Grinding method and grinding apparatus

Abstract

The application provides a polishing method and a polishing device. The polishing method comprises: performing a first polishing treatment on a surface to be polished to form a first track, a second track to an Nth track on the surface to be polished, N>=3 and N is a positive integer, the first track, the second track to the Nth track are a plurality of first polishing tracks with the same shape and different positions, and in a radial direction of the first polishing track, parts of two adjacent first polishing tracks overlap; after the first polishing treatment, a first protrusion is formed between the two adjacent first polishing tracks. The second polishing treatment is performed on the surface to be polished to remove part of the first protrusion, so that the first protrusion forms a second protrusion, and the height of the second protrusion is smaller than the height of the first protrusion. The polishing method provided by the application is simple in operation, high in solving efficiency of polishing parameters, low in running cost, reduces the positioning difficulty of the polishing device, removes the residual first protrusion to improve the polishing precision, and avoids the over-removal or under-removal phenomenon.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of grinding, and particularly relates to a grinding method and a grinding device. BACKGROUND

[0002] With the rapid popularization of consumer electronics such as smart phones, digital cameras and virtual reality devices, the market demand for high-performance optical lenses is increasing. For example, spherical lenses and aspherical lenses; aspherical lenses effectively reduce spherical aberration and other aberrations through complex surface shape design, significantly improving imaging quality, but the manufacturing process is complex and costly, limiting large-scale application.

[0003] At present, the commonly used processing method for aspherical lenses is to use a traditional numerical control machine tool to roughly process the maximum fitting spherical surface, then use a precision numerical control machine tool to process it into an aspherical surface, and then use a grinding and polishing device to grind and polish it. Among them, the irregularity and roughness of the surface are eliminated through grinding, and then polishing is performed to achieve higher surface finish and gloss. The commonly used grinding method is usually to fix the optical component, calculate the processing parameters of the grinding head on the concentric trajectory, spiral line, grating and other trajectories for grinding, but the related art grinding method is complex to operate, the grinding equipment has high positioning accuracy requirements, the solving efficiency of the grinding parameters is low, and it is not conducive to controlling the surface precision of the optical component, and it is easy to cause excessive removal or under-removal phenomenon. SUMMARY

[0004] In view of this, the first aspect of the present application provides a grinding method applied to an optical component with a surface to be ground, the grinding method comprising:

[0005] performing first grinding processing on the surface to be ground to form a first trajectory, a second trajectory to an Nth trajectory on the surface to be ground, N>3 and N is a positive integer, the first trajectory, the second trajectory to the Nth trajectory are a plurality of first grinding trajectories with the same shape and different positions, and along the radial direction of the first grinding trajectory, part of two adjacent first grinding trajectories overlaps; after the first grinding processing, a first protrusion is formed between the two adjacent first grinding trajectories;

[0006] performing second grinding processing on the surface to be ground to remove part of the first protrusion, so that the first protrusion forms a second protrusion, and the height of the second protrusion is less than the height of the first protrusion.

[0007] In the first grinding processing, each first grinding trajectory has different discrete points;

[0008] In the step of performing second grinding processing on the surface to be ground, it comprises:

[0009] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0010] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0011] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0012] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0013] The first track, the second track to the Nth track form a first groove respectively, two adjacent first grooves partially overlap, and the width of the first groove gradually decreases in the arrangement direction of the first groove opening pointing to the first groove bottom.

[0014] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0015] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0016] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0017] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0018] The first sub-track to the N-1th sub-track of the to-be-ground surface are formed, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and each second grinding track has different sub-discrete points in the second grinding process.

[0019] The one first protrusion forms two second protrusions; wherein the number of the first protrusions in the first grinding process is N-1, and the number of the second protrusions in the second grinding process is 2×(N-1).

[0020] After the step of performing the second grinding process on the surface to be ground, the method further comprises:

[0021] performing a third grinding process on the surface to be ground to remove part of the second protrusions, so that the second protrusions form third protrusions, and the height of the third protrusions is less than the height of the second protrusions.

