Automatic testing device for circuit board

Abstract

The present invention discloses an automatic testing device for a circuit board, which belongs to the field of circuit board detection, and comprises a detection box, a copper plate to be detected is arranged above the detection box, a positioning plate is connected to the top of the detection box, a positioning hole is opened at the top of the positioning plate, a gear assembly is arranged at one end of the positioning hole, the gear assembly is connected to a plurality of mutually symmetrical feed wheels through two pins, the bottom of the detection box is connected to two electric push rods for pushing out the copper plate through a sealing plate, and the inner side wall of the detection box is connected to four fixed shafts. The present invention can detect the warpage of the copper plate in the process of feeding the copper plate to be detected into the detection box through the arrangement of a plurality of feed wheels, so as to facilitate the qualified warpage of the plate in the subsequent processing, and at the same time, the arrangement of the immersion plate and the immersion layer can utilize the deformation of the immersion layer to invade the hole of the standard plate, so that the conductive liquid is connected to the two ends of the hole of the copper plate, and the integrity and continuity of the copper in the hole of the copper plate is detected.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board detection, and in particular to an automatic circuit board testing device. Background Art

[0002] A circuit board can be called a printed circuit board or a printed circuit board. Circuit boards are divided into three major categories according to the number of layers: single-sided boards, double-sided boards, and multi-layer circuit boards. Double-sided boards are an extension of single-sided boards. When single-layer wiring cannot meet the needs of electronic products, double-sided boards must be used. Both sides have copper cladding and routing, and holes can be used to conduct the circuits between the two layers to form the required network connection.

[0003] After drilling, the circuit board needs to undergo a copper plating process so that the aperture of the circuit board is attached with a continuous and uniform copper layer to facilitate the subsequent circuit conduction of the circuit board. However, the spacing between some holes and wires is relatively small, so there may be no copper around the holes. Incomplete pre-impregnation or electrolysis in the copper plating process will cause defects such as no copper on the inner side walls of some holes or discontinuous copper layers. In addition, in the process of manufacturing circuit boards, operations such as punching and chemical etching will generate residual stress on the circuit board. These residual stresses will continue to accumulate during the processing and cause the board to warp to a certain extent. If the warpage of the board is unqualified after copper plating, continued processing will result in a waste of processing resources. Therefore, an automatic circuit board testing device is proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem that the spacing between some holes and wires in the prior art is relatively small, so there may be a situation where there is no copper around the holes, and incomplete pre-impregnation or electrolysis in the copper plating process will cause defects such as no copper on the inner side walls of some holes or discontinuous copper layers. In addition, in the process of manufacturing circuit boards, operations such as punching and chemical etching will generate residual stress on the circuit boards. These residual stresses will continue to accumulate during the processing and cause the board to warp to a certain extent. If the warpage of the board is unqualified after copper plating, continued processing will cause a waste of processing resources. An automatic circuit board testing device is proposed.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The top of the testing box is provided with a positioning plate, and the top of the testing box is provided with a positioning hole, and one end of the positioning hole is provided with a gear assembly, and the gear assembly is connected with a plurality of mutually symmetrical feed wheels through two pin shafts, and the bottom of the testing box is connected with two electric push rods for pushing out the copper plate through a sealing plate, and the inner side wall of the testing box is connected with four fixed shafts, and the fixed shaft is respectively connected with two adapter plates through two movable plates, and an adjustment assembly is arranged between the two adapter plates, and the inward side walls of the adapter plates are respectively connected with two right-angle clamps through two limiting telescopic rods, and standard plates are arranged on the inner side walls of the front and rear right-angle clamps, and positioning assemblies are arranged on the side walls of the plurality of right-angle clamps located below, and an immersion plate is arranged on the outer side of the standard plate, and the inward side wall of the immersion plate is connected with an immersion layer, and the side wall of the immersion plate is connected with three brush cylinders through an electrically controlled annular guide rail.

[0007] Preferably, the top end of the detection box is fixedly connected to the bottom end of the positioning plate, the positioning hole provided on the positioning plate is located between the two standard plates, and the bottom end of the detection box is fixedly connected to the bottom ends of the two electric push rods via a sealing plate.

[0008] Preferably, the gear assembly consists of a driving gear and two driven gears, which are arranged side by side and meshed with each other. A driving motor is fixedly connected to the top of the positioning plate, and an output end of the driving motor is fixedly connected to the end face of the driving gear.

