the swing frame 9. A heat conducting plate 12 is fixedly connected to the rear side of the sliding frame 11. The heat conducting plate 12 is used to heat the contact surface between the wafer 102 and the substrate, ensuring the heating accuracy of the wafer 102 while avoiding adverse effects on other positions of the wafer 102. A heating element 13 in contact with the heat conducting plate 12 is fixedly connected to the swing arm 7. The heating element 13 is electrically connected to the control terminal. A temperature sensor 131 electrically connected to the control terminal is fixedly connected inside the heating element 13. The temperature sensor 131 is in contact with the heat conducting plate 12 and is used to detect the temperature on the heat conducting plate 12. The heating element 13 is provided with a groove for heat preservation of the heat conducting plate 12. The heat conducting plate 12 is heated by being inserted into the groove of the heating element 13. The telescopic end of the electric telescopic rod 8 is fixedly connected with a swing mechanism for controlling the swing of the swing frame 9 and a pressure regulating mechanism for controlling the extrusion force between the wafer 102 and the substrate. Both the swing mechanism and the pressure regulating mechanism are electrically connected to the control terminal.

[0044] Refer to Figure 6 and Figure 8, the swing mechanism includes a first limiting member 14 slidably connected to the telescopic end of the electric telescopic rod 8. A groove is provided on the left side of the first limiting member 14. The first limiting member 14 limits the sliding rod 10 through the groove thereon, driving the sliding rod 10 to move up and down together. A spring is installed between the first limiting member 14 and the telescopic end of the electric telescopic rod 8. An air duct 81 is provided inside the telescopic end of the electric telescopic rod 8. The air duct 81 is connected to an external air pump, and the air pump is connected to the control terminal. The air pump extracts the air duct 81 to a negative pressure state, so that the telescopic end of the electric telescopic rod 8 sucks the wafer 102. The sliding connection between the first limiting member 14 and the telescopic end of the electric telescopic rod 8 is connected to the air duct 81. Therefore, the first limiting member 14 will also be sucked by the negative pressure in the air duct 81 and move into the telescopic end of the electric telescopic rod 8. The swing arm 7 is slidably connected with a second limiting member 15. A spring is installed between the second limiting member 15 and the swing arm 7. The second limiting member 15 limits the swing frame 9, so that when the swing frame 9 is not in limit cooperation with the sliding rod 10, it remains in a fixed state. The swing frame 9 is provided with a contraction assembly for controlling the sliding of the sliding frame 11.

[0045] Refer to Figure 7 , Figure 9 and Figure 10 , the contraction assembly includes a first hydraulic telescopic rod 16 fixedly connected to the front side of the swing frame 9. A magnetic attraction block 17 magnetically attracted to the telescopic end of the first hydraulic telescopic rod 16 is fixedly connected to the rear side of the sliding frame 11. A spring is installed between the sliding frame 11 and the swing frame 9. The spring on the sliding frame 11 is in a compressed state in the initial state. The fixed part of the electric telescopic rod 8 is fixedly connected with a second hydraulic telescopic rod 18 connected to the first hydraulic telescopic rod 16 through a hose. When the telescopic end of the second hydraulic telescopic rod 18 extends, the second hydraulic telescopic rod 18 extracts the hydraulic oil in the first hydraulic telescopic rod 16, thereby controlling the telescopic end of the first hydraulic telescopic rod 16 to retract inward. A spring is installed between the telescopic rod of the second hydraulic telescopic rod 18 and its fixed part. The spring on the second hydraulic telescopic rod 18 is in a compressed state in the initial state.