[0022] The second aspect of the present application provides a grinding device, comprising a grinding device for grinding a surface to be ground of an optical component, and a processor electrically connected to the grinding device, wherein the processor is configured to execute the grinding method according to the first aspect of the present application.

[0023] The present application provides a grinding method and a grinding device. The grinding method provided by the present application can make part of two adjacent first grinding tracks coincide in the first grinding process, thereby achieving grinding of the surface to be ground, removing part of defects and corrugations, and controlling the degree of grinding to form first protrusions to be processed, thereby providing a basis for subsequent second grinding process to improve grinding precision. In the second grinding process, at least part of the first protrusions between the two first grinding tracks can be removed, thereby further improving the grinding precision. The grinding method provided by the present application is simple to operate, has high efficiency in solving grinding parameters, low running cost, and reduces the positioning difficulty of the grinding device. By removing the residual first protrusions, the grinding precision is improved, which is conducive to controlling the surface precision of the axisymmetric component and avoiding over-removal or under-removal. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be described below.

[0025] Figure 1 The flowchart of the grinding method provided by an embodiment of the present application.

[0026] Figure 2 The path diagram of the grinding track provided by an embodiment of the present application is a path diagram of a concentric track path.

[0027] Figure 3 The path diagram of the grinding track provided by an embodiment of the present application is a path diagram of a spiral line path.

[0028] Figure 4 The path diagram of the grinding track provided by an embodiment of the present application is a path diagram of a grating path.

[0029] Figure 5 Process diagram of the grinding method provided for an embodiment of the present application Figure 1 .

[0030] Figure 6 Process diagram of the grinding method provided for an embodiment of the present application Figure 2 .

[0031] Figure 7 Process diagram of the grinding method provided for an embodiment of the present application Figure 3 .

[0032] Figure 8 Process diagram of the grinding method provided for an embodiment of the present application Figure 4 .

[0033] Label explanation: surface to be ground 1a, target surface 1b, first grinding track 10, first groove 11, first protrusion 12, second grinding track 20, second groove 21, second protrusion 22. DETAILED DESCRIPTION

[0034] The following is a preferred embodiment of the present application. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered within the scope of protection of the present application.

[0035] Unless otherwise stated or contradictory, the terms or phrases used in the present application have the following meanings:

[0036] In the present application, “first”, “second”, etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first”, “second” can explicitly or implicitly include at least one of the features.

[0037] In the present application, “one or more” refers to any one, any two or any two or more of the listed items. Among them, “several” refers to any two or more.

[0038] In the present application, it should be understood that the orientations or positional relationships indicated by the terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise” are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0039] The following describes the grinding method in the related art. In the related grinding method I, the grinding head grinds in a concentric circular trajectory, and the feed amount of the grinding path is controlled to optimize the overall surface of the optical component. The defect of the grinding method I is that after the grinding head grinds and polishes according to the trajectory, there is ungrounding and polishing at the intersection of the two paths of the optical component, and the residual height is not effectively removed. In the related grinding method II, the optical component is first fixed, and the spiral trajectory of the grinding head is polished, and the polishing parameters of the grinding head are calculated by controlling the residence time. The defect of the grinding method II is that the spiral trajectory of the grinding head increases the number of axes required for the grinding and polishing of the equipment, further increases the influence of the positioning error, and the spiral trajectory is complex to solve and has high cost.

[0040] Therefore, the grinding method in the related art is complex to operate, requires high positioning accuracy of the grinding equipment, and has low efficiency in solving the grinding parameters, which is not conducive to controlling the surface accuracy of the optical component and is prone to over-removal or under-removal.

[0041] For reference Figures 1-8 The present application provides a grinding method applied to an optical component having a surface to be ground 1a, which comprises the following steps S100, S200, and each step is described in detail below.

