Light emitting device and method of fabricating the same

Abstract

The application discloses a light-emitting device and a preparation method thereof. The light-emitting device comprises a substrate, a light-emitting component and an underfill layer. The light-emitting component is arranged on the substrate and is electrically connected to a pad of the substrate. The underfill layer is arranged on the substrate. The underfill layer and the light-emitting component are located on the same side of the substrate. The underfill layer covers the surface of the substrate located at the periphery of the light-emitting component. Therefore, the light-emitting performance of the light-emitting device can be improved more simply by adjusting the light absorption and reflection performance of the underfill layer.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a light-emitting device and a preparation method thereof. Background Art

[0002] A light emitting device is a device that can emit light. The light emitted by the light emitting device can be used as a light source for PD (Photo-Diode) to receive and detect, as a light source for a display device, or as a light source for illumination.

[0003] However, both the solder pad surface and the substrate surface itself will have a certain impact on the light, and since the solder pad surface and the substrate surface itself have different absorption and reflection properties for light, the solder pad surface and the substrate surface itself have inconsistent effects on the luminous performance of the light-emitting device, resulting in the difficulty in improving the luminous performance of the light-emitting device. Summary of the Invention

[0004] An object of the present invention is to provide a light-emitting device that can prevent the solder pad surface of the substrate and the surface of the substrate itself from affecting light, thereby improving the light-emitting performance of the light-emitting device.

[0005] Another object of the present invention is to provide a method for preparing a light-emitting device, which can manufacture the light-emitting device as described above.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In a first aspect, a light emitting device is provided, comprising:

[0008] substrate;

[0009] a light-emitting component, the light-emitting component being disposed on the substrate and electrically connected to a pad of the substrate; and

[0010] A primer layer is sprayed on the substrate. The primer layer and the light-emitting component are located on the same side of the substrate, and the primer layer covers the surface of the substrate located at the periphery of the light-emitting component.

[0011] As a preferred technical solution of the light-emitting device, the light-emitting device further includes a light-transmitting encapsulation layer, and the light-transmitting encapsulation layer covers the light-emitting component and the primer layer.

[0012] As a preferred technical solution of the light-emitting device, the light-emitting assembly includes a plurality of light-emitting elements, the plurality of light-emitting elements are spaced apart on the substrate and electrically connected to the pads of the substrate, and the primer layer covers the surface of the substrate located at the periphery of the light-emitting elements;

[0013] Along a direction perpendicular to the surface of the substrate, a protrusion height of the primer layer from the substrate is e1, a protrusion height of the light emitting element from the substrate is e2, and e1<e2.

[0014] In a second aspect, a method for preparing a light-emitting device is provided, which can prepare the light-emitting device as described in the first aspect, and the preparation method comprises:

[0015] Step S10: providing a substrate, wherein a plurality of light-emitting components are arranged in an array at intervals on one side of the substrate, and the substrate surface has a surrounding area surrounding each of the light-emitting components;

[0016] Step S11, providing a glue spraying device and a base glue, and causing the glue spraying device to spray the base glue onto the surrounding area;

[0017] Step S12: performing a first curing after an interval time, so that the primer forms a primer layer;

[0018] Step S20: cutting the substrate and the primer layer between any two adjacent light-emitting components to obtain the light-emitting device.

[0019] As a preferred technical solution of the light-emitting device, the primer comprises, by mass, 100 parts of transparent glue, 20 to 40 parts of titanium dioxide, and 0.5 to 2 parts of anti-precipitation powder; or, the primer comprises, by mass, 100 parts of transparent glue, 0.15 to 10 parts of black powder, 0 to 25 parts of titanium dioxide, and 0 to 3 parts of anti-precipitation powder; and / or,

[0020] The viscosity of the primer ranges from 7000 mPa·s to 25000 mPa·s.

[0021] As a preferred technical solution of the light emitting device, when the glue spraying device sprays the primer onto the surrounding area,

[0022] The moving speed range of the nozzle of the glue spraying device is 100mm / s to 150mm / s, and / or, along the direction perpendicular to the board surface of the substrate, there is a distance h between the nozzle of the glue spraying device and the board surface of the substrate, 2mm≤h≤4mm.

[0023] As a preferred technical solution of the light emitting device, the interval time is t, 0.2h≤t≤2h

[0024] As a preferred technical solution of the light-emitting device, the first curing temperature of the first curing is in the range of 100° C. to 150° C., and the first curing time is in the range of 0.5 min to 30 min.

[0025] As a preferred technical solution of the light-emitting device, the glue spraying equipment includes a plurality of nozzles arranged at intervals. In the step S11, the plurality of nozzles of the glue spraying equipment are caused to spray the base glue onto the surrounding area simultaneously.

[0026] As a preferred technical solution of the light-emitting device, the surrounding area includes a first area, a second area, and a third area. The first area is located between any two adjacent light-emitting components along the first direction, the second area is located between any two adjacent light-emitting components along the second direction, and the third area surrounds the entire periphery of all the light-emitting components.