[0009] Preferably, the driven gear is fixedly connected to the inner side walls of multiple feed wheels through a pin shaft, the feed wheel is located directly above the positioning hole on the positioning plate, the top of the positioning plate is rotatably connected to the two ends of the pin shaft through two fixing plates, and two laser sensors are arranged under the two driven gears.

[0010] Preferably, the inner wall of the detection box is fixedly connected to both ends of the fixed shaft, the outer wall of the fixed shaft is slidably connected to the inner wall of the movable plate, and the end of the movable plate is connected to the controller via an adapter plate.

[0011] Preferably, the adjustment assembly consists of two electromagnetic rings and an adjustment spring, one end of the electromagnetic ring is fixedly connected to the inward side wall of the movable plate, both ends of the adjustment spring are respectively fixedly connected to the other ends of the two electromagnetic rings, and the inner side wall of the electromagnetic ring is slidably connected to the outer side wall of the fixed shaft.

[0012] Preferably, the positioning assembly consists of a T-shaped plate and a T-shaped slot plate, the T-shaped plate is slidably connected to the inner side wall of the T-shaped slot plate, the inward side wall of the adapter plate is fixedly connected to two right-angle clamps through two limiting telescopic rods, the two right-angle clamps are arranged at an angle to each other, and the two positioning assemblies located below are arranged at an angle to each other.

[0013] Preferably, the inner wall of the detection box is fixedly connected to the outward end surface of the immersion plate through a hydraulic rod, the inner cavity of the immersion plate is provided with a conductive liquid, and the immersion layer is connected to the inner cavity of the immersion plate.

[0014] Preferably, the side wall of the soaking plate is fixedly connected to the side wall of the electric-controlled annular guide rail, the inner side wall of the electric-controlled annular guide rail is fixedly connected to the end face of the brush cylinder through a guide tube, and the three brush cylinders are respectively located on both sides and the bottom of the two standard plates.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. This solution can detect the warpage of the copper-plated plate to be tested in the process of feeding the copper-plated plate to the test box through the setting of multiple feed wheels, so as to ensure that the warpage of the plate to be processed later is qualified.

[0017] 2. Through the setting of standard plates and electromagnetic rings, this scheme can utilize the holes on the front and rear standard plates to increase the overall path of the holes on the copper-plated board to be tested, which is convenient for the subsequent copper-plated continuity detection of the combined overall hole path and avoids the situation where there is no copper in the hole and it is difficult to detect.

[0018] 3. Through the setting of the immersion plate and the immersion layer, this scheme can use the deformation of the immersion layer to invade the holes of the standard plate, allowing the conductive liquid to connect to both ends of the holes of the copper-immersion plate, and detect the integrity and continuity of the copper in the holes on the copper-immersion plate, making the detection faster and more intuitive. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a circuit board automatic testing device proposed by the present invention Figure 1 ;

[0020] Figure 2 A schematic diagram of the three-dimensional structure of a circuit board automatic testing device proposed by the present invention Figure 2 ;

[0021] Figure 3 for Figure 2 A is an enlarged view of the middle figure;

[0022] Figure 4 This is a structural schematic diagram of the top of a positioning plate in a circuit board automatic testing device proposed by the present invention;

[0023] Figure 5 for Figure 4 The enlarged view of point B in the middle;

[0024] Figure 6 This is a structural schematic diagram of the position of the soaked board in a circuit board automatic testing device proposed by the present invention;

[0025] Figure 7 A schematic diagram of the structure of two standard boards in a circuit board automatic testing device proposed by the present invention;

[0026] Figure 8 A schematic diagram of the structure between two adapter boards in a circuit board automatic testing device proposed by the present invention;

[0027] Fig. 9 The present invention provides a schematic structural diagram of a positioning component in a circuit board automatic testing device.