[0042] S100, the first grinding treatment is performed on the surface to be ground 1a to form a first trajectory, a second trajectory to an Nth trajectory on the surface to be ground 1a, N≥3 and N is a positive integer, the first trajectory, the second trajectory to the Nth trajectory are a plurality of first grinding trajectories 10 with the same shape and different positions, and the portions of the two adjacent first grinding trajectories 10 overlap in the radial direction of the first grinding trajectory 10; after the first grinding treatment, a first protrusion 12 is formed between the two adjacent first grinding trajectories 10.

[0043] The optical component can be a symmetrical optical component, also known as an axisymmetric component. The following describes the grinding trajectory, which is the moving trajectory of the grinding head on the surface to be ground 1a. As shown in Figures 2-4 The shape of the grinding trajectory can be the following path, such as a concentric trajectory path, or a spiral path, or a grating path, etc., and the present embodiment does not limit the shape of the grinding trajectory. In the grinding method, the first grinding trajectory 10 of the first grinding treatment and the second grinding trajectory 20 of the second grinding treatment have the same shape, the second grinding trajectory 20 of the second grinding treatment and the third grinding trajectory of the third grinding treatment have the same shape, and so on. The following uses a concentric circular path for illustrative purposes, but it does not mean that the shape of the grinding trajectory can only use a concentric circular path.

[0044] AsFigure 5 and Figure 6 As shown, when the grinding track is a concentric path, the first, second, through Nth tracks are all circular tracks centered at the center point of the surface to be ground 1a. Furthermore, portions of two adjacent first grinding tracks 10 overlap, i.e., portions of two adjacent circular tracks overlap. For example, portions of the first track overlap with the second track, and portions of the N-1th track overlap with the Nth track. After the first grinding process, a first protrusion 12 is formed between two adjacent circular tracks. For example, a first protrusion 12 is formed between the first track and the second track, and a first protrusion 12 is formed between the N-1th track and the Nth track.

[0045] Among them, the positions of the first track, the second track to the Nth track are different, which can also be understood as the first track, the second track to the Nth track have different discrete points respectively. Therefore, under the action of multiple first grinding tracks 10, the grinding of the surface 1a to be ground is achieved to remove some defects, ripples, etc., and the parts of the two adjacent first grinding tracks 10 are overlapped, the degree of grinding is controlled, and the first protrusion 12 to be processed is formed, which provides a basis for the subsequent second grinding process to improve the grinding accuracy.

[0046] S200 , performing a second grinding process on the surface to be ground 1 a to remove a portion of the first protrusions 12 so that the first protrusions 12 are formed into second protrusions 22 , wherein the height of the second protrusions 22 is smaller than the height of the first protrusions 12 .

[0047] like Figure 7 and Figure 8 As shown, in the second grinding process, a portion of the first protrusion 12 is removed by grinding, and the height of the first protrusion 12 is reduced, thereby forming a second protrusion 22.

[0048] The height of the second protrusion 22 is H1, the height of the second protrusion 22 is H2, and H2 / H1 < 1. Specific examples include H2 / H1 < 0.9, H2 / H1 < 0.8, H2 / H1 < 0.7, H2 / H1 < 0.6, or H2 / H1 < 0.5. It should be noted that the ratio H2 / H1 can be adjusted to different values ​​by varying the material of the optical component and various parameters of the polishing process, such as contact pressure, feed rate, and dwell time.

[0049] In summary, by using the grinding method provided in the present application, in the first grinding process, the parts of the two adjacent first grinding tracks 10 are overlapped, the grinding of the to-be-ground surface 1a is realized, the degree of grinding is controlled, the first protrusions 12 to be processed are formed, and a basis for subsequent second grinding process to improve the grinding precision is provided; in the second grinding process, at least part of the first protrusions 12 located between the two first grinding tracks 10 can be removed, so as to further improve the grinding precision. The grinding method provided in the present application is simple in operation, high in solving efficiency of grinding parameters, low in running cost, reduces the positioning difficulty of the grinding equipment, removes the residual first protrusions 12 to improve the grinding precision, is beneficial to control the surface precision of the optical component, and avoids the phenomenon of excessive removal or insufficient removal.

[0050] For reference Figures 5-8 In an embodiment, in the first grinding process, each of the first grinding tracks 10 has different discrete points.