[0046] Refer to Figure 10 and Figure 11, the pressure regulating mechanism includes four pneumatic telescopic rods 19 that are circumferentially and uniformly distributed and fixedly connected to the telescopic ends of the electric telescopic rods 8. The telescopic ends of the pneumatic telescopic rods 19 are slidably connected to the telescopic ends of the electric telescopic rods 8. The telescopic ends of the pneumatic telescopic rods 19 are ball-jointed with a pressing plate 20. The pressing plate 20 is used to provide a pressing force to the wafer 102. The pressing plate 20 is in extrusion fit with the telescopic end of the electric telescopic rod 8. When the telescopic end of the pneumatic telescopic rod 19 is fully retracted, the pressing plate 20 does not affect the sealing fit between the telescopic end of the electric telescopic rod 8 and the wafer 102. A gas guide ring 21 is fixedly connected to the fixed part of the electric telescopic rod 8. The gas guide ring 21 is communicated with an external air pump. The pneumatic telescopic rod 19 is communicated with the gas guide ring 21 through a hose. The staff adjusts the pressing force applied by the four pressing plates 20 to the wafer 102 by controlling the air pressure in the gas guide ring 21. The telescopic end of the second hydraulic telescopic rod 18 is in extrusion fit with the adjacent pressing plate 20. When the telescopic end of the electric telescopic rod 8 retracts upward, the telescopic end of the electric telescopic rod 8 drives the adjacent pressing plate 20 to squeeze the telescopic end of the second hydraulic telescopic rod 18 to retract. An elastic rope 22 is installed between the pressing plate 20 and the telescopic end of the electric telescopic rod 8. The elastic rope 22 is used to drag the adjacent pressing plate 20, so as to make the adjacent pressing plate 20 squeeze the edge position of the wafer 102 and provide a more stable pressing force to the wafer 102.

[0047] When the staff uses this device to produce chips, first install the wafer tray 101 on the first intelligent moving platform 2 and install the substrate on the second intelligent moving platform 3. The first intelligent moving platform 2 is used to drive the wafer tray 101 to move according to the program, and sequentially move the wafers 102 on the wafer tray 101 to the lower side of the telescopic end of the electric telescopic rod 8, which is convenient for the electric telescopic rod 8 and adjacent components to continuously grab the wafers 102. The second intelligent moving platform 3 is used to drive the substrate to move according to the program, and sequentially move the substrates that need to install the wafers 102 to the lower side of the telescopic end of the electric telescopic rod 8, which is convenient for continuously hot-pressing the wafers 102 on the substrate. After the staff installs the wafer tray 101 and the substrate, start the program for continuously producing and hot-pressing chips through the control terminal, and start gradually hot-pressing the wafers 102 on the substrate according to the following steps.

[0048] The control terminal first activates the heating element 13. The heating element 13 heats the heat conduction plate 12. The control terminal identifies the temperature of the heat conduction plate 12 through the temperature sensor 131. When the temperature of the heat conduction plate 12 reaches the temperature for heating the wafer 102, the control terminal turns off the heating element 13. When the control terminal activates the heating element 13, it simultaneously heats the substrate through an existing heating device to ensure that the temperature of the substrate always remains at a temperature suitable for hot-pressing the wafer 102. After the control terminal turns off the heating element 13, the control terminal controls the electric rotating shaft 5 to drive the fixed slide rail 6 to rotate. The fixed slide rail 6 drives components such as the swing arm 7 and the electric telescopic rod 8 to rotate together through the upper slider thereon. When the electric telescopic rod 8 moves to directly above the wafer 102, the control terminal turns off the electric rotating shaft 5, and the electric telescopic rod 8 and adjacent components stop moving.

[0049] After the control terminal turns off the electric rotating shaft 5, the control terminal controls the telescopic end of the electric telescopic rod 8 to extend downward. The telescopic end of the electric telescopic rod 8 drives components such as the extrusion plate 20 and four pneumatic telescopic rods 19 to move downward together. At this time, the extrusion plate 20 no longer presses the telescopic end of the second hydraulic telescopic rod 18. The telescopic end of the second hydraulic telescopic rod 18 extends downward under the action of the adjacent spring. The second hydraulic telescopic rod 18 extracts the hydraulic oil in the first hydraulic telescopic rod 16 through a hose. The telescopic end of the first hydraulic telescopic rod 16 retracts backward. At this time, the distance between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic attraction block 17 gradually becomes farther. The magnetic attraction force between the magnetic attraction block 17 and the telescopic end of the first hydraulic telescopic rod 16 gradually becomes smaller than the elastic force of the spring on the sliding frame 11. The sliding frame 11 drives the magnetic attraction block 17 and the heat conduction plate 12 to move forward together under the action of the spring, and the heat conduction plate 12 is separated from the contact with the heating element 13.

