Method and device for correcting digital integration by hardware integration of Rogowski coil

Abstract

The invention discloses a method and a device for correcting digital integration by hardware integration of a Rogowski coil. The method comprises the following steps: collecting a current differential signal in an output signal of a Rogowski coil, and obtaining a discrete current differential signal; performing signal processing on the current differential signal to obtain a reconstructed current signal; determining a digital integration algorithm of the Rogowski coil according to the obtained hardware measurement waveform of the Rogowski coil; and obtaining a digital integral signal of the Rogowski coil according to a digital integral algorithm and the reconstructed current signal.

Description

Technical Field

[0001] The present invention relates to the technical field of signal processing, and more specifically, to a method and device for correcting digital integration of hardware integration of a Rogowski coil. Background Art

[0002] Lightning accidents will cause the current amplitude of this part of the power system to rise sharply, which will have an immeasurable impact on the safety of power equipment in the power system and the production and life of residents and industrial users. Many electrical equipment should consider the ability to withstand transient current impacts when designing; lightning protection equipment needs to undergo impact current tolerance tests. Therefore, the accuracy of impact current measurement directly affects the performance evaluation of lightning protection equipment. Rogowski coil is a universal sensor for measuring current signals based on the principle of electromagnetic induction. It is currently the most widely used transient current measurement sensor, mainly including coils and integral circuits.

[0003] According to the principle of Faraday's law of electromagnetic induction, the Rogowski coil generates a voltage output signal proportional to the derivative of the current signal:

[0004]

[0005] Where E is the induced voltage obtained by the measured current I through the Rogowski coil. From the induced voltage of the Rogowski coil to the actual waveform of the measured current, an integration link is required. Therefore, a high-performance integration link is the key to ensure the high measurement accuracy of the Rogowski coil sensor.

[0006] The integrators widely used at present are hardware integrators and digital integrators. Both analog and digital methods can realize the integral part of the Rogowski coil. Hardware integrators are usually composed of inertial components such as amplifiers, resistors and capacitors. At present, hardware integrators are generally located at the end of the Rogowski coil to transform the amplitude and phase of the input current. However, the temperature and aging of analog devices are unstable, which may cause leakage, capacity loss and zero drift in analog devices. In addition, the feedback and compensation design of hardware integrators is relatively inflexible. All these factors existing in analog devices may lead to integration performance errors. Summary of the invention

[0007] In view of the deficiencies in the prior art, the present invention provides a method and device for correcting the digital integration of the hardware integration of a Rogowski coil.

[0008] According to one aspect of the present invention, a method for correcting digital integration of a Rogowski coil by hardware integration is provided, comprising:

[0009] Collecting the current differential signal in the output signal of the Rogowski coil to obtain a discrete current differential signal;

[0010] Performing signal processing on the current differential signal to obtain a reconstructed current signal;

[0011] Determine the digital integration algorithm of the Rogowski coil according to the obtained hardware measurement waveform of the Rogowski coil;

[0012] According to the digital integration algorithm and the reconstructed current signal, the digital integration signal of the Rogowski coil is obtained.

[0013] Optionally, performing signal processing on the current differential signal to obtain a reconstructed current signal includes:

[0014] Wavelet transform is used to decompose the current differential signal to obtain wavelet signals of different scale frequency bands;

[0015] Threshold processing is performed on wavelet signals of different scale frequency bands, wavelet signals smaller than a preset threshold are reduced by a preset ratio, and wavelet signals larger than the preset threshold are kept unchanged;

[0016] The wavelet signals of different scale frequency bands processed by threshold are inversely transformed and merged to obtain the reconstructed current signal.

[0017] Optionally, determining a digital integration algorithm of the Rogowski coil according to the acquired hardware measurement waveform of the Rogowski coil includes:

[0018] The hardware measurement waveform of the Rogowski coil is obtained through the hardware integration link;

[0019] Performing Fourier transform on the hardware measurement waveform to obtain frequency components of the hardware measurement waveform, where the frequency components include low-frequency components, intermediate-frequency components, and high-frequency components;

[0020] Calculate the sampling rate component introduced by the sampling rate of the hardware measurement waveform;

[0021] According to the frequency components, the adoption rate components and the preset weights of multiple integration algorithms, a composite evaluation index of multiple integration algorithms is constructed;

[0022] The integration algorithm with the highest composite evaluation index is selected as the digital integration algorithm.