[0027] Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the plate surface of the substrate;

[0028] The step S11 includes:

[0029] Step S111a, providing the glue spraying equipment and the primer;

[0030] Step S112a, moving the nozzle of the glue spraying device relative to the substrate along the second direction and spraying the primer onto the first area; moving the nozzle of the glue spraying device relative to the substrate along the first direction and spraying the primer onto the second area;

[0031] Step S113a: Move the nozzle of the glue spraying device around all the light-emitting components as a whole and spray the primer toward the third area.

[0032] As a preferred technical solution of the light-emitting device, in the step of spraying the primer onto the first area with the nozzle of the glue spraying device, the glue spraying starting point of the nozzle of the glue spraying device is located in the third area adjacent to the first area; and / or

[0033] In the step of spraying the base glue toward the second area by the nozzle of the glue spraying device, a glue spraying starting point of the nozzle of the glue spraying device is located in the third area adjacent to the second area.

[0034] As a preferred technical solution for the light-emitting device, in step S112a, the glue spraying flow rate of the glue spraying equipment per unit time is a first glue spraying flow rate, and in step S113a, the glue spraying flow rate of the glue spraying equipment per unit time is a second glue spraying flow rate, and the second glue spraying flow rate is less than the first glue spraying flow rate.

[0035] As a preferred technical solution of the light emitting device, step S11 includes:

[0036] Step S111b, providing the glue spraying equipment and the primer;

[0037] Step S112b: Move the nozzle of the glue spraying device around the periphery of each light-emitting component and spray the primer onto the surface of the substrate located at the periphery of each light-emitting component.

[0038] As a preferred technical solution of the light-emitting device, after step S12 and before step S20, the preparation method further includes:

[0039] Step S13: Covering the base glue layer and the surface of the light-emitting component with packaging glue;

[0040] Step S14, performing a second curing on the primer layer and the encapsulation adhesive as a whole, so that the encapsulation adhesive forms a light-transmitting encapsulation layer;

[0041] At this time, the step S20 includes:

[0042] Step S20a: cutting the substrate, the primer layer, and the light-transmitting encapsulation layer between any two adjacent light-emitting components to obtain the light-emitting device.

[0043] As a preferred technical solution of the light-emitting device, the second curing temperature range of the second curing is 130° C. to 150° C., and the second curing time range is 3 hours to 4 hours.

[0044] The beneficial effects of the present invention are:

[0045] By covering the surface of the substrate located at the periphery of the light-emitting component with a primer layer, the primer layer can cover the surface of the substrate's pads and the surface of the substrate itself, thereby preventing the surfaces of the substrate's pads and the substrate itself from affecting the light emitted by the light-emitting component. Understandably, in this case, only the primer layer will affect the light-emitting performance of the light-emitting component near the substrate. Therefore, by adjusting the light absorption and reflection properties of the primer layer, the light-emitting performance of the light-emitting device can be easily improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0047] Figure 1 It is a schematic side view of the structure of the light-emitting device described in the embodiment.

[0048] Figure 2 It is a schematic side view of the structure of the light emitting device (part of the primer layer is omitted) described in the embodiment.

[0049] Figure 3 Schematic top view of the structure of the substrate and the light-emitting component described in the embodiment.

[0050] Figure 4 It is a structural flow chart of step S10, step S12, step S14 and step S20 of the method for preparing the light-emitting device according to the embodiment.

[0051] Figure 5 This is a schematic top view of the structure of the substrate and the light-emitting component provided in step S10 of the method for preparing the light-emitting device according to the embodiment.

[0052] Figure 6 This is a schematic top view of the structure of the substrate and the light-emitting component (showing the edge of the surrounding area) provided in step S10 of the method for preparing the light-emitting device according to the embodiment.

[0053] Figure 7 This is a schematic top view of the structure of the substrate and the light-emitting component (showing the edges of the first region and the third region) provided in step S10 of the method for preparing the light-emitting device according to the embodiment.

[0054] Figure 8 This is a schematic top view of the structure of the substrate and the light-emitting component (showing the edges of the second region and the third region) provided in step S10 of the method for preparing the light-emitting device according to the embodiment.

[0055] In the picture:

[0056] 1. Light-emitting device; 10. Substrate; 100. Surrounding area; 100a. First area; 100b. Second area; 100c. Third area; 101. Solder pad; 11. Light-emitting component; 110. Light-emitting element; 12. Base glue layer; 13. Transparent encapsulation layer. DETAILED DESCRIPTION

[0057] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention more clearly understood, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the described embodiments are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0058] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0059] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0060] like Figures 1 to 3 As shown, the present invention provides a light-emitting device 1, comprising a substrate 10, a light-emitting component 11 and a primer layer 12. The light-emitting component 11 is disposed on the substrate 10 and electrically connected to a pad 101 of the substrate 10. The primer layer 12 is sprayed on the substrate 10. The primer layer 12 and the light-emitting component 11 are located on the same side of the substrate 10, and the primer layer 12 covers the surface of the substrate 10 located at the periphery of the light-emitting component 11. In order to facilitate observation of the structure of the primer layer 12 located near the outer surface of the light-emitting component 11, Figure 2 Part of the primer layer 12 is omitted to expose the light emitting component 11 and the solder pad 101 of the substrate 10 .