[0050] When the telescopic end of the electric telescopic rod 8 moves downward to contact the wafer 102, the control terminal controls the telescopic end of the electric telescopic rod 8 to stop moving. At this time, the wafer 102 only contacts the telescopic end of the electric telescopic rod 8, and the first limiting member 14 just aligns with the sliding rod 10. The control terminal controls the air pump to extract the air in the air guide channel 81, and a negative pressure cavity is formed in the air guide channel 81. The wafer 102 is fixed to the lower side of the telescopic end of the electric telescopic rod 8 by the suction force of the negative pressure in the air guide channel 81. At this time, the first limiting member 14 is subjected to the suction force of the negative pressure in the air guide channel 81 and gradually moves into the telescopic end of the electric telescopic rod 8. The spring on the first limiting member 14 compresses and stores energy. The first limiting member 14 and the sliding rod 10 slide relative to each other, so that the sliding rod 10 gradually inserts into the groove of the first limiting member 14. At this time, the sliding rod 10 and the first limiting member 14 are in a connected state. After the telescopic end of the electric telescopic rod 8 sucks the wafer 102, the control terminal controls the telescopic end of the electric telescopic rod 8 to drive the wafer 102, the pressing plate 20 and other components to move upward and reset. At this time, the telescopic end of the electric telescopic rod 8 drives the first limiting member 14 to move upward together. The telescopic end of the first limiting member 14 drives the sliding rod 10 to move upward. The sliding rod 10 drives the swing frame 9, the heat conduction plate 12 and other components to rotate downward by 90°. The swing frame 9 moves by pressing the second limiting member 15 to release the limiting relationship between the two. After the swing frame 9 passes through the second limiting member 15, the second limiting member 15 resets under the drive of the adjacent spring. When the pressing plate 20 contacts the telescopic end of the second hydraulic telescopic rod 18 again, the hydraulic oil in the second hydraulic telescopic rod 18 is extruded into the first hydraulic telescopic rod 16, and the telescopic end of the first hydraulic telescopic rod 16 extends downward. When the electric telescopic rod 8 is completely reset, at this time, the magnetic force between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic block 17 is just greater than the elastic force of the spring on the sliding frame 11. The sliding frame 11 moves upward under the drive of the magnetic force received by the magnetic block 17. The spring on the sliding frame 11 compresses and stores energy until the heat conduction plate 12 on the sliding frame 11 contacts the wafer 102, and the sliding frame 11 stops moving upward. The heat conduction plate 12 heats the wafer 102 through its own temperature.

[0051] Because when the heat conduction plate 12 heats the wafer 102, the heating surface is the contact surface between the wafer 102 and the substrate, avoiding the problem that when the whole wafer 102 is heated by the traditional heating method, the temperature transfer is not timely, resulting in damage to the other side of the wafer 102 due to excessive heating when the contact surface between the wafer 102 and the substrate is heated to a sufficient temperature. And during the process, the heating member 13 is far away from the electric telescopic rod 8, reducing the influence of high temperature on the electric telescopic rod 8 and increasing the accuracy during the operation of the device.