[0023] Optionally, the sampling rate component p4 is calculated as:

[0024]

[0025] Where SR is the sampling rate.

[0026] Optionally, the calculation formula of the composite evaluation index is:

[0027]

[0028] In the formula, p1 is the low-frequency component, p2 is the intermediate-frequency component, p3 is the high-frequency component, p4 is the sampling rate component, W1 is the low-frequency weight, W2 is the intermediate-frequency weight, W3 is the high-frequency weight, and W4 is the sampling rate weight.

[0029] Optionally, the digital integration algorithm includes:

[0030] Complex rectangle algorithm:

[0031]

[0032] Complex trapezoidal algorithm:

[0033]

[0034] Complex Simpson algorithm:

[0035]

[0036] Where H(z) represents the z-domain transfer function, T s is the sampling interval, and z is a complex variable.

[0037] Optionally, the calculation formula of the digital integration signal of the Rogowski coil is:

[0038]

[0039] Where e1(n) is the reconstructed current signal, H(z) is the z-domain transfer function represented by the digital integration algorithm, z is a complex variable, n is the signal length, and C is any simple positive closed curve in the convergence domain of the digital integration algorithm H(z).

[0040] According to another aspect of the present invention, a device for correcting the digital integration of the hardware integration of the Rogowski coil is provided, comprising:

[0041] A first acquisition module is used to collect a current differential signal in the output signal of the Rogowski coil to obtain a discrete current differential signal;

[0042] A second acquisition module is used to perform signal processing on the current differential signal to obtain a reconstructed current signal;

[0043] A determination module, used for determining a digital integration algorithm of the Rogowski coil according to the acquired hardware measurement waveform of the Rogowski coil;

[0044] The third acquisition module is used to acquire the digital integration signal of the Rogowski coil according to the digital integration algorithm and the reconstructed current signal.

[0045] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the storage medium stores a computer program, and the computer program is used to execute the method described in any one of the above aspects of the present invention.

[0046] According to another aspect of the present invention, an electronic device is provided, comprising: a processor; a memory for storing instructions executable by the processor; the processor is configured to read the executable instructions from the memory and execute the instructions to implement the method described in any one of the above aspects of the present invention.

[0047] Therefore, the present invention corrects the integration link of the Rogowski coil by combining the hardware integration and the digital integration, and improves the accuracy of the digital integration method by combining the advantages of the hardware integration and the digital integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] A more complete understanding of exemplary embodiments of the present invention may be obtained by referring to the following drawings:

[0049] Figure 1 It is a flow chart of a method for correcting digital integration of a Rogowski coil by hardware integration provided by an exemplary embodiment of the present invention;

[0050] Figure 2 It is another flow chart of a method for correcting a digital integration of a Rogowski coil using hardware integration provided by an exemplary embodiment of the present invention;

[0051] Figure 3 It is a structural schematic diagram of a correction device for a digital integration of a Rogowski coil provided by an exemplary embodiment of the present invention;

[0052] Figure 4 This is a structure of an electronic device provided by an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0053] Below, the exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments of the present invention, and it should be understood that the present invention is not limited to the exemplary embodiments described here.

[0054] It should be noted that the relative arrangement of components and steps, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0055] Those skilled in the art can understand that the terms "first" and "second" in the embodiments of the present invention are only used to distinguish different steps, devices or modules, etc., and neither represent any specific technical meaning nor indicate the necessary logical order between them.

[0056] It should also be understood that, in the embodiments of the present invention, “plurality” may refer to two or more than two, and “at least one” may refer to one, two or more than two.

[0057] It should also be understood that any component, data or structure mentioned in the embodiments of the present invention can generally be understood as one or more, unless explicitly limited or otherwise indicated in the context.

[0058] In addition, the term "and / or" in the present invention is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present invention generally indicates that the associated objects before and after are in an "or" relationship.

[0059] It should also be understood that the description of the various embodiments of the present invention focuses on the differences between the various embodiments, and the same or similar aspects thereof can be referenced to each other, and for the sake of brevity, they will not be described one by one.

[0060] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0061] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0062] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0063] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0064] Embodiments of the present invention can be applied to electronic devices such as terminal devices, computer systems, servers, etc., which can operate with many other general or special computing system environments or configurations. Examples of well-known terminal devices, computing systems, environments and / or configurations suitable for use with electronic devices such as terminal devices, computer systems, servers, etc. include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network personal computers, small computer systems, large computer systems, and distributed cloud computing technology environments including any of the above systems, etc.

