Assembly and positioning mechanism and method for thin-sheet terminal shielding sheet
The thin-sheet terminal shielding sheet assembly positioning mechanism solves the problem of low assembly efficiency of wafer terminals and shielding sheets, achieves precise positioning and stable installation, and improves assembly efficiency and accuracy.
Patent Information
- Application Number
- CN202411332977.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2044-09-24
AI Technical Summary
In the prior art, the assembly efficiency of wafer terminals and shielding sheets is low and the labor cost is high, and the positioning is difficult, resulting in unstable installation.
The wafer terminal shielding sheet assembly positioning mechanism is adopted, including the first positioning mechanism and the second positioning mechanism. Through the cooperation of the push block, roller and telescopic rod, the wafer terminal body is accurately positioned and fixed to ensure the stable installation of the shielding sheet.
The automatic positioning and fixing of the wafer terminal body is realized, the installation accuracy of the shielding sheet is improved, the labor cost is reduced and the assembly efficiency is improved.
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Figure CN119093128B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of connector assembly, and in particular to an assembly and positioning mechanism and method for a thin-sheet terminal shielding sheet. Background Art
[0002] A connector, also known as a connector, plug, or socket in China, generally refers to an electrical connector. It's a device that connects two active components, transmitting current or signals. Connectors are a component that electronic engineers often come into contact with.
[0003] The PSAS5.0 series of high-speed female connectors, due to structural limitations, has a large number of wafers and is therefore long. The connector features a variety of terminal types, including BL, 7-pin wafer, SAS6-pin, SATA15-pin, and 40-pin wafer. The assembly of these wafer terminals is not yet automated, requiring a step-by-step process. Existing technology involves manually assembling the bent wafer terminals and inserting them into a plastic housing, a process that is extremely inefficient and labor-intensive. During assembly, a shielding sheet must be added to the wafer terminals before the terminals are inserted into the connector's plastic housing.
[0004] Since the wafer terminal and the shielding sheet are relatively small in size, it is difficult to position the shielding sheet when installing it on the wafer terminal, resulting in unstable installation of the shielding sheet. Summary of the Invention
[0005] The purpose of the present invention is to provide a thin-sheet terminal shielding sheet assembly positioning mechanism and method, which can achieve precise positioning of the wafer terminal body in actual use, so as to stably install the shielding sheet on the wafer terminal body and improve installation accuracy.
[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:
[0007] A wafer terminal shielding sheet assembly positioning mechanism includes a first positioning mechanism and a second positioning mechanism for being installed on both sides of a wafer terminal body driving mechanism.
[0008] Its characteristics are:
[0009] The first positioning mechanism includes a mounting base for mounting on a frame of the wafer terminal body driving mechanism, a first telescopic rod fixedly mounted on the mounting base, a push block slidably mounted on the mounting base and connected to the first telescopic rod, and a positioning unit slidably mounted on the mounting base;
[0010] The positioning unit includes a positioning block, a slide and a roller. A limiting portion is provided on both sides of the positioning block, and a U-shaped limiting area is formed between the limiting portion and the positioning block. The positioning block is connected to a slide that is slidably arranged above the mounting seat. A clearance groove is provided on the slide, and the roller is rotatably installed in the clearance groove.
[0011] An inclined surface is provided on the push block, and a tension spring is provided between the mounting seat and the slide. Under the action of the tension spring, the roller and the inclined surface contact each other; the second positioning mechanism is located on the other side of the frame of the wafer terminal body driving mechanism, and the second positioning mechanism is used to push the wafer terminal body into the U-shaped limiting area to achieve limiting and fixing of the wafer terminal body.
[0012] Furthermore, the wafer terminal body driving mechanism includes a frame, a feeding track and a driving unit arranged on the frame, a wafer terminal body flow channel is arranged on the feeding track, and the driving unit is used to drive the wafer terminal body to move intermittently in the wafer terminal body flow channel, and a first guide groove and a second guide groove are arranged on the feeding track. The first guide groove and the second guide groove are connected to the wafer terminal body flow channel, and the limiting part on the positioning block is slidably arranged in the first guide groove and the second guide groove respectively. After the limiting part extends out of the first guide groove and the second guide groove, it is used to limit the wafer terminal body.
[0013] Wherein, both the mounting seat and the slide plate are provided with mounting holes, and the tension spring is fixedly arranged in the mounting hole.
[0014] Furthermore, a guiding inclined surface for guiding the wafer terminal body is provided on a side of the limiting portion close to the wafer terminal body.
[0015] Further optimization is achieved by sliding connection between the mounting seat and the slide plate through a slide groove and a slide rail.
[0016] It is further defined that the slide groove is a dovetail groove or a T-slot, and the shape of the slide rail matches the shape of the slide groove.
[0017] Furthermore, the roller is rotatably installed in the clearance groove through a pin shaft.