[0052] When the telescopic end of the electric telescopic rod 8 is completely reset, the control terminal controls the electric shaft 5 to drive the fixed slide rail 6, the swing frame 9 and the electric telescopic rod 8 and other components to rotate toward the second intelligent mobile platform 3 until the electric telescopic rod 8 is located directly above the position of the chip to be installed on the substrate. At this time, the control terminal controls the telescopic end of the electric telescopic rod 8 to extend downward. At this time, the heat conducting plate 12 just heats the lower side of the chip 102 to a temperature suitable for hot pressing. The heat conducting plate 12 and the sliding frame 11 are pushed downward by the chip 102 and the telescopic end of the electric telescopic rod 8, and the extrusion plate 20 stops squeezing the telescopic end of the second hydraulic telescopic rod 18. The second hydraulic telescopic rod 18 re-extracts the hydraulic pressure in the first hydraulic telescopic rod 16 according to the same principle as above. The oil is applied, and the distance between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic block 17 is rapidly increased. When the magnetic attraction between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic block 17 is less than the spring force on the sliding frame 11, the sliding frame 11 rapidly moves downward under the action of the adjacent spring force, so that the heat conducting plate 12 is out of contact with the wafer 102. During the downward movement, the telescopic end of the electric telescopic rod 8 drives the swing frame 9 and adjacent components to swing upward and reset through the first limit member 14 and the sliding rod 10. The swing frame 9 moves by squeezing the second limit member 15 and resumes the limit cooperation with the second limit member 15. When the wafer 102 moves downward to the position in contact with the substrate, the control terminal controls the telescopic end of the electric telescopic rod 8 to stop moving downward.

[0053] When the control terminal controls the telescopic end of the electric telescopic rod 8 to stop moving downward, the control terminal controls the air pump to stop extracting air from the air duct 81, and the negative pressure environment is no longer maintained in the air duct 81, and the air pump is controlled to inflate the air guide ring 21. The gas in the air guide ring 21 is passed into the four pneumatic telescopic rods 19 through the hose. The telescopic end of the pneumatic telescopic rod 19 drives the adjacent extrusion plates 20 to extend downward and squeeze the wafer 102 downward. At this time, there is pressure between the wafer 102 and the substrate, and the pressure between the wafer 102 and the substrate is equal to the air pressure in the air guide ring 21, which is convenient for the staff to control the pressure between the wafer 102 and the substrate during hot pressing. At this time, the elastic rope 22 drags the adjacent extrusion plates 20 so that the four extrusion plates 20 apply force to the wafer 102, close to the edge of the wafer 102, thereby promoting rapid consolidation around the wafer 102.

[0054] When the negative pressure environment is no longer maintained in the air guide channel 81, the first limiting member 14 is reset under the drive of the adjacent spring. The cooperation between the first limiting member 14 and the sliding rod 10 is released. The swing frame 9 and the sliding rod 10 are jointly limited by the second limiting member 15 and no longer move together with the telescopic end of the electric telescopic rod 8. When the pressing plate 20 presses the wafer 102 for a certain period of time and the chip is firmly fixed on the substrate after hot pressing, the control terminal controls the telescopic end of the electric telescopic rod 8 and the adjacent components to reset upward. At the same time, the control terminal controls the air pump to extract the gas in the air guide ring 21. The air guide ring 21 extracts the gas in the four pneumatic telescopic rods 19, and the telescopic ends of the pneumatic telescopic rods 19 retract and reset. When the telescopic end of the electric telescopic rod 8 is completely reset, the pressing plate 20 presses the telescopic end of the second hydraulic telescopic rod 18 again. The second hydraulic telescopic rod 18 drives the telescopic end of the first hydraulic telescopic rod 16 to extend according to the same principle as above, so as to drive the sliding frame 11 and the heat conducting plate 12 to slide backward. The heat conducting plate 12 is inserted into the heating member 13, and the control terminal starts the heating member 13 again to heat the heat conducting plate 12.

[0055] The control terminal controls the device to continuously repeat the above steps to sequentially hot press the wafers 102 on the wafer plate 101 onto the substrate. The staff removes the substrate with the wafers 102 installed and moves the substrate to the next process. When the staff has produced all the chips, the staff turns off the electrical control components such as the heating member 13 through the control terminal.

[0056] Embodiment 2: The existing electric control chuck usually fixes the substrate by inserting the fixing pin into the positioning hole of the substrate. And during the process of hot pressing the wafer 102, the existing intelligent moving platform needs to drive the substrate to move frequently through the electric control chuck to ensure that the wafer 102 is correctly installed at the position to be hot pressed on the substrate during the hot pressing process. When the electric control chuck drives the substrate to move frequently, it will inevitably cause wear between the fixing pin on the electric control chuck and the substrate. When the fixing pin is worn, the electric control chuck can no longer drive the substrate to move precisely. If the fixing pin on the electric control chuck is not replaced in time, it is easy to cause the wafer 102 to be difficult to be precisely installed at the expected position on the substrate.