[0065] Electronic devices such as terminal devices, computer systems, servers, etc. can be described in the general context of computer system executable instructions (such as program modules) executed by computer systems. Generally, program modules can include routines, programs, object programs, components, logic, data structures, etc., which perform specific tasks or implement specific abstract data types. Computer systems / servers can be implemented in a distributed cloud computing environment, where tasks are performed by remote processing devices linked through a communication network. In a distributed cloud computing environment, program modules can be located on local or remote computing system storage media including storage devices.

[0066] Exemplary Methods

[0067] Figure 1 FIG. 1 is a flow chart of a method for correcting a digital integral of a Rogowski coil by hardware integral according to an exemplary embodiment of the present invention. This embodiment can be applied to electronic devices, such as Figure 1 As shown, the correction method 100 of the hardware integration of the Rogowski coil to the digital integration includes the following steps:

[0068] Step 101, collecting a current differential signal in an output signal of a Rogowski coil to obtain a discrete current differential signal;

[0069] Step 102, performing signal processing on the current differential signal to obtain a reconstructed current signal;

[0070] Step 103, determining a digital integration algorithm of the Rogowski coil according to the acquired hardware measurement waveform of the Rogowski coil;

[0071] Step 104 : acquiring a digital integration signal of the Rogowski coil according to a digital integration algorithm and the reconstructed current signal.

[0072] Specifically, the main purpose of the present invention is to improve the measurement performance of the Rogowski coil, especially in the measurement of the integral link of the Rogowski coil, by combining the hardware integration and digital integration to correct the integral link of the Rogowski coil and obtain more accurate results. Figure 2 As shown, the specific steps are as follows:

[0073] 1. Connect the output signal of the Rogowski coil to the ADC for sampling:

[0074] For the output signal of the Rogowski coil, an ADC is used to collect the current differential signal. The sampling rate and resolution of the ADC are based on the measured waveform. The discrete current differential signals collected by the ADC are I1′(n), which are transmitted to the host computer that controls the ADC.

[0075] 2. Process the discrete current differential signal by controlling the ADC host computer:

[0076] Wavelet threshold denoising:

[0077] (1) Use wavelet transform to decompose the original signal into frequency bands of different scales.

[0078] (2) Perform threshold processing on the wavelet coefficients of each frequency band. The coefficients smaller than the threshold are scaled down proportionally, and the coefficients larger than the threshold remain unchanged. This can retain some smaller signal components while reducing noise.

[0079] (3) Reconstructing the signal: Perform inverse wavelet transform on the wavelet coefficients after threshold processing to obtain the denoised signal. The reconstruction process combines the processing results of each frequency band to reconstruct the signal e1(n).

[0080] (4) Adjust parameters: adjust the threshold and the number of wavelet decomposition layers according to the denoising effect until a satisfactory result is obtained. This step requires repeated trials and adjustments for waveforms and coil bodies with different time parameters.

[0081] 3. Correct the digital integration link by using the waveform data obtained through the hardware integration link:

[0082] (1) Obtain the hardware measurement waveform E2(n) through the hardware integration link.

[0083] (2) Perform fast Fourier transform on the measured waveform E2(n) to extract the frequency components of the waveform. The frequency from DC to 100 Hz is the low-frequency component, which is recorded as p1. The frequency from 100 Hz to 10 kHz is the medium-frequency component p2, and the frequency above 10 kHz is the high-frequency component p3. p1, p2, and p3 are all normalized proportion coefficients.

[0084] (3) Calculate the component introduced by the sampling rate SR:

[0085]

[0086] (4) Construct a composite evaluation index T: low frequency weight W1, medium frequency weight W2, high frequency weight W3, sampling rate weight W4:

[0087]

[0088] (5) The weights of different integration algorithms are shown in the following table:

[0089]

[0090] (6) Calculate the evaluation index T of each integration algorithm, select the integration algorithm with the highest index score as the algorithm for waveform integration, and perform digital integration.

[0091] The algorithm formula for complex rectangle is:

[0092]

[0093] The formula of the complex trapezoidal algorithm is:

[0094]

[0095] The complex Simpson algorithm formula is:

[0096]

[0097] Where H(z) represents the z-domain transfer function, T s is the sampling interval, and z is a complex variable.