[0061] By covering the surface of the substrate 10 located at the periphery of the light-emitting component 11 with the primer layer 12, the primer layer 12 can cover the surface of the solder pad 101 of the substrate 10 and the surface of the substrate 10 itself, thereby preventing the surface of the solder pad 101 of the substrate 10 and the surface of the substrate 10 itself from affecting the light emitted by the light-emitting component 11. It can be understood that at this time, in the area of ​​the light-emitting component 11 close to the substrate 10, only the primer layer 12 will affect the light-emitting performance of the light-emitting component 11. Therefore, the light-absorbing and reflecting properties of the primer layer 12 can be adjusted to easily improve the light-emitting performance of the light-emitting device 1.

[0062] In an optional example, the primer layer 12 can be white, so that the primer layer 12 has good light reflective properties. The primer layer 12 can reflect part of the light emitted by the light-emitting component 11 toward the primer layer 12, thereby improving the brightness of the light-emitting device 1. In particular, when the light-emitting device 1 is used as a light source for PD reception and detection, by improving the brightness of the light-emitting device 1, the brightness of the light that can be emitted to the PD can also be increased, thereby improving the stability of the reception and detection by the PD.

[0063] In another optional example, the primer layer 12 can be a darker color such as black or gray. This allows the primer layer 12 to absorb light better, creating a strong contrast between the primer layer 12 and the light-emitting component 11 when the light-emitting component 11 emits light, thereby improving the visual clarity of the light emitted by the light-emitting device 1. In particular, when the light-emitting device 1 is used as a light source for a display device, by increasing the contrast between the light-emitting component 11 and the primer layer 12, the display contrast of the display device can be improved, thereby enhancing the display clarity and color gradation of the display device.

[0064] Optionally, the light-emitting device 1 further includes a light-transmitting encapsulation layer 13, which covers the light-emitting component 11 and the base glue layer 12. On the one hand, the light-emitting component 11 and the base glue layer 12 can be encapsulated by the light-transmitting encapsulation layer 13 to further strengthen the structure of the light-emitting device 1, and at the same time, the light-emitting component 11 is sealed to prevent moisture and rust. On the other hand, by using the light-transmitting encapsulation layer 13 for encapsulation, in other words, using a light-transmitting encapsulation layer 13 with good light-transmitting performance can reduce the influence of the light-transmitting encapsulation layer 13 on the light-emitting performance of the light-emitting device 1.

[0065] Optionally, the light-transmitting encapsulation layer 13 may be provided in different forms and materials according to the actual product performance requirements of the light-emitting device 1. For example, the light-transmitting encapsulation layer 13 may include, but is not limited to, transparent and colorless, white, black, or other colors. In addition, the light-transmitting encapsulation layer 13 may also be provided with, but is not limited to, structures such as phosphors, quantum dots, and diffusion powders that can change the light emission performance (for example, change the light color, light emission direction, or light emission intensity).

[0066] Optionally, the light-emitting assembly 11 includes a plurality of light-emitting elements 110, which are spaced apart on the substrate 10 and electrically connected to the pads 101 of the substrate 10. This allows the overall light-emitting effect of the light-emitting assembly 11 to be flexibly adjusted by adjusting the number of light-emitting elements 110 and the wavelength of light emitted by each light-emitting element 110. For example, when the light-emitting device 1 is used as a light source for PD reception and detection, the light-emitting assembly 11 may include, but is not limited to, light-emitting elements 110 capable of emitting green light, red light, and infrared light, so that the light emitted by the light-emitting assembly 11 is suitable for PD reception and detection and can reduce the impact of ambient light on the inspection results. When the light-emitting device 1 is used as a light source for a display device, the light-emitting assembly 11 may include, but is not limited to, light-emitting elements 110 capable of emitting red light, green light, and blue light, so that the display device including the light-emitting assembly 11 has a larger color gamut.

[0067] At this time, optionally, the base glue layer 12 covers the surface of the substrate 10 located at the periphery of the light-emitting element 110. In other words, the base glue layer 12 not only covers the surface of the substrate 10 located at the periphery of the entire light-emitting component 11, but also covers the surface of the substrate 10 located in the gap between two adjacent light-emitting elements 110, so that the base glue layer 12 can cover the surface of the substrate 10 pad 101 from more positions, and can absorb or reflect light from more positions to better improve the light-emitting performance of the light-emitting device 1.

[0068] In the direction perpendicular to the surface of the substrate 10, the protrusion height of the base glue layer 12 from the substrate 10 is e1, and the protrusion height of the light-emitting element 110 from the substrate 10 is e2. Optionally, e1<e2, so as to avoid the base glue layer 12 covering the side surface of the light-emitting element 110 facing away from the substrate 10, so as to avoid the base glue layer 12 affecting the positive light output of the light-emitting element 110.