[0028] In the figure: 1. detection box; 2. copper plate; 3. positioning plate; 4. driving motor; 5. driving gear; 6. driven gear; 7. pin shaft; 8. feed wheel; 9. laser sensor; 10. sealing plate; 11. electric push rod; 12. fixed shaft; 13. moving plate; 14. adapter plate; 15. controller; 16. electromagnetic ring; 17. adjustment spring; 18. limit telescopic rod; 19. right-angle clamp; 20. standard plate; 21. T-shaped plate; 22. T-slot plate; 23. hydraulic rod; 24. immersion plate; 25. immersion layer; 26. electric-controlled annular guide rail; 27. guide tube; 28. brush cylinder. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0030] Embodiment 1, refer to Figure 1-9 , a circuit board automatic testing device, comprising a testing box 1, a copper plate 2 to be tested is arranged above the testing box 1, a positioning plate 3 is connected to the top of the testing box 1, a positioning hole is opened at the top of the positioning plate 3, a gear assembly is arranged at one end of the positioning hole, the gear assembly is connected to a plurality of mutually symmetrical feed wheels 8 through two pins 7, and two electric push rods 11 for pushing out the copper plate 2 are connected to the bottom of the testing box 1 through a sealing plate 10;

[0031] Furthermore, the top of the detection box 1 is fixedly connected to the bottom of the positioning plate 3, the positioning hole opened on the positioning plate 3 is located between the two standard plates 20, the bottom of the detection box 1 is fixedly connected to the bottom of the two electric push rods 11 through the sealing plate 10, the gear assembly is composed of a driving gear 5 and two driven gears 6, the driving gear 5 and the two driven gears 6 are arranged side by side, and two of them are meshed with each other, the top of the positioning plate 3 is fixedly connected to the driving motor 4, the output end of the driving motor 4 is fixedly connected to the end face of the driving gear 5, the driven gear 6 is fixedly connected to the inner side walls of multiple feed wheels 8 through a pin shaft 7, the feed wheel 8 is located directly above the positioning hole on the positioning plate 3, the top of the positioning plate 3 is rotatably connected to the two ends of the pin shaft 7 through two fixing plates, and two laser sensors 9 are arranged below the two driven gears 6;

[0032] It should be noted that: the copper plate 2 to be tested is conveyed to the side of the test box 1 through a conveyor belt, and the copper plate 2 is grabbed by a manipulator, passed through multiple feed wheels 8 and entered into the positioning hole of the positioning plate 3. The distance between the two feed wheels 8 is the thickness of the copper plate 2. The rubber material of the feed wheel 8 makes the feed wheel 8 and the copper plate 2 have a large friction force. Then the drive motor 4 is started to drive the drive gear 5 to rotate, and the rotation of the drive gear 5 drives the adjacent driven gear 6 to rotate, so that the two driven gears 6 rotate in the opposite direction, and the driven gear 6 rotates through the pin shaft 7 to drive multiple feed wheels. The wheel 8 rotates, and the reverse rotation of the two rows of feed wheels 8 drives the copper plate 2 to move down or up. If the copper plate 2 to be tested has a large warpage, when the copper plate 2 with the largest warpage moves onto the feed wheel 8, the entire plate of the copper plate 2 will be tilted at a large angle. At this time, the angle deviation of the copper plate 2 will cause the sensing light beams of the two laser sensors 9 to pass through, indicating that the warpage of the copper plate 2 is unqualified. At this time, the two electric push rods 11 on the sealing plate 10 will be started to push the copper plate 2 out, and then the robot will grab the unqualified copper plate 2 pushed out and put it on the rework conveyor belt;

[0033] A further advantage of adopting the above method is that the warping of the copper plate 2 can be tested during the process of feeding the copper plate 2 to be tested into the testing box 1, so that the warping of the plate to be processed later is qualified.

[0034] Example 2, reference Figure 1-9 , the inner wall of the detection box 1 is connected to four fixed shafts 12, the fixed shafts 12 are respectively connected to two adapter plates 14 through two movable plates 13, an adjustment component is arranged between the two adapter plates 14, the inner side walls of the adapter plate 14 are respectively connected to two right-angle clamps 19 through two limit telescopic rods 18, standard plates 20 are arranged on the inner side walls of the front and rear right-angle clamps 19, and positioning components are arranged on the side walls of the multiple right-angle clamps 19 located below;

[0035] Further, the inner wall of the detection box 1 is fixedly connected to both ends of the fixed shaft 12, the outer wall of the fixed shaft 12 is slidably connected to the inner wall of the movable plate 13, the end of the movable plate 13 is connected to the controller 15 through the adapter plate 14, the adjustment component is composed of two electromagnetic rings 16 and an adjustment spring 17, one end of the electromagnetic ring 16 is fixedly connected to the inner side wall of the movable plate 13, the two ends of the adjustment spring 17 are respectively fixedly connected to the other ends of the two electromagnetic rings 16, the inner wall of the electromagnetic ring 16 is slidably connected to the outer wall of the fixed shaft 12, the positioning component is composed of a T-shaped plate 21 and a T-shaped slot plate 22, the T-shaped plate 21 is slidably connected to the inner wall of the T-shaped slot plate 22, the inner side wall of the adapter plate 14 is fixedly connected to two right-angle clamps 19 through two limiting telescopic rods 18, the two right-angle clamps 19 are arranged at 90° to each other, and the two positioning components located below are arranged at 90° to each other;