[0098] 4. Integrate the reconstructed signal e1(n) in step 2 with the selected integration algorithm to obtain the final result. The calculation formula of the final integrated signal f(n) is as follows:

[0099]

[0100] Where n is the signal length, and C is any simple positive closed curve in the convergence domain of the integration algorithm H(z).

[0101] In one embodiment of the present invention, the digital integration device provided by the present invention is used in conjunction with a Rogowski coil to measure a specific current waveform:

[0102] (1) Connect the Rogowski coil through the center of the current to be measured. The output port of the Rogowski coil body is divided into two outputs, one connected to the hardware integration module of the device, and the other connected to the AD sampling module of the device.

[0103] (2) Waveform 1 is obtained through hardware integration, and waveform 1 is input into the upper computer of the device. The waveform is subjected to fast Fourier transform to extract the characteristic parameters of the waveform p1=0.47, p2=0.33, and p3=0.2.

[0104] Get the sampling rate SR = 10MS / s, and calculate the component p4 = 7 introduced by SR,

[0105] According to the calculation formula of the composite evaluation index T and the weights of different digital integration algorithms, the evaluation scores of the three digital integrations are calculated:

[0106] Complex rectangle algorithm: T = 0.057

[0107] Complex trapezoidal algorithm: T = 0.038

[0108] Complex Simpson algorithm: T = 0.034

[0109] The complex rectangular algorithm with the highest score is selected as the digital integration algorithm for this waveform.

[0110] (3) The AD sampled magnetic field signal is subjected to wavelet threshold method to remove noise, and digital integration is performed through complex rectangular algorithm to obtain waveform 2 of digital integration output.

[0111] (4) Waveform 2 is the digital integration waveform obtained by the present invention.

[0112] Therefore, the present invention corrects the integration link of the Rogowski coil by combining the hardware integration and the digital integration to obtain a more accurate result. The advantages of the hardware integration and the digital integration are combined to improve the accuracy of the digital integration method.

[0113] Exemplary Devices

[0114] Figure 3 FIG. 1 is a schematic diagram of a correction device for a digital integration of a Rogowski coil provided by an exemplary embodiment of the present invention. Figure 3 As shown, the device 300 includes:

[0115] A first acquisition module 310 is used to collect a current differential signal in the output signal of the Rogowski coil to obtain a discrete current differential signal;

[0116] A second acquisition module 320 is used to perform signal processing on the current differential signal to obtain a reconstructed current signal;

[0117] A determination module 330, configured to determine a digital integration algorithm of the Rogowski coil according to the acquired hardware measurement waveform of the Rogowski coil;

[0118] The third acquisition module 340 is used to acquire the digital integration signal of the Rogowski coil according to the digital integration algorithm and the reconstructed current signal.

[0119] Optionally, the second acquisition module 320 includes:

[0120] The first acquisition submodule is used to decompose the current differential signal by using wavelet transform to obtain wavelet signals of different scale frequency bands;

[0121] A processing submodule is used to perform threshold processing on wavelet signals of different scale frequency bands, reduce the wavelet signals smaller than a preset threshold by a preset ratio, and keep the wavelet signals larger than the preset threshold unchanged;

[0122] The second acquisition submodule is used to perform inverse wavelet transformation on the wavelet signals of different scale frequency bands processed by threshold value and merge them to obtain the reconstructed current signal.

[0123] Optionally, the determination module 330 includes:

[0124] The third acquisition submodule is used to obtain the hardware measurement waveform of the Rogowski coil through the hardware integration link;

[0125] A fourth acquisition submodule is used to perform Fourier transform on the hardware measurement waveform to obtain frequency components of the hardware measurement waveform, where the frequency components include low-frequency components, intermediate-frequency components, and high-frequency components;

[0126] A calculation submodule, used for calculating a sampling rate component introduced by the adoption rate of the hardware measurement waveform;

[0127] A construction submodule is used to construct a composite evaluation index of multiple integration algorithms based on frequency components, adoption rate components and preset weights of multiple integration algorithms;

[0128] A submodule is selected to select the integration algorithm with the highest composite evaluation index as the digital integration algorithm.

[0129] Optionally, the sampling rate component p4 is calculated as:

[0130]

[0131] Where SR is the sampling rate.

[0132] Optionally, the calculation formula of the composite evaluation index is:

[0133]

[0134] In the formula, p1 is the low-frequency component, p2 is the intermediate-frequency component, p3 is the high-frequency component, p4 is the sampling rate component, W1 is the low-frequency weight, W2 is the intermediate-frequency weight, W3 is the high-frequency weight, and W4 is the sampling rate weight.