[0069] When the light-emitting assembly 11 includes multiple light-emitting elements 110, in order to ensure that the primer layer 12 does not affect the positive light emission of all light-emitting elements 110, one option is to make e1 smaller than the minimum value of e2. Among the multiple light-emitting elements 110, the protrusion height e2 of the light-emitting element 110 with the smallest protrusion height from the substrate 10 is the minimum value of e2. Alternatively, for any light-emitting element 110, the protrusion height e1 of the primer layer 12 at the periphery of the light-emitting element 110 can be smaller than the protrusion height e2 of the light-emitting element 110.

[0070] In an actual embodiment, the protrusion height e2 of the light-emitting element 110 can generally satisfy: 150μm≤e2≤250μm. For example, the protrusion height e2 of the light-emitting element 110 can be: 150μm, 155μm, 160μm, 165μm, 170μm, 175μm, 180μm, 185μm, 190μm, 200μm, 210μm, 220μm, 230μm, 240μm or 250μm, etc. At this time, the maximum value of the protrusion height e1 of the base glue layer 12 can be less than 150μm, or the protrusion height e1 of at least part of the base glue layer 12 can be greater than or equal to 150μm, and the protrusion height e1 of the base glue layer 12 at the periphery of any light-emitting element 110 can be less than the protrusion height e2 of the light-emitting element 110.

[0071] In addition, due to capillary action, the smaller the distance between two adjacent objects, the higher the climbing height of the base glue layer 12 between the outer surfaces of the two adjacent objects. Therefore, the protrusion height e1 of the base glue layer 12 at different positions on the periphery of any light-emitting element 110 may be different. Specifically, during the preparation process of the light-emitting device 1, for multiple light-emitting elements 110 belonging to the same light-emitting component 11, the spacing between any adjacent light-emitting elements 110 is smaller than the spacing between the light-emitting elements 110 and other light-emitting components 11. Therefore, the height e1 of the primer layer 12 between two adjacent light-emitting elements 110 of the same light-emitting component 11 may generally be greater than the height e1 of the primer layer 12 on the side adjacent to the light-emitting element 110 and other light-emitting components 11, and for any light-emitting component 11, when the distance between the light-emitting component 11 and the adjacent light-emitting component 11 on one side is greater than the distance between the light-emitting component 11 and the adjacent light-emitting component 11 on the other side, the height e1 of the primer layer 12 between the light-emitting component 11 and the adjacent light-emitting component 11 on the one side is smaller than the height e1 of the primer layer 12 between the light-emitting component 11 and the adjacent light-emitting component 11 on the other side.

[0072] In addition, when adjacent light-emitting elements 110 are respectively provided on two different sides of a light-emitting element 110, it can be understood that when the spacing between the one light-emitting element 110 and the two adjacent light-emitting elements 110 is the same, the height e1 of the base glue layer 12 located between the one light-emitting element 110 and the two adjacent light-emitting elements 110 is approximately equal, and when the spacing between the one light-emitting element 110 and the adjacent light-emitting element 110 is smaller than the spacing between the one light-emitting element 110 and another adjacent light-emitting element 110, the height e1 of the base glue layer 12 located between the one light-emitting element 110 and the adjacent light-emitting element 110 is greater than the height e1 of the base glue layer 12 located between the one light-emitting element 110 and another adjacent light-emitting element 110.

[0073] And as Figure 5 As shown, under normal circumstances, the distance between two adjacent light-emitting devices 1 is greater than the distance between two adjacent light-emitting elements 110 in the light-emitting device 1. Therefore, in the light-emitting device 1, the protrusion height e1 of the base glue layer 12 at the periphery of the light-emitting element 110 is higher than the protrusion height e1 on the side away from the light-emitting element 110.

[0074] like Figure 4 As shown, the present invention also provides a method for preparing a light-emitting device 1, which can prepare the light-emitting device 1 as described in the above technical solution. Specifically, the preparation method includes:

[0075] Step S10 , providing a substrate 10 , wherein a plurality of light-emitting components 11 are arranged in an array at intervals on one side of the substrate 10 , and a surface of the substrate 10 has a surrounding area 100 surrounding each light-emitting component 11 .

[0076] like Figure 5 and Figure 6 As shown, Figure 5 and Figure 6 FIG shows that a plurality of light emitting components 11 are arranged in an array at intervals on one side of the substrate 10, and Figure 6 The edge of the surrounding area 100 is shown by a thick dotted line. It can be understood that the thick dotted line is only used to illustrate the edge position of the surrounding area 100 and does not represent the specific physical structure shape.

[0077] Step S11 : providing a glue spraying device and a primer, and enabling the glue spraying device to spray the primer onto the surrounding area 100 .

[0078] In order to make the base glue suitable for spraying through the glue spraying equipment, the viscosity of the base glue can be relatively low. In order to prevent the base glue from climbing too fast and too high along the outer peripheral surface of the light-emitting component 11 under the capillary action after being sprayed, thereby preventing the base glue from blocking the side surface of the light-emitting component 11 away from the substrate 10, the viscosity of the base glue needs to be relatively high. Therefore, the viscosity of the base glue cannot be too low or too high. Based on this, optionally, the viscosity range of the base glue can be 7000mPa·s~25000mPa·s. For example, the viscosity of the base glue can be 7000mPa·s, 8000mPa·s, 9000mPa·s, 10000mPa·s, 12000mPa·s, 15000mPa·s, 17000mPa·s, 20000mPa·s, 22000mPa·s or 25000mPa·s, etc.