[0018] Preferably, a clearance notch is provided on the limiting portion near the upper side of the wafer terminal body.
[0019] Furthermore, the second positioning mechanism includes a second telescopic rod, a support frame, a push frame and a lower pressure plate. The support frame is fixedly installed on the frame of the wafer terminal body feeding mechanism. The second telescopic rod is connected to the push frame after being installed on the support frame. The push frame is slidably installed on the support frame. The lower pressure plate is fixedly connected to the push frame. After the lower pressure plate moves, it is located above the wafer terminal body.
[0020] The present invention also discloses a wafer terminal shielding piece assembly and positioning method, which comprises using the wafer terminal shielding piece assembly and positioning mechanism to position the wafer terminal body.
[0021] Compared with the prior art, the present invention has the following beneficial effects:
[0022] The present invention is mainly used for automatically installing a shielding sheet on a wafer terminal body to achieve positioning and fixing of the wafer terminal body, so as to achieve installation of the shielding sheet. During use, the wafer terminal body driving mechanism is used to achieve intermittent feeding of the wafer terminal body. When the wafer terminal body reaches a preset position, the push block is pushed under the action of the first telescopic rod. After the push block moves upward, the roller in contact with the upper inclined surface of the push block will drive the sliding movement. Under the action of the second positioning mechanism, the wafer terminal body enters the U-shaped limiting area to achieve limiting and fixing of the wafer terminal body. It can ensure that the wafer terminal body is located in the same position, and when the shielding sheet is installed on the wafer terminal body, the installation accuracy is higher. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention.
[0025] Figure 2 Schematic diagram of the connection relationship between the first positioning mechanism and the frame of the present invention.
[0026] Figure 3 For the present invention Figure 3 A partial enlarged schematic diagram of point A in the middle.
[0027] Figure 4 This is a diagram showing the fixed state of the first and second positioning mechanisms and the wafer terminal body of the present invention.
[0028] Figure 5 It is a schematic diagram of the contact state between the fixing block and the wafer terminal body of the present invention.
[0029] Reference numerals:
[0030] 101 wafer terminal body driving mechanism, 102 first positioning mechanism, 103 second positioning mechanism, 104 frame, 105 mounting seat, 106 first telescopic rod, 107 push block, 108 positioning block, 109 slide plate, 110 roller, 111 limiting portion, 112 make way groove, 113 inclined surface, 114 shielding sheet, 115 wafer terminal body, 116 feeding track, 117 driving unit, 118 wafer terminal body flow channel, 119 first guide groove, 120 second guide groove, 121 second telescopic rod, 122 supporting frame, 123 push frame, 124 lower pressure plate, 125 fixing seat, 126 fixing block. DETAILED DESCRIPTION
[0031] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.
[0032] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the embodiments of the present invention.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.
[0034] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.
[0035] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0036] The disclosure below provides many different embodiments or examples for implementing different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. In addition, the embodiments of the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.
[0037] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0038] See Figure 1-Figure 5 This embodiment discloses a thin-film terminal shielding sheet assembly positioning mechanism, including a first positioning mechanism 102 and a second positioning mechanism 103 for being installed on both sides of a wafer terminal body driving mechanism 101.
[0039] The first positioning mechanism 102 includes a mounting base 105 for mounting on a frame 104 of the wafer terminal body driving mechanism 101, a first telescopic rod 106 fixedly mounted on the mounting base 105, a push block 107 slidably mounted on the mounting base 105 and connected to the first telescopic rod 106, and a positioning unit slidably mounted on the mounting base 105;
[0040] The positioning unit includes a positioning block 108, a slide 109 and a roller 110. A limiting portion 111 is provided on both sides of the positioning block 108. A U-shaped limiting area is formed between the limiting portion 111 and the positioning block 108. The positioning block 108 is connected to the slide 109 slidably provided above the mounting seat 105. A clearance groove 112 is provided on the slide 109. The roller 110 is rotatably installed in the clearance groove 112.
[0041] A slope 113 is provided on the push block 107, and a tension spring is provided between the mounting seat 105 and the slide 109. Under the action of the tension spring, the roller 110 and the slope 113 contact each other; the second positioning mechanism 103 is located on the other side of the frame 104 of the wafer terminal body driving mechanism 101, and the second positioning mechanism 103 is used to push the wafer terminal body 115 into the U-shaped limiting area to achieve limiting and fixing of the wafer terminal body 115.