[0036] It should be noted that: after the copper-plated plate 2 with qualified warping degree is fed into the detection box 1, the bottom and both sides of the copper-plated plate 2 will be limited by the side walls of the T-shaped plate 21 and the T-shaped slot plate 22 at the bottom and both sides respectively, and then the controller 15 controls the power supply to connect the two electromagnetic rings 16 on the fixed shaft 12, so that the adjacent ends of the electromagnetic rings 16 have opposite magnetic poles, and the two electromagnetic rings 16 will generate mutual magnetic attraction to compress the adjustment spring 17, and drive the two adapter plates 14 to move toward each other through the two movable plates 13, and the adapter plate 14 will drive the two standard plates 20 to approach each other through the right-angle clamping plate 19, and the standard plate 20 pushes the right-angle clamping plate 19 in all directions through the limiting telescopic rod 18 to limit and fix, and the two standard plates 20 approach each other to clamp the copper-plated plate 2, so that the positions of the holes of the standard plate 20 and the copper-plated plate 2 are aligned one by one;

[0037] A further advantage of adopting the above method is that the holes on the front and rear end standard boards 20 can be used to increase the overall path of the holes on the copper-plated board 2 to be tested, which facilitates the subsequent copper-plated continuity detection of the combined overall hole path and avoids the situation where there is no copper in the hole and it is difficult to detect.

[0038] Example 3, reference Figure 1-9 A soaking plate 24 is arranged outside the standard plate 20, and an immersion layer 25 is connected to the inner side wall of the soaking plate 24. The side wall of the soaking plate 24 is connected to three brush cylinders 28 through an electrically controlled annular guide rail 26;

[0039] Further, the inner wall of the detection box 1 is fixedly connected to the outward end face of the impregnation plate 24 through the hydraulic rod 23, the inner cavity of the impregnation plate 24 is provided with a conductive liquid, the immersion layer 25 is communicated with the inner cavity of the impregnation plate 24, the side wall of the impregnation plate 24 is fixedly connected to the side wall of the electric control annular guide rail 26, the inner wall of the electric control annular guide rail 26 is fixedly connected to the end face of the brush cylinder 28 through the guide pipe 27, and the three brush cylinders 28 are respectively located on both sides and the bottom of the two standard plates 20;

[0040] It should be noted that: the hydraulic rod 23 is then started to push the impregnation plate 24 inward to a preset position and stop. The movement of the impregnation plate 24 will press the immersion layer 25 onto the standard plate 20. During the continuous pressing process, the immersion layer 25 will undergo elastic deformation and invade into the hole of the standard plate 20. Since the impregnation plate 24 is pushed inward to a preset position and stops, the immersion layer 25 deforms and invades the fitting part of the standard plate 20 and the copper plate 2 and stops. The guide tube 27 keeps the brush cylinder 28 between the two standard plates 20 under the telescopic tube structure. On the side wall of the room, the brush cylinder 28 moves under the drive of the electric control annular guide rail 26, and the conductive liquid is immersed in the edge of the standard plate 20 and the copper plate 2. At this time, the detection power supply of the standard plate 20 is turned on by the controller 15. If the copper is deposited completely and continuously in the holes on the copper plate 2, then the circuits of the two standard plates 20 will remain unobstructed after power is turned on, and all data can be exported normally, so that the detection results can be observed intuitively. The data export after the circuit board is powered on is a prior art, and no further details will be given here.

[0041] A further advantage of adopting the above method is that the deformation of the immersion layer 25 can be used to invade the holes of the standard board 20, allowing the conductive liquid to connect to both ends of the holes of the copper-plated plate 2, and the integrity and continuity of the copper in the holes on the copper-plated plate 2 can be detected, making the detection faster and more intuitive.