[0079] When the base glue layer 12 is white as described in the above technical solution, in order to make the viscosity of the base glue layer 12 appropriate and the light reflection performance of the base glue layer 12 ideal, optionally, the base glue includes, by mass: 100 parts of transparent glue, 20 parts to 40 parts of titanium dioxide and 0.5 parts to 2 parts of anti-precipitation powder. For example, the titanium dioxide can be 20 parts, 22 parts, 25 parts, 27 parts, 30 parts, 32 parts, 35 parts, 37 parts or 40 parts by mass, and the anti-precipitation powder can be 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part, 1.2 parts, 1.5 parts, 1.7 parts or 2 parts by mass.

[0080] When, as described in the aforementioned technical solution, the base glue layer 12 is a dark color such as black or gray with good light absorption performance, in order to make the viscosity of the base glue appropriate and the light absorption performance of the base glue layer 12 ideal, optionally, the base glue includes, by mass, 100 parts of transparent glue, 0.15 parts to 10 parts of black powder, 0 parts to 25 parts of titanium dioxide, and 0 parts to 3 parts of anti-precipitation powder. For example, the black powder can be 0.15 parts by mass. , 0.2 parts, 0.25 parts, 0.5 parts, 1 parts, 2 parts, 5 parts, 7 parts or 10 parts, etc., and the titanium dioxide can be 0 parts, 2 parts, 5 parts, 10 parts, 15 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts or 25 parts, etc. by mass, and the anti-precipitation powder can be 0 parts, 0.2 parts, 0.5 parts, 0.8 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts or 3 parts, etc. by mass. Among them, the black powder may include but is not limited to carbon powder and black liquid dye.

[0081] When the glue spraying equipment sprays the primer onto the surrounding area 100, in order to make the primer be evenly sprayed on the surface of the substrate 10 in the surrounding area 100, the nozzle movement speed of the glue spraying equipment needs to be slower. However, if the nozzle movement speed of the glue spraying equipment is too slow, it will cause too much primer to be sprayed in the unit area. Based on this, optionally, the movement speed range of the nozzle of the glue spraying equipment can be 100mm / s to 150mm / s. For example, the movement speed of the nozzle of the glue spraying equipment can be 100mm / s, 115mm / s, 120mm / s, 125mm / s, 130mm / s, 135mm / s, 140mm / s, 145mm / s or 150mm / s, etc. Preferably, the moving speed range of the nozzle of the glue spraying equipment can be 110mm / s to 130mm / s. For example, the moving speed of the nozzle of the glue spraying equipment can be 110mm / s, 112mm / s, 114mm / s, 116mm / s, 118mm / s, 122mm / s, 124mm / s, 126mm / s, 128mm / s or 130mm / s, etc., so that the base glue sprayed by the glue spraying equipment has better spraying uniformity and the amount of glue sprayed is more appropriate.

[0082] Along the direction perpendicular to the board surface of the substrate 10, there is a distance h between the nozzle of the glue spraying equipment and the board surface of the substrate 10. If the distance h is too small, the nozzle is likely to collide with the light-emitting component 11 on the substrate 10 during the movement relative to the substrate 10. If the distance h is too large, the controllability of the primer spraying range of the nozzle becomes worse, and part of the primer is likely to be splashed onto the surface of the light-emitting component 11 away from the substrate 10. Therefore, the distance h cannot be too small or too large. Based on this, optionally, the distance h between the nozzle of the glue spraying equipment and the board surface of the substrate 10 can satisfy: 2mm≤h≤4mm. For example, the distance h can be 2mm, 2.2mm, 2.5mm, 2.7mm, 3mm, 3.2mm, 3.5mm, 3.7mm or 4mm, etc.

[0083] Optionally, the glue spraying device includes a plurality of nozzles arranged at intervals. In step S11 , the plurality of nozzles of the glue spraying device spray the base glue toward the surrounding area 100 simultaneously, thereby improving the base glue spraying efficiency in step S11 .

[0084] In addition, the nozzle of the glue spraying device can move relative to the substrate 10 along a variety of different paths to spray the primer onto the surface of the substrate 10 within the surrounding area 100 .

[0085] Please combine Figure 7 and Figure 8 As shown, in an optional embodiment, the surrounding area 100 includes a first area 100a, a second area 100b and a third area 100c. The first area 100a is provided between any two adjacent light-emitting components 11 along the first direction S1, the second area 100b is provided between any two adjacent light-emitting components 11 along the second direction S2, and the third area 100c surrounds the entire periphery of all light-emitting components 11, wherein the first direction S1 is perpendicular to the second direction S2, and the first direction S1 and the second direction S2 are both parallel to the plate surface of the substrate 10, as shown in FIG. Figure 7 and Figure 8 As shown, Figure 7 and Figure 8 The first direction S1 and the second direction S2 are shown in coordinates, and Figure 7 The edges of the first region 100a and the third region 100c are shown by thick dashed lines. Figure 8 The edges of the second area 100b and the third area 100c are shown by thick dotted lines. It can be understood that the thick dotted lines are only used to illustrate the edge positions of the first area 100a, the second area 100b and the third area 100c, and do not represent the specific physical structure shape.