[0051] For example, the first track has a first discrete point Y1, the second track has a second discrete point Y2, the N-1th track has an N-1th discrete point Y N-1 , and the Nth track has an Nth discrete point Y N .

[0052] More specifically, when the shape of the grinding track is a concentric track path, the first track, the second track to the Nth track are all circular tracks with the center point of the to-be-ground surface 1a as the center, the first discrete point corresponds to the radius of the first track, the second discrete point corresponds to the radius of the second track, the N-1th discrete point corresponds to the radius of the N-1th track, and the Nth discrete point corresponds to the radius of the Nth track.

[0053] In the step S200 of performing the second grinding process on the to-be-ground surface 1a, the following steps are included:

[0054] S210, forming first sub-tracks to N-1th sub-tracks on the to-be-ground surface 1a, the first sub-tracks to the N-1th sub-tracks are a plurality of second grinding tracks 20 with the same shape and different positions, and there is a gap between two adjacent second grinding tracks 20, and each of the second grinding tracks 20 has different sub-discrete points in the second grinding process.

[0055] Wherein, the first grinding track 10 and the second grinding track 20 have the same shape and different positions, the first sub-discrete point of the first sub-track is located between the first discrete point of the first track and the second discrete point of the second track, and the N-1th sub-discrete point of the N-1th sub-track is located between the N-1th discrete point of the N-1th track and the Nth discrete point of the Nth track.

[0056] The first grinding track 10 has the same shape as the second grinding track 20. As shown in Figure 7 As shown in Figure 8 When the shape of the grinding track is a concentric track path, the first sub-track to the N-1 sub-track are all circular tracks with the center point of the surface to be ground 1a as the center. And there is a gap between the two adjacent second grinding tracks 20 to avoid interference between the adjacent second grinding tracks 20, which is not conducive to controlling the grinding accuracy. For example, there is a gap between the first sub-track and the second sub-track, and there is a gap between the N-2 sub-track and the N-1 sub-track.

[0057] The first sub-track to the N-1 sub-track are different in position, which can also be understood as that the first sub-track to the N-1 sub-track have different sub-discrete points respectively. For example, the first sub-track has a first sub-discrete point X1, and the N-1 sub-track has an N-1 sub-discrete point X N-1 More specifically, when the shape of the grinding track is a concentric track path, the first sub-track to the N-1 sub-track are all circular tracks with the center point of the surface to be ground 1a as the center, the first sub-discrete point corresponds to the radius of the first sub-track, and the N-1 sub-discrete point corresponds to the radius of the N-1 sub-track.

[0058] The first sub-discrete point of the first sub-track is located between the first discrete point of the first track and the second discrete point of the second track, in other words, the first sub-track is located between the first track and the second track, thereby removing part of the first protrusion 12 formed between the first track and the second track. The N-1 sub-discrete point of the N-1 sub-track is located between the N-1 discrete point of the N-1 track and the N discrete point of the N track, in other words, the N-1 sub-track is located between the N-1 track and the N track, thereby removing part of the first protrusion 12 formed between the N-1 track and the N track. By analogy, the second sub-discrete point of the second sub-track is located between the second discrete point of the second track and the third discrete point of the third track.

[0059] In summary, the second grinding track 20 with the same shape as the first grinding track 10 is adopted in the embodiment to remove part of the first protrusion 12, which can further simplify the grinding method, reduce the difficulty of solving the grinding parameters, further reduce the operation cost, and further reduce the positioning difficulty of the grinding equipment.

[0060] In one embodiment, the first sub-discrete point is located at the middle point between the first discrete point and the second discrete point, and the N-1 sub-discrete point is located at the middle point between the N-1 discrete point and the N discrete point.

[0061] It can also be understood that the first sub-discrete point is the midpoint of the first discrete point and the second discrete point, and the N-1th sub-discrete point is the midpoint of the N-1th discrete point and the Nth discrete point. Specific examples are as follows: if the first sub-discrete point is X1, the first discrete point is Y1, and the second discrete point is Y2, then X1=(Y1+Y2) / 2; if the N-1th sub-discrete point is X N-1 , the N-1th discrete point is Y N-1 , and the Nth discrete point is Y N , then X N-1 =(Y N-1 +Y N ) / 2.