[0057] In view of the above problems, on the basis of Embodiment 1, with reference to Figures 12 - 14, further comprising a fixing mechanism disposed on the second intelligent mobile platform 3. The fixing mechanism is used to stably fix the substrate instead of the existing electric control chuck. The fixing mechanism includes a sliding block 23 which is slidably connected to the upper side of the second intelligent mobile platform 3. The second intelligent mobile platform 3 can intelligently control the sliding block 23 to move in directions such as up, down, left, right, front and back, so as to control the movement of the substrate. A plurality of fixing columns 24 evenly distributed are fixedly connected to the upper side of the sliding block 23. Two groups of spring telescopic rods evenly distributed in the circumferential direction are fixedly connected to the fixing columns 24. The telescopic ends of one group of spring telescopic rods are all fixedly connected with positioning plates 25. First pneumatic push rods 26 are fixedly connected to the sliding block 23 near the evenly distributed fixing columns 24. The first pneumatic push rods 26 are electrically connected to the control terminal. The telescopic ends of the first pneumatic push rods 26 are fixedly connected with a moving ring 27. First extrusion blocks 28 evenly distributed in the circumferential direction and respectively in extrusion fit with adjacent positioning plates 25 are fixedly connected to the upper side of the moving ring 27. The first extrusion blocks 28 move and open by extruding the adjacent positioning plates 25, so that all the positioning plates 25 on the same fixing column 24 jointly open to position the adjacent positioning holes. The telescopic ends of the other group of spring telescopic rods on the fixing columns 24 are all fixedly connected with fixing plates 29. Second pneumatic push rods 30 evenly distributed in the circumferential direction are fixedly connected to the sliding block 23 near the evenly distributed fixing columns 24. The second pneumatic push rods 30 are electrically connected to the control terminal. The telescopic ends of the second pneumatic push rods 30 are fixedly connected with second extrusion blocks 31 in extrusion fit with the adjacent fixing plates 29. The second extrusion blocks 31 move by extruding the adjacent fixing plates 29, so as to control the adjacent fixing plates 29 to fix the substrate.

[0058] When the staff installs the substrate on the second intelligent mobile platform 3, the staff first places the substrate on the sliding block 23 and ensures that the positioning holes of the substrate correspond one by one with the adjacent fixed columns 24. Subsequently, the staff first activates all the first pneumatic push rods 26 through the control terminal. The telescopic ends of the first pneumatic push rods 26 drive the adjacent moving rings 27 and all the first extrusion blocks 28 thereon to extend upward together. The first extrusion blocks 28 extrude the adjacent positioning plates 25, and the positioning plates 25 on the same fixed column 24 extend simultaneously. The adjacent spring telescopic rods stretch and store energy to position the adjacent positioning holes. After all the positioning plates 25 are in contact with the adjacent positioning holes respectively, the control terminal closes all the first pneumatic push rods 26, and the substrate is fixed on the upper side of the sliding block 23 and cannot move. At this time, the control terminal activates all the second pneumatic push rods 30. The telescopic ends of the second pneumatic push rods 30 drive the second extrusion blocks 31 to move upward together. The second extrusion blocks 31 extrude the adjacent fixing plates 29 to open, and the adjacent spring telescopic rods stretch and store energy until the fixing plates 29 are in contact with the adjacent positioning holes and cannot move. The control terminal closes all the second pneumatic push rods 30. Subsequently, the control terminal controls the first pneumatic push rods 26 to drive the adjacent components to move back to their original positions, and the positioning plates 25 move back to their original positions driven by the adjacent spring telescopic rods. At this time, the substrate is supported by all the fixing plates 29 together, and the substrate still remains in a relatively fixed state with the sliding block 23. After all the wafers 102 to be installed on the substrate are installed with wafers 102, the control terminal controls all the second pneumatic push rods 30 to drive the adjacent components to move back to their original positions, and the fixing plates 29 move back to their original positions driven by the adjacent spring telescopic rods. The staff promptly removes the substrate and installs a new substrate on the sliding block 23.