[0086] At this time, step S11 may include:

[0087] Step S111a: providing glue spraying equipment and primer.

[0088] Step S112a: Move the nozzle of the glue spraying device relative to the substrate 10 along the second direction S2 and spray the primer toward the first area 100a; move the nozzle of the glue spraying device relative to the substrate 10 along the first direction S1 and spray the primer toward the second area 100b.

[0089] In this way, the base glue can be sprayed on the surface of the substrate 10 between any two adjacent light-emitting components 11, and during the spraying process, the nozzle of the glue spraying equipment only needs to move in a straight line relative to the substrate 10. In other words, the nozzle of the glue spraying equipment does not need to turn. Therefore, the spraying range of the base glue can be better controlled, the spraying uniformity is better, and the relative movement control of the nozzle of the glue spraying equipment and the substrate 10 is simple.

[0090] Among them, the nozzle of the glue spraying device can first be moved relative to the substrate 10 along the second direction S2 and spray the primer on the first area 100a, and then the nozzle of the glue spraying device can be moved relative to the substrate 10 along the first direction S1 and spray the primer on the second area 100b, or the nozzle of the glue spraying device can first be moved relative to the substrate 10 along the first direction S1 and spray the primer on the second area 100b, and then the nozzle of the glue spraying device can be moved relative to the substrate 10 along the second direction S2 and spray the primer on the first area 100a.

[0091] When the glue spraying equipment includes multiple nozzles as described in the above technical solution, the multiple nozzles can be arranged in a row, and the multiple nozzles can be moved simultaneously along the second direction S2 to simultaneously spray the base glue to the multiple first areas 100a, and the multiple nozzles can be moved simultaneously along the first direction S1 to simultaneously spray the base glue to the multiple second areas 100b.

[0092] It is understandable that when the glue spraying device includes only one nozzle, the nozzle can be moved over the multiple first areas 100a and the multiple second areas 100b in sequence to spray the primer onto the multiple first areas 100a and the multiple second areas 100b in sequence.

[0093] In addition, there are overlapping areas in the two primer spraying processes included in step S112a. In other words, in step S112a, a part of the area is sprayed with primer twice. The part of the area is the area surrounded by four light-emitting components 11, that is, the part of the area is located at the corners of the light-emitting component 11. Therefore, although a large amount of primer is sprayed on the part of the area in step S112a, the primer in the part of the area is difficult to contact the light-emitting component 11, so it is difficult to cause too much primer to climb along the outer peripheral surface of the light-emitting component 11 under capillary action until part of the primer climbs to the side surface of the light-emitting component 11 away from the substrate 10.

[0094] Since the spraying speed and spraying range of the primer are relatively unstable when the nozzle first starts to spray the primer, in order to prevent the primer from splashing onto the side of the light-emitting component 11 facing away from the substrate 10 when the nozzle first starts to spray the primer, and at the same time, reduce the amount of primer sprayed on non-target spraying areas, optionally, when the nozzle of the spraying device sprays the primer onto the first area 100a or the second area 100b, the nozzle's spraying starting point can be located outside the first area 100a or the second area 100b and adjacent to the first area 100a or the second area 100b. In one optional example, when the nozzle of the spraying device sprays the primer onto the first area 100a, the nozzle's spraying starting point is located within the third area 100c adjacent to the first area 100a. In another optional example, when the nozzle of the spraying device sprays the primer onto the second area 100b, the nozzle's spraying starting point is located within the third area 100c adjacent to the second area 100b. In another optional example, in the step of spraying the base glue onto the first area 100a by the nozzle of the glue spraying device, the starting point of the glue spraying of the nozzle of the glue spraying device is located in the third area 100c adjacent to the first area 100a, and in the step of spraying the base glue onto the second area 100b by the nozzle of the glue spraying device, the starting point of the glue spraying of the nozzle of the glue spraying device is located in the third area 100c adjacent to the second area 100b.

[0095] Step S113a: Move the nozzle of the glue spraying device around all the light-emitting components 11 as a whole and spray the primer toward the third area 100c.

[0096] In step S112a, the glue flow rate per unit time of the glue spraying equipment is the first glue flow rate, and in step S113a, the glue flow rate per unit time of the glue spraying equipment is the second glue flow rate. Since the light-emitting component 11 includes multiple light-emitting elements 110, after spraying the primer, the primer will creep along the light-emitting elements 110 included in the light-emitting component 11 and the surface of the substrate 10 under capillary action to cover the surface of the substrate 10 between adjacent light-emitting elements 110. The primer located in the first area 100a and the second area 100b needs to creep toward the two adjacent light-emitting components 11 respectively. Therefore, the amount of primer sprayed per unit area in the first area 100a and the second area 100b needs to be larger. The primer located in the third area 100c only needs to creep toward one adjacent light-emitting component 11. Therefore, the amount of primer sprayed per unit area in the third area 100c needs to be smaller. Based on this, optionally, the second glue flow rate is smaller than the first glue flow rate.