[0135] Optionally, the digital integration algorithm includes:

[0136] Complex rectangle algorithm:

[0137]

[0138] Complex trapezoidal algorithm:

[0139]

[0140] Complex Simpson's algorithm:

[0141]

[0142] Where H(z) represents the z-domain transfer function, T s is the sampling interval, and z is a complex variable.

[0143] Optionally, the calculation formula of the digital integration signal of the Rogowski coil is:

[0144]

[0145] Where e1(n) is the reconstructed current signal, H(z) is the z-domain transfer function represented by the digital integration algorithm, z is a complex variable, n is the signal length, and C is any simple positive closed curve in the convergence domain of the digital integration algorithm H(z).

[0146] Exemplary Electronic Devices

[0147] Figure 4 This is a structure of an electronic device provided by an exemplary embodiment of the present invention. Figure 4 As shown, the electronic device 40 includes one or more processors 41 and a memory 42 .

[0148] The processor 41 may be a central processing unit (CPU) or other forms of processing units having data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0149] The memory 42 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory (cache), etc. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor 41 may run the program instructions to implement the methods of the software programs of the various embodiments of the present invention described above and / or other desired functions. In one example, the electronic device may also include: an input device 43 and an output device 44, which are interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0150] In addition, the input device 43 may also include, for example, a keyboard, a mouse, etc.

[0151] The output device 44 can output various information to the outside, and can include, for example, a display, a speaker, a printer, a communication network and a remote output device connected thereto.

[0152] Of course, to simplify, Figure 4 Only some of the components related to the present invention in the electronic device are shown, and components such as a bus, an input / output interface, etc. are omitted. In addition, the electronic device may further include any other appropriate components according to specific application conditions.

[0153] Exemplary computer program products and computer-readable storage media

[0154] In addition to the above-mentioned methods and devices, an embodiment of the present invention may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present invention described in the above-mentioned "Exemplary Method" section of this specification.

[0155] The computer program product may be written in any combination of one or more programming languages ​​to write program code for performing the operations of the embodiments of the present invention, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0156] In addition, an embodiment of the present invention may also be a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present invention described in the above “Exemplary Method” section of this specification.

[0157] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, system or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0158] The basic principle of the present invention is described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, strengths, effects, etc. mentioned in the present invention are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. must be possessed by each embodiment of the present invention. In addition, the specific details disclosed above are only for the purpose of illustration and facilitation of understanding, rather than limitation, and the above details do not limit the present invention to being implemented by adopting the above specific details.

[0159] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0160] The block diagrams of the devices, systems, equipment, and systems involved in the present invention are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, systems, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The word "such as" used here refers to the phrase "such as but not limited to", and can be used interchangeably with it.

[0161] The method and system of the present invention may be implemented in many ways. For example, the method and system of the present invention may be implemented by software, hardware, firmware or any combination of software, hardware, firmware. The above order of steps for the method is only for illustration, and the steps of the method of the present invention are not limited to the order specifically described above, unless otherwise specifically stated. In addition, in some embodiments, the present invention may also be implemented as a program recorded in a recording medium, which includes machine-readable instructions for implementing the method according to the present invention. Thus, the present invention also covers a recording medium storing a program for executing the method according to the present invention.

[0162] It should also be noted that in the system, device and method of the present invention, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. The above description of the disclosed aspects is provided to enable any technician in the field to make or use the present invention. Various modifications to these aspects are very obvious to those skilled in the art, and the general principles defined here can be applied to other aspects without departing from the scope of the present invention. Therefore, the present invention is not intended to be limited to the aspects shown here, but in accordance with the widest range consistent with the principles and novel features disclosed here.

[0163] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present invention to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A method for correcting the digital integration of the hardware integration of the Rogowski coil, characterized in that: include: Collecting the current differential signal in the output signal of the Rogowski coil to obtain a discrete current differential signal; Performing signal processing on the current differential signal to obtain a reconstructed current signal; Determining a digital integration algorithm of the Rogowski coil according to the acquired hardware measurement waveform of the Rogowski coil; A digital integration signal of the Rogowski coil is obtained according to the digital integration algorithm and the reconstructed current signal.