[0042] The present invention is mainly used to position and fix the wafer terminal body 115 when automatically installing the shielding sheet 114 on the wafer terminal body 115, so as to achieve the installation of the shielding sheet 114. When in use, the wafer terminal body driving mechanism 101 is used to achieve intermittent feeding of the wafer terminal body 115. When the wafer terminal body 115 reaches the preset position, the push block 107 is pushed under the action of the first telescopic rod 106. After the push block 107 moves upward, the roller 110 in contact with the inclined surface 113 on the push block 107 will drive the slide 109 to move. Under the action of the second positioning mechanism 103, the wafer terminal body 115 enters the U-shaped limiting area to achieve the limiting and fixing of the wafer terminal body 115. It can ensure that the wafer terminal body 115 is located in the same position, and when the shielding sheet 114 is installed on the wafer terminal body 115, the installation accuracy is higher.
[0043] Among them, the wafer terminal body driving mechanism 101 includes a frame 104, a feeding track 116 and a driving unit 117 arranged on the frame 104, a wafer terminal body flow channel 118 is arranged on the feeding track 116, and the driving unit 117 is used to drive the wafer terminal body 115 to move intermittently in the wafer terminal body flow channel 118, and a first guide groove 119 and a second guide groove 120 are arranged on the feeding track 116. The first guide groove 119 and the second guide groove 120 are connected to the wafer terminal body flow channel 118, and the limiting part 111 on the positioning block 108 is respectively slidably arranged in the first guide groove 119 and the second guide groove 120. After the limiting part 111 extends out of the first guide groove 119 and the second guide groove 120, it is used to limit the wafer terminal body 115.
[0044] It should be noted that, in this embodiment, the driving unit 117 is an intermittent toggle driving device, and its structure is not described in detail here.
[0045] In actual use, the driving unit 117 drives the wafer terminal body 115 to move intermittently in the wafer terminal body flow channel 118. At the same time, the limiting portion 111 extends out of the first guide groove 119 and the second guide groove 120 to limit the wafer terminal body 115.
[0046] Among them, both the mounting seat 105 and the slide plate 109 are provided with mounting holes, and the tension spring is fixedly arranged in the mounting hole, so that the slide plate 109 can achieve the purpose of automatic reset.
[0047] Furthermore, in actual use, a guiding inclined surface for guiding the wafer terminal body 115 is provided on the side of the limiting portion 111 close to the wafer terminal body 115 .
[0048] The provided guiding slope can serve the purpose of guiding, so that the wafer terminal body 115 can enter the U-shaped limiting area more smoothly, thereby ensuring that the wafer terminal body 115 can reach the preset position.
[0049] The mounting seat 105 and the slide plate 109 are slidably connected via a slide groove and a slide rail.
[0050] In actual use, the slide groove is a dovetail groove or a T-shaped groove, and the shape of the slide rail matches the shape of the slide groove, so that the mounting seat 105 and the slide plate 109 can slide stably.
[0051] The roller 110 is rotatably installed in the clearance groove 112 via a pin shaft.
[0052] Among them, the second positioning mechanism 103 includes a second telescopic rod 121, a support frame 122, a push frame 123 and a lower pressure plate 124. The support frame 122 is fixedly installed on the frame 104 of the wafer terminal body 115 feeding mechanism. After the second telescopic rod 121 is installed on the support frame 122, it is connected to the push frame 123. The push frame 123 is slidably installed on the support frame 122. The lower pressure plate 124 is fixedly connected to the push frame 123. After the lower pressure plate 124 moves, it is located above the wafer terminal body 115.
[0053] In actual use, a negative pressure adsorption device is used to adsorb the shielding sheet 114, and the shielding sheet 114 is installed on the wafer terminal body 115. The second telescopic rod 121 drives the push frame 123 to move, so that the lower pressure plate 124 moves toward the wafer terminal body 115 to above the shielding sheet 114 on the wafer terminal body 115. At this time, the lower pressure plate 124 will be located above the shielding sheet 114 to prevent the installed shielding sheet 114 from being taken away from the wafer terminal body 115 when the negative pressure adsorption device is reset. After the negative pressure suction head is reset, the lower pressure plate 124 is reset horizontally, and the wafer terminal body 115 with the shielding sheet 114 installed is moved to the next process.
[0054] Furthermore, a clearance notch is provided on the limiting portion 111 near the upper portion of the wafer terminal body 115 , and the clearance notch can serve the purpose of making way for the lower pressing plate 124 .
[0055] In actual use, the second positioning mechanism 103 also includes a fixing seat 125, a fixing block 126 and a spring. The fixing seat 125 is fixedly set on the push frame 123, and a slot connected to the wafer terminal body flow channel 118 is provided on the wafer terminal body flow channel 118. The fixing block 126 is slidably set in the slot, and the spring is provided between the fixing block 126 and the fixing seat 125; when in use, when the push frame 123 moves, it can drive the fixing seat 125 to move, so that the fixing block 126 passes through the slot and contacts the side of the wafer terminal body 115, thereby fixing the wafer terminal body 115 on the inner wall of the wafer terminal body flow channel 118, and at this time, the wafer terminal body 115 is fixed in all directions under the action of the pressure plate and the limiting part 111; when the fixing block 126 fixes the wafer terminal body 115 on the wafer terminal body flow channel 118 under the action of the spring, the push frame 123 still moves to ensure that the pressure plate is located above the wafer terminal body 115.