[0097] In another optional implementation manner, optionally, step S11 includes:

[0098] Step S111b: providing glue spraying equipment and primer.

[0099] Step S112 b , moving the nozzle of the glue spraying device around the periphery of each light-emitting component 11 and spraying primer onto the surface of the substrate 10 located at the periphery of each light-emitting component 11 .

[0100] This allows the primer to be sprayed onto the surface of the substrate 10 within the surrounding area 100. Since, in step S112b, the primer is sprayed twice on the surface of the substrate 10 between two adjacent light-emitting components 11, while the primer is sprayed only once on the entire periphery of all light-emitting components 11 (i.e., the third area 100c in the aforementioned solution), in this embodiment, there is no need to adjust the primer flow rate sprayed from the nozzle. A larger amount of primer can be sprayed per unit area between two adjacent light-emitting components 11, while a smaller amount can be sprayed per unit area in the third area 100c.

[0101] In addition, optionally, when the nozzle of the glue spraying equipment moves relative to the substrate 10 to spray the primer, a mask plate can be set on the side of the light-emitting component 11 facing away from the substrate 10, and the mask plate at least covers the light-emitting component 11 to prevent the primer from splashing onto the surface of the light-emitting component 11 facing away from the substrate 10.

[0102] Step S12 : performing a first curing after an interval, so that the primer forms a primer layer 12 .

[0103] By performing the first curing after an interval, the primer can be given enough time to spread along the surface of the light-emitting component 11 and the substrate 10 under capillary action, so that the primer can fully cover the surface area of ​​the substrate 10 located outside each light-emitting element 110.

[0104] The interval time is t. In order to provide sufficient time for the base glue to climb along the surface of the light-emitting component 11 and the substrate 10, and at the same time prevent the base glue from climbing along the outer peripheral surface of the light-emitting component 11 to the side surface of the light-emitting component 11 away from the substrate 10, the interval time t cannot be too short or too long. Based on this, optionally, the interval time t can meet the following conditions: 0.2h≤t≤2h. Exemplarily, the interval time t can be: 0.2h, 0.3h, 0.4h, 0.5h, 0.6h, 0.7h, 1h, 1.2h, 1.5h, 1.7h or 2h, etc.

[0105] It can be understood that the greater the viscosity of the base glue, the slower the speed of creeping along the surface of the light-emitting component 11 and the substrate 10 under the capillary action, and therefore the longer the required interval time t. In actual operation, the actual viscosity of the base glue needs to be considered to select the interval time t.

[0106] In order to make the curing effect of the first curing effective, the first curing temperature of the first curing needs to be appropriate. At the same time, since the subsequent steps may also include the process of setting the encapsulation glue and the second curing, in order to make the combination of the primer and the encapsulation glue more stable, the primer can be pre-cured only during the first curing, and then the primer and the encapsulation glue can be completely cured together during the second curing. In other words, during the first curing process, the primer does not need to be completely cured. Therefore, the first curing time of the first curing can be shorter. Based on this, optionally, the first The first curing temperature range of curing can be 100℃~150℃, and the first curing time range can be 0.5min~30min. For example, the first curing temperature range can be 100℃, 105℃, 110℃, 115℃, 120℃, 125℃, 130℃, 135℃, 140℃, 145℃ or 150℃, etc., and the first curing time can be 0.5min, 1min, 2min, 3min, 5min, 10min, 15min, 20min, 25min or 30min, etc.

[0107] Step S20 , cutting the substrate 10 and the primer layer 12 between any two adjacent light-emitting components 11 to obtain a light-emitting device 1 .

[0108] When the light-emitting device 1 further includes a light-transmitting encapsulation layer 13 as described in the above technical solution, optionally, after step S12 and before step S20, the preparation method further includes:

[0109] Step S13 : Cover the surfaces of the base glue layer 12 and the light emitting component 11 with packaging glue.

[0110] Step S14 , performing a second curing on the primer layer 12 and the packaging adhesive as a whole, so that the packaging adhesive forms a light-transmitting packaging layer 13 .

[0111] In order to make the curing effect of the second curing effective, the second curing temperature of the second curing needs to be appropriate. At the same time, in order to completely cure the encapsulation glue, the second curing time of the second curing needs to be longer. Based on this, optionally, the second curing temperature range of the second curing can be 130℃~150℃, and the second curing time range can be 3h~4h. For example, the second curing temperature range can be 130℃, 132℃, 135℃, 137℃, 140℃, 142℃, 145℃, 147℃ or 150℃, etc., and the second curing time can be 3h, 3.1h, 3.2h, 3.3h, 3.4h, 3.5h, 3.6h, 3.7h, 3.8h, 3.9h or 4h, etc.

[0112] At this time, step S20 includes:

[0113] Step S20a: cutting the substrate 10, the primer layer 12 and the light-transmitting encapsulation layer 13 between any two adjacent light-emitting components 11 to obtain a light-emitting device 1.