[0062] In summary, the present embodiment controls one second grinding track 20 to be located in the middle of two adjacent first grinding tracks 10 by limiting the relationship between the sub-discrete point and the discrete point, so that the second grinding process can remove more first protrusions 12, which not only simplifies the grinding method, reduces the difficulty of solving the grinding parameters, but also improves the grinding precision, and is conducive to controlling the surface precision of the optical component.

[0063] For reference Figures 5-6 , in one embodiment, in the step S100 of performing the first grinding process on the surface to be ground 1a, the following steps are included:

[0064] S101, the first track, the second track to the Nth track respectively form a first groove 11, and the widths of the first grooves 11 gradually decrease along the arrangement direction in which the openings of the first grooves 11 point to the groove bottoms of the first grooves 11.

[0065] The groove side walls of the first grooves 11 formed by the first grinding tracks 10 are inclined slopes. Alternatively, the ends of the opposite groove side walls of the first grooves 11 far from the openings are connected, in other words, the first grooves 11 are conical. The two adjacent first grooves 11 partially overlap, so that the first protrusions 12 are formed between the two adjacent first grooves 11. Alternatively, the widths of the first protrusions 12 gradually increase along the arrangement direction in which the openings of the first grooves 11 point to the groove bottoms of the first grooves 11, in other words, the shapes of the first protrusions 12 are triangular.

[0066] In summary, the present embodiment limits the widths of the first grooves 11 formed by the first grinding tracks 10, thereby limiting the shapes of the first protrusions 12, so as to facilitate the subsequent removal of the first protrusions 12, thereby improving the grinding precision and being conducive to controlling the surface precision of the optical component, and avoiding the phenomena of excessive removal or insufficient removal.

[0067] In any of the first grinding tracks 10, the center point of the groove bottom of the first groove 11 formed by the A-th track corresponds to the A-th discrete point, and A is a positive integer.

[0068] For example, the center point of the bottom of the first groove 11 formed by the first track corresponds to the first discrete point, the center point of the bottom of the first groove 11 formed by the second track corresponds to the second discrete point, the center point of the bottom of the first groove 11 formed by the N-1 track corresponds to the N-1 discrete point, the center point of the bottom of the first groove 11 formed by the N track corresponds to the N discrete point, and so on.

[0069] For reference Figures 7-8 In an embodiment, in the step S200 of performing the second grinding process on the surface to be ground la, the following steps are included.

[0070] S201, the first sub-track to the N-1 sub-track respectively forms a second groove 21, and the two adjacent second grooves 21 have a spacing, and along the arrangement direction of the opening of the second groove 21 pointing to the bottom of the second groove 21, the width of the second groove 21 gradually decreases.

[0071] The side wall of the second groove 21 formed by the second grinding track 20 is an inclined slope. Alternatively, the opposite side walls of the second groove 21 are connected away from the opening end, in other words, the second groove 21 is conical. The two adjacent second grooves 21 have a spacing to avoid interference between the adjacent second grooves 21, which is not conducive to controlling the grinding precision. The second groove 21 is arranged on the first protrusion 12 to remove part of the first protrusion 12, so that one first protrusion 12 forms two second protrusions 22. Alternatively, along the arrangement direction of the opening of the second groove 21 pointing to the bottom of the second groove 21, the width of the second protrusion 22 gradually increases, in other words, the shape of the second protrusion 22 is triangular. Alternatively, the first groove 11 and the second groove 21 have the same shape. The opening width of the first groove 11 is greater than the opening width of the second groove 21.

[0072] In summary, the embodiment limits the width of the second groove 21 formed by the second grinding track 20, thereby limiting the shape of the second protrusion 22, so as to more easily remove the first protrusion 12 and subsequently more easily remove the second protrusion 22, thereby further improving the grinding precision, which is conducive to further controlling the surface precision of the optical component, and further avoiding the phenomenon of excessive removal or insufficient removal.