2. The method according to claim 1, characterized in that Performing signal processing on the current differential signal to obtain a reconstructed current signal includes: Decomposing the current differential signal by wavelet transform to obtain wavelet signals of different scale frequency bands; Performing threshold processing on the wavelet signals of different scale frequency bands, reducing the wavelet signals smaller than a preset threshold by a preset ratio, and keeping the wavelet signals larger than the preset threshold unchanged; The wavelet signals of different scale frequency bands processed by threshold value are subjected to inverse wavelet transformation and merged to obtain the reconstructed current signal.

3. The method according to claim 1, characterized in that Determining a digital integration algorithm of the Rogowski coil according to the acquired hardware measurement waveform of the Rogowski coil includes: Acquire the hardware measurement waveform of the Rogowski coil through a hardware integration link; Performing Fourier transform on the hardware measurement waveform to obtain frequency components of the hardware measurement waveform, wherein the frequency components include low-frequency components, intermediate-frequency components, and high-frequency components; Calculating a sampling rate component introduced by the sampling rate of the hardware measurement waveform; Constructing a composite evaluation index of multiple integration algorithms according to the frequency component, the adoption rate component and preset weights of multiple integration algorithms; The integration algorithm with the highest composite evaluation index is selected as the digital integration algorithm.

4. The method according to claim 3, characterized in that The calculation formula of the sampling rate component p4 is: Where SR is the sampling rate.

5. The method according to claim 3, characterized in that: The calculation formula of the composite evaluation index is: In the formula, p1 is the low-frequency component, p2 is the intermediate-frequency component, p3 is the high-frequency component, p4 is the sampling rate component, W1 is the low-frequency weight, W2 is the intermediate-frequency weight, W3 is the high-frequency weight, and W4 is the sampling rate weight.

6. The method according to claim 3, characterized in that The digital integration algorithm includes: Complex rectangle algorithm: Complex trapezoidal algorithm: Complex Simpson algorithm: Where H(z) represents the z-domain transfer function, T s is the sampling interval, and z is a complex variable.

7. The method according to claim 1, characterized in that The calculation formula of the digital integral signal of the Rogowski coil is: Where e1(n) is the reconstructed current signal, H(z) is the z-domain transfer function represented by the digital integration algorithm, z is a complex variable, n is the signal length, and C is any simple positive closed curve in the convergence domain of the digital integration algorithm H(z).

8. A correction device for the hardware integration of a Rogowski coil to the digital integration, characterized in that: include: A first acquisition module is used to collect a current differential signal in the output signal of the Rogowski coil to obtain a discrete current differential signal; A second acquisition module, used for performing signal processing on the current differential signal to obtain a reconstructed current signal; A determination module, used for determining a digital integration algorithm of the Rogowski coil according to the acquired hardware measurement waveform of the Rogowski coil; The third acquisition module is used to acquire the digital integration signal of the Rogowski coil according to the digital integration algorithm and the reconstructed current signal.

9. The device according to claim 8, characterized in that The second acquisition module includes: A first acquisition submodule is used to decompose the current differential signal by using wavelet transform to obtain wavelet signals of different scale frequency bands; A processing submodule, used for performing threshold processing on the wavelet signals of different scale frequency bands, reducing the wavelet signals smaller than a preset threshold by a preset ratio, and keeping the wavelet signals larger than the preset threshold unchanged; The second acquisition submodule is used to perform inverse wavelet transformation on the wavelet signals of different scale frequency bands processed by threshold value and merge them to obtain the reconstructed current signal.

10. The device according to claim 8, characterized in that Identify modules, including: A third acquisition submodule is used to acquire the hardware measurement waveform of the Rogowski coil through a hardware integration link; A fourth acquisition submodule, configured to perform Fourier transform on the hardware measurement waveform to obtain frequency components of the hardware measurement waveform, wherein the frequency components include low-frequency components, intermediate-frequency components, and high-frequency components; A calculation submodule, used for calculating a sampling rate component introduced by the adoption rate of the hardware measurement waveform; A construction submodule, used to construct a composite evaluation index of multiple integration algorithms according to the frequency component, the adoption rate component and preset weights of multiple integration algorithms; A submodule is selected to select the integration algorithm with the highest composite evaluation index as the digital integration algorithm.

11. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and the computer program is used to execute the method according to any one of claims 1 to 7.

12. An electronic device, characterized in that: The electronic device comprises: processor; a memory for storing instructions executable by the processor; The processor is used to read the executable instructions from the memory and execute the instructions to implement the method described in any one of claims 1 to 7.

Images