[0042] When the present invention is in use, the copper-plated plate 2 to be tested is transported to the side of the testing box 1 through the conveyor belt, and the copper-plated plate 2 is grabbed by a manipulator, passed through multiple feed wheels 8 and entered into the positioning hole of the positioning plate 3. The distance between the two feed wheels 8 is the thickness of the copper-plated plate 2. The rubber material of the feed wheel 8 makes the feed wheel 8 and the copper-plated plate 2 have a large friction force. Then the drive motor 4 is started to drive the drive gear 5 to rotate, and the rotation of the drive gear 5 drives the adjacent driven gear 6 to rotate, so that the two driven gears 6 rotate in the opposite direction. The rotation of the driven gear 6 drives multiple feed wheels 8 to rotate through the pin shaft 7, and the reverse rotation of the two rows of feed wheels 8 drives the copper-plated plate 2 to move down or up If the copper plate 2 to be tested has a large warpage, when the copper plate 2 with the largest warpage moves onto the feed wheel 8, the entire copper plate 2 will be tilted at a large angle. At this time, the angle deviation of the copper plate 2 will cause the sensing light beams of the two laser sensors 9 to pass through, indicating that the warpage of the copper plate 2 is unqualified. At this time, the two electric push rods 11 on the sealing plate 10 will be started to push the copper plate 2 out, and then the robot will grab the unqualified copper plate 2 pushed out to the rework conveyor belt. In this way, the warpage of the copper plate 2 can be tested during the process of feeding the copper plate 2 to the detection box 1, so as to facilitate the subsequent processing of the plate with qualified warpage;

[0043] After the copper plate 2 with qualified warpage is fed into the inspection box 1, the bottom and both sides of the copper plate 2 will be limited by the side walls of the T-shaped plate 21 and the T-shaped slot plate 22 at the bottom and both sides respectively, and then the controller 15 controls the power supply to connect the two electromagnetic rings 16 on the fixed shaft 12, so that the adjacent ends of the electromagnetic rings 16 have opposite magnetic poles, then the two electromagnetic rings 16 will generate mutual magnetic attraction, compress the adjustment spring 17, and drive the two adapter plates 14 to move towards each other through the two moving plates 13, then the adapter plates 14 will pass The right-angle clamp 19 drives the two standard plates 20 to approach each other, and the standard plates 20 push the right-angle clamps 19 in all directions to limit and fix through the limiting telescopic rod 18. The two standard plates 20 approach each other to clamp the copper sinking plate 2, so that the positions of the holes of the standard plates 20 and the copper sinking plate 2 are aligned one by one. In this way, the holes on the front and rear standard plates 20 can be used to increase the overall path of the holes on the copper sinking plate 2 to be detected, which is convenient for the subsequent copper sinking continuity detection of the combined overall hole path, and avoids the situation where the copper is not deposited in the hole and is difficult to detect;

[0044] Then, the hydraulic rod 23 is started to push the immersion plate 24 inward to the preset position and stop. The movement of the immersion plate 24 will press the immersion layer 25 onto the standard plate 20. During the continuous pressing process, the immersion layer 25 will undergo elastic deformation and invade into the hole of the standard plate 20. Since the immersion plate 24 is pushed inward to the preset position and stops, the immersion layer 25 deforms and invades the fitting part of the standard plate 20 and the copper plate 2 and stops. The guide tube 27 keeps the brush cylinder 28 on the side wall between the two standard plates 20 under the telescopic tube structure. The brush cylinder 28 moves under the drive of the electrically controlled annular guide rail 26 to immerse the conductive liquid into the standard plate 20 and the copper plate 20. At the edge of the plate 2, the detection power supply of the standard plate 20 is turned on through the controller 15. If the copper in the holes on the copper-plated plate 2 is complete and continuous, then after the two standard plates 20 are powered on, all circuits will remain unobstructed, and all data can be exported normally, so that the detection results can be observed intuitively. The data export after the circuit board is powered on is a prior art and will not be elaborated on here. In this way, the deformation of the immersion layer 25 can be used to invade the holes of the standard plate 20, allowing the conductive liquid to be connected to the two ends of the hole of the copper-plated plate 2, and the complete continuity of the copper in the holes on the copper-plated plate 2 can be detected, making the detection faster and more intuitive.