[0073] In any of the second grinding tracks 20, the center point of the bottom of the second groove 21 formed by the Bth sub-track corresponds to the Bth sub-discrete point, and B is a positive integer.

[0074] For example, the center point of the bottom of the second groove 21 formed by the first sub-track corresponds to the first sub-discrete point, the center point of the bottom of the second groove 21 formed by the N-1 sub-track corresponds to the N-1 sub-discrete point, and so on.

[0075] Reference is made to Figures 5-8 In an embodiment, in the step S200 of performing the second polishing process on the surface to be polished 1a, the following step is further included:

[0076] S220, forming two second protrusions 22 from one first protrusion 12; wherein the number of the first protrusions 12 in the first polishing process is N-1, and the number of the second protrusions 22 in the second polishing process is 2x(N-1).

[0077] In the embodiment, by forming two second protrusions 22 from one first protrusion 12, and the height of the second protrusions 22 is smaller than the first height of the first protrusions 12, the number and height of the subsequently formed protrusions can be controlled, thereby further simplifying the polishing method, further improving the solving efficiency of the polishing parameters, further reducing the operation cost, further improving the polishing precision, and further controlling the surface precision of the optical component, and further avoiding the over-removal or under-removal phenomenon.

[0078] In an embodiment, after the step S200 of performing the second polishing process on the surface to be polished 1a, the following step is further included:

[0079] S300, performing a third polishing process on the surface to be polished 1a to remove part of the second protrusions 22, so as to form third protrusions from the second protrusions 22, and the height of the third protrusions is smaller than the height of the second protrusions 22.

[0080] Optionally, in the step of performing the third polishing process on the surface to be polished 1a, the following step is included: forming two third protrusions from one second protrusion 22; wherein the number of the second protrusions 22 in the second polishing process is 2x(N-1), and the number of the third protrusions in the third polishing process is 4x(N-1).

[0081] Optionally, the height of the second protrusions 22 is H2, the height of the third protrusions is H3, and H3 / H2<1, and specifically, H3 / H2<0.9, or H3 / H2<0.8, or H3 / H2<0.7, or H3 / H2<0.6, or H3 / H2<0.5, etc. It should be noted that by changing the material of the optical component and the plurality of parameters of the polishing process, such as the contact pressure, the feed amount, the residence time, etc., H3 / H2may have different ratios.

[0082] In this way, the surface to be polished 1a is polished multiple times, and protrusions with smaller and smaller heights are continuously formed, thereby further improving the polishing precision, further controlling the surface precision of the optical component, and further avoiding the over-removal or under-removal phenomenon.

[0083] In order to make the purposes and advantages of the present application more clear, the effects of the polishing method of the present application are further explained in detail below in combination with specific embodiments.

[0084] The optical component is an axisymmetric component, and the axisymmetric component is uniformly rotated around the center of the workpiece. The polishing head is discretely fed in the axisymmetric component axial direction, and a concentric circular track is used, as shown in Figure 2 . Uniform removal is achieved by synchronously controlling the feed amount, contact pressure, and dwell time of the polishing head.

[0085] As shown in Figure 5 , a first polishing process is performed on the surface to be polished 1a. The polishing amount on the surface to be polished 1a is determined according to the initial surface type of the axisymmetric component and the target surface 1b type. The first feed amount, the second feed amount, and the Nth feed amount (Z1, Z2, …, Z N ) of the polishing head at the first discrete point, the second discrete point, and the Nth discrete point (Y1, Y2, …, Y N-1 ) of the surface to be polished 1a are determined according to the polishing amount. The polishing head is controlled to move to the first discrete point of the surface to be polished 1a, the polishing head contacts the surface to be polished 1a at the first pressure, and the polishing is performed at the first dwell time. The polishing head is controlled to move to the second discrete point of the surface to be polished 1a at the first feed amount, the polishing head contacts the surface to be polished 1a at the second pressure, and the polishing is performed at the second dwell time. The polishing head is controlled to move to the Nth discrete point of the surface to be polished 1a at the N-1th feed amount, the polishing head contacts the surface to be polished 1a at the Nth pressure, and the polishing is performed at the Nth dwell time, until the entire surface to be polished 1a is covered, and there are N-1 residual heights left on the surface to be polished 1a, that is, N-1 first protrusions 12 are formed. The first polishing process is completed, and the residual height and the surface type of the polished surface to be polished 1a are as shown in Figure 6 .