[0114] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0115] In this specification, reference to terms such as "one embodiment" or "example" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0116] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0117] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A method for preparing a light-emitting device, characterized in that: include: Step S10: providing a substrate, wherein a plurality of light-emitting components are arranged in an array at intervals on one side of the substrate, and the substrate surface has a surrounding area surrounding each of the light-emitting components; Step S11, providing a glue spraying device and a base glue, and causing the glue spraying device to spray the base glue onto the surrounding area; Step S12: performing a first curing after an interval time, so that the primer forms a primer layer; Step S20: cutting the substrate and the primer layer between any two adjacent light-emitting components to obtain the light-emitting device; The surrounding area includes a first area, a second area, and a third area. The first area is located between any two adjacent light-emitting components along the first direction, the second area is located between any two adjacent light-emitting components along the second direction, and the third area surrounds the entire periphery of all the light-emitting components. Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the plate surface of the substrate; The step S11 includes: Step S111a, providing the glue spraying equipment and the primer; Step S112a, moving the nozzle of the glue spraying device relative to the substrate along the second direction and spraying the primer onto the first area; moving the nozzle of the glue spraying device relative to the substrate along the first direction and spraying the primer onto the second area; Step S113a, moving the nozzle of the glue spraying device around all the light-emitting components as a whole and spraying the primer onto the third area; In the step S112a, the glue spraying flow rate per unit time of the glue spraying equipment is a first glue spraying flow rate. In the step S113a, the glue spraying flow rate per unit time of the glue spraying equipment is a second glue spraying flow rate, and the second glue spraying flow rate is smaller than the first glue spraying flow rate.

2. The method for preparing a light-emitting device according to claim 1, wherein: The base glue comprises, by mass, 100 parts of transparent glue, 20 to 40 parts of titanium dioxide, and 0.5 to 2 parts of anti-precipitation powder; or, the base glue comprises, by mass, 100 parts of transparent glue, 0.15 to 10 parts of black powder, 0 to 25 parts of titanium dioxide, and 0 to 3 parts of anti-precipitation powder; and / or, The viscosity of the primer ranges from 7000 mPa·s to 25000 mPa·s.

3. The method for preparing a light-emitting device according to claim 1, wherein: When the glue spraying device sprays the base glue onto the surrounding area, The moving speed range of the nozzle of the glue spraying device is 100mm / s to 150mm / s, and / or, along the direction perpendicular to the board surface of the substrate, there is a distance h between the nozzle of the glue spraying device and the board surface of the substrate, 2mm≤h≤4mm.

4. The method for preparing a light-emitting device according to claim 1, wherein: The interval time is t, 0.2h≤t≤2h.

5. The method for preparing a light-emitting device according to claim 1, wherein: The first curing temperature of the first curing is in the range of 100° C. to 150° C., and the first curing time is in the range of 0.5 min to 30 min.

6. The method for preparing a light-emitting device according to claim 1, wherein: The glue spraying device includes a plurality of nozzles arranged at intervals. In the step S11 , the plurality of nozzles of the glue spraying device are caused to spray the base glue toward the surrounding area simultaneously.

7. The method for preparing a light-emitting device according to claim 1, wherein: In the step of spraying the base glue onto the first area by the nozzle of the glue spraying device, the glue spraying starting point of the nozzle of the glue spraying device is located in the third area adjacent to the first area; and / or, In the step of spraying the base glue toward the second area by the nozzle of the glue spraying device, a glue spraying starting point of the nozzle of the glue spraying device is located in the third area adjacent to the second area.

8. The method for preparing a light-emitting device according to any one of claims 1 to 7, characterized in that: After step S12 and before step S20, the preparation method further includes: Step S13: Covering the base glue layer and the surface of the light-emitting component with packaging glue; Step S14, performing a second curing on the primer layer and the encapsulation adhesive as a whole, so that the encapsulation adhesive forms a light-transmitting encapsulation layer; At this time, the step S20 includes: Step S20a: cutting the substrate, the primer layer, and the light-transmitting encapsulation layer between any two adjacent light-emitting components to obtain the light-emitting device.

9. The method for preparing a light-emitting device according to claim 8, wherein: The second curing temperature of the second curing is in the range of 130° C. to 150° C., and the second curing time is in the range of 3 hours to 4 hours.

10. A light emitting device, characterized in that: The light emitting device is prepared by the method for preparing a light emitting device according to any one of claims 1 to 9, wherein the light emitting device comprises: substrate; a light-emitting component, the light-emitting component being disposed on the substrate and electrically connected to a pad of the substrate; and A primer layer is sprayed on the substrate. The primer layer and the light-emitting component are located on the same side of the substrate, and the primer layer covers the surface of the substrate located at the periphery of the light-emitting component.

11. The light emitting device according to claim 10, characterized in that The light emitting device further includes a light-transmitting encapsulation layer, which covers the light emitting component and the primer layer.

12. The light emitting device according to claim 10 or 11, characterized in that: The light-emitting assembly includes a plurality of light-emitting elements, which are spaced apart on the substrate and electrically connected to pads of the substrate, and the primer layer covers the surface of the substrate located around the light-emitting elements; Along a direction perpendicular to the surface of the substrate, a protrusion height of the primer layer from the substrate is e1, a protrusion height of the light emitting element from the substrate is e2, and e1<e2.

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