[0056] More importantly, after the shielding sheet 114 is installed, the push frame 123 is reset, and the pressure plate will leave the top of the wafer terminal body 115 from the side, while the fixing block 126 still fixes the wafer terminal body 115.
[0057] Furthermore, in actual use, a cover plate is provided on the wafer terminal body flow channel 118 for closing the wafer terminal body flow channel 118 .
[0058] In addition, this embodiment also discloses a method for assembling and positioning a thin-sheet terminal shielding sheet 114 , which includes using the above-mentioned assembly and positioning mechanism for the wafer terminal shielding sheet 114 to perform positioning.
[0059] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.
[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A thin-sheet terminal shielding sheet assembly positioning mechanism, comprising a first positioning mechanism and a second positioning mechanism for being mounted on both sides of a thin-sheet terminal body driving mechanism, Its characteristics are: The first positioning mechanism includes a mounting base for mounting on a frame of the thin-sheet terminal body driving mechanism, a first telescopic rod fixedly mounted on the mounting base, a push block slidably mounted on the mounting base and connected to the first telescopic rod, and a positioning unit slidably mounted on the mounting base; The positioning unit includes a positioning block, a slide and a roller. A limiting portion is provided on both sides of the positioning block, and a U-shaped limiting area is formed between the limiting portion and the positioning block. The positioning block is connected to a slide that is slidably arranged above the mounting seat. A clearance groove is provided on the slide, and the roller is rotatably installed in the clearance groove. The push block is provided with an inclined surface, and a tension spring is provided between the mounting seat and the slide plate. Under the action of the tension spring, the roller and the inclined surface contact each other; the second positioning mechanism is located on the other side of the frame of the thin-sheet terminal body driving mechanism, and the second positioning mechanism is used to push the thin-sheet terminal body into the U-shaped limiting area to achieve limiting and fixing of the thin-sheet terminal body; The thin-sheet terminal body driving mechanism includes a frame, a feeding track provided on the frame, and a driving unit. The feeding track is provided with a thin-sheet terminal body flow channel. The driving unit is used to drive the thin-sheet terminal body to intermittently move in the thin-sheet terminal body flow channel. The feeding track is provided with a first guide groove and a second guide groove. The first guide groove and the second guide groove are connected to the thin-sheet terminal body flow channel. The limiting portion on the positioning block is slidably provided in the first guide groove and the second guide groove, respectively. The limiting portion extends out of the first guide groove and the second guide groove and is used to limit the thin-sheet terminal body. The second positioning mechanism includes a second telescopic rod, a support frame, a push frame and a lower pressure plate. The support frame is fixedly installed on the frame of the thin-sheet terminal body feeding mechanism. The second telescopic rod is connected to the push frame after being installed on the support frame. The push frame is slidably installed on the support frame. The lower pressure plate is fixedly connected to the push frame. After the lower pressure plate moves, it is located above the thin-sheet terminal body.
2. The thin-sheet terminal shielding sheet assembly and positioning mechanism according to claim 1, characterized in that: Both the mounting seat and the slide plate are provided with mounting holes, and the tension spring is fixedly arranged in the mounting holes.
3. The thin-sheet terminal shielding sheet assembly and positioning mechanism according to claim 1, characterized in that: A guiding inclined surface for guiding the thin-sheet terminal body is provided on the limiting portion at one side close to the thin-sheet terminal body.
4. The thin-sheet terminal shielding sheet assembly and positioning mechanism according to claim 1, characterized in that: The mounting seat and the slide plate are slidably connected via a slide groove and a slide rail.
5. The thin-sheet terminal shielding sheet assembly and positioning mechanism according to claim 4, characterized in that: The slide groove is a dovetail groove or a T-slot, and the shape of the slide rail matches the shape of the slide groove.
6. The thin-sheet terminal shielding sheet assembly and positioning mechanism according to claim 1, characterized in that: The roller is rotatably installed in the clearance groove through a pin shaft.
7. A thin-sheet terminal shielding sheet assembly and positioning mechanism according to any one of claims 1 to 6, characterized in that: A clearance notch is provided on the limiting portion near the upper portion of the thin-sheet terminal body.
8. A method for assembling and positioning a thin-sheet terminal shielding sheet, characterized in that: The method comprises using the thin-sheet terminal shielding sheet assembly positioning mechanism according to any one of claims 1 to 7 for positioning.
Citation Information
Patent Citations
Full-automatic shielding sheet assembling machine and method
CN116845668A
Automatic assembling equipment and method for 40PINwafer
CN117559194A