[0086] A second polishing process is performed on the surface to be polished 1a, and the polishing amount on the surface to be polished 1a of the axisymmetric component is determined again, as shown in Figure 7 . The first sub-discrete point of the second polishing process is determined between the first discrete point and the second discrete point of the first polishing process. The second sub-discrete point of the second polishing process is determined between the second discrete point and the third discrete point of the first polishing process. The N-1th sub-discrete point of the second polishing process is determined between the N-1th discrete point and the Nth discrete point of the first polishing process. The first sub-feed amount, the second sub-feed amount, and the N-2th sub-feed amount (W1, W2, …, W N-1 ) of the second polishing process are determined according to the first sub-discrete point, the second sub-discrete point, and the N-1th sub-discrete point (X1, X2, …, X N-2). The grinding head is controlled to move to a first sub-discrete point of the surface to be ground 1a at a first sub-feed amount, the grinding head contacts the surface to be ground 1a at a first sub-pressure, and grinds for a first sub-dwell time; the grinding head is controlled to move to a second sub-discrete point of the surface to be ground 1a at a second sub-feed amount, the grinding head contacts the surface to be ground 1a at a second sub-pressure, and grinds for a second sub-dwell time; the grinding head is controlled to move to an N-1th sub-discrete point of the surface to be ground 1a at an N-1th sub-feed amount, the grinding head contacts the surface to be ground 1a at an N-1th sub-pressure, and grinds for an N-1th sub-dwell time, until the central region of N-1 residual heights is removed, that is, part of the first protrusions 12 is removed, so that one first protrusion 12 forms two second protrusions 22. The residual heights of the surface to be ground 1a are decomposed into 2x(N-1), that is, 2x(N-1) second protrusions 22 are formed. The second grinding process is completed, and the residual heights and surface profile of the surface to be ground 1a after grinding are as shown in Figure 8

[0087] The third grinding process is performed on the surface to be ground 1a, and the above steps are repeated to re-determine the amount to be ground on the surface to be ground 1a of the axisymmetric component, determine 2x(N-1) discrete points, and remove the central region of 2x(N-1) residual heights, that is, part of the second protrusions 22 is removed, so that one second protrusion 22 forms two third protrusions. The residual heights of the surface to be ground 1a are decomposed into 4x(N-1) residual heights, that is, 4x(N-1) third protrusions are formed. Until the residual heights meet the accuracy requirements, that is, until the surface to be ground 1a meets the accuracy requirements, it can also be understood that the surface to be ground 1a is ground into the target surface 1b by repeating the above steps using the grinding method of the present application.

[0088] In summary, the grinding method provided by the present application has the advantages of simple operation, high feasibility, high efficiency of solving grinding parameters, low running cost, and is conducive to improving the grinding accuracy and avoiding over-removal or under-removal.

[0089] The present application also provides a grinding device, which comprises a grinding device for grinding the surface to be ground of an optical component, and a processor electrically connected to the grinding device, wherein the processor is used to execute the grinding method provided by the present application.

[0090] ​The grinding device provided by the application can make the parts of the two adjacent first grinding tracks coincide in the first grinding process, so that the grinding of the surface to be ground is realized, and part of the defects, corrugations and the like are removed, the degree of grinding is controlled, the first protrusions to be processed are formed, and a basis for subsequent second grinding processing to improve the grinding precision is provided; in the second grinding process, at least part of the first protrusions located between the two first grinding tracks can be removed, so that the grinding precision is further improved, the solving efficiency of the grinding parameters is high, the operation cost is low, the positioning difficulty of the grinding device is reduced, the grinding precision is improved, the surface precision of the optical component is beneficial to be controlled, and the phenomenon of excessive removal or insufficient removal is avoided.