[0045] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A circuit board automatic testing device, comprising a testing box (1), a copper plate (2) to be tested is arranged above the testing box (1), characterized in that: The top of the detection box (1) is connected to a positioning plate (3), the top of the positioning plate (3) is provided with a positioning hole, one end of the positioning hole is provided with a gear assembly, the gear assembly is connected to a plurality of mutually symmetrical feed wheels (8) via two pin shafts (7), the bottom of the detection box (1) is connected to two electric push rods (11) for pushing out the copper plate (2) via a sealing plate (10), the inner side wall of the detection box (1) is connected to four fixed shafts (12), the fixed shafts (12) are respectively connected to two adapter plates (14) via two movable plates (13), and the two adapter plates An adjusting component is arranged between the adapter plate (14); the inward side wall of the adapter plate (14) is respectively connected to two right-angle clamping plates (19) through two limiting telescopic rods (18); standard plates (20) are arranged on the inner side walls of the front and rear right-angle clamping plates (19); positioning components are arranged on the side walls of the plurality of right-angle clamping plates (19) located below; an immersion plate (24) is arranged on the outer side of the standard plate (20); the inward side wall of the immersion plate (24) is connected to an immersion layer (25); and the side wall of the immersion plate (24) is connected to three brush cylinders (28) through an electrically controlled annular guide rail (26).

2. A circuit board automatic testing device according to claim 1, characterized in that: The top end of the detection box (1) is fixedly connected to the bottom end of the positioning plate (3); the positioning hole provided on the positioning plate (3) is located between the two standard plates (20); and the bottom end of the detection box (1) is fixedly connected to the bottom ends of the two electric push rods (11) via a sealing plate (10).

3. The circuit board automatic testing device according to claim 1, characterized in that: The gear assembly is composed of a driving gear (5) and two driven gears (6); the driving gear (5) and the two driven gears (6) are arranged side by side and mesh with each other; the top end of the positioning plate (3) is fixedly connected to a driving motor (4); the output end of the driving motor (4) is fixedly connected to the end face of the driving gear (5).

4. A circuit board automatic testing device according to claim 3, characterized in that: The driven gear (6) is fixedly connected to the inner side walls of a plurality of feed wheels (8) via a pin shaft (7); the feed wheel (8) is located directly above a positioning hole on the positioning plate (3); the top end of the positioning plate (3) is rotatably connected to the two ends of the pin shaft (7) via two fixing plates; and two laser sensors (9) are provided below the two driven gears (6).

5. The circuit board automatic testing device according to claim 1, characterized in that: The inner wall of the detection box (1) is fixedly connected to both ends of the fixed shaft (12), the outer wall of the fixed shaft (12) is slidably connected to the inner wall of the movable plate (13), and the end of the movable plate (13) is connected to a controller (15) via an adapter plate (14).

6. The circuit board automatic testing device according to claim 1, characterized in that: The adjustment assembly is composed of two electromagnetic rings (16) and an adjustment spring (17); one end of the electromagnetic ring (16) is fixedly connected to the inward side wall of the movable plate (13); two ends of the adjustment spring (17) are respectively fixedly connected to the other ends of the two electromagnetic rings (16); and the inner side wall of the electromagnetic ring (16) is slidably connected to the outer side wall of the fixed shaft (12).

7. The circuit board automatic testing device according to claim 1, characterized in that: The positioning assembly is composed of a T-shaped plate (21) and a T-shaped slot plate (22); the T-shaped plate (21) is slidably connected to the inner side wall of the T-shaped slot plate (22); the inner side wall of the adapter plate (14) is fixedly connected to two right-angle clamping plates (19) via two limiting telescopic rods (18); the two right-angle clamping plates (19) are arranged at 90 degrees to each other, and the two positioning assemblies located below are arranged at 90 degrees to each other.

8. The circuit board automatic testing device according to claim 1, characterized in that: The inner wall of the detection box (1) is fixedly connected to the outward end surface of the immersion plate (24) via a hydraulic rod (23); the inner cavity of the immersion plate (24) is provided with a conductive liquid; and the immersion layer (25) is connected to the inner cavity of the immersion plate (24).

9. The circuit board automatic testing device according to claim 1, characterized in that: The side wall of the soaking plate (24) is fixedly connected to the side wall of the electric-controlled annular guide rail (26); the inner side wall of the electric-controlled annular guide rail (26) is fixedly connected to the end surface of the brush cylinder (28) via a guide tube (27); the three brush cylinders (28) are respectively located on both sides and the bottom of the two standard plates (20); the guide tube (27) is a telescopic tube structure.

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