[0059] When the fixing plate 29 is worn due to long-term use, since the relative position between each substrate and the sliding block 23 is determined by the positioning plate 25, and each fixing plate 29 is individually driven by the adjacent second pneumatic push rod 30 and the second extrusion block 31, the relative position between each substrate and the sliding block 23 will not change due to the wear of the fixing plate 29, increasing the service life of the sliding block 23 and the adjacent components.

[0060] Embodiment 3: A general chip hot pressing method, referring to Figures 1 - 14 , applied to a general chip die bonding device with a pressure regulating function based on Embodiment 2, and the specific method is as follows:

[0061] S1: Install the wafer tray 101 on the upper side of the first intelligent mobile platform 2, and install the substrate on the upper side of the second intelligent mobile platform 3 by sequentially activating the first pneumatic push rod 26 and the second pneumatic push rod 30.

[0062] S2: Start the heating element 13 to heat the heat conducting plate 12, and rotate the electric telescopic rod 8 to the upper side of the wafer 102 by controlling the electric rotating shaft 5.

[0063] S3: By controlling the electric telescopic rod 8, the telescopic end of the electric telescopic rod 8 drives the adjacent components to move downward until they contact the adjacent wafer 102. Subsequently, the air duct 81 is evacuated to a negative pressure state, and the wafer 102 is fixed on the lower side of the telescopic end of the electric telescopic rod 8. The first limiting member 14 is driven by the negative pressure to be in limiting cooperation with the sliding rod 10;

[0064] S4: By controlling the electric telescopic rod 8, the telescopic end of the electric telescopic rod 8 drives the wafer 102 and the adjacent components to move upward. The telescopic end of the electric telescopic rod 8 drives the swing frame 9 to rotate through the first limiting member 14 and the sliding rod 10. When the electric telescopic rod 8 resets, the heat conducting plate 12 is located under the wafer 102 and they are in contact with each other to heat the wafer 102;

[0065] S5: By controlling the electric rotating shaft 5, the electric telescopic rod 8 is rotated to directly above the substrate. The telescopic end of the electric telescopic rod 8 is controlled to drive the adjacent components to extend downward. The swing frame 9 drives the heat conducting plate 12 to rotate away from the wafer 102, and the wafer 102 is driven by the telescopic end of the electric telescopic rod 8 to the contact position with the substrate;

[0066] S6: Stop maintaining the negative pressure state in the air duct 81 and introduce air into the air guide ring 21. Control the telescopic end of the pneumatic telescopic rod 19 to extend to provide a fixed extrusion force to the wafer 102 and mount the wafer 102 on the substrate;

[0067] S7: After controlling the telescopic end of the electric telescopic rod 8 to retract, repeat the above process to mount the wafers 102 at other positions. When the substrate is full, replace the substrate;

[0068] S8: When all the hot pressing of the wafers 102 is completed, turn off the electric control components such as the heating element 13.

[0069] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited by the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the present invention.

Claims

1. A chip-universal crystal bonding device with a pressure regulating function, comprising a frame (1), wherein a first intelligent mobile platform (2) and a second intelligent mobile platform (3) are installed in the frame (1), wherein the first intelligent mobile platform (2) is used to install a crystal plate (101), wherein the crystal plate (101) comprises a plurality of evenly distributed crystals (102), wherein a fixed frame (4) is fixedly connected in the frame (1), wherein the fixed frame (4) is located on the upper side of the first intelligent mobile platform (2) and the second intelligent mobile platform (3), wherein the fixed frame (4) is installed with an electric rotating shaft (5), wherein the electric rotating shaft (5) is fixedly connected with a fixed slide rail (6), wherein the fixed slide rail (6) is installed with a slider, wherein the fixed slide rail (6) is slidably connected with the fixed frame (4), wherein the slider on the fixed slide rail (6) is fixedly connected with a swing arm (7), wherein the swing arm (7) is fixedly connected with an electric telescopic rod (8) on a side away from the fixed slide rail (6), wherein the swing arm (7) is fixedly connected with an electric telescopic rod (8), wherein the swing arm (7) is fixedly connected with a side away from the fixed slide rail (6), wherein the swing arm (7) is fixedly connected with a telescopic rod (8), wherein the swing arm (7) is fixedly connected with a telescopic rod (8) on ... It also includes a swing frame (9), the swing frame (9) is rotatably connected to the swing arm (7), the fixed part of the electric telescopic rod (8) is slidably connected to a sliding rod (10) through a bracket, the sliding rod (10) is rotatably connected to the swing frame (9), the swing frame (9) is slidably connected to a sliding frame (11), the sliding frame (11) is fixedly connected to a heat conducting plate (12), the swing arm (7) is fixedly connected to a heating element (13) that contacts and cooperates with the heat conducting plate (12), and the telescopic end of the electric telescopic rod (8) is fixedly connected to a swing mechanism for controlling the swing of the swing frame (9) and a pressure regulating mechanism for controlling the squeezing force between the wafer (102) and the substrate; A temperature sensor (131) is fixedly connected inside the heating element (13), the temperature sensor (131) is in contact with the heat conducting plate (12), and the heating element (13) is provided with a groove for keeping the heat conducting plate (12) warm; The swing mechanism comprises a first limit member (14), the first limit member (14) is slidably connected to the telescopic end of the electric telescopic rod (8), the first limit member (14) and the sliding rod (10) are limitedly matched, a spring is installed between the first limit member (14) and the telescopic end of the electric telescopic rod (8), an air guide (81) for sucking the wafer (102) by negative pressure is arranged in the telescopic end of the electric telescopic rod (8), the sliding connection between the first limit member (14) and the telescopic end of the electric telescopic rod (8) is communicated with the air guide (81), and the swing frame (9) is provided with a contraction component for controlling the sliding of the sliding frame (11).

2. The chip-universal die bonding device with pressure regulating function according to claim 1, characterized in that: The swing arm (7) is slidably connected to a second limiting member (15), a spring is installed between the second limiting member (15) and the swing arm (7), and the second limiting member (15) is in limiting cooperation with the swing frame (9).

3. The chip-universal die bonding device with pressure regulating function according to claim 2 is characterized in that: The retracting assembly comprises a first hydraulic telescopic rod (16), the first hydraulic telescopic rod (16) being fixedly connected to a side of the swing frame (9) close to the sliding frame (11), the sliding frame (11) being fixedly connected to a magnetic block (17), the telescopic end of the first hydraulic telescopic rod (16) being magnetically matched with the magnetic block (17), a spring being installed between the sliding frame (11) and the swing frame (9), the fixed portion of the electric telescopic rod (8) being fixedly connected to a second hydraulic telescopic rod (18), the second hydraulic telescopic rod (18) being connected to the first hydraulic telescopic rod (16) via a hose, and a spring being installed between the telescopic rod of the second hydraulic telescopic rod (18) and its fixed portion.

4. The chip-universal die bonding equipment with pressure regulating function according to claim 3 is characterized in that: The pressure regulating mechanism comprises pneumatic telescopic rods (19) uniformly distributed in the circumferential direction, the pneumatic telescopic rods (19) being fixedly connected to the telescopic ends of the electric telescopic rods (8), the telescopic ends of the pneumatic telescopic rods (19) being slidably connected to the telescopic ends of the electric telescopic rods (8), the telescopic ends of the pneumatic telescopic rods (19) being ball-connected with extrusion plates (20), the extrusion plates (20) being extrusion-fitted with the telescopic ends of the electric telescopic rods (8), the fixed portion of the electric telescopic rods (8) being fixedly connected with an air guide ring (21), and the pneumatic telescopic rods (19) being connected to the air guide ring (21) via a hose.

5. The chip-universal die bonding equipment with pressure regulating function according to claim 4 is characterized in that: The telescopic end of the second hydraulic telescopic rod (18) is extruded and matched with the adjacent extrusion plate (20).

6. The chip-universal die bonding equipment with pressure regulating function according to claim 5, characterized in that: An elastic rope (22) is installed between the extrusion plate (20) and the telescopic end of the electric telescopic rod (8).

7. The chip-universal die bonding equipment with pressure regulating function according to claim 6, characterized in that: The invention also comprises a fixing mechanism for stably fixing the base plate, the fixing mechanism being arranged on the second intelligent mobile platform (3), the fixing mechanism comprising a sliding block (23), the sliding block (23) being slidably connected to the upper side of the second intelligent mobile platform (3), the upper side of the sliding block (23) being fixedly connected with evenly distributed fixing columns (24), the fixing columns (24) being slidably connected with circumferentially evenly distributed positioning plates (25) via spring telescopic rods, the sliding blocks (23) being fixedly connected with first pneumatic push rods (26) near the evenly distributed fixing columns (24), the first pneumatic push rods (26) being fixedly connected with the first pneumatic push rods (26) and ... evenly distributed fixing columns (24) via spring telescopic rods. The telescopic end of the movable push rod (26) is fixedly connected to a movable ring (27), and the movable ring (27) is fixedly connected to first extrusion blocks (28) which are evenly distributed in the circumference and respectively extruded and matched with the adjacent positioning plates (25). The fixed column (24) is slidably connected to a fixed plate (29) evenly distributed in the circumference through a spring telescopic rod. The sliding blocks (23) are fixedly connected to second pneumatic push rods (30) evenly distributed in the circumference near the evenly distributed fixed columns (24). The telescopic end of the second pneumatic push rod (30) is fixedly connected to a second extrusion block (31) which is extruded and matched with the adjacent fixed plate (29).

8. A chip-universal hot pressing method, applied to the chip-universal die bonding device with pressure regulating function as claimed in claim 7, characterized in that: The specific method is as follows: S1: mounting a crystal plate (101) on the upper side of a first intelligent mobile platform (2), and mounting a substrate on the upper side of a second intelligent mobile platform (3) by sequentially activating a first pneumatic push rod (26) and a second pneumatic push rod (30); S2: starting the heating element (13) to heat the heat conducting plate (12), and controlling the electric rotating shaft (5) to rotate the electric telescopic rod (8) to the top of the wafer (102); S3: by controlling the electric telescopic rod (8), the telescopic end of the electric telescopic rod (8) drives the adjacent components to move downward to a position where the adjacent wafer (102) is in contact, and then the air guide channel (81) is evacuated to a negative pressure state, the wafer (102) is fixed to the lower side of the telescopic end of the electric telescopic rod (8), and the first limiter (14) is driven by the negative pressure to cooperate with the sliding rod (10) in a limited manner; S4: by controlling the electric telescopic rod (8), the telescopic end of the electric telescopic rod (8) drives the wafer (102) and adjacent components to move upward, and the telescopic end of the electric telescopic rod (8) drives the swing frame (9) to rotate through the first limiter (14) and the sliding rod (10), and when the electric telescopic rod (8) is reset, the heat conducting plate (12) is located at the lower side of the wafer (102) and the two are in contact with each other, thereby heating the wafer (102); S5: controlling the electric rotating shaft (5) to rotate the electric telescopic rod (8) to the position directly above the substrate, controlling the telescopic end of the electric telescopic rod (8) to drive adjacent components to extend downward, and the swing frame (9) drives the heat conducting plate (12) to rotate away from the wafer (102), and the wafer (102) is driven by the telescopic end of the electric telescopic rod (8) to a position where it contacts the substrate; S6: stopping maintaining the negative pressure state in the air guide channel (81), guiding air into the air guide ring (21), controlling the telescopic end of the pneumatic telescopic rod (19) to extend, providing a fixed squeezing force on the wafer (102), and mounting the wafer (102) on the substrate; S7: After the telescopic end of the electric telescopic rod (8) is controlled to retract, the above process is repeated to install wafers (102) at other positions. When the substrate is fully installed, the substrate is replaced; S8: When all the chips (102) have been thermally pressed, the electrical control unit is turned off.

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