[0091] The above describes the content provided by the embodiments of the application in detail, and the principles and embodiments of the application are described and explained in this paper. The above description is only used to help understand the method of the application and its core idea; meanwhile, for those skilled in the art, according to the idea of the application, the specific embodiments and application range will be changed, and the above description should not be understood as a limitation of the application.

Claims

1. A polishing method characterized by, The grinding method is applied to an optical component with a surface to be ground, and comprises the following steps: a first grinding process is performed on the surface to be ground to form a first track, a second track to an Nth track on the surface to be ground, N≥3 and N is a positive integer, the first track, the second track to the Nth track are a plurality of first grinding tracks with the same shape and different positions, and in the radial direction of the first grinding track, parts of two adjacent first grinding tracks overlap; after the first grinding process, a first protrusion is formed between two adjacent first grinding tracks; a second grinding process is performed on the surface to be ground to remove part of the first protrusion, so that the first protrusion forms a second protrusion, and the height of the second protrusion is less than the height of the first protrusion; in the first grinding process, each first grinding track has different discrete points; in the step of performing the second grinding process on the surface to be ground, the following steps are included: a first sub-track to an N-1th sub-track is formed on the surface to be ground, the first sub-track to the N-1th sub-track are a plurality of second grinding tracks with the same shape and different positions, and there is a gap between two adjacent second grinding tracks, and in the second grinding process, each second grinding track has different sub-discrete points; wherein the first grinding track and the second grinding track have the same shape and different positions, the first sub-discrete point of the first sub-track is located between the first discrete point of the first track and the second discrete point of the second track, and the N-1th sub-discrete point of the N-1th sub-track is located between the N-1th discrete point of the N-1th track and the Nth discrete point of the Nth track.

2. The polishing method according to claim 1, wherein The first sub-discrete point is located at the middle point between the first discrete point and the second discrete point, and the N-1th sub-discrete point is located at the middle point between the N-1th discrete point and the Nth discrete point.

3. The polishing method according to claim 1, wherein in the step of performing the first grinding process on the surface to be ground, the following steps are included: the first track, the second track to the Nth track form a first groove respectively, and parts of two adjacent first grooves overlap, and in the arrangement direction of the first groove opening pointing to the bottom of the first groove, the width of the first groove gradually decreases.

4. The polishing method according to claim 3, wherein in any first grinding track, the center point of the bottom of the first groove formed by the A-th track corresponds to the A-th discrete point, and A is a positive integer.

5. The polishing method according to claim 3, wherein in the step of performing the second grinding process on the surface to be ground, the following steps are included: the first sub-track to the N-1th sub-track form a second groove respectively, and there is a gap between two adjacent second grooves, and in the arrangement direction of the second groove opening pointing to the bottom of the second groove, the width of the second groove gradually decreases.

6. The polishing method according to claim 5, wherein in any second grinding track, the center point of the bottom of the second groove formed by the B-th sub-track corresponds to the B-th sub-discrete point, and B is a positive integer.

7. The polishing method according to claim 1, wherein in the step of performing the second grinding process on the surface to be ground, the following steps are included: The first protrusion forms two second protrusions; wherein the number of the first protrusions is N-1 in the first polishing process, and the number of the second protrusions is 2×(N-1) in the second polishing process.

8. The polishing method according to claim 1, wherein After the step of performing the second polishing process on the surface to be polished, the method further comprises: performing a third polishing process on the surface to be polished to remove part of the second protrusions, so that the second protrusions form third protrusions, the height of the third protrusions being less than the height of the second protrusions.

9. A grinding apparatus characterized by comprising: The polishing apparatus comprises a polishing device for polishing a surface to be polished of an optical component, and a processor electrically connected to the polishing device, the processor being configured to perform the polishing method according to any one of claims 1-